A substrate grinding method and grinding equipment

Abstract

The present invention relates to the field of semiconductor technology, and in particular to a substrate grinding method and grinding equipment. The substrate grinding method provided by the present invention firstly performs rough grinding on the first grinding surface of the first coating layer so that the first grinding surface forms a relatively flat reference plane; then the reference plane is placed on the adsorption surface of the adsorption platform; then the angle between the upper surface of the substrate and the reference plane is measured, and the lower surface of the substrate is parallel to the grinding plane by adjusting the adsorption platform or adjusting the substrate, and the second grinding surface of the substrate is subjected to standard grinding by the grinding equipment, and then the substrate is turned over to perform standard grinding on the reference plane of the first coating layer, at which time the thickness of each area of ​​the first coating layer and the second coating layer after grinding is uniform and consistent, and the thickness of the first coating layer and the second coating layer can be accurately controlled.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a substrate grinding method and grinding equipment. Background Art

[0002] During the semiconductor chip manufacturing process, metal layers need to be plated on both sides of the substrate. The substrate is usually a ceramic sheet, and the metal layer is usually a copper layer or a gold layer. The surface of the plated structure formed on both sides of the substrate is uneven, so it is necessary to use grinding equipment to grind the surface of the plated layer flat.

[0003] The grinding equipment usually includes an adsorption platform and a grinding wheel, wherein the upper surface of the adsorption platform is a plane, and the grinding surface of the grinding wheel is also a plane, and the grinding surface is parallel to the upper surface of the adsorption platform. When grinding the coating, first place the lower coating on the adsorption platform, and then grind the upper coating surface flat with the grinding wheel; then flip the substrate structure, place the upper coating surface on the adsorption platform, and then grind the lower coating surface flat.

[0004] Although the above-mentioned coating grinding process can ensure that the overall thickness of the substrate and the coating meets the requirements, due to the uneven surfaces of the upper coating and the lower coating at the beginning, when the lower coating is placed on the adsorption platform, the substrate is tilted relative to the adsorption platform, and the grinding surface of the grinding wheel is parallel to the surface of the adsorption platform. Therefore, the thickness of each area of ​​the upper coating obtained after grinding the upper coating with the grinding wheel is inconsistent; when grinding the lower coating, since the surface of the upper coating after grinding is placed on the adsorption platform, the surface of the upper coating after grinding is flat. Therefore, after the surface of the upper coating is attached to the adsorption platform, the position of the substrate is still tilted relative to the adsorption platform. Therefore, the thickness of each area of ​​the lower coating after grinding is inconsistent. Summary of the invention

[0005] (I) The technical problem to be solved by the present invention is that in the existing substrate grinding process, the coating surface on one side of the substrate is directly placed on an adsorption platform, and the coating on the other side of the substrate is ground by a grinding wheel. Since the coating surface is uneven and the substrate is tilted relative to the grinding surface of the grinding wheel, there is a defect that the thickness of each area of ​​the coating is inconsistent after grinding.

[0006] (II) Technical solution

[0007] In order to solve the above technical problems, an embodiment of the present invention provides a method for grinding a substrate, wherein the substrate comprises a substrate, a first coating layer and a second coating layer respectively disposed on upper and lower sides of the substrate, wherein the upper surface and the lower surface of the substrate are parallel;

[0008] The surface of the first coating layer facing away from the substrate is a first grinding surface; the surface of the second coating layer facing away from the substrate is a second grinding surface; the grinding method comprises the following steps:

[0009] Rough grinding, placing the adsorption platform flat on the mounting surface of the workbench, placing the second grinding surface on the adsorption surface of the adsorption platform, and adjusting the grinding plane of the grinding device to be parallel to the adsorption surface; grinding the first grinding surface of the first coating layer by the grinding device to form a reference plane;

[0010] After rough grinding, the error is measured by measuring the angle between the upper surface of the substrate and the reference plane;

[0011] Correct the error based on the result of the measurement error, flip the substrate, place the reference plane on the adsorption platform, and adjust the substrate or the adsorption platform so that the lower surface of the substrate is parallel to the grinding plane of the grinding device;

[0012] After the error is corrected, the second coating is subjected to standard grinding, and the second grinding surface is ground by a grinding device until the flatness of the second grinding surface meets the requirements;

[0013] Perform standard grinding of the first coating layer, turn over the substrate, place the second grinding surface after standard grinding on the adsorption surface of the adsorption platform, adjust the substrate or adjust the adsorption platform, and make the adsorption surface of the adsorption platform parallel to the grinding plane of the grinding equipment measured after rough grinding, and grind the reference plane by the grinding equipment until the flatness of the reference plane meets the requirements.

[0014] According to one embodiment of the present invention, the step of correcting the error based on the result of the measurement error so that the upper surface of the substrate is parallel to the grinding plane of the grinding device comprises:

[0015] At least one area of ​​the adsorption platform is raised so that the adsorption platform is tilted relative to the mounting surface, and the adsorption platform of the at least one area is raised in the same tilt direction as the substrate in the step of measuring the error after rough grinding; the angle between the adsorption surface of the adsorption platform and the mounting surface is equal to the angle between the upper surface of the substrate and the reference plane in the step of measuring the error after rough grinding.

[0016] According to one embodiment of the present invention, the grinding device comprises a grinding wheel, the lower surface of which is a grinding plane; and a threaded hole is provided on the adsorption platform:

[0017] The step of raising at least one area of ​​the adsorption platform includes: tilting the adsorption platform includes: rotating the adjusting bolt to connect the adjusting bolt with the threaded hole, the lower end of the adjusting bolt passes through the threaded hole and abuts against the mounting surface, and continuing to rotate the adjusting bolt until the adsorption platform is raised.

[0018] According to one embodiment of the present invention, the step of correcting the error based on the result of measuring the error comprises:

[0019] A wedge-shaped pad is placed on the adsorption surface of the adsorption platform, the substrate is turned over, and the reference plane is placed on the pad. The inclination direction of the surface of the pad on the side in contact with the reference plane is the same as the inclination direction of the substrate in the error measurement step after rough grinding, so that the lower surface of the substrate is parallel to the adsorption surface.

[0020] According to one embodiment of the present invention, the step of measuring the error after rough grinding includes:

[0021] The inclination angle of the upper surface of the substrate relative to the horizontal plane is measured by an angle measuring instrument. The inclination angle of the upper surface of the substrate relative to the horizontal plane is equal to the angle between the upper surface of the substrate and the reference plane.

[0022] According to one embodiment of the present invention, the first coating layer is provided with a plurality of measuring holes penetrating the first coating layer:

[0023] The inclination angle of the upper surface of the substrate corresponding to each measuring hole relative to the horizontal plane is measured by an angle measuring instrument, and the angle between the lower surface of the substrate and the grinding plane is obtained by taking an average value of multiple inclination angles measured by multiple measuring holes.

[0024] According to one embodiment of the present invention, the measurement error after rough grinding includes:

[0025] The maximum thickness L1 and the minimum thickness L2 of the first coating after rough grinding are measured by a thickness measuring device, wherein the first coating and the second coating are both cylindrical structures, and the diameters of the first coating and the second coating are equal to each other, both being D1, wherein the angle α between the reference plane and the upper surface of the substrate is tanα=(L1-L2) / D1.

[0026] According to one embodiment of the present invention, correcting the error based on the result of measuring the error also includes: re-measuring the error after adjusting the substrate or adjusting the adsorption platform, if the lower surface of the substrate is not parallel to the grinding plane after the re-measurement, continue to adjust the substrate or adjust the adsorption platform, and continue to re-measure after adjustment until the upper surface of the substrate is parallel to the grinding plane.

[0027] Another aspect of the present invention is to provide a grinding device, including a grinding wheel, an adsorption platform and an adjusting bolt;

[0028] The adsorption platform is placed flat on the installation surface, the upper surface of the adsorption platform is the adsorption surface, and the adsorption surface is provided with adsorption holes connected to the air source;

[0029] The lower surface of the grinding wheel is a grinding plane, and the adsorption surface is parallel to the grinding plane;

[0030] The adsorption platform is provided with a threaded hole penetrating the adsorption platform, the axis of the threaded hole is perpendicular to the adsorption platform, and the adjusting bolt is threadably matched with the threaded hole.

[0031] According to one embodiment of the present invention, the upper surface of the adsorption platform is provided with a groove, and the bottom wall of the groove is provided with the threaded hole;

[0032] A plurality of grooves are formed on the upper surface of the adsorption platform, and a threaded hole is formed in each of the grooves.

[0033] Beneficial effects of the present invention: The substrate grinding method provided by the present invention firstly performs rough grinding on the first grinding surface of the first coating layer, so that the first grinding surface forms a relatively flat reference plane; the angle between the upper surface of the substrate and the reference plane is measured, the reference plane is parallel to the grinding plane, and the angle between the upper surface of the substrate and the reference plane is equal to the angle between the upper surface of the substrate and the grinding plane. Then the reference plane is placed on the adsorption surface of the adsorption platform, and since the surface of the reference plane is flat after rough grinding, it can be fitted with the adsorption surface; by adjusting the adsorption platform or adjusting the substrate, the lower surface of the substrate is parallel to the grinding plane, and then the second grinding surface of the substrate is subjected to standard grinding by the grinding equipment, and the thickness of each area of ​​the second coating layer after grinding is consistent; then the substrate is turned over, and the second grinding surface after standard grinding is placed on the adsorption surface of the adsorption platform, and since the second grinding surface after standard grinding is a plane structure, it can be fitted with the adsorption surface, and the substrate or adjusting the adsorption platform is adjusted so that the adsorption surface is parallel to the grinding plane, and the upper surface of the substrate is parallel to the grinding plane, and the reference plane is subjected to standard grinding by the grinding equipment until the flatness of the reference plane meets the requirements, and the substrate grinding operation is completed. The first coating layer and the second coating layer of the substrate ground by the grinding method provided by the present application have uniform thickness in each region, and the thickness of the first coating layer and the second coating layer can be accurately controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 A schematic diagram of the structure of rough grinding using a grinding device provided by an embodiment of the present invention;

[0036] Figure 2 This is the effect picture after rough grinding;

[0037] Figure 3A schematic diagram of standard grinding of a second coating layer using a grinding device provided by an embodiment of the present invention;

[0038] Figure 4 This is the effect picture of the standard grinding of the second coating;

[0039] Figure 5 A schematic diagram of standard grinding of a first coating layer using a grinding device provided by an embodiment of the present invention;

[0040] Figure 6 This is the effect picture of the standard grinding of the first coating;

[0041] Figure 7 It is a schematic diagram of the structure before the substrate is ground;

[0042] Figure 8 It is a schematic diagram of the structure after the substrate is ground;

[0043] Fig. 9 This is a top view of the substrate after grinding;

[0044] Fig.10 is a top view of the grinding platform;

[0045] Fig.11 This is a bottom view of the grinding platform.

[0046] Icons: 1-grinding equipment; 11-grinding wheel; 111-grinding plane; 12-adsorption platform; 121-adsorption surface; 1211-adsorption hole; 122-groove; 123-threaded hole; 13-adjusting bolt;

[0047] 2-substrate; 21-underlayer; 22-first coating; 221-first grinding surface; 222-reference plane; 223-measuring hole; 23-second coating; 231-second grinding surface. DETAILED DESCRIPTION

[0048] In order to more clearly understand the above-mentioned purposes, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention.

[0049] In one aspect, an embodiment of the present invention provides a substrate grinding method, such as Figure 7As shown, the substrate 2 includes a first coating 22, a second coating 23 and a disc-shaped substrate 21, that is, the upper surface and the lower surface of the substrate 21 are parallel; the substrate 21 is usually a ceramic sheet, and the upper surface and the lower surface of the substrate 21 are plated with aluminum or gold to form the first coating 22 and the second coating 23. The surface of the first coating 22 facing away from the substrate 21 is a first grinding surface 221; the surface of the second coating 23 facing away from the substrate 21 is a second grinding surface 231.

[0050] Combination Figures 1 to 10 As shown, the grinding method includes the following steps: rough grinding, placing the adsorption platform 12 flat on the mounting surface of the workbench, wherein the workbench is usually placed horizontally, and the upper surface of the workbench forms the mounting surface; the adsorption platform 12 is usually a cylindrical structure, and the upper and lower surfaces of the adsorption platform 12 are both planar structures, and the lower surface of the adsorption platform 12 is a planar structure, and the upper surface of the adsorption platform 12 is an adsorption surface 121, and adsorption holes 1211 are provided on the adsorption surface 121, and the adsorption holes 1211 are connected to an external air source, and the substrate 2 placed thereon is fixed through the adsorption holes 1211. The grinding equipment 1 grinds the coating on the side of the substrate 2 away from the adsorption platform 12, and a grinding plane 111 is formed on the lower surface of the grinding equipment 1, wherein when the adsorption platform 12 is placed flat on the mounting surface, the grinding plane 111, the adsorption surface 121 and the mounting surface are parallel to each other and arranged horizontally. As shown Figure 1 As shown, the second grinding surface 231 is placed on the adsorption surface 121, and the first coating layer 22 is facing the grinding device 1, that is, the first grinding surface 221 is facing the grinding device 1, and the substrate 2 is adsorbed and fixed through the adsorption holes 1211 of the adsorption surface 121; Figure 2 As shown, the protrusions of the first grinding surface 221 are ground away by the grinding device 1, and the first grinding surface 221 forms a reference plane 222. The surface of the reference plane 222 is a planar structure with no protrusions, but some pits may exist, and at this time the thickness of the first coating 22 is greater than the final required thickness.

[0051] After rough grinding, the measurement error, such as Figure 1 and Figure 7 As shown, due to the formation of protrusions on the second grinding surface 231, the surface is uneven, and the substrate 21 and the grinding plane 111 are not parallel at this time. At this time, the angle between the upper surface of the substrate 21 and the reference plane 222 is measured. Since the reference plane 222 after rough grinding is parallel to the grinding plane, the angle between the upper surface of the substrate 21 and the reference plane 222 is equal to the angle between the upper surface of the substrate 21 and the grinding plane 111.

[0052] Since the grinding plane 111 is parallel to the horizontal plane, that is, the angle between the substrate 21 and the horizontal plane is equal to the angle between the upper surface of the substrate 21 and the reference plane 222 is equal to the angle between the upper surface of the substrate 21 and the grinding plane 111.

[0053] Based on the result of the measurement error, the error is corrected and the substrate 2 is flipped over, such as Figure 3 As shown, the reference plane 222 is placed on the adsorption platform 12. At this time, the second coating 23 faces the grinding device 1, that is, the second grinding surface 231 faces the grinding device 1. At this time, the lower surface of the substrate 21 faces the grinding plane 111. The substrate 2 is adjusted or the adsorption platform 12 is adjusted to make the lower surface of the substrate 21 parallel to the grinding plane 111 of the grinding device 1. Through the reference plane 222 after rough grinding and the adjustment of the substrate 2 and the adsorption platform 12, the lower surface of the substrate 21 is parallel to the grinding plane 111 of the grinding device 1. At this time, standard grinding of the second coating 23 can be performed.

[0054] After the error is corrected, the second coating 23 is subjected to standard grinding, which includes grinding the second grinding surface 231 by the grinding device 1 until the flatness of the second grinding surface 231 meets the requirements, wherein the thickness of the second coating 23 is 90±15μm, and the thickness of the second coating 23 that meets the requirements after grinding is generally 75±5um. Since the lower surface of the substrate 21 is parallel to the grinding plane 111 of the grinding device 1, as shown in FIG. Figure 4 As shown, the second grinding surface 231 is flat after grinding, and the thickness of each area is consistent.

[0055] After the second coating 23 is polished by standard, the second coating 23 is polished and the thickness of each region of the second coating 23 is uniform. At this time, the second polished surface 231 of the second coating 23 is parallel to the mounting surface and the polishing plane. Then the first coating 22 is polished by standard. Figure 5As shown, the standard grinding of the first coating 22 includes: placing the second grinding surface 231 after standard grinding on the adsorption surface 121 of the adsorption platform 12, at this time, the first coating 22 faces the grinding device 1, that is, the reference plane 222 after rough grinding on the first coating 22 faces the grinding device 1, and at this time, the upper surface of the substrate 21 faces the grinding plane 111. Since the second grinding surface 231 after standard grinding has a flat surface, the second grinding surface 231 can be attached to the adsorption surface 121. Then adjust the substrate 2 or the adsorption platform 12, and make the adsorption surface 121 of the adsorption platform 12 parallel to the grinding plane 111 of the grinding device 1. At this time, the upper surface of the substrate 21 is parallel to the adsorption surface 121 and the grinding plane 111. The reference plane 222 is ground by the grinding device 1 until the flatness of the reference plane 222 meets the requirements, wherein the thickness of the first coating 22 is 90±15μm, and the thickness of the first coating 22 that meets the requirements after grinding is usually 75±5um. The thickness of the first coating 22 and the second coating 23 after grinding is consistent. Figure 6 and Figure 8 As shown, after the substrate 2 is ground by the above-mentioned grinding method, the thickness of each area of ​​the first coating 22 is consistent, the thickness of each area of ​​the second coating 23 is consistent, and the thickness of the first coating 22 and the second coating 23 can be accurately controlled to ensure that the thickness of the first coating 22 and the second coating 23 are the same.

[0056] It can be understood that the first coating 22 and the second coating 23 of the substrate 2 in the present application do not mean that there is a difference in structure between the two, it only means that in a certain state, the first coating 22 is located on the upper side of the substrate 21, and the second coating 23 is located on the lower side of the substrate 21; therefore, for those skilled in the art, in the above-mentioned substrate grinding method, the second coating 23 can be rough-ground first, and then the error can be measured after the rough grinding, the error can be corrected based on the result of the measured error, and the first coating 22 and the second coating 23 can be standard-ground after the error is corrected. It can also achieve the purpose of uniform thickness of the first coating 22 and the second coating 23 after grinding, and should fall within the protection scope of the present invention.

[0057] According to one embodiment of the present invention, in the step of correcting the error based on the result of the measurement error, making the upper surface of the substrate 21 parallel to the grinding plane 111 of the grinding device 1 includes: raising at least one area of ​​the adsorption platform 12 so that the adsorption platform 12 is tilted; wherein, since the thickness of each area of ​​the roughly ground first coating 22 is inconsistent, the grinding plane 111, the adsorption surface 121 and the mounting surface are parallel to each other, and the adsorption platform 12 is placed flat on the mounting surface, so when the reference plane 222 is placed on the adsorption surface 121, the substrate 21 is tilted relative to the adsorption plane; in this By raising a part of the adsorption platform 12, the adsorption surface 121 of the adsorption platform 12 is tilted relative to the grinding plane 111, and the tilt direction of the adsorption platform 12 that raises at least one area is the same as the tilt direction of the substrate 21 in the step of measuring the error after rough grinding, so that the angle between the adsorption surface 121 of the adsorption platform 12 and the mounting surface is equal to the angle between the upper surface of the substrate 21 and the reference plane 222 in the step of measuring the error after rough grinding, that is, equal to the angle between the upper surface of the substrate 21 and the grinding plane 111 in the step of measuring the error after rough grinding. That is, the tilt angle of the adsorption platform 12 is made consistent with the tilt angle of the substrate 21 detected in the step of measuring the error after rough grinding, so as to correct the problem of uneven thickness of each area of ​​the first coating 22 after rough grinding.

[0058] The lower surface of the modified substrate 21 is parallel to the grinding plane 111 (the second coating layer 23 faces the grinding device 1 at this time), so that the thickness of each area of ​​the second coating layer 23 after grinding by the grinding device 1 remains consistent.

[0059] Preferably, in this embodiment, Figures 1 to 6 As shown, the grinding device 1 includes a grinding wheel 11, and the lower surface of the grinding wheel 11 is a grinding plane 111; Figure 3 , Figure 4 , Fig. 9 , Fig.10 and Fig.11 As shown, the adsorption platform 12 is provided with at least one threaded hole 123 penetrating the adsorption platform 12, and the adjusting bolt 13 is connected with the inner thread of the threaded hole 123: the step of raising at least one area of ​​the adsorption platform 12 to tilt the adsorption platform 12 comprises: rotating the adjusting bolt 13 so that the adjusting bolt 13 is threadedly matched with the threaded hole 123, the lower end of the adjusting bolt 13 passes through the threaded hole 123 and abuts against the mounting surface, and continuing to rotate the adjusting bolt, as shown in FIG. Figure 3 and Figure 4 As shown, until the adsorption platform 12 is raised. Among them, the present application can be provided with a plurality of threaded holes 123, through which a plurality of adjusting bolts 13 are used to raise the adsorption platform 12, support the adsorption platform 12, and ensure that the adsorption platform 12 is stably placed on the installation surface; Fig.10 and Fig.11 As shown, in this embodiment, the lower surface of the adsorption platform 12 is provided with three threaded holes 123, and the three threaded holes 123 are spaced and evenly distributed in the circumferential direction of the edge of the lower surface of the adsorption platform 12, that is, the central angle of the axes of any two adjacent threaded holes 123 is 120°; Figure 2 and Figure 3 As shown, in this embodiment, the thickness of the first coating 22 is uneven after rough grinding. When the reference plane 222 is placed on the adsorption surface 121, at least one threaded hole 123 corresponds to the area of ​​the first coating 22 with the thinnest thickness. At this time, the adjusting bolt 13 is rotated, and the adjusting bolt 13 lifts the adsorption platform 12. The adsorption platform 12 drives the area of ​​the first coating 22 with the thinnest thickness to move upward, and the moving distance is equal to the maximum thickness of the first coating 22 minus the minimum thickness of the first coating 22; after moving into place, the lower surface of the substrate 21 is parallel to the grinding plane 111. At this time, after the second grinding surface 231 of the second coating 23 is ground by the grinding plane 111 of the grinding equipment 1, the thickness of each area of ​​the second grinding surface 231 can be kept consistent.

[0060] In an embodiment of another aspect of the present invention, the step of correcting the error based on the result of the measurement error includes: placing a wedge-shaped pad on the adsorption surface 121 of the adsorption platform 12, turning over the substrate 2, and placing the reference plane 222 on the pad, the inclination direction of the surface of the pad on the side in contact with the reference plane 222 is the same as the inclination direction of the substrate 21 in the step of measuring the error after rough grinding, so that the lower surface of the substrate 21 is parallel to the adsorption surface 121; the inclination angle of the wedge-shaped pad is equal to the angle between the lower surface of the substrate 21 and the reference plane in the step of measuring the error after rough grinding (that is, the angle between the lower surface of the substrate 21 and the grinding plane 111 in the step of measuring the error after rough grinding); in this embodiment, the adsorption platform 12 is not adjusted, that is, the grinding plane 1 11. The adsorption surface 121 and the mounting surface are always parallel and horizontally arranged; after detecting the angle between the upper surface of the substrate 21 and the grinding plane 111 in the step of measuring the error after rough grinding, that is, after detecting the inclination angle of the substrate 21 relative to the horizontal plane, a wedge-shaped pad is placed on the adsorption surface 121 of the adsorption platform 12. The inclination angle of the wedge-shaped pad is equal to the angle between the upper surface of the substrate 21 and the grinding plane 111 in the step of measuring the error after rough grinding, that is, equal to the inclination angle of the substrate 21 relative to the horizontal plane. At this time, when the rough-ground reference plane 222 is placed on the wedge-shaped pad on the adsorption surface 121, the error caused by the uneven thickness of the first coating layer 22 after rough grinding can be corrected, so that the lower surface of the substrate 21 is parallel to the grinding plane 111. Figure 4 As shown, after the second grinding surface 231 of the second coating layer 23 is ground by the grinding device 1, the thickness of each area of ​​the second coating layer 23 can be kept consistent.

[0061] It can be understood that in the present application, the adsorption platform 12 or the substrate 2 can be adjusted by other means. As long as the lower surface of the substrate 21 can be made parallel to the grinding plane 111 of the grinding device 1 by adjusting the substrate 2 or adjusting the adsorption platform 12, the design concept of the present invention can be realized and should fall within the protection scope of the present invention.

[0062] According to an embodiment of the present invention, the step of measuring the error after rough grinding includes: measuring the angle between the upper surface of the substrate 21 and the reference plane 222 by an angle measuring instrument, the reference plane 222 after rough grinding is parallel to the grinding plane 111, and the inclination angle of the upper surface of the substrate 21 relative to the horizontal plane is equal to the angle between the lower surface of the substrate 21 and the grinding plane 111. Since the grinding plane 111 is arranged horizontally, measuring the inclination angle of the upper surface of the substrate 21 relative to the horizontal plane is equivalent to measuring the angle between the upper surface of the substrate 21 and the reference plane 222, and is also equivalent to measuring the angle between the upper surface of the substrate 21 and the grinding plane 111.

[0063] In this embodiment, Fig. 9 As shown, the first plating layer 22 is provided with a plurality of measuring holes 223 penetrating the first plating layer 22: the inclination of the upper surface of the substrate 21 corresponding to each measuring hole 223 relative to the horizontal plane is measured by an angle measuring instrument, and the multiple inclinations measured by the multiple measuring holes 223 are averaged to obtain the angle between the lower surface of the substrate 21 and the grinding plane 111. In this way, the angle between the upper surface of the substrate 21 and the grinding plane 111 measured is more accurate.

[0064] In another embodiment of the present invention, the step of measuring the error includes: measuring the maximum thickness L1 and the minimum thickness L2 of the first coating 22 after rough grinding by a thickness measuring device, wherein the substrate 21, the first coating 22 and the second coating 23 are all cylindrical structures, and the diameters of the first coating 22 and the second coating 23 are equal to D1, wherein the angle between the reference plane 222 and the upper surface of the substrate 21 is equal to the angle between the lower surface of the substrate 21 and the grinding plane 111; the angle between the reference plane 222 and the upper surface of the substrate 21 is α, then the angle between the upper surface of the substrate 21 and the grinding plane 111 is also α, tanα=(L1-L2) / D1. In this embodiment, the maximum thickness and minimum thickness of the first coating 22 are measured by a thickness gauge (such as a laser rangefinder). Since the first coating and the second coating are cylindrical structures of equal diameter, the line connecting the point corresponding to the maximum thickness and the point corresponding to the minimum thickness is the diameter D1. The sides corresponding to D1 and L1-L2 are two right-angled sides of a right triangle. The angle of the substrate 21 relative to the horizontal plane is equal to the inclination angle of the substrate 21, which is equal to α. Then tanα=(L1-L2) / D1, from which the angle between the upper surface of the substrate 21 and the reference plane 222 can be calculated, and the angle between the lower surface of the substrate 21 and the grinding plane 111 can also be calculated. When the error is corrected by raising the adsorption platform 12, the height of the raised end of the adsorption platform 12 is equal to L1-L2.

[0065] According to one embodiment of the present invention, the step of correcting the error based on the result of the measurement error also includes: re-measuring the error after adjusting the substrate 2 or the adsorption platform 12, if the lower surface of the substrate 21 is not parallel to the grinding plane 111 after the re-measurement, then continue to adjust the substrate 2 or adjust the adsorption platform, and continue to re-measure after adjustment until the upper surface of the substrate 21 is parallel to the grinding plane 111. Through multiple re-measurements and multiple adjustments, it can be ensured that the upper surface of the substrate 21 is adjusted to be parallel to the grinding plane 111, at which time the upper surface of the substrate 21 is parallel to the grinding plane 111 and parallel to the mounting surface; thereby ensuring that the thickness of each area of ​​the second coating 23 after grinding remains consistent. Optionally, in this embodiment, the step of re-measuring the error is also carried out through the measuring hole 223, and the grinding equipment automatically measures the height