A high temperature resistant protective film and its production process

Abstract

The present invention provides a high temperature resistant protective film, a high temperature resistant protective film, the high temperature resistant protective film comprises a receiving layer and two release layers. The receiving layer is arranged between the two release layers, and each release layer is connected to one side of the receiving layer. The release layer comprises the following components in parts by weight: 18 to 25 parts of silicone oil, 0.05 to 0.15 parts of cross-linking agent, 0.04 to 0.08 parts of catalyst, 0.1 to 0.3 parts of activator, 30 to 40 parts of mixed benzene and 40 to 45 parts of ethyl ester. The above-mentioned high temperature resistant protective film has low shrinkage, good wrinkle resistance, is not easy to wrinkle, and has good flatness. Secondly, the above-mentioned high temperature resistant protective film has good high temperature resistance, high melting point, and is not easy to deform when exposed to high temperature. In addition, the above-mentioned high temperature resistant protective film has good flexibility and good buffering and pressure resistance, and can provide good protection for PCB. In particular, the above-mentioned high temperature resistant protective film has an excellent tearing effect, no residue after tearing, and will not cause pollution to the PCB.

Description

Technical Field

[0001] The invention relates to the field of printed circuit boards, in particular to a high temperature resistant protective film and a production process thereof. Background Art

[0002] PCB is an important electronic component. It is not only the support of electronic components, but also the provider of circuit connections for electronic components. PCB transfers the circuit to the substrate by image transfer, and generates the circuit after chemical etching. Since PCB is made by electronic printing technology, it is called printed circuit board. With the continuous development and progress of PCB technology, printed circuit boards are gradually developing in the direction of light weight, thin thickness, small size and high circuit density. The rigid-flexible board saves a lot of space in the assembly of the circuit board through the organic combination of the flexible board and the hard board, and the demand for rigid-flexible boards from various end customers continues to increase. In the production of rigid-flexible boards, the auxiliary role of protective film is indispensable.

[0003] However, PCB boards are squeezed by processing equipment during production and processing. In order to protect the PCB boards from being crushed, a protective film needs to be covered on the PCB boards to provide buffer protection for the PCB boards. However, traditional protective films have poor high temperature resistance and are prone to deformation and cracking. Summary of the invention

[0004] Based on this, it is necessary to provide a high temperature resistant protective film to address the technical problems that traditional protective films have poor high temperature resistance and are prone to deformation and cracking.

[0005] A high temperature resistant protective film, comprising a receiving layer and two release layers; the receiving layer is arranged between the two release layers, and each release layer is connected to one side of the receiving layer;

[0006] The release layer includes the following components in parts by weight: 18 to 25 parts of silicone oil, 0.05 to 0.15 parts of a cross-linking agent, 0.04 to 0.08 parts of a catalyst, 0.1 to 0.3 parts of an activator, 30 to 40 parts of mixed benzene, and 40 to 45 parts of ethyl ester.

[0007] In one embodiment, the receiving layer has a thickness of 40 micrometers to 100 micrometers.

[0008] In one embodiment, the thickness of the release layer is 1 micrometer to 3 micrometers.

[0009] In one embodiment, the receiving layer includes the following components in parts by weight: 45 to 55 parts of atactic polypropylene, 10 to 20 parts of cotactic polypropylene, 25 to 35 parts of isotactic polypropylene, 0.5 to 0.9 parts of diethyl phthalate and 0.5 to 1.5 parts of alkylphenol.

[0010] In one embodiment, the crosslinking agent includes the following components in parts by weight: 50 to 70 parts of vinyl triacyloxysilane and 30 to 50 parts of glycidyloxypropyl trimethoxysilane.

[0011] In one embodiment, the catalyst comprises the following components in parts by weight: 70 to 90 parts of vinyl-1.1.3.3-tetramethyldisiloxane and 15 to 20 parts of 1.3-divinyl-1.1.3.3-tetramethyldisiloxane.

[0012] In one embodiment, the activator comprises the following components in parts by weight: 40 to 60 parts of n-heptane and 40 to 60 parts of isopropanol.

