Cleaning equipment circuit board and its potting method, potting system, cleaning equipment

Abstract

The present invention discloses a potting method for a cleaning equipment circuit board, comprising: applying glue to the bottom surface of the cleaning equipment circuit board and leaving it to stand for a first preset curing time; turning over the cleaning equipment circuit board and placing the cleaning equipment circuit board in a mold that matches its shape; applying glue to the top surface of the cleaning equipment circuit board in the mold and leaving it to stand for a second preset curing time; and removing the mold. The potting method for the cleaning equipment circuit board of the present invention implements miniaturization of the cleaning equipment circuit board by respectively performing glue potting and sealing on the bottom surface and the top surface of the cleaning equipment circuit board so that the cleaning equipment circuit board is coated with glue on both sides; and after potting is completed, the corresponding mold is removed, and the cleaning equipment circuit board can be installed separately on the cleaning equipment without the mold in the prior art being installed together, thereby reducing the occupied space and weight, thereby meeting the requirements of high integration, small size, and lightness of the cleaning equipment.

Description

Technical Field

[0001] The invention relates to the field of circuit board potting, and in particular to a cleaning device circuit board and a potting method, a potting system and a cleaning device. Background Art

[0002] Nowadays, cleaning robots are often in working environments such as kitchens and bathrooms. To ensure normal operation, their internal circuit boards need to be waterproofed.

[0003] At present, when waterproofing circuit boards, Figure 1 As shown, the circuit board 10 is usually placed in the mold box 20, and the top surface of the circuit board 10 in the mold box 20 is sealed by pouring glue, and the glue flows to the bottom surface of the circuit board 10 through the glue holes 10A on the circuit board 10. In order to ensure that the glue can flow smoothly from the top surface of the circuit board 10 to the bottom surface, this solution needs to use glue with good fluidity, and glue with good fluidity can easily enter the connector 11 on the top surface of the circuit board 10, thereby affecting the normal use of the connector 11. Furthermore, in order to avoid such a situation, the height of the connector 11 in the prior art will be made relatively high, and it is also necessary to reserve more and larger glue holes 10A on the circuit board 10, occupying the setting area of ​​electronic components, so that the circuit board 10 cannot be miniaturized. At the same time, since the mold box 20 plays a positioning role, the thickness of the mold box 20 is generally thicker, specifically generally more than 5 mm. This mold box 20 is large in size and occupies space. During installation, the circuit board 10 needs to be installed on the cleaning equipment together with the mold box 20, which makes the entire circuit board module larger in size and heavier in weight, and cannot meet the requirements of high integration, small size and lightness of the cleaning equipment. Summary of the invention

[0004] The main purpose of the present invention is to propose a potting method for a cleaning equipment circuit board, aiming to solve the technical problem that the current filling method of the cleaning equipment circuit board makes it impossible to miniaturize the cleaning equipment circuit board, and the circuit board is installed on the cleaning equipment together with the mold, which makes the entire circuit board module large in size and heavy in weight, and cannot meet the design requirements of high integration, small size and lightness of the cleaning equipment.

[0005] To achieve the above object, the present invention provides a potting method for a circuit board of a cleaning device in a first aspect. The potting method for a circuit board of a cleaning device comprises:

[0006] Applying glue to the bottom surface of the cleaning device circuit board and leaving it to stand for a first preset curing time;

[0007] Turning over the cleaning device circuit board, and placing the cleaning device circuit board in a mold that matches its shape;

[0008] Dispensing glue on the top surface of the cleaning device circuit board in the mold and leaving it to stand for a second preset curing time;

[0009] The mold is removed.

[0010] In some embodiments, before performing the step of dispensing glue on the bottom surface of the cleaning device circuit board and standing for a first preset curing time, the method further includes:

[0011] The cleaning device circuit board is placed in a first fixture to position the cleaning device circuit board.

[0012] In some embodiments, before performing the step of dispensing glue on the top surface of the cleaning device circuit board in the mold and standing for a second preset curing time, the method further includes:

[0013] The mold is placed in a second fixture to position the cleaning device circuit board.

[0014] In some embodiments, the second fixture is provided with a second positioning groove and a pressing member, the second positioning groove matches the shape of the mold, and the pressing member is used to press the mold;

[0015] The step of placing the mold in a second fixture to position the cleaning device circuit board includes:

[0016] placing the mold in the second positioning groove;

[0017] The mold is pressed by the pressing member.

[0018] In some embodiments, a mounting hole is provided on the cleaning device circuit board, and an inserting portion adapted to the mounting hole is provided on the pressing member;

[0019] The step of pressing the mold by a pressing member comprises:

[0020] The insertion part of the pressing member is correspondingly inserted into the installation hole of the cleaning equipment circuit board.

[0021] In some embodiments, a plurality of electrical connectors are disposed on the top surface of the cleaning device circuit board, wherein a side surface of at least one of the electrical connectors is provided with a bayonet for engaging with a plug-in terminal;

[0022] The glue dispensed on the bottom surface of the cleaning device circuit board is a semi-flowing glue with a viscosity of 700mPas to 1300mPas, and / or the glue dispensed on the top surface of the cleaning device circuit board is a semi-flowing glue with a viscosity of 700mPas to 1300mPas.

