High-strength high-plasticity conductive copper alloy material and preparation method thereof
High-strength, high-ductility, and conductive copper alloy materials were prepared by a dual-liquid quenching process and a series of heat treatment steps. This solved the deformation and cracking problems caused by water quenching, achieved high strength and high ductility of the material, and simplified the subsequent cleaning process.
Patent Information
- Application Number
- CN202311487970.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-09
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2043-11-09
AI Technical Summary
Existing conductive copper alloy materials experience high quenching stress during water quenching, which makes the workpieces prone to deformation and cracking.
A dual-liquid quenching process is adopted, in which the copper alloy material is first placed in an organic aqueous solution such as polyethylene glycol aqueous solution for the first cooling, and then quickly placed in oil for the second cooling. High-strength, high-ductility and conductive copper alloy material is prepared by combining vacuum melting, homogenization treatment, hot rolling, solution quenching, aging treatment and annealing treatment.
It effectively solves the problems of deformation and fracture of copper alloy materials during quenching, improves the strength and plasticity of the material, and the film after quenching is easy to clean.
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Figure CN117448714B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of conductive copper alloy material, in particular to a high-strength and high-plasticity conductive copper alloy material and a preparation method thereof. BACKGROUND
[0002] In recent years, with the rapid development of electronic information technology, especially the semiconductor industry as the core of integrated circuits as the pillar industry of modern information technology has developed by leaps and bounds, so that its requirements for material varieties and performance are more and more demanding. Since integrated circuits are mainly composed of chips and lead frame, among which the lead frame material plays a role in transmitting signals, protecting internal components and dissipating heat outward, and is a key component of integrated circuits. At present, the lead frame material of integrated circuits is mainly conductive copper alloy material.
[0003] However, in the manufacturing process of the existing conductive copper alloy material, in order to improve the quenching efficiency, water quenching is mostly used for quenching. Quenching with water as quenching agent has the advantage of faster cooling in the high temperature zone, but the disadvantage is also obvious. In the process of water quenching, the quenching stress is large, and the workpiece is easy to deform and crack. SUMMARY
[0004] (I) Technical problems to be solved
[0005] In view of the shortcomings of the prior art, the present application provides a high-strength and high-plasticity conductive copper alloy material and a preparation method thereof, which solves the problem of large stress and easy deformation and cracking of the workpiece in the quenching process of the existing water quenching method.
[0006] (II) Technical scheme
[0007] In order to achieve the above purpose, the present application is realized by the following technical scheme: a preparation method of a high-strength and high-plasticity conductive copper alloy material, comprising the following specific steps:
[0008] S1, vacuum melting of the material: first, the raw materials are weighed using a weighing device, then the raw materials are added to a vacuum melting furnace for melting, after the raw materials are completely melted, heat preservation for 3-5 minutes, and then the copper alloy is cast to obtain a copper alloy ingot;
[0009] S2, soaking treatment: the cast copper alloy ingot is placed in an environment with a temperature of 900-950 DEG C for uniform heating treatment, and the soaking time is 2-3 hours;
[0010] S3, hot rolling treatment: the copper alloy ingot is heated to a temperature of 760-800 DEG C, and then the copper alloy ingot is placed in a hot rolling equipment for hot rolling treatment;
[0011] S4, solid solution quenching treatment: the copper alloy material after hot rolling is placed in an environment with a temperature of 950-980℃, the solid solution quenching time is 2-4 hours, then the copper alloy material is quickly placed in an organic aqueous solution for the first cooling treatment, and then the copper alloy material is quickly placed in oil for the second cooling treatment, and the organic aqueous solution is a polyethylene glycol aqueous solution, the first cooling treatment time is 3-5 seconds, and the second cooling treatment time is 20-30 minutes;
[0012] S5, aging treatment: the copper alloy material after the solid solution quenching is placed in an environment with a temperature of 430-480℃, and the time is 1-3 hours;
[0013] S6, cold rolling forming: the copper alloy material is cooled to-40 to 20℃, and then the copper alloy material is placed in a cold rolling equipment for cold rolling treatment;
[0014] S7, annealing treatment: the copper alloy material after cold rolling is placed in an environment with a temperature of 450-650℃ for annealing treatment, and the annealing time is 30-60 minutes, and finally the copper alloy material is naturally cooled to obtain the high-strength high-plasticity conductive copper alloy material.
