A preparation device and preparation method for realizing a wire clamp

Abstract

The present invention relates to the field of mechanical production, and discloses a preparation device and preparation method for realizing a wire clamp, the method comprising: performing superpixel segmentation on a wire clamp image to obtain a wire clamp segmentation image, extracting a wire clamp image foreground of the wire clamp segmentation image, fusing the wire clamp image foreground to obtain a wire clamp fusion image foreground; constructing a three-dimensional modeling wire clamp of a wire clamp to be prepared; analyzing the wire clamp clamping force of the three-dimensional modeling wire clamp, and configuring a preparation device for the wire clamp to be prepared; constructing a coordination network of the preparation device to construct the time-frequency resources of the preparation device, simulating the wire clamp preparation work of the preparation device, and obtaining wire clamp simulation work data, analyzing the time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources, and obtaining the adjusted time-frequency resources, preparing the wire clamp through the preparation device, and obtaining a finished wire clamp; analyzing the wire clamp surface defects of the finished wire clamp, and performing surface treatment on the finished wire clamp to obtain a target wire clamp. The present invention can improve the preparation effect of the wire clamp.

Description

Technical Field

[0001] The present invention relates to the field of mechanical production, and in particular to a preparation device and a preparation method for a wire clamp. Background Art

[0002] Wire clamp preparation is a process of making wires that achieves stable connection and fixation between wires through material selection, process design and assembly methods. Wire clamp preparation can improve the safety of circuit transmission.

[0003] At present, wire clamps are mainly prepared by designing preparation drawings of the wire clamps, and then preparing them according to the process based on the preparation drawings. This method is too template-based for the preparation process of the wire clamps, and problems in the preparation process of the wire clamps cannot be discovered in time, resulting in poor preparation effects of the wire clamps. Summary of the invention

[0004] The present invention provides a preparation device and a preparation method for a wire clamp, the main purpose of which is to improve the preparation effect of the wire clamp.

[0005] To achieve the above object, the present invention provides a method for preparing a wire clamp, comprising:

[0006] Acquire a wire clamp image and wire clamp requirement data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground of the wire clamp segmentation image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground;

[0007] Extracting the wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features;

[0008] Analyze the clamping force of the three-dimensional modeled wire clamp, and when the clamping force meets the requirement, construct a preparation process drawing of the wire clamp to be prepared according to the wire clamp requirement data, and configure the preparation equipment of the wire clamp to be prepared based on the preparation process drawing;

[0009] Constructing a coordination network for the preparation equipment, constructing time-frequency resources for the preparation equipment through the coordination network, simulating the wire clamp preparation work of the preparation equipment through the time-frequency resources, obtaining wire clamp simulation work data, analyzing the time-frequency conflicts of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflicts, obtaining adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;

[0010] The surface defects of the finished wire clamp are analyzed, and when the surface defects of the wire clamp meet the requirements, the finished wire clamp is surface treated to obtain a target wire clamp.

[0011] Optionally, performing superpixel segmentation on the wire clip image to obtain a wire clip segmentation image includes:

[0012] Preprocessing the wire clamp image to obtain a processed wire clamp image;

[0013] Extracting image features of the processed wire clamp image;

[0014] Based on the image features, constructing a similarity measurement index of the processed wire clamp image;

[0015] Based on the similarity measurement index, superpixel segmentation is performed on the processed wire clamp image to obtain the wire clamp segmentation image.

[0016] Optionally, constructing a similarity measurement index of the processed wire clamp image based on the image features includes:

[0017] According to the image features, marking the center point in the line clamp segmentation image;

[0018] Marking the pixels corresponding to the processed line clamp image through the center point to obtain marked pixels;

[0019] The pixel similarity of the marked pixels is calculated using the following formula through the center point:

[0020]

[0021] Among them, silhouette(a, b) represents the pixel similarity between the marked pixel a and the marked pixel b, a_c represents the distance from the marked pixel a to the cth center point, b_c represents the distance from the marked pixel b to the cth center point, and W represents the cluster radius;

[0022] A similarity measurement index of the processed wire clamp image is constructed through the pixel similarity.

[0023] Optionally, fusing the wire clip image foreground to obtain a wire clip fused image foreground includes:

[0024] Performing frequency division on the wire clip fusion image foreground to obtain a high-frequency wire clip foreground and a low-frequency wire clip foreground;

[0025] Performing high-frequency fusion on the high-frequency line clip foreground to obtain a high-frequency parallax line clip foreground;

[0026] Performing low-frequency fusion on the low-frequency line clip foreground to obtain a low-frequency parallax line clip foreground;

[0027] The high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground are image-fused to obtain the line clip fused image foreground.

[0028] Optionally, the step of fusing the high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground to obtain the line clip fused image foreground includes:

[0029] The high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground are image-fused using the following formula to obtain the line clip fusion image foreground:

[0030]

[0031] Among them, τ represents the line-clip fusion image foreground, Trh represents the fusion function, R represents the high-frequency parallax line-clip foreground, P i represents P, S represents the high-frequency parallax line clamp foreground and the line clamp image foreground corresponding to the low-frequency parallax line clamp foreground, γ represents the regularization parameter, and i represents the number of foregrounds of the high-frequency parallax line clamp foreground and the line clamp image foreground corresponding to the low-frequency parallax line clamp foreground.

