A method and device for automatically managing non-product wafers in wafer production process
By creating a waiting warehouse, a finished warehouse and a recycled regeneration warehouse during the wafer production process, the flow of non-product chips is automatically managed, and the problem of non-product chip management relies on labor in the existing technology is solved, and production efficiency is improved.
Patent Information
- Application Number
- CN202410011082.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-03
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2044-01-03
AI Technical Summary
In the prior art, the management of non-product chips in wafer production mainly relies on manual labor, which leads to an increase in workload of personnel, prone to chaos, and affects production efficiency.
Record non-product chips at the corresponding stages of the wafer production process by creating a waiting warehouse, a completed warehouse, and a recycle regeneration warehouse, and automatically manage the flow of non-product chips during the wafer production process.
Reduces workload for personnel, reduces equipment waiting time and improves production efficiency.
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Figure CN117829524B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of production and manufacturing technology, and in particular to an automated management method and device for non-product wafers in a wafer production process. Background Art
[0002] Wafer production is an extremely complex production process. In addition to producing product wafers as the actual production target, non-product wafers must also participate in the wafer production process to ensure the process stability of the manufactured product wafers.
[0003] However, in the prior art, the management of non-product wafers mainly relies on manual labor, and the management method is also imperfect, which increases the workload of personnel and is prone to confusion, affecting the efficiency of wafer production. Summary of the invention
[0004] In view of this, the purpose of this application is to provide an automated management method and device for non-product wafers in the wafer production process. By creating a waiting warehouse, a used warehouse and a recycling warehouse to record the non-product wafers in the corresponding stage of the wafer production process, and automatically managing the flow of non-product wafers in the wafer production process, it can reduce personnel workload, reduce equipment waiting time and improve production efficiency.
[0005] The present application provides an automated management method for non-product wafers in a wafer production process, the method comprising:
[0006] Create a waiting warehouse for recording non-product wafers waiting to be used in the wafer production process, a used warehouse for recording non-product wafers after use, and a recycling warehouse for recording non-product wafers after recycling;
[0007] In the wafer production process, for each non-product wafer in the used warehouse, determining whether the number of times the non-product wafer has been processed is greater than a reuse number threshold;
[0008] If it is greater than, a recycling process is performed on the non-product piece, and the non-product piece that has undergone the recycling process is transferred to the recycling warehouse;
[0009] For each non-product piece in the recycling warehouse, determining whether the number of processing times of the recycling times of the non-product piece is greater than a recycling times threshold;
[0010] If it is greater, the non-product film will be downgraded according to the downgrading rules, and the non-product film after the downgrade will be transferred to the waiting warehouse or scrapped; wherein, the types of non-product films include control films, warm-up films, and block films; the level of control films is higher than that of warm-up films, and the level of warm-up films is higher than that of block films.
[0011] Furthermore, the method further comprises:
[0012] Determine whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets;
[0013] If necessary, the original production plan is adjusted, and non-product sheets are produced according to the updated production plan obtained after the adjustment.
[0014] Further, the determining whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets includes:
[0015] When the number of non-product sheets in the waiting warehouse is less than a preset safety number threshold, determining a first number of non-product sheets to be newly prepared before the start of the next production cycle according to the original preparation plan, and predicting a second number of non-product sheets required for the next production cycle according to the equipment maintenance plan;
[0016] determining whether the sum of the number of non-product pieces in the waiting warehouse and the first number is less than the second number;
[0017] If it is less than, determine whether the sum of the number of non-product sheets in the waiting warehouse, the number of non-product sheets in the used warehouse that need to be transferred to the waiting warehouse, the number of non-product sheets in the recycling warehouse that need to be transferred to the waiting warehouse, and the first number is less than the second number;
[0018] If it is less than, it is determined that the original preparation plan needs to be adjusted.
[0019] Furthermore, the method further comprises:
[0020] When it is determined that any machine needs non-product pieces, a non-product piece processing task is automatically generated;
[0021] The non-product sheet processing task is reserved for the machine, so that a transport task is automatically initiated according to the non-product sheet processing task to transport the required non-product sheet to the machine.
[0022] Furthermore, when the machine completes the equipment maintenance plan, or when the processing recipe of the machine is changed, it is determined that the machine needs to be controlled;
[0023] When the machine equipment is a chemical mechanical polishing equipment, the following methods are used to determine whether the machine needs a warm-up plate:
[0024] When reserving a product piece processing task with a machine, obtaining the number of product pieces to be processed in the product piece processing task;
[0025] In the process of transporting product sheets to the machine to perform product sheet processing tasks, the number of product sheets being processed is obtained;
[0026] If the number of product sheets to be processed is less than the processing quantity limit of the machine equipment, or the number of product sheets being processed is less than the processing quantity limit of the machine equipment, it is determined that the machine needs a warm-up sheet.
