Substrate detection method, device, electronic equipment and storage medium

Abstract

The embodiments of the present application relate to the field of automated production, and provide a substrate detection method, device, electronic device, and storage medium. The substrate to be detected is compared with each standard substrate in the standard substrate library, and the closest target standard pad is determined by the offset of the first pad, and then the expansion and contraction ratio and offset distance of each first pad of the substrate to be detected are determined based on the target standard pad; by first matching the target standard substrate and then determining the expansion and contraction ratio and offset distance, the expansion and contraction information of the substrate to be detected can be quickly detected, and the accuracy of the detection can be improved. By setting a compensation value during the offset calculation, the error after the substrate processing is also taken into consideration in advance in the deviation calculation, the accuracy of the offset is improved, and thus the overall accuracy of the substrate detection is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of automated production, and in particular to a substrate detection method, device, electronic device and storage medium. Background Art

[0002] In the field of substrate surface mounting, as devices become smaller and more sophisticated, the requirements for substrates are getting higher and higher. Due to the diversity of substrate types, different substrates have different expansion and contraction properties.

[0003] In related technologies, chip mounters and die bonders perform chip placement or die bonding according to the imported theoretical Gerber data. However, there are many types of substrates, and each substrate will have different degrees of expansion and contraction. If the imported Gerber data is used directly for substrate processing, the yield rate will be reduced. Therefore, the substrate needs to be tested. How to quickly and accurately detect the expansion and contraction information of the substrate is an issue that needs to be discussed and solved urgently. Summary of the invention

[0004] The embodiments of the present application provide a substrate detection method, device, electronic device and storage medium, which are intended to quickly and accurately detect substrate expansion and contraction information.

[0005] In a first aspect, an embodiment of the present application provides a substrate detection method, the method comprising:

[0006] Acquire position information of each first pad of the substrate to be inspected;

[0007] According to the position and compensation value of each first pad of the substrate to be inspected, offset calculation is performed with each standard substrate in the standard substrate library to obtain multiple offset groups, wherein the compensation value is used to compensate for the flow error after the pad is coated with solder paste;

[0008] Selecting a target offset group satisfying a first condition from among the plurality of offset groups;

[0009] determining a target standard substrate according to the target offset group;

[0010] Based on the target standard substrate, the expansion and contraction ratio of each of the first pads and the offset distance of each of the first pads are determined.

[0011] According to the substrate detection method provided in the first aspect of the present application, the substrate to be detected is compared with each standard substrate in the standard substrate library, the closest target standard pad is determined by the offset of the first pad, and then the expansion and contraction ratio and offset distance of each first pad of the substrate to be detected are determined based on the target standard pad; by first matching the target standard substrate and then determining the expansion and contraction ratio and offset distance, the expansion and contraction information of the substrate to be detected can be quickly detected, and the accuracy of the detection can be improved. By setting a compensation value in the offset calculation, the error after substrate processing is also taken into consideration in advance in the deviation calculation, the accuracy of the offset is improved, thereby improving the overall accuracy of the substrate detection.

[0012] Wherein, the step of obtaining the position information of each first pad of the substrate to be inspected includes:

[0013] Extracting a plurality of brightest areas on the substrate to be inspected by an image recognition algorithm;

[0014] Determine the circumscribed rectangle corresponding to each of the brightest areas;

[0015] The position and size of each of the first pads are determined according to the position and size of each of the circumscribed rectangles.

[0016] Wherein, the step of obtaining the position information of each first pad of the substrate to be inspected includes:

[0017] The position and size of each of the first pads on the substrate to be inspected are obtained through an optimal template matching algorithm.

[0018] Wherein, before performing offset calculations based on the positions and compensation values ​​of each first pad of the substrate to be inspected and each standard substrate in the standard substrate library to obtain a plurality of offset groups, the method further includes:

[0019] Acquire a plurality of second reference points of the standard substrates, position information of each second pad, and an identification signal, wherein the identification signal is used to identify the corresponding standard substrate;

[0020] Each of the identification signals is respectively bound to the corresponding second reference point of the standard substrate and the position information of each second pad to construct the standard substrate library.