[0023] In some embodiments, the mold is a blister box;

[0024] And / or, the mold is a transparent part;

[0025] And / or, the wall thickness of the mold is 0.2 mm to 0.5 mm;

[0026] And / or, the thickness of the glue dispensed on the bottom surface of the circuit board of the cleaning device is 1 mm to 2 mm;

[0027] And / or, the thickness of the glue dispensed on the top surface of the cleaning equipment circuit board in the mold is 1 mm to 2 mm.

[0028] A second aspect of the present invention provides a potting system for a circuit board of a cleaning device, the potting system for a circuit board of a cleaning device comprising:

[0029] A mold for placing an upright cleaning device circuit board;

[0030] The first fixture is provided with a first positioning groove adapted to the shape of the cleaning device circuit board and is used for placing the inverted cleaning device circuit board.

[0031] In some embodiments, it also includes:

[0032] The second fixture is provided with a second positioning groove adapted to the shape of the mold and is used to accommodate the mold.

[0033] In some embodiments, a pressing member is further provided on the second fixture, and the pressing member is used to press the mold.

[0034] In some embodiments, a mounting hole is provided on the cleaning device circuit board, and an inserting portion adapted to the mounting hole is provided on the pressing member, and the inserting portion of the pressing member can be correspondingly inserted into the mounting hole.

[0035] A third aspect of the present invention provides a cleaning equipment circuit board, which is prepared by using any of the above-mentioned potting methods for cleaning equipment circuit boards.

[0036] A fourth aspect of the present invention provides a cleaning device, comprising:

[0037] A device body, and the cleaning device circuit board as described above, wherein the cleaning device circuit board is installed in the device body.

[0038] The potting method of the cleaning equipment circuit board of the present invention first dispenses glue on the bottom surface of the cleaning equipment circuit board, and leaves it to stand for a first preset curing time; flips the cleaning equipment circuit board and places the cleaning equipment circuit board in a mold that matches its shape; dispenses glue on the top surface of the cleaning equipment circuit board in the mold, and leaves it to stand for a second preset curing time; and finally removes the mold. It can be seen that compared with the prior art, the potting method of the cleaning equipment circuit board of the present invention is to seal the bottom and top surfaces of the cleaning equipment circuit board respectively, so that the cleaning equipment circuit board is coated with glue on both sides, and there is no need to use a glue with relatively good fluidity, so the connector can use a low connector accordingly. And there is no need to reserve a glue hole on the cleaning equipment circuit board, which reduces the area occupied by the electronic components, realizes the compact arrangement of the electronic components on the cleaning equipment circuit board, reduces the area of ​​the cleaning equipment circuit board, and makes the cleaning equipment circuit board miniaturized; and, after the potting is completed, the mold is removed, and the cleaning equipment circuit board can be installed separately on the cleaning equipment, without the mold in the prior art being installed together, reducing the occupied space and weight, thereby meeting the requirements of high integration, small volume, and lightness of the cleaning equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of a state in which a circuit board is placed in a mold for dispensing in the prior art;

[0040] Figure 2 It is a schematic diagram of the structure of a circuit board of a cleaning device in one embodiment of the present invention;

[0041] Figure 3 for Figure 2 A schematic diagram of the structure of the circuit board of the cleaning device in the embodiment from another perspective;

[0042] Figure 4 It is a flow chart of a method for potting a circuit board of a cleaning device according to an embodiment of the present invention;

[0043] Figure 5 It is a structural schematic diagram of a mold in one embodiment of the present invention;

[0044] Figure 6 It is a flow chart of a method for potting a circuit board of a cleaning device according to an embodiment of the present invention;

[0045] Figure 7 It is a structural schematic diagram of a first fixture in one embodiment of the present invention;

[0046] Figure 8 It is a flow chart of a method for potting a circuit board of a cleaning device according to an embodiment of the present invention;

[0047] Fig. 9 It is a structural schematic diagram of a second fixture in one embodiment of the present invention;

[0048] Fig.10 It is a flow chart of a method for potting a circuit board of a cleaning device according to an embodiment of the present invention;

[0049] Fig.11 The figure is a flow chart of a method for potting a circuit board of a cleaning device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0052] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0053] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0054] As household appliances, cleaning equipment has many types, such as sweeping robots, sweeping and mopping robots, mopping robots, floor scrubbers, cleaning base stations, etc. Cleaning equipment is equipped with circuit boards. Because they are often in working environments such as kitchens and bathrooms, circuit boards need to be waterproofed, usually meeting IPX4 waterproof requirements. Traditional household appliances use glue to seal circuit boards. Figure 1 As shown, the glue dispensing method is to place the circuit board 10 in the mold box 20, and fill the glue from the top surface of the circuit board 10, and the glue flows to the bottom surface of the circuit board 10 through the glue holes 10A on the circuit board 10.

[0055] Based on this glue dispensing method, in order to ensure that the glue can flow smoothly from the top surface of the circuit board 10 to the bottom surface, it is necessary to use glue with good fluidity, and glue with good fluidity is easy to enter the connector 11, thereby affecting the normal use of the connector 11. Further, in order to avoid such a situation, the height of the connector 11 in the prior art will be made relatively high, because a plurality of glue holes 10A for glue application need to be reserved, and electronic components cannot be set at the glue holes 10A, occupying more area of ​​the board body, which will also lead to a relatively large design area of ​​the circuit board 10, making it impossible to miniaturize the circuit board 10.

