A packaging detection device and detection process for defective semiconductor products

Abstract

The present invention discloses a packaging inspection device and a detection process for semiconductor defective products, belonging to the field of chip detection technology, comprising a packaging machine main body, a detection frame, a sorting mechanism, and an electromagnet mechanism. The present invention can immediately detect the packaging workpiece after packaging and degumming treatment, and ensure that the movement of the packaging workpiece will not be disturbed during the detection process by using the detection frame that is arranged obliquely as a whole. When the packaging workpiece arrives at the sorting mechanism, the quality of the packaging workpiece is independently judged by whether the sorting mechanism has a change in the motion state, and two packaging workpieces of different qualities are automatically sorted, thereby reducing the difficulty of personnel operation, effectively avoiding errors that may occur during manual detection, improving detection efficiency, and also ensuring the production quality of products, which can effectively prevent the occurrence of accidents in subsequent processes such as the collapse of rib cutting tools due to residual resin on the surface of the packaging workpiece.

Description

Technical Field

[0001] The present invention relates to the field of chip detection technology, and more specifically, to a packaging detection device and a detection process for defective semiconductor products. Background Art

[0002] Semiconductor packaging is the process of encapsulating a chip (semiconductor device) inside a housing to protect the chip from environmental factors such as mechanical damage, moisture, dust and chemicals, while providing connection pins for easy connection with external circuits.

[0003] In the semiconductor packaging process, packaging resin is used to fix and protect the chip. If too much resin is used in the packaging process or the operation is improper, the resin may overflow from the edge or interface of the packaging tool to the outer wall of the workpiece, forming residue. The residual resin on the surface of the mold used in the packaging process may also be transferred or left when it contacts the surface of the workpiece, which will have a serious impact on the subsequent use of the workpiece, such as thermal management problems and electrical performance problems. Resin residue may affect the thermal conductivity of semiconductor devices, causing the temperature of the device to rise during operation, resulting in changes in the electrical characteristics of the device surface, such as increased resistance, capacitance or inductance, which may affect the circuit performance and reliability of the device and shorten its life.

[0004] Therefore, the semi-finished workpieces that have been packaged need to go through a degumming process to remove the residual resin on the workpieces. Even so, there will still be resin residue on the surface of some workpieces. When manually inspecting the workpieces after the degumming process, since most of the workpieces are good products, it is time-consuming and laborious to find the workpieces with resin residue on the surface, and the inspection has a certain degree of difficulty. However, workpieces with resin residue on the surface are very likely to break the expensive micron-level rib cutting tools in the subsequent rib cutting process. Therefore, fast and accurate quality inspection of the packaged parts before the next process is the key to ensuring product production quality.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a packaging inspection device and inspection process for defective semiconductor products. Summary of the invention

[0006] The object of the present invention is to provide a packaging inspection device and inspection process for defective semiconductor products to solve the above-mentioned problems.

[0007] In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0008] A packaging inspection device for defective semiconductor products, a packaging machine main body and a detection frame, wherein a conveyor belt is arranged on the packaging machine main body, and the detection frame is fixedly connected to the side wall of the packaging machine main body, and the detection frame is provided with mutually connected guide slide grooves, assembly groove 1, assembly groove 2, superior product separation port and inferior product separation port, and the packaging machine main body controls the packaging workpiece to be transmitted from the conveyor belt in a timely and quantitative manner through a built-in program, and a sorting mechanism and a fixed plate are arranged in the assembly groove 1, and the sorting mechanism and the fixed plate are slidably connected, and a feedback mechanism is arranged on the sorting mechanism and the fixed plate, and an electromagnet mechanism and a sorting mechanism are arranged in the assembly groove 2, and the sorting mechanism is composed of a top plate, a bottom plate and a connecting rod, and an isolation membrane is fixedly connected between the top plate and the bottom plate, and the isolation membrane separates the top plate from the bottom plate The bottom plate is divided into a detection chamber and a slot, the specifications of the detection chamber slot body match the standard specifications of the thickness and size of the packaged workpiece, the isolation membrane is made of elastic material, and the isolation membrane is arranged in a long strip shape, a slide groove is opened at the lower end of the bottom plate, a fixed plate is slidably connected in the slide groove, the fixed plate includes a positioning part fixedly connected to an assembly groove and an embedded part located in the slide groove, a micro-compression spring 1 is fixedly connected between the embedded part and the inner wall of the slide groove, a feedback mechanism includes an electric contact 1 arranged on a side wall of the bottom plate close to the positioning part and an electric contact 2 arranged on a side wall of the positioning part close to the bottom plate, an electromagnet mechanism includes a fixed block and a movable block, a micro-compression spring 2 is fixedly connected between the fixed block and the movable block, and a push plate is fixedly connected to the end of the movable block away from the fixed block.

