Imitation ceramic structure and preparation method thereof, electronic equipment housing

Abstract

In order to overcome the problem that the existing imitation ceramic glass back cover cannot achieve a real imitation ceramic effect, the present invention provides an imitation ceramic structure, including a transparent substrate, an imitation ceramic film layer and an ink layer, wherein the imitation ceramic film layer is located between the transparent substrate and the ink layer, and the imitation ceramic film layer is composed of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer, wherein the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer and the second low refractive index material layer are stacked in sequence. At the same time, the present invention also discloses a preparation method of the above-mentioned imitation ceramic structure and an electronic device housing including the above-mentioned imitation ceramic structure. The imitation ceramic structure provided by the present invention is observed at different observation angles under different angles of incident light, and the observed color difference is small, there is no visual color change effect, and it can better simulate the real texture of the ceramic structure.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic equipment casings, and in particular relates to an imitation ceramic structure and a preparation method thereof, and an electronic equipment casing. Background Art

[0002] The shell of electronic products, such as the back cover of mobile phones, is commonly made of glass, ceramics, and plastic sheets. The production cost of ceramic back covers is higher than that of glass back covers. Ceramics are generally used in high-end flagship models. One of the reasons for the high-end positioning is the appearance of ceramics, which is as smooth as jade, has a glossy texture, and a strong sense of color. Glass back covers are generally only used in mid-to-high-end models because their texture is slightly worse than that of ceramic back covers.

[0003] At present, there is a type of technology that forms a ceramic-like effect by using a coating process or a film + coating process on the glass back cover. However, whether it is a pure coating process or a film + coating process, the effect is mainly colorful, gradient, or single color, and often shows no texture. On the one hand, the reflectivity of the ceramic-like glass back cover obtained by the existing process to light is still different from that of the ceramic back cover; on the other hand, the ceramic-like glass back cover obtained by the existing process may be able to achieve the ceramic-like effect when viewed straight on, but once the observation angle or the incident light angle changes, it will be found that the glass back cover obtained by this process will have a large change in color, while the color of the real ceramic back cover is relatively uniform when observed from all angles, and there is no such color change. The main reasons are: conventional coating processes will have a certain degree of color change in vision (the color will have a certain visual effect change at different observation angles). At the same time, some ceramic-like glass back covers are also provided with a UV texture layer to achieve the front ceramic-like effect, but the UV texture layer also has the problem of changing color as the observation angle changes. Therefore, the existing ceramic-like glass back cover does not achieve a real ceramic-like effect. Summary of the invention

[0004] In view of the problem that the existing imitation ceramic glass back cover cannot achieve a true imitation ceramic effect, the present invention provides an imitation ceramic structure and a preparation method thereof, and an electronic equipment housing.

[0005] The technical solution adopted by the present invention to solve the above technical problems is as follows:

[0006] In one aspect, the present invention provides a simulated ceramic structure, comprising a transparent substrate, a simulated ceramic film layer and an ink layer, wherein the simulated ceramic film layer is located between the transparent substrate and the ink layer, and the simulated ceramic film layer is composed of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer, wherein the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer and the second low refractive index material layer are stacked in sequence;

[0007] The refractive index of the first high refractive index material layer and the second high refractive index material layer is greater than 2.3, and the refractive index of the first low refractive index material layer and the second low refractive index material layer is less than 1.6.

[0008] Optionally, the reflectivity of the imitation ceramic structure is 25%-30%.

[0009] Optionally, the first high refractive index material layer is in contact with the transparent substrate.

[0010] Optionally, the first low refractive index material layer and the second low refractive index material layer are each independently selected from one or more of SiO2 and MgF2.

[0011] Optionally, the first low refractive index material layer and the second low refractive index material layer are selected from SiO2.

[0012] Optionally, the first high refractive index material layer and the second high refractive index material layer are each independently selected from one or more of Nb2O5, Ti3O5 and TiO2.

[0013] Optionally, the first high refractive index material layer and the second high refractive index material layer are selected from Nb2O5.

[0014] Optionally, the thickness of the first high refractive index material layer is 53.8~105.8nm, the thickness of the second high refractive index material layer is 1~16nm, the thickness of the first low refractive index material layer is 32.4~86.4nm, and the thickness of the second low refractive index material layer is 44.6~90.6nm.

[0015] Optionally, the transparent substrate is glass.

[0016] Optionally, the imitation ceramic structure further includes an anti-drop layer, wherein the anti-drop layer is located between the transparent substrate and the imitation ceramic film layer, and the anti-drop layer is an organic silicone material.

[0017] Optionally, the organosiloxane material is obtained by polymerization of small molecule siloxanes, and the small molecule siloxanes include one or more of dialkoxysilanes with organic groups, trialkoxysilanes with organic groups, and tetraalkoxysilanes, and the organic groups are selected from hydrocarbon groups, phenyl groups, epoxy groups, amino groups, isocyanate groups, ester groups, and combinations thereof.

