A silicon wafer rapid turnover device

Abstract

The application discloses a kind of silicon wafer quick turnover device, including main line and auxiliary line of parallel arrangement, the side of main line is provided with feeding mechanism, the rear end of feeding mechanism is provided with taking and placing mechanism, the front end of feeding mechanism is provided with buffer mechanism, the front end of buffer mechanism is provided with feeding mechanism, the side of auxiliary line is provided with first silicon wafer rack, main line and auxiliary line all include rotating mechanism and turnover mechanism, taking and placing mechanism, rotating mechanism and turnover mechanism are sequentially arranged from right to left;The application is provided with turnover mechanism, the silicon wafer on third conveying line can be turned over in sequence by turnover mechanism, in the process of silicon wafer turnover, the silicon wafer is adsorbed by vacuum chuck, avoid the edge of silicon wafer and turnover plate contact to cause the breakage of silicon wafer, ensure the processing quality of silicon wafer, to improve the efficiency of silicon wafer turnover conveying while, improve the security of silicon wafer in the process of turnover.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer conveying equipment technology, and more specifically to a silicon wafer rapid flipping device. Background Technology

[0002] With the development of technology and the increasing awareness of environmental protection, the use of solar panels for power generation has become widespread. Silicon wafers are an important component of solar panels. In the production of solar panels, the silicon wafers first need to be cut, and then both sides of the wafers need to be processed. At this point, the silicon wafers that have been processed on one side need to be flipped over for further processing. In existing technology, silicon wafers are usually cut vertically to obtain two vertically placed silicon wafers. Before flipping the silicon wafers, the vertically placed silicon wafers need to be rotated to a horizontal position and placed on a conveyor line to facilitate subsequent flipping.

[0003] Current silicon wafer flipping methods involve manually rotating and flipping each wafer one by one using a suction nozzle. This process is time-consuming, labor-intensive, and carries the risk of breakage, resulting in low flipping efficiency and high production costs. Given these drawbacks, it is necessary to design a rapid silicon wafer flipping device. Summary of the Invention

[0004] The purpose of this invention is to provide a silicon wafer rapid flipping device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a silicon wafer rapid flipping device, comprising a main line and an auxiliary line arranged side by side, a feeding mechanism on one side of the main line, a picking and placing mechanism at the rear end of the feeding mechanism, a buffer mechanism at the front end of the feeding mechanism, a loading mechanism at the front end of the buffer mechanism, and a first silicon wafer placement rack on one side of the auxiliary line. Both the main line and the auxiliary line include a rotation mechanism and a flipping mechanism, and the picking and placing mechanism, the rotation mechanism, and the flipping mechanism are arranged sequentially from right to left.

[0006] Preferably, both the feeding mechanism and the loading mechanism include two first conveyor lines arranged side by side. Each first conveyor line includes a support frame, on which a first pallet is mounted. Driven wheel mounting seats are mounted at both ends of the first pallet, and driven wheels are mounted on both sides of each driven wheel mounting seat. A mounting plate is fixedly connected to the bottom of the first pallet, and a tensioning wheel is movably mounted on the mounting plate. A drive shaft is rotatably mounted on the mounting plate via a bearing. A drive wheel is mounted at one end of the drive shaft, and a first driven pulley is mounted at the other end of the drive shaft. The first driven pulley is connected to the first drive pulley via a first drive belt. The first drive pulley is mounted on the output shaft of the first motor. A conveyor belt is wound around the driven wheel, the tensioning wheel, and the drive wheel, and a plurality of first through holes are opened on the conveyor belt.

[0007] Preferably, the buffer mechanism includes a lifting component and a conveying component mounted on the lifting component. Several conveying components are provided, arranged side by side in a vertical arrangement. The lifting component includes a first Z-axis linear module, which is mounted on a first vertical plate. A first lifting plate is mounted on the slider of the first Z-axis module, and first sliders are mounted on both ends of the first lifting plate. The first sliders are slidably mounted on a first slide rail.

[0008] Preferably, the conveying assembly includes a second pallet, one side of which is mounted on a first lifting plate. Two active roller mounting seats are mounted on one end of the second pallet, and an active roller is movably mounted between the two active roller mounting seats. Two driven roller mounting seats are mounted on the other end of the second pallet, and two driven rollers are movably mounted between the two driven roller mounting seats. A tension roller is provided between the two driven rollers and is movably mounted on a driven roller mounting seat. A conveyor belt is wound around the tension roller, driven roller, and active roller. A second through hole is provided on the conveyor belt. A transmission gear is mounted on the shaft of the active roller and meshes with the active gear. The active gear is mounted on the output shaft of a second motor.