[0056] In addition, the above-mentioned glue dispensing method of the circuit board 10 needs to ensure the consistency of the glue thickness and position, so it needs to be finalized through the mold box 20. In order to ensure the reliability of the mold box 20, a mold box 20 with a thicker thickness (for example, more than 5 mm) and better rigidity is usually selected. When installing the circuit board 10, the circuit board 10 is connected to the mold box 20 and installed on the cleaning equipment together, so that the entire circuit board module is larger in size and heavier in weight, which is not conducive to the miniaturization and lightness of the cleaning equipment.

[0057] Based on this, the present invention proposes a potting method for a cleaning device circuit board 100. The cleaning device circuit board 100 involved in this solution can be a main control circuit board of the cleaning device, or it can be other types of circuit boards, without limitation. The cleaning device circuit board 100 can be in a conventional shape such as square or round, or it can be in an unconventional shape, depending on the actual situation. Generally speaking, Figure 2 and Figure 3 As shown, the cleaning equipment circuit board 100 has a bottom surface A (also called the lower surface) and a top surface B (also called the upper surface) facing opposite directions, and electronic components such as semiconductors, resistors, capacitors, etc. can be arranged on the top surface B and the bottom surface A according to the function of the circuit board and the circuit requirements.

[0058] Reference Figure 4 , the potting method of the cleaning device circuit board 100 includes:

[0059] Step S100: dispensing glue on the bottom surface A of the cleaning device circuit board 100 and leaving it to stand for a first preset curing time.

[0060] It should be noted that the present application defines the bottom surface A and the top surface B of the cleaning device circuit board 100 in the following manner. When the cleaning device circuit board 100 is in normal use, there is a mounting surface for mounting the cleaning device circuit board 100 in the housing of the cleaning device, and the surface of the cleaning device circuit board 100 that contacts the mounting surface of the housing of the cleaning device or faces the mounting surface of the housing of the cleaning device is the bottom surface A, and the surface that faces away from the mounting surface of the housing of the cleaning device is the top surface B.

[0061] Usually, a connector is provided on the cleaning device circuit board 100. The connector is a component used to connect to an external electronic device. For example, the connector has an interface, one end of a power cord with a plug connector is plugged into the interface of the connector, and the other end of the power cord is connected to a battery to realize power supply of the cleaning device circuit board 100. Of course, in the embodiment of the present application, the connector on the cleaning device circuit board 100 can also be used to connect to other electronic components through wires, for example, connected to a key module in the cleaning device through a wire. The connector of the cleaning device circuit board 100 is generally provided on the top surface B, so that when the cleaning device circuit board 100 is installed, the user can also easily plug and unplug the wires for easy maintenance.

[0062] In this implementation step, glue is dispensed onto the bottom surface A of the cleaning device circuit board 100, and the glue adheres to the bottom surface A of the cleaning device circuit board 100, and automatically solidifies to form a glue layer after standing for a first preset curing time, thereby sealing the electronic components and circuits on the bottom surface A of the cleaning device circuit board 100, and achieving waterproof sealing of the bottom surface A of the cleaning device circuit board 100. The first preset curing time can be set or changed according to actual conditions, such as 3h, 4h or 5h, and there is no limitation on this.

[0063] Step S200: Turn over the cleaning device circuit board 100 and place the cleaning device circuit board 100 in a mold 200 that matches its shape.

[0064] In this implementation step, the cleaning equipment circuit board 100 is flipped to be placed in the mold 200 from the opening of the mold 200. At this time, the bottom surface A of the cleaning equipment circuit board 100 faces the inner bottom surface of the mold 200, and the top surface B of the cleaning equipment circuit board 100 faces the opening of the mold 200. Among them, the flipping of the cleaning equipment circuit board 100 can be realized by flipping a flipping device, or it can be realized by manual flipping, and those skilled in the art can set it according to actual conditions. The mold 200 involved is made according to the shape of the cleaning equipment circuit board 100 to match the cleaning equipment circuit board 100. When the cleaning equipment circuit board 100 is located in the mold 200, it can be stably positioned. It should be noted that in this application, the role of the mold 200 is to realize the fixing of the cleaning equipment circuit board 100 and the positioning of the dispensing path when dispensing glue, and it can also be used as a stable storage tool for the cleaning equipment circuit board 100 during the dispensing to curing process, avoiding overflow of glue, positioning deviation, and gluing to other places, thereby improving the dispensing quality.

[0065] like Figure 5As shown, the mold 200 provided in the embodiment of the present application can be a blister box, which is a bubble shell, and is formed into a plastic box shape by blistering a sheet. Exemplarily, the mold 200 can be a transparent part, specifically a PET material, which has the characteristics of light weight, good sealing performance, and low cost. The mold 200 adopts a transparent setting, which can facilitate observation of whether the glue produces bubbles, stratification, etc., so as to ensure the dispensing effect. In some embodiments, the wall thickness of the mold 200 is 0.2mm to 0.5mm, and the wall thickness of the exemplary mold 200 is 0.3mm. The size and thickness designed for the blister box can be set according to actual conditions and are not limited here. It can be understood that the thinner the wall thickness of the mold 200, the easier it is to remove the mold 200.