[0027] Furthermore, when the number of times the baffles used in any machine are processed exceeds a preset threshold, it is determined that the machine needs to replace the baffles; the method further includes:
[0028] According to the non-product wafer processing task, a wafer transfer box is reserved to transport the replacement baffle to the machine;
[0029] Control the machine to unbind from the baffle whose processing times exceed a preset threshold, and control the machine to bind with the replacement baffle;
[0030] The replacement baffle is controlled to exchange positions with the baffle whose processing times exceed the preset threshold, and the baffle whose processing times exceed the preset threshold is transported away by using the wafer transfer box.
[0031] Furthermore, the method further comprises:
[0032] Sort the multiple product slice processing tasks reserved on each machine, arrange the product slice processing tasks with the same formula in one group and execute them in sequence.
[0033] The embodiment of the present application also provides an automated management device for non-product wafers in a wafer production process, the device comprising:
[0034] A creation module is used to create a waiting warehouse for recording non-product wafers waiting to be used, a used warehouse for recording non-product wafers after use, and a recycling warehouse for recording non-product wafers after recycling in the wafer production process;
[0035] A first determination module is used to determine, during the wafer production process, for each non-product wafer in the used warehouse, whether the number of times the non-product wafer has been processed is greater than a reuse number threshold;
[0036] A recycling module, for executing a recycling process for the non-product piece if it is greater than, and transferring the non-product piece that has undergone the recycling process to the recycling warehouse;
[0037] A second determination module is used to determine, for each non-product piece in the recycling warehouse, whether the number of processing times of recycling times of the non-product piece is greater than a recycling times threshold;
[0038] A downgrading module is used to downgrade the non-product film according to the downgrading rules if it is greater than, and transfer the non-product film after the downgrade to the waiting warehouse or scrap it; wherein the types of non-product films include control films, warm-up films, and baffle films; the level of control films is higher than that of warm-up films, and the level of warm-up films is higher than that of baffle films.
[0039] An embodiment of the present application also provides an electronic device, including: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of the automated management method for non-product wafers in a wafer production process as described above are performed.
[0040] An embodiment of the present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the method for automated management of non-product wafers in a wafer production process as described above are executed.
[0041] An embodiment of the present application provides an automated management method and device for non-product wafers in a wafer production process. By creating a waiting warehouse, a used warehouse, and a recycling warehouse to record the non-product wafers in the corresponding stage of the wafer production process, and automatically managing the flow of non-product wafers in the wafer production process, it can reduce personnel workload, reduce equipment waiting time, and improve production efficiency.
[0042] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0044] Figure 1 A flow chart showing an automated management method for non-product wafers in a wafer production process provided by an embodiment of the present application;
[0045] Figure 2One of the structural schematic diagrams of an automated management device for non-product wafers in a wafer production process provided by an embodiment of the present application is shown;
[0046] Figure 3 A second structural schematic diagram of an automated management device for non-product wafers in a wafer production process provided by an embodiment of the present application is shown;
[0047] Figure 4 A schematic structural diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION
[0048] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, each other embodiment obtained by those skilled in the art without making creative work belongs to the scope of protection of the present application.
[0049] Research has found that wafer production is an extremely complex production process. In the wafer production process, in addition to producing product wafers as the actual production target, non-product wafers also need to participate in order to ensure the process stability of the manufactured product wafers.
[0050] However, in the prior art, the management of non-product wafers mainly relies on manual labor, and the management method is also imperfect, which increases the workload of personnel and is prone to confusion, affecting the efficiency of wafer production.
[0051] Based on this, the embodiments of the present application provide an automated management method and device for non-product wafers in the wafer production process, which records the non-product wafers at the corresponding stages of the wafer production process by creating a waiting warehouse, a used warehouse, and a recycling warehouse, and automatically manages the flow of non-product wafers in the wafer production process, thereby reducing personnel workload, reducing equipment waiting time, and improving production efficiency.
[0052] See also Figure 1 , Figure 1 The flowchart of the method for automated management of non-product wafers in the wafer production process provided by the embodiment of the present application. The method for automated management of non-product wafers provided by the embodiment of the present application can be applied to the wafer production management system, and can be executed by the MES system, EAP system, RTD system, etc. included in the wafer production management system; Figure 1 As shown in, the method provided in the embodiment of the present application includes:
[0053] S101. Create a waiting warehouse for recording non-product wafers waiting to be used, a used warehouse for recording non-product wafers after use, and a recycling warehouse for recording non-product wafers after recycling in the wafer production process.