[0009] Preferably, the material handling mechanism includes a plurality of first vacuum suction cups, which are mounted on a suction cup mounting frame. The suction cup mounting frame is fixedly connected to the front side of the second lifting plate via a connecting plate. A pad is mounted on one end of the rear side of the second lifting plate, and a second slider is mounted on the pad. The second slider is slidably disposed on a second slide rail. The other end of the rear side of the second lifting plate is mounted on a slider of a second Z-axis linear module. The second Z-axis linear module is mounted on a second vertical plate. The second vertical plate is mounted on the front side of the first moving plate. Two third sliders are spaced apart on the rear side of the first moving plate. The third sliders are slidably disposed on a third slide rail. The third slide rail is mounted on a support plate. First bearing seats are mounted on both ends of the support plate. Synchronous pulley shafts are mounted on both first bearing seats. Synchronous pulleys are mounted on both synchronous pulley shafts. Synchronous belts are wound around the two synchronous pulleys. Synchronous belt clamps are mounted on the synchronous belts. The synchronous belt clamps are fixedly connected to the first moving plate. One of the synchronous pulley shafts is fixedly connected to the output shaft of a third motor. The third motor is mounted on a second motor mounting base.

[0010] Preferably, the rotating mechanism includes a second conveyor line, a lifting and rotating assembly, and a correcting assembly. There are two lifting and rotating assemblies, which are located below the second conveyor line. A correcting assembly is located between the two lifting and rotating assemblies, and there are two correcting assemblies located on both sides of the second conveyor line.

[0011] Preferably, the lifting and rotating assembly includes a third lifting plate, a fourth motor mounted on the rear side of the third lifting plate, a second driving pulley mounted on the output end of the fourth motor, the second driving pulley being connected to a second driven pulley via a second transmission belt, the second driven pulley being mounted on a rotating shaft, both ends of the rotating shaft being mounted on second bearing seats, the second bearing seats being mounted on the third lifting plate, the top of the rotating shaft being fixedly connected to a suction cup support rod, a second vacuum suction cup being mounted on the top of the suction cup support rod, a nut seat being mounted on the front side of the third lifting plate, a lead screw nut being mounted on the nut seat, the lead screw nut being fitted onto the lead screw, a third driven pulley being mounted on the bottom of the lead screw, the third driven pulley being connected to a third driving pulley via a third transmission belt, and the third driving pulley being mounted on the output shaft of a fifth motor.

[0012] Preferably, the correction assembly includes two sets of rollers, which are installed at both ends of the roller support plate. Each roller set includes a plurality of rollers spaced apart along the roller support plate. The roller support plate is mounted on a support seat via a connecting frame, and the support seat is mounted on the slide of the slide cylinder.

[0013] Preferably, the flipping mechanism includes a displacement component, a third conveyor line, and a flipping component. The third conveyor line is mounted on the displacement component, and a flipping component is provided at one end of the third conveyor line. A material handling component and a second silicon wafer placement rack are mounted on one side of the third conveyor line. The displacement component includes a second movable plate. A fourth slider is mounted at both ends of the bottom of the second movable plate. The fourth slider is slidably mounted on a fourth slide rail. The fourth slide rail is mounted at both ends of the base plate. The bottom of the second movable plate is mounted on the slide table of the X-axis linear module. The X-axis linear module is mounted in the middle of the base plate.

[0014] Preferably, the flipping assembly includes a flipping plate, one end of which is fixed to the middle of a rotating shaft. Both ends of the rotating shaft are mounted on a third bearing seat. A fourth driven pulley is mounted on one end of the rotating shaft. The fourth driven pulley is connected to a fourth driving pulley via a fourth transmission belt. The fourth driving pulley is fixedly connected to the output shaft of a seventh motor. The seventh motor is mounted on a second moving plate via a third motor mounting seat. A hollow groove is provided at the other end of the flipping plate. Suction cup mounting plates are installed on both sides of the hollow groove. Several vacuum suction cups are installed on the suction cup mounting plates.

[0015] Compared with the prior art, the silicon wafer rapid flipping device of the present invention has the following beneficial effects:

[0016] 1. The present invention is provided with a flipping mechanism, which can flip the silicon wafers on the third conveyor line sequentially. During the flipping process, the silicon wafers are adsorbed by a vacuum suction cup to avoid the edges of the silicon wafers from contacting the flipping plate and causing damage to the silicon wafers, thus ensuring the processing quality of the silicon wafers. This improves the efficiency of silicon wafer flipping and conveying while also improving the safety of the silicon wafers during the flipping process.

[0017] 2. This invention is equipped with a main line and an auxiliary line. The main line and the auxiliary line operate independently and do not interfere with each other. When the main line needs to be stopped for maintenance, the silicon wafers on the feeding mechanism are adsorbed and transported to the auxiliary line through the material handling mechanism. The silicon wafers can be transported and flipped through the auxiliary line. Similarly, when the auxiliary line needs to be stopped for maintenance, the main line can be used to transport and flip the silicon wafers, ensuring uninterrupted operation of the device.

[0018] 3. The present invention is provided with a first conveyor line, a second conveyor line and a third conveyor line. By opening a number of first through holes on the conveyor belt, a vacuum pump is used to evacuate the negative pressure chamber of the first pallet, thereby vacuum adsorbing the silicon wafers on the conveyor belt through the air holes and through holes. This prevents the silicon wafers from being damaged by friction between the silicon wafers and the conveyor belt and by the vibration of the silicon wafers during the transportation of silicon wafers, thereby reducing scratches on the silicon wafers and reducing fragmentation.

