A temperature and humidity integrated sensor based on a paper-folding structure and a method of using the same

Abstract

The application discloses a temperature and humidity integrated sensor based on a paper folding structure, which comprises a wireless transmission structure, a thermal driving beam structure, a paper folding beam structure and an interdigital capacitive humidity sensing structure. When the ambient temperature is higher than a plurality of set temperature points, the paper folding beam structure is bent to cause a plurality of contact electrodes to contact with contact electrodes, an LC resonant circuit is formed by the interdigital capacitive humidity sensing structure and the wireless transmission structure, the sequential contact of the contact electrodes and the contact electrodes causes the change of an induced capacitance, and the resonant frequency is greatly changed. When the ambient humidity changes, the dielectric constant of a film material in the interdigital capacitive humidity sensing structure changes to cause the slight change of the interdigital capacitance, so that the resonant frequency is slightly deviated near the temperature jump point. The temperature and humidity resonant frequency sensing information is collected in a passive and wireless mode through electromagnetic coupling, the simultaneous measurement of the temperature and humidity sensor is realized, and the scheme has the advantages of multi-parameter sensing, passive and wireless and simple structure.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more particularly to an integrated temperature and humidity sensor based on a paper-folding structure and its usage method. Background Technology

[0002] Integrated temperature and humidity sensors are closely related to people's daily lives and occupy an important position in many fields such as navigation, biomedicine, environmental monitoring, intelligent transportation, and smart agriculture. This is mainly due to the advantages of these sensors, such as multifunctional monitoring, low cost, and ease of on-chip integration. However, most current integrated temperature and humidity sensors adopt a stacked integration strategy and discrete output ports, and are difficult to integrate with microfabrication processes. This makes sensor integration more challenging and increases the difficulty of collecting sensing information. In addition, the impact of external wiring on the signal transmission of integrated sensors is also significant. With the continuous advancement of science and technology, people have put forward higher requirements for the information transmission methods and integration strategies of temperature and humidity sensors. Therefore, developing a passive wireless integrated temperature and humidity sensor with a simple integration method, single-port output, and high process compatibility is of great research significance. Summary of the Invention

[0003] In view of this, the purpose of this invention is to provide a wireless, passive, origami-based integrated temperature and humidity sensor and its usage method, to solve the problems of complex integration strategies, multi-port output, and poor process compatibility of current integrated temperature and humidity sensors. This invention integrates an origami-style beam structure with an interdigital capacitive humidity sensing structure. It relies on the bending of the origami-style beam structure under different temperature conditions, which causes a significant jump in the resonant frequency due to the change in capacitance between several contact electrodes and the contact electrode. It also relies on the change in interdigital capacitance under different humidity conditions, which causes a slight shift in the resonant frequency near the temperature jump point, to reflect temperature and humidity sensing information. This achieves passive, wireless, multi-parameter sensing information detection. This approach gives the origami-based integrated temperature and humidity sensor the characteristics of multi-parameter sensing, simple structure, passive wireless operation, single-port output, and high process compatibility.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows: a temperature and humidity integrated sensor based on an origami structure, comprising: a wireless transmission structure, a thermally driven beam structure, an origami-style beam structure, an interdigital capacitive humidity sensing structure, a third connecting line, and a substrate. The wireless transmission structure, the thermally driven beam structure, the origami-style beam structure, the interdigital capacitive humidity sensing structure, and the third connecting line are respectively placed on the substrate and form an LC resonant circuit.

[0005] The wireless transmission structure includes an inductor coil, a receiving coil, a first connecting line, and a second connecting line. The thermally driven beam structure includes a first thermally driven beam fixing point, a second thermally driven beam fixing point, a third thermally driven beam fixing point, and a fourth thermally driven beam fixing point; the structure also includes a first thermally driven beam, a second thermally driven beam, a third thermally driven beam, and a fourth thermally driven beam.

[0006] An integrated temperature and humidity sensor based on an origami structure, wherein the first fold node, second fold node, third fold node, fourth fold node, fifth fold node, sixth fold node, seventh fold node, eighth fold node, ninth fold node, tenth fold node, eleventh fold node, twelfth fold node, first contact electrode, second contact electrode, third contact electrode, and origami beam constitute an origami beam structure; wherein the first contact electrode, second contact electrode, and third contact electrode are located on the side of the origami beam.