[0054] Among them, non-product wafers (NPW) are also called non-productive wafers, and their types include monitor wafers, season wafers, and dummy wafers. The process flow of non-product wafers includes Prepare, InUse, and Recycle.
[0055] In this step, the waiting warehouse WaitInuseBank, the used warehouse AfterInuseBank and the recycling warehouse AfterRecycleBank are designed in the MES system to record the information of non-product pieces in the corresponding production stage, such as number, type, number of processing times and number of recycling times.
[0056] S102. During the wafer production process, for each non-product wafer in the used warehouse, determine whether the number of times the non-product wafer has been processed is greater than a reuse number threshold.
[0057] Here, the prepared non-product pieces will enter the waiting warehouse, and will automatically enter the used warehouse after InUse processing. Afterwards, for each non-product piece in the used warehouse, the MES system can determine whether the non-product piece can be directly reused based on the reuse count threshold and the number of times the non-product piece has been processed. Specifically, if the number of processing times is less than or equal to the reuse count threshold, it means that the non-product piece can be directly reused, so the non-product piece can be directly transferred from the used warehouse in the MES system to the waiting warehouse, that is, waiting for the next production processing.
[0058] S103, if it is greater than, executing a recycling process for the non-product piece, and transferring the non-product piece that has passed the recycling process to the recycling warehouse.
[0059] Here, if the number of processing times is greater than the reuse times threshold, it means that the non-product piece cannot be reused directly and needs to be processed through a recycling process. Therefore, the recycling process is executed on the non-product piece, and the recycling process can clean the non-product piece. After the execution is completed, the non-product piece is transferred to the recycling warehouse in the MES system, and the recycling times of the non-product piece are increased by one, and the processing times are reset to zero.
[0060] S104: For each non-product piece in the recycling warehouse, determine whether the processing number of recycling times of the non-product piece is greater than a recycling times threshold.
[0061] In this step, for each non-product piece in the recycling warehouse, the MES system can determine whether the non-product piece needs to be downgraded for use or keep the current level of non-product piece type according to the recycling number threshold and the recycling number of the non-product piece, and directly transfer it to the waiting warehouse for direct reuse. Specifically, if the recycling number is less than or equal to the recycling number threshold, it means that the non-product piece can keep the current level of non-product piece type, so the non-product piece can be directly transferred from the recycling warehouse in the MES system to the waiting warehouse, that is, waiting for the next production and processing.
[0062] S105: If it is greater than, downgrading the non-product piece according to the downgrading rule, and transferring the non-product piece after the downgrade to the waiting warehouse or scrapping it.
[0063] Here, if the number of cycles is greater than the cycle threshold, it is necessary to determine whether the non-product chip meets the downgrade rule; if it does, the non-product chip is automatically downgraded, where the control chip is higher than the warm-up chip, and the warm-up chip is higher than the blocking chip. Therefore, the control chip can be downgraded to the warm-up chip or the blocking chip; the warm-up chip can be downgraded to the blocking chip; and the blocking chip is generally scrapped after being downgraded.
[0064] For non-product pieces that do not meet the downgrade rules, for example, if the product piece is damaged, has a gap, or has other problems such as abnormal parameters, the non-product piece will be submitted to relevant personnel for manual intervention to determine whether it needs to be scrapped.
[0065] In this way, by creating a waiting warehouse, a used warehouse and a recycling warehouse to record the non-product wafers at the corresponding stage of the wafer production process, and automatically managing the flow of non-product wafers in the wafer production process, it is possible to reduce personnel workload, reduce equipment waiting time and improve production efficiency.
[0066] In a possible implementation, the method further includes:
[0067] Step 1: Determine whether the original preparation plan needs to be adjusted based on the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets.
[0068] Step 2: If necessary, adjust the original preparation plan, and prepare non-product tablets according to the updated preparation plan obtained after the adjustment.
[0069] Here, the equipment needs to be regularly maintained according to the equipment maintenance plan, and the equipment that has just completed the equipment maintenance plan cannot be used to produce product wafers immediately. A batch of non-product wafers, such as control wafers or warm-up wafers, need to be put into trial production first. Furthermore, after the maintenance of each equipment is completed, the Season Job can be automatically generated according to the Season Flow Group, and the Monitor Job can be automatically generated according to the Monitor Flow Group. Therefore, according to the equipment maintenance plan, the number of non-product wafers that will need to be put into the wafer production process can be predicted.