[0021] Wherein, before performing offset calculations based on the positions and compensation values ​​of each first pad of the substrate to be inspected and each standard substrate in the standard substrate library to obtain a plurality of offset groups, the method further includes:

[0022] Acquire a first reference point of the substrate to be inspected;

[0023] Determining a second reference point corresponding to the first reference point in each of the standard substrates;

[0024] For each of the standard substrates, the first reference point is aligned with the second reference point to unify the coordinate systems of the substrate to be inspected and the standard substrate.

[0025] The offset group includes the offset between each second pad and each first pad of the standard substrate corresponding to the offset group;

[0026] The step of selecting a target offset group satisfying a first condition from a plurality of offset groups includes:

[0027] Calculating the offset sum of each of the offset groups;

[0028] The offset group with the smallest total offset is selected as the target offset group.

[0029] Wherein, determining the target standard substrate according to the target offset group includes:

[0030] Determine a standard substrate corresponding to the target offset group;

[0031] Acquire the offset between each second pad of the standard substrate and each first pad of the substrate to be tested;

[0032] Determining the number of offsets greater than a preset offset range;

[0033] When the number of the offsets greater than the preset offset range is less than a preset threshold, the standard substrate is determined to be the target standard substrate.

[0034] In a second aspect, an embodiment of the present application provides a substrate detection device, comprising:

[0035] A position acquisition module, used to obtain position information of each first pad of the substrate to be inspected;

[0036] A substrate comparison module, used to perform offset calculations with each standard substrate in a standard substrate library according to the position and compensation value of each first pad of the substrate to be detected, to obtain a plurality of offset groups, wherein the compensation value is used to compensate for the flow error after the pad is coated with solder paste;

[0037] A selection module, configured to select a target offset group satisfying a first condition from among a plurality of offset groups;

[0038] A substrate determination module, used for determining a target standard substrate according to the target offset group;

[0039] The detection output module is used to determine the expansion and contraction ratio of each of the first pads and the offset distance of each of the first pads based on the target standard substrate.

[0040] In a third aspect, an embodiment of the present application provides an electronic device, characterized in that it includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the substrate detection method described in the first aspect is implemented.

[0041] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, the substrate detection method as described in the first aspect is implemented.

[0042] The substrate detection method, device, electronic device and storage medium of the present application compare the substrate to be detected with each standard substrate in the standard substrate library respectively, determine the closest target standard pad by the offset of the first pad, and then determine the expansion and contraction ratio and offset distance of each first pad of the substrate to be detected based on the target standard pad; by first matching to obtain the target standard substrate and then determining the expansion and contraction ratio and offset distance, the expansion and contraction information of the substrate to be detected can be quickly detected, and the detection accuracy can be improved.

[0043] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A flow chart of a substrate detection method provided in one embodiment of the present application;

[0045] Figure 2 A flow chart of a substrate detection method provided by another embodiment of the present application;

[0046] Figure 3 A schematic diagram of benchmark alignment provided for an example of the present application;

[0047] Figure 4 A schematic diagram of displaying first pad offset information provided in an example of the present application;

[0048] Figure 5 A schematic diagram showing first pad offset information provided by another example of the present application;

[0049] Figure 6 A schematic structural diagram of a substrate detection device provided in one embodiment of the present application;

[0050] Figure 7 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0052] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0053] In the description of the embodiments of the present application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the embodiments of the present application based on the specific content of the technical solution.

[0054] In the embodiments of the present application, the words "further", "exemplarily" or "optionally" are used to indicate examples, illustrations or descriptions, and should not be interpreted as being more preferred or more advantageous than other embodiments or designs. The use of the words "further", "exemplarily" or "optionally" is intended to present related concepts in a specific way.