[0007] An integrated temperature and humidity sensor based on an origami structure, the interdigitated capacitive humidity sensing structure comprising a first metal contact electrode, a second metal contact electrode, a third metal contact electrode; a first metal finger electrode, a second metal finger electrode, a third metal finger electrode; a graphene oxide film; a fourth metal finger electrode, a fifth metal finger electrode, a sixth metal finger electrode, a seventh metal finger electrode; and a metal electrode. The first metal contact electrode is connected to the first metal finger electrode, the second metal contact electrode is connected to the second metal finger electrode, and the third metal contact electrode is connected to the third metal finger electrode. The first, second, and third metal finger electrodes are placed parallel to the fourth, fifth, sixth, and seventh metal finger electrodes to form an interdigitated capacitor. The graphene oxide film is coated on the surface of the interdigitated capacitor. One end of the fourth, fifth, sixth, and seventh metal finger electrodes is connected to the side of the metal electrode.

[0008] An integrated temperature and humidity sensor based on an origami structure is disclosed. One end of an inductor coil is connected to one end of a fixing point of a first thermally driven beam via a first connecting line, and the other end of the inductor coil is connected to one end of a metal electrode via a second connecting line. The other end of the fixing point of the first thermally driven beam is connected to one end of the first thermally driven beam, and the fixing point of the second thermally driven beam is connected to one end of the second thermally driven beam. The other ends of the first and second thermally driven beams are simultaneously connected to one end of an origami-shaped beam. The other end of the origami-shaped beam is simultaneously connected to one end of a third and a fourth thermally driven beam. The other end of the third thermally driven beam is connected to one end of a fixing point of the third thermally driven beam, and the other end of the fourth thermally driven beam is connected to one end of a fixing point of the fourth thermally driven beam. The other end of the fixing point of the third thermally driven beam is connected to the other end of the metal electrode via a connecting line. Changes in ambient temperature cause the origami-like beam structure to bend, leading to sequential contact between several contact electrodes and the contact electrode. This sequential contact causes a change in the induced capacitance, resulting in a significant jump in the resonant frequency. Changes in ambient humidity alter the dielectric constant of the graphene oxide film, causing a subtle change in the interdigital capacitance, which in turn causes a slight shift in the resonant frequency near the temperature jump point. The change in resonant frequency is read out by the receiving coil via an inductor in a passive, wireless manner, enabling simultaneous measurement of temperature and humidity by the sensor.

[0009] Beneficial effects:

[0010] This invention relates to an integrated temperature and humidity sensor based on an origami structure, which has the following advantages: The integrated temperature and humidity sensor based on an origami structure integrates an origami-style beam structure with an interdigital capacitive humidity sensing structure. It relies on the bending of the origami beam structure under different temperature conditions, causing a jump in the sensing capacitance after several contact electrodes come into contact with the contact electrode, resulting in a significant jump in the resonant frequency. Furthermore, the change in interdigital capacitance under different humidity conditions causes a slight shift in the resonant frequency near the temperature jump point, reflecting temperature and humidity sensing information. This achieves passive wireless multi-parameter sensing information detection. This integrated temperature and humidity sensor based on an origami structure features multi-parameter sensing, wireless single-port output, and high process compatibility. The integration of the origami beam structure with the interdigital capacitive humidity sensing structure offers the advantage of structural simplicity. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of a temperature and humidity integrated sensor based on a paper-folding structure provided in this invention.

[0012] Figure 2 This is a top view of an integrated temperature and humidity sensor based on a paper-folding structure provided in this invention.

[0013] Figure 3This is a schematic diagram of the origami-style beam structure of an integrated temperature and humidity sensor based on origami structure provided in this invention.