[0070] On the other hand, there is an original preparation plan set up in advance for non-product wafers, such as preparing a certain number of non-product wafers at a certain interval, so as to replenish non-product wafers. However, as wafer production proceeds, non-product wafers will naturally become obsolete or accidentally damaged, which is uncontrollable. If non-product wafers are only prepared according to the fixed original preparation plan, it is easy to cause insufficient non-product wafer reserves, affecting wafer preparation efficiency.
[0071] Therefore, the method provided in the embodiment of the present application can predict whether the number of non-product sheets in the future will be sufficient based on the equipment maintenance plan, the number of non-product sheets in the warehouse waiting to be used, the number of non-product sheets in the warehouse after use, the number of non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets, and then determine whether the original preparation plan needs to be adjusted; if necessary, the original preparation plan is adjusted, and the non-product sheets are prepared in advance according to the updated preparation plan obtained after the adjustment, so as to avoid the situation where the machine equipment has completed equipment maintenance but there are not enough non-product sheets to put into testing, causing equipment idleness and affecting production efficiency.
[0072] In specific implementation, step 1 may include:
[0073] Step a: When the number of non-product sheets in the waiting warehouse is less than a preset safety quantity threshold, determine the first number of newly prepared non-product sheets before the start of the next production cycle according to the original preparation plan, and predict the second number of non-product sheets required for the next production cycle according to the equipment maintenance plan.
[0074] In this step, at any time point in any production cycle, when it is detected that the number of non-product sheets in the warehouse waiting to be used is less than the preset safety quantity threshold, it is determined that there is a risk of shortage of non-product sheets. At this time, the first number of non-product sheets that will be newly prepared before the start of the next production cycle can be determined according to the original preparation plan, and the second number of non-product sheets required for the next production cycle can be predicted according to the equipment maintenance plan. Among them, the production cycle can be set according to production needs, such as one day, 12 hours, etc.; the preset safety quantity threshold can be set according to factors such as production scale, and this application does not make any restrictions here.
[0075] Step b: Determine whether the sum of the number of non-product sheets in the waiting warehouse and the first number is less than the second number.
[0076] If it is not less than, it means that the number of non-product sheets should be sufficient in the next production cycle, and the original preparation plan can be kept unchanged.
[0077] Step c. If it is less than, determine whether the sum of the number of non-product sheets in the waiting warehouse, the number of non-product sheets in the used warehouse that need to be transferred to the waiting warehouse, the number of non-product sheets in the recycling warehouse that need to be transferred to the waiting warehouse, and the first number is less than the second number.
[0078] In this step, if it is less than, it means that there is a risk that the number of non-product pieces may be insufficient in the next production cycle, and further refined judgment is required. Specifically, as mentioned above, part of the non-product pieces in the used warehouse will be transferred to the waiting warehouse; the other part will be transferred to the recycling warehouse and after the recycling process is carried out, it will also be transferred back to the waiting warehouse.
[0079] Therefore, at any time point, the number of non-product sheets currently in the warehouse waiting to be used, the number of non-product sheets in the used warehouse that need to be transferred to the warehouse waiting to be used, the number of non-product sheets in the recycling warehouse that need to be transferred to the warehouse waiting to be used, and the first number can be summed up; if the sum obtained is not less than the second number, it means that the number of non-product sheets in the next production cycle is actually sufficient, and the original preparation plan can be kept unchanged.
[0080] Step d: If it is less than, it is determined that the original preparation plan needs to be adjusted.
[0081] Furthermore, for step 2, when adjusting the original preparation plan, you can choose to directly shorten the preparation time interval of each batch of non-product sheets, increase the preparation quantity of each batch of non-product sheets, etc. to adjust the updated preparation plan; you can also adjust the updated preparation plan more accurately based on the difference between the sum obtained in step c and the second quantity.
[0082] By adjusting the non-product slice preparation plan through step-by-step judgment, computing resources can be saved and a sufficient number of non-product slices can be ensured in production, thereby avoiding the impact of insufficient non-product slices on production efficiency.
[0083] In a possible implementation, the method further includes: when it is determined that any machine needs a non-product sheet, automatically generating a non-product sheet processing task; reserving the non-product sheet processing task to the machine, so as to automatically initiate a transport task according to the non-product sheet processing task, and transport the required non-product sheet to the machine.
[0084] In this step, when it is determined that any machine needs a non-product sheet, a non-product sheet processing task can be generated based on information such as the type of non-product sheet required, processing time, and machine number, and the non-product sheet processing task can be reserved for the corresponding machine; in this way, when the scheduled processing time arrives, the MES system can automatically initiate a transport task based on the non-product sheet processing task, and transport the required non-product sheet to the machine for processing.
[0085] During specific implementation, when a machine completes the equipment maintenance plan or when the processing recipe of the machine is changed, it is determined that the machine needs to be controlled.