[0066] Step S300: dispensing glue on the top surface B of the cleaning device circuit board 100 in the mold 200, and leaving it to stand for a second preset curing time.

[0067] In this implementation step, glue is dispensed onto the top surface B of the cleaning device circuit board 100, and the glue adheres to the top surface B of the cleaning device circuit board 100, so as to automatically solidify to form a glue layer after standing for a second preset curing time, thereby sealing the electronic components and circuits on the top surface B of the cleaning device circuit board 100, and achieving waterproof sealing of the top surface B of the cleaning device circuit board 100. The second preset curing time can be set or changed according to actual conditions, such as 3h, 4h or 5h, and there is no limitation on this.

[0068] Furthermore, when the cleaning equipment circuit board 100 is placed in the mold 200 and glue is dispensed on the top surface B, the glue liquid dispensed on the top surface B of the cleaning equipment circuit board 100 can flow to the peripheral position of the cleaning equipment circuit board 100 by itself, and seamlessly connect with the glue layer on the bottom surface A of the cleaning equipment, thereby achieving a complete glue dispense seal of the bottom surface A, top surface B and circumferential side of the cleaning equipment, and can improve the waterproof sealing of the cleaning equipment circuit board 100.

[0069] Step S400: removing the mold 200. In this implementation step, the cleaning device circuit board 100 with double-sided glue sealing is obtained by removing the mold 200, so as to carry out the subsequent separate installation of the cleaning device circuit board 100. The mold 200 can be removed by a manipulator or by manual operation, which is set according to the actual situation. It is easy to understand that the mold 200 can be a blister box, which is easy to deform under the action of external force, so when removing it, the operation is simple and convenient.

[0070] For the potting method of the cleaning device circuit board 100, a potting device can be used to pot the cleaning device circuit board 100. Optionally, the potting device includes a glue dispenser, so that the bottom surface A and the top surface B of the cleaning device circuit board 100 are automatically dispensed by the glue dispenser, which can improve the glue dispensing efficiency and glue dispensing effect compared with manual glue dispensing. The type of glue used is set according to actual conditions, and this embodiment does not limit this.

[0071] In some embodiments, reference Figure 3 , the top surface B of the cleaning device circuit board 100 is provided with a plurality of electrical connectors 110, wherein the side of at least one electrical connector 110 is provided with a bayonet 111 for engaging with a plug-in terminal. In the embodiment of the present application, the glue liquid dispensed on the bottom surface A of the cleaning device circuit board 100 is a semi-flowing glue liquid with a viscosity of 700mPas to 1300mPas, and / or, the glue liquid dispensed on the top surface B of the cleaning device circuit board 100 is a semi-flowing glue liquid with a viscosity of 700mPas to 1300mPas.

[0072] The cleaning equipment circuit board 100 is provided with various devices including an electrical connector 110. The electrical connector 110 is a low structure on the circuit board. During the glue filling process, the glue can easily flow into the interior of the interface of the electrical connector 110 from the snap-in 111 on the side of the electrical connector 110, and is sealed after the glue solidifies, resulting in the electrical connector 110 being unable to connect and communicate normally with the plug-in terminal later.

[0073] In the present embodiment, optionally, the glue used for gluing the bottom surface A of the cleaning equipment circuit board 100 is a semi-flowing glue with a viscosity of 700mPas to 1300mPas, which is a single-component dealcoholized translucent and semi-flowing silicone sealant that cures at room temperature, and has excellent resistance to cold and heat changes, stress changes, and high and low temperature resistance (maintaining elasticity and stability for a long time at -40 to 150°C); during the curing process, the viscosity of the glue is about 700mPas to 1300mPas, and because of its semi-flowing property, it is ensured that it can flow into the larger gap (about 1mm) between the electronic components of the bottom surface A of the cleaning equipment circuit board 100, and will not flow into the interior of the interface from the bayonet 111 on the side of the electrical connector 110 (the gap is relatively small, less than 0.15mm), while ensuring high protection, avoiding interference with the normal plugging and unplugging and communication of the electrical connector 110, that is, the electrical connector 110 will not seep glue, which can improve the gluing effect.

[0074] Optionally, the glue used for gluing the top surface B of the cleaning equipment circuit board 100 is a semi-flowing glue with a viscosity of 700mPas to 1300mPas. It is a room temperature curing single-component dealcoholized translucent and semi-flowing silicone sealant, which has excellent resistance to thermal changes, stress changes, and high and low temperature resistance (maintaining elasticity and stability for a long time at -40 to 150°C); during the curing process, the viscosity of the glue is around 700mPas to 1300mPas, and due to its semi-flowing property, it is ensured that it can flow into the larger gap (about 1mm) between the electronic components on the top surface B of the cleaning equipment circuit board 100, and will not flow into the interior of the interface from the bayonet 111 on the side of the electrical connector 110 (the gap is relatively small, less than 0.15mm), while ensuring high protection, avoiding interference with the normal plugging and unplugging and communication of the connector, that is, the electrical connector 110 will not seep glue, which can improve the gluing effect.