[0018] Optionally, the thickness of the anti-fall layer is 100~2000nm.

[0019] In another aspect, the present invention provides a method for preparing the above-mentioned imitation ceramic structure, comprising the following steps:

[0020] Providing a transparent precursor including a transparent substrate;

[0021] The transparent precursor is sequentially subjected to coating operations of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer to form a ceramic-like film layer on the surface of the transparent precursor;

[0022] Ink is applied on the surface of the formed imitation ceramic film layer to obtain an imitation ceramic structure.

[0023] Optionally, the surface of the transparent substrate is covered with an organic siloxane material to form an anti-drop layer to obtain a transparent precursor; and the imitation ceramic film layer is formed on the surface of the anti-drop layer.

[0024] Optionally, before forming the anti-drop layer, the transparent substrate is subjected to a surface cleaning treatment.

[0025] Optionally, a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer are sequentially deposited on the transparent precursor by vacuum coating.

[0026] In yet another aspect, the present invention provides an electronic device housing, comprising the above-mentioned imitation ceramic structure.

[0027] According to the imitation ceramic structure provided by the present invention, the inventors have found through a large number of experiments that by using a specific number and order of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer between the transparent substrate and the ink layer to form an imitation ceramic film layer, it is possible to achieve an imitation ceramic effect on the surface of the transparent substrate, which can replace ceramics to a certain extent, and the material and processing costs of conventional transparent substrates are low, which can effectively reduce production costs; in particular, compared with other existing imitation ceramic structures, the obtained imitation ceramic structure has a surface reflectivity similar to that of existing real ceramic structures, and the imitation ceramic structure has no problem of angular color change. When observed at different observation angles under conditions of incident light at different angles, the observed color difference of the imitation ceramic structure is small, and there is no visual color change effect, so it can better simulate the real texture of the ceramic structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the imitation ceramic structure provided by the present invention.

[0029] The reference numerals in the drawings of the specification are as follows:

[0030] 1. Transparent substrate; 2. Anti-drop layer; 3. Imitation ceramic film layer; 31. First high refractive index material layer; 32. First low refractive index material layer; 33. Second high refractive index material layer; 34. Second low refractive index material layer; 4. Ink layer. DETAILED DESCRIPTION

[0031] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0032] See also Figure 1 As shown, an embodiment of the present invention provides a simulated ceramic structure, comprising a transparent substrate 1, a simulated ceramic film layer 3 and an ink layer 4, wherein the simulated ceramic film layer 3 is located between the transparent substrate 1 and the ink layer 4, and the simulated ceramic film layer 3 is composed of a first high refractive index material layer 31, a first low refractive index material layer 32, a second high refractive index material layer 33 and a second low refractive index material layer 34, wherein the first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33 and the second low refractive index material layer 34 are stacked in sequence;

[0033] The refractive index of the first high refractive index material layer 31 and the second high refractive index material layer 33 is greater than 2.3, and the refractive index of the first low refractive index material layer 32 and the second low refractive index material layer 34 is less than 1.6.

[0034] The inventors have found through a large number of experiments that by using a specific number and order of a first high refractive index material layer 31, a first low refractive index material layer 32, a second high refractive index material layer 33 and a second low refractive index material layer 34 between the transparent substrate 1 and the ink layer 4 to form an imitation ceramic film layer 3, it is possible to achieve an imitation ceramic effect on the surface of the transparent substrate 1, which can replace ceramics to a certain extent, and the material and processing costs of the conventional transparent substrate 1 are low, which can effectively reduce the production cost; in particular, compared with other existing imitation ceramic structures, the obtained imitation ceramic structure has a surface reflectivity similar to that of the existing real ceramic structure, and the imitation ceramic structure has no problem of angular color change. When observed at different observation angles under conditions of incident light at different angles, the color difference of the observed imitation ceramic structure is small, and there is no visual color change effect, so it can better simulate the real texture of the ceramic structure.

[0035] It should be noted that the terms "first high refractive index material layer 31", "second high refractive index material layer 33", "first low refractive index material layer 32" and "second low refractive index material layer 34" are relative concepts, indicating that the refractive index of the "first high refractive index material layer 31" and the "second high refractive index material layer 33" is higher than that of the "first low refractive index material layer 32" and the "second low refractive index material layer 34".

[0036] By stacking the high refractive index material layer and the low refractive index material layer, the reflection of light can be regulated, and the surface gloss of the imitation ceramic structure can be affected together with the transparent substrate 1 and the ink layer 4; it should be noted that the stacking number and order of different high refractive index material layers and low refractive index material layers will have a greater impact on its gloss and reflectivity in different directions. In the present invention, the imitation ceramic structure has the characteristic of small color difference under different angles of incident light and observation conditions, which is directly related to the number and stacking order of the high refractive index material layer and the low refractive index material layer. Any change in the stacking number and order will lead to a change in its presentation effect, and thus the real ceramic texture to be achieved by the present invention cannot be obtained.