[0009] As a further improvement of the present invention, the upper surface of the guide groove, the lower bottom surface of the top plate, the upper surface of the bottom plate, and the upper surfaces of the positioning portion and the embedded portion are all coated with a smooth coating.

[0010] As a further improvement of the present invention, the opening width of the defective product separation port is equal to the sum of the lengths of the sorting mechanism and the packaged workpiece, and the defective product separation port is parallel to the upper surface of the bottom plate.

[0011] As a further improvement of the present invention, the fixed block and the movable block are both arranged parallel to the slot, and the push plate does not contact the sorting mechanism.

[0012] As a further improvement of the present invention, the push plate is configured to be conical, the push plate is made of rubber, and the length of the push plate is greater than the distance between the slot opening and the isolation membrane.

[0013] As a further improvement of the present invention, the fixed block is embedded with an electromagnet 1, and the movable block is embedded with an electromagnet 2.

[0014] As a further improvement of the present invention, the feedback mechanism and the electromagnet mechanism are connected through a microcontroller and a driver. When it is detected that electrical contact one is in contact with electrical contact two, the driver controls the electromagnet mechanism to start. After the fixed block and the movable block are energized, the movable block moves toward one end close to the sorting mechanism.

[0015] As a further improvement of the present invention, a packaging detection process for defective semiconductor products comprises the following steps:

[0016] S1. Determine process parameters: obtain standard parameter information of the encapsulated workpiece, the parameter information including thickness and size specifications, and formulate a corresponding sorting mechanism according to the parameter information of the encapsulated workpiece;

[0017] S2. Material sorting: The packaged workpieces after packaging and degumming are transported to the inspection rack in a timely and quantitative manner through the conveyor belt on the packaging machine body;

[0018] S3, quality inspection: The packaged workpiece slides to the sorting mechanism through the guide chute, and the movement state of the sorting mechanism is detected according to the feedback mechanism on the sorting mechanism and the fixed plate, so as to detect the quality of the packaged workpiece, and independently judge whether the quality of the packaged workpiece is qualified through the movement state of the sorting mechanism;

[0019] S4. Material sorting: The packaged workpieces judged as good quality products can pass through the inspection room at will and finally slide to the good quality material sorting port. The packaged workpieces judged as defective products will be intercepted and pushed to the defective material sorting port by the electromagnet mechanism.

