Double-sided edge banding tooling

Abstract

A double-sided edge-banding jig is used to perform double-sided edge-banding on substrates with a laminated structure. The jig includes a first carrier and a second carrier to clamp the substrate between them. By simultaneously heating the substrate on both sides using the first and second carriers, both sides of the substrate can be processed simultaneously, thereby shortening processing time, increasing production capacity, and ensuring that the processing positions on both sides of the substrate correspond, thereby improving processing accuracy.

Description

Technical Field

[0001] The present invention relates to an edge banding technology, in particular to a double-sided edge banding jig. Background Art

[0002] Currently, there are many types and varieties of semiconductor packages. For example, it is known that circuits can be manufactured on substrates with a laminated structure. As a carrier board for the circuit, the substrate with a laminated structure includes, for example: a core layer, a carrier layer formed on both sides of the core layer, and a functional layer formed on both sides of the carrier layer. If there is delamination between the layers of the substrate, it may penetrate into the gaps between the layers during the wet process (such as copper plating) and cause reliability problems in the product. Therefore, in order to avoid delamination between the layers of the substrate and the formation of gaps, the outer periphery of the substrate is generally heated and the edge of the substrate is sealed before the circuit is manufactured, so that the layers of the substrate are firmly bonded and foreign matter cannot enter from the edge of the substrate.

[0003] Conventional technology uses laser processing (e.g., a CO2 laser) to ablate the edges of the substrate, thereby bonding the various layers of the substrate. However, laser processing equipment has a short service life and lacks precision, for example, achieving an accuracy of only approximately + / - 75 μm.

[0004] Furthermore, the laser takes a long time to heat the substrate along its trajectory, and it can only process a single side of the substrate at a time. This means that one side must be processed first before the other side can be flipped over. This increases processing time, potentially exceeding 100 seconds. Furthermore, after processing one side of the substrate, flipping it over can cause the substrate to shift position, causing the processed positions on the two sides to misalign.

[0005] In addition, the processing width of laser processing may be less than 30um. In order to ensure that the layers of the substrate are firmly bonded and not easily separated, more than one laser processing may be required to strengthen the bonding between the layers. This will further increase the processing time required and occupy more substrate space, compressing the space for subsequent production circuits.

[0006] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the Invention

[0007] The object of the present invention is to provide a double-sided edge banding jig to solve at least one of the above problems.

[0008] In view of the various defects of the above-mentioned prior art, the present invention provides a double-sided edge banding jig for performing double-sided edge banding on a substrate with a stacked structure, and the double-sided edge banding jig includes: a first carrier, having a first body and a first heating head arranged on the first body; and a second carrier, arranged above the first carrier, and having a second body, a second heating head arranged on the second body and a moving mechanism for moving the second body; wherein the first heating head and the second heating head are opposite to each other and arranged in alignment so as to clamp the substrate by the first heating head and the second heating head.

[0009] In a specific embodiment of the aforementioned double-sided edge banding jig, the first body has a first groove, the first heating head is arranged in the first groove and protrudes from the first groove to the surface of the first body, and the second body has a second groove, the second heating head is arranged in the second groove and protrudes from the second groove to the surface of the second body.

[0010] In a specific embodiment of the double-sided edge banding jig, the depth of the first groove and the second groove is 2 mm to 7 mm.

[0011] In a specific embodiment of the double-sided edge banding jig, the first heating head and the second heating head protrude from the surface of the first body and the surface of the second body respectively by a height of 0.1 mm to 0.5 mm.

[0012] In a specific embodiment of the aforementioned double-sided edge banding jig, the first heating head is formed into a pointed shape extending outward from the first groove and gradually narrowing in width, and the second heating head is formed into a pointed shape extending outward from the second groove and gradually narrowing in width.

[0013] In a specific embodiment of the double-sided edge banding jig, the width of the tips of the first heating head and the second heating head is 0.5 mm to 1 mm.

[0014] In a specific embodiment of the aforementioned double-sided edge banding jig, the first heating head is circumferentially arranged on the outer periphery of the first body, and the second heating head is also circumferentially arranged on the outer periphery of the second body, that is, the first heating head and the second heating head are formed corresponding to the outer periphery of the substrate and surround the functional area of ​​the substrate.

