Semiconductor detection device and method

The semiconductor detection device addresses loose weld issues by simulating a falling operation with a steering mechanism and adjusting components to detect and remove low-quality circuit boards, ensuring stable welds and enhancing product quality.

CN118330444BActive Publication Date: 2024-12-17GUANGDONG HUIYU OPTOELECTRONICS EQUIPMENT CO LTD
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Patent Information

Application Number
CN202410740553.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-06-09
Publication Date
2024-12-17
Estimated Expiration
2044-06-09

AI Technical Summary

Technical Problem

Existing semiconductor detection methods fail to effectively identify loose welds between pins and wires on circuit boards, leading to potential detachment and damage during normal operation, resulting in low-quality semiconductor products.

Method used

A semiconductor detection device and method that simulates a falling operation to separate loose welds by using a mounting plate with a steering mechanism and adjusting components to change the falling direction, allowing for pre-elimination of low-quality products.

Benefits of technology

The device enables automatic detection and removal of semiconductor circuit boards with loose welds before power-on detection, improving product quality by enhancing the randomness and stability of the drop simulation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a semiconductor detection device and method, and relates to the field of semiconductor circuit board detection technology. The device comprises a mounting plate and a frame body arranged at both ends of the mounting plate, a bottom plate is fixed at the bottom of the two frames, two conveyor belts with opposite conveying directions are respectively arranged on both sides of the mounting plate, and a limiting mechanism installed in the mounting plate is also included, and the limiting mechanism is used for installation and positioning of the semiconductor circuit board; two screw rods installed in the two frames are rotated by a bearing seat. The invention can simulate the installation and positioning of the semiconductor circuit board through the limiting mechanism designed on the mounting plate, and then lift and move the screw rod through the designed moving tube, so as to drive the adjusting rope to pull accordingly, cooperate with the effect of the tightening member, realize the dropping of the mounting plate from a high place, and early detachment of the pins of the semiconductor circuit board with loose welding, and then pre-removal of the semiconductor circuit board with poor quality through subsequent power-on detection.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor circuit board detection, and in particular to a semiconductor detection device and method. Background Art

[0002] Semiconductor is a general term for a class of materials whose conductivity is between that of conductors and insulators, and is widely used in many industries and fields.

[0003] At present, the common application of semiconductors in the electronic field is mainly reflected in integrated circuits, flat-panel displays, optoelectronic devices, etc. Integrated circuits are one of the core applications of semiconductors. They integrate multiple electronic components on a semiconductor chip circuit board, thus realizing high-speed computing and large-scale integration of electronic products such as computers, mobile phones, and tablet computers.

[0004] Existing Chinese patent document CN202010738043.5 discloses a visual inspection device for semiconductor module packaging, in which product quality identification is performed through visual inspection. The camera in the scheme can move up and down and rotate, and can be photographed in multiple positions when the semiconductor is processed on the operating table, so that the visual inspection range is adjustable and the inspection is more comprehensive. When the semiconductor chip is installed on the circuit board, it will pass the visual inspection, but it can only inspect its appearance, such as defects in appearance, the length of the skewness of the pins, etc. After it is installed on the circuit board, personnel also need to detect the stability of the connection between the pins on the semiconductor circuit board and the circuit board. The chip pin connection stability can be detected by power-on detection, but after some chips are docked and packaged with the circuit board, the chip has welding defects such as cold welding through the welding of the pins and the circuit board. During normal power-on detection, it can also meet the detection, but after encountering a certain degree of collision, the defective welding area will be easily loosened and detached, thereby causing the semiconductor circuit board to be extremely vulnerable to damage, resulting in low quality of semiconductor products. For this reason, the present invention proposes a semiconductor detection device and method. Summary of the invention

[0005] In order to solve the technical problems raised in the above-mentioned background technology, the present invention provides a semiconductor detection device and method, which has the advantage of being able to simulate a falling operation and to separate in advance the welding points of products where the pins and wires in the semiconductor circuit board are not firmly welded, so as to facilitate the pre-elimination of low-quality products.

[0006] In order to achieve the above object, the present invention specifically adopts the following technical solutions:

[0007] A semiconductor detection device comprises a mounting plate and a frame body arranged at both ends of the mounting plate, a bottom plate is fixed at the bottom of the two frames, two conveyor belts with opposite conveying directions are respectively arranged on both sides of the mounting plate, and a limiting mechanism installed in the mounting plate, the limiting mechanism is used for the installation and positioning of the semiconductor circuit board; two screw rods installed in the two frames are rotated by a bearing seat, the bottoms of the two screw rods are installed with a linkage member for synchronous rotation of the two screw rods, and a moving tube is threadedly sleeved on the outer side of the screw rod, an adjustment rope is fixed on the outer side of the moving tube, a through hole is opened at the top of the frame body, and one end of the adjustment rope slides through the through hole on the frame body and is fixed to one end of the top of the mounting plate, a support platform for contacting the adjustment rope is fixed on the outer side of the through hole at the top of the frame body, and a tightening member for squeezing the adjustment rope is installed on the top of the frame body; a steering mechanism installed on the frame body, the steering mechanism is used to change the falling direction of the mounting plate, and an adjustment component for driving the steering mechanism to rotate is installed on the outer side of the moving tube.

