Ultra-thin resin dicing knife for semiconductor wafer cutting and preparation method thereof

Abstract

The present application relates to the field of grinding wheel technology, more specifically, it relates to a kind of ultra-thin resin dicing knife for semiconductor wafer cutting and its preparation method. It is composed of the following raw materials in parts by weight: 25-35 parts of abrasive, 15-25 parts of resin powder, 13-18 parts of filler, 12-20 parts of modifier, and the modifier is made of polyborosilazane, acrylate-based siloxane, long-chain acrylate-based siloxane polymer, initiator, and solvent. By borosilazane, acrylate-based siloxane, long-chain acrylate-based siloxane polymer compounding, and under the action of solvent and initiator, compound and react, so that the prepared modifier has better film-forming property, adhesion, compatibility with polymer and heat resistance, so the modifier forms a coating film on the surface of abrasive and filler, so that it is fully uniform with resin powder, and after sintering, the formed resin dicing knife has better structural stability, reducing the phenomenon of damage, wear and tear.

Description

Technical Field

[0001] The present application relates to the technical field of grinding wheels, and more specifically, to an ultra-thin resin dicing knife for cutting semiconductor wafers and a preparation method thereof. Background Art

[0002] Resin dicing blade is a sintered blade, which is made of thermosetting resin as a binder and diamond and other abrasives. It has good self-sharpening, sharp cutting, high processing efficiency, good elasticity, etc., which can maximize the cutting quality. Therefore, it is widely used in processing difficult-to-process materials such as glass and crystalline materials, or cutting various packaging materials.

[0003] At present, resin dicing knives are mainly composed of abrasives, fillers, and resin powder. The abrasives have high hardness, high compressive strength, and low friction coefficient, which enhance the self-sharpening and cutting sharpness of the resin dicing knife, making it have a certain hardness, which is convenient for cutting various glasses, semiconductors, etc.; the filler is usually a thermal conductive filler, which plays a role in heat dissipation and reduces the large amount of heat generated during the process. The resin has a bonding effect and can bond the abrasives and fillers stably. After sintering, a resin dicing knife with a stable structure is formed.

[0004] However, in order to further improve the processing accuracy, ultra-thin resin scriber blades are usually used, with a thickness as low as micron level. As the thickness is thinner, the cutting accuracy is better, but as the cutting speed increases, the cutting process is prone to edge chipping and excessive wear, which in turn affects the processing efficiency. Therefore, further research is needed. Summary of the invention

[0005] In order to obtain a resin dicing knife with a thinner thickness and ensure that wear, edge collapse and the like are reduced at a higher cutting speed, the present application provides an ultra-thin resin dicing knife for semiconductor wafer cutting and a preparation method thereof.

[0006] In the first aspect, an ultra-thin resin dicing knife for semiconductor wafer cutting is composed of the following raw materials in parts by weight: 25-35 parts of abrasive

[0007] Resin powder 15-25 parts

[0008] Filling 13-18 parts

[0009] Modifier 12-20 parts

[0010] The modifier is prepared from polyborosilazane, acrylate siloxane, long-chain acrylate siloxane polymer, initiator and solvent.

[0011] Abrasives and fillers are difficult to make compatible with resin powder, so this application uses a modifier to modify its surface to form a coating film to improve its compatibility with resin powder, thereby improving the structural stability of the resin dicing knife and reducing the possibility of edge collapse and wear during use.

[0012] Specifically, polyborosilazane has high strength, adhesion and heat resistance, acrylate siloxane contains acrylate and siloxy groups, has good adhesion and film-forming properties, and can undergo self-polymerization; long-chain acrylate siloxane polymer contains double bonds and siloxy groups, which are further grafted with acrylate siloxane under the action of an initiator, and then compounded with polyborosilazane to obtain a macromolecular polymer complex, which is diluted under the action of a solvent to make the prepared modifier have good film-forming properties, adhesion, compatibility with polymers and heat resistance. Therefore, the modification can easily form a coating film on the surface of the abrasive and filler, making it fully uniform with the resin powder. After sintering, the formed resin dicing knife has good structural stability, reducing the occurrence of breakage, wear and the like.

[0013] The ultra-thin thickness in this application is 75-150 microns.

[0014] Preferably, the weight ratio of the polyborosilazane, acrylate siloxane, long-chain acrylate siloxane polymer, initiator, and solvent is (5-8):(1-3):(1-2):(0.01-0.03):20.