[0055] In the related technologies, in the SMT (Surface Mounted Technology), SMD (Surface Mounted Devices), COB (chip-on-board) and other industry markets, as devices become smaller and smaller, devices become more and more precise, the requirements for substrates become higher and higher, the diversity of substrate types, and the different expansion and contraction properties of different types of substrates, lead to the inability to guarantee batch differences on the production line, and the production yield cannot be guaranteed. At present, chip mounters, die bonders, etc. perform chip placement or die bonding according to the imported theoretical Gerber data, but in fact each substrate has different expansion and contraction procedures, and there is a certain deviation between the actual object and the theory, which will cause many problems such as chip offset, resulting in a reduction in yield, so the substrate needs to be tested before processing. How to quickly and accurately detect the expansion and contraction information of the substrate is an issue that urgently needs to be discussed and solved.

[0056] The embodiment of the present application provides a substrate detection method, device, electronic device and storage medium, by comparing the substrate to be detected with each standard substrate in the standard substrate library, determining the closest target standard pad by the offset of the first pad, and then determining the expansion and contraction ratio and offset distance of each first pad of the substrate to be detected based on the target standard pad; by first matching the target standard substrate and then determining the expansion and contraction ratio and offset distance, the expansion and contraction information of the substrate to be detected can be quickly detected, and the accuracy of the detection can be improved. By setting the compensation value in the offset calculation, the error after the substrate processing is also taken into account in advance in the deviation calculation, the accuracy of the offset is improved, and thus the overall accuracy of the substrate detection is improved. The embodiment of the present application also determines the corresponding standard steel mesh for solder paste printing on the substrate through the detected target standard substrate, thereby improving the production yield. The embodiment of the present application also compensates in the subsequent packaging by using the expansion and contraction information and offset distance of the detected substrate to be detected, calibrates the processing position, and improves the production yield.

[0057] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0058] Figure 1 1 is a flow chart of a substrate detection method provided by an embodiment of the present application. Figure 1 As shown, in Figure 1 In the embodiment of the present invention, the substrate detection method may include but is not limited to steps S110 to S150.

[0059] Step S110: acquiring position information of each first pad of the substrate to be inspected;

[0060] Step S120: performing offset calculations with each standard substrate in the standard substrate library according to the position and compensation value of each first pad of the substrate to be inspected, to obtain a plurality of offset groups, wherein the compensation value is used to compensate for the flow error of the pad after solder paste is coated;

[0061] Step S130: selecting a target offset group satisfying a first condition from a plurality of offset groups;

[0062] Step S140: determining a target standard substrate according to the target offset group;

[0063] Step S150: determining the expansion / contraction ratio of each first pad and the offset distance of each first pad based on the target standard substrate.

[0064] Wherein, in step S110, the substrate to be inspected refers to a substrate to be used for substrate mounting or die bonding; the first pad refers to a pad on the substrate to be inspected for the mounting or die bonding. The position information of the first pad includes at least but is not limited to the coordinates of the first pad and the size of the first pad; illustratively, the coordinates of the first pad may be the coordinates of the center point of the first pad, or the coordinates of each side of the first pad.

[0065] Wherein, in step S120, the position of the first pad refers to the coordinates used to represent the position of the first pad; illustratively, the coordinates may be the coordinates of the center position of the first pad, or the coordinates of the reference point of the first pad, or the coordinates of the position of the first pad where the solder paste is applied. For convenience of explanation, in each embodiment of the present application, the position of the first pad adopts the coordinates of the center position of the first pad. The compensation value refers to the error used to compensate for the fluidity of the solder paste during the solder paste coating process; since the solder paste has a certain fluidity and will flow farther in the direction of the scraper, a compensation value needs to be set. In the case where the pad is not offset, the position coordinates of the first pad plus the corresponding compensation value should be equal to the position coordinates of the second pad corresponding to the matching standard substrate.

[0066] Offset calculation refers to comparing each first pad of the substrate to be tested with each standard substrate in the standard substrate library to determine the offset of each first pad of the substrate to be tested relative to each second pad of the standard substrate; a set of offset groups can be obtained between the substrate to be tested and each standard substrate. Each offset group includes the offset of each first pad of the substrate to be tested relative to the corresponding second pad of the standard substrate.