[0008] Through the above technical solution: the semiconductor circuit boards can be automatically dropped, and some semiconductor circuit boards with loose welding can be picked out in advance, so that low-quality products can be eliminated.

[0009] The present invention is further configured as follows: the steering mechanism includes a rotating shaft rotatably mounted on a frame body and a docking piece mounted on the bottom of a mounting plate, a triangular frame being fixed to one end of the rotating shaft, and a coaxial double gear being fixed to the other end of the rotating shaft, and three through slots being opened in the triangular frame, two baffles being rotatably mounted at one end of an outlet of the through slot, and magnetic magnets that are mutually attracted are mounted between the baffles and the outer wall of the triangular frame, a fixing plate being fixed to the inner side of the frame body, and a prismatic column being slidably inserted in the fixing plate, a tooth plate meshing with a large gear in the coaxial double gear being fixed to the bottom of the prismatic column, and a pulling plate being fixed to the top, an extrusion spring for pushing the tooth plate downward is sleeved on the outer side of the prismatic column, and the adjustment component is connected to the pulling plate.

[0010] Through the above technical solution: the triangular frame in the steering mechanism can adjust the angle of the dropped mounting plate, thereby improving the randomness of the drop.

[0011] The present invention is further configured such that two docking parts are provided and are distributed at both ends of the bottom of the mounting plate, the docking part comprises an arc-shaped plate fixed to the bottom of the mounting plate, and a docking column adapted to the through groove is rotatably installed in the arc-shaped plate through a connecting shaft, and a spring sheet abutting against the bottom of the docking column is fixed to the outer side of the bottom of the mounting plate.

[0012] Through the above technical solution: the interaction between the designed docking column and the spring sheet 1 enables the mounting plate to directly pass through the triangular frame when moving upward, which facilitates the subsequent resetting of the mounting plate.

[0013] The present invention is further configured as follows: the adjustment component includes an L-shaped frame fixed to the outside of the moving tube, the L-shaped frame is fitted with the inner wall of the frame, and a telescopic rod is fixed in the L-shaped frame, an L-shaped table fitted with the surface of the L-shaped frame is fixed to the outer end of the telescopic rod, and a tension spring fixed to the L-shaped table and the L-shaped frame is sleeved on the outer side of the telescopic rod, a connecting arc plate is fixed between the two L-shaped tables, and a trapezoidal track plate is fixed in the frame, an adjustment plate corresponding to the pulling plate is rotatably installed in the L-shaped table, and a spring sheet two that resists the adjustment plate is fixed in the L-shaped table, and an adjustment member meshing with the coaxial double gears is fixed to the bottom of the moving tube through a bracket.

[0014] Through the above technical solution: the design of the adjustment component allows the pulling plate to be pulled up accordingly each time the movable tube moves upward, so that the coaxial double gears are not limited, which facilitates subsequent adjustment of the gears by the adjustment member.

[0015] The present invention is further configured such that the adjusting member includes a docking plate fixed to the outer end of the bracket and a tooth row adapted to the small gear in the coaxial double gear, a connecting column plugged into the docking plate is fixed to the outer side of the tooth row, and a limiting block is fixed to the outer end of the connecting column, and a spring sheet three fitting with the docking plate is fixed to the outer side of the tooth row.

[0016] Through the above technical solution: the rotation of the coaxial double gears is realized through the adjusting member, thereby adjusting the rotation of the triangular frame.

[0017] The present invention is further configured such that the clamping member includes a clamping plate installed in the through hole, a clamping rod plugged into the support platform is fixed to the bottom of the clamping plate, an adjusting frame is fixed to the bottom of the clamping rod, and a clamping spring that abuts against the adjusting frame and the support platform is sleeved on the outer side of the clamping rod, a through opening is opened on the top of the frame, and one end of the adjusting frame slides through the through opening and extends into the frame, a pushing frame adapted to the adjusting frame is fixed to the top of the moving tube, and one end of the adjusting rope is fixed in the pushing frame.

[0018] Through the above technical solution: the tightening member can tighten the adjustment rope, so that when the adjustment rope is not pulled by external force, it can ensure that the mounting plate is stable and does not fall off.

[0019] The present invention is further configured such that a track frame for limiting the movement of the docking column is fixed to the outer side of the top end of the frame body, and the bottom of the track frame is an open structure.

[0020] Through the above technical solution: the design of the track frame enables the mounting plate to be stably docked with the triangular frame when it moves downward in the early stage.