[0075] Furthermore, the semi-flowing adhesive with a viscosity of 700mPas to 1300mPas has a moderate hardness after curing and can absorb a certain amount of mechanical stress, thereby ensuring that the device is protected from stress damage during vibration and strong plugging and unplugging.

[0076] In some embodiments, the glue dispensed on the bottom surface of the cleaning device circuit board has a thickness of 1 mm to 2 mm; the glue dispensed on the top surface of the cleaning device circuit board in the mold has a thickness of 1 mm to 2 mm.

[0077] Compared with the prior art, the potting method of the cleaning equipment circuit board 100 provided in the embodiment of the present invention performs glue potting and sealing on the bottom surface A and the top surface B of the cleaning equipment circuit board 100 respectively, so that the cleaning equipment circuit board 100 is coated with glue on both sides, without the need to use glue with relatively good fluidity. Therefore, the electrical connector 110 on the cleaning equipment circuit board 100 can correspondingly adopt a low electrical connector 110. Exemplarily, the side wall of the electrical connector 110 generally has a bayonet 111. For the circuit board manufactured by the potting method of the cleaning equipment circuit board 100 provided in the embodiment of the present application, the bayonet 111 on the electrical connector 110 can be 2 mm away from the top surface B of the cleaning equipment circuit board 100. The distance is short, and the overall protruding height of the electrical connector 110 can be shorter, which is conducive to the overall miniaturization of the cleaning equipment circuit board 100. Furthermore, no glue holes need to be reserved on the cleaning equipment circuit board 100, thereby reducing the area occupied by the electronic components, achieving compact arrangement of the electronic components on the cleaning equipment circuit board 100, reducing the area of ​​the cleaning equipment circuit board 100, and miniaturizing the cleaning equipment circuit board 100; furthermore, a detachable and easily detachable mold 200 is used during the glue pouring process, and the mold 200 can be removed accordingly when the pouring is completed. The cleaning equipment circuit board 100 can be installed separately on the cleaning equipment without the mold being installed in conjunction with it in the prior art, thereby reducing the occupied space and weight, thereby meeting the requirements of high integration, small size, and lightness of the cleaning equipment.

[0078] In some embodiments, reference Figure 6 and Figure 7 Before executing step S100, the potting method of the cleaning device circuit board 100 further includes:

[0079] Step S500 : placing the cleaning device circuit board 100 in the first fixture 310 to position the cleaning device circuit board 100 .

[0080] In this implementation step, the first fixture 310 is used to position the cleaning device circuit board 100. After the cleaning device circuit board 100 is placed in the first fixture 310 for positioning, glue is then applied to the bottom surface A of the cleaning device circuit board 100, which can improve the glue application accuracy, ensure the glue application curing effect, and thus improve the sealing. The structural structure of the first fixture 310 can be set according to actual conditions. Optionally, as Figure 7As shown, the first fixture 310 may be provided with a first positioning groove 311, and the first positioning groove 311 is adapted to the shape of the cleaning device circuit board 100. Specifically, when the cleaning device circuit board 100 is inserted into the first positioning groove 311, the inner side wall of the first positioning groove 311 contacts the edge side wall of the cleaning circuit board 100. The cleaning device circuit board 100 can be positioned by placing it in the first positioning groove 311. Furthermore, a plurality of first positioning grooves 311 may be provided on the first fixture 310, and a plurality of first positioning grooves 311 may be correspondingly placed with a plurality of cleaning device circuit boards 100, so as to perform batch positioning and dispensing of the cleaning device circuit boards 100.

[0081] In some embodiments, reference Figure 8 and Fig. 9 Before executing step S300, the potting method of the cleaning device circuit board 100 further includes:

[0082] Step S600 : placing the mold 200 in the second fixture 320 to position the cleaning device circuit board 100 .

[0083] In this implementation step, the second fixture 320 is used to position the cleaning device circuit board 100. After the mold 200 (with the cleaning device circuit board 100 inside) is placed in the second fixture 320 for positioning, the top surface B of the cleaning device circuit board 100 is then glued, which can improve the glue dispensing accuracy, ensure the glue dispensing curing effect, and thus improve the sealing. Among them, the structural structure of the second fixture 320 can be set according to actual conditions.

[0084] In some embodiments, reference Fig. 9 The second fixture 320 is provided with a second positioning groove 321 and a pressing member 322. The second positioning groove 321 is adapted to the shape of the mold 200. Specifically, when the cleaning device circuit board 100 is installed in the second positioning groove 321, the inner side wall of the second positioning groove 321 contacts the outer side wall of the mold 200, and the pressing member 322 is used to press the mold 200.

[0085] Reference Fig.10 , step S600 includes:

[0086] Step S610: placing the mold 200 in the second positioning groove 321;

[0087] Step S620 : Pressing the mold 200 by the pressing member 322 .