[0019] 4. The present invention is equipped with a correction component. The slide cylinder drives the support base to move, and the connecting frame, roller support plate and roller also move. The roller pushes the silicon wafer to guide the silicon wafer to adjust the angle of the silicon wafer and prevent the silicon wafer from shifting position.

[0020] 5. The present invention is equipped with a buffer mechanism, which can realize the buffering of silicon wafers, effectively avoid the congestion of silicon wafers on the conveyor line, ensure the continuous and reliable operation of the conveyor line, and improve the processing efficiency of silicon wafers.

[0021] 6. The present invention is provided with a rotating mechanism, which uses a second vacuum suction cup to adsorb the silicon wafer, and then uses a fourth motor to drive the suction cup support rod and the second vacuum suction cup to drive the silicon wafer to rotate, thereby realizing the rotation of the silicon wafer. At the same time, the rotating mechanism is set below the second conveyor belt to ensure that the silicon wafer or the conveyor belt is not affected when the silicon wafer is not rotated. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the first conveyor line structure in this invention;

[0025] Figure 3 This is a schematic diagram of the cache mechanism structure in this invention;

[0026] Figure 4 This is a schematic diagram of the material handling mechanism in this invention;

[0027] Figure 5This is a schematic diagram of the rotating mechanism structure in this invention;

[0028] Figure 6 This is a schematic diagram of the flipping mechanism in this invention.

[0029] In the attached image:

[0030] 1. Main line; 2. Auxiliary line; 3. Feeding mechanism; 31. First conveyor line; 3101. Support frame; 3102. First pallet; 3103. Driven wheel mounting seat; 3104. Driven wheel; 3105. Mounting plate; 3106. Tensioner wheel; 3107. Drive shaft; 3108. Drive wheel; 3109. First driven pulley; 3110. First transmission belt; 3111. First drive pulley; 3112. First motor; 3113. First motor mounting seat; 3114. Conveyor belt; 3115. First through hole; 4. Buffer mechanism; 41. Lifting assembly; 4101. First Z-axis linear module; 4102. First vertical plate; 4103. First lifting plate; 4104. First slider; 4105. First slide rail; 42. Conveying assembly; 4201. Second pallet; 4202. Driven roller mounting base; 4203. Driven roller; 4204. Driven roller mounting base; 4205. Driven roller; 4206. Conveyor belt; 4207. Second through hole; 4208. Transmission gear; 4209. Driven gear; 4210. Second motor; 4211. Motor mounting plate; 5. Feeding mechanism; 6. Picking and unloading mechanism; 601. First vacuum suction cup; 602. Suction cup mounting bracket; 603. Connecting plate; 604. Second lifting plate; 605. Pad; 606. Second slider; 607. Second slide rail; 608. Second vertical plate; 609. Second Z-axis linear module; 610. First moving plate; 611. Third slider; 612. Third slide rail; 613. Support plate; 614. First bearing housing; 615. Synchronous pulley shaft; 616. Synchronous pulley; 617. Synchronous belt; 618. Third motor; 619. Second motor mounting base; 620. Bracket; 7. Rotating mechanism; 71. Second conveyor line; 72. Lifting and rotating assembly; 7201. Third lifting plate; 7202. Fourth motor; 7203. Second driving pulley; 7204. Second transmission belt; 7205. Second driven pulley; 7206. Rotating shaft; 7207. Second bearing housing; 7208. Second vacuum suction cup; 7209. Nut seat; 7210. Lead screw nut; 7211. Lead screw; 7212. Lead screw seat; 7213. Third driven pulley; 7214. Third transmission belt; 7215. Three driving pulleys; 7216, Fifth motor; 7217, Third vertical plate; 73, Correction assembly; 7301, Roller support plate; 7302, Roller; 7303, Connecting frame; 7304, Support seat; 7305, Slide cylinder; 8, Tilting mechanism; 81, Displacement assembly; 8101, Second moving plate; 8102, Fourth slider; 8103, Fourth slide rail; 8104, Base plate; 8105, X-axis linear module; 82, Third conveyor line; 83, Tilting assembly; 8301, Tilting plate; 8302, Rotating shaft; 8303, Third bearing seat; 8304, Fourth driven pulley; 8305, Fourth transmission belt; 8306, Fourth driving pulley; 8307, Seventh motor; 8308, Third motor mounting seat;8309. Suction cup mounting plate; 84. Material handling assembly; 85. Second silicon wafer placement rack; 8501. Placement stage; 8502. Limiting baffle; 8503. Storage box; 8504. Handle; 9. First silicon wafer placement rack. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Please see Figure 1-6 As shown, the present invention provides a technical solution: a silicon wafer rapid flipping device, comprising a main line 1 and an auxiliary line 2 arranged side by side. A feeding mechanism 3 is provided on one side of the main line 1, a pick-and-place mechanism 6 is provided at the rear end of the feeding mechanism 3, a buffer mechanism 4 is provided at the front end of the feeding mechanism 3, and a loading mechanism 5 is provided at the front end of the buffer mechanism 4. A first silicon wafer placement rack 9 is provided on one side of the auxiliary line 2. Both the main line 1 and the auxiliary line 2 include a rotating mechanism 7 and a flipping mechanism 8, which are arranged sequentially from right to left. When the main line 1 and the auxiliary line 2 are under maintenance, the silicon wafers on the feeding mechanism 3 can be removed by the pick-and-place mechanism 6 and placed on the first silicon wafer placement rack 9.