[0037] In some embodiments, the reflectivity of the simulated ceramic structure is 25%-30%.

[0038] By controlling the surface reflectivity of the imitation ceramic structure to be between 25% and 30%, the gloss of ceramics can be better simulated to meet the requirements of imitation ceramics. Specifically, the refractive index of the first high refractive index material layer 31, the second high refractive index material layer 33, the first low refractive index material layer 32 and the second low refractive index material layer 34 can be selected and the film thickness can be controlled to adjust the reflectivity of the imitation ceramic film layer 3.

[0039] In different embodiments, the first high refractive index material layer 31 is in contact with the transparent substrate, that is, the first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33 and the second low refractive index material layer 34 are stacked in sequence in a direction away from the transparent substrate 1. Alternatively, the second low refractive index material layer 34 is in contact with the transparent substrate, and the first high refractive index material layer 31, the first low refractive index material layer 32, the second high refractive index material layer 33 and the second low refractive index material layer 34 are stacked in sequence in a direction away from the ink layer 4.

[0040] Compared with the method of "the second low refractive index material layer 34 is in contact with the transparent substrate", the first high refractive index material layer 31 is in contact with the transparent substrate, which is beneficial to improve the bonding force between the film layers to improve the wear resistance of the imitation ceramic structure.

[0041] In some embodiments, the first low refractive index material layer 32 and the second low refractive index material layer 34 are each independently selected from one or more of SiO 2 and MgF 2 .

[0042] In a preferred embodiment, the first low refractive index material layer 32 and the second low refractive index material layer 34 are selected from SiO2.

[0043] In some embodiments, the first high refractive index material layer 31 and the second high refractive index material layer 33 are each independently selected from one or more of Nb2O5, Ti3O5 and TiO2.

[0044] In a preferred embodiment, the first high refractive index material layer 31 and the second high refractive index material layer 33 are selected from Nb2O5.

[0045] In some embodiments, the thickness of the first high refractive index material layer is 53.8~105.8nm, the thickness of the second high refractive index material layer is 1~16nm, the thickness of the first low refractive index material layer is 32.4~86.4nm, and the thickness of the second low refractive index material layer is 44.6~90.6nm.

[0046] The thicknesses of the first high refractive index material layer 31, the second high refractive index material layer 33, the first low refractive index material layer 32 and the second low refractive index material layer 34 have a great influence on the anti-ceramic effect of the anti-ceramic structure. When the thicknesses of the first high refractive index material layer 31, the second high refractive index material layer 33, the first low refractive index material layer 32 and the second low refractive index material layer 34 are within the above range, it is beneficial to ensure the consistency of the surface reflectivity of the imitation ceramic structure with the real ceramic effect, and avoid display differences caused by too low or too high thickness.

[0047] In some embodiments, the transparent substrate 1 may be a single layer of transparent material or a plurality of layers of transparent materials stacked together.

[0048] The shape of the imitation ceramic structure is mainly determined by the structure of the transparent substrate 1. The shape of the transparent substrate 1 can be adjusted according to different application fields. For example, the shape of the transparent substrate 1 can be plate-like, three-dimensional or irregular, and its size can be selected according to actual conditions. For example, when the imitation ceramic structure is the back panel of a mobile phone, its area and thickness can be adjusted according to the specific shape of the mobile phone.

[0049] In some embodiments, the transparent substrate 1 is one or more of a transparent plastic material and glass.

[0050] In a preferred embodiment, the transparent substrate 1 is glass.

[0051] Compared with transparent plastic materials, glass is used as the transparent substrate 1, which has the characteristics of high hardness, high transparency and low haze, and can better reflect the touch texture and glaze texture similar to ceramics.

[0052] However, there are also certain shortcomings in using glass as the transparent substrate 1. The main reason is that the current glass has insufficient impact resistance due to its material limitations. In particular, when depositing the imitation ceramic film layer 3, the imitation ceramic film layer 3 itself has a large internal stress, which leads to a large surface stress in the glass. Under external impact conditions, it is more likely to cause cracks inside the glass to expand, and then cause the glass to shatter. To solve the above problem, in some embodiments, the imitation ceramic structure also includes an anti-drop layer 2, which is located between the transparent substrate 1 and the imitation ceramic film layer 3, and the anti-drop layer 2 is an organic silicone material.

[0053] Organic silicone material has good deformation adaptability. By using organic silicone material as the anti-drop layer 2 between the glass and the imitation ceramic film layer 3, the micro cracks on the glass can be filled, thereby achieving a reinforcement effect on the glass and improving the impact resistance of the glass itself. At the same time, the anti-drop layer 2 can better buffer the stress generated by the imitation ceramic film layer 3, solve the problem of stress mismatch between the imitation ceramic layer and the glass, and effectively improve the strength and impact resistance of the imitation ceramic structure.