[0032] Optionally, constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features includes:

[0033] Based on the wire clamp features, identifying the wire clamp structure and wire clamp properties of the wire clamp to be prepared;

[0034] Scanning the wire clamp structure to obtain point cloud data of the wire clamp to be prepared;

[0035] Based on the properties of the wire clamp, construct a modeling function of the wire clamp to be prepared;

[0036] The three-dimensional modeling wire clamp of the wire clamp to be prepared is constructed using the modeling function through the point cloud data and the wire clamp properties.

[0037] Optionally, analyzing the clamping force of the three-dimensional modeled clamp includes:

[0038] Meshing the three-dimensional modeling wire clamp to obtain a meshed modeling wire clamp;

[0039] Applying boundary conditions to the grid modeling wire clamp to obtain a conditional grid modeling wire clamp;

[0040] Applying a load to the conditional mesh modeling wire clamp to obtain a load mesh modeling wire clamp;

[0041] Calculating the stiffness matrix of the load mesh modeling clamp;

[0042] The wire clamp holding force of the three-dimensional modeled wire clamp is analyzed through the stiffness matrix.

[0043] Optionally, the calculating the stiffness matrix of the load mesh modeling clamp includes:

[0044] Determining a load curve of the load mesh modeling clamp;

[0045] Based on the load curve, the stiffness matrix of the load mesh modeling clamp is calculated using the following formula:

[0046] L = ∫Ωproperty*sin(θ t )

[0047] Where L represents the stiffness matrix of the load mesh modeling clamp, Ω represents the load mesh modeling clamp corresponding to the force mesh unit, property represents the material property of the load mesh modeling clamp corresponding to the force mesh unit, sin(θ t ) represents the load curve, θ t It represents the load value of the load mesh unit corresponding to the load mesh modeling clip at time t.

[0048] Optionally, constructing the time-frequency resources of the preparation equipment through the coordination network includes:

[0049] identifying equipment characteristics of the preparation equipment;

[0050] Based on the equipment characteristics, analyzing equipment functions and equipment control parameters of the preparation equipment;

[0051] By using the equipment function, the equipment control parameters and the preset equipment demand indicators, the coordination network is used to design the network topology of the preparation equipment;

[0052] Based on the network topology, the time and frequency resources of the preparation equipment are constructed.

[0053] In order to solve the above problems, the present invention also provides a device for preparing a wire clamp, the device comprising:

[0054] A wire clamp image foreground extraction module is used to obtain a wire clamp image and wire clamp requirement data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground from the wire clamp segmentation image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground;

[0055] A wire clamp three-dimensional modeling module, used for extracting wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features;

[0056] A wire clamp drawing design module is used to analyze the wire clamp holding force of the three-dimensional modeled wire clamp, and when the wire clamp holding force meets the requirements, a preparation process drawing of the wire clamp to be prepared is constructed through the wire clamp demand data, and a preparation device for the wire clamp to be prepared is configured based on the preparation process drawing;

[0057] An equipment time-frequency resource configuration module is used to construct a coordination network for the preparation equipment, to construct the time-frequency resources of the preparation equipment through the coordination network, to simulate the wire clamp preparation work of the preparation equipment through the time-frequency resources, to obtain wire clamp simulation work data, to analyze the time-frequency conflicts of the wire clamp simulation work data, to adjust the time-frequency resources based on the time-frequency conflicts, to obtain adjusted time-frequency resources, to prepare the wire clamp through the preparation equipment based on the adjusted time-frequency resources, to obtain a finished wire clamp;

[0058] The wire clamp surface treatment module is used to analyze the wire clamp surface defects of the finished wire clamp. When the wire clamp surface defects meet the requirements, the finished wire clamp is surface treated to obtain a target wire clamp.

[0059] The embodiment of the present invention performs superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, which means grouping pixels in the image into superpixels with similar features, thereby improving the efficiency of subsequent processing and analysis. Furthermore, the embodiment of the present invention obtains a wire clamp fusion image foreground by fusing the wire clamp image foreground, thereby obtaining a wire clamp image with more complete details, thereby providing a data basis for the subsequent construction of the wire clamp. Furthermore, the embodiment of the present invention constructs a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features, thereby intuitively displaying the structure and appearance of the wire clamp, which helps to preview and verify the design scheme before actual production, thereby reducing the possibility of errors and rework. Furthermore, the embodiment of the present invention configures the preparation equipment of the wire clamp to be prepared based on the preparation process drawing, thereby further improving the wire clamp preparation process. The embodiment of the present invention can achieve collaborative work between equipment by constructing a coordination network of the preparation equipment, thereby improving the effect of wire clamp preparation. Finally, the embodiment of the present invention can detect and repair the wire clamp surface defects by analyzing the wire clamp surface defects of the finished wire clamp, thereby avoiding damage to the wire clamp due to defect expansion, thereby reducing the maintenance cost of the equipment. Therefore, the manufacturing device and method for the wire clamp proposed in the present invention can improve the manufacturing effect of the wire clamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 A schematic diagram of a process for implementing a method for preparing a wire clamp provided in one embodiment of the present invention;

[0061] Figure 2 A functional module diagram of a device for preparing a wire clamp provided in one embodiment of the present invention;

[0062] Figure 3 A schematic structural diagram of an electronic device for implementing a manufacturing device for a wire clamp provided in one embodiment of the present invention;

[0063] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0064] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0065] The embodiment of the present application provides a method for preparing a wire clamp. The execution subject of the method for preparing the wire clamp includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided by the embodiment of the present application. In other words, the method for preparing the wire clamp can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. The server can be an independent server, or it can be a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and big data and artificial intelligence platforms.