[0067] The standard substrate library refers to a database storing a plurality of substrate templates; illustratively, the standard substrate library may be generated based on a summary of historical substrate data, or may be designed based on expert experience and actual production requirements and then stored.

[0068] In step S130 , the target offset group refers to the offset group that is closest to the substrate to be inspected after screening, and is usually the offset group with the smallest offset among multiple offset groups.

[0069] In step S140, the target standard substrate refers to the standard substrate corresponding to the target offset group. The target offset group has the smallest offset among the multiple offset groups, so the standard substrate corresponding to it is also the standard substrate closest to the substrate to be detected.

[0070] In step S150, the expansion / contraction ratio refers to the ratio of the size of the first pad to the size of the second pad corresponding to the standard substrate. The offset distance refers to the distance difference between the first pad and the second pad corresponding to the standard substrate.

[0071] In this embodiment, the substrate to be inspected is compared with each standard substrate in the standard substrate library, the closest target standard pad is determined by the offset of the first pad, and then the expansion and contraction ratio and offset distance of each first pad of the substrate to be inspected are determined based on the target standard pad; by first matching the target standard substrate and then determining the expansion and contraction ratio and offset distance, the expansion and contraction information of the substrate to be inspected can be quickly detected, and the accuracy of the detection can be improved. By setting a compensation value during the offset calculation, the error after substrate processing is also taken into consideration in advance in the deviation calculation, the accuracy of the offset is improved, and thus the overall accuracy of the substrate detection is improved.

[0072] In some embodiments, the offset is the offset distance of the first pad relative to the pad corresponding to the standard substrate, and the calculation formula is as follows: offset distance = √ˉ((actual coordinate x + compensation x - standard x)2 + (actual coordinate y + compensation y - standard y)2)

[0073] Among them, the actual coordinate x refers to the horizontal coordinate of the first pad position, the compensation x refers to the horizontal coordinate of the compensation value, the standard x refers to the horizontal coordinate of the pad corresponding to the standard substrate, the actual coordinate y refers to the vertical coordinate of the first pad position, the compensation y refers to the vertical coordinate of the compensation value, and the standard y refers to the vertical coordinate of the pad corresponding to the standard substrate.

[0074] The offset can also be offset x and offset y respectively, wherein offset x refers to the lateral offset of the first pad relative to the pad corresponding to the standard substrate, and offset y refers to the longitudinal offset of the first pad relative to the pad corresponding to the standard substrate; specifically, offset X = (actual coordinate X + compensation value X) - standard coordinate X; offset Y = (actual coordinate Y + compensation value Y) - standard coordinate Y.

[0075] In some embodiments, step S110 includes at least but is not limited to the following steps: extracting multiple brightest areas on the substrate to be detected through an image recognition algorithm; determining the circumscribed rectangle corresponding to each brightest area; and determining the position and size of each first pad according to the position and size of each circumscribed rectangle. For example, since the pad is made of metal, it will be brighter than other positions on the substrate. The image information of the substrate to be detected can be collected by AOI (Automated Optical Inspection) and other devices, and the brightest area in the image of the substrate to be detected can be extracted through an algorithm. The circumscribed rectangle corresponding to each brightest area is calculated, and the circumscribed rectangle corresponds to the first pad. By calculating the center position coordinates of each circumscribed rectangle and calculating the width and height of the circumscribed rectangle, the center position coordinates and size of each first pad can be obtained. By identifying the circumscribed rectangle of the brightest area based on the image recognition algorithm, the first pads of the substrate to be detected can be quickly identified; and the coordinates and size calculations of the circumscribed rectangle are performed, the calculation amount is small, and the position and size information of each first pad can be obtained more quickly.

[0076] In some embodiments, step S110 includes at least but is not limited to the following steps: obtaining the position and size of each first pad on the substrate to be inspected through the best template matching algorithm. Exemplarily, the best template matching algorithm refers to performing image recognition on the substrate to be inspected through a preset pad template, obtaining a pattern on the substrate to be inspected that matches the pad template, and determining the pattern as the first pad; the position of each first pad on the substrate to be inspected can be matched simply and quickly through template matching; and then the size of each first pad is measured by locating the four edges of each matched first pad and calculating the distance between the edges.