[0054] In some embodiments, the organosiloxane material is obtained by polymerization of small molecule siloxanes, and the small molecule siloxanes include one or more of dialkoxysilanes with organic groups, trialkoxysilanes with organic groups, and tetraalkoxysilanes, and the organic groups are selected from hydrocarbon groups, phenyl groups, epoxy groups, amino groups, isocyanate groups, ester groups, and combinations thereof.

[0055] The anti-fall layer can be obtained by evaporating organic siloxane as a target material on the transparent substrate 1, or by directly coating the small molecule siloxane on the transparent substrate 1 and then polymerizing and curing it.

[0056] In some embodiments, the thickness of the anti-fall layer 2 is 100~2000nm.

[0057] When the thickness of the anti-fall layer 2 is within the above range, on the one hand, it can play a better buffering role and improve the impact resistance of the imitation-ceramic structure; on the other hand, it can also avoid affecting the optical display effect of the imitation-ceramic structure due to excessive thickness.

[0058] In some embodiments, the ink layer 4 may be an ink layer of different colors. For example, the ink layer 4 may be red, yellow, blue, green, black, or a mixture of the above colors.

[0059] In a preferred embodiment, the ink layer 4 is black.

[0060] In some embodiments, the simulated ceramic structure may further include other functional layers that do not affect its simulated ceramic effect, such as a hardening layer, an anti-fingerprint layer, etc.

[0061] Another embodiment of the present invention provides a method for preparing the above-mentioned imitation ceramic structure, comprising the following steps:

[0062] Providing a transparent precursor including a transparent substrate 1;

[0063] The transparent precursor is sequentially coated with a first high refractive index material layer 31, a first low refractive index material layer 32, a second high refractive index material layer 33 and a second low refractive index material layer 34 to form a ceramic-like film layer 3 on the surface of the transparent precursor;

[0064] Ink is applied on the surface of the formed imitation ceramic film layer 3 to obtain an imitation ceramic structure.

[0065] In some embodiments, the surface of the transparent substrate 1 is covered with an organic siloxane material to form an anti-fall layer 2 to obtain a transparent precursor; and the imitation ceramic film layer 3 is formed on the surface of the anti-fall layer 2.

[0066] In some embodiments, before forming the anti-drop layer 2, the transparent substrate 1 is subjected to a surface cleaning treatment.

[0067] The surface cleaning operation of the transparent substrate 1 includes one or more of deionized water cleaning, surfactant cleaning and ultrasonic cleaning.

[0068] The surface cleaning treatment is helpful to remove dust and other impurities on the surface of the transparent substrate 1, so as to avoid the influence of the surface impurities of the transparent substrate 1 on the bonding effect and optical performance of the imitation ceramic film layer 3.

[0069] In some embodiments, a first high refractive index material layer 31 , a first low refractive index material layer 32 , a second high refractive index material layer 33 and a second low refractive index material layer 34 are sequentially deposited on the transparent precursor by vacuum coating.

[0070] The first high refractive index material layer 31 , the first low refractive index material layer 32 , the second high refractive index material layer 33 and the second low refractive index material layer 34 may be prepared by physical vapor deposition, evaporation coating or magnetron sputtering.

[0071] Specifically, depending on the selected material, the corresponding target material can be bombarded by an ion source to form a sputtering source, and deposition is performed in a vacuum or inert gas environment. When necessary, an auxiliary gas source such as oxygen or nitrogen can be added. For example, when the first low refractive index material layer 32 and the second low refractive index material layer 34 are selected from SiO2, silicon can be used as a target material, and oxygen is introduced as an auxiliary gas to form a SiO2 layer; when the first high refractive index material layer 31 and the second high refractive index material layer 33 are selected from Nb2O5, metal niobium can be used as a target material, and oxygen is introduced as an auxiliary gas to form a Nb2O5 layer.

[0072] In some embodiments, the ink layer 4 can be prepared by spraying, curtain coating, roller coating or screen printing.

[0073] Another embodiment of the present invention provides an electronic device housing, comprising the above-mentioned imitation ceramic structure.

[0074] In some embodiments, the electronic device housing is a mobile phone, a tablet computer, a watch, and other wearable electronic devices or household appliances.

[0075] The present invention is further described below by way of examples.

[0076] Example 1

[0077] This embodiment is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes the following steps:

[0078] 1) Cleaning:

[0079] Place the glass substrate in a nine-tank ultrasonic cleaner for 1 hour to remove dust and dirt residue on the surface.

[0080] 2) Anti-drop coating:

[0081] a. Cover the cleaned glass substrate with a protective film to cover the non-treated part, and then fix it on the umbrella of the coating machine to complete the loading.

[0082] b. Turn on the coating machine, use organic siloxane as the film material, and evaporate the anti-fall layer on the glass substrate.

[0083] 3) Plating imitation ceramic film:

[0084] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0085] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0086] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0087] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0088] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0089] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0090] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0091] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0092] 4) Silk screen black ink, bake at 120℃ for 90 minutes.

