A packaging process for transparent light-emitting LED tube

Abstract

The present invention relates to the field of LED packaging technology, specifically to a packaging process for a transparent luminous LED tube, the steps of which are as follows: (1) using a crystal bonding machine to fix an LED chip on an LED bracket through a crystal bonding glue, and then baking the LED chip; (2) using a wire bonding machine to weld the electrodes of the LED chip in (1) to the pins of the LED bracket through wires; (3) mixing transparent glue and phosphor according to a certain mass ratio, stirring to make them evenly mixed to obtain phosphor glue; heating the phosphor glue to completely solidify it; grinding the solidified phosphor silica gel mixture to obtain phosphor composite particles; passing the particles through a 400-mesh sieve, and drying for standby use; (4) mixing the phosphor composite particles with transparent glue to form phosphor glue, using a glue dispenser to fill the phosphor glue in the LED bracket and cover the phosphor glue on the LED chip, heating and solidifying, and obtaining a packaged transparent luminous LED tube. The process of the present invention achieves the improvement of LED optical performance by optimizing the preparation method of the packaging material.

Description

Technical Field

[0001] The invention relates to the technical field of LED packaging, in particular to a packaging process for a transparent light-emitting LED tube. Background Art

[0002] Light Emitting Diode (LED) has developed into a new generation of green lighting source and has been applied in various lighting fields. LED is based on a new light-emitting principle, made of semiconductor materials, and uses electron-hole interband transition radiation recombination to emit light. The PN junction is the core of the device. In theory, LED can achieve 100% electron-hole recombination luminescence. Compared with traditional lighting sources such as incandescent lamps and fluorescent lamps, LED is not only energy-saving and environmentally friendly, with high energy utilization rate, but also light weight, small size, and long life, so it has developed into a new generation of green lighting source.

[0003] Packaging is a key step in realizing the application of LED from chip to final product. Packaging effectively connects the chip with the product application. Through the packaging process, the LED chip can be effectively protected and mechanically supported, while also achieving key functions such as optical parameter adjustment and heat dissipation. The quality of the LED packaging process directly determines the reliability and optical performance of the product application process.

[0004] However, there are many technical problems in the current LED packaging process, such as the problem of LED light color consistency, which reduces the effect of LED products and hinders the development of LED products. Summary of the invention

[0005] The purpose of the present invention is to provide a packaging process for a transparent light-emitting LED tube. The process of the present invention studies the packaging technology in the LED packaging process, and improves the optical performance of the LED by optimizing the preparation method of the packaging material, thereby improving the light color consistency of the LED product.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A first aspect of the present invention provides a packaging process for a transparent light-emitting LED tube, comprising the following steps:

[0008] (1) Using a die-bonding machine to fix the LED chip on the LED bracket through a die-bonding adhesive, and baking the LED bracket with the LED chip installed;

[0009] (2) Using a wire bonding machine, the electrodes of the LED chip in step (1) are welded to the pins of the LED bracket through wires;

[0010] (3) Mixing transparent glue and phosphor powder in a certain mass ratio, stirring to make the mixture uniform, and obtaining phosphor powder glue; vacuumizing the phosphor powder glue; heating the phosphor powder glue at 140 to 150° C. for 30 to 40 minutes to completely cure it; grinding the cured phosphor powder silica gel mixture to obtain phosphor powder composite particles; sieving the phosphor powder composite particles through a 400-mesh sieve, and drying the sieved phosphor powder composite particles for later use;

[0011] (4) Mixing the phosphor composite particles with transparent glue to form phosphor glue, stirring evenly and then performing vacuum degassing; using a glue dispenser to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and heating and curing the LED bracket filled with the phosphor glue to obtain a packaged transparent light-emitting LED tube.