[0088] In this implementation step, the mold 200 is placed in the second positioning groove 321 and is positioned by being pressed by the clamping member 322. Under the pressing action of the clamping member 322, the mold 200 is firmly placed in the second positioning groove 321 of the second fixture 320, which can improve the positioning accuracy. Optionally, a plurality of second positioning grooves 321 can be provided on the second fixture 320, and the plurality of second positioning grooves 321 can correspond to the placement of a plurality of molds 200 with cleaning equipment circuit boards 100 placed thereon, so as to facilitate batch positioning and dispensing of the cleaning equipment circuit boards 100. Among them, the clamping member 322 is provided corresponding to the second positioning groove 321, and one second positioning groove 321 can be provided with one clamping member 322, or a plurality of second positioning grooves 321 can be provided with one clamping member 322 (such as Fig. 9 ), set according to actual conditions. Optionally, the pressing member 322 is rotatably connected to the second fixture 320. When the mold 200 in the second positioning groove 321 needs to be positioned, the pressing member 322 is rotated to the notch of the second positioning groove 321, and the mold 200 is pressed by pressing the edge of the mold 200, so that the positioning effect is better. Of course, this is only exemplary and not restrictive.

[0089] In some embodiments, reference Figure 2 and Figure 3 , the cleaning device circuit board 100 is provided with a mounting hole 101, referring to Fig. 9 The pressing member 322 is provided with an inserting portion 322a adapted to the mounting hole 101. The mounting hole 101 on the cleaning device circuit board 100 is used for assembling the cleaning device circuit board 100 to the cleaning device housing. Specifically, a connecting member (such as a screw) can be passed through the mounting hole on the cleaning device circuit board 100 and the mounting hole on the cleaning device housing, and the cleaning device circuit board 100 can be installed and fixed on the cleaning device housing under the action of the connecting member.

[0090] Reference Fig.11 , step S620 includes:

[0091] Step S621 : inserting the inserting portion 322 a of the pressing member 322 into the mounting hole 101 of the cleaning device circuit board 100 .

[0092] In this implementation step, when the clamping member 322 clamps the mold 200, its insertion portion 322a is correspondingly inserted into the mounting hole 101 of the cleaning device circuit board 100. In this way, when dispensing glue, the glue will not flow into the mounting hole 101 of the cleaning device circuit board 100 and block it, thereby ensuring the dispensing effect. In addition, by the insertion and matching of the insertion portion 322a of the clamping member 322 with the mounting hole 101 of the cleaning device circuit board 100, the position of the cleaning device circuit board 100 can be limited to prevent it from being displaced, thereby further improving the positioning effect. Among them, the number and position of the insertion portion 322a on the clamping member 322 are set according to the mounting hole 101 on the cleaning device circuit board 100, and there is no restriction on this.

[0093] In this solution, the first fixture 310 and the second fixture 320 are fixed to ensure that there are no bubbles after the glue is cured, the surface is flat, the cured product has good acid and alkali resistance, good moisture-proof, waterproof and dust-proof properties, and has good insulation, compression resistance, high bonding strength and other physical properties, so that the cleaning equipment circuit board 100 can be used in applications with different salinity, humidity and temperature.

[0094] The embodiment of the present invention also provides a potting system for a cleaning device circuit board 100, referring to Figure 5 and Figure 7 , the potting system of the cleaning device circuit board 100 includes:

[0095] The mold 200 is used to place the upright cleaning device circuit board 100;

[0096] The first fixture 310 is provided with a first positioning groove 311 matching the shape of the cleaning device circuit board 100 and is used to place the inverted cleaning device circuit board 100 .

[0097] Based on the potting system of the cleaning device circuit board 100 involved in this embodiment, when dispensing glue on the cleaning device circuit board 100, firstly, the cleaning device circuit board 100 is inverted (i.e., the bottom surface A faces upward) and placed in the first positioning groove 311 of the first fixture 310 for positioning, and then the bottom surface A of the cleaning device circuit board 100 is dispensed with glue, and the glue adheres to the bottom surface A of the cleaning device circuit board 100 to automatically solidify after standing for a first preset curing time to form a glue layer, thereby sealing the electronic components and circuits on the bottom surface A of the cleaning device circuit board 100, and realizing the waterproof sealing of the bottom surface A of the cleaning device circuit board 100. The first preset curing time can be set or changed according to actual conditions, such as 3h, 4h or 5h, and there is no limitation on this.

[0098] Then, the cleaning equipment circuit board 100 is flipped over to be placed upright in the mold 200 from the opening of the mold 200, with the bottom surface A of the cleaning equipment facing the inner bottom surface A of the mold 200, and the top surface B of the cleaning equipment facing the opening of the mold 200. Among them, the flipping of the cleaning equipment circuit board 100 can be achieved by flipping through a flipping device, or it can be achieved by manual flipping, which is set according to the actual situation. The mold 200 involved is made according to the outer shape of the cleaning equipment circuit board 100 to adapt to the cleaning equipment circuit board 100, and the cleaning equipment circuit board 100 can be stably positioned when it is located in the mold 200. In the present application, the function of the mold 200 is to fix the cleaning equipment circuit board 100 and position the glue dispensing path during glue dispensing, and at the same time serve as a stable storage tool for the cleaning equipment circuit board 100 from glue dispensing to curing process, to avoid glue overflow, positioning deviation, glue sticking to other places, etc., thereby improving the glue dispensing quality. Among them, if Figure 5 As shown, the mold 200 can be a blister box, which is a bubble shell, formed into a plastic box shape by blistering a sheet. Exemplarily, the mold 200 can be made of transparent PET material, which has the characteristics of light weight, good sealing performance, and low cost. The mold 200 is transparent, which can facilitate observation of whether the glue generates bubbles and separation phenomena. The size and thickness of the blister box can be set according to actual conditions and are not limited here.