[0077] In some embodiments, before step S120, the substrate detection method further includes: obtaining the second reference points of multiple standard substrates, the position information of each second pad and an identification signal, wherein the identification signal is used to mark the corresponding standard substrate; binding each identification signal to the second reference point of the corresponding standard substrate and the position information of each second pad, and constructing a standard substrate library. In this embodiment, the second reference point refers to the mark point of the standard pad. Exemplarily, the mark point is a positioning point used for surface mounting technology in circuit board design. The shape of the mark point is usually a solid circle with a diameter of 1mm (±0.2mm), and the material can be bare copper, tin-plated or nickel-plated. The mark point should be located in the diagonal direction of the substrate to improve the recognition effect. The second pad refers to the pad on the standard substrate. By constructing a standard substrate library, the identification signal can be used to quickly obtain the second reference point of the standard substrate corresponding to the identification signal, the position of each second pad and other information from the library.

[0078] In some embodiments, before step S120, the substrate detection method further includes: obtaining a first reference point of the substrate to be detected; determining a second reference point corresponding to the first reference point in each standard substrate; for each standard substrate, aligning the first reference point with the second reference point to unify the coordinate systems of the substrate to be detected and the standard substrate. The first reference point refers to a mark point of the pad to be detected. For example, the first reference point of the pad to be detected can be obtained by an image recognition algorithm or an optimal template matching algorithm. For example, Figure 3 As shown, Figure 3 A schematic diagram of the alignment of reference points is provided for an example of the present application. Taking the substrate to be inspected and any standard substrate as an example, the first reference point of the substrate to be inspected is overlapped and aligned with the second reference point of the standard substrate. In a unified coordinate system, the offset and expansion / contraction between the substrate to be inspected and the standard substrate can be quickly compared.

[0079] In some embodiments, the offset group includes the offset between each second pad and each first pad of the standard substrate corresponding to the offset group. Step S130 at least includes but is not limited to: calculating the sum of the offsets of each offset group; selecting the offset group with the smallest sum of offsets as the target offset group. Exemplarily, assuming that the substrate to be inspected has no expansion, contraction or offset at all, the sum of the offset groups calculated for the substrate to be inspected and the standard substrate should be 0. Therefore, the degree of matching between the substrate to be inspected and the standard substrate corresponding to the offset group can be determined by comparing the size of the sum of the offsets of each offset group; wherein, the smaller the sum of the offsets, the higher the degree of matching between the corresponding standard substrate and the substrate to be inspected.

[0080] In some other embodiments, the target offset group that best matches the substrate to be inspected may be determined by the following steps: calculating the average offset of each offset group; and selecting the offset group with the smallest average offset as the target offset group.

[0081] In some embodiments, the target offset group can also be determined by the following steps: calculating the offset sum of each offset group; selecting several pre-selected offset groups whose offset sum is less than the offset sum threshold; for each pre-selected offset group, determining whether there is an offset in the pre-selected offset group that exceeds the upper limit of the allowable offset, and if so, removing the pre-selected offset group; and selecting the pre-selected offset group with the smallest offset sum from the remaining pre-selected offset groups as the target offset group.

[0082] In some embodiments, step S140 at least includes but is not limited to the following steps: determining a standard substrate corresponding to the target offset group; obtaining the offsets of each second pad of the standard substrate and each first pad of the substrate to be inspected; determining the number of offsets greater than a preset offset range; when the number of offsets greater than the preset offset range is less than a preset threshold, determining that the standard substrate is a target standard substrate.

[0083] In one example, if Figure 2 As shown, when the number of offsets greater than the preset offset range is greater than the preset threshold, an NG signal is output, and the NG signal is used to indicate that the substrate to be inspected cannot be matched to the target standard substrate that meets the requirements. At this time, it can be determined that the substrate to be inspected has serious expansion and contraction offsets and cannot be used for subsequent production. In another example, if multiple consecutive substrates to be inspected output NG signals, it may be that a standard substrate template is missing in the standard substrate library, and the standard substrate library needs to be updated.