[0086] As mentioned above, after the equipment has completed the equipment maintenance plan, in order to ensure that the products produced by the equipment are stable and qualified, a batch of non-product sheets, such as control sheets or warm-up sheets, need to be put into trial production first to determine whether the equipment can be put into production normally based on the processing quality of the control sheets. In addition, when the production formula of the equipment is changed, it is also necessary to put in control sheets for trial production.
[0087] In specific implementation, when the machine equipment is a chemical mechanical polishing equipment, it is determined that the machine needs a warm-up plate by the following method:
[0088] When reserving a product sheet processing task with the machine, obtain the number of product sheets to be processed in the product sheet processing task; in the process of transporting product sheets to the machine to execute the product sheet processing task, obtain the number of product sheets being processed; if the number of product sheets to be processed is less than the processing quantity limit of the machine equipment, or the number of product sheets being processed is less than the processing quantity limit of the machine equipment, it is determined that the machine needs a warm-up sheet.
[0089] Here, if the chemical mechanical polishing equipment is idling, the speed and stability of the drill bit will decrease. Therefore, the chemical mechanical polishing equipment is a 0IDLE device. The MES system will obtain the number of product sheets to be processed and the number of product sheets being processed according to the equipment automation system EAP. When making an appointment, it will check whether the number of product sheets to be processed is less than the processing quantity limit of the machine equipment, or when Track In, it will check whether the number of product sheets being processed is less than the processing quantity limit of the machine equipment; if so, it is determined that the machine needs a warm-up sheet to adjust the processing performance of the chemical mechanical polishing equipment to a stable state through the warm-up sheet.
[0090] In a specific implementation, when the number of times the baffles used in any machine are processed exceeds a preset threshold, it is determined that the machine needs to replace the baffles. In a specific implementation, an event trigger is also running in the production management system, which can monitor the number of times the baffles are processed, and when the number of times the processing exceeds the preset threshold, a baffle replacement event is triggered, that is, it is determined that the machine needs to replace the baffles.
[0091] In the prior art, the processing times of baffles can only be managed manually, and when the threshold is exceeded, all old baffles in the buffer of the machine equipment are taken out (Dummy Out) and new baffles are put in (Dummy In), so it is impossible to achieve refined automatic management of a single baffle.
[0092] The method provided in the embodiment of the present application also includes: according to the non-product sheet processing task, reserving a wafer transfer box to transport the replacement baffle to the machine; controlling the machine to unbind the baffle whose processing times exceed a preset threshold, and controlling the machine to bind the replacement baffle; controlling the replacement baffle to exchange positions with the baffle whose processing times exceed the preset threshold, and using the wafer transfer box to transport away the baffle whose processing times exceed the preset threshold.
[0093] Here, the non-product sheet processing task should also indicate the slot position of the original baffle in the machine equipment that needs to be replaced because the number of processing times exceeds the preset threshold; therefore, on the hardware equipment, according to the non-product sheet processing task, the wafer transfer box Foup can be reserved, and the replacement baffle can be moved to the slot corresponding to the baffle in the machine that has been processed more than the preset threshold. The replacement baffle in the machine equipment buffer is exchanged with the baffle that has reached the upper limit of use through the EAP system, and then the baffle that has reached the upper limit of use is moved away using the wafer transfer box. At the software level, the original baffle that has reached the upper limit of use that was bound to the machine buffer during Dummy In needs to be unbound, and then the replacement baffle is bound to the machine.
[0094] More specifically, the method provided in the embodiment of the present application has two devices when performing baffle exchange, one is a furnace tube and the other is an etchant. For the furnace tube device, the furnace tube device is an internal buffer, and the carrier can be loaded into the processing space buffer inside the device. Generally, more than ten carriers can be placed in the buffer. When exchanging baffles, the old baffle can be loaded onto the machine together with the carrier, and then transported away; then the new baffle can be transported in and loaded into the buffer inside the furnace tube device together with the carrier.
[0095] For the etching equipment, the etching equipment is a fix buffer. There are two ways to exchange baffles: one is to move an empty carrier to move the old baffle away, then move a carrier with a new baffle to load the new baffle into the buffer, and then move the empty carrier away. The other is that the etching equipment is usually equipped with a buffer position, and a carrier with a new baffle is directly moved to this position; in this way, every time the equipment takes in a new baffle, it replaces an old baffle into the carrier; this is repeated many times to complete the baffle exchange.
[0096] Therefore, the embodiment of the present application provides a Dummy Exchange baffle exchange method, which can automatically and accurately replace baffles that exceed the upper limit of usage, thereby improving production efficiency.