[0099] Then, glue is dispensed on the top surface B of the cleaning device circuit board 100 in the mold 200, and the glue is attached to the top surface B of the cleaning device circuit board 100 to automatically solidify to form a glue layer after standing for a second preset curing time, thereby sealing the electronic components and circuits on the top surface B of the cleaning device circuit board 100, and achieving waterproof sealing of the top surface B of the cleaning device circuit board 100. The second preset curing time can be set or changed according to actual conditions, such as 3h, 4h or 5h, and there is no limitation on this.

[0100] Furthermore, when the cleaning equipment circuit board 100 is placed in the mold 200 and glue is dispensed on the top surface B, the glue liquid dispensed on the top surface B of the cleaning equipment circuit board 100 can flow to the peripheral position of the cleaning equipment circuit board 100 by itself, and seamlessly connect with the glue layer on the bottom surface A of the cleaning equipment, thereby achieving a complete glue dispense seal of the bottom surface A, top surface B and circumferential side of the cleaning equipment, and can improve the waterproof sealing of the cleaning equipment circuit board 100.

[0101] Finally, the mold 200 is removed to obtain the cleaning device circuit board 100 with double-sided glue sealing for subsequent installation. The mold 200 can be removed by a manipulator or by manual operation, depending on the actual situation. It is easy to understand that the blister box used by the mold 200 is simple and convenient to operate when removed.

[0102] The potting system of the cleaning device circuit board 100 may include a glue dispenser to automatically dispense glue on the bottom surface A and the top surface B of the cleaning device circuit board 100, which can improve the efficiency and effect of glue dispensing compared to manual glue dispensing. The type of glue used is set according to actual conditions, and this embodiment does not limit this.

[0103] In this embodiment, the bottom surface A and the top surface B of the cleaning equipment circuit board 100 are sealed with glue respectively, so that the cleaning equipment circuit board 100 is coated with glue on both sides, and there is no need to use glue with relatively good fluidity. Therefore, the connector can adopt a low electrical connector accordingly, and there is no need to reserve glue holes on the cleaning equipment circuit board 100, thereby reducing the area occupied by the setting of electronic components, realizing the compact setting of electronic components on the cleaning equipment circuit board 100, reducing the area of ​​the cleaning equipment circuit board 100, and miniaturizing the cleaning equipment circuit board 100; and, a detachable and easy-to-detach mold 200 is used in the glue filling process, and the mold 200 can be removed accordingly when the filling is completed. The cleaning equipment circuit board 100 can be installed separately on the cleaning equipment without the mold installed in the prior art, thereby reducing the occupied space and weight, thereby meeting the requirements of high integration, small size and lightness of the cleaning equipment.

[0104] In some embodiments, reference Fig. 9 , the potting system of the cleaning device circuit board 100 also includes:

[0105] The second fixture 320 is provided with a second positioning groove 321 matching the shape of the mold 200 and used to accommodate the mold 200 .

[0106] In this embodiment, the second fixture 320 is used to position the cleaning device circuit board 100. After the mold 200 (with the cleaning device circuit board 100 inside) is placed in the second fixture 320 for positioning, the top surface B of the cleaning device circuit board 100 is then glued, which can improve the glue dispensing accuracy, ensure the glue dispensing curing effect, and thus improve the sealing. Optionally, multiple second positioning grooves 321 on the second fixture 320 can be provided, and multiple second positioning grooves 321 can be corresponding to multiple molds 200 for batch positioning and glue dispensing of the cleaning device circuit board 100.

[0107] In some embodiments, a pressing member 322 is further disposed on the second fixture 320 , and the pressing member 322 is used to press the mold 200 .

[0108] In this embodiment, the mold 200 is placed in the second positioning groove 321 and is positioned by pressing the pressing member 322. Under the pressing action of the pressing member 322, the mold 200 is firmly placed in the second positioning groove 321 of the second fixture 320, which can improve the positioning accuracy. Among them, the pressing member 322 is set corresponding to the second positioning groove 321. It can be that one second positioning groove 321 is correspondingly configured with one pressing member 322, or it can be that multiple second positioning grooves 321 are correspondingly configured with one pressing member 322, which is set according to actual conditions. Optionally, the pressing member 322 is rotatably connected to the second fixture 320. When it is necessary to position the mold 200 in the second positioning groove 321, the pressing member 322 is rotated to the notch of the second positioning groove 321, and the mold 200 is pressed by pressing the edge of the mold 200. Of course, this is only exemplary and not restrictive.

[0109] In some embodiments, reference Figure 2 , Figure 3 and Fig. 9 A mounting hole 101 is provided on the cleaning device circuit board 100 , and an inserting portion 322 a matching the mounting hole 101 is provided on the pressing member 322 . The inserting portion 322 a of the pressing member 322 can be correspondingly inserted into the mounting hole 101 .