[0015] In a specific embodiment of the double-sided edge banding jig, the first heating head and the second heating head are connected to an electrical circuit and form a loop with the substrate, so as to heat the substrate by passing current through the substrate.

[0016] In one embodiment of the double-sided edge banding jig, the first heating head and the second heating head are made of a heat-conducting material such as cast iron or carbide. In another embodiment, the carbide is tungsten carbide.

[0017] In a specific embodiment of the double-sided edge banding jig, the surfaces of the first body and the second body are hard anodized.

[0018] From the above, it can be seen that in the double-sided edge banding jig of the present invention, the substrate is mainly processed by clamping the two sides of the substrate with a stacked structure by the first carrier and the second carrier. Since the first heating head of the first carrier and the second heating head of the second carrier are opposite to each other and their positions correspond to each other, both sides of the substrate can be heated at the same time. Therefore, compared with the existing technology, the double-sided edge banding jig of the present invention can shorten the processing time and increase production capacity, and can ensure that the processing positions of the two sides of the substrate correspond, thereby improving the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic cross-sectional view of the substrate of the present invention.

[0020] Figure 2 It is a three-dimensional schematic diagram of the double-sided edge banding jig of the present invention.

[0021] Figure 3A This is a cross-sectional schematic diagram of the double-sided edge banding jig of the present invention processing a substrate.

[0022] Figure 3B This is a cross-sectional schematic diagram of an electric cylinder provided at the bottom of the first heating head of the double-sided edge banding jig of the present invention.

[0023] Figure 4 for Figure 3A A partial enlarged view of .

[0024] Figure 5 for Figure 3A Schematic top view of the substrate after processing.

[0025] The reference numerals are as follows:

[0026] 1 Double-sided edge banding tool

[0027] 10 First Vehicle

[0028] 11 The first ontology

[0029] 12. First heating head

[0030] 13 First groove

[0031] 20 Second Vehicle

[0032] 21 Second Body

[0033] 22 Second heating head

[0034] 23 Second groove

[0035] 24 Mobile Mechanism

[0036] 25 Electric Cylinder

[0037] 251 Power Tube

[0038] 30 substrate

[0039] 30a First side

[0040] 30b Second side

[0041] 31 Core Layer

[0042] 32 carrier layer

[0043] 33 functional layers

[0044] A. Functional Area

[0045] B Non-functional area

[0046] D distance

[0047] D1,D2 depth

[0048] H1,H2 height

[0049] P processing position

[0050] W1, W2, W3, W4 width DETAILED DESCRIPTION

[0051] The following describes the embodiments of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0052] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the efficacy and purpose of the present invention. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0053] Figure 1 Schematic cross-sectional view of the substrate of the present invention. Figure 2 It is a three-dimensional schematic diagram of the double-sided edge banding jig of the present invention. Figure 3A This is a cross-sectional diagram of the double-sided edge-sealing jig of the present invention processing a substrate. First, please refer to Figures 1 to 3A In this embodiment, the double-sided edge-sealing jig 1 is used to process a substrate 30 having a stacked structure so as to join the edges of the substrate 30 and seal the interior thereof.

[0054] The substrate 30 described above can be a carrier board used to fabricate circuits. The substrate 30 may include a core layer 31, with a carrier layer 32 and a functional layer 33 formed sequentially on opposite sides of the core layer 31. In other words, the substrate 30 may have a five-layer stacked structure consisting of, in order, the functional layer 33, carrier layer 32, core layer 31, carrier layer 32, and functional layer 33. It should be understood that while the substrate 30 is shown here as having a five-layer stacked structure, the present invention is not limited thereto. In other embodiments, the substrate 30 may also have a stacked structure other than five layers, and this can be adjusted as needed.

[0055] In this embodiment, the core layer 31 can be an organic polymer sheet such as bismaleimide / triazine (BT) or a copper foil substrate. The carrier layer 32 can be a metal layer of a copper layer (or copper foil), and the functional layer 33 can be another metal layer of the copper layer (or copper foil). The thickness of the carrier layer 32 can be 18 μm, and the thickness of the functional layer 33 can be 5 μm. After the double-sided edge sealing process of the substrate 30 is performed, the layers of the substrate 30 at the heated area can be melted or plasticized, thereby bonding them together.