[0020] The movement states of the sorting mechanism in step S3 include two kinds, which correspond to the two sorting modes in step S4. One of the movement states of the sorting mechanism is the inspection pass state, which is specifically manifested in that if there is no packaging resin attached to the surface of the packaged workpiece, the packaged workpiece will quickly slide along the inclined surface of the guide slide groove under the action of its own gravity, and then through the detection chamber and the fixed plate to the superior material distribution port. In this state, the upper end of the sorting mechanism will always fit with the top of the groove body of the assembly groove one. The other movement state of the sorting mechanism is the inspection abnormal state, which is specifically manifested in that if there is packaging resin attached to the surface of the packaged workpiece, the packaged workpiece will slide along the inclined surface of the guide slide groove and then through the detection chamber and the fixed plate to the superior material distribution port. The guide slide slides to the detection chamber and cannot completely enter the detection chamber. At this time, the sorting mechanism slides downward due to the gravity of the packaged workpiece, and the bottom plate squeezes the micro compression spring 1 until the electrical contact 1 on the bottom plate contacts the electrical contact 2 on the positioning part. The feedback mechanism drives the electromagnet mechanism to start, and in this state, the sorting mechanism is separated from the top of the slot body of the assembly slot 1. The packaged workpiece that has not completely entered the detection chamber will move to a position parallel to the defective product dispensing port, and the movable block drives the push plate to squeeze the isolation membrane to deform it, and finally the push plate pushes the packaged workpiece with the packaging resin attached to the surface to the defective product dispensing port.

[0021] Compared with the prior art, the advantages of the present invention are:

[0022] This solution can immediately inspect the packaged workpiece after packaging and degumming treatment. The overall obliquely arranged inspection frame ensures that the movement of the packaged workpiece will not be disturbed during the inspection process. When the packaged workpiece arrives at the sorting mechanism, the quality of the packaged workpiece is independently judged by whether the sorting mechanism has a change in motion state. Two packaged workpieces of different qualities are automatically sorted, which reduces the difficulty of personnel operation, effectively avoids possible errors in manual inspection, improves inspection efficiency, and also ensures the production quality of the product. It can effectively prevent accidents in subsequent processes such as damage to rib cutting tools due to residual resin on the surface of the packaged workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a packaging inspection device for defective semiconductor products provided by the present invention;

[0024] Figure 2 A schematic diagram of the structure of the detection frame provided by the present invention;

[0025] Figure 3 A three-dimensional cross-sectional schematic diagram of the detection frame provided by the present invention;

[0026] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0027] Figure 5 A structural schematic diagram comparing two kinds of motions of the sorting mechanism provided by the present invention;

[0028] Figure 6 This is a schematic diagram of the structure of the sorting mechanism provided by the present invention after the top plate is removed;

[0029] Figure 7 A schematic top view and cross-sectional view of the base plate and the fixing plate provided by the present invention;

[0030] Figure 8 The present invention provides a flow chart of the packaging detection process method for defective semiconductor products.

[0031] Description of the numbers in the figure:

[0032] 1. Packaging machine body; 101. Conveyor belt; 2. Inspection frame; 201. Guide slide; 202. Assembly slot one; 203. Assembly slot two; 204. Good product sorting port; 205. Bad product sorting port; 3. Packaging workpiece; 4. Sorting mechanism; 401. Top plate; 402. Bottom plate; 403. Connecting rod; 404. Isolation membrane; 405. Inspection chamber; 406. Slot; 407. Slide; 5. Fixed plate; 501. Positioning part; 502. Embedded part; 6. Micro compression spring one; 7. Electric contact one; 8. Electric contact two; 9. Fixed block; 10. Movable block; 11. Micro compression spring two; 12. Push plate. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0034] Example