[0014] In the diagram: Inductor coil (1a), Receiving coil (1b), First connecting line (c1), Second connecting line (c2); First heat-driven beam fixing point (2a), Second heat-driven beam fixing point (2b), Third heat-driven beam fixing point (2c), Fourth heat-driven beam fixing point (2d); First heat-driven beam (3a), Second heat-driven beam (3b), Third heat-driven beam (3c), Fourth heat-driven beam (3d); First folding node (41), Second folding node (42), Third folding node (43), Fourth folding node (44), Fifth folding node (45), Sixth folding node (46), Seventh folding node (47), Eighth folding node (48), Ninth folding node (49), Tenth folding node (50), Eleventh folding node (51), Tenth The origami beam structure is composed of a two-fold node (52), a first contact electrode (5a), a second contact electrode (5b), a third contact electrode (5c), and an origami beam (6); wherein the first contact electrode (5a), the second contact electrode (5b), the third contact electrode (5c); the first metal contact electrode (7a), the second metal contact electrode (7b), the third metal contact electrode (7c); the first metal finger electrode (8a), the second metal finger electrode (8b), the third metal finger electrode (8c); a graphene oxide film (9); the fourth metal finger electrode (10a), the fifth metal finger electrode (10b), the sixth metal finger electrode (10c), the seventh metal finger electrode (10d), a metal electrode (10e); a third connecting line (11); and a substrate (12). Detailed Implementation

[0015] To better understand the purpose, structure, and function of this invention, the following detailed description of an integrated temperature and humidity sensor based on a paper-folding structure is provided in conjunction with the accompanying drawings.

[0016] Example: See Figures 1-3 An integrated temperature and humidity sensor based on an origami structure is disclosed. The integrated temperature and humidity sensor based on an origami structure includes: a wireless transmission structure, a thermally driven beam structure, an origami beam structure, an interdigital capacitive humidity sensing structure, a third connecting line 11, and a substrate 12. The wireless transmission structure, the thermally driven beam structure, the origami beam structure, the interdigital capacitive humidity sensing structure, and the third connecting line 11 are respectively placed on the substrate and form an LC resonant circuit.

[0017] The wireless transmission structure includes an inductor coil 1a, a receiving coil 1b, a first connecting line c1, and a second connecting line c2.

[0018] The heat-driven beam structure includes a first heat-driven beam fixing point 2a, a second heat-driven beam fixing point 2b, a third heat-driven beam fixing point 2c, a fourth heat-driven beam fixing point 2d; a first heat-driven beam 3a, a second heat-driven beam 3b, a third heat-driven beam 3c, and a fourth heat-driven beam 3d.

[0019] One end of the inductor coil 1a is connected to one end of the first heat-driven beam fixing point 2a via the first connecting line c1. The other end of the inductor coil 1a is connected to one end of the metal electrode 10e via the second connecting line c2. The other end of the first heat-driven beam fixing point 2a is connected to one end of the first heat-driven beam 3a. The second heat-driven beam fixing point 2b is connected to one end of the second heat-driven beam 3b. The other ends of the first heat-driven beam 3a and the second heat-driven beam 3b are simultaneously connected to one end of the origami beam 6. The other end of the origami beam 6 is simultaneously connected to one end of the third heat-driven beam 3c and the fourth heat-driven beam 3d. The other end of the third heat-driven beam 3c is connected to one end of the third heat-driven beam fixing point 2c. The other end of the fourth heat-driven beam 3d is connected to one end of the fourth heat-driven beam fixing point 2d. The other end of the third heat-driven beam fixing point 2c is connected to the other end of the metal electrode 10e via the connecting line 11.

[0020] The first fold node 41, the second fold node 42, the third fold node 43, the fourth fold node 44, the fifth fold node 45, the sixth fold node 46, the seventh fold node 47, the eighth fold node 48, the ninth fold node 49, the tenth fold node 50, the eleventh fold node 51, the twelfth fold node 52, the first contact electrode 5a, the second contact electrode 5b, the third contact electrode 5c, and the origami beam 6 together form an origami beam structure; one end of the first contact electrode 5a, the second contact electrode 5b, and the third contact electrode 5c is connected to the side of the origami beam 6 respectively; the first fold node 41, the second fold node 42, the third fold node 43, the fourth fold node 44, the fifth fold node 45, the sixth fold node 46, the seventh fold node 47, the eighth fold node 48, the ninth fold node 49, the tenth fold node 50, the eleventh fold node 51, and the twelfth fold node 52 are located on the origami beam 6 respectively.