[0013] A production process of a high temperature resistant protective film, the process is used to produce the high temperature resistant protective film described in any of the above embodiments, the process comprises the following steps:

[0014] Equipment preheating step: preheat the blow molding machine for 1 to 2 hours;

[0015] The step of stirring the raw materials of the bearing layer: mixing and stirring the raw materials of the bearing layer evenly;

[0016] Plasticizing and extruding step: placing the raw material of the bearing layer into a blow molding machine, the blow molding machine heats and liquefies the raw material of the bearing layer, and squeezes the liquefied raw material of the bearing layer into a mold;

[0017] The step of stretching the bearing layer: after longitudinally stretching the bearing layer in the mold, coating the release layer on both sides of the bearing layer and then stretching it transversely to obtain a bearing layer with a fixed shape;

[0018] Cooling step: cooling the bearing layer by water circulation;

[0019] Cutting step: Cut the cooled carrier layer into pieces and then package them.

[0020] In one of the embodiments, in the equipment preheating step, the blow molding machine is debugged after preheating to adapt to production needs.

[0021] In one embodiment, in the slitting step, the thickness of the cooled support layer is measured, and then the layer is pulled and rolled up before slitting.

[0022] The above-mentioned high temperature resistant protective film has low shrinkage, good wrinkle resistance, is not easy to wrinkle, and has good flatness. Secondly, the above-mentioned high temperature resistant protective film has low density and light texture. In addition, the above-mentioned high temperature resistant protective film has good high temperature resistance, high melting point, and is not easy to deform when exposed to high temperature. In addition, the above-mentioned high temperature resistant protective film has good flexibility and good buffering and pressure resistance, and can provide good protection for PCB. In particular, the above-mentioned high temperature resistant protective film has excellent tearing effect, no residue after tearing, and will not cause pollution to PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a high temperature resistant protective film in one embodiment;

[0024] Figure 2 The figure is a flow chart of a production process of a high temperature resistant protective film in one embodiment. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purpose, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth so as to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or position relationship shown in the accompanying drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0030] See also Figure 1 The present invention provides a high temperature resistant protective film 10, which includes a receiving layer 100 and two release layers 200. In this embodiment, the thickness of the receiving layer 100 is 40 microns to 100 microns. The receiving layer 100 is arranged between the two release layers 200, and each release layer 200 is connected to one side of the receiving layer 100. The thickness of the release layer 200 is 1 micron to 3 microns.

[0031] The release layer 200 includes the following components in parts by weight: 18 to 25 parts of silicone oil, 0.05 to 0.15 parts of a cross-linking agent, 0.04 to 0.08 parts of a catalyst, 0.1 to 0.3 parts of an activator, 30 to 40 parts of mixed benzene, and 40 to 45 parts of ethyl ester. The release layer 200 composed of the above components has no residue after being torn off, and will not cause pollution to the PCB 20.

[0032] In order to increase the structural stability and high temperature resistance of the high temperature resistant protective film 10, in one embodiment, the receiving layer 100 includes the following components in parts by weight: 45 to 55 parts of atactic polypropylene, 10 to 20 parts of co-tactic polypropylene, 25 to 35 parts of isotactic polypropylene, 0.5 to 0.9 parts of diethyl phthalate, and 0.5 to 1.5 parts of alkylphenol. The receiving layer 100 composed of the above components has high structural strength, good flexibility, good buffering and compression resistance, good high temperature performance, high melting point, and is not easy to deform when exposed to high temperature.

[0033] In order to increase the stability of the combination of the components in the release layer 200, the crosslinking agent includes the following components in parts by weight: 50 to 70 parts of vinyl triacyloxysilane and 30 to 50 parts of glycidyl ether oxypropyl trimethoxysilane. The crosslinking agent composed of the above components can increase the stability of the combination of the components in the release layer 200.

[0034] In order to increase the production efficiency of the release layer 200, the catalyst includes the following components in parts by weight: 70 to 90 parts of vinyl-1.1.3.3-tetramethyldisiloxane and 15 to 20 parts of 1.3-divinyl-1.1.3.3-tetramethyldisiloxane. The catalyst composed of the above components can increase the chemical reaction speed between the components of the release layer 200, thereby increasing the production efficiency of the release layer 200.