[0021] The present invention is further configured as follows: the limiting mechanism includes two limiting frames, the two limiting frames are distributed at both ends of the mounting plate, and an adjusting shaft is fixed to the bottom of the limiting frame, the two ends of the adjusting shaft are rotatably docked with the two ends of the mounting plate through bearing seats, and adjusting gears are fixed to the outer sides of both ends of the adjusting shaft, a dual-axis motor is fixed in the mounting plate, and two driving gears are fixed to the output end of the dual-axis motor through a coupling, and the driving gear is meshed with the two adjusting gears on its outer side.

[0022] Through the above technical solution: the designed limiting mechanism can clamp and limit the semiconductor circuit board, so that the installation of the semiconductor circuit board can be simulated during the subsequent drop test.

[0023] The present invention is further configured such that the linkage member includes a driving motor fixed at the bottom of one of the frames, the output end of the driving motor is fixed to the bottom of one of the screw rods through a coupling, and linkage gears are fixed on the outside of the two screw rods, and synchronous belts are meshed on the outside of the two linkage gears.

[0024] Through the above technical solution: the design of the linkage allows the two screw rods to rotate forward and reverse synchronously.

[0025] A semiconductor detection method comprises the following steps:

[0026] S1. The semiconductor circuit board is transported to the limit frame by a conveyor belt, and then the semiconductor circuit board is clamped and positioned by a limit mechanism;

[0027] S2. Move the moving tube upward on the screw rod until the push frame lifts up the adjustment frame, so that the tightening piece loosens the adjustment rope. Under the action of gravity, the mounting plate performs free fall motion to simulate a fall and collision. During the upward movement, the steering mechanism is triggered, so that each fall direction is different, thereby improving the randomness of the detection.

[0028] S3. Move the moving tube downward on the screw rod, pull the adjustment rope, reset the mounting plate, and simulate falling multiple times;

[0029] S4. Repeat steps S1-S3 several times, then open the limit mechanism, transfer the chip through the conveyor belt, and the personnel conduct power-on detection on the semiconductor circuit board.

[0030] The beneficial effects of the present invention are:

[0031] The present invention can simulate the installation and positioning of the semiconductor circuit board through the limit mechanism designed on the installation plate, and then the designed moving tube is lifted and lowered on the screw rod, so as to drive the adjustment rope to pull accordingly, and cooperate with the function of the tightening member to release the adjustment rope, so that the installation plate falls from a high place under the action of its own gravity, and the pins of the semiconductor circuit board with loose welding are separated in advance, and then the semiconductor circuit board with poor quality can be pre-removed through subsequent power-on detection;

[0032] The steering mechanism and the adjusting assembly designed in the present invention cooperate with each other, so that each upward movement of the moving tube can trigger the steering mechanism to rotate at a certain angle through the adjusting assembly, so that when the subsequent mounting plate falls, the falling direction can be adjusted accordingly, thereby improving the randomness of the falling. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0034] Figure 2 It is a schematic diagram of the internal structure of the frame of the present invention after partial section;

[0035] Figure 3 This is a schematic diagram of the positional relationship between the mounting plate and the conveyor belt of the present invention;

[0036] Figure 4 It is a schematic diagram of the positional relationship between the steering mechanism and the frame of the present invention;

[0037] Figure 5 It is a schematic diagram of the positional relationship between the adjustment component and the steering mechanism of the present invention;

[0038] Figure 6 This is a schematic diagram of the structure of the regulating component of the present invention;

[0039] Figure 7 It is a side view of the adjustment assembly of the present invention;

[0040] Figure 8 It is a schematic diagram of the position relationship between the adjusting member and the coaxial double gears of the present invention;

[0041] Fig. 9 This is a schematic structural diagram of one end of the top fastening member of the frame of the present invention;

[0042] Fig.10 This is a schematic diagram of the structure of the fastening member of the present invention;

[0043] Fig.11 It is a schematic diagram of the structure of the limiting mechanism of the present invention.

[0044] In the figure: 1. mounting plate; 2. frame; 3. limit mechanism; 4. screw rod; 5. linkage member; 6. moving tube; 7. adjustment rope; 8. support platform; 9. fastening member; 10. steering mechanism; 11. adjustment assembly; 12. rotating shaft; 13. docking member; 14. triangular frame; 15. coaxial double gear; 16. through groove; 17. baffle; 18. prismatic column; 19. tooth plate; 20. pulling plate; 21. extrusion spring; 22. arc plate; 23. docking column; 24. spring sheet 1; 25. L-shaped frame; 26. telescopic rod; 27. L-shaped 1. table; 28. tension spring; 29. ​​connecting arc plate; 30. trapezoidal track plate; 31. adjustment plate; 32. spring sheet two; 33. adjustment member; 34. docking plate; 35. tooth row; 36. connecting column; 37. spring sheet three; 38. clamping plate; 39. clamping rod; 40. adjustment frame; 41. clamping spring; 42. through port; 43. push frame; 44. track frame; 45. limit frame; 46. adjustment gear; 47. dual-axis motor; 48. drive gear; 49. inclined plate; 50. drive motor; 51. linkage gear; 52. synchronous belt. DETAILED DESCRIPTION

[0045] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0046] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of this patent, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing this patent and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this patent.

