A coating device suitable for production of wafers of various specifications

Abstract

The application belongs to the technical field of semiconductor processing, and discloses a coating equipment suitable for production of wafers of various specifications, which comprises a support column and a base, the top of the base is provided with a liquid discharge opening and is provided with a plurality of material boxes, the top of the base is fixedly provided with two groups of transfer frames, the front of the transfer frame is provided with a motor one, the outer surface of the output shaft of the motor one is fixedly provided with a cam, and a rotator is movably connected to the cam, and the two ends of the rotator are fixedly provided with placing rings. The device uses a micro air pump to generate negative pressure to adsorb the wafer, and when the cam is rotated by the motor one, the elastic force generated by the fully compressed spring three is used to keep the sealing column from moving upward, so that the wafer to be adsorbed and the next group of wafers to be loaded can have a certain distance, which is helpful for transferring and processing wafers of different specifications.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, specifically a coating equipment adapted to the production of wafers of various specifications. Background Technology

[0002] Before semiconductor wafers undergo packaging, they need to be diced to obtain the final product dimensions. Before dicing, to modify the surface condition of the wafer, such as cleanliness, tension, and adhesion, and to prevent breakage or damage during dicing, a coating liquid needs to be applied to the wafer surface, followed by removal of the coating liquid with a cleaning solution. In the prior art, patent CN202120040770.4 discloses an automatic coating and cleaning device for wafer carrier rings, which integrates wafer coating and cleaning into one machine, achieving high efficiency in the wafer processing. However, it uses a lifting and transfer method for wafer transfer, which cannot handle multiple wafers of different specifications. At the same time, both sides of the wafer cannot be processed at once, and its efficiency needs to be improved. Therefore, this invention aims to optimize and improve the above-mentioned defects and redesign a coating equipment suitable for the production of wafers of various specifications. Summary of the Invention

[0003] The purpose of this invention is to provide a coating equipment that can be adapted to the production of wafers of various specifications, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a coating equipment for wafer production of various specifications, comprising a support column and a base, wherein the top of the base is provided with a drain port and multiple sets of material boxes are installed, and two sets of transfer frames are fixedly installed on the top of the base, a motor is installed on the front of the transfer frame, a cam is fixedly installed on the outer surface of the output shaft of the motor and a rotary device is movably sleeved thereon, and a placement ring is fixedly installed at both ends of the rotary device, wherein a spring three, a limiting block one and a limiting block two are provided inside the placement ring, and connecting blocks are fixedly connected to the front and rear sides of the outer surface of the output shaft of the motor one, wherein the connecting blocks are located inside the placement ring and abut against the limiting block one, and one side of the connecting block is elastically connected to the limiting block two through the spring three;

[0005] The rotary device is composed of an inner ring and an outer ring. A sealing column is movably fitted inside the rotary device. A spring is movably fitted on the outer surface of the sealing column. A sealing sleeve is fixedly fitted at the bottom of the outer ring. A miniature air pump is also installed inside the outer ring. An exhaust groove and an air inlet groove are respectively opened inside the outer ring. The air inlet groove and the exhaust groove are respectively connected to the air inlet and air outlet of the miniature air pump. A pressure relief port is also opened on the inner wall of the exhaust groove. A negative pressure port is opened on the outer surface of the sealing column. A suction cup is movably fitted at the bottom of the sealing column.

[0006] As a preferred embodiment of the present invention, a coating and cleaning mechanism is fixedly installed on the top of the transfer frame. The coating and cleaning mechanism includes a top frame, a second motor is fixedly installed on the top of the top frame, the output shaft of the second motor is fixedly connected to a liquid storage tank, an inlet is installed on the top of the liquid storage tank, multiple sets of nozzles are fixedly connected to the bottom of the liquid storage tank, and a water storage chamber and a liquid storage chamber are respectively opened inside the liquid storage tank.

[0007] The top of the inner walls of the water storage chamber and the liquid storage chamber are fixedly connected to a fixing plate. A sealing plate is movably engaged with the inner wall of the water storage chamber. A set of springs is elastically connected between the side of the sealing plate and a set of fixing plates. Multiple openings are provided on the top of the sealing plate. A second sealing plate is movably engaged with the inner wall of the liquid storage chamber. Multiple openings are provided on the top of the second sealing plate. Another set of springs is elastically connected between the side of the second sealing plate and another set of fixing plates.