[0035] See also Figure 1-8, a packaging inspection device and inspection process for semiconductor defective products, including a packaging machine body 1 and a detection frame 2, the packaging machine body 1 is provided with a conveyor belt 101, the packaging machine body 1 is provided with a degumming mechanism, the detection frame 2 is fixedly connected to the side wall of the packaging machine body 1, and the detection frame 2 is provided with a guide slide 201, an assembly groove 1 202, an assembly groove 203, a superior product separation port 204 and a defective product separation port 205 that are interconnected, the packaging machine body 1 controls the packaging workpiece 3 to be transmitted from the conveyor belt 101 at a fixed time and quantity through a built-in program, and the interval time is 8-10 seconds, the guide slide 201 is set to an inclined surface matching the size specification of the packaging workpiece 3, the assembly groove 1 202 is provided with a sorting mechanism 4 and a fixed plate 5, and the sorting mechanism 4 and the fixed plate 5 are slidably connected, and a feedback mechanism is set on the sorting mechanism 4 and the fixed plate 5, and the feedback mechanism includes an electric contact 1 7 set on a side wall of the bottom plate 402 close to the positioning part 501 and a contact 1 7 set on the positioning part 501 close to the bottom plate The electric contact 2 8 on the side wall of 402 is equipped with an electromagnet mechanism in the assembly groove 203. The electromagnet mechanism includes a fixed block 9 and a movable block 10. The fixed block 9 is embedded with an electromagnet 1, and the movable block 10 is embedded with an electromagnet 2. A micro-compression spring 2 11 is fixedly connected between the fixed block 9 and the movable block 10. The end of the movable block 10 away from the fixed block 9 is fixedly connected with a push plate 12. The feedback mechanism and the electromagnet mechanism are connected through a microcontroller and a driver. When it is detected that the electric contact 1 7 is in contact with the electric contact 2 8, the driver controls the electromagnet mechanism to start. After the fixed block 9 and the movable block 10 are energized, the movable block 10 moves toward the end close to the sorting mechanism 4. The personnel can set the program by themselves, such as: after detecting that the electric contact 1 7 is in contact with the electric contact 2 8, the electromagnet mechanism starts to energize the fixed block 9 and the movable block 10 and cut off the power after 3 seconds. The movable block 10 is immediately reset by the micro-compression spring 2 11 after the power is cut off, so as to avoid interference with the packaged workpiece 3 that needs to be detected later.

[0036] See also Figure 4-7, the sorting mechanism 4 is composed of a top plate 401, a bottom plate 402, and a connecting rod 403. An isolation membrane 404 is fixedly connected between the top plate 401 and the bottom plate 402. The isolation membrane 404 separates the top plate 401 and the bottom plate 402 into a detection chamber 405 and a slot 406. The slot specifications of the detection chamber 405 match the standard specifications of the thickness and size of the packaged workpiece 3. The isolation membrane 404 is made of elastic material, and the isolation membrane 404 is set in a long strip shape. Under normal conditions, the sorting mechanism 4 and the defective material distribution port 205 are offset. The offset setting and the shape of the isolation membrane 404 can guide the packaged workpiece 3, so that the packaged workpiece 3 judged as a good product will not move to the side of the defective material distribution port 205 or the slot 406, so that it can be Due to its own gravity, it quickly passes through the detection chamber 405 and finally slides to the superior material distribution port 204. A slide groove 407 is opened at the lower end of the bottom plate 402, and a fixed plate 5 is slidably connected in the slide groove 407. The fixed plate 5 includes a positioning part 501 fixedly connected to the assembly groove 202 and an embedded part 502 located in the slide groove 407. A micro-compression spring 6 is fixedly connected between the embedded part 502 and the inner wall of the slide groove 407. After the sorting mechanism 4 is squeezed by gravity, the bottom plate 402 will squeeze the micro-compression spring 6 and move in the direction of the positioning part 501. The upper surface of the guide slide groove 201, the lower bottom surface of the top plate 401, the upper surface of the bottom plate 402, and the upper surfaces of the positioning part 501 and the embedded part 502 are all coated with a smooth coating to reduce the friction on the surfaces of the above-mentioned components and facilitate the detection and passage of the packaged workpiece 3.