[0015] Preferably, the chemical composition of the copper alloy ingot in S1 is as follows in terms of mass percentage: Ni 3.0-4.5wt%, Sn 1.0-1.2wt%, Zn 2.0-3.3wt%, Mg 1.4-2.2wt%, Ti 3.6-4.5wt%, and the balance is Cu.
[0016] Preferably, after the raw materials in S1 are placed in the vacuum melting furnace, a vacuum pump is used to pump the vacuum melting furnace to a negative pressure state, then protective gas is again injected into the vacuum melting furnace, so that the gas pressure in the vacuum melting furnace is less than 0.1Pa, and then the raw materials are heated and melted, and the melting temperature is 1200-1300℃.
[0017] Preferably, the heating rate during the soaking treatment in S2 is 80℃ / min, and the cooling rate is 100℃ / min.
[0018] Preferably, after the copper alloy material is subjected to the second cooling treatment in S4, the film formed on the surface of the copper alloy material needs to be cleaned, and then dried before subsequent process treatment.
[0019] A high-strength high-plasticity conductive copper alloy material is prepared by using the high-strength high-plasticity conductive copper alloy material preparation method provided by the application.
[0020] (Three) beneficial effects
[0021] The application provides a high-strength high-plasticity conductive copper alloy material and a preparation method thereof.
[0022] 1. The application adopts double liquid quenching process to quench the copper alloy during quenching, and the double liquid quenching process first puts the copper alloy material into an organic aqueous solution for first cooling treatment, and then quickly puts the copper alloy material into oil for second cooling treatment, effectively solving the deformation and fracture of the copper alloy material during quenching.
[0023] 2. The application mainly uses polyethylene glycol aqueous solution, which can not only prevent the copper alloy material from cracking, but also easily clean the film formed by quenching. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 The process flowchart of the application. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the application.
[0026] Embodiment one:
[0027] As shown in the figure, the application provides a preparation method of high-strength high-plasticity conductive copper alloy material, which comprises the following specific steps: Figure 1
[0028] S1, vacuum melting of the material: first, use a weighing device to weigh the raw materials, then add the raw materials to the vacuum melting furnace for melting, after the raw materials are completely melted, keep warm for 5 minutes, then cast the copper alloy, thereby obtaining a copper alloy ingot;
[0029] The weighing device used is mainly an electronic scale, or a weighing instrument with high precision can be used;
[0030] S2, soaking treatment: put the cast copper alloy ingot into an environment with a temperature of 950℃ for uniform heating treatment, and the soaking time is 2 hours;
[0031] S3, hot rolling treatment: heat the copper alloy ingot to a temperature of 800℃, and then put it into a hot rolling equipment for hot rolling treatment;
[0032] S4, solid solution quenching treatment: the copper alloy material after hot rolling is placed in an environment with a temperature of 950 DEG C, the solid solution quenching time is 2 hours, then the copper alloy material is quickly placed in an organic aqueous solution for the first cooling treatment, then the copper alloy material is quickly placed in oil for the second cooling treatment, and the organic aqueous solution is a polyethylene glycol aqueous solution, which can not only prevent the copper alloy material from cracking, but also the film formed by quenching is easy to clean, the first cooling treatment time is 3 seconds, and the second cooling treatment time is 30 minutes;
[0033] In the quenching process, the copper alloy is quenched mainly by using the double liquid quenching process, and the double liquid quenching process first places the copper alloy material in an organic aqueous solution for the first cooling treatment, and then quickly places the copper alloy material in oil for the second cooling treatment, effectively solving the problem of easy deformation and cracking of the copper alloy material during quenching.
[0034] The organic aqueous solution can also be any one of a polyvinyl alcohol aqueous solution, a polyamide polyethylene glycol aqueous solution, and a polyether aqueous solution, and the cooling time during the first cooling treatment and the second cooling treatment must be controlled.