[0008] As a preferred embodiment of the present invention, the number of nozzles is six groups, which are evenly distributed and connected at the bottom of the water storage chamber and the liquid storage chamber. The first opening is completely offset from the three groups of nozzles on the left side and the distance is L1. The second opening is completely offset from the three groups of nozzles on the right side and the distance is L2. L1 is less than L2.

[0009] As a preferred embodiment of the present invention, the sealing sleeve is made of rubber block and is press-fitted with the outer surface of the sealing column. The negative pressure port is set on the same side as the outlet of the exhaust groove and the air inlet groove, and the negative pressure port is lower than the exhaust groove and higher than the air inlet groove.

[0010] As a preferred embodiment of the present invention, a limiting ring is fixedly sleeved on the bottom of the outer surface of the sealing column, and a rubber ring located below the limiting ring is also fixedly sleeved on the outer surface of the sealing column. A groove is provided on the inner wall of the suction cup, and the rubber ring and the groove are sealed together.

[0011] As a preferred embodiment of the present invention, the bottom of the inner ring is provided with a groove, the cross-sectional shape of the sealing column is "T" shaped, the two ends of the second spring are elastically connected to the sealing column and the groove respectively, and the distance between the non-protruding side of the outer surface of the cam and the top of the sealing column is equal to the distance between the negative pressure port and the exhaust groove outlet.

[0012] As a preferred embodiment of the present invention, a fixing block is fixedly connected to the side of the left transfer frame, and a telescopic rod two is fixedly installed on the side of the right transfer frame. The telescopic end of the telescopic rod two is fixedly connected to a movable block. Two sets of limiting plates are fixedly connected to the outer surface of the rotary device, and one set abuts against the fixing block, so that the maximum rotation angle of the rotary device in the two rotation directions is 180°.

[0013] As a preferred embodiment of the present invention, the rotator located on the right side has a 90° angle with the rotator on the left side, and the movable block abuts against the rotator located on the right side, so that it can move or cannot move.

[0014] As a preferred embodiment of the present invention, the material bins are configured as two sets and symmetrically distributed on the left and right sides of the top of the base. A telescopic rod is installed at the bottom of the material bin, and the telescopic end of the telescopic rod extends into the inner cavity of the material bin and is fixedly connected to a top plate. The material bins on the left and right sides are used for feeding and discharging materials, respectively.

[0015] The beneficial effects of this invention are as follows:

[0016] 1. This device can perform continuous double-sided coating, cleaning, and transfer operations on wafers in one operation, greatly improving the equipment's efficiency. Two identical transfer racks are arranged side-by-side, with the right-side transfer rack rotating 90° clockwise relative to the left-side rack. During processing, motor one drives the connecting block to rotate inside the placement ring, and the spring force of spring three creates rotational space, simultaneously rotating the placement ring and the rotary unit. A fixed block limits the position of the limiting plate, maintaining the vertical position of the suction cup when the rotary unit rotates it to its lowest point. This is achieved through the interaction between limiting block one and limiting block two. The rotation space with an angle greater than 180° allows the motor to drive the cam to continue rotating even when the entire rotary unit is limited and cannot rotate. It applies downward pressure to the sealing column, causing the negative pressure port to move to the position where it coincides with the air inlet slot. The micro air pump generates negative pressure to adsorb the wafer. Then, when the motor drives the cam to rotate, the rebound force generated by the fully compressed spring keeps the sealing column from moving upward as it resets. The entire rotary unit does not move immediately, thus maintaining a certain distance between the adsorbed and fixed wafer and the next set of wafers to be loaded. This facilitates the transfer and processing of wafers of different specifications.

[0017] 2. The coating and cleaning mechanism enables simple and quick simultaneous coating and water cleaning. When the wafer is rotated to its highest point by the rotary head, motor 2 is started and drives the liquid storage tank to rotate. By setting sealing plate 1 in the inner cavity of the water storage chamber and sealing plate 2 in the inner cavity of the liquid storage chamber, the nozzle is automatically sealed under the elastic contact of the fixing plate and spring 1. Since the distance between the nozzle and the two openings is completely offset from each other, the centrifugal force generated by the rotation of motor 2 can be used to control the openings 1 and 2 to overlap with multiple sets of nozzles on the left and right sides, realizing coating processing first and cleaning finishing. The overall structure is simple, safe and reliable.