[0084] In some embodiments, when the number of offsets greater than a preset offset range is greater than a preset threshold, an offset group that meets the condition is reselected from other standard substrates other than the current target standard substrate to update the target offset group. The standard substrate corresponding to the updated target offset group is obtained, and the number of offsets greater than the preset offset range is determined; when the number of offsets greater than the preset offset range is less than the preset threshold, the standard substrate corresponding to the updated target offset group is determined to be the target standard substrate.

[0085] In some embodiments, Figure 2 As shown, after determining the target standard substrate, an identification signal corresponding to the target standard substrate is obtained, and the identification signal of the target standard substrate is sent to a downstream material receiver, so that the downstream material receiver uses the standard steel mesh corresponding to the target standard substrate to print solder paste according to the identification signal, and uses the most matching standard steel mesh according to the matching result to improve the production yield rate; when the target standard substrate cannot be matched, an NG signal is issued, and the defective substrate to be inspected is analyzed.

[0086] In some embodiments, step 150 at least includes but is not limited to: obtaining the position coordinates and dimensions of each second pad of the target standard substrate; obtaining the position coordinates and dimensions of each first pad of the substrate to be inspected; calculating the offset distance of each first pad based on the position coordinates of each pair of corresponding first pads and second pads; calculating the expansion and contraction ratio of each first pad based on the dimensions of each pair of corresponding first pads and second pads.

[0087] In some embodiments, after the expansion / contraction ratio and offset distance of each first pad of the substrate to be inspected are detected, since the expansion / contraction of the substrate to be inspected is not proportional, the offset information can be outputted in the form of scattered points in different regions (such as four-square grids or nine-square grids). Figure 4 As shown, Figure 4 A schematic diagram showing the first pad offset information provided in an example of the present application; Figure 4As shown in the figure, the pad area is divided into four equal parts by using a four-square grid. One area only displays the offset information of the pads in this area. Taking one area as an example, the center point of the area is (0, 0), the horizontal direction is X, and the vertical direction is Y. The coordinates of each point are the specific offset of each pad. The coordinates that exceed the offset range are highlighted (such as Figure 4 The coordinate points selected by the circle in the middle are displayed in low saturation colors if the coordinates are within the range. Through the practical method of this embodiment, the offset distribution of the first pad in each area can be viewed very conveniently.

[0088] In other embodiments, Figure 5 A schematic diagram showing the first pad offset information provided by another example of the present application; Figure 5 As shown, after the expansion / contraction ratio and offset distance of each first pad of the substrate to be inspected are detected, the actual positions of all first pads can be output simultaneously (eg Figure 5 The solid line frame shows the size and the second pad (as shown in Figure 5 By comparing the position and size of the substrate (shown in the dotted box), we can more intuitively see the difference between the substrate and the standard.

[0089] In some embodiments, Figure 2 As shown, after detecting the expansion / contraction ratio and offset distance of each first pad of the substrate to be inspected, the actual pad position and pad size of the substrate to be inspected are obtained according to the expansion / contraction ratio and offset distance obtained from the test, and a steel mesh that can match the substrate to be inspected is formulated, thereby improving the production yield.

[0090] In some embodiments, Figure 2 As shown, after the expansion / contraction ratio and offset distance of each first solder pad of the substrate to be inspected are detected, the offset information such as the expansion / contraction ratio and offset distance of the substrate to be inspected is sent to upstream production equipment such as a placement machine or a die bonder. When packaging, the upstream production equipment such as the placement machine or the die bonder obtains the actual position of the first solder pad based on the offset information such as the expansion / contraction ratio and offset distance of the substrate to be inspected, and operates according to the actual position to improve the production yield.