[0093] Example 2

[0094] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0095] 3) In the plating of imitation ceramic film:

[0096] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0097] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0098] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0099] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 95.3nm, to complete the Nb2O5 coating;

[0100] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 35.1 nm, and complete the coating;

[0101] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 2.7 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0102] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film, 87.7 nm, and complete the coating;

[0103] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0104] Example 3

[0105] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0106] 3) In the plating of imitation ceramic film:

[0107] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0108] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0109] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0110] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 84.2nm, to complete the Nb2O5 coating;

[0111] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 34.5 nm, and complete the coating;

[0112] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 15.3 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0113] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 46.3 nm, and complete the coating;

[0114] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0115] Example 4

[0116] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0117] 3) In the plating of imitation ceramic film:

[0118] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0119] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0120] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0121] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 75.3nm, to complete the Nb2O5 coating;

[0122] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 56.3 nm, and complete the coating;

[0123] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 6.2 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0124] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 75.1 nm, and complete the coating;

[0125] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0126] Example 5

[0127] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0128] 3) In the plating of imitation ceramic film:

[0129] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0130] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0131] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0132] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 26nm, to complete the Nb2O5 coating;

[0133] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0134] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0135] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0136] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0137] Example 6

[0138] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0139] 3) In the plating of imitation ceramic film:

[0140] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0141] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0142] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0143] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 118nm, to complete the Nb2O5 coating;

[0144] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0145] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0146] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0147] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0148] Example 7

[0149] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0150] 3) In the plating of imitation ceramic film:

[0151] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0152] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0153] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0154] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0155] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit a SiO2 film with a thickness of 14 nm, and complete the coating;

[0156] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0157] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0158] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0159] Example 8

[0160] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0161] 3) In the plating of imitation ceramic film:

[0162] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0163] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0164] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0165] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0166] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 97 nm, and complete the coating;

[0167] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0168] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0169] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0170] Example 9

[0171] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0172] 3) In the plating of imitation ceramic film:

[0173] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0174] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0175] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0176] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0177] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0178] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 0.5 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0179] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0180] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0181] Example 10

[0182] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0183] 3) In the plating of imitation ceramic film:

[0184] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0185] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0186] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0187] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0188] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0189] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 38nm at an oxygen flow rate of 200sccm to complete the coating;

[0190] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0191] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0192] Embodiment 11

[0193] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0194] 3) In the plating of imitation ceramic film:

[0195] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0196] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0197] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0198] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0199] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0200] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0201] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit a SiO2 film with a thickness of 20 nm, and complete the coating;

[0202] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0203] Example 12

[0204] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0205] 3) In the plating of imitation ceramic film:

[0206] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0207] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0208] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0209] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0210] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0211] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0212] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 152 nm, and complete the coating;

[0213] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0214] Embodiment 13

[0215] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0216] 3) In the plating of imitation ceramic film:

[0217] MgF2 is obtained by sputtering MgF2 film material; Nb2O5 is obtained by sputtering Nb2O5 film material.

[0218] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0219] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0220] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the Nb2O5 film evaporation power supply, the power is 7KW, the thickness is set to 66.6nm, and the Nb2O5 coating is completed;

[0221] d. Rotate to the MgF2 film position, deposit a MgF2 film layer with a thickness of 58.1nm, and complete the coating;

[0222] e. Rotate to the Nb2O5 film position, oxygen flow rate 40sccm, deposit Nb2O5 film layer with a thickness of 9.4nm, and complete the coating;

[0223] f. Rotate to the MgF2 film position, deposit a MgF2 film layer with a thickness of 38.2nm, and complete the coating;

[0224] g. After the coating is completed, turn off the power of the evaporation source, turn off the power of the ion source, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0225] Embodiment 14

[0226] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0227] 3) In the plating of imitation ceramic film:

[0228] SiO2 is obtained by sputtering Si target coating; TiO2 is obtained by sputtering Ti target.

[0229] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0230] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0231] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Ti target, with a power of 10KW and a thickness of 56.9nm to complete the TiO2 coating;

[0232] d. Turn off the sputtering power of the Ti target, turn on the Si target power, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 38.6 nm, and complete the coating;

[0233] e. Turn off the sputtering power of the Si target, turn on the power of the Ti target, and deposit a TiO2 film with a thickness of 3.3 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0234] f. Turn off the sputtering power of the Ti target, turn on the Si target power, set the oxygen flow rate to 150 sccm, deposit a SiO2 film with a thickness of 122.8 nm, and complete the coating;

[0235] g. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0236] Embodiment 15

[0237] This example is used to illustrate the imitation ceramic structure and the preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0238] The "anti-drop coating" operation is not performed.

[0239] Example 16

[0240] This comparative example is used to compare and illustrate the imitation ceramic structure and preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0241] 3) In the plating of imitation ceramic film:

[0242] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0243] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0244] c. Turn on the ion source and the oxygen in the ion source, turn on the Si target power supply, the oxygen flow rate is 150sccm, and a SiO2 film layer is deposited with a thickness of 45.6nm to complete the coating;

[0245] d. Turn off the sputtering power of the Si target, turn on the Nb target power, and deposit a Nb2O5 film with a thickness of 9 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0246] e. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0247] f. Turn off the sputtering power of the Si target, turn on the Nb target power, and deposit a Nb2O5 film with an oxygen flow rate of 200 sccm to complete the coating.