[0066] Reference Figure 1 FIG. 1 is a flow chart of a method for preparing a wire clamp according to an embodiment of the present invention. In this embodiment, the method for preparing a wire clamp includes:

[0067] S1. Obtain a wire clamp image and wire clamp requirement data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground of the wire clamp segmentation image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground.

[0068] In the embodiment of the present invention, the wire clamp image refers to the wire clamp effect image of the wire clamp to be manufactured, and the wire clamp requirement data refers to the requirements for the preparation of the wire clamp to be prepared, such as wire clamp type, wire clamp hardness, wire clamp material and other requirements.

[0069] Furthermore, the embodiment of the present invention performs superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, which means grouping pixels in the image into superpixels with similar features, thereby improving the efficiency of subsequent processing and analysis, wherein the wire clamp segmentation image means dividing the wire clamp image into superpixel images with similar features.

[0070] As an embodiment of the present invention, the superpixel segmentation of the wire clamp image to obtain the wire clamp segmentation image includes: preprocessing the wire clamp image to obtain a processed wire clamp image; extracting image features of the processed wire clamp image; constructing a similarity measurement index of the processed wire clamp image based on the image features; and performing superpixel segmentation on the processed wire clamp image based on the similarity measurement index to obtain the wire clamp segmentation image.

[0071] The processed wire clip image refers to an image obtained after graying, filtering, denoising, etc., and the image feature refers to the pixel-level image feature attributes of the processed wire clip image, such as color, texture, shape, etc. These features will be used to describe the similarity between pixels, and the similarity measurement index refers to an index for measuring the degree of similarity between pixels.

[0072] Furthermore, in an optional embodiment of the present invention, the similarity measurement index of the processed wire clamp image is constructed based on the image feature, including: marking the center point in the wire clamp segmentation image according to the image feature; marking the corresponding pixels of the processed wire clamp image through the center point to obtain marked pixels; and calculating the pixel similarity of the marked pixels through the center point using the following formula:

[0073]

[0074] Among them, silhouette(a, b) represents the pixel similarity between the marked pixel a and the marked pixel b, a_c represents the distance from the marked pixel a to the cth center point, b_c represents the distance from the marked pixel b to the cth center point, and W represents the cluster radius;

[0075] A similarity measurement index of the processed wire clamp image is constructed through the pixel similarity.

[0076] Furthermore, the embodiment of the present invention can effectively reduce the interference of the background on the subject by extracting the wire clip image foreground of the wire clip segmentation image, focus on the important elements in the image, and improve the visual effect. Among them, the wire clip image foreground refers to the image foreground containing the wire clip.

[0077] As an embodiment of the present invention, the foreground of the line clip image of the line clip segmentation image may be extracted by using a cutout technique.

[0078] Furthermore, the embodiment of the present invention can obtain a wire clip image with more complete details by fusing the wire clip image foreground to obtain a wire clip fused image foreground, thereby providing a data basis for later wire clip construction. The wire clip fused image foreground refers to a fused image obtained by fusing the wire clip image foreground.

[0079] As an embodiment of the present invention, the fusing of the line clip image foreground to obtain the line clip fused image foreground includes: dividing the frequency of the line clip fused image foreground to obtain a high-frequency line clip foreground and a low-frequency line clip foreground; performing high-frequency fusion on the high-frequency line clip foreground to obtain a high-frequency parallax line clip foreground; performing low-frequency fusion on the low-frequency line clip foreground to obtain a low-frequency parallax line clip foreground; and performing image fusion on the high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground to obtain the line clip fused image foreground.

[0080] Among them, the high-frequency line clip foreground and the low-frequency line clip foreground refer to a set of images obtained by dividing the line clip image foreground into high and low frequencies, the high-frequency parallax line clip foreground refers to an image obtained by fusing the high-frequency line clip foreground image, and the low-frequency parallax line clip foreground refers to an image obtained by fusing the low-frequency line clip foreground.

[0081] Furthermore, in an optional embodiment of the present invention, the step of fusing the high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground to obtain the line clip fused image foreground includes:

[0082] The high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground are image-fused using the following formula to obtain the line clip fusion image foreground:

[0083]

[0084] Among them, τ represents the line-clip fusion image foreground, Trh represents the fusion function, R represents the high-frequency parallax line-clip foreground, P i represents P, S represents the high-frequency parallax line clamp foreground and the line clamp image foreground corresponding to the low-frequency parallax line clamp foreground, γ represents the regularization parameter, and i represents the number of foregrounds of the high-frequency parallax line clamp foreground and the line clamp image foreground corresponding to the low-frequency parallax line clamp foreground.