[0015] The above dosage range is the preferred composition of this application. The prepared modifier improves the compatibility of abrasives, fillers and resin powder in the resin dicing knife raw material system, while improving the heat resistance and adhesion of the resin powder, thereby making the prepared resin dicing knife have better structural stability and reducing the occurrence of breakage, wear and the like.

[0016] Preferably, the acrylate siloxane is bis-3-methacryloxypropylated tetramethyldisiloxane and / or 1,3-diacryloxymethyl)phenethyl]tetramethyldisiloxane.

[0017] Both bis-3-methylpropyleneoxypropylated tetramethyldisiloxane and [1,3-diacryloxymethyl]phenethyl]tetramethyldisiloxane contain two double bonds and silane, and can be further grafted with acrylate siloxane and combined with polyborosilazane. The formed modifier has better film-forming properties, adhesion, heat resistance and compatibility with polymers. After the abrasive and filler are coated and modified, it is easy to form a structure with resin powder. The resin scriber obtained after sintering has better structural stability. When it is in a high-speed cutting process, it reduces the occurrence of edge collapse, cracking, wear and other phenomena.

[0018] Preferably, the weight ratio of the bis-3-methylacryloxypropylated tetramethyldisiloxane to 1,3-bis(acryloyloxymethyl)phenethyl)tetramethyldisiloxane is 1:(1-4).

[0019] When bis-3-methylpropyleneoxypropylated tetramethyldisiloxane and 1,3-bis(acryloyloxymethyl)phenethyl)tetramethyldisiloxane are used, a synergistic effect is achieved, thereby further improving the structural stability of the resin scriber blade and reducing the possibility of breakage, cracking, edge collapse, and wear during the process of cutting semiconductors, glass, etc.

[0020] Preferably, the long-chain acrylate-based siloxane polymer is a polymer of 2-hydroxyethyl 2-methyl-2-acrylate, vinyl acetate and 3-(trimethoxysilyl)propyl 2-methacrylate and / or a polymer of methyl 2-methyl-2-acrylate and 3-(trimethoxysilyl)propyl 2-methyl-2-acrylate.

[0021] The polymer of 2-methyl-2-acrylic acid-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester, and the polymer of 2-methyl-2-acrylic acid methyl ester and 2-methyl-2-acrylic acid-3-(trimethoxysilyl)propyl ester are all polyacrylate-based siloxy polymers, and have good film-forming properties, adhesion and compatibility with polymers. They can be compounded with acrylate-based siloxanes and polyborosilazane to form macromolecular polymeric complexes. The obtained modifier is used to modify abrasives, fillers, and resin powders so that they can be fully mixed with each other. The resin dicing blade obtained has good structural stability, reducing the possibility of edge collapse, breakage, wear, etc. in the process of cutting semiconductor boards.

[0022] Preferably, the weight ratio of the polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester, and the polymer of methyl 2-methyl-2-acrylate and 2-methyl-2-acrylate-3-(trimethoxysilyl)propyl ester is 1:(1-4).

[0023] When the present application selects a polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester with vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester and / or a polymer of 2-methyl-2-acrylate with 2-methyl-3-(trimethoxysilyl)propyl ester for compounding, a synergistic effect is achieved, thereby further improving the structural stability of the resin dicing knife and reducing the possibility of wear and tear during use.

[0024] Preferably, the abrasive is composed of one or more of single crystal diamond, polycrystalline diamond, and cubic boron nitride.

[0025] By selecting one or more of the above abrasives, the resin dicing knife has better structural stability, wear resistance, etc.

[0026] Preferably, the resin powder is one or more of phenolic resin powder, epoxy resin, PI powder and aramid powder.

[0027] Phenolic resin powder and epoxy resin have better adhesion. PI powder is a polyimide resin with better wear resistance, film-forming property, compressive strength, etc. Aramid powder is obtained by grinding aramid fiber, which has higher toughness and wear resistance.

[0028] When one of phenolic resin powder, epoxy resin, PI powder and aramid powder is used, the abrasive and filler can be coated.