[0056] The double-sided edge banding tool 1 includes a first carrier 10 and a second carrier 20. The second carrier 20 is arranged above the first carrier 10 and is separated from the first carrier 10 by a distance so that the substrate 30 is placed between the first carrier 10 and the second carrier 20. By adjusting the distance between the first carrier 10 and the second carrier 20, the first carrier 10 and the second carrier 20 can clamp the first side 30a and the second side 30b of the substrate 30 (such as Figure 3A As shown), the first side 30a and the second side 30b of the substrate 30 can be heated simultaneously.

[0057] In this embodiment, the first carrier 10 includes a first body 11 , a first groove 13 recessed in the first body 11 , and a first heating head 12 disposed in the first groove 13 and protruding from the first groove 13 to a surface of the first body 11 .

[0058] The first body 11 can be made of an insulating material with a heat-resistant and deformation-resistant surface treatment to prevent deformation due to long-term use, which could lead to layer deviation during hot pressing. Such a surface treatment can be, for example, hard anodizing, but the present invention is not limited to such a treatment; any material that prevents deformation of the first body 11 due to long-term use will suffice.

[0059] The first heating head 12 can be made of a high thermal conductivity material such as cast iron, carbide, etc., for example, tungsten carbide, which has high temperature resistance, high hardness, good thermal conductivity, and anti-oxidation properties, so it is beneficial for the first heating head 12 to repeatedly contact and heat the substrate 30.

[0060] like Figure 2 As shown, in this embodiment, the first groove 13 is recessed in the upper surface of the outer periphery of the first body 11 in a circumferential manner corresponding to the size of the substrate 30, and is an annular groove, and correspondingly, the first heating head 12 is also circumferentially arranged on the outer periphery of the first body 11. In addition, the first heating head 12 may be an annular heating head, or one or more heating heads may be arranged in the first groove 13 and arranged in a ring shape (not shown). An alignment line or alignment structure (not shown) may be arranged on the upper surface of the first body 11, and the user may place the substrate 30 on the upper surface of the first body 11 according to the alignment line or alignment structure, so that the first heating head 12 is aligned with the processing position P of the substrate 30. The processing position P of the substrate 30 is shown in Figure 5 , which will be explained in more detail later.

[0061] Figure 4 for Figure 3A A partial enlarged view of the Figure 4 As shown, the depth D1 of the first groove 13 is 2 to 7 mm, for example, 2, 3, 4, 5, 6 or 7 mm, and the height H1 of the first heating head 12 extending upward from the bottom of the first groove 13 and protruding from the surface of the first body 11 is 0.1 to 0.5 mm, for example, 0.1, 0.2, 0.3, 0.4 or 0.5 mm. Since most of the first heating head 12 is buried in the first body 11, the first heating head 12 can be protected and the possibility of damage to the first heating head 12 can be reduced. It should be understood that as long as the first heating head 12 can be firmly set on the first body 11, the depth in the first groove 13 or the protruding height of the first heating head 12 can also be changed, or the way in which the first heating head 12 is configured on the first body 11 can be changed, and it is not limited to the above.

[0062] Furthermore, in this embodiment, the width W1 of the bottom of the first heating head 12 is 2 to 7 mm, for example, 2, 3, 4, 5, 6 or 7 mm, and its width gradually narrows as it extends outward from the first groove 13. The width W2 of the tip of the first heating head 12 is 0.5 to 1 mm, for example, 0.5, 0.6, 0.7, 0.8, 0.9 or 1 mm. By using this pointed blade-type heating head, the first heating head 12 can accurately contact the desired processing position P (such as Figure 5As shown in FIG, and because the first heating head 12 has a relatively wide bottom, sufficient support force can be ensured for the first heating head 12. It should be understood that as long as the first heating head 12 can accurately contact the processing position P of the substrate 30 and has sufficient support force, the first heating head 12 can also be formed in other shapes or sizes, and is not limited to the above.

[0063] In addition, the heat insulation treatment can be performed above the first heating head 12 and the air blowing cooling function can be added. Figure 3B In the illustrated embodiment, at least one electric cylinder 25 can be installed at the bottom of the first heating head 12. Its power tube 251 abuts against the bottom of the first heating head 12, implementing torque control. This prevents uneven contact pressure on the first heating head 12, which could lead to carbonization, when the height of the first heating head 12 is uneven. Similarly, at least one electric cylinder can also be installed at the bottom of the second heating head 22, described later, for torque control (not shown).