[0048] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be fixedly connected or set, or it can be detachably connected or set, or connected or set in one piece. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances. Embodiment 1

[0049] See also Figure 1-Figure 3 and Fig.10 , a semiconductor detection device shown in the figure includes a mounting plate 1 and a frame 2 arranged at both ends of the mounting plate 1, a bottom plate is fixed at the bottom of the two frames 2, two conveyor belts with opposite conveying directions are respectively arranged on both sides of the mounting plate 1, and a limiting mechanism 3 is installed in the mounting plate 1, and the limiting mechanism 3 is used for the installation and positioning of the semiconductor circuit board; two screw rods 4 installed in the two frames 2 are rotated by the bearing seat, and the bottom of the two screw rods 4 is installed with a linkage 5 for the synchronous rotation of the two screw rods 4, and the outer thread of the screw rod 4 is sleeved with a displacement A moving tube 6, an adjusting rope 7 is fixed to the outside of the moving tube 6, a through hole is opened at the top of the frame 2, and one end of the adjusting rope 7 slides through the through hole on the frame 2 and is fixed to one end of the top of the mounting plate 1, a support platform 8 for contacting the adjusting rope 7 is fixed to the outside of the through hole at the top of the frame 2, and a fastening member 9 for squeezing the adjusting rope 7 is installed on the top of the frame 2; a steering mechanism 10 installed on the frame 2, the steering mechanism 10 is used to change the falling direction of the mounting plate 1, and an adjusting component 11 for driving the steering mechanism 10 to rotate is installed on the outside of the moving tube 6;

[0050] In this solution, by moving the moving tube 6 up and down on the screw rod 4, in cooperation with the fastening member 9 for limiting the adjusting rope 7, the upward pulling and resetting of the mounting plate 1 and the subsequent automatic dropping operation can be realized, simulating the dropping operation of the semiconductor circuit board, so that some pins of the semiconductor circuit board that are not firmly welded can be detached in advance. After power is turned on, the low-quality semiconductor circuit boards can be detected and then removed in advance.

[0051] It is worth noting that the designed bottom plate enables the falling mounting plate 1 to fall on its surface every time.

[0052] Reference Figure 4-Figure 8 The steering mechanism 10 shown in the figure includes a rotating shaft 12 rotatably mounted on the frame 2 and a docking piece 13 mounted on the bottom of the mounting plate 1, a triangular frame 14 is fixed to one end of the rotating shaft 12, and a coaxial double gear 15 is fixed to the other end of the rotating shaft 12, and three through slots 16 are opened in the triangular frame 14, two baffles 17 are rotatably mounted at one end of the outlet of the through slot 16, and magnetic magnets that attract each other are installed between the baffles 17 and the outer wall of the triangular frame 14, a fixed plate is fixed to the inner side of the frame 2, and a prismatic column 18 is slidably inserted in the fixed plate, a tooth plate 19 meshing with the large gear in the coaxial double gear 15 is fixed to the bottom of the prismatic column 18, and a pulling plate 20 is fixed to the top, and an extrusion spring 21 for pushing the tooth plate 19 downward is sleeved on the outer side of the prismatic column 18, and the adjustment component 11 is connected to the pulling plate 20.

[0053] Among them, there are two docking parts 13, which are distributed at both ends of the bottom of the mounting plate 1. The docking part 13 includes an arc-shaped plate 22 fixed to the bottom of the mounting plate 1, and a docking column 23 adapted to the through groove 16 is rotatably installed in the arc-shaped plate 22 through a connecting shaft, and a spring sheet 24 is fixed to the outer side of the bottom of the mounting plate 1 to abut against the bottom of the docking column 23.

[0054] The principle of achieving angle adjustment when the mounting plate 1 falls is as follows: when the mounting plate 1 is in free fall, the docking column 23 at the bottom will abut against the outer side of the triangular frame 14 as the mounting plate 1 falls, and when contacting the outer edge of the triangular frame 14, it can move along the inclined surface at a certain angle, and after entering the through groove 16, it can also move along the through groove 16, thereby increasing the randomness of the mounting plate 1 falling.

[0055] When the mounting plate 1 moves upward, the docking post 23 will contact the outside of the triangular frame 14, and under the action of external force, the docking post 23 will be pushed, so that the docking post 23 squeezes the spring sheet 1 24 and bends, so that it can smoothly pass through the triangular frame 14 and smoothly restore the mounting plate 1.