[0248] g. After the coating is completed, turn off the Nb target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the refrigerator to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0249] Comparative Example 1

[0250] This comparative example provides a black ceramic structure.

[0251] Comparative Example 2

[0252] This comparative example is used to compare and illustrate the imitation ceramic structure and preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0253] 3) In the plating of imitation ceramic film:

[0254] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0255] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0256] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0257] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0258] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0259] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0260] g. After the coating is completed, turn off the Nb target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the refrigerator to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0261] Comparative Example 3

[0262] This comparative example is used to compare and illustrate the imitation ceramic structure and preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0263] 3) In the plating of imitation ceramic film:

[0264] SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0265] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0266] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0267] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Nb target, with a power of 10KW and a thickness of 54.8nm, to complete the Nb2O5 coating;

[0268] d. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0269] e. Turn off the sputtering power of the Si target, turn on the power of the Nb target, and deposit a Nb2O5 film with a thickness of 9nm at an oxygen flow rate of 200sccm to complete the coating;

[0270] f. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 45.6 nm, and complete the coating;

[0271] g. Turn off the sputtering power of the Si target, turn on the Nb target power, and deposit a Nb2O5 film with a thickness of 36nm at an oxygen flow rate of 200sccm to complete the coating;

[0272] h. After the coating is completed, turn off the Nb target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the refrigerator to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0273] Comparative Example 4

[0274] This comparative example is used to compare and illustrate the imitation ceramic structure and preparation method thereof disclosed in the present invention, and includes most of the operation steps in Example 1, except that:

[0275] 3) In the plating of imitation ceramic film:

[0276] Al2O3 is obtained by sputtering Al target coating, SiO2 is obtained by sputtering Si target coating; Nb2O5 is obtained by sputtering Nb target.

[0277] a. Place the glass substrate on the fixture of the sputtering machine and evacuate it;

[0278] b. The vacuum degree of the coating chamber reaches 3×10 -3 Pa, introduce Ar gas and wait until the gas is stable;

[0279] c. Turn on the ion source and the oxygen in the ion source, and at the same time turn on the sputtering power of the Al target, with a power of 10KW and a thickness of 46nm, to complete the Al2O3 coating;

[0280] d. Turn off the sputtering power of the Al target, turn on the Nb target power, and deposit a Nb2O5 film with a thickness of 54.8 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0281] e. Turn off the sputtering power of the Nb target, turn on the power of the Si target, set the oxygen flow rate to 150 sccm, deposit the SiO2 film with a thickness of 84.4 nm, and complete the coating;

[0282] f. Turn off the sputtering power of the Si target, turn on the Nb target power, and deposit a Nb2O5 film with a thickness of 9 nm at an oxygen flow rate of 200 sccm to complete the coating;

[0283] g. Turn off the sputtering power of the Nb target, turn on the Si target power, oxygen flow rate 150sccm, deposit SiO2 film with a thickness of 45.6nm, and complete the coating;

[0284] h. After the coating is completed, turn off the Si target power supply, turn off the ion source power supply, then turn off the argon and oxygen, stop the rotation of the turntable, wait for the workpiece to cool down, start the freezer to defrost, and finally inflate it and restore it to atmospheric pressure before taking it out.

[0285] Performance Testing

[0286] 1. The following tests were performed on the imitation ceramic structures prepared in the above Examples 1 to 16 and Comparative Examples 2 to 4 and the real ceramic structure provided in Comparative Example 1:

[0287] 1.1. Lab color detection: A colorimeter is used to perform Lab color detection at different incident light angles on the imitation ceramic structures prepared in the above embodiments 1 to 16 and comparative examples 2 to 4 and the real ceramic structure provided in comparative example 1. The above L, a and b refer to the L value, a value and b value in the Lab color space, wherein the L value represents brightness, the larger the L value, the brighter the brightness (or the whiter the color), the smaller the L value, the darker the color (or the blacker the color), and the L value range can be 0-100; the a value is a color value, a is positive, indicating red, the larger the a value, the redder the color, a is negative, indicating green, the smaller the a value, the greener the color, and the a value range is -120 to 120; the b value is a color value, b is positive, indicating yellow, the larger the b value, the yellower the color; b is negative, indicating blue, the smaller the b value, the bluer the color, and the b value range is -120 to 120.