[0037] The fixed block 9 and the movable block 10 are both arranged parallel to the slot 406, and the push plate 12 does not contact the sorting mechanism 4. The push plate 12 is arranged in a conical shape. The push plate 12 is made of rubber to ensure that the push plate 12 will not cause damage to the packaged workpiece 3 that has not passed the quality inspection after the collision. The length of the push plate 12 is greater than the distance between the slot 406 opening and the isolation membrane 404. The opening width of the defective material separation port 205 is equal to the sum of the lengths of the sorting mechanism 4 and the packaged workpiece 3. The defective material separation port 205 is parallel to the upper surface of the bottom plate 402. After the magnet mechanism is started to energize the fixed block 9 and the movable block 10, the movable block 10 moves closer to the slot 4. 06 moves until its surface is in contact with the sorting mechanism 4. In this state, the push plate 12 passes through the slot 406 and applies an instantaneous thrust to the isolation membrane 404, causing it to deform and push the packaged workpiece 3 located on the side of the isolation membrane 404 toward the defective material distribution port 205. The packaged workpiece 3 sent out from the defective material distribution port 205 can be cleaned with solvents or ultrasonic waves to remove the residual resin on the surface, and the packaged workpiece 3 is thoroughly dried after cleaning to prevent residual moisture or chemicals from affecting the packaged workpiece 3. After the processing is completed, it can enter the next process together with the packaged workpiece 3 sent out from the superior material distribution port 204.

[0038] A packaging detection process for defective semiconductor products comprises the following steps:

[0039] S1. Determine process parameters: obtain standard parameter information of the encapsulated workpiece 3, the parameter information including thickness and size specifications, and formulate a corresponding sorting mechanism 4 according to the parameter information of the encapsulated workpiece 3;

[0040] S2, material sorting: the packaged workpiece 3 after packaging and debonding is transported to the inspection rack 2 in a timely and quantitative manner through the conveyor belt 101 on the packaging machine body 1;

[0041] S3, quality inspection: the packaged workpiece 3 slides toward the sorting mechanism 4 through the guide chute 201, and the movement state of the sorting mechanism 4 is detected according to the feedback mechanism on the sorting mechanism 4 and the fixed plate 5, so as to detect the quality of the packaged workpiece 3, and independently judge whether the quality of the packaged workpiece 3 is qualified according to the movement state of the sorting mechanism 4;

[0042] S4. Material sorting: The packaged workpiece 3 judged as good quality can freely pass through the inspection chamber 405 and finally slide to the good quality material separation port 204, while the packaged workpiece 3 judged as defective quality will be intercepted and pushed to the defective quality material separation port 205 by the electromagnet mechanism.

[0043] There are two kinds of movement states of the sorting mechanism 4 in step S3, which correspond to the two sorting modes in step S4. One of the movement states of the sorting mechanism 4 is the inspection pass state, which is specifically manifested as follows: if there is no packaging resin attached to the surface of the packaged workpiece 3, the packaged workpiece 3 will quickly slide along the inclined surface of the guide slide 201 under the action of its own gravity, and then through the detection chamber 405 and the fixed plate 5 to the superior material distribution port 204. In this state, the upper end of the sorting mechanism 4 will always be in contact with the top of the groove body of the assembly groove 202. The other movement state of the sorting mechanism 4 is the inspection abnormal state, which is specifically manifested as follows: if there is packaging resin attached to the surface of the packaged workpiece 3, the packaged workpiece 3 will slide along the guide slide 201 to the detection chamber 4 05 and cannot completely enter the detection chamber 405. At this time, the sorting mechanism 4 slides downward due to the gravity of the packaged workpiece 3, and the bottom plate 402 squeezes the micro compression spring 6 until the electrical contact 7 on the bottom plate 402 contacts the electrical contact 2 8 on the positioning portion 501, and the feedback mechanism drives the electromagnet mechanism to start. In this state, the sorting mechanism 4 is separated from the top of the groove body of the assembly groove 202, and the packaged workpiece 3 that has not completely entered the detection chamber 405 will move to a position parallel to the defective material distribution port 205. The movable block 10 drives the push plate 12 to impact the isolation membrane 404 to deform it, and finally the push plate 12 pushes the packaged workpiece 3 with the packaging resin attached to the surface to the defective material distribution port 205.