[0097] Furthermore, the method also includes: sorting the multiple product slice processing tasks reserved on each machine, arranging the product slice processing tasks with the same formula in a group and executing them in sequence.
[0098] Here, the real-time scheduling system RTD can schedule the product sheet processing tasks of the work-in-progress in the MES system to reduce equipment idleness and recipe changes; for example, sort the multiple product sheet processing tasks reserved on each machine, arrange the product sheet processing tasks with the same recipe in a group and execute them in sequence. This is because the machine equipment needs to conduct trial production after the recipe changes, so frequent recipe changes will affect the production efficiency of the machine equipment, and arranging the product sheet processing tasks with the same recipe in a group and executing them in sequence can reduce the recipe changes and ensure the continuity of production.
[0099] An embodiment of the present application provides an automated management method for non-product wafers in a wafer production process. By creating a waiting warehouse, a used warehouse, and a recycling warehouse to record the non-product wafers in the corresponding stage of the wafer production process, and automatically managing the flow of non-product wafers in the wafer production process, it can reduce personnel workload, reduce equipment waiting time, and improve production efficiency.
[0100] See also Figure 2 , Figure 3 , Figure 2 This is one of the structural schematic diagrams of an automated management device for non-product wafers in a wafer production process provided by an embodiment of the present application. Figure 3 This is a second structural schematic diagram of an automated management device for non-product wafers in a wafer production process provided in an embodiment of the present application.
[0101] like Figure 2 As shown in , the device 200 includes:
[0102] A creation module 210 is used to create a waiting warehouse for recording non-product wafers waiting to be used, a used warehouse for recording non-product wafers after use, and a recycling warehouse for recording non-product wafers after recycling in the wafer production process;
[0103] The first determination module 220 is used to determine, during the wafer production process, for each non-product wafer in the used warehouse, whether the number of times the non-product wafer has been processed is greater than a reuse number threshold;
[0104] A recycling module 230, for executing a recycling process for the non-product piece if it is greater than, and transferring the non-product piece after the recycling process to the recycling warehouse;
[0105] A second determination module 240 is used to determine, for each non-product piece in the recycling warehouse, whether the number of processing times of recycling times of the non-product piece is greater than a recycling times threshold;
[0106] The downgrading module 250 is used to downgrade the non-product film according to the downgrading rules if it is greater than, and transfer the non-product film after the downgrade to the waiting warehouse or scrap processing; wherein, the types of non-product films include control films, warm-up films, and blocking films; the level of control films is higher than that of warm-up films, and the level of warm-up films is higher than that of blocking films.
[0107] Further, such as Figure 3 As shown, the device further includes: a prediction module 260; the prediction module 260 is used to:
[0108] Determine whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets;
[0109] If necessary, the original production plan is adjusted, and non-product sheets are produced according to the updated production plan obtained after the adjustment.
[0110] Further, when the prediction module 260 is used to determine whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets, the prediction module 260 is used to:
[0111] When the number of non-product sheets in the waiting warehouse is less than a preset safety number threshold, determining a first number of non-product sheets to be newly prepared before the start of the next production cycle according to the original preparation plan, and predicting a second number of non-product sheets required for the next production cycle according to the equipment maintenance plan;
[0112] determining whether the sum of the number of non-product pieces in the waiting warehouse and the first number is less than the second number;
[0113] If it is less than, determine whether the sum of the number of non-product sheets in the waiting warehouse, the number of non-product sheets in the used warehouse that need to be transferred to the waiting warehouse, the number of non-product sheets in the recycling warehouse that need to be transferred to the waiting warehouse, and the first number is less than the second number;
[0114] If it is less than, it is determined that the original preparation plan needs to be adjusted.
[0115] Further, such as Figure 3 As shown, the device further includes: a reservation module 270; the reservation module 270 is used to:
[0116] When it is determined that any machine needs non-product pieces, a non-product piece processing task is automatically generated;
[0117] The non-product sheet processing task is reserved for the machine, so that a transport task is automatically initiated according to the non-product sheet processing task to transport the required non-product sheet to the machine.
[0118] Further, when the machine completes the equipment maintenance plan, or when the processing recipe of the machine changes, the reservation module 270 determines that the machine needs to be controlled;
[0119] When the machine equipment is a chemical mechanical polishing equipment, the reservation module 270 determines that the machine equipment needs a warm-up plate in the following manner:
[0120] When reserving a product piece processing task with a machine, obtaining the number of product pieces to be processed in the product piece processing task;
[0121] In the process of transporting product sheets to the machine to perform product sheet processing tasks, the number of product sheets being processed is obtained;
[0122] If the number of product sheets to be processed is less than the processing quantity limit of the machine equipment, or the number of product sheets being processed is less than the processing quantity limit of the machine equipment, it is determined that the machine needs a warm-up sheet.