[0288] 1.2. Reflectivity test: The reflectivity of the imitation ceramic structures prepared in the above-mentioned Examples 1 to 16 and Comparative Examples 2 to 4 and the real ceramic structure provided in Comparative Example 1 was tested using a UV-2800 spectrophotometer manufactured by Shimadzu of Japan. The configuration parameters of the UV-2800 spectrophotometer are as follows:

[0289] 1) Spectral width: 4 nm

[0290] 2) Wavelength range: 190 nm – 1100 nm

[0291] 3) Wavelength accuracy: ± 0.5 nm

[0292] 4) Wavelength repeatability: 0.3 nm

[0293] 5) Wavelength resolution: 0.1 nm

[0294] The test results are filled in Table 1:

[0295] Table 1

[0296]

[0297]

[0298]

[0299] It can be seen from the test results in Table 1 that the imitation ceramic structure prepared by the preparation method provided by the present invention is similar to the real ceramic structure of comparative example 1 in color values ​​at different incident light angles. At the same time, the reflectivity of light is also close to that of the real ceramic structure of comparative example 1, indicating that the imitation ceramic structure provided by the present invention has no obvious color difference with the real ceramic at all angles, and achieves a better imitation ceramic effect.

[0300] It can be seen from the test results of Examples 1 to 4 and Examples 5 to 12 that when the thicknesses of the first high refractive index material layer, the second high refractive index material layer, the first low refractive index material layer and the second low refractive index material layer are within the range defined by the present invention, the ceramic-like effect can be further improved.

[0301] It can be seen from the test results of Comparative Examples 1 to 4 that changes in the number of imitation ceramic film layers or the stacking order will lead to large differences in the color of the imitation ceramic structure, especially obvious color differences with real ceramics under different incident light angles, and there is a problem of discoloration.

[0302] 2. The simulated ceramic structures prepared in the above Examples 1 to 4 and Example 15 and the glass substrates that have not been treated were subjected to impact resistance tests. The test conditions were: a 110g ball was dropped from a height of 5 cm to impact the four R corners of the simulated ceramic structure or the glass substrate. Each point was impacted 5 times. If it did not break, it was raised by 5 cm and continued to be impacted by the above method. This process was repeated until it broke, and the height of the breakage was recorded. The test results are entered in Table 2:

[0303] Table 2

[0304]

[0305] It can be seen from the test results in Table 2 that by providing an anti-drop layer between the glass substrate and the imitation ceramic film layer, the problem of the stress generated by the imitation ceramic film layer causing the impact resistance of the glass substrate to decrease can be effectively avoided, thereby improving the anti-drop ability of the imitation ceramic structure.

[0306] 3. The following tests were performed on the imitation ceramic structures prepared in the above-mentioned Examples 1 and 16:

[0307] A. Boiled 100 grid test conditions:

[0308] 1) Add an appropriate amount of pure water to a constant temperature water tank, heat it to 100℃ and boil it, then put the product in. The product should not touch the wall of the boiling water tank, and take it out after boiling for 1 hour;

[0309] 2) Wipe dry with a dust-free cloth and return to normal temperature for at least 2 hours, then compare the appearance with that of a normal sample;

[0310] 3) 100 grids: Use a sharp blade to draw 10×10 1mm×1mm grids on the surface, and each line should penetrate the glass. Use 3M610 tape to stick to the grid area, squeeze out the bubbles, press statically for more than 5 seconds, keep the product still, and quickly pull up one side of the tape at a 90° angle, repeat 3 times;

[0311] Test compliance standard: 100 grids not less than 4B, no abnormality in appearance, no coating layer and ink layer falling off.

[0312] B. High temperature and high humidity test conditions:

[0313] 1) Temperature: 65±1℃, humidity: 91-95%RH, test time: 96H;

[0314] 2) After the specified experimental time is reached, take it out and place it under natural conditions for at least 2 hours, and observe and compare its appearance with that of normal samples;

[0315] 3) 100 grids: Use a sharp blade to draw 10×10 2mm×2mm grids on the surface area, and each line should penetrate the glass. Use 3M610 tape to stick to the grid area, squeeze out the bubbles, press statically for more than 5 seconds, keep the product still, and quickly pull up one side of the tape at a 90° angle, repeat 3 times;

[0316] Test compliance standard: 100 grids not less than 4B, no abnormality in appearance, no coating layer and ink layer falling off.

[0317] C. Cosmetic testing conditions:

[0318] 1) First, clean the surface of the product with a cotton cloth, and apply NIVEA sunscreen oil (SPF30) and NIVEA hand cream samples on the front of the product. Apply 2 samples of each cosmetic. Pay attention to the edges and holes of the product when applying, and apply more than other areas.

[0319] 2) Temperature: 55±1℃, humidity: 93±2%RH, test time: 96H;

[0320] 3) Take out the sample after the specified time, place it under natural conditions for at least 2 hours, and compare its appearance with that of normal samples; 4) 100 grids: Use 3M610 adhesive tape to stick on the ink surface, squeeze out the bubbles, press statically for more than 5 seconds, keep the product still, and quickly pull up one side of the tape at a 90° angle, repeat 3 times;

[0321] Test compliance standard: 100 grids not less than 4B, no abnormality in appearance, no coating layer and ink layer falling off.