[0029] When epoxy resin, PI powder and aramid powder are compounded and the modifier is used, they can obtain better wear resistance, toughness, compressive strength, heat resistance, adhesion, etc., and then combined with abrasives, resin powder, etc., the obtained resin dicing blade has better toughness, hardness, heat resistance, wear resistance and structural stability, etc., reducing the possibility of wear, breakage and cracking during the cutting process. At the same time, the resin dicing knife can be cut at a higher cutting speed and is not prone to edge collapse. Edge collapse refers to the appearance of gaps on the edge of the resin dicing knife.

[0030] Preferably, the filler is one or more of carbon nanotubes, silicon carbide, and graphite powder.

[0031] The use of carbon nanotubes, silicon carbide, and graphite powder all have a better heat dissipation effect and enhance the structure of the resin scriber blade. The resin scriber blade is prone to generate a lot of heat during the cutting process. If the heat is not dissipated in time, it is easy to cause the temperature of the resin scriber blade to be too high, and the internal resin will also soften, thereby affecting the overall structural stability.

[0032] The modifiers made of polyborosilazane, acrylate siloxane, and long-chain acrylate siloxane polymers used in this application can also modify the resin powder, improve its heat resistance, adhesion, and bonding stability with abrasives and fillers, so that the resulting resin cutting blade has better toughness, hardness, heat resistance, wear resistance, and structural stability, reducing the possibility of wear, breakage, cracking, and edge collapse during the cutting process.

[0033] In a second aspect, a method for preparing an ultra-thin resin dicing knife for semiconductor wafer cutting comprises the following steps: weighing acrylate siloxane, long-chain acrylate siloxane polymer, solvent, initiator, and polyborosilazane in parts by weight, mixing them evenly, and reacting them to obtain a modifier;

[0034] According to the weight percentage, the abrasive and filler are weighed and mixed evenly, and then 1 / 2 of the modifier is added and ground to obtain a mixture A; the resin powder and 1 / 2 of the modifier are weighed and mixed evenly to obtain a mixture B;

[0035] Add mixture B to mixture A, continue grinding to obtain a composite; transfer the composite to a mold, perform molding to obtain a mold base, and sinter the mold base to obtain a resin scribing blade.

[0036] In the above process, acrylate siloxane, long-chain acrylate siloxane polymer and polyborosilazane are compounded and reacted under the action of an initiator and a solvent to obtain a modifier having comprehensive properties.

[0037] By using 1 / 2 modifier, abrasive and filler to grind the ball, its surface is modified to improve its compatibility with the polymer, and the resin powder and 1 / 2 modifier are compounded, the solvent in the modifier can dissolve the resin powder to form a blended modified mixture B with good heat resistance and good adhesion. When the mixture B is mixed with the mixture A, it is molded and sintered to form a resin blade with good structural stability, wear resistance and good toughness. The resin blade can be cut at a higher cutting speed without edge collapse, cracking, breakage and the like. After multiple cuttings, the wear degree is low and a longer service life is obtained.

[0038] In summary, this application has the following beneficial effects:

[0039] 1. The present application compounds borosilazane, acrylate siloxane, and long-chain acrylate siloxane polymers, and compound and react them under the action of solvents and initiators, so that the prepared modifier has better film-forming properties, adhesion, compatibility with polymers, and heat resistance. Therefore, the modification can easily form a coating film on the surface of the abrasive and filler, so that it is fully mixed with the resin powder. After sintering, the formed resin dicing knife has better structural stability, reducing the occurrence of breakage, wear and the like.

[0040] 2. The preparation method of the present application is compounded by acrylate siloxane, long-chain acrylate siloxane polymer, and polyborosilazane, and the compounding reaction is carried out under the action of an initiator and a solvent, so that the materials undergo a preliminary reaction, and the obtained modifier has its comprehensive performance. By using 1 / 2 modifier and abrasives and fillers to grind the ball, the surface is modified to improve its compatibility with the polymer, and the resin powder and 1 / 2 modifier are compounded. The solvent in the modifier can dissolve the resin powder and form a blended modified mixture B with good heat resistance and good adhesion. When the mixture B is mixed with the mixture A, it is molded and sintered to form a resin blade with good structural stability, wear resistance, and good toughness. The resin blade can be cut at a higher cutting speed without edge collapse, cracking, breakage, etc. After multiple cuttings, the wear degree is low and a longer service life is obtained. DETAILED DESCRIPTION

[0041] The present application is further described in detail below with reference to the embodiments.