[0012] A second aspect of the present invention provides a transparent light-emitting LED tube packaged by the above-mentioned transparent light-emitting LED tube packaging process.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] In the present invention, phosphor composite particles are obtained by curing and grinding phosphor glue, and then the phosphor composite particles are added to transparent glue, thereby inhibiting the precipitation of phosphor, thereby improving the light color consistency of LED products. The mass ratio of phosphor to transparent glue, and the mass ratio of phosphor composite particles to transparent glue in the present invention can further reduce the precipitation phenomenon of phosphor, thereby enhancing the light color consistency of LED. In addition, the preparation process of phosphor composite particles does not affect the fluorescent properties of phosphor, and the prepared phosphor composite particles have the same fluorescent properties as ordinary phosphor particles. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] As mentioned in the background technology, packaging is a key step in realizing the application of LED from chip to final product. The quality of LED packaging process directly determines the reliability and optical performance of the product application process. However, there are problems such as LED light color consistency in the current LED packaging process, which reduces the effect of LED products and hinders the development of LED products. Based on this, in a real-time method of the present invention, a packaging process of a transparent light-emitting LED tube is provided, including the following steps:

[0017] (1) Using a die-bonding machine to fix the LED chip on the LED bracket through a die-bonding adhesive, and baking the LED bracket with the LED chip installed;

[0018] (2) Using a wire bonding machine, the electrodes of the LED chip in step (1) are welded to the pins of the LED bracket through wires;

[0019] (3) Mixing transparent glue and phosphor powder in a certain mass ratio, stirring to make the mixture uniform, and obtaining phosphor powder glue; vacuumizing the phosphor powder glue; heating the phosphor powder glue at 140 to 150° C. for 30 to 40 minutes to completely cure it; grinding the cured phosphor powder silica gel mixture to obtain phosphor powder composite particles; sieving the phosphor powder composite particles through a 400-mesh sieve, and drying the sieved phosphor powder composite particles for later use;

[0020] (4) Mixing the phosphor composite particles with transparent glue to form phosphor glue, stirring evenly and then performing vacuum degassing; using a glue dispenser to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and heating and curing the LED bracket filled with the phosphor glue to obtain a packaged transparent light-emitting LED tube.

[0021] In the LED packaging process, combining LED blue light chips and yellow light phosphors is the most common method to achieve white light LEDs. In the prior art phosphor coating method, the phosphor particles are first fully stirred and mixed with the packaging glue, and after vacuum degassing treatment, the phosphor glue is applied on the top of the LED chip through a dispensing device to form a phosphor layer, and the phosphor glue is cured by heating. During the phosphor coating process, since the density of the phosphor is much greater than the density of silica gel, the phosphor will precipitate downward, resulting in uneven distribution in the packaging structure, thereby causing light color consistency problems. In the present invention, the phosphor glue is cured and ground to obtain phosphor composite particles, and then the phosphor composite particles are added to transparent glue, thereby inhibiting the precipitation of the phosphor, thereby improving the light color consistency of the LED product.

[0022] Screening the phosphor composite particles can obtain composite particles of a suitable size and can also ensure the uniformity of the phosphor concentration and particle size of the phosphor composite particles.

[0023] In one or more embodiments, the baking temperature in step (1) is 170-180° C., and the baking time is 2.5-3 hours; and the die-bonding glue is selected from silver glue or insulating glue.

[0024] In one or more embodiments, after the welding is completed in step (2), the welded LED bracket is dehumidified. Preferably, the dehumidification temperature is 140-150°C and the time is 2-3 hours. Moisture has a great influence on the performance of LED chips, so the moisture content of LED tubes must be strictly controlled; if the moisture content of the LED bracket is too high, the product will be scrapped and the quality will be reduced. Therefore, dehumidifying the welded LED bracket in the present invention can ensure the quality of the LED tube.

[0025] In one or more embodiments, the temperature of heating and curing in step (4) is 100° C. to 150° C., the time is 2 to 4 hours, and the mass ratio of the fluorescent powder to the transparent glue is 1:4 to 5.

[0026] In one or more embodiments, the mass ratio of the fluorescent powder composite particles to the transparent glue in step (4) is 0.1-0.4:1. Preferably, the fluorescent powder is yellow fluorescent powder.

[0027] The mass ratio of the fluorescent powder to the transparent glue, and the mass ratio of the fluorescent powder composite particles to the transparent glue in the present invention can further reduce the precipitation phenomenon of the fluorescent powder, thereby enhancing the consistency of LED light color.

[0028] In one or more embodiments, the transparent glue in step (3) is selected from silicone, epoxy resin, silicone resin or silicone rubber. Preferably, the transparent glue is silicone.

[0029] In one or more embodiments, the LED bracket is a copper bracket or an iron bracket, and the surfaces of the electrodes and the solder pins are both silver-plated.