[0064] In this embodiment, the second carrier 20 has a structure corresponding to that of the first carrier 10. Specifically, the second carrier 20 may also include: a second body 21, a second groove 23 recessed in the second body 21, and a second heating head 22 disposed in the second groove 23 and protruding from the second groove 23 to the surface of the second body 21.

[0065] Furthermore, the second body 21 may also be made of an insulating material having a surface treated with heat resistance and deformation resistance, such as hard anodizing, and the second heating head 22 may also be made of a high thermal conductivity material such as cast iron, carbide, or tungsten carbide. Furthermore, the depth D2 of the second recess 23 may also be 2 to 7 mm, such as 2, 3, 4, 5, 6, or 7 mm, and the height H2 of the second heating head 22 protruding from the surface of the second body 21 may also be 0.1 to 0.5 mm, such as 0.1, 0..2, 0.3, 0.4, or 0.5 mm. The second heating head 22 may also be pointed and have a bottom width W3 of 2 to 7 mm, such as 2, 3, 4, 5, 6, or 7 mm, and a tip width W4 of 0.5 to 1 mm, such as 0.5, 0.6, 0.7, 0.8, 0.9, or 1 mm. However, the present invention is not limited thereto, and the materials and sizes of the first carrier 10 and the second carrier 20 may be adjusted according to needs.

[0066] Furthermore, the second carrier 20 also includes a moving mechanism 24 for moving the second body 21. This moving mechanism 24 can be a lifting device that enables the second body 21 to move vertically up and down relative to the first body 11. Its height can be automatically adjusted based on parameters set by the control system, or it can be adjusted by the user at any time. Furthermore, the moving mechanism 24 allows the second carrier 20 to apply pressure to the substrate 30, thereby ensuring a better bond between the various layers of the substrate 30, which has been heated to a molten or plastic state.

[0067] In this embodiment, the second heating head 22 on the second body 21 is configured to be opposite to and positioned corresponding to the first heating head 12 on the first body 11. The second body 21 is raised and lowered by the moving mechanism 24 to change the distance between the first heating head 12 and the second heating head 22, so that the substrate 30 can be clamped between the first heating head 12 and the second heating head 22.

[0068] In this embodiment, the first heating head 12 and the second heating head 22 are connected to a circuit and serve as two electrodes. The first heating head 12 and the second heating head 22, acting as two electrodes, contact the first side 30a and the second side 30b of the substrate 30, respectively, to form a circuit. A high-frequency current is passed through the substrate 30, generating a resistive heating effect, thereby heating the substrate 30 to a molten or plastic state, thereby bonding the various layers of the substrate 30. It should be understood that the heating method of the present invention is not limited to the above. In other embodiments, the first heating head 12 and the second heating head 22 may be connected to respective heating devices to heat the first heating head 12 and the second heating head 22, respectively. Furthermore, the heating temperature of the substrate 30 applied by the first heating head 12 and the second heating head 22 can be adjusted as needed. The heating temperature is set to be higher than the melting point of each layer of the substrate 30, for example, in the range of 1000 to 2500°C.

[0069] Figure 5 for Figure 3A Schematic diagram of the top view of the substrate after processing. Figure 3A and Figure 5 As shown, the first heating head 12 and the second heating head 22 are configured to match the size of the substrate 30 to be processed, so that the processing position P of the first heating head 12 and the second heating head 22 on the substrate 30 is located in the non-functional area B outside the functional area A of the substrate 30, and the distance D between the processing position P and the edge of the substrate 30 is minimized as much as possible, for example, the distance D can be less than 3mm. Therefore, this double-sided edge sealing will not affect the subsequent circuit production in the functional area A of the substrate 30, ensuring that the utilization rate of the functional area A of the substrate 30 is maximized. In addition, the processing position P is formed into a closed ring along the outer periphery of the substrate 30, thereby preventing foreign matter from entering the layers from the edge of the substrate 30.