[0033] In this embodiment, both the feeding mechanism 3 and the loading mechanism 5 include two first conveyor lines 31 arranged side by side. Each first conveyor line 31 includes a support frame 3101, on which a first pallet 3102 is mounted. Driven wheel mounting seats 3103 are mounted at both ends of the first pallet 3102, and driven wheels 3104 are mounted on both sides of each driven wheel mounting seat 3103. A mounting plate 3105 is fixedly connected to the bottom of the first pallet 3102, and a tensioning wheel 3106 is movably mounted on the mounting plate 3105. A drive shaft 3107 is rotatably mounted on the mounting plate 3105 via bearings. A drive wheel 3108 is mounted on one end of the drive shaft 3107, and a first driven pulley 3109 is mounted on the other end of the drive shaft 3107. The first driven pulley 3109 is connected to the first drive pulley 3111 via a first drive belt 3110. The first drive pulley 3111 is mounted on the output shaft of the first motor 3112. The first motor 3112 is fixed to the bottom of the mounting plate 3105 via a first motor mounting base 3113.

[0034] In this embodiment, a conveyor belt 3114 is wound around the driven wheel 3104, tension wheel 3106, and driving wheel 3108. The conveyor belt 3114 has several first through holes 3115. Both ends of the first support plate 3102 have several elongated air holes along the direction of movement of the conveyor belt 3114. The first support plate 3102 has a negative pressure chamber inside. The first support plate 3102 has an air extraction hole on its side wall. The first support plate 3102 has a cavity inside. The air extraction hole communicates with the air hole through the cavity. The air extraction hole is connected to a vacuum pump through an air pipe.

[0035] The buffer mechanism 4 in this embodiment includes a lifting assembly 41 and a conveying assembly 42 mounted on the lifting assembly 41. Several conveying assemblies 42 are provided, and the several conveying assemblies 42 are arranged side by side in a vertical position. The lifting assembly 41 includes a first Z-axis linear module 4101, which is mounted on a first vertical plate 4102. A first lifting plate 4103 is mounted on the slider of the first Z-axis linear module 4101. First sliders 4104 are mounted on both ends of the first lifting plate 4103. The first sliders 4104 are slidably mounted on a first slide rail 4105, which is mounted on the first vertical plate 4102.

[0036] The conveying assembly 42 in this embodiment includes a second pallet 4201. One side of the second pallet 4201 is mounted on the first lifting plate 4103. Two active roller mounting seats 4202 are mounted on one end of the second pallet 4201, and an active roller 4203 is movably mounted between the two active roller mounting seats 4202. Two driven roller mounting seats 4204 are mounted on the other end of the second pallet 4201, and two driven rollers 4205 are movably mounted between the two driven roller mounting seats 4204. A tension roller is disposed between the two driven rollers 4205. Mounted on the driven roller mounting base 4204, a conveyor belt 4206 is wound around the tension roller, driven roller 4205 and driving roller 4203. The conveyor belt 4206 has a second through hole 4207. The middle part of the second support plate 4201 has several elongated air holes along the moving direction of the conveyor belt 4206. The interior of the second support plate 4201 is provided with a negative pressure chamber. The side wall of the second support plate 4201 is provided with an air extraction hole. The interior of the second support plate 4201 is provided with a cavity. The air extraction hole is connected to the air hole through the cavity. The air extraction hole is connected to a vacuum pump through an air pipe.

[0037] In this embodiment, a transmission gear 4208 is mounted on the shaft of the drive roller 4203. The transmission gear 4208 meshes with the drive gear 4209. The drive gear 4209 is mounted on the output shaft of the second motor 4210. The second motor 4210 is mounted on the motor mounting plate 4211. The motor mounting plate 4211 is mounted on the drive roller mounting base 4202.