[0018] 3. Finally, the transfer frame on the right side is further improved. The original mounting position of the fixed block is replaced with a telescopic rod two, which extends and retracts to drive the movable block. By controlling whether the movable block abuts against the outer surface of the rotary device, the rotary device moves the suction cup to the left horizontal position. The rotary device, which is abutted by the movable block and cannot rotate at this time, fixes the position of the suction cup. Then, the motor one drives the cam to rotate and pushes the suction cup to the left, abutting against the wafer on the left side. The gap between the sealing column and the cam pushes the suction cup, so that the suction cup on the left side loses its negative pressure suction when the negative pressure port coincides with the telescopic rod two. At the same time, the negative pressure port on the right side coincides with the air inlet groove, and negative pressure suction is generated under the action of the micro air pump, fixing the wafer. At this time, the wafer, which has been fixed by two sets of suction cups, has changed one side and is processed on the other side. Compared with traditional technology, this equipment can process both sides of the wafer at one time, and its efficiency is self-evident. Attached Figure Description

[0019] Figure 1 This is a front view of the structure of the present invention;

[0020] Figure 2 This is a three-dimensional schematic diagram of the internal structure of the present invention;

[0021] Figure 3 For the present invention Figure 2 Enlarged schematic diagram of the structure at point A;

[0022] Figure 4 This is a partial cross-sectional view of the front of the structure of the present invention;

[0023] Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure at point B;

[0024] Figure 6 For the present invention Figure 4 Enlarged schematic diagram of the structure at point C;

[0025] Figure 7 This is a schematic diagram showing the separation of the coating and cleaning mechanism of the present invention;

[0026] Figure 8 This is a schematic diagram showing the separation of the motor, cam, rotary device, limiting block, sealing column, connecting block, placement ring, spring, limiting block one, and limiting block two of the present invention.

[0027] Figure 9 This is a schematic diagram showing the separation of the motor, cam, sealing column, limiting ring, suction cup, spring 2, placement ring, and spring 3 of the present invention.

[0028] In the diagram: 1. Support column; 2. Base; 3. Transfer frame; 4. Motor 1; 5. Coating and cleaning mechanism; 51. Top frame; 52. Motor 2; 53. Liquid storage tank; 54. Nozzle; 55. Liquid inlet; 56. Water storage chamber; 57. Liquid storage chamber; 58. Fixing plate; 59. Sealing plate 1; 510. Through-hole 1; 511. Sealing plate 2; 512. Through-hole 2; 513. Spring 1; 6. Material box; 7. Telescopic rod 1; 8. Top material plate; 9. Drain outlet; 10. Cam; 11. Rotary head; 12. Limiting plate; 13. Fixing block; 14. Sealing column; 141. Rubber ring; 142. Negative pressure port; 15. Limiting ring; 16. Suction cup; 161. Slot; 17. Pressure relief port; 18. Spring 2; 19. Sealing sleeve; 20. Connecting block; 21. Placement ring; 22. Spring 3; 23. Limiting block 1; 24. Limiting block 2; 25. Miniature air pump; 26. Exhaust groove; 27. Inlet groove; 28. Telescopic rod 2; 29. ​​Movable block. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1 to 9 As shown, this embodiment of the invention provides a coating equipment for wafer production of various specifications, including a support column 1 and a base 2. The top of the base 2 is provided with a drain port 9 and multiple sets of material boxes 6 are installed. Two sets of transfer frames 3 are fixedly installed on the top of the base 2. A motor 4 is installed on the front of the transfer frame 3. A cam 10 is fixedly installed on the outer surface of the output shaft of the motor 4 and a rotary device 11 is movably sleeved thereon. Placement rings 21 are fixedly installed at both ends of the rotary device 11. A spring 3 22, a limiting block 1 23 and a limiting block 24 are provided inside the placement ring 21. Connecting blocks 20 are fixedly connected to the front and rear sides of the outer surface of the output shaft of the motor 4. The connecting blocks 20 are located inside the placement ring 21 and abut against the limiting block 1 23. One side of the connecting block 20 is elastically connected to the limiting block 24 through the spring 3 22.