[0056] It should be noted that the designed baffle 17 can block one end of the through slot 16 to prevent the docking column 23 from entering the through slot 16 when moving on the inclined surface of the triangular frame 14. At the same time, when the docking column 23 enters the through slot 16 from one end, it can also smoothly push away the baffle 17 from the inside of the through slot 16, thereby making the installation plate 1 fall more smoothly.

[0057] In addition, in the present embodiment, a track frame 44 is fixed to the outside of the top end of the frame body 2 for limiting the movement of the docking column 23, and the bottom of the track frame 44 is an open structure, so that when the mounting plate 1 falls, it can move downward through the track frame 44, which is more convenient for contact with the triangular frame 14, thereby improving the stability of the mounting plate 1 when it just moves downward.

[0058] At the same time, refer to Figure 6-Figure 8 The adjustment component 11 includes an L-shaped frame 25 fixed to the outside of the moving tube 6, the L-shaped frame 25 is fitted with the inner wall of the frame 2, and a telescopic rod 26 is fixed in the L-shaped frame 25, an L-shaped platform 27 fitted with the surface of the L-shaped frame 25 is fixed to the outer end of the telescopic rod 26, and a tension spring 28 fixed to the L-shaped platform 27 and the L-shaped frame 25 is sleeved on the outer side of the telescopic rod 26, a connecting arc plate 29 is fixed between the two L-shaped platforms 27, and a trapezoidal track plate 30 is fixed in the frame 2, an adjustment plate 31 corresponding to the pulling plate 20 is rotatably installed in the L-shaped platform 27, and a spring sheet 2 32 abutting against the adjustment plate 31 is fixed in the L-shaped platform 27, and an adjustment member 33 meshing with the coaxial double gear 15 is fixed to the bottom of the moving tube 6 through a bracket.

[0059] Among them, the adjusting member 33 includes a docking plate 34 fixed to the outer end of the bracket and a tooth row 35 adapted to the small gear in the coaxial double gear 15, a connecting column 36 plugged into the docking plate 34 is fixed to the outer side of the tooth row 35, and a limiting block is fixed to the outer end of the connecting column 36, and a spring sheet 37 fitted with the docking plate 34 is fixed to the outer side of the tooth row 35.

[0060] The principle of the adjustment component 11 triggering the steering mechanism 10 is as follows: when the moving tube 6 moves upward on the screw rod 4, the adjusting plate 31 on the L-shaped platform 27 will abut against the bottom of the pulling plate 20, and as the moving tube 6 moves upward, the pulling plate 20 will be pulled upward, so that the prismatic column 18 and the toothed plate 19 move upward and disengage from the coaxial double gear 15. Then, as the moving tube 6 continues to move upward, the connecting arc plate 29 at the rear end of the L-shaped platform 27 moves along the trapezoidal track plate 30, and under the action of the tension spring 28 , the L-shaped table 27 is pulled backward, so that the adjustment plate 31 moves backward and disengages from the pulling plate 20, and under the action of the extrusion spring 21, the tooth plate 19 is again against the coaxial double gear 15. In the process of pulling the tooth plate 19 apart, the moving tube 6 continues to move upward, which will cause the tooth row 35 to move upward and drive the coaxial double gear 15 to rotate, so that the rotating shaft 12 and the triangular frame 14 rotate accordingly, so that when the subsequent mounting plate 1 falls, the falling direction will change accordingly each time, thereby improving the randomness of the fall.

[0061] When the moving tube 6 moves downward, the adjustment plate 31 on the L-shaped table 27 will contact the pulling plate 20. At this time, under the action of external force, the adjustment plate 31 will be bent and pass through the pulling plate 20 smoothly. At this time, the tooth plate 19 is meshed with the coaxial double gear 15, which will prevent the coaxial double gear 15 from rotating. At this time, when the gear row 35 contacts the coaxial double gear 15, it will not drive it to rotate. When they are offset, the gear row 35 will squeeze the spring sheet 37 and retract, so that when the moving tube 6 moves downward, the condition that the gear row 35 passes through the coaxial double gear 15 smoothly is met.

[0062] In this solution, in order to reduce the friction between the adjustment plate 31 and the pulling plate 20 and facilitate smoother retraction of the subsequent adjustment plate 31, a plurality of rollers are installed on the contact surface between the adjustment plate 31 and the pulling plate 20.

[0063] In addition, please refer to Fig.11 The limiting mechanism 3 shown in the figure includes two limiting frames 45, which are distributed at both ends of the mounting plate 1, and an adjusting shaft is fixed to the bottom of the limiting frame 45. The two ends of the adjusting shaft are rotatably connected with the two ends of the mounting plate 1 through bearing seats, and adjusting gears 46 are fixed to the outer sides of both ends of the adjusting shaft. A dual-axis motor 47 is fixed in the mounting plate 1, and two driving gears 48 are fixed to the output end of the dual-axis motor 47 through a coupling, and the driving gear 48 is meshed with the two adjusting gears 46 on its outer side.