[0021] The described interdigitated capacitive humidity sensing structure includes a first metal contact electrode 7a, a second metal contact electrode 7b, a third metal contact electrode 7c; a first metal finger electrode 8a, a second metal finger electrode 8b, a third metal finger electrode 8c; a graphene oxide film 9; a fourth metal finger electrode 10a, a fifth metal finger electrode 10b, a sixth metal finger electrode 10c, a seventh metal finger electrode 10d, and a metal electrode 10e. The first metal contact electrode 7a is connected to the first metal finger electrode 8a, the second metal contact electrode 7b is connected to the second metal finger electrode 8b, and the third metal finger electrode 7c... The three-metal contact electrode 7c is connected to the third metal finger electrode 8c; the first metal finger electrode 8a, the second metal finger electrode 8b, the third metal finger electrode 8c and the fourth metal finger electrode 10a, the fifth metal finger electrode 10b, the sixth metal finger electrode 10c and the seventh metal finger electrode 10d are placed in parallel to form an interdigital capacitor; a graphene oxide film 9 is coated on the surface of the interdigital capacitor; one end of the fourth metal finger electrode 10a, the fifth metal finger electrode 10b, the sixth metal finger electrode 10c and the seventh metal finger electrode 10d are respectively connected to the side of the metal electrode 10e.

[0022] Example 2: A method for using an integrated temperature and humidity sensor based on a paper-folding structure. As the ambient temperature changes, the paper-folding beam structure 6 bends, causing several contact electrodes to sequentially contact each other. This sequential contact causes a change in the induced capacitance, leading to a significant jump in the resonant frequency. As the ambient humidity changes, the dielectric constant of the graphene oxide film 9 changes, causing a slight change in the interdigital capacitance, resulting in a slight shift in the resonant frequency near the temperature jump point. The change in the resonant frequency is read out by the receiving coil 1b via the inductor coil 1a in a passive, wireless manner, enabling simultaneous measurement of temperature and humidity by the sensor.

[0023] In summary, this integrated temperature and humidity sensor differs from other temperature and humidity sensors in the following ways: 1. It adopts a paper-folding beam structure to achieve digital output of temperature detection; 2. It adopts an interdigital capacitive humidity sensing structure to achieve analog output of humidity detection; 3. It reflects temperature information through a large jump in resonant frequency, and combines this with a slight shift in resonant frequency near the temperature jump point to reflect humidity sensing information, achieving simultaneous detection of temperature and humidity information; 4. It is compatible with microfabrication technology.

[0024] The criteria for distinguishing whether something belongs to this structure are as follows:

[0025] (a) Temperature sensing is achieved using a paper-folding beam structure;

[0026] (b) Humidity sensing is achieved using an interdigitated capacitor structure;

[0027] (c) A paper-folding beam structure is used to connect the contact electrode in sequence to reconstruct the interdigital capacitive humidity sensing structure to achieve temperature and humidity sensing.

[0028] (d) Achieve single-port output of multiple sensor parameters through LC passive wireless method.

[0029] A structure that meets the above four conditions should be considered as an integrated temperature and humidity sensor based on origami structure.

[0030] Any aspects of this invention not described in detail are well-known to those skilled in the art.

[0031] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A temperature and humidity integrated sensor based on a paper-folding structure, characterized in that, The temperature and humidity integrated sensor based on origami structure includes: a wireless transmission structure, a thermally driven beam structure, an origami beam structure, an interdigital capacitive humidity sensing structure, a third connecting line (11), and a substrate (12). The wireless transmission structure, the thermally driven beam structure, the origami beam structure, the interdigital capacitive humidity sensing structure, and the third connecting line (11) are respectively placed on the substrate and form an LC resonant circuit. The first fold node (41), the second fold node (42), the third fold node (43), the fourth fold node (44), the fifth fold node (45), the sixth fold node (46), the seventh fold node (47), the eighth fold node (48), the ninth fold node (49), the tenth fold node (50), the eleventh fold node (51), the twelfth fold node (52), the first contact electrode (5a), the second contact electrode (5b), the third contact electrode (5c), and the origami beam (6) together form an origami beam structure; The interdigitated capacitive humidity sensing structure includes a first metal contact electrode (7a), a second metal contact electrode (7b), a third metal contact electrode (7c); a first metal finger electrode (8a), a second metal finger electrode (8b), a third metal finger electrode (8c); a graphene oxide film (9); a fourth metal finger electrode (10a), a fifth metal finger electrode (10b), a sixth metal finger electrode (10c), a seventh metal finger electrode (10d), and a metal electrode (10e).