[0085] S2. Extracting the wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features.

[0086] The embodiment of the present invention can extract key information of the wire clamp by extracting the wire clamp features in the foreground of the wire clamp fusion image to provide a data basis for later wire clamp modeling. The wire clamp features refer to characteristic attributes of the wire clamp, such as color, shape and other features. The wire clamp features can be identified by image feature extraction technology.

[0087] Furthermore, in the embodiment of the present invention, based on the characteristics of the wire clamp, a three-dimensional modeling wire clamp of the wire clamp to be prepared is constructed to intuitively display the structure and appearance of the wire clamp, which helps to preview and verify the design scheme before actual production, and reduce the possibility of errors and rework. Among them, the three-dimensional modeling wire clamp refers to a wire clamp model modeled by three-dimensional modeling technology.

[0088] As an embodiment of the present invention, the three-dimensional modeling of the wire clamp to be prepared is constructed based on the wire clamp features, including: identifying the wire clamp structure and wire clamp properties of the wire clamp to be prepared based on the wire clamp features; scanning the wire clamp structure to obtain point cloud data of the wire clamp to be prepared; constructing a modeling function of the wire clamp to be prepared based on the wire clamp properties; and constructing the three-dimensional modeling of the wire clamp to be prepared using the modeling function through the point cloud data and the wire clamp properties.

[0089] Among them, the wire clamp structure refers to the component structure of the wire clamp to be prepared, such as shape, width and other structures; the wire clamp attributes refer to the color, texture and other attributes of the wire clamp structure; the point cloud data refers to data describing the spatial structure of the wire clamp to be prepared; the modeling function refers to a function that performs spatial modeling on the wire clamp to be prepared, such as parametric modeling, reverse modeling, mesh modeling and other functions.

[0090] S3. Analyze the wire clamp holding force of the three-dimensional modeled wire clamp. When the wire clamp holding force meets the requirement, construct a preparation flow chart of the wire clamp to be prepared through the wire clamp requirement data. Based on the preparation flow chart, configure the preparation equipment of the wire clamp to be prepared.

[0091] The embodiment of the present invention can provide strong support for the design and improvement of the wire clamp by analyzing the wire clamp clamping force of the three-dimensional modeled wire clamp, wherein the wire clamp clamping force refers to the force applied by the wire clamp when fixing the wires and cables, so as to ensure that the wires and cables are stably and reliably connected and transmit power.

[0092] As an embodiment of the present invention, the analysis of the wire clamp clamping force of the three-dimensional modeling wire clamp includes: meshing the three-dimensional modeling wire clamp to obtain a meshed modeling wire clamp; applying boundary conditions to the meshed modeling wire clamp to obtain a conditional meshed modeling wire clamp; applying a load to the conditional meshed modeling wire clamp to obtain a load meshed modeling wire clamp; calculating the stiffness matrix of the load meshed modeling wire clamp; and analyzing the wire clamp clamping force of the three-dimensional modeling wire clamp through the stiffness matrix.

[0093] Among them, the mesh modeling wire clamp refers to the modeling wire clamp obtained by dividing the three-dimensional modeling wire clamp into unit grids, and the conditional mesh modeling wire clamp refers to applying appropriate boundary conditions to the wire clamp model according to the actual application scenario. For example, in the analysis of clamping force, fixed boundary conditions can be applied to keep the wire clamp stationary under the action of the clamping force, the load mesh modeling wire clamp refers to applying appropriate loads at the clamping force action position that needs to be analyzed, and the stiffness matrix refers to the description of the relationship between the displacement and stress of the wire clamp under the action of external force.

[0094] Further, in an optional embodiment of the present invention, the calculating the stiffness matrix of the load mesh modeling wire clamp includes: determining the load curve of the load mesh modeling wire clamp; and calculating the stiffness matrix of the load mesh modeling wire clamp based on the load curve using the following formula:

[0095] L = ∫Ωproperty*sin(θ t )

[0096] Where L represents the stiffness matrix of the load mesh modeling clamp, Ω represents the load mesh modeling clamp corresponding to the force mesh unit, property represents the material property of the load mesh modeling clamp corresponding to the force mesh unit, sin(θ t ) represents the load curve, θ t It represents the load value of the load mesh unit corresponding to the load mesh modeling clip at time t.

[0097] The material properties refer to the material characteristic properties of the load grid modeling wire clamp corresponding to the force grid unit, such as the elastic modulus E and the Poisson's ratio ν.

[0098] In the embodiment of the present invention, when the clamping force of the wire clamp meets the requirements, the preparation process drawing of the wire clamp to be prepared is constructed by using the wire clamp requirement data, and the wire clamp can be accurately prepared through the drawing, thereby improving the efficiency of wire clamp preparation. The preparation process drawing refers to a step drawing for preparing the wire clamp. The preparation process drawing for constructing the wire clamp to be prepared can be prepared through CAD.