[0030] In one or more embodiments, the LED bracket is a single-cup bracket or a multi-cup bracket.

[0031] The present invention will be further explained and illustrated below in conjunction with specific embodiments.

[0032] Example 1

[0033] A packaging process for a transparent light-emitting LED tube:

[0034] (1) Using a die-bonding machine to fix the LED chip on the LED bracket through silver glue, and baking the LED bracket with the LED chip installed at a temperature of 170° C. for 2.5 hours;

[0035] (2) using a wire bonding machine to weld the electrodes of the LED chip in step (1) to the pins of the LED bracket through wires, and after welding, dehumidifying the LED bracket at a temperature of 140° C. for 2 hours;

[0036] (3) Mixing silica gel and phosphor in a mass ratio of 1:1, and mixing them evenly by mechanical stirring; then evacuating the phosphor glue by a vacuum pump to remove bubbles in the colloid; heating the phosphor glue at 140° C. for 30 minutes to completely cure it; taking out the cured phosphor silica gel mixture, and mechanically grinding it to obtain phosphor composite particles; passing the phosphor composite particles through a 400-mesh sieve, and drying the sieved phosphor composite particles for later use;

[0037] (4) Mix the phosphor composite particles and silica gel in a mass ratio of 0.1:1 to form phosphor glue, stir evenly and perform vacuum degassing; use a glue dispenser to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and heat and cure the LED bracket filled with the phosphor glue at a temperature of 100°C for 2 hours to obtain a packaged transparent luminous LED tube.

[0038] Example 2

[0039] A packaging process for a transparent light-emitting LED tube:

[0040] (1) Using a die-bonding machine to fix the LED chip on the LED bracket through silver glue, and baking the LED bracket with the LED chip installed at a temperature of 175° C. for 2.6 hours;

[0041] (2) using a wire bonding machine to weld the electrodes of the LED chip in step (1) to the pins of the LED bracket through wires, and after welding, dehumidifying the LED bracket at a temperature of 145° C. for 2.5 hours;

[0042] (3) Mixing silica gel and phosphor in a mass ratio of 1:1, and mixing them evenly by mechanical stirring; then evacuating the phosphor glue by a vacuum pump to remove bubbles in the colloid; heating the phosphor glue at 145° C. for 35 minutes to completely cure it; taking out the cured phosphor silica gel mixture, and mechanically grinding it to obtain phosphor composite particles; passing the phosphor composite particles through a 400-mesh sieve, and drying the sieved phosphor composite particles for later use;

[0043] (4) The phosphor composite particles and silica gel are mixed in a mass ratio of 0.2:1 to form phosphor glue, and the mixture is stirred evenly and then vacuum degassed; a dispensing machine is used to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and the LED bracket filled with the phosphor glue is heated and cured at a temperature of 110°C to 150°C for 3 hours to obtain a packaged transparent light-emitting LED tube.

[0044] Example 3

[0045] A packaging process for a transparent light-emitting LED tube:

[0046] (1) Using a die-bonding machine to fix the LED chip on the LED bracket through silver glue, and baking the LED bracket with the LED chip installed at a temperature of 178° C. for 2.7 hours;

[0047] (2) using a wire bonding machine to weld the electrodes of the LED chip in step (1) to the pins of the LED bracket through wires, and after welding, dehumidifying the LED bracket at a temperature of 148° C. for 2.8 hours;

[0048] (3) Mixing silica gel and phosphor in a mass ratio of 1:1, and mixing them evenly by mechanical stirring; then evacuating the phosphor glue by a vacuum pump to remove bubbles in the colloid; heating the phosphor glue at 148° C. for 38 minutes to completely cure it; taking out the cured phosphor silica gel mixture, and mechanically grinding it to obtain phosphor composite particles; passing the phosphor composite particles through a 400-mesh sieve, and drying the sieved phosphor composite particles for later use;

[0049] (4) The phosphor composite particles and silica gel are mixed in a mass ratio of 0.1 to 0.4:1 to form phosphor glue, and the mixture is stirred evenly and then vacuum degassed; a dispensing machine is used to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and the LED bracket filled with the phosphor glue is heated and cured at a temperature of 130° C. for 3 hours to obtain a packaged transparent light-emitting LED tube.