[0064] Wherein, inclined plates 49 adapted to the limiting frames 45 are fixed on both sides of the mounting plate 1 .

[0065] The method for installing a semiconductor circuit board is as follows: first, the semiconductor circuit board is conveyed into a limit frame 45 by a conveyor belt, and then a driving gear 48 is driven to rotate by a dual-axis motor 47, so that the two adjustment gears 46 rotate synchronously, thereby causing the two limit frames 45 to rotate and abut against the inclined plate 49, thereby realizing simulated installation positioning of the semiconductor circuit board.

[0066] It should also be noted that: after the semiconductor circuit board is detected for falling, the mounting plate 1 is moved to the specified position, and the driving gear 48 is driven to rotate by the dual-axis motor 47, so that the limit frame 45 opens, and the semiconductor circuit board can be transferred through the conveyor belt at the bottom, thereby realizing automatic loading and unloading of the semiconductor circuit board.

[0067] It is worth noting that the upper conveyor belt is used to transport the chips, and the bottom conveyor belt is used to transport the semiconductor circuit boards that have passed the drop detection.

[0068] In this solution, the linkage part 5 includes a driving motor 50 fixed at the bottom of one of the frames 2, the output end of the driving motor 50 is fixed to the bottom of one of the screw rods 4 through a coupling, and linkage gears 51 are fixed on the outside of the two screw rods 4, and synchronous belts 52 are meshed on the outside of the two linkage gears 51.

[0069] It should be noted that: by rotating the driving motor 50 , one of the screw rods 4 is driven to rotate, and under the action of the synchronous belt 52 and the linkage gear 51 , the two screw rods 4 rotate synchronously, and the forward and reverse rotation of the screw rod 4 is achieved by the forward and reverse rotation of the driving motor 50 .

[0070] The principle of detecting the chips with loose soldering in some chips is as follows: First, the chips to be tested are transported to the front end through the conveyor belt above, and then Figure 3The limit frame 45 shown catches the semiconductor circuit board, and then the limit frame 45 rotates and cooperates with the inclined plate 49 to complete the simulated installation and positioning of the semiconductor circuit board. After that, the two lead screws 4 are rotated synchronously through the linkage member 5, driving the moving tube 6 to move upward, and when it moves to the vicinity of the rotating shaft 12, the adjusting plate 31 is abutted against the pulling plate 20, driving the pulling plate 20 to move upward, loosening the tooth plate 19 meshing with the coaxial double gear 15, and then driving the tooth row 35 to move, so that the coaxial double gear 15 that is not limited is rotated by a certain angle, and also driving the rotating shaft 12 and the triangular frame 14 to rotate correspondingly by a certain angle. After that, the moving tube 6 continues to move, which will drive the trigger abutment 9 to release the limit on the adjusting rope 7. After there is no adjusting rope 7 pulling, the mounting plate 1 performs free fall motion by its own gravity, and changes the falling direction after contacting the triangular frame 14 at different angles.

[0071] When the moving tube 6 moves up and down on the screw rod 4, it will pull the adjusting rope 7, so that the installation plate 1 that has fallen off will slowly move up, and when it moves to the vicinity of the rotating shaft 12, it will first contact the pulling plate 20 through the adjusting plate 31, and the adjusting plate 31 will be bent by force, and finally pass through the pulling plate 20. Because the tooth plate 19 abuts against the coaxial double gear 15, the tooth row 35 will squeeze the spring sheet 3 37 when moving to the coaxial double gear 15, so that it can also pass smoothly, and as the moving tube 6 finally moves to the bottom end of the screw rod 4, it will pull the installation plate 1 to move up, and the docking column 23 will be bent by force when it abuts against the triangular frame 14 until it breaks away from the triangular frame 14 and smoothly contacts the track frame 44, so as to achieve stable resetting of the installation plate 1, so that in the next dropping operation, some of the welding places in the semiconductor circuit board that are not firmly welded can be loosened in advance, so that after the subsequent power-on detection, the semiconductor circuit board with low quality can be pre-removed to prevent low-quality chips from entering the market.