[0123] When the number of times the baffles used in any machine are processed exceeds a preset threshold, the reservation module 270 determines that the machine needs to replace the baffles; the reservation module 270 is used to: according to the non-product wafer processing task, reserve a wafer transfer box to transport the replacement baffles to the machine;
[0124] Control the machine to unbind from the baffle whose processing times exceed a preset threshold, and control the machine to bind with the replacement baffle;
[0125] The replacement baffle is controlled to exchange positions with the baffle whose processing times exceed the preset threshold, and the baffle whose processing times exceed the preset threshold is transported away by using the wafer transfer box.
[0126] Further, such as Figure 3 As shown, the device further includes a scheduling module 280; the scheduling module 280 is used to:
[0127] Sort the multiple product slice processing tasks reserved on each machine, arrange the product slice processing tasks with the same formula in one group and execute them in sequence.
[0128] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 4 As shown in , the electronic device 400 includes a processor 410 , a memory 420 and a bus 430 .
[0129] The memory 420 stores machine-readable instructions executable by the processor 410. When the electronic device 400 is running, the processor 410 communicates with the memory 420 via the bus 430. When the machine-readable instructions are executed by the processor 410, the above-mentioned Figure 1 The steps of an automated management method for non-product wafers in a wafer production process in the method embodiment shown are described in detail in the method embodiment, and will not be described in detail here.
[0130] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the computer program can execute the above-mentioned Figure 1 The steps of an automated management method for non-product wafers in a wafer production process in the method embodiment shown are described in detail in the method embodiment, and will not be described in detail here.
[0131] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.
[0132] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.
[0133] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0134] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
[0135] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or in other words, the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.
[0136] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. An automated management method for non-product wafers in a wafer production process, characterized in that: The method comprises: Create a waiting warehouse for recording non-product wafers waiting to be used in the wafer production process, a used warehouse for recording non-product wafers after use, and a recycling warehouse for recording non-product wafers after recycling; In the wafer production process, for each non-product wafer in the used warehouse, determining whether the number of times the non-product wafer has been processed is greater than a reuse number threshold; If it is greater than, a recycling process is performed on the non-product piece, and the non-product piece that has undergone the recycling process is transferred to the recycling warehouse; For each non-product piece in the recycling warehouse, determining whether the number of processing times of the recycling times of the non-product piece is greater than a recycling times threshold; If it is greater, the non-product film is downgraded according to the downgrading rules, and the non-product film after the downgrading is transferred to the waiting warehouse or scrapped; wherein the types of the non-product film include control film, warm-up film, and blocking film; the level of the control film is higher than that of the warm-up film, and the level of the warm-up film is higher than that of the blocking film; The method further comprises: Determine whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets; If necessary, adjusting the original preparation plan, and preparing non-product tablets according to the updated preparation plan obtained after the adjustment; The determining whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets includes: When the number of non-product sheets in the waiting warehouse is less than a preset safety number threshold, determining a first number of non-product sheets to be newly prepared before the start of the next production cycle according to the original preparation plan, and predicting a second number of non-product sheets required for the next production cycle according to the equipment maintenance plan; determining whether the sum of the number of non-product pieces in the waiting warehouse and the first number is less than the second number; If it is less than, determine whether the sum of the number of non-product sheets in the waiting warehouse, the number of non-product sheets in the used warehouse that need to be transferred to the waiting warehouse, the number of non-product sheets in the recycling warehouse that need to be transferred to the waiting warehouse, and the first number is less than the second number; If it is less than, it is determined that the original preparation plan needs to be adjusted; The method further comprises: When it is determined that any machine needs non-product pieces, a non-product piece processing task is automatically generated; Reserving the non-product sheet processing task to the machine, automatically initiating a transport task according to the non-product sheet processing task, and transporting the required non-product sheet to the machine; When the number of times the baffles used in any machine are processed exceeds a preset threshold, it is determined that the machine needs to replace the baffles; the non-product sheet processing task indicates that the number of times the processing exceeds the preset threshold, and the slot of the original baffle that needs to be replaced in the machine equipment; the method also includes: According to the non-product wafer processing task, a wafer transfer box is reserved to transport the replacement baffle to the slot corresponding to the original baffle in the machine; Control the machine to unbind from the original baffle whose processing times exceed a preset threshold, and control the machine to bind with the replacement baffle; The replacement baffle is controlled to exchange positions with the original baffle whose processing times exceed the preset threshold, and the baffle whose processing times exceed the preset threshold is transported away by using the wafer transfer box.