[0042] The sources of some raw materials;

[0043] Table 1 Sources of some raw materials

[0044]

[0045]

[0046] Example

[0047] Example 1

[0048] An ultra-thin resin dicing knife for semiconductor wafer cutting is prepared by the following method:

[0049] 1 kg of acrylated siloxane, 1 kg of long-chain acrylated siloxane polymer, 20 kg of solvent, 5 kg of polyborosilazane, and 0.01 kg of initiator were weighed and put into a reactor, mixed at a speed of 200 r / min for 10 min, heated to 68 ° C, and reacted for 2 h to obtain a modifier.

[0050] Weigh 25 kg of abrasive and 13 kg of filler and put them into a ball mill, grind them at a speed of 100 r / min for 10 min, then add 6 kg of modifier into the ball mill, and continue grinding for 1 h to obtain mixture A; weigh resin powder and 1 / 2 of the modifier and put them into a stirring device, stir them at a speed of 150 r / min for 30 min to fully dissolve the resin powder, and obtain mixture B;

[0051] Add mixture B to mixture A, continue grinding for 1 hour to obtain a composite; transfer the composite to a mold, and perform molding at a pressure of 12 MPa, a molding temperature of 185°C, and a holding time of 100 seconds to obtain a mold base; sinter the mold base, and heat the temperature to 195°C at a rate of 5°C / min during the sintering process, keep the temperature for 1 hour, and then heat the temperature to 215°C at a rate of 3°C / min, and hold the temperature for 30 minutes to obtain a resin scribing blade with an average thickness of 123 μm.

[0052] Among them, the acrylate siloxane is 1,3-bis(acryloyloxymethyl)phenethyl]tetramethyldisiloxane; the long-chain acrylate siloxane polymer is a polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate 3-(trimethoxysilyl)propyl ester; the resin powder is phenolic resin powder; the filler is graphite powder; and the abrasive is single crystal diamond.

[0053] Embodiment 2-5

[0054] The difference between Example 2-5 and Example 1 is that the composition of the raw materials is different, as shown in Table 2;

[0055]

[0056]

[0057] Example 6

[0058] The difference between Example 6 and Example 4 is that the acrylate siloxane is composed of 1 kg of bis-3-methacryloxypropylated tetramethyldisiloxane and 1 kg of 1,3-bis(acryloyloxymethyl)phenethyl)tetramethyldisiloxane.

[0059] Example 7

[0060] The difference between Example 7 and Example 4 is that the acrylate siloxane is composed of 0.8 kg of bis-3-methacryloxypropylated tetramethyldisiloxane and 1.2 kg of 1,3-bis(acryloyloxymethyl)phenethyl)tetramethyldisiloxane.

[0061] Example 8

[0062] The difference between Example 8 and Example 4 is that the acrylate siloxane is composed of 0.4 kg of bis-3-methacryloxypropylated tetramethyldisiloxane and 1.6 kg of 1,3-bis(acryloyloxymethyl)phenethyl)tetramethyldisiloxane.

[0063] Example 9

[0064] The difference between Example 9 and Example 7 is that the long-chain acrylate-based siloxane polymer is composed of 0.75 kg of a polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester, and 0.75 kg of a polymer of 2-methyl-2-acrylate-3-(trimethoxysilyl)propyl ester.

[0065] Example 10

[0066] The difference between Example 10 and Example 7 is that the long-chain acrylate-based siloxane polymer is composed of 0.5 kg of a polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester, and 1.0 kg of a polymer of 2-methyl-2-acrylate-methyl ester and 2-methyl-2-acrylate-3-(trimethoxysilyl)propyl ester.

[0067] Embodiment 11

[0068] The difference between Example 11 and Example 7 is that the long-chain acrylate-based siloxane polymer is composed of 0.3 kg of a polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester, and 1.2 kg of a polymer of 2-methyl-2-acrylate-methyl ester and 2-methyl-2-acrylate-3-(trimethoxysilyl)propyl ester.

[0069] Example 12

[0070] The difference between Example 12 and Example 10 is that the abrasive consists of 18 kg of single crystal diamond and 12 kg of polycrystalline diamond.

[0071] Example 13

[0072] The difference between Example 13 and Example 12 is that the resin powder consists of 6 kg epoxy resin, 11 kg PI powder, and 3 kg aramid powder.

[0073] Embodiment 14

[0074] The difference between Example 14 and Example 13 is that the filler consists of 1 kg of carbon nanotubes, 4 kg of silicon carbide, and 10 kg of graphite powder.