[0099] Furthermore, the embodiment of the present invention can further improve the wire clamp preparation process by configuring the preparation equipment of the wire clamp to be prepared based on the preparation process drawing. The preparation equipment refers to mechanical equipment for preparing the wire clamp, such as cutting equipment, welding equipment, forming equipment and the like.

[0100] S4. Construct a coordination network for the preparation equipment, construct the time-frequency resources of the preparation equipment through the coordination network, simulate the wire clamp preparation work of the preparation equipment through the time-frequency resources, obtain wire clamp simulation work data, analyze the time-frequency conflicts of the wire clamp simulation work data, adjust the time-frequency resources based on the time-frequency conflicts, obtain adjusted time-frequency resources, and prepare the wire clamp through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp.

[0101] The embodiment of the present invention can realize the collaborative work between the equipment by constructing the coordination network of the preparation equipment, thereby improving the effect of wire clamp preparation. The coordination network refers to a network that can realize data transmission and regulation between the preparation equipment. The coordination network can be realized by building a network protocol.

[0102] Furthermore, the embodiment of the present invention can construct an efficient and reliable time-frequency resource allocation scheme for the preparation equipment through the coordination network, thereby improving the preparation effect of the wire clamp preparation. The time-frequency resource allocation scheme refers to a scheme for reasonably allocating frequency bands and time slots to the preparation equipment.

[0103] As an embodiment of the present invention, constructing the time-frequency resources of the preparation equipment through the coordination network includes: identifying equipment characteristics of the preparation equipment; analyzing the equipment functions and equipment control parameters of the preparation equipment based on the equipment characteristics; designing the network topology of the preparation equipment using the coordination network through the equipment functions, the equipment control parameters and preset equipment demand indicators; and constructing the time-frequency resources of the preparation equipment based on the network topology.

[0104] Among them, the equipment characteristics refer to the characteristic attributes of the preparation equipment, such as functional characteristics, structural characteristics and other characteristics; the equipment function refers to the function of the preparation equipment in producing wire clamps, such as softening structure, welding and other functions; the network topology refers to the design of a suitable network topology structure based on demand analysis. Common topological structures include star, ring, mesh and other structures; the equipment demand index refers to the demand target that the preparation equipment needs to achieve for wire clamp preparation.

[0105] Furthermore, the embodiment of the present invention simulates the wire clamp preparation work of the preparation equipment through the time-frequency resources, and obtains the wire clamp simulation work data. The abnormalities of the wire clamp preparation process can be analyzed through the simulation work, thereby improving the effect of wire clamp preparation. Among them, the wire clamp simulation work data refers to the production data generated by the simulation of the wire clamp preparation work of the preparation equipment. The wire clamp preparation work of the preparation equipment can be simulated to obtain the wire clamp simulation work data through the simulation function.

[0106] Furthermore, the embodiment of the present invention can identify the locations where preparation anomalies exist in the preparation process of the preparation equipment by analyzing the time-frequency conflicts of the wire clamp simulation work data, and carry out targeted repairs, thereby improving the preparation efficiency of the wire clamp. The time-frequency conflicts refer to anomalies existing in the simulated preparation process of the wire clamp, such as wire clamp wear, improper connection between equipment, and other anomalies. The analysis of the time-frequency conflicts of the wire clamp simulation work data can be achieved by analyzing the abnormal data in the wire clamp simulation work data.

[0107] In an embodiment of the present invention, the adjustment of time-frequency resources refers to a scheme for allocating frequency bands and time slots obtained after adjusting the parameters of the time-frequency resources. By adjusting the time-frequency resources, the wire clamp preparation process can be optimized, thereby improving the preparation effect of the wire clamp.

[0108] In the embodiment of the present invention, the wire clamp is prepared by the preparation device to obtain a finished wire clamp, which can realize the manufacture of a preliminary finished wire clamp. The finished wire clamp refers to a finished wire clamp prepared by the device.

[0109] S5. Analyze the surface defects of the finished wire clamp. When the surface defects of the wire clamp meet the requirements, perform surface treatment on the finished wire clamp to obtain a target wire clamp.

[0110] The embodiment of the present invention can detect and repair the surface defects of the finished wire clamp by analyzing the surface defects of the wire clamp, thereby avoiding damage to the wire clamp due to the expansion of the defects, thereby reducing the maintenance cost of the equipment. The surface defects of the wire clamp refer to damage on the surface of the finished wire clamp, such as wear, fracture and other damage. The surface defects of the wire clamp can be achieved by activating scanning technology.

[0111] Furthermore, in the embodiment of the present invention, the target wire clamp can be improved by surface treatment of the finished wire clamp to improve its surface performance and enhance its stability, reliability and durability during use. The target wire clamp refers to the final finished wire clamp. The surface treatment of the finished wire clamp can be achieved by surface coating or surface modification.