[0322] D. Artificial sweat test conditions:

[0323] 1) Prepare the solution according to the "Artificial Sweat Preparation Guide", PH = 4.6 ± 0.1

[0324] 2) Stick the dust-free cloth soaked in the solution on the surface of the sample and seal it with a sealing bag and store it in a constant temperature and humidity chamber for the specified experimental time (temperature: 55±1℃, humidity: 93±2%RH, test time: 96H;)

[0325] 3) Place under natural conditions for at least 2 hours and compare the appearance with that of normal samples;

[0326] 4) 100 grids: Use a sharp blade to draw 10×10 2mm×2mm grids on the surface area, and each line penetrates the glass. Use 3M610 adhesive tape to stick on the ink surface, squeeze out the bubbles, press statically for more than 5 seconds, keep the product still, and quickly pull up one side of the tape at a 90° angle, repeat 3 times;

[0327] Test compliance standard: 100 grids not less than 4B, no abnormality in appearance, no coating layer and ink layer falling off.

[0328] The test results are filled in Table 3:

[0329] Table 3

[0330]

[0331] It can be seen from the test results that compared with stacking the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer and the second low refractive index material layer in sequence in a direction away from the ink layer, the method of stacking the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer and the second low refractive index material layer in sequence in a direction away from the transparent substrate can effectively improve the bonding force between each film layer and the transparent substrate and the ink layer.

[0332] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A ceramic-like structure, It is characterized in that The invention comprises a transparent substrate, an imitation ceramic film layer and an ink layer, wherein the imitation ceramic film layer is located between the transparent substrate and the ink layer, and the imitation ceramic film layer is composed of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer, wherein the first high refractive index material layer, the first low refractive index material layer, the second high refractive index material layer and the second low refractive index material layer are stacked in sequence; the thickness of the first high refractive index material layer is 53.8-105.8 nm, the thickness of the second high refractive index material layer is 1-16 nm, the thickness of the first low refractive index material layer is 32.4-86.4 nm, and the thickness of the second low refractive index material layer is 44.6-90.6 nm; The refractive index of the first high refractive index material layer and the second high refractive index material layer is greater than 2.3, and the refractive index of the first low refractive index material layer and the second low refractive index material layer is less than 1.6; The imitation ceramic structure also includes an anti-drop layer, which is located between the transparent substrate and the imitation ceramic film layer. The first high refractive index material layer is in contact with the anti-drop layer, and the anti-drop layer is an organic silicone material.

2. The imitation ceramic structure according to claim 1, It is characterized in that The reflectivity of the imitation ceramic structure is 25%-30%.

3. The imitation ceramic structure according to claim 1, It is characterized in that The first low refractive index material layer and the second low refractive index material layer are each independently selected from SiO 2 and MgF 2 One or more of .

4. The imitation ceramic structure according to claim 3, It is characterized in that The first low refractive index material layer and the second low refractive index material layer are selected from SiO 2 .

5. The imitation ceramic structure according to claim 1, It is characterized in that The first high refractive index material layer and the second high refractive index material layer are each independently selected from Nb 2 O 5 、Ti 3 O 5 and TiO 2 One or more of .

6. The imitation ceramic structure according to claim 5, It is characterized in that The first high refractive index material layer and the second high refractive index material layer are selected from Nb 2 O 5 .

7. The imitation ceramic structure according to claim 1, It is characterized in that The transparent substrate is glass.

8. The imitation ceramic structure according to claim 1, It is characterized in that The organosiloxane material is obtained by polymerization of small molecule siloxane, and the small molecule siloxane includes one or more of dialkoxysilane with an organic group, trialkoxysilane with an organic group, and tetraalkoxysilane with an organic group, and the organic group is selected from hydrocarbon group, phenyl group, epoxy group, amino group, isocyanate group and ester group and combinations thereof.

9. The imitation ceramic structure according to claim 1, It is characterized in that The thickness of the anti-fall layer is 100-2000nm.

10. The method for preparing a ceramic-like structure according to any one of claims 1 to 9, It is characterized in that The steps include: A transparent precursor is provided, which includes a transparent substrate, and an organic siloxane material is coated on the surface of the transparent substrate to form an anti-fall layer, so as to obtain a transparent precursor; The transparent precursor is sequentially subjected to coating operations of a first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer to form a ceramic-like film layer on the surface of the transparent precursor; Ink is applied on the surface of the formed imitation ceramic film layer to obtain an imitation ceramic structure.

11. The method for preparing the imitation ceramic structure according to claim 10, It is characterized in that Before forming the anti-drop layer, the transparent substrate is subjected to a surface cleaning treatment.

12. The method for preparing the imitation ceramic structure according to claim 11, It is characterized in that A first high refractive index material layer, a first low refractive index material layer, a second high refractive index material layer and a second low refractive index material layer are sequentially deposited on the transparent precursor by vacuum coating.

13. An electronic device housing, It is characterized in that It comprises the imitation ceramic structure as described in any one of claims 1 to 9.

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