[0035] S5, aging treatment: the copper alloy material after the solid solution quenching is placed in an environment with a temperature of 480 DEG C for 2 hours;
[0036] S6, cold rolling forming: the copper alloy material is cooled to-20 DEG C, and then the copper alloy material is placed in a cold rolling equipment for cold rolling treatment;
[0037] S7, annealing treatment: the copper alloy material after cold rolling is placed in an environment with a temperature of 650 DEG C for annealing treatment, and the annealing time is 50 minutes, and finally the copper alloy material is naturally cooled to obtain a high-strength high-plasticity conductive copper alloy material.
[0038] The chemical composition of the copper alloy ingot in S1 is as follows in terms of mass percentage: Ni 3.0wt%, Sn 1.0wt%, Zn 2.0wt%, Mg 1.4wt%, Ti 3.6wt%, and the balance is Cu, the raw materials in S1 are placed in a vacuum melting furnace, a vacuum pump is used to pump the vacuum melting furnace to a negative pressure state, then protective gas is injected into the vacuum melting furnace, the pressure in the vacuum melting furnace is less than 0.1 Pa, then the raw materials are heated and melted, the melting temperature is 1300 DEG C, the heating rate during the soaking treatment in S2 is 80 DEG C / min, and the cooling rate is 100 DEG C / min, the film formed on the surface of the copper alloy material after the second cooling treatment in S4 needs to be cleaned, and then dried before subsequent process treatment.
[0039] A high-strength, high-ductility, and conductive copper alloy material is prepared using the method provided by this invention.
[0040] Example 2:
[0041] like Figure 1 As shown in the figure, this invention provides a method for preparing a high-strength, high-ductility, and conductive copper alloy material, comprising the following specific steps:
[0042] S1. Vacuum melting of materials: First, weigh the raw materials using a weighing device, then add the raw materials into a vacuum melting furnace for melting. After the raw materials are completely melted, keep them at a constant temperature for 5 minutes, and then cast the copper alloy to obtain a copper alloy ingot.
[0043] S2. Soaking heat treatment: The cast copper alloy ingot is placed in an environment with a temperature of 950℃ for uniform heat treatment for 2 hours.
[0044] S3. Hot rolling treatment: The copper alloy ingot is heated to 800°C and then placed into a hot rolling equipment for hot rolling treatment.
[0045] S4. Solution quenching treatment: The hot-rolled copper alloy material is placed in an environment with a temperature of 950℃ and the solution quenching time is 2 hours. Then, the copper alloy material is quickly placed in an organic aqueous solution for the first cooling treatment, and then the copper alloy material is quickly placed in oil for the second cooling treatment. The organic aqueous solution is a polyethylene glycol aqueous solution. The first cooling treatment time is 3 seconds and the second cooling treatment time is 30 minutes.
[0046] S5. Aging treatment: Place the copper alloy material after quenching and fixing in an environment with a temperature of 480℃ for 2 hours.
[0047] S6. Cold rolling: Cool the copper alloy material to -20℃, and then put the copper alloy material into the cold rolling equipment for cold rolling treatment;
[0048] S7; Annealing treatment: The cold-rolled copper alloy material is placed in an environment of 650℃ for annealing treatment for 50 minutes. Finally, after the copper alloy material is naturally cooled, a high-strength, high-ductility, and conductive copper alloy material is obtained.
[0049] The chemical composition of the copper alloy ingot in S1 is as follows in terms of mass percentage: Ni 4.0 wt%, Sn 1.1 wt%, Zn 3.0 wt%, Mg 1.8 wt%, Ti 4.0 wt%, and the balance being Cu. After the raw materials in S1 are placed in a vacuum melting furnace, a vacuum pump is used to pump the vacuum melting furnace to a state of negative pressure, and then protective gas is again injected into the vacuum melting furnace, so that the air pressure in the vacuum melting furnace is less than 0.1 Pa. Then, the raw materials are heated and melted, and the melting temperature is 1300 DEG C. In S2, the heating rate during the heat treatment is 80 DEG C / min, and the cooling rate is 100 DEG C / min. In S4, the film formed on the surface of the copper alloy material after the second cooling treatment needs to be cleaned, and then the copper alloy material is dried before subsequent process treatment.