[0112] The embodiment of the present invention performs superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, which means grouping pixels in the image into superpixels with similar features, thereby improving the efficiency of subsequent processing and analysis. Furthermore, the embodiment of the present invention obtains a wire clamp fusion image foreground by fusing the wire clamp image foreground, thereby obtaining a wire clamp image with more complete details, thereby providing a data basis for the subsequent construction of the wire clamp. Furthermore, the embodiment of the present invention constructs a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features, thereby intuitively displaying the structure and appearance of the wire clamp, which helps to preview and verify the design scheme before actual production, thereby reducing the possibility of errors and rework. Furthermore, the embodiment of the present invention configures the preparation equipment of the wire clamp to be prepared based on the preparation process drawing, thereby further improving the wire clamp preparation process. The embodiment of the present invention can achieve collaborative work between equipment by constructing a coordination network of the preparation equipment, thereby improving the effect of wire clamp preparation. Finally, the embodiment of the present invention can detect and repair the wire clamp surface defects by analyzing the wire clamp surface defects of the finished wire clamp, thereby avoiding damage to the wire clamp due to defect expansion, thereby reducing the maintenance cost of the equipment. Therefore, the method for preparing the wire clamp proposed in the present invention can improve the preparation effect of the wire clamp.

[0113] like Figure 2 , which is a functional module diagram of a device for preparing a wire clamp provided in one embodiment of the present invention.

[0114] The manufacturing device 200 for realizing the wire clamp of the present invention can be installed in an electronic device. According to the functions to be realized, the manufacturing device 200 for realizing the wire clamp can include a wire clamp image foreground extraction module 201, a wire clamp three-dimensional modeling module 202, a wire clamp drawing design module 203, an equipment time-frequency resource configuration module 204 and a wire clamp surface treatment module 205. The module of the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0115] In this embodiment, the functions of each module / unit are as follows:

[0116] The wire clamp image foreground extraction module 201 is used to obtain a wire clamp image and wire clamp requirement data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground from the wire clamp segmentation image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground;

[0117] The wire clamp three-dimensional modeling module 202 is used to extract the wire clamp features in the foreground of the wire clamp fusion image, and construct a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features;

[0118] The wire clamp drawing design module 203 is used to analyze the wire clamp holding force of the three-dimensional modeled wire clamp, and when the wire clamp holding force meets the requirements, construct a preparation process drawing of the wire clamp to be prepared according to the wire clamp requirement data, and configure the preparation equipment of the wire clamp to be prepared based on the preparation process drawing;

[0119] The equipment time-frequency resource configuration module 204 is used to construct a coordination network for the preparation equipment, construct the time-frequency resources of the preparation equipment through the coordination network, simulate the wire clamp preparation work of the preparation equipment through the time-frequency resources, obtain wire clamp simulation work data, analyze the time-frequency conflict of the wire clamp simulation work data, adjust the time-frequency resources based on the time-frequency conflict, obtain adjusted time-frequency resources, and prepare the wire clamp through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;

[0120] The wire clamp surface processing module 205 is used to analyze the wire clamp surface defects of the finished wire clamp. When the wire clamp surface defects meet the requirements, the finished wire clamp is subjected to surface processing to obtain a target wire clamp.

[0121] In detail, each module described in the device 200 for preparing a wire clamp described in the embodiment of the present invention adopts the same technical means as the method for preparing a wire clamp described in the accompanying drawings when used, and can produce the same technical effects, which will not be repeated here.

[0122] An embodiment of the present invention provides an electronic device for implementing a method for preparing a wire clamp.

[0123] See also Figure 3 As shown, the electronic device may include a processor 30, a memory 31, a communication bus 32 and a communication interface 33, and may also include a computer program stored in the memory 31 and executable on the processor 30, such as a program for implementing a method for preparing a wire clamp.

[0124] In some embodiments, the processor may be composed of an integrated circuit, for example, a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and combinations of various control chips. The processor is the control core (Control Unit) of the electronic device, and uses various interfaces and lines to connect the various components of the entire electronic device, and executes or executes the program or module stored in the memory (for example, executes the preparation program for realizing the wire clamp, etc.), and calls the data stored in the memory to execute various functions of the electronic device and process data.

[0125] The memory includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disk, multimedia card, card-type memory (for example: SD or DX memory, etc.), magnetic memory, disk, optical disk, etc. In some embodiments, the memory may be an internal storage unit of an electronic device, such as a mobile hard disk of the electronic device. In other embodiments, the memory may also be an external storage device of an electronic device, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device. Further, the memory may also include both an internal storage unit of the electronic device and an external storage device. The memory can be used not only to store application software and various types of data installed in the electronic device, such as codes based on a preparation program for implementing a wire clamp, but also to temporarily store data that has been output or is to be output.

[0126] The communication bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The bus is configured to realize connection and communication between the memory and at least one processor, etc.

[0127] The communication interface is used for communication between the above-mentioned electronic device and other devices, including a network interface and a user interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device and other electronic devices. The user interface may be a display (Display), an input unit (such as a keyboard (Keyboard)), and optionally, the user interface may also be a standard wired interface, a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode, organic light-emitting diode) touch device, etc. Among them, the display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device and to display a visual user interface.

[0128] For example, although not shown, the electronic device may also include a power source (such as a battery) for supplying power to each component. Preferably, the power source may be logically connected to the at least one processor through a power management device, so that the power management device can realize functions such as charging management, discharging management, and power consumption management. The power source may also include any components such as one or more DC or AC power sources, recharging devices, power failure detection circuits, power converters or inverters, power status indicators, etc. The electronic device may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be repeated here.