[0072] In this solution, a semiconductor detection method includes the following steps:

[0073] S1. The semiconductor circuit board is transported to the limit frame 45 by a conveyor belt, and then the semiconductor circuit board is clamped and positioned by the limit mechanism 3;

[0074] S2. Move the moving tube 6 upward on the screw rod 4 until the push frame 43 lifts up the adjustment frame 40, so that the tightening member 9 releases the adjustment rope 7. Under the action of gravity, the mounting plate 1 performs free fall motion to simulate a fall and collision. During the upward movement, the steering mechanism 10 is triggered, so that each fall direction is different, thereby improving the randomness of the detection;

[0075] S3. Move the tube 6 downward on the screw rod 4, pull the adjustment rope 7, so that the mounting plate 1 is reset, and perform multiple simulated falls;

[0076] S4. Repeat steps S1-S3 for several times, then open the limit mechanism 3, transfer the chip through the conveyor belt, and perform power-on detection on the semiconductor circuit board. Embodiment 2

[0077] Reference Fig. 9 and Fig.10 As shown, this embodiment further illustrates Example 1, and the clamping member 9 shown in the figure includes a clamping plate 38 installed in the through hole, a clamping rod 39 plugged into the support platform 8 is fixed to the bottom of the clamping plate 38, an adjusting frame 40 is fixed to the bottom of the clamping rod 39, and a clamping spring 41 that is abutted against the adjusting frame 40 and the support platform 8 is sleeved on the outer side of the clamping rod 39, a through opening 42 is opened at the top of the frame 2, and one end of the adjusting frame 40 slides through the through opening 42 and extends into the frame 2, a pushing frame 43 adapted to the adjusting frame 40 is fixed to the top of the moving tube 6, and one end of the adjusting rope 7 is fixed in the pushing frame 43.

[0078] It should be noted that when the movable tube 6 moves upward on the screw rod 4, the push frame 43 will eventually abut against the adjusting frame 40 and drive it to move up a certain distance, thereby moving the clamping rod 39 and the clamping plate 38 upward, so that the adjusting rope 7 is no longer squeezed. At this time, the mounting plate 1 can be free from the pulling of the adjusting rope 7 and perform free fall movement, which is convenient for the falling operation.

[0079] It should also be noted that a rubber block is fixed to the bottom of the clamping plate 38, which is in contact with the outer side of the adjusting rope 7, so that when the movable tube 6 moves downward, the adjusting rope 7 can be pulled, so that the adjusting rope 7 pulls the mounting plate 1 to reset, and at the same time, the adjusting rope 7 is clamped, so that when the movable tube 6 moves upward, as long as the adjusting frame 40 is not touched, the adjusting rope 7 will not loosen, and the mounting plate 1 can be effectively dropped from a high place.

[0080] It is worth noting that the push frame 43 has a certain space so that the loose adjustment rope 7 can be accommodated when the moving tube 6 moves upward.

[0081] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor testing device, comprising: A mounting plate (1) and frames (2) arranged at both ends of the mounting plate (1), bottom plates being fixed to the bottoms of the two frames (2), two conveyor belts with opposite conveying directions being arranged on both sides of the mounting plate (1), characterized in that the detection device further comprises: A limiting mechanism (3) installed in the installation plate (1), the limiting mechanism (3) being used for positioning the installation of the semiconductor circuit board; Two screw rods (4) are rotatably mounted in the two frames (2) through bearing seats, a linkage member (5) for synchronously rotating the two screw rods (4) is mounted at the bottom of the two screw rods (4), and a moving tube (6) is threadedly sleeved on the outer side of the screw rod (4), an adjusting rope (7) is fixed on the outer side of the moving tube (6), a through hole is opened on the top of the frame (2), and one end of the adjusting rope (7) slides through the through hole on the frame (2) and is fixed to one end of the top of the mounting plate (1), a support platform (8) for contacting the adjusting rope (7) is fixed on the outer side of the through hole on the top of the frame (2), and a tightening member (9) for squeezing the adjusting rope (7) is mounted on the top of the frame (2); A steering mechanism (10) mounted on the frame (2), the steering mechanism (10) being used to change the falling direction of the mounting plate (1), and an adjusting component (11) for driving the steering mechanism (10) to rotate being mounted on the outer side of the moving tube (6); The steering mechanism (10) comprises a rotating shaft (12) rotatably mounted on a frame (2) and a docking member (13) mounted on the bottom of a mounting plate (1); a triangular frame (14) is fixed to one end of the rotating shaft (12); a coaxial double gear (15) is fixed to the other end of the rotating shaft (12); three through slots (16) are formed in the triangular frame (14); two baffles (17) are rotatably mounted at one end of the outlet of the through slot (16); and the baffles (17) are in contact with the triangular frame (14). Magnetic magnets that attract each other are installed between the outer walls, a fixed plate is fixed on the inner side of the frame (2), and a prismatic column (18) is slidably inserted in the fixed plate, a toothed plate (19) meshing with the large gear of the coaxial double gear (15) is fixed on the bottom of the prismatic column (18), and a pulling plate (20) is fixed on the top, and an extrusion spring (21) for pushing the toothed plate (19) downward is sleeved on the outer side of the prismatic column (18), and the adjustment component (11) is connected to the pulling plate (20); The adjustment assembly (11) comprises an L-shaped frame (25) fixed on the outside of the moving tube (6), the L-shaped frame (25) being in contact with the inner wall of the frame (2), a telescopic rod (26) being fixed inside the L-shaped frame (25), an L-shaped platform (27) being in contact with the surface of the L-shaped frame (25) being fixed to the outer end of the telescopic rod (26), and a tension spring (28) being fixed to the L-shaped platform (27) and the L-shaped frame (25) being sleeved on the outer side of the telescopic rod (26). A connecting arc plate (29) is fixed between the two L-shaped platforms (27), and a trapezoidal track plate (30) is fixed in the frame (2). An adjustment plate (31) corresponding to the pulling plate (20) is rotatably mounted in each of the L-shaped platforms (27), and a second spring sheet (32) abutting against the adjustment plate (31) is fixed in the L-shaped platform (27). An adjustment member (33) meshing with the coaxial double gear (15) is fixed at the bottom of the moving tube (6) via a bracket.