[0110] In this embodiment, when the clamping member 322 clamps the mold 200, its insertion portion 322a is correspondingly inserted into the mounting hole 101 of the cleaning device circuit board 100. In this way, when dispensing glue, the glue will not flow into the mounting hole 101 of the cleaning device circuit board 100 and block it, thereby ensuring the dispensing effect. In addition, by the insertion and matching of the insertion portion 322a of the clamping member 322 with the mounting hole 101 of the cleaning device circuit board 100, the position of the cleaning device circuit board 100 can be limited to prevent it from being displaced, thereby further improving the positioning effect. Among them, the number and position of the insertion portion 322a on the clamping member 322 are set according to the mounting hole 101 on the cleaning device circuit board 100, and there is no restriction on this.

[0111] The embodiment of the present invention further provides a cleaning device circuit board 100, which is prepared by the potting method of the cleaning device circuit board 100 as described in the above embodiment.

[0112] The present invention also provides a cleaning device, which comprises:

[0113] The device body and the cleaning device circuit board 100 as described in the above embodiment, the cleaning device circuit board 100 is installed in the device body.

[0114] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A potting method for a cleaning equipment circuit board, characterized in that: include: Applying glue to the bottom surface of the cleaning device circuit board and leaving it to stand for a first preset curing time; Turning over the cleaning device circuit board, and placing the cleaning device circuit board in a mold that matches its shape; Placing the mold in a second fixture to position the cleaning device circuit board; Dispensing glue on the top surface of the cleaning device circuit board in the mold and leaving it to stand for a second preset curing time; removing the mold; The second fixture is provided with a second positioning groove, and the second positioning groove matches the shape of the mold; The step of placing the mold in the second fixture to position the cleaning device circuit board includes: placing the mold in the second positioning groove; Among them, the function of the mold is to fix the cleaning equipment circuit board and position the glue dispensing path during glue dispensing, and at the same time serve as a stable storage tool for the cleaning equipment circuit board during the glue dispensing to curing process to avoid glue overflow, positioning deviation, and glue sticking to other places.

2. The potting method for a cleaning equipment circuit board according to claim 1, characterized in that: Before performing the step of dispensing glue on the bottom surface of the cleaning device circuit board and standing for a first preset curing time, the method further includes: The cleaning device circuit board is placed in a first fixture to position the cleaning device circuit board.

3. The potting method for a cleaning equipment circuit board according to claim 1, characterized in that: The second fixture is provided with a pressing piece, and the pressing piece is used to press the mold; The step of placing the mold in a second fixture to position the cleaning device circuit board includes: The mold is pressed by the pressing member.

4. The potting method for a cleaning equipment circuit board according to claim 3, characterized in that: The cleaning device circuit board is provided with a mounting hole, and the pressing member is provided with an inserting portion adapted to the mounting hole; The step of pressing the mold by a pressing member comprises: The insertion part of the pressing member is correspondingly inserted into the installation hole of the cleaning equipment circuit board.

5. The potting method for a circuit board of a cleaning device according to any one of claims 1 to 4, characterized in that: The top surface of the cleaning device circuit board is provided with a plurality of electrical connectors, wherein a side surface of at least one of the electrical connectors is provided with a bayonet for engaging with a plug-in terminal; The glue dispensed on the bottom surface of the cleaning device circuit board is a semi-flowing glue with a viscosity of 700mPas to 1300mPas, and / or the glue dispensed on the top surface of the cleaning device circuit board is a semi-flowing glue with a viscosity of 700mPas to 1300mPas.

6. The potting method for a circuit board of a cleaning device according to any one of claims 1 to 4, characterized in that: The mold is a blister box; And / or, the mold is a transparent part; And / or, the wall thickness of the mold is 0.2 mm to 0.5 mm; And / or, the thickness of the glue dispensed on the bottom surface of the circuit board of the cleaning device is 1 mm to 2 mm; And / or, the thickness of the glue dispensed on the top surface of the cleaning equipment circuit board in the mold is 1 mm to 2 mm.

7. A potting system for a cleaning device circuit board, applied to the potting method for a cleaning device circuit board according to any one of claims 1 to 6, characterized in that: The potting system of the cleaning equipment circuit board includes: A mold for placing an upright cleaning device circuit board; A first fixture is provided with a first positioning groove adapted to the shape of the cleaning device circuit board and used for placing the inverted cleaning device circuit board; The second fixture is provided with a second positioning groove adapted to the shape of the mold and is used to accommodate the mold.

8. The potting system for cleaning equipment circuit boards according to claim 7, characterized in that: The second fixture is also provided with a pressing piece, and the pressing piece is used to press the mold.

9. The potting system for cleaning equipment circuit boards according to claim 8, characterized in that: The cleaning device circuit board is provided with a mounting hole, the pressing piece is provided with an inserting portion adapted to the mounting hole, and the inserting portion of the pressing piece can be correspondingly inserted into the mounting hole.

10. A circuit board of a cleaning device, characterized in that: The cleaning equipment circuit board is prepared by the potting method for a cleaning equipment circuit board according to any one of claims 1 to 6.

11. A cleaning device, characterized in that: include: An equipment body, and a cleaning equipment circuit board as claimed in claim 10, wherein the cleaning equipment circuit board is installed in the equipment body.

Images