[0129] It should be understood that the embodiment is for illustration only and the scope of the patent application is not limited to this structure.

[0130] The preparation program for realizing the wire clamp stored in the memory of the electronic device is a combination of multiple instructions, and when executed in the processor, the following can be realized:

[0131] Acquire a wire clamp image and wire clamp requirement data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground of the wire clamp segmentation image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground;

[0132] Extracting the wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features;

[0133] Analyze the clamping force of the three-dimensional modeled wire clamp, and when the clamping force meets the requirement, construct a preparation process drawing of the wire clamp to be prepared according to the wire clamp requirement data, and configure the preparation equipment of the wire clamp to be prepared based on the preparation process drawing;

[0134] Constructing a coordination network for the preparation equipment, constructing time-frequency resources for the preparation equipment through the coordination network, simulating the wire clamp preparation work of the preparation equipment through the time-frequency resources, obtaining wire clamp simulation work data, analyzing the time-frequency conflicts of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflicts, obtaining adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;

[0135] The surface defects of the finished wire clamp are analyzed, and when the surface defects of the wire clamp meet the requirements, the finished wire clamp is surface treated to obtain a target wire clamp.

[0136] Specifically, the specific implementation method of the processor for the above instructions can refer to the description of the relevant steps in the corresponding embodiment of the accompanying drawings, which will not be repeated here.

[0137] Furthermore, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a mobile hard disk, a magnetic disk, an optical disk, a computer memory, and a read-only memory (ROM).

[0138] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor of an electronic device, the computer program can implement:

[0139] Acquire a wire clamp image and wire clamp requirement data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground of the wire clamp segmentation image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground;

[0140] Extracting the wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features;

[0141] Analyze the clamping force of the three-dimensional modeled wire clamp, and when the clamping force meets the requirement, construct a preparation process drawing of the wire clamp to be prepared according to the wire clamp requirement data, and configure the preparation equipment of the wire clamp to be prepared based on the preparation process drawing;

[0142] Constructing a coordination network for the preparation equipment, constructing time-frequency resources for the preparation equipment through the coordination network, simulating the wire clamp preparation work of the preparation equipment through the time-frequency resources, obtaining wire clamp simulation work data, analyzing the time-frequency conflicts of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflicts, obtaining adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;

[0143] The surface defects of the finished wire clamp are analyzed, and when the surface defects of the wire clamp meet the requirements, the finished wire clamp is surface treated to obtain a target wire clamp.

[0144] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0145] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0146] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0147] The embodiments of the present application can acquire and process relevant data based on artificial intelligence technology. Among them, artificial intelligence (AI) is the theory, method, technology and application device that uses digital computers or machines controlled by digital computers to simulate, extend and expand human intelligence, perceive the environment, acquire knowledge and use knowledge to obtain the best results.

[0148] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in a device claim can also be implemented by one unit or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for manufacturing a wire clamp, characterized in that: The method comprises: Acquire a wire clamp image and wire clamp demand data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground of the wire clamp segmentation image, perform frequency division on the wire clamp image foreground to obtain a high-frequency wire clamp foreground and a low-frequency wire clamp foreground, perform high-frequency fusion on the high-frequency wire clamp foreground to obtain a high-frequency parallax wire clamp foreground, perform low-frequency fusion on the low-frequency wire clamp foreground to obtain a low-frequency parallax wire clamp foreground, perform image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground to obtain the wire clamp fused image foreground; Extracting the wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features; Analyze the clamping force of the three-dimensional modeled wire clamp, and when the clamping force meets the requirement, construct a preparation process drawing of the wire clamp to be prepared according to the wire clamp requirement data, and configure the preparation equipment of the wire clamp to be prepared based on the preparation process drawing; Constructing a coordination network for the preparation equipment, constructing time-frequency resources for the preparation equipment through the coordination network, simulating the wire clamp preparation work of the preparation equipment through the time-frequency resources, obtaining wire clamp simulation work data, analyzing the time-frequency conflicts of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflicts, obtaining adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp; The surface defects of the finished wire clamp are analyzed, and when the surface defects of the wire clamp meet the requirements, the finished wire clamp is surface treated to obtain a target wire clamp.

2. The method for manufacturing a wire clamp according to claim 1, characterized in that: The step of performing superpixel segmentation on the wire clip image to obtain a wire clip segmentation image includes: Preprocessing the wire clamp image to obtain a processed wire clamp image; Extracting image features of the processed wire clamp image; Based on the image features, constructing a similarity measurement index of the processed wire clamp image; Based on the similarity measurement index, superpixel segmentation is performed on the processed wire clamp image to obtain the wire clamp segmentation image.

3. The method for manufacturing a wire clamp according to claim 2, characterized in that: The constructing a similarity measurement index of the processed wire clamp image based on the image features includes: According to the image features, marking the center point in the line clamp segmentation image; Marking the pixels corresponding to the processed line clamp image through the center point to obtain marked pixels; The pixel similarity of the marked pixels is calculated using the following formula through the center point: ； in, Represents the marked pixel and marker pixels The pixel similarity of Represents the marked pixel To The distance between the center points, Represents the marked pixel To The distance between the center points, represents the cluster radius; A similarity measurement index of the processed wire clamp image is constructed through the pixel similarity.