[0075] Comparative Example

[0076] Comparative Example 1

[0077] The difference between Comparative Example 1 and Example 1 is that the acrylate siloxane is replaced by an equal amount of silane coupling agent KH550.

[0078] Comparative Example 2

[0079] The difference between Comparative Example 2 and Example 1 is that the long-chain acrylate-based siloxane polymer is replaced by acrylate-based siloxane in equal amounts.

[0080] Comparative Example 3

[0081] The difference between Comparative Example 3 and Example 1 is that an equal amount of acrylate-based siloxane is replaced by a long-chain acrylate-based siloxane-based polymer.

[0082] Comparative Example 4

[0083] The difference between Comparative Example 4 and Example 1 is that polyborosilazane is replaced by polydimethylsiloxane in an equal amount.

[0084] Comparative Example 5

[0085] The difference between Comparative Example 5 and Example 1 is that the long-chain acrylate-based siloxy polymer is replaced by polysilicon borazane in equal amounts.

[0086] Comparative Example 6

[0087] The difference between Comparative Example 6 and Example 1 is that the modifier is replaced by liquid phenolic resin in equal amount.

[0088] Comparative Example 7

[0089] The difference between Comparative Example 7 and Example 1 is that the modifier consists of silane coupling agent KH550 and solvent in a weight ratio of 3:10.

[0090] Performance testing

[0091] The resin dicing knives obtained from Examples 1-14 and Comparative Examples 1-6 were subjected to the following performance tests, as shown in Table 3.

[0092] Detection method / test method (a) The resin dicing knife obtained from Examples 1-14 and Comparative Examples 1-6 is used in a wafer cutting machine to cut wafers. The wafer thickness is 1.01 mm, and the spindle speed of the wafer cutting machine is 30 kRRM. The resin dicing knife cuts at speeds of 8.5 m / s, 10 m / s, 12.5 m / s, 15 m / s, and 16 m / s, respectively. After cutting at 10 m / s, take out the resin dicing knife, clean the surface, and stop to observe whether there is damage, edge collapse, etc. If the above situation occurs, it is recorded as 8.5 m / s. If there is no such situation, and after the resin dicing knife cuts at a speed of 10 m / s, take out the resin dicing knife, clean the surface, and stop to observe whether there is damage, edge collapse, etc. If the above situation occurs, it is recorded as 10 m / s. If there is no such situation, continue the experiment, and so on.

[0093] (ii) The resin dicing knife obtained from Examples 1-14 and Comparative Examples 1-6 is used in a wafer cutting machine to cut wafers. The wafer thickness is 1.01 mm. The spindle speed of the wafer cutting machine is 30 kRRM. The resin dicing knife is used for cutting at a speed of 7.8 m / s. The number of cuts is 100. The surface is cleaned and the radius at three positions is measured respectively. The average value is taken. The radius loss rate is calculated to be equal to the difference between the radius before cutting and the radius after 100 cuts, divided by the radius before cutting, and finally multiplied by 100%.

[0094] Table 3 Resin Slicing Knives Obtained from Examples 1-14 and Comparative Examples 1-7

[0095]

[0096]

[0097] It can be seen from Example 1 and Comparative Examples 1-7 and Table 1 that the cutting speed of Example 1 with edge jumping is greater than the cutting speed of Comparative Examples 1-7, and the radius loss rate of Example 1 is less than the radius loss rate of Comparative Examples 1-7, indicating that the modifier prepared by using the raw material composition of the present application in the raw material system of the resin cutting blade can further enhance its structural stability and reduce the occurrence of edge collapse, severe wear and other phenomena during high-speed cutting.

[0098] Combining Example 2 and Examples 6-8 and Table 3, it can be seen that the radius loss rates of Examples 6-8 are all smaller than the radius loss rate of Example 2, indicating that the compounding effect of bis-3-methylpropyleneoxypropylated tetramethyldisiloxane and 1,3-bis(acryloyloxymethyl)phenethyl)tetramethyldisiloxane is better, and the edge chipping and wear of the resin dicing knife are reduced.

[0099] It can be seen from Example 7 and Examples 9-11 and Table 3 that the radius loss rates of Examples 9-11 are all smaller than that of Example 7, indicating that the use of a polymer of 2-hydroxyethyl 2-methyl-2-acrylate with vinyl acetate and 3-(trimethoxysilyl)propyl 2-methacrylate and / or a polymer of methyl 2-methyl-2-acrylate with 3-(trimethoxysilyl)propyl 2-methyl-2-acrylate has a synergistic reinforcing effect, reducing the possibility of edge collapse, wear, and the like.