[0031] The rotary device 11 is composed of an inner ring and an outer ring. A sealing column 14 is movably sleeved inside the rotary device 11. A spring 18 is movably sleeved on the outer surface of the sealing column 14. A sealing sleeve 19 is fixedly sleeved at the bottom of the outer ring. A miniature air pump 25 is also installed inside the outer ring. An exhaust groove 26 and an air inlet groove 27 are respectively opened inside the outer ring. The air inlet groove 27 and the exhaust groove 26 are respectively connected to the air inlet and air outlet of the miniature air pump 25. A pressure relief port 17 is also opened on the inner wall of the exhaust groove 26. A negative pressure port 142 is opened on the outer surface of the sealing column 14. A suction cup 16 is movably sleeved at the bottom of the sealing column 14.

[0032] This device can perform continuous double-sided coating, cleaning, and transfer operations on wafers in one operation, greatly improving the equipment's efficiency. Two identical transfer racks 3 are arranged side-by-side, with the right-side transfer rack 3 rotating 90° clockwise relative to the left-side transfer rack 3. During processing, motor 4 drives the connecting block 20 to rotate inside the placement ring 21, and the spring force of spring 22 creates rotational space, simultaneously rotating the placement ring 21 and the rotary actuator 11 as a whole. The fixing block 13 limits the position of the limiting plate 12, and maintains the vertical position of the suction cup 16 when the rotary actuator 11 rotates it to its lowest point. Limiting blocks 23 and 24 further ensure this verticality. The rotation space with an angle greater than 180° between them allows the motor 4 to drive the cam 10 to continue rotating even when the rotary unit 11 is restricted from rotating. This applies downward pressure to the sealing column 14, causing the negative pressure port 142 to move to the position where it coincides with the air inlet groove 27. The micro air pump 25 generates negative pressure to adsorb the wafer. Then, when the motor 4 drives the cam 10 to rotate, the spring force generated by the fully compressed spring 22 keeps the sealing column 14 from moving upward as it resets. The rotary unit 11 does not move immediately, thus allowing a certain distance between the adsorbed and fixed wafer and the next set of wafers to be loaded. This facilitates the transfer and processing of wafers of different specifications.

[0033] The top of the transfer frame 3 is fixedly installed with a coating and cleaning mechanism 5. The coating and cleaning mechanism 5 includes a top frame 51. A second motor 52 is fixedly installed on the top of the top frame 51. The output shaft of the second motor 52 is fixedly connected to a liquid storage tank 53. An inlet 55 is installed on the top of the liquid storage tank 53. Multiple sets of nozzles 54 are fixedly connected to the bottom of the liquid storage tank 53. The inside of the liquid storage tank 53 is respectively provided with a water storage chamber 56 and a liquid storage chamber 57.

[0034] The top of the inner walls of the water storage chamber 56 and the liquid storage chamber 57 are fixedly connected to a fixing plate 58. The inner wall of the water storage chamber 56 is movably engaged with a sealing plate 59. A set of springs 513 is elastically connected between the side of the sealing plate 59 and a set of fixing plates 58. Multiple sets of openings 510 are opened on the top of the sealing plate 59. The inner wall of the liquid storage chamber 57 is movably engaged with a sealing plate 511. Multiple sets of openings 512 are opened on the top of the sealing plate 511. Another set of springs 513 is elastically connected between the side of the sealing plate 511 and another set of fixing plates 58.

[0035] By incorporating a synchronized function for simple and quick coating and rinsing, when the wafer is rotated to its highest point by the rotary unit 11, the second motor 52 is activated, driving the liquid storage tank 53 to rotate. A sealing plate 59 is installed inside the water storage chamber 56, and a sealing plate 511 is installed inside the liquid storage chamber 57. Under the elastic contact of the fixing plate 58 and the first spring 513, the nozzle 54 is automatically sealed. Since the openings 512 and 510 are completely offset from the nozzle 54 by different distances, the centrifugal force generated by the rotation of the second motor 52 can be used to control the openings 510 and 512 to overlap with multiple sets of nozzles 54 on the left and right sides, achieving coating processing followed by rinsing. The overall structure is simple, safe, and reliable.