[0044] This solution can immediately inspect the packaged workpiece 3 after packaging and degumming treatment. The overall obliquely arranged inspection frame 2 ensures that the movement of the packaged workpiece 3 will not be disturbed during the inspection process. When the packaged workpiece 3 arrives at the sorting mechanism 4, the quality of the packaged workpiece 3 is independently judged by whether the sorting mechanism 4 has a change in motion state. Two packaged workpieces 3 of different qualities are automatically sorted, which reduces the difficulty of personnel operation, effectively avoids errors that may occur during manual inspection, improves inspection efficiency, and also ensures the production quality of the product, which can effectively prevent accidents in subsequent processes such as the collapse of rib cutting tools due to residual resin on the surface of the packaged workpiece 3.

[0045] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0046] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that those skilled in the art can understand.

Claims

1. A packaging inspection device for defective semiconductor products, characterized in that: include: A packaging machine body (1) and a detection frame (2), wherein the packaging machine body (1) is provided with a conveyor belt (101), the detection frame (2) is fixedly connected to the side wall of the packaging machine body (1), the detection frame (2) is provided with a guide slide groove (201), a first assembly groove (202), a second assembly groove (203), a superior product separation port (204) and a inferior product separation port (205) which are interconnected, the packaging machine body (1) controls the packaging workpiece (3) to be transmitted from the conveyor belt (101) in a timely and quantitative manner through a built-in program, the first assembly groove (202) is provided with a sorting mechanism (4) and a fixed plate (5), and the sorting mechanism (4) and the fixed plate (5) are slidably connected, the sorting mechanism (4) and the fixed plate (5) are provided with a feedback mechanism, and the second assembly groove (203) is provided with an electromagnet mechanism; The sorting mechanism (4) is composed of a top plate (401), a bottom plate (402), and a connecting rod (403). An isolation membrane (404) is fixedly connected between the top plate (401) and the bottom plate (402). The isolation membrane (404) separates the top plate (401) and the bottom plate (402) into a detection chamber (405) and a slot (406). The slot specifications of the detection chamber (405) match the standard specifications of the thickness and size of the packaged workpiece (3). The isolation membrane (404) is made of elastic material, and the isolation membrane (404) is arranged in a strip shape. A slide groove (407) is provided at the lower end of the bottom plate (402). A fixed plate (5) is slidably connected in the slide groove (407). The fixed plate (5) comprises a positioning portion (501) fixedly connected to the first assembly groove (202) and an embedded portion (502) located in the slide groove (407). A micro compression spring (6) is fixedly connected between the embedded portion (502) and the inner wall of the slide groove (407). The feedback mechanism comprises an electrical contact point 1 (7) arranged on a side wall of the bottom plate (402) close to the positioning portion (501) and an electrical contact point 2 (8) arranged on a side wall of the positioning portion (501) close to the bottom plate (402); The electromagnet mechanism comprises a fixed block (9) and a movable block (10), wherein two micro compression springs (11) are fixedly connected between the fixed block (9) and the movable block (10), and a push plate (12) is fixedly connected to one end of the movable block (10) away from the fixed block (9).

2. The packaging inspection equipment for defective semiconductor products according to claim 1, characterized in that: The upper surface of the guide slide groove (201), the lower bottom surface of the top plate (401), the upper surface of the bottom plate (402), and the upper surfaces of the positioning portion (501) and the embedded portion (502) are all coated with a smooth coating.

3. The packaging inspection equipment for defective semiconductor products according to claim 1, characterized in that: The opening width of the defective product separation opening (205) is equal to the sum of the lengths of the separation mechanism (4) and the packaged workpiece (3), and the defective product separation opening (205) is parallel to the upper surface of the bottom plate (402).

4. The packaging inspection equipment for defective semiconductor products according to claim 1, characterized in that: The fixed block (9) and the movable block (10) are both arranged parallel to the slot (406), and the push plate (12) does not contact the sorting mechanism (4).