[0091] Figure 6 This is a schematic diagram of the structure of a substrate detection device provided in one embodiment of the present application. Figure 6 As shown, the substrate detection device at least includes but is not limited to:

[0092] A position acquisition module, used to obtain position information of each first pad of the substrate to be inspected;

[0093] A substrate comparison module is used to calculate the offsets of each standard substrate in the standard substrate library according to the position and compensation value of each first pad of the substrate to be detected, and obtain multiple offset groups, wherein the compensation value is used to compensate for the flow error of the pad after the solder paste is coated;

[0094] A selection module, configured to select a target offset group satisfying a first condition from among a plurality of offset groups;

[0095] A substrate determination module, used for determining a target standard substrate according to a target offset group;

[0096] The detection output module is used to determine the expansion and contraction ratio of each first solder pad and the offset distance of each first solder pad based on the target standard substrate.

[0097] It should be noted that the specific implementation and beneficial effects of the substrate detection device of the embodiment of the present application correspond to the substrate detection method provided in any of the above embodiments, and will not be repeated here.

[0098] Figure 7 Schematic diagram of the structure of an electronic device provided by an embodiment of the present application. Figure 7 As shown, the electronic device 2000 includes a memory 2100 and a processor 2200. The number of the memory 2100 and the processor 2200 may be one or more. Figure 7 In the example, a memory 2101 and a processor 2201 are taken; the memory 2101 and the processor 2201 in the network device can be connected via a bus or other means. Figure 7 The example of connecting through bus is taken in the following.

[0099] The memory 2101 is a computer-readable storage medium that can be used to store software programs, computer executable programs, and modules, such as program instructions / modules corresponding to the method provided in any embodiment of the present application. The processor 2201 implements the substrate detection method provided in any of the above embodiments by running the software programs, instructions, and modules stored in the memory 2101.

[0100] The memory 2101 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function. In addition, the memory 2101 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device or other non-volatile solid-state storage device. In some instances, the memory 2101 further includes a memory remotely arranged relative to the processor 2201, and these remote memories may be connected to the device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0101] An embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute a substrate detection method as provided in any embodiment of the present application.

[0102] An embodiment of the present application also provides a computer program product, including a computer program or computer instructions, which are stored in a computer-readable storage medium. A processor of a computer device reads the computer program or computer instructions from the computer-readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes a substrate detection method provided in any embodiment of the present application.

[0103] The system architecture and application scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of the system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0104] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0105] In hardware implementation, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed by several physical components in cooperation. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium [or non-transitory medium] and a communication medium [or temporary medium]. As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information [such as computer-readable instructions, data structures, program modules or other data]. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk [DVD] or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0106] The terms "component", "module", "system", etc. used in this specification are used to represent computer-related entities, hardware, firmware, a combination of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, or a computer. By way of illustration, both applications running on a computing device and a computing device can be components. One or more components may reside in a process or an execution thread, and a component may be located on a computer or distributed between two or more computers. In addition, these components may be executed from various computer-readable media having various data structures stored thereon. Components may communicate, for example, through a local or remote process based on a signal having one or more data packets [e.g., data from two components interacting with another component between a local system, a distributed system, or a network, such as the Internet interacting with other systems through signals].

[0107] The above describes some embodiments of the present application with reference to the accompanying drawings, but does not limit the scope of the present application. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present application shall be within the scope of the present application.

Claims

1. A substrate detection method, It is characterized in that The method comprises: Acquire position information of each first pad of the substrate to be inspected; According to the position and compensation value of each first pad of the substrate to be inspected, offset calculation is performed with each standard substrate in the standard substrate library to obtain multiple offset groups, wherein the compensation value is used to compensate for the flow error after the pad is coated with solder paste; Selecting a target offset group satisfying a first condition from among the plurality of offset groups; Determine the target standard substrate according to the target offset group; wherein, when the pad is not offset, the position coordinate of the first pad plus the corresponding compensation value is equal to the position coordinate of the second pad corresponding to the matched standard substrate; Based on the target standard substrate, determining the expansion and contraction ratio of each of the first pads and the offset distance of each of the first pads; According to the expansion / contraction ratio and offset distance obtained from the test, determine the steel mesh that matches the substrate to be tested; The offset group includes the offset between each second pad and each first pad of the standard substrate corresponding to the offset group; The step of selecting a target offset group satisfying a first condition from a plurality of offset groups includes: Calculating the offset sum of each of the offset groups; Selecting the offset group with the smallest total offset as the target offset group; Before performing offset calculations based on the positions and compensation values ​​of the first pads of the substrate to be inspected and the standard substrates in the standard substrate library to obtain a plurality of offset groups, the method further includes: Acquire a plurality of second reference points of the standard substrates, position information of each second pad, and an identification signal, wherein the identification signal is used to identify the corresponding standard substrate; Binding each of the identification signals to the corresponding second reference points of the standard substrate and position information of each second pad to construct the standard substrate library; Acquire a first reference point of the substrate to be inspected; Determine a second reference point corresponding to the first reference point in each of the standard substrates; For each of the standard substrates, the first reference point is aligned with the second reference point to unify the coordinate systems of the substrate to be inspected and the standard substrate.