[0070] When using the double-sided edge banding jig 1 to perform double-sided edge banding on a substrate 30, the user places the substrate 30 on the upper surface of the first body 11, aligning the predetermined processing position P of the substrate 30 with the first heating head 12, and moving the second body 21 so that the second heating head 22 contacts the substrate 30, thereby allowing the first heating head 12 and the second heating head 22 to simultaneously heat the first side 30a and the second side 30b of the substrate 30. In this way, since the first heating head 12 and the second heating head 22 can heat both sides of the substrate 30 simultaneously, the processing time can be shortened and the production capacity can be increased. For example, the processing time only takes 20 to 40 seconds, and the processing positions P on both sides of the substrate 30 can be ensured to correspond, thereby improving the processing accuracy.

[0071] Furthermore, because the first heating head 12 and the second heating head 22 are positioned to correspond to a full circle of processing positions P on the substrate 30, there is no need to move the laser along a trajectory as in the prior art. Instead, heating can be completed in a single pass, further shortening processing time and increasing production capacity. Furthermore, by initially placing the substrate 30 in the correct position on the double-sided edge banding jig 1 using pattern alignment, heating can be performed quickly and accurately at the predetermined processing position P on the substrate 30, with an accuracy of, for example, ±10 μm.

[0072] To summarize, in the double-sided edge banding jig of the present invention, the substrate is mainly processed by clamping the two sides of the substrate having a stacked structure by the first carrier and the second carrier. Since the first heating head of the first carrier and the second heating head of the second carrier are opposite to each other and their positions correspond, both sides of the substrate can be heated simultaneously, thereby shortening the processing time and improving production capacity, and ensuring that the processing positions of the two sides of the substrate correspond, thereby improving processing accuracy.

[0073] Furthermore, since the first heating head of the first carrier and the second heating head of the second carrier are continuously formed along the edge of the substrate and surround the functional area of ​​the substrate, the edges of the substrate can be sealed to prevent foreign matter from entering between the layers from the edges of the substrate.

[0074] In addition, the double-sided edge banding jig constructed according to the above method has a long service life and does not need to be frequently replaced, thereby reducing manufacturing costs.

[0075] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the claims.

Claims

1. A double-sided edge-sealing jig for performing double-sided edge-sealing on a substrate having a laminated structure, the double-sided edge-sealing jig comprising: The first carrier comprises a first body and a first heating head with a pointed shape provided on the first body; as well as A second carrier is disposed above the first carrier and comprises a second body, a second heating head with a pointed shape disposed on the second body, and a moving mechanism for moving the second body; In which, the first heating head and the second heating head are opposite to each other and arranged in alignment so as to clamp the substrate by the first heating head and the second heating head, wherein the first body has a first groove, and the first heating head with a pointed shape is arranged in the first groove and protrudes from the first groove to the surface of the first body.

2. The double-sided edge banding jig according to claim 1, wherein: The second body has a second groove, the second heating head is arranged in the second groove and protrudes from the second groove to the surface of the second body, and the depth of the first groove and the second groove is 2mm to 7mm.

3. The double-sided edge banding jig according to claim 2, wherein: The first heating head and the second heating head protrude from the surface of the first body and the surface of the second body respectively by a height of 0.1 mm to 0.5 mm.

4. The double-sided edge banding jig according to claim 2, wherein: The pointed shape of the first heating head extends outward from the first groove and its width gradually narrows, and the pointed shape of the second heating head extends outward from the second groove and its width gradually narrows.

5. The double-sided edge banding jig according to claim 4, wherein: The width of the tips of the first heating head and the second heating head is 0.5 mm to 1 mm.

6. The double-sided edge banding jig according to claim 1, wherein: The first heating head is circumferentially arranged on the outer periphery of the first body, and the second heating head is also circumferentially arranged on the outer periphery of the second body.

7. The double-sided edge banding jig according to claim 1, wherein: The first heating head and the second heating head are connected to an electric circuit and form a loop with the substrate so as to heat the substrate by passing an electric current through the substrate.

8. The double-sided edge banding jig according to claim 1, wherein: The first heating head and the second heating head are made of heat-conducting materials such as cast iron or carbide.

9. The double-sided edge banding jig according to claim 8, wherein: The carbide is tungsten carbide.

10. The double-sided edge banding jig according to claim 1, wherein: The surfaces of the first body and the second body are hard anodized.

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