[0036] There are six sets of nozzles 54, which are evenly distributed and connected at the bottom of the water storage chamber 56 and the liquid storage chamber 57. The first opening 510 is completely offset from the three sets of nozzles 54 on the left side and the distance is L1. The second opening 512 is completely offset from the three sets of nozzles 54 on the right side and the distance is L2. L1 is less than L2.

[0037] When the liquid storage tank 53 rotates, the centrifugal force generated in the water storage chamber 56 and the liquid storage chamber 57 is the same. At this time, the distance that the sealing plate 511 and the sealing plate 59 move radially along the motor 52 is the same. However, the distance that the outlet 512 is offset from the nozzle 54 on the right is shorter. Therefore, when the coating liquid in the liquid storage chamber 57 is discharged through the nozzle 54, the outlet 510 is still offset from the nozzle 54. Only by increasing the speed of the motor 52 and increasing the centrifugal force can the sealing plate 59 continue to move and make the outlet 510 coincide with the nozzle 54 on the left, and drain the water to complete the cleaning operation. At this time, the outlet 512 is offset from the nozzle 54 on the right under the action of the continued movement of the sealing plate 511, so that only one liquid can be discharged from the liquid storage tank 53 at the same time. This can be achieved by controlling the speed of the motor 52.

[0038] The sealing sleeve 19 is made of rubber block and is press-fitted with the outer surface of the sealing column 14. The negative pressure port 142 is set on the same side as the outlet of the exhaust groove 26 and the air inlet groove 27, and the negative pressure port 142 is lower than the exhaust groove 26 and higher than the air inlet groove 27.

[0039] When motor 14 drives the sealing column 14 to continue moving via cam 10, causing the negative pressure port 142 to coincide with the air intake groove 27, a negative pressure can be generated in the inner cavity of the suction cup 16, which will adsorb and fix the wafer. When cam 10 rotates back to its original position, spring 2 18 drives the sealing column 14 to reset, and the negative pressure port 142 is misaligned with the air intake groove 27, but it is sealed by the inner wall of the sealing sleeve 19. The negative pressure generated inside the suction cup 16 still exists. Only when the external force on the right side of the suction cup 16 moves to the left and exerts pressure on the wafer, pushing the left side of the suction cup 16 to move towards the axis of cam 10, will the sealing column 14 just retract so that the negative pressure port 142 coincides with the exhaust groove 26, and it is connected to the outside through the pressure relief port 17, so that the negative pressure inside the sealing column 14 and the suction cup 16 disappears, and the wafer can be released from fixation.

[0040] Among them, a limiting ring 15 is fixedly sleeved on the bottom of the outer surface of the sealing column 14, and a rubber ring 141 located below the limiting ring 15 is also fixedly sleeved on the outer surface of the sealing column 14. A groove 161 is opened on the inner wall of the suction cup 16, and the rubber ring 141 and the groove 161 are sealed together.

[0041] The limiting ring 15 is used to limit the suction cup 16, providing an accurate installation position for the suction cup 16 when it is installed in place. The serrated structure of the slot 161 and the rubber ring 141 facilitates the installation and quick disassembly of the suction cup 165.

[0042] Among them, the bottom of the inner ring is provided with a groove, the cross-sectional shape of the sealing column 14 is "T" shaped, the two ends of the spring 18 are elastically connected to the sealing column 14 and the groove respectively, and the distance between the non-protruding side of the outer surface of the cam 10 and the top of the sealing column 14 is equal to the distance between the negative pressure port 142 and the outlet of the exhaust groove 26.

[0043] Spring 18 is used for the reset and elastic support of the sealing column 14, which can make the top of the sealing column 14 and the outer surface of the cam 10 a certain distance in the initial stage.

[0044] Among them, a fixed block 13 is fixedly connected to the side of the left transfer frame 3, and a telescopic rod 28 is fixedly installed on the side of the right transfer frame 3. The telescopic end of the telescopic rod 28 is fixedly connected to a movable block 29. Two sets of limiting plates 12 are fixedly connected to the outer surface of the rotary device 11, and one set abuts against the fixed block 13, so that the maximum rotation angle of the rotary device 11 in the two rotation directions is 180°.