[0038] The material handling mechanism 6 in this embodiment includes a plurality of first vacuum suction cups 601, which are mounted on a suction cup mounting bracket 602. Each of the first vacuum suction cups 601 is connected to a vacuum pump via an air pipe. The suction cup mounting bracket 602 is fixedly connected to the front side of a second lifting plate 604 via a connecting plate 603. A pad 605 is mounted on one end of the rear side of the second lifting plate 604, and a second slider 606 is mounted on the pad 605. The second slider 606 is slidably disposed on a second slide rail 607, which is mounted on a second vertical plate 608. The other end of the rear side of the second lifting plate 604 is mounted on a slider of a second Z-axis linear module 609, which is mounted on the second vertical plate 608. The second vertical plate 608 is mounted on the front side of a first moving plate 610. Two third sliders 611 are installed at intervals on the rear side of a movable plate 610. The third sliders 611 are slidably mounted on a third slide rail 612. The third slide rail 612 is mounted on a support plate 613. Both ends of the support plate 613 are equipped with first bearing seats 614. Synchronous pulley shafts 615 are mounted on both first bearing seats 614. Synchronous pulleys 616 are mounted on both synchronous pulley shafts 615. Synchronous belts 617 are wound around the two synchronous pulleys 616. Synchronous belt clamps are mounted on the synchronous belts 617. The synchronous belt clamps are fixedly connected to the first movable plate 610. One of the synchronous pulley shafts 615 is fixedly connected to the output shaft of a third motor 618. The third motor 618 is mounted on a second motor mounting seat 619. The second motor mounting seat 619 is mounted on the support plate 613. The support plate 613 is mounted on a bracket 620.

[0039] The rotating mechanism 7 in this embodiment includes a second conveyor line 71, a lifting and rotating assembly 72, and a straightening assembly 73. Two lifting and rotating assemblies 72 are provided, positioned below the second conveyor line 71. Two straightening assemblies 73 are positioned between the two lifting and rotating assemblies 72, located on both sides of the second conveyor line 71. The second conveyor line 71 has the same structure as the first conveyor line 31. The lifting and rotating assembly 72 includes a third lifting plate 7201. A fourth motor 7202 is mounted on the rear side of the third lifting plate 7201. A second driving pulley 7203 is mounted on the output end of the fourth motor 7202. The second driving pulley 7203 is connected to a second driven pulley 7205 via a second transmission belt 7204. The second driven pulley 7205 is mounted on a rotating shaft 7206. Both ends of the rotating shaft 7206 are mounted on second bearing seats 7207. The support 7207 is mounted on the third lifting plate 7201. The top of the rotating shaft 7206 is fixedly connected to the suction cup support rod. A second vacuum suction cup 7208 is mounted on the top of the suction cup support rod. A through hole is provided on the support plate of the second conveyor line 71 for the second vacuum suction cup 7208 to pass through. The second vacuum suction cup 7208 is connected to the vacuum pump through an air pipe. A nut seat 7209 is mounted on the front side of the third lifting plate 7201, and a lead screw nut 72 is mounted on the nut seat 7209. 10. The lead screw nut 7210 is fitted onto the lead screw 7211. Both ends of the lead screw 7211 are movably mounted on the lead screw seat 7212. The bottom of the lead screw 7211 is equipped with a third driven pulley 7213. The third driven pulley 7213 is connected to the third driving pulley 7215 through the third transmission belt 7214. The third driving pulley 7215 is mounted on the output shaft of the fifth motor 7216. The fifth motor 7216 is mounted on the front side of the third vertical plate 7217.

[0040] The correction component 73 in this embodiment includes two sets of rollers. The two sets of rollers are installed at both ends of the roller support plate 7301. The roller set includes a plurality of rollers 7302 spaced apart along the roller support plate 7301. The roller support plate 7301 is mounted on the support seat 7304 through the connecting frame 7303. The support seat 7304 is mounted on the slide of the slide cylinder 7305.

[0041] The flipping mechanism 8 in this embodiment includes a displacement component 81, a third conveyor line 82, and a flipping component 83. The third conveyor line 82 is mounted on the displacement component 81, and the flipping component 83 is located at one end of the third conveyor line 82. A pick-and-place component 84 and a second silicon wafer placement rack 85 are mounted on one side of the third conveyor line 82. The pick-and-place component 84 has the same structure as the pick-and-place mechanism 6. The displacement component 81 includes a second moving plate 8101. A fourth slider 8102 is mounted at both ends of the bottom of the second moving plate 8101. The fourth slider 8102 is slidably mounted on a fourth slide rail 8103, which is mounted at both ends of a base plate 8104. The bottom of the second moving plate 8101 is mounted on a slide table of an X-axis linear module 8105, which is mounted in the middle of the base plate 8104. When the silicon wafer does not need to be flipped, it can be removed from the third conveyor line 82 and placed on the second silicon wafer placement rack 85 by the pick-and-place component 84.

[0042] The flipping assembly 83 in this embodiment includes a flipping plate 8301. One end of the flipping plate 8301 is fixed to the middle of the rotating shaft 8302. Both ends of the rotating shaft 8302 are mounted on the third bearing seat 8303. A fourth driven pulley 8304 is mounted on one end of the rotating shaft 8302. The fourth driven pulley 8304 is connected to the fourth driving pulley 8306 via a fourth transmission belt 8305. The fourth driving pulley 8306 is fixedly connected to the output shaft of the seventh motor 8307. The seventh motor 8307 is mounted on the second moving plate 8101 via a third motor mounting seat 8308. A hollow groove is opened at the other end of the flipping plate 8301. Suction cup mounting plates 8309 are mounted on both sides of the hollow groove. Several vacuum suction cups are mounted on the suction cup mounting plates 8309. The vacuum suction cups are connected to a vacuum pump via air pipes.