[0050] Embodiment three:
[0051] As shown in Figure 1 , the embodiment of the present application provides a preparation method of high-strength high-plasticity conductive copper alloy material, which comprises the following specific steps:
[0052] S1, vacuum melting of the material: first, the raw materials are weighed using a weighing device, and then the raw materials are added to a vacuum melting furnace for melting. After the raw materials are completely melted, they are kept at temperature for 5 minutes, and then the copper alloy is cast to obtain a copper alloy ingot;
[0053] S2, heat treatment: the cast copper alloy ingot is placed in an environment with a temperature of 950 DEG C for uniform heating treatment, and the heat treatment time is 2 hours;
[0054] S3, hot rolling treatment: the copper alloy ingot is heated to a temperature of 800 DEG C, and then the copper alloy ingot is placed in a hot rolling device for hot rolling treatment;
[0055] S4, solid solution quenching treatment: the hot-rolled copper alloy material is placed in an environment with a temperature of 950 DEG C, and the solid solution quenching time is 2 hours. Then, the copper alloy material is quickly placed in an organic aqueous solution for the first cooling treatment, and then the copper alloy material is quickly placed in oil for the second cooling treatment. The organic aqueous solution is a polyethylene glycol aqueous solution. The first cooling treatment time is 3 seconds, and the second cooling treatment time is 30 minutes;
[0056] S5, aging treatment: the copper alloy material after the solid solution quenching treatment is placed in an environment with a temperature of 480 DEG C for 2 hours;
[0057] S6, cold rolling forming: the copper alloy material is cooled to -20 DEG C, and then the copper alloy material is placed in a cold rolling device for cold rolling treatment;
[0058] S7: annealing treatment: the copper alloy material after cold rolling is put into an environment of 650℃ for annealing treatment, the annealing time is 50 minutes, and finally the high-strength high-plasticity conductive copper alloy material is obtained after the copper alloy material is naturally cooled.
[0059] The chemical composition of the copper alloy ingot in S1 is as follows in terms of mass percentage: Ni 4.5wt%, Sn 1.2wt%, Zn 3.3wt%, Mg 2.2wt%, Ti 4.5wt%, and the balance being Cu. After the raw materials in S1 are put into a vacuum melting furnace, a vacuum pump is used to pump the vacuum melting furnace to a negative pressure state. Then, the vacuum melting furnace is filled with protective gas again, so that the air pressure in the vacuum melting furnace is less than 0.1Pa. Then, the raw materials are heated and melted, and the melting temperature is 1300℃. In S2, the heating rate during the soaking treatment is 80℃ / min, and the cooling rate is 100℃ / min. After the copper alloy material is subjected to the second cooling treatment in S4, the film formed on the surface of the copper alloy material needs to be cleaned, and then the copper alloy material is dried before subsequent process treatment.
[0060] Comparative Example 1
[0061] The chemical composition of the high-strength high-plasticity conductive copper alloy material is as follows in terms of mass percentage: Ni 3.0wt%, Sn 1.0wt%, Zn 2.0wt%, Mg 1.4wt%, Ti 3.6wt%, and the balance being Cu. The quenching method in the solid solution quenching treatment is water quenching, and the other processes are the same as those in Example 1.
[0062] Comparative Example 2
[0063] The chemical composition of the high-strength high-plasticity conductive copper alloy material is as follows in terms of mass percentage: Ni 4.0wt%, Sn 1.1wt%, Zn 3.0wt%, Mg 1.8wt%, Ti 4.0wt%, and the balance being Cu. The quenching method in the solid solution quenching treatment is water quenching, and the other processes are the same as those in Example 2.
[0064] Comparative Example 3
[0065] The chemical composition of the high-strength high-plasticity conductive copper alloy material is as follows in terms of mass percentage: Ni 4.5wt%, Sn 1.2wt%, Zn 3.3wt%, Mg 2.2wt%, Ti 4.5wt%, and the balance being Cu. The quenching method in the solid solution quenching treatment is water quenching, and the other processes are the same as those in Example 3.