[0035] In order to increase the curing speed of the release layer 200, the activator includes the following components in parts by weight: 40 to 60 parts of n-heptane and 40 to 60 parts of isopropanol. The activator composed of the above components increases the curing speed of the release layer 200, thereby increasing the production efficiency of the release layer 200.

[0036] The above-mentioned high temperature resistant protective film 10 has low shrinkage, good wrinkle resistance, is not easy to wrinkle, and has good flatness. Secondly, the above-mentioned high temperature resistant protective film 10 has a low density and a light texture. In addition, the above-mentioned high temperature resistant protective film 10 has good high temperature resistance, a high melting point, and is not easy to deform when exposed to high temperature. In addition, the above-mentioned high temperature resistant protective film 10 has good flexibility and good buffering and pressure resistance, and can provide good protection for the PCB. In particular, the above-mentioned high temperature resistant protective film 10 has an excellent tearing effect, and there is no residue after tearing, and it will not cause pollution to the PCB.

[0037] See also Figure 2 The present invention also provides a production process for a high temperature resistant protective film, the process is used to produce the high temperature resistant protective film described in any of the above embodiments, the process comprises the following steps:

[0038] Step 101: Equipment preheating step: preheat the blow molding machine for 1 to 2 hours.

[0039] Specifically, the core components of the blow molding machine, such as the screw and the mold, are heated for 90 minutes. In one embodiment, the blow molding machine is debugged after preheating to meet production needs.

[0040] Step 102: Carrying layer raw material stirring step: Mixing and stirring the carrying layer raw materials evenly.

[0041] Specifically, the raw materials of the supporting layer are mixed and stirred evenly in a stirrer. The raw materials of the supporting layer include the following components in parts by weight: 45 to 55 parts of atactic polypropylene, 10 to 20 parts of eutectic polypropylene, 25 to 35 parts of isotactic polypropylene, 0.5 to 0.9 parts of diethyl phthalate, and 0.5 to 1.5 parts of alkylphenol.

[0042] Step 103: Plasticizing and extruding step: the bearing layer raw material is placed in a blow molding machine, the blow molding machine heats and liquefies the bearing layer raw material, and squeezes the liquefied bearing layer raw material into a mold.

[0043] Specifically, the raw material of the bearing layer is put into a blow molding machine, and the preheated blow molding machine heats and liquefies the raw material of the bearing layer, and squeezes the liquefied raw material of the bearing layer into a mold.

[0044] Step 104: Carrying layer stretching step: After the carrying layer in the mold is longitudinally stretched, a release layer is coated on both sides of the carrying layer and then transversely stretched to obtain a carrying layer with a fixed shape.

[0045] Specifically, after the bearing layer in the mold is longitudinally stretched, a release layer is coated on both sides of the bearing layer and then transversely stretched to obtain a bearing layer with a fixed shape. The release layer includes the following components in parts by mass: 18 to 25 parts of silicone oil, 0.05 to 0.15 parts of a cross-linking agent, 0.04 to 0.08 parts of a catalyst, 0.1 to 0.3 parts of an activator, 30 to 40 parts of mixed benzene, and 40 to 45 parts of ethyl ester. The cross-linking agent includes the following components in parts by mass: 50 to 70 parts of vinyl triacyloxysilane, 30 to 50 parts of glycidyl ether oxypropyl trimethoxysilane. The catalyst includes the following components in parts by mass: 70 to 90 parts of vinyl-1.1.3.3-tetramethyldisiloxane, and 15 to 20 parts of 1.3-divinyl-1.1.3.3-tetramethyldisiloxane. The activator comprises the following components in parts by weight: 40 to 60 parts of n-heptane and 40 to 60 parts of isopropanol.

[0046] Step 105: Cooling step: cooling the bearing layer by water circulation.

[0047] Specifically, the bearing layer is cooled by water circulation so that the bearing layer is cooled, solidified and shaped.

[0048] Step 106: Cutting step: Cut the cooled support layer and then package it.