2. A semiconductor detection device according to claim 1, characterized in that: Two docking members (13) are provided and are distributed at both ends of the bottom of the mounting plate (1). The docking member (13) comprises an arc-shaped plate (22) fixed to the bottom of the mounting plate (1), and a docking column (23) adapted to the through groove (16) is rotatably mounted in the arc-shaped plate (22) via a connecting shaft. A spring sheet (24) abutting against the bottom of the docking column (23) is fixed to the outer side of the bottom of the mounting plate (1).

3. The semiconductor detection device according to claim 1, characterized in that: The adjusting member (33) comprises a docking plate (34) fixed to the outer end of the bracket and a tooth row (35) adapted to the small gear in the coaxial double gear (15); a connecting column (36) plugged into the docking plate (34) is fixed to the outer side of the tooth row (35); a limiting block is fixed to the outer end of the connecting column (36); and a spring sheet (37) abutting against the docking plate (34) is fixed to the outer side of the tooth row (35).

4. The semiconductor detection device according to claim 1, characterized in that: The abutting member (9) comprises a abutting plate (38) installed in the through hole, a abutting rod (39) plugged into the support platform (8) is fixed at the bottom of the abutting plate (38), an adjusting frame (40) is fixed at the bottom of the abutting rod (39), and a abutting spring (41) abutting against the adjusting frame (40) and the support platform (8) is sleeved on the outer side of the abutting rod (39), a through hole (42) is opened at the top of the frame (2), and one end of the adjusting frame (40) slides through the through hole (42) and extends into the frame (2), a pushing frame (43) matched with the adjusting frame (40) is fixed at the top of the moving tube (6), and one end of the adjusting rope (7) is fixed in the pushing frame (43).

5. The semiconductor detection device according to claim 2, characterized in that: A track frame (44) for limiting the movement of the docking column (23) is fixed to the outside of the top end of the frame body (2), and the bottom of the track frame (44) is an open structure.

6. The semiconductor testing device according to claim 1, characterized in that: The limiting mechanism (3) comprises two limiting frames (45), the two limiting frames (45) are distributed at two ends of the mounting plate (1), and an adjusting shaft is fixed at the bottom of the limiting frame (45), the two ends of the adjusting shaft are rotatably connected with the two ends of the mounting plate (1) through a bearing seat, and the outer sides of the two ends of the adjusting shaft are fixed with adjusting gears (46), a dual-axis motor (47) is fixed inside the mounting plate (1), and two driving gears (48) are fixed to the output end of the dual-axis motor (47) through a coupling, and the driving gear (48) is meshed with the two adjusting gears (46) on the outer sides thereof.

7. The semiconductor detection device according to claim 1, characterized in that: The linkage member (5) comprises a drive motor (50) fixed to the bottom of one of the frames (2); an output end of the drive motor (50) is fixed to the bottom of one of the lead screws (4) via a coupling; linkage gears (51) are fixed to the outsides of the two lead screws (4); and synchronous belts (52) are meshed on the outsides of the two linkage gears (51).

8. A semiconductor detection method, comprising a semiconductor detection device according to any one of claims 1 to 7, characterized in that: The method comprises the following steps: S1. The semiconductor circuit board is conveyed to the limit frame (45) by a conveyor belt, and then the semiconductor circuit board is clamped and positioned by a limit mechanism (3); S2. The moving tube (6) moves upward on the screw rod (4) until the push frame (43) lifts the adjustment frame (40), so that the tightening member (9) releases the adjustment rope (7). Under the action of gravity, the mounting plate (1) performs free fall motion to simulate a fall and collision. During the upward movement, the steering mechanism (10) is triggered, so that each fall direction is different, thereby improving the randomness of the detection; S3. By moving the tube (6) downward on the screw rod (4), pulling the adjustment rope (7), the mounting plate (1) is reset, and multiple simulated falls are performed; S4. Repeat steps S1-S3 several times, then open the limit mechanism (3), transfer the chip via the conveyor belt, and conduct power-on inspection on the semiconductor circuit board.