[0100] Combining Example 10 and Example 12 and Table 3, it can be seen that the radius loss rate of Example 12 is smaller than that of Example 10, indicating that the compounding of single crystal diamond and polycrystalline diamond has a better synergistic effect, and the obtained resin cutting blade has better toughness.

[0101] It can be seen from Example 13 and Example 12 combined with Table 3 that the radius loss rate of Example 13 is smaller than that of Example 12, indicating that the compound of epoxy resin, PI powder and aramid powder has a better synergistic effect, so that the obtained resin cutting blade has better structural stability and reduces the possibility of breakage.

[0102] It can be seen from Example 13 and Example 14 combined with Table 3 that the radius loss rate of Example 14 is smaller than that of Example 13, indicating that the compound of carbon nanotubes, silicon carbide and graphite powder plays a better role, so that the obtained resin scriber blade has better structural stability and reduces the possibility of breakage and wear.

[0103] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. An ultra-thin resin dicing knife for semiconductor wafer cutting, characterized in that: It is composed of the following raw materials in parts by weight: Abrasive 25-35 parts Resin powder 15-25 parts Filling 13-18 parts Modifier 12-20 parts The modifier is prepared from polyborosilazane, acrylate siloxane, long-chain acrylate siloxane polymer, initiator and solvent; The weight ratio of the polyborosilazane, acrylated siloxane, long-chain acrylated siloxane polymer, initiator, and solvent is (5-8): (1-3): (1-2): (0.01-0.03): 20; The acrylate siloxanes are bis-3-methacryloxypropylated tetramethyldisiloxane and 1,3-bis[(acryloyloxymethyl)phenethyl]tetramethyldisiloxane; The long-chain acrylate-based siloxane polymer is a polymer of 2-hydroxyethyl 2-methyl-2-acrylate, vinyl acetate, and 3-(trimethoxysilyl)propyl 2-methacrylate, and a polymer of methyl 2-methyl-2-acrylate and 3-(trimethoxysilyl)propyl 2-methyl-2-acrylate.

2. The ultra-thin resin dicing knife for semiconductor wafer cutting according to claim 1, characterized in that: The weight ratio of the bis-3-methacryloxypropylated tetramethyldisiloxane to 1,3-bis[(acryloyloxymethyl)phenethyl]tetramethyldisiloxane is 1:(1-4).

3. The ultra-thin resin dicing knife for semiconductor wafer cutting according to claim 1, characterized in that: The weight ratio of the polymer of 2-methyl-2-acrylate-2-hydroxyethyl ester, vinyl acetate and 2-methacrylate-3-(trimethoxysilyl)propyl ester and the polymer of 2-methyl-2-acrylate-3-(trimethoxysilyl)propyl ester is 1:(1-4).

4. The ultra-thin resin dicing knife for semiconductor wafer cutting according to claim 1, characterized in that: The abrasive is composed of one or more of single crystal diamond, polycrystalline diamond and cubic boron nitride.

5. The ultra-thin resin dicing knife for semiconductor wafer cutting according to claim 1, characterized in that: The resin powder is one or more of phenolic resin powder, epoxy resin, PI powder and aramid powder.

6. The ultra-thin resin dicing knife for semiconductor wafer cutting according to claim 1, characterized in that: The filler is one or more of carbon nanotubes, silicon carbide and graphite powder.

7. A method for preparing an ultra-thin resin dicing knife for semiconductor wafer cutting according to any one of claims 1 to 6, characterized in that: The following steps are involved: According to parts by weight, acrylate siloxane, long-chain acrylate siloxane polymer, solvent, initiator, and polyborosilazane are weighed, mixed evenly, and reacted to obtain a modifier; According to the weight percentage, the abrasive and filler are weighed and mixed evenly, and then 1 / 2 of the modifier is added and ground to obtain a mixture A; the resin powder and 1 / 2 of the modifier are weighed and mixed evenly to obtain a mixture B; Add mixture B to mixture A, continue grinding to obtain a composite; transfer the composite to a mold, perform molding to obtain a mold base, and sinter the mold base to obtain a resin scriber blade.

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