[0045] Further improvements were made to the transfer frame 3 located on the right side. A telescopic rod 28 was installed at the original position of the fixing block 13, which in turn moved the movable block 29. By controlling whether the movable block 29 abutted against the outer surface of the rotary device 11, the rotary device 11 was controlled to move the suction cup 16 to the left horizontal position. The position of the suction cup 16 was fixed by the rotary device 11, which was abutted against by the movable block 29 and could not rotate. Then, the motor 4 drove the cam 10 to rotate and pushed the suction cup 16 to move to the left and abut against the wafer located on the left side. The gap between the sealing column 14 and the cam 10 pushed the suction cup 16, so that the suction cup 16 located on the left side lost its negative pressure suction when the negative pressure port 142 coincided with the telescopic rod 28. At the same time, the negative pressure port 142 located on the right side coincided with the air inlet groove 27 and generated negative pressure suction under the action of the micro air pump 25, and fixed the wafer. At this time, the wafer fixed by the two sets of suction cups 16 had just changed to another side and was processed on the other side.

[0046] Among them, the right rotary device 11 has a 90° angle with the left rotary device 11, and the movable block 29 abuts against the right rotary device 11, so that it can move or cannot move.

[0047] The 90° angle between the two sets of transfer frames 3 and their mounting structure facilitates the fixing and conversion of the wafer, making it easier to process the other side of the wafer.

[0048] Among them, the material box 6 is set in two sets and symmetrically distributed on the left and right sides of the top of the base 2. The bottom of the material box 6 is equipped with a telescopic rod 7. The telescopic end of the telescopic rod 7 extends into the inner cavity of the material box 6 and is fixedly connected to the top plate 8. The left and right material boxes 6 are used for feeding and discharging respectively.

[0049] Multiple sets of wafers are stacked inside the material bin 6 on the left. The top plate 8 is driven to move upward by the telescopic rod 7, realizing the automated function of feeding wafers upward.

[0050] Working principle:

[0051] When the device is working, water is added into the water storage chamber 56 through the liquid inlet 55, and coating liquid is added into the liquid storage chamber 57. The wafer to be coated is loaded into the material box 6 located on the left side, driven by the telescopic rod 7, which in turn drives the top plate 8 to push the wafer upward.

[0052] The wafer undergoes coating and cleaning on one side using the transfer rack 3 and coating and cleaning unit 5 located on the left.

[0053] Wafer loading in one pass: Start motor 4 drives cam 10, connecting block 20, and spring 3 22 to rotate clockwise. Spring 3 22 is compressed, generating a rebound force. Simultaneously, its other end acts on limit block 24, driving placement ring 21 and rotary device 11 to rotate. When the rotation reaches... Figure 1In the state shown, a set of limiting plates 12 on the outer surface of the rotary device 11 are limited by the fixing block 13, and the rotary device 11 as a whole no longer rotates. The axes of the sealing column 14, the limiting ring 15, and the suction cup 16 are vertical. The motor 1 4 drives the cam 10 and the connecting block 20 to continue rotating, continuously compressing the spring 3 22 while driving the cam 10 to rotate to about 180° relative to the initial position, and pushing the sealing column 14 downward, compressing the spring 2 18, and driving the limiting ring 15 and the suction cup 16 to move downward. When the bottom of the suction cup 16 abuts against the wafer, the negative pressure port 142 drops to the height that coincides with the air inlet groove 27. The micro air pump 25 is turned on and generates negative pressure, firmly adsorbing the wafer to the bottom of the suction cup 16.