[0050] Example 4

[0051] A packaging process for a transparent light-emitting LED tube:

[0052] (1) Using a die-bonding machine to fix the LED chip on the LED bracket through silver glue, and baking the LED bracket with the LED chip installed at a temperature of 180° C. for 3 hours;

[0053] (2) using a wire bonding machine to weld the electrodes of the LED chip in step (1) to the pins of the LED bracket through wires, and after welding, dehumidifying the LED bracket at a temperature of 150° C. for 3 hours;

[0054] (3) Mixing silica gel and phosphor in a mass ratio of 1:1, and mixing them evenly by mechanical stirring; then evacuating the phosphor glue by a vacuum pump to remove bubbles in the colloid; heating the phosphor glue at 150° C. for 40 minutes to completely cure it; taking out the cured phosphor silica gel mixture, and mechanically grinding it to obtain phosphor composite particles; passing the phosphor composite particles through a 400-mesh sieve, and drying the sieved phosphor composite particles for later use;

[0055] (4) The phosphor composite particles and silica gel are mixed in a mass ratio of 0.4:1 to form phosphor glue, and the mixture is stirred evenly and then vacuum degassed; a dispensing machine is used to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and the LED bracket filled with the phosphor glue is heated and cured at a temperature of 150° C. for 4 hours to obtain a packaged transparent light-emitting LED tube.

[0056] In summary, the preparation and application of the phosphor composite particles in the packaging process of the transparent light-emitting LED tube of the present invention can significantly inhibit the precipitation of phosphors and enhance the consistency of LED light color. Moreover, the phosphor composite particles do not affect the fluorescence performance and thermal stability of the phosphors. Applying them to the phosphor coating process can significantly improve the light color consistency of LED products. Whether in the dispensing equipment or in the LED tube, the precipitation of phosphors is effectively inhibited.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging process for a transparent light-emitting LED tube, characterized in that: The process steps are as follows: (1) using a die-bonding machine to fix the LED chip on the LED bracket through a die-bonding adhesive, and baking the LED bracket with the LED chip mounted thereon; the die-bonding adhesive is selected from silver glue; (2) Using a wire bonding machine, the electrodes of the LED chip in step (1) are welded to the pins of the LED bracket through wires; (3) Mixing transparent glue and phosphor powder in a certain mass ratio, stirring to make them evenly mixed to obtain phosphor powder glue; vacuumizing the phosphor powder glue; heating the phosphor powder glue at 140-150° C. for 30-40 minutes to completely cure it; grinding the cured phosphor powder silica gel mixture to obtain phosphor powder composite particles; passing the phosphor powder composite particles through a 400-mesh sieve, and drying the sieved phosphor powder composite particles for standby use; wherein the mass ratio of the phosphor powder to the transparent glue is 1:4-5; the transparent glue is selected from silicone resin or silicone rubber; (4) mixing the phosphor composite particles with transparent glue to form phosphor glue, stirring evenly and then performing vacuum degassing; using a glue dispenser to fill the phosphor glue into the LED bracket and cover the LED chip with the phosphor glue, and heating and curing the LED bracket filled with the phosphor glue to obtain a packaged transparent light-emitting LED tube; The mass ratio of the fluorescent powder composite particles to the transparent glue is 0.1-0.4:1; the temperature of heating and curing is 100° C.-150° C., and the time is 2-4 hours.

2. The packaging process of the transparent light-emitting LED tube according to claim 1, characterized in that: The baking temperature in step (1) is 170-180° C., and the baking time is 2.5-3 hours.

3. The packaging process of the transparent light-emitting LED tube according to claim 1, characterized in that: After the welding in step (2) is completed, the welded LED bracket is dehumidified, and the dehumidification temperature is 140-150° C. and the time is 2-3 hours.

4. The packaging process of the transparent light-emitting LED tube according to claim 1, characterized in that: The fluorescent powder is yellow fluorescent powder.

5. The packaging process of the transparent light-emitting LED tube according to claim 1, characterized in that: The LED bracket is a copper bracket or an iron bracket, and the surfaces of the electrodes and the soldering feet are both plated with silver.

6. A transparent light-emitting LED tube obtained by packaging the transparent light-emitting LED tube packaging process according to any one of claims 1 to 5.