2. The method according to claim 1, It is characterized in that The step of obtaining position information of each first pad of the substrate to be inspected includes: Extracting a plurality of brightest areas on the substrate to be inspected by an image recognition algorithm; Determine the circumscribed rectangle corresponding to each of the brightest areas; The position and size of each of the first pads are determined according to the position and size of each of the circumscribed rectangles.

3. The method according to claim 1, It is characterized in that The step of obtaining position information of each first pad of the substrate to be inspected includes: The position and size of each of the first pads on the substrate to be inspected are obtained through an optimal template matching algorithm.

4. The method according to claim 1, It is characterized in that The step of determining a target standard substrate according to the target offset group includes: Determine a standard substrate corresponding to the target offset group; Acquire the offset between each second pad of the standard substrate and each first pad of the substrate to be tested; Determining the number of offsets greater than a preset offset range; When the number of the offsets greater than the preset offset range is less than a preset threshold, the standard substrate is determined to be the target standard substrate.

5. A substrate detection device, It is characterized in that include: A position acquisition module, used to obtain position information of each first pad of the substrate to be inspected; A substrate comparison module, used to perform offset calculations with each standard substrate in a standard substrate library according to the position and compensation value of each first pad of the substrate to be detected, to obtain a plurality of offset groups, wherein the compensation value is used to compensate for the flow error after the pad is coated with solder paste; A selection module, configured to select a target offset group satisfying a first condition from among a plurality of offset groups; A substrate determination module, used to determine a target standard substrate according to the target offset group; wherein, when the pad is not offset, the position coordinate of the first pad plus the corresponding compensation value is equal to the position coordinate of the second pad corresponding to the matched standard substrate; A detection output module, used to determine the expansion and contraction ratio of each of the first pads and the offset distance of each of the first pads based on the target standard substrate, and determine a steel mesh that matches the substrate to be detected according to the expansion and contraction ratio and the offset distance obtained by the test; The offset group includes the offset between each second pad and each first pad of the standard substrate corresponding to the offset group; The step of selecting a target offset group satisfying a first condition from a plurality of offset groups includes: Calculating the offset sum of each of the offset groups; Selecting the offset group with the smallest total offset as the target offset group; Before performing offset calculations based on the positions and compensation values ​​of the first pads of the substrate to be inspected and the standard substrates in the standard substrate library to obtain a plurality of offset groups, the substrate comparison module is further used to: Acquire a plurality of second reference points of the standard substrates, position information of each second pad, and an identification signal, wherein the identification signal is used to identify the corresponding standard substrate; Binding each of the identification signals to the corresponding second reference points of the standard substrate and position information of each second pad to construct the standard substrate library; Acquire a first reference point of the substrate to be inspected; Determine a second reference point corresponding to the first reference point in each of the standard substrates; For each of the standard substrates, the first reference point is aligned with the second reference point to unify the coordinate systems of the substrate to be inspected and the standard substrate.

6. An electronic device, It is characterized in that include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the substrate detection method according to any one of claims 1 to 4 when executing the computer program.

7. A computer-readable storage medium, It is characterized in that A computer program is stored, and when the computer program is executed by a processor, the substrate detection method according to any one of claims 1 to 4 is implemented.

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