2. The method according to claim 1, characterized in that When the machine completes the equipment maintenance plan, or when the machine's processing formula is changed, it is determined that the machine needs to be controlled; When the machine equipment is a chemical mechanical polishing equipment, the following methods are used to determine whether the machine needs a warm-up plate: When reserving a product piece processing task with a machine, obtaining the number of product pieces to be processed in the product piece processing task; In the process of transporting product sheets to the machine to perform product sheet processing tasks, the number of product sheets being processed is obtained; If the number of product sheets to be processed is less than the processing quantity limit of the machine equipment, or the number of product sheets being processed is less than the processing quantity limit of the machine equipment, it is determined that the machine needs a warm-up sheet.
3. The method according to claim 1, characterized in that The method further comprises: Sort the multiple product slice processing tasks reserved on each machine, arrange the product slice processing tasks with the same formula in one group and execute them in sequence.
4. An automated management device for non-product wafers in a wafer production process, characterized in that: The device comprises: A creation module is used to create a waiting warehouse for recording non-product wafers waiting to be used, a used warehouse for recording non-product wafers after use, and a recycling warehouse for recording non-product wafers after recycling in the wafer production process; A first determination module is used to determine, during the wafer production process, for each non-product wafer in the used warehouse, whether the number of times the non-product wafer has been processed is greater than a reuse number threshold; A recycling module, for executing a recycling process for the non-product piece if it is greater than, and transferring the non-product piece that has undergone the recycling process to the recycling warehouse; A second determination module is used to determine, for each non-product piece in the recycling warehouse, whether the number of processing times of recycling times of the non-product piece is greater than a recycling times threshold; A downgrading module is used for downgrading the non-product slice according to the downgrading rule if it is greater than, and transferring the non-product slice after the downgrading to the waiting warehouse or scrapping; wherein the types of the non-product slices include control slices, warm-up slices, and blocking slices; the level of the control slices is higher than that of the warm-up slices, and the level of the warm-up slices is higher than that of the blocking slices; The device further comprises: a prediction module; the prediction module is used to: Determine whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product sheets in the waiting warehouse, the non-product sheets in the used warehouse, the non-product sheets in the recycling warehouse, and the original preparation plan of the non-product sheets; If necessary, adjusting the original preparation plan, and preparing non-product tablets according to the updated preparation plan obtained after the adjustment; When the prediction module is used to determine whether the original preparation plan needs to be adjusted according to the equipment maintenance plan, the non-product pieces in the waiting warehouse, the non-product pieces in the used warehouse, the non-product pieces in the recycling warehouse, and the original preparation plan of the non-product pieces, the prediction module is used to: When the number of non-product sheets in the waiting warehouse is less than a preset safety number threshold, determining a first number of non-product sheets to be newly prepared before the start of the next production cycle according to the original preparation plan, and predicting a second number of non-product sheets required for the next production cycle according to the equipment maintenance plan; determining whether the sum of the number of non-product pieces in the waiting warehouse and the first number is less than the second number; If it is less than, determine whether the sum of the number of non-product sheets in the waiting warehouse, the number of non-product sheets in the used warehouse that need to be transferred to the waiting warehouse, the number of non-product sheets in the recycling warehouse that need to be transferred to the waiting warehouse, and the first number is less than the second number; If it is less than, it is determined that the original preparation plan needs to be adjusted; The device further comprises: a reservation module; the reservation module is used to: When it is determined that any machine needs non-product pieces, a non-product piece processing task is automatically generated; Reserving the non-product sheet processing task to the machine, automatically initiating a transport task according to the non-product sheet processing task, and transporting the required non-product sheet to the machine; When the number of times the baffle used in any machine is processed exceeds a preset threshold, it is determined that the machine needs to replace the baffle; the non-product sheet processing task indicates that the number of times the processing exceeds the preset threshold, and the slot of the original baffle that needs to be replaced in the machine equipment; the reservation module is used to: According to the non-product wafer processing task, a wafer transfer box is reserved to transport the replacement baffle to the slot corresponding to the original baffle in the machine; Control the machine to unbind from the original baffle whose processing times exceed a preset threshold, and control the machine to bind with the replacement baffle; The replacement baffle is controlled to exchange positions with the original baffle whose processing times exceed the preset threshold, and the baffle whose processing times exceed the preset threshold is transported away by using the wafer transfer box.
5. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and the machine-readable instructions are executed by the processor to execute the steps of a method for automated management of non-product wafers in a wafer production process as described in any one of claims 1 to 3.
6. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method for automated management of non-product wafers in a wafer production process as described in any one of claims 1 to 3 are executed.
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