5. The packaging inspection equipment for defective semiconductor products according to claim 4, characterized in that: The push plate (12) is configured to be conical, the push plate (12) is made of rubber, and the length of the push plate (12) is greater than the distance between the opening of the slot (406) and the isolation membrane (404).

6. The packaging inspection equipment for defective semiconductor products according to claim 1, characterized in that: The fixed block (9) is embedded with a first electromagnet, and the movable block (10) is embedded with a second electromagnet.

7. The packaging inspection equipment for defective semiconductor products according to claim 6, characterized in that: The feedback mechanism is connected to the electromagnet mechanism via a microcontroller and a driver. When it is detected that the first electrical contact (7) is in contact with the second electrical contact (8), the driver controls the electromagnet mechanism to start. After the fixed block (9) and the movable block (10) are energized, the movable block (10) moves toward one end close to the sorting mechanism (4).

8. A packaging detection process for defective semiconductor products, characterized in that: The method is carried out using the detection device according to any one of claims 1 to 7, comprising the following steps: S1, determining process parameters: obtaining standard parameter information of the packaged workpiece (3), the parameter information including thickness and size specifications, and formulating a corresponding sorting mechanism (4) according to the parameter information of the packaged workpiece (3); S2, material sorting: the packaged workpieces (3) that have been packaged and debonded are transported to the inspection rack (2) in a timely and quantitative manner via a conveyor belt (101) on the packaging machine body (1); S3, quality inspection: the packaged workpiece (3) slides toward the sorting mechanism (4) through the guide slide groove (201), and the movement state of the sorting mechanism (4) is inspected according to the feedback mechanism on the sorting mechanism (4) and the fixed plate (5), thereby inspecting the quality of the packaged workpiece (3), and independently judging whether the quality of the packaged workpiece (3) is qualified based on the movement state of the sorting mechanism (4); S4, material sorting: the packaged workpiece (3) judged as good quality can freely pass through the inspection chamber (405) and finally slide to the good quality material separation port (204), while the packaged workpiece (3) judged as defective quality will be intercepted and pushed to the defective quality material separation port (205) by the electromagnet mechanism; The movement states of the sorting mechanism (4) in step S3 include two kinds, which correspond to the two sorting modes in step S4. One of the movement states of the sorting mechanism (4) is the inspection pass state, which is specifically manifested as follows: if the surface of the packaged workpiece (3) is not attached with packaging resin, the packaged workpiece (3) will quickly slide along the inclined surface of the guide slide groove (201) and then through the detection chamber (405) and the fixed plate (5) to the superior material distribution port (204) under the action of its own gravity. In this state, the upper end of the sorting mechanism (4) will always be in contact with the top of the groove body of the assembly groove 1 (202). The other movement state of the sorting mechanism (4) is the inspection abnormal state, which is specifically manifested as follows: if the surface of the packaged workpiece (3) is attached with packaging resin, the packaged workpiece (3) will slide along the guide slide groove (201) to the detection chamber (405) and there is no packaging resin. The packaged workpiece (3) is not able to completely enter the detection chamber (405). At this time, the sorting mechanism (4) is affected by the gravity of the packaged workpiece (3) and slides downward. The bottom plate (402) squeezes the micro-compression spring (6) until the electric contact (7) on the bottom plate (402) contacts the electric contact (8) on the positioning portion (501). At this time, the feedback mechanism drives the electromagnet mechanism to start. In this state, the sorting mechanism (4) is separated from the top of the groove body of the assembly groove (202). The packaged workpiece (3) that has not completely entered the detection chamber (405) will move to a position parallel to the defective material distribution port (205). The movable block (10) drives the push plate (12) to squeeze the isolation film (404) to deform it. Finally, the push plate (12) pushes the packaged workpiece (3) with the packaging resin attached to the surface toward the defective material distribution port (205).

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