[0054] Wafer primary processing (including coating and cleaning): Motor 4 drives cam 10 and connecting block 20 to reverse. Cam 10 begins to reset and gradually disengages from the top of sealing post 14, causing sealing post 14 to gradually reset upward under the restoring force of spring 18. When negative pressure port 142 and air inlet groove 27 disengage, they are sealed by sealing sleeve 19. At this time, the wafer is firmly adsorbed on the bottom of suction cup 16. When motor 4 drives connecting block 20 to rotate to the position of abutting against limit block 23, the placement ring 21 drives the rotary unit 11 to rotate and reset as a whole, and drives the wafer to rotate upward to the top. With the round side facing the bottom of the nozzle 54, the motor 52 is started and the liquid storage tank 53 is rotated, generating centrifugal force in the inner cavity of the liquid storage chamber 57, which in turn moves the sealing plate 511, so that the port 512 coincides with the nozzle 54 located at its bottom. The coating liquid then falls onto the wafer surface. After coating is completed, the speed of the motor 52 can be increased to increase the centrifugal force, which drives the sealing plate 511 and the sealing plate 59 to continue moving radially along the top frame 51. At this time, the port 510 is connected to the nozzle 54 located at its bottom, and the nozzle 54 sprays water downwards to clean the wafer surface.

[0055] At this time, motor 4 reverses again, driving rotary 11, limit ring 15, suction cup 16 and wafer to rotate 90° clockwise;

[0056] The other side of the wafer is coated and cleaned by the transfer rack 3 and coating and cleaning unit 5 located on the right.

[0057] Secondary wafer loading: The telescopic rod 28 is activated, causing the movable block 29 to abut against the outer surface of the rotary unit 11, preventing it from rotating. The motor 4 on the right side is activated, causing the rotary unit 11, sealing column 14, and suction cup 16 to rotate 90° clockwise. Spring 22 is compressed more than 180°, causing the cam 10 to rotate and abut against the sealing column 14. This causes the sealing column 14 on the right side to move the suction cup 16 horizontally to the left. Upon contact with the wafer, the negative pressure port 142 coincides with the air inlet groove 27, generating negative pressure. During this process, the suction cup 16 on the right side continuously pushes the suction cup 16 on the left side to the left, causing the sealing column 14 on the left side to move to the left, and aligning the negative pressure port 142 on the left side with the suction cup 16. This causes the negative pressure on the suction cup 16 on the left to disappear, while the wafer is fixed to the suction cup 16 on the right. At this time, the other side of the wafer is exposed. Then, the movable block 29 is moved by the telescopic rod 28 to release the fixation on the rotary device 11 (Note: At this time, the movable block 29 can still limit the limiting plate 12 connected to the surface of the rotary device 11). At this time, the rotary device 11 can process the other side of the wafer as described above. The wafer is driven by the suction cup 16 to rotate 90° clockwise and reach the highest point. After the coating and cleaning operation of the coating and cleaning mechanism 5, it is driven by the rotary device 11 to rotate 180° counterclockwise. At this time, the wafer completes the coating and cleaning on both sides and falls onto the material box 6 on the right, completing the processing of both sides of the wafer.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coating equipment adaptable to the production of wafers of various specifications, comprising a support column (1) and a base (2), wherein the top of the base (2) is provided with a drain port (9) and multiple sets of material bins (6) are installed, characterized in that: Two sets of transfer frames (3) are fixedly installed on the top of the base (2). A motor (4) is installed on the front of the transfer frame (3). A cam (10) is fixedly installed on the outer surface of the output shaft of the motor (4) and a rotary device (11) is movably sleeved thereon. Placement rings (21) are fixedly installed at both ends of the rotary device (11). Spring three (22), limit block one (23) and limit block two (24) are provided inside the placement ring (21). Connecting blocks (20) are fixedly connected to the front and rear sides of the outer surface of the output shaft of the motor (4). The connecting blocks (20) are located inside the placement ring (21) and abut against the limit block one (23). One side of the connecting block (20) is elastically connected to the limit block two (24) through spring three (22). The rotary device (11) is composed of an inner ring and an outer ring. A sealing column (14) is movably sleeved inside the rotary device (11). A spring (18) is movably sleeved on the outer surface of the sealing column (14). A sealing sleeve (19) is fixedly sleeved at the bottom of the outer ring. A micro air pump (25) is also installed inside the outer ring. An exhaust groove (26) and an air inlet groove (27) are respectively opened inside the outer ring. The air inlet groove (27) and the exhaust groove (26) are respectively connected to the air inlet and air outlet of the micro air pump (25). A pressure relief port (17) is also opened on the inner wall of the exhaust groove (26). A negative pressure port (142) is opened on the outer surface of the sealing column (14). A suction cup (16) is movably sleeved at the bottom of the sealing column (14).