[0043] In this embodiment, the second silicon wafer placement rack 85 has the same structure as the first silicon wafer placement rack 9. The second silicon wafer placement rack 85 includes a placement platform 8501. Both ends of the placement platform 8501 are equipped with limit baffles 8502. The limit baffles 8502 have a U-shaped cross-section. A storage box 8503 with an open top is placed on the placement platform 8201. Handles 8504 are installed on both sides of the storage box 8503.

[0044] The working principle of this invention: Silicon wafers are conveyed to the buffer mechanism 4 via the loading mechanism 5. When the silicon wafers are being conveyed normally, they are conveyed to the feeding mechanism 3 via the buffer mechanism 4. When the silicon wafers become congested and need to be buffered, the first Z-axis linear module 4101 operates, driving the first lifting plate 4103 to move. Several conveying components 42 also move accordingly, aligning the height of the conveyor belt 4206 on the bottom conveying component 42 with the loading mechanism 5. At this time, the silicon wafers from the loading mechanism 5 can be conveyed to the conveyor belt 4206 of the bottom conveying component 42. After the bottom conveying component 42 is full of silicon wafers, the first Z-axis linear module 4101 operates, driving several conveying components 42 to move downwards, aligning the height of the conveyor belt 4206 on another conveying component 42 with the loading mechanism 5. When the silicon wafers are aligned with the loading mechanism 5, they can be transported to the conveyor belt 4206 of another conveyor assembly 42. Repeating this process fills several conveyor assemblies 42 with silicon wafers. Then, the first Z-axis linear module 4101 moves the first lifting plate 4103, causing several conveyor assemblies 42 to move as well, aligning the height of the conveyor belt 4206 on the conveyor assembly 42 with the conveyor belt 3114 of the first conveyor line 31. The second motor 4210 drives the drive gear 4209 to rotate, and the transmission gear 4208 and drive roller 4203 also rotate, thereby moving the conveyor belt 4206. The conveyor belt 4206 transports the silicon wafers to the conveyor belt 3114. The first motor 3112 then drives... The first driving pulley 3111 rotates, driving the first driven pulley 3109 to rotate via the first transmission belt 3110. The transmission shaft 3107 and the driving pulley 3108 also rotate, causing the conveyor belt 3114 to move. The conveyor belt 3114 transports the silicon wafer a certain distance and then stops. The second Z-axis linear module 609 operates, causing the second lifting plate 604 to move downward. The connecting plate 603, the suction cup mounting bracket 602, and the first vacuum suction cup 601 also move downward, bringing the first vacuum suction cup 601 into contact with the silicon wafer. The vacuum pump operates, drawing air out of the first vacuum suction cup 601 through the air pipe, allowing the first vacuum suction cup 601 to adsorb the silicon wafer. The second Z-axis linear module 609 operates, causing the first vacuum suction cup 601 and the silicon wafer to move upward. Upon reset, the third motor 618 operates, driving the synchronous pulley shaft 615 and synchronous pulley 616 to rotate. Synchronous pulley 616 drives the synchronous belt 617 to move, which in turn drives the first moving plate 610 and the second vertical plate 608 to move. The second lifting plate 604, connecting plate 603, suction cup mounting bracket 602, and first vacuum suction cup 601 also move accordingly, causing the first vacuum suction cup 601 and the silicon wafer to move above the second conveyor line 71. The second conveyor line 71 then transports the silicon wafer. When the silicon wafer reaches above the lifting and rotating assembly 72, the fifth motor 7216 operates, driving the third driving pulley 7215 to rotate. This, in turn, drives the third driven pulley 7213 to rotate via the third transmission belt 7214. The lead screw 7211 also rotates accordingly.The lead screw 7211 drives the lead screw nut 7210 to move, and the nut seat 7209, the third lifting plate 7201, and the second vacuum chuck 7208 also move accordingly, so that the second vacuum chuck 7208 contacts the silicon wafer and lifts it up. At the same time, the vacuum pump works, and the air inside the second vacuum chuck 7208 is evacuated through the air pipe, so that the second vacuum chuck 7208 can adsorb the silicon wafer. The fourth motor 7202 works, driving the second driving pulley 7203 to rotate, which drives the second driven pulley 7205 to rotate through the second transmission belt 7204. The rotating shaft 7206, the chuck support rod, and the second vacuum chuck 7208 also rotate accordingly, thereby driving the silicon wafer to rotate 90°. After the silicon wafer has rotated, the slide cylinder 7305 works, driving the support base 7304 to move, and the connecting frame 7303, the roller support plate 7301, and the roller 7302 also move accordingly. The roller 7302 pushes the silicon wafer to adjust the angle of the silicon wafer to ensure that its placement angle is correct. The X-axis linear module 8105 moves the second moving plate 8101, facilitating subsequent wafer flipping. The third conveyor line 82, flipping assembly 83, and loading / unloading assembly 84 also move accordingly, aligning one end of the third conveyor line 82 with one end of the second conveyor line 71. The second conveyor line 71 transports the wafer to the third conveyor line 82, which then transports it to the flipping plate 8301. A vacuum pump operates, removing air from the vacuum suction cups via an air pipe, allowing the suction cups to adsorb the wafers. This suction prevents the wafer edges from contacting the flipping plate 8301, thus avoiding damage and ensuring wafer processing quality. The seventh motor 8307 drives the fourth drive pulley 8306, which in turn drives the fourth driven pulley 8304 via the fourth transmission belt 8305. The rotating shaft 8302 also rotates, causing the flipping plate 8301 to flip 180°, achieving wafer flipping.