2. The temperature and humidity integrated sensor based on origami structure according to claim 1, characterized in that, The wireless transmission structure includes an inductor coil (1a), a receiving coil (1b), a first connecting line (c1), and a second connecting line (c2). The heat-driven beam structure includes a first heat-driven beam fixing point (2a), a second heat-driven beam fixing point (2b), a third heat-driven beam fixing point (2c), and a fourth heat-driven beam fixing point (2d); a first heat-driven beam (3a), a second heat-driven beam (3b), a third heat-driven beam (3c), and a fourth heat-driven beam (3d); One end of the inductor coil (1a) is connected to one end of the first thermal drive beam fixing point (2a) via the first connecting line (c1), and the other end of the inductor coil (1a) is connected to one end of the metal electrode (10e) via the second connecting line (c2). The other end of the first thermal drive beam fixing point (2a) is connected to one end of the first thermal drive beam (3a), and the second thermal drive beam fixing point (2b) is connected to one end of the second thermal drive beam (3b). The other end of the first thermal drive beam (3a) is connected to the other end of the second thermal drive beam (3b). One end is connected to one end of the origami beam (6), and the other end of the origami beam (6) is connected to one end of the third heat-driven beam (3c) and the fourth heat-driven beam (3d). The other end of the third heat-driven beam (3c) is connected to one end of the fixing point (2c) of the third heat-driven beam, and the other end of the fourth heat-driven beam (3d) is connected to one end of the fixing point (2d) of the fourth heat-driven beam. The other end of the fixing point (2c) of the third heat-driven beam is connected to the other end of the metal electrode (10e) through the connecting line (11).

3. The temperature and humidity integrated sensor based on origami structure according to claim 1, characterized in that, One end of the first contact electrode (5a), the second contact electrode (5b), and the third contact electrode (5c) are respectively connected to the side of the origami beam (6); the first folding node (41), the second folding node (42), the third folding node (43), the fourth folding node (44), the fifth folding node (45), the sixth folding node (46), the seventh folding node (47), the eighth folding node (48), the ninth folding node (49), the tenth folding node (50), the eleventh folding node (51), and the twelfth folding node (52) are respectively located on the origami beam (6).

4. The temperature and humidity integrated sensor based on origami structure according to claim 1, characterized in that, The first metal contact electrode (7a) is connected to the first metal finger electrode (8a), the second metal contact electrode (7b) is connected to the second metal finger electrode (8b), and the third metal contact electrode (7c) is connected to the third metal finger electrode (8c). The first metal finger electrode (8a), the second metal finger electrode (8b), the third metal finger electrode (8c), the fourth metal finger electrode (10a), the fifth metal finger electrode (10b), the sixth metal finger electrode (10c), and the seventh metal finger electrode (10d) are placed in parallel to form an interdigital capacitor. A graphene oxide film (9) is coated on the surface of the interdigital capacitor. One end of the fourth metal finger electrode (10a), the fifth metal finger electrode (10b), the sixth metal finger electrode (10c), and the seventh metal finger electrode (10d) is connected to the side of the metal electrode (10e).

5. A method for using an integrated temperature and humidity sensor based on a paper-folding structure, characterized in that, Using the sensor described in any one of claims 1-4, the change in ambient temperature causes the origami beam structure to bend, resulting in sequential contact between several contact electrodes. The sequential contact between several contact electrodes and the contact electrode causes a change in the sensing capacitance, which in turn leads to a significant jump in the resonant frequency. As the ambient humidity changes, the dielectric constant of the graphene oxide film (9) changes, which in turn causes a slight change in the interdigital capacitance, resulting in a slight shift in the resonant frequency near the temperature jump point. The change in the resonant frequency is read out by the receiving coil (1b) in a passive wireless manner through the inductor coil (1a), thus realizing the simultaneous measurement of temperature and humidity by the sensor.

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