2. The coating equipment for producing wafers of various specifications according to claim 1, characterized in that: The top of the transfer frame (3) is fixedly installed with a coating and cleaning mechanism (5). The coating and cleaning mechanism (5) includes a top frame (51). The top of the top frame (51) is fixedly installed with a second motor (52). The output shaft of the second motor (52) is fixedly connected to a liquid storage tank (53). The top of the liquid storage tank (53) is installed with a liquid inlet (55). The bottom of the liquid storage tank (53) is fixedly connected with multiple sets of nozzles (54). The interior of the liquid storage tank (53) is respectively provided with a water storage chamber (56) and a liquid storage chamber (57). The top of the inner walls of the water storage chamber (56) and the liquid storage chamber (57) are fixedly connected to a fixing plate (58). The inner wall of the water storage chamber (56) is movably engaged with a sealing plate (59). The side of the sealing plate (59) is elastically connected to a set of fixing plates (58) with a set of springs (513). The top of the sealing plate (59) has multiple sets of openings (510). The inner wall of the liquid storage chamber (57) is movably engaged with a sealing plate (511). The top of the sealing plate (511) has multiple sets of openings (512). The side of the sealing plate (511) is elastically connected to another set of fixing plates (58) with another set of springs (513).

3. The coating equipment for producing wafers of various specifications according to claim 2, characterized in that: The number of nozzles (54) is six, and they are evenly distributed and connected at the bottom of the water storage chamber (56) and the liquid storage chamber (57). The first opening (510) is completely offset from the three sets of nozzles (54) on the left side and the distance is L1. The second opening (512) is completely offset from the three sets of nozzles (54) on the right side and the distance is L2. L1 is less than L2.

4. The coating equipment for producing wafers of various specifications according to claim 3, characterized in that: The sealing sleeve (19) is made of rubber block and is press-fitted to the outer surface of the sealing column (14). The negative pressure port (142) is set on the same side as the outlet of the exhaust groove (26) and the air inlet groove (27), and the negative pressure port (142) is lower than the exhaust groove (26) and higher than the air inlet groove (27).

5. A coating equipment for producing wafers of various specifications according to claim 4, characterized in that: A limiting ring (15) is fixedly sleeved on the bottom of the outer surface of the sealing column (14). A rubber ring (141) located below the limiting ring (15) is also fixedly sleeved on the outer surface of the sealing column (14). A slot (161) is opened on the inner wall of the suction cup (16). The rubber ring (141) and the slot (161) are sealed together.

6. A coating equipment for producing wafers of various specifications according to claim 5, characterized in that: The inner ring has a groove at the bottom, the sealing column (14) has a "T" shaped cross section, the two ends of the spring (18) are elastically connected to the sealing column (14) and the groove respectively, and the distance between the non-protruding side of the outer surface of the cam (10) and the top of the sealing column (14) is equal to the distance between the negative pressure port (142) and the outlet of the exhaust groove (26).

7. A coating equipment for producing wafers of various specifications according to claim 6, characterized in that: A fixing block (13) is fixedly connected to the side of the transfer frame (3) on the left side, and a telescopic rod (28) is fixedly installed on the side of the transfer frame (3) on the right side. A movable block (29) is fixedly connected to the telescopic end of the telescopic rod (28). Two sets of limiting plates (12) are fixedly connected to the outer surface of the rotary device (11), and one set abuts against the fixing block (13), so that the maximum rotation angle of the rotary device (11) in the two rotation directions is 180°.

8. A coating equipment for producing wafers of various specifications according to claim 7, characterized in that: The rotary device (11) located on the right side has a 90° angle relative to the rotary device (11) on the left side, and the movable block (29) abuts against the rotary device (11) located on the right side, making it movable or immovable.

9. A coating equipment for producing wafers of various specifications according to claim 8, characterized in that: The material bins (6) are set in two groups and symmetrically distributed on the left and right sides of the top of the base (2). A telescopic rod (7) is installed at the bottom of the material bins (6). The telescopic end of the telescopic rod (7) extends into the inner cavity of the material bins (6) and is fixedly connected to the top plate (8). The material bins (6) on the left and right sides are used for feeding and discharging materials, respectively.

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