[0045] The present invention is provided with a main line 1 and an auxiliary line 2. The main line 1 and the auxiliary line 2 operate independently without interfering with each other. When the main line 1 needs to be stopped for maintenance, the silicon wafers on the feeding mechanism 3 are adsorbed and transported to the auxiliary line 2 through the material handling mechanism 6. The silicon wafers can be transported and flipped through the auxiliary line 2. Similarly, when the auxiliary line 2 needs to be stopped for maintenance, the main line 1 can be used to transport and flip the silicon wafers, ensuring uninterrupted operation of the device.

[0046] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer rapid flipping device, characterized in that: The system includes a main line (1) and an auxiliary line (2) arranged side by side. A feeding mechanism (3) is provided on one side of the main line (1). A picking and placing mechanism (6) is provided at the rear end of the feeding mechanism (3). A buffer mechanism (4) is provided at the front end of the feeding mechanism (3). A loading mechanism (5) is provided at the front end of the buffer mechanism (4). A first silicon wafer placement rack (9) is provided on one side of the auxiliary line (2). Both the main line (1) and the auxiliary line (2) include a rotating mechanism (7) and a flipping mechanism (8). The picking and placing mechanism (6), the rotating mechanism (7), and the flipping mechanism (8) are arranged sequentially from right to left. The rotating mechanism (7) includes a second conveyor line (71), a lifting and rotating assembly (72), and a straightening assembly (73). There are two lifting and rotating assemblies (72). The lifting and rotating assembly (72) is located below the second conveyor line (71). A straightening assembly (73) is provided between the two lifting and rotating assemblies (72). There are two straightening assemblies (73), located on both sides of the second conveyor line (71). Each lifting and rotating assembly (72) includes a third lifting plate (7201). A fourth motor (7202) is installed on the rear side of the third lifting plate (7201). A second driving pulley (7203) is installed on the output end of the fourth motor (7202). The second driving pulley (7203) is connected to a second driven pulley (7205) via a second transmission belt (7204). The second driven pulley (7205) is mounted on a rotating shaft (7206). Both ends of the rotating shaft (7206) are mounted on the second bearing seat (7207), which is mounted on the third lifting plate (7201). The top of the rotating shaft (7206) is fixedly connected to the suction cup support rod. The top of the suction cup support rod is equipped with a second vacuum suction cup (7208). A nut seat (7209) is mounted on the front side of the third lifting plate (7201). A screw nut (7210) is mounted on the nut seat (7209), which is fitted onto the screw (7211). A third driven pulley (7213) is mounted on the bottom of the screw (7211). The third driven pulley (7213) is connected to the third driving pulley (7215) via a third transmission belt (7214). (7215) is installed on the output shaft of the fifth motor (7216). The correction component (73) includes two sets of rollers. The two sets of rollers are installed at both ends of the roller support plate (7301). The roller set includes a plurality of rollers (7302) spaced apart along the roller support plate (7301). The roller support plate (7301) is mounted on the support base (7304) through the connecting frame (7303). The support base (7304) is mounted on the slide of the slide cylinder (7305). The flipping mechanism (8) includes a displacement component (81), a third conveyor line (82), and a flipping component (83). The third conveyor line (82) is installed on the displacement component (81). The flipping component (83) is provided at one end of the third conveyor line (82).A material handling assembly (84) and a second silicon wafer placement rack (85) are installed on one side of the third conveyor line (82). The displacement assembly (81) includes a second moving plate (8101). A fourth slider (8102) is installed at both ends of the bottom of the second moving plate (8101). The fourth slider (8102) is slidably disposed on a fourth slide rail (8103). The fourth slide rail (8103) is installed at both ends of the base plate (8104). The bottom of the second moving plate (8101) is installed on the slide table of the X-axis linear module (8105). The X-axis linear module (8105) is installed in the middle of the base plate (8104). The flipping assembly (83) includes a flipping plate (8301). One end of the flipping plate (8301) is fixed to the rotating shaft ( In the middle of 8302, both ends of the rotating shaft (8302) are mounted on the third bearing seat (8303). A fourth driven pulley (8304) is mounted on one end of the rotating shaft (8302). The fourth driven pulley (8304) is connected to the fourth driving pulley (8306) via a fourth transmission belt (8305). The fourth driving pulley (8306) is fixedly connected to the output shaft of the seventh motor (8307). The seventh motor (8307) is mounted on the second moving plate (8101) via a third motor mounting seat (8308). A hollow groove is provided at the other end of the rotating plate (8301). Suction cup mounting plates (8309) are mounted on both sides of the hollow groove, and several vacuum suction cups are mounted on the suction cup mounting plates (8309).