[0049] Specifically, according to production needs, the cooled bearing layer is cut and then packaged. In this embodiment, the cooled bearing layer is measured for thickness, then pulled and rolled up, and then cut.

[0050] The production process of the above-mentioned high temperature resistant protective film is concise and exquisite. The high temperature resistant protective film obtained according to the production process of the above-mentioned high temperature resistant protective film has low shrinkage, good wrinkle resistance, is not easy to wrinkle, and has good flatness. Secondly, the density of the above-mentioned high temperature resistant protective film is low and the texture is light. In addition, the above-mentioned high temperature resistant protective film has good high temperature resistance, high melting point, and is not easy to deform when exposed to high temperature. In addition, the above-mentioned high temperature resistant protective film has good flexibility and good buffering and compression resistance, and can provide good protection for the PCB. In particular, the above-mentioned high temperature resistant protective film has an excellent tearing effect, and there is no residue after tearing, and it will not cause pollution to the PCB.

[0051] The average results of the performance test of 1,000 pieces of high temperature resistant protective film are shown in the following table:

[0052]

[0053] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A high temperature resistant protective film, characterized in that: It comprises a receiving layer and two release layers; the receiving layer is arranged between the two release layers, and each release layer is connected to one side of the receiving layer; The release layer comprises the following components in parts by weight: 18 to 25 parts of silicone oil, 0.05 to 0.15 parts of a cross-linking agent, 0.04 to 0.08 parts of a catalyst, 0.1 to 0.3 parts of an activator, 30 to 40 parts of mixed benzene, and 40 to 45 parts of ethyl ester; The crosslinking agent includes the following components in parts by weight: 50 to 70 parts of vinyl triacyloxysilane and 30 to 50 parts of glycidyl ether oxypropyl trimethoxysilane; The receiving layer comprises the following components in parts by weight: 45 to 55 parts of atactic polypropylene, 10 to 20 parts of tactic polypropylene, 25 to 35 parts of isotactic polypropylene, 0.5 to 0.9 parts of diethyl phthalate and 0.5 to 1.5 parts of alkylphenol.

2. The high temperature resistant protective film according to claim 1, characterized in that: The receiving layer has a thickness of 40 micrometers to 100 micrometers.

3. The high temperature resistant protective film according to claim 1, characterized in that: The thickness of the release layer is 1 micron to 3 microns.

4. The high temperature resistant protective film according to claim 1, characterized in that: The catalyst comprises the following components in parts by weight: 70 to 90 parts of vinyl-1.1.3.3-tetramethyldisiloxane and 15 to 20 parts of 1.3-divinyl-1.1.3.3-tetramethyldisiloxane.

5. The high temperature resistant protective film according to claim 1, characterized in that: The activator comprises the following components in parts by weight: 40 to 60 parts of n-heptane and 40 to 60 parts of isopropanol.

6. A production process for a high temperature resistant protective film, characterized in that: The process is used to produce the high temperature resistant protective film described in any one of claims 1 to 5 above, and the process comprises the following steps: Equipment preheating step: preheat the blow molding machine for 1 to 2 hours; The step of stirring the raw materials of the bearing layer: mixing and stirring the raw materials of the bearing layer evenly; Plasticizing and extruding step: placing the raw material of the bearing layer into a blow molding machine, the blow molding machine heats and liquefies the raw material of the bearing layer, and squeezes the liquefied raw material of the bearing layer into a mold; The step of stretching the bearing layer: after longitudinally stretching the bearing layer in the mold, coating the release layer on both sides of the bearing layer and then stretching it transversely to obtain a bearing layer with a fixed shape; Cooling step: cooling the bearing layer by water circulation; Cutting step: Cut the cooled carrier layer and then package it.

7. The production process of the high temperature resistant protective film according to claim 6, characterized in that: In the equipment preheating step, the blow molding machine is debugged after preheating to adapt to production needs.

8. The production process of the high temperature resistant protective film according to claim 6, characterized in that: In the slitting step, the thickness of the cooled bearing layer is measured, and then the layer is pulled and rolled up before slitting.

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