4. The method for manufacturing a wire clamp according to claim 1, characterized in that: The step of fusing the high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground to obtain the line clip fused image foreground includes: The high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground are image-fused using the following formula to obtain the line clip fusion image foreground: ； in, represents the line-clip fused image foreground, represents the fusion function, represents the high-frequency parallax line clip foreground, express , represents the line clip image foreground corresponding to the high-frequency parallax line clip foreground and the low-frequency parallax line clip foreground, represents the regularization parameter, The foreground number of the clip image foreground corresponding to the high-frequency parallax clip foreground and the low-frequency parallax clip foreground is represented.

5. The method for manufacturing a wire clamp according to claim 1, characterized in that: The method of constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features includes: Based on the wire clamp features, identifying the wire clamp structure and wire clamp properties of the wire clamp to be prepared; Scanning the wire clamp structure to obtain point cloud data of the wire clamp to be prepared; Based on the properties of the wire clamp, construct a modeling function of the wire clamp to be prepared; The three-dimensional modeling wire clamp of the wire clamp to be prepared is constructed using the modeling function through the point cloud data and the wire clamp properties.

6. The method for manufacturing a wire clamp according to claim 1, characterized in that: The analyzing the clamping force of the three-dimensional modeled wire clamp comprises: Meshing the three-dimensional modeling wire clamp to obtain a meshed modeling wire clamp; Applying boundary conditions to the grid modeling wire clamp to obtain a conditional grid modeling wire clamp; Applying a load to the conditional mesh modeling wire clamp to obtain a load mesh modeling wire clamp; Calculating the stiffness matrix of the load mesh modeling clamp; The wire clamp holding force of the three-dimensional modeled wire clamp is analyzed through the stiffness matrix.

7. The method for manufacturing a wire clamp according to claim 6, characterized in that: The calculating of the stiffness matrix of the load mesh modeling clamp comprises: Determining a load curve of the load mesh modeling clamp; Based on the load curve, the stiffness matrix of the load mesh modeling clamp is calculated using the following formula: ； in, Represents the stiffness matrix of the loaded mesh modeling clip, Indicates the load mesh modeling line clip corresponding to the force grid unit, Indicates the material properties of the load mesh modeling clip corresponding to the force grid unit, represents the load curve, express The load grid modeling clip at the moment corresponds to the load value of the force grid unit.

8. The method for manufacturing a wire clamp according to claim 1, characterized in that: The step of constructing the time-frequency resources of the preparation equipment through the coordination network includes: identifying equipment characteristics of the preparation equipment; Based on the equipment characteristics, analyzing equipment functions and equipment control parameters of the preparation equipment; By using the equipment function, the equipment control parameters and the preset equipment demand indicators, the coordination network is used to design the network topology of the preparation equipment; Based on the network topology, the time and frequency resources of the preparation equipment are constructed.

9. A device for manufacturing a wire clamp, characterized in that: The device is used to perform the method for preparing a wire clamp as claimed in any one of claims 1 to 8, the device comprising: A wire clamp image foreground extraction module is used to obtain a wire clamp image and wire clamp demand data of a wire clamp to be prepared, perform superpixel segmentation on the wire clamp image to obtain a wire clamp segmentation image, extract a wire clamp image foreground of the wire clamp segmentation image, perform frequency division on the wire clamp image foreground to obtain a high-frequency wire clamp foreground and a low-frequency wire clamp foreground, perform high-frequency fusion on the high-frequency wire clamp foreground to obtain a high-frequency parallax wire clamp foreground, perform low-frequency fusion on the low-frequency wire clamp foreground to obtain a low-frequency parallax wire clamp foreground, and perform image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground to obtain the wire clamp fused image foreground; A wire clamp three-dimensional modeling module, used for extracting wire clamp features in the foreground of the wire clamp fusion image, and constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp features; A wire clamp drawing design module is used to analyze the wire clamp holding force of the three-dimensional modeled wire clamp, and when the wire clamp holding force meets the requirements, a preparation process drawing of the wire clamp to be prepared is constructed through the wire clamp demand data, and a preparation device for the wire clamp to be prepared is configured based on the preparation process drawing; An equipment time-frequency resource configuration module is used to construct a coordination network for the preparation equipment, to construct the time-frequency resources of the preparation equipment through the coordination network, to simulate the wire clamp preparation work of the preparation equipment through the time-frequency resources, to obtain wire clamp simulation work data, to analyze the time-frequency conflicts of the wire clamp simulation work data, to adjust the time-frequency resources based on the time-frequency conflicts, to obtain adjusted time-frequency resources, to prepare the wire clamp through the preparation equipment based on the adjusted time-frequency resources, to obtain a finished wire clamp; The wire clamp surface treatment module is used to analyze the wire clamp surface defects of the finished wire clamp. When the wire clamp surface defects meet the requirements, the finished wire clamp is surface treated to obtain a target wire clamp.

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