2. The silicon wafer rapid flipping device according to claim 1, characterized in that: Both the feeding mechanism (3) and the loading mechanism (5) include two first conveyor lines (31) arranged side by side. Each first conveyor line (31) includes a support frame (3101), on which a first pallet (3102) is mounted. Driven wheel mounting seats (3103) are mounted at both ends of the first pallet (3102), and driven wheels (3104) are mounted on both sides of the driven wheel mounting seats (3103). A mounting plate (3105) is fixedly connected to the bottom of the first pallet (3102), and a tensioning wheel (3106) is movably mounted on the mounting plate (3105). The mounting plate (3105) rotates via a bearing. A drive shaft (3107) is mounted on the drive shaft (3107). A drive pulley (3108) is mounted on one end of the drive shaft (3107), and a first driven pulley (3109) is mounted on the other end of the drive shaft (3107). The first driven pulley (3109) is connected to the first drive pulley (3111) via a first drive belt (3110). The first drive pulley (3111) is mounted on the output shaft of the first motor (3112). A conveyor belt (314) is wound around the driven pulley (3104), the tension pulley (3106), and the drive pulley (3108). Several first through holes (3115) are opened on the conveyor belt (314).

3. The silicon wafer rapid flipping device according to claim 1, characterized in that: The buffer mechanism (4) includes a lifting assembly (41) and a conveying assembly (42) installed on the lifting assembly (41). Several conveying assemblies (42) are provided, and the several conveying assemblies (42) are arranged side by side in a vertical position. The lifting assembly (41) includes a first Z-axis linear module (4101). The first Z-axis linear module (4101) is installed on a first vertical plate (4102). A first lifting plate (4103) is installed on the slider of the first Z-axis linear module (4101). A first slider (4104) is installed at both ends of the first lifting plate (4103). The first slider (4104) is slidably arranged on a first slide rail (4105). The first slide rail (4105) is installed on the first vertical plate (4102).

4. The silicon wafer rapid flipping device according to claim 3, characterized in that: The conveying assembly (42) includes a second pallet (4201). One side of the second pallet (4201) is mounted on a first lifting plate (4103). Two drive roller mounting seats (4202) are mounted on one end of the second pallet (4201), and a drive roller (4203) is movably mounted between the two drive roller mounting seats (4202). Two driven roller mounting seats (4204) are mounted on the other end of the second pallet (4201), and two driven rollers (4205) are movably mounted between the two driven roller mounting seats (4204). A tensioning roller is provided between the driven rollers (4205). The tensioning roller is movably mounted on the driven roller mounting base (4204). A conveyor belt (4206) is wound around the tensioning roller, the driven roller (4205), and the driving roller (4203). A second through hole (4207) is provided on the conveyor belt (4206). A transmission gear (4208) is mounted on the shaft of the driving roller (4203). The transmission gear (4208) meshes with the driving gear (4209). The driving gear (4209) is mounted on the output shaft of the second motor (4210).

5. The silicon wafer rapid flipping device according to claim 1, characterized in that: The material handling mechanism (6) includes several first vacuum suction cups (601), which are mounted on a suction cup mounting bracket (602). The suction cup mounting bracket (602) is fixedly connected to the front side of the second lifting plate (604) via a connecting plate (603). A pad (605) is mounted on one end of the rear side of the second lifting plate (604), and a second slider (606) is mounted on the pad (605). The second slider (606) is slidably disposed on the second slide rail (607). The other end of the rear side of the second lifting plate (604) is mounted on the slider of the second Z-axis linear module (609). The second Z-axis linear module (609) is mounted on the second vertical plate (608), which is mounted on the front side of the first moving plate (610). Two third sliders (611) are installed at intervals on the rear side of the 0). The third sliders (611) are slidably set on the third slide rail (612). The third slide rail (612) is installed on the support plate (613). The two ends of the support plate (613) are each equipped with a first bearing seat (614). The two first bearing seats (614) are each equipped with a synchronous pulley shaft (615). The two synchronous pulley shafts (615) are each equipped with a synchronous pulley (616). The two synchronous pulleys (616) are wound with a synchronous belt (617). The synchronous belt (617) is equipped with a synchronous belt clamp. The synchronous belt clamp is fixedly connected to the first moving plate (610). One of the synchronous pulley shafts (615) is fixedly connected to the output shaft of the third motor (618). The third motor (618) is installed on the second motor mounting base (619).

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