[0066] 100 pieces of the high-strength high-plasticity conductive copper alloy material prepared in Example 1, Example 2, Example 3, Comparative Example 1, Comparative Example 2 and Comparative Example 3 are randomly selected for detection of whether there are cracks, and the detection results are shown in Table 1.
[0067] Table 1
[0068]
[0069]
[0070] From the data in Table 1, it can be seen that in the process of solution quenching, the crack rate of the high-strength high-plasticity conductive copper alloy material prepared by using double-liquid quenching is less than that of the high-strength high-plasticity conductive copper alloy material prepared by using water quenching, and therefore, the effect of preparing the high-strength high-plasticity conductive copper alloy material by using double-liquid quenching is better.
[0071] While the embodiments of the application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.
Claims
1. A method for preparing a high-strength, high-ductility, and conductive copper alloy material, characterized in that: The specific steps include the following: S1. Vacuum melting of materials: First, weigh the raw materials using a weighing device, then add the raw materials into a vacuum melting furnace for melting. After the raw materials are completely melted, keep them at a constant temperature for 3-5 minutes, and then cast the copper alloy to obtain a copper alloy ingot. S2. Soaking heat treatment: The cast copper alloy ingot is placed in an environment with a temperature of 900-950℃ for uniform heat treatment for 2-3 hours. S3. Hot rolling treatment: The copper alloy ingot is heated to 760-800℃, and then the copper alloy ingot is placed in hot rolling equipment for hot rolling treatment. S4. Solution quenching treatment: The hot-rolled copper alloy material is placed in an environment with a temperature of 950-980℃ for solution quenching for 2-4 hours. Then, the copper alloy material is quickly placed in an organic aqueous solution for the first cooling treatment, and then quickly placed in oil for the second cooling treatment. The organic aqueous solution is a polyethylene glycol aqueous solution. The first cooling treatment time is 3-5 seconds, and the second cooling treatment time is 20-30 minutes. S5. Aging treatment: Place the copper alloy material after quenching and fixing in an environment with a temperature of 430-480℃ for 1-3 hours. S6. Cold rolling: Cool the copper alloy material to -40 to 20°C, and then put the copper alloy material into the cold rolling equipment for cold rolling treatment; S7; Annealing treatment: The cold-rolled copper alloy material is placed in an environment of 450-650℃ for annealing treatment for 30-60 minutes. Finally, after the copper alloy material is naturally cooled, a high-strength, high-ductility, and conductive copper alloy material is obtained.
2. The method for preparing a high-strength, high-ductility, and conductive copper alloy material according to claim 1, characterized in that: The chemical composition of the copper alloy ingot in S1, by mass percentage, is: Ni 3.0-4.5wt%, Sn 1.0-1.2wt%, Zn 2.0-3.3wt%, Mg 1.4-2.2wt%, Ti 3.6-4.5wt%, with the balance being Cu.
3. The method for preparing a high-strength, high-ductility, and conductive copper alloy material according to claim 1, characterized in that: In step S1, after the raw materials are placed inside the vacuum melting furnace, a vacuum pump is used to evacuate the vacuum melting furnace to make it negative pressure. Then, protective gas is injected into the vacuum melting furnace again to make the gas pressure inside the vacuum melting furnace less than 0.1 Pa. Then, the raw materials are heated and melted at a temperature of 1200-1300℃.
4. The method for preparing a high-strength, high-ductility, and conductive copper alloy material according to claim 1, characterized in that: The heating rate during the homogenization heat treatment in S2 is 80℃ / min, and the cooling rate is 100℃ / min.
5. The method for preparing a high-strength, high-ductility, and conductive copper alloy material according to claim 1, characterized in that: In step S4, after the copper alloy material undergoes a second cooling treatment, the film formed on the surface of the copper alloy material needs to be cleaned and then dried before subsequent processing can proceed.
6. A high-strength, high-ductility, conductive copper alloy material prepared by the method described in any one of claims 1-5.
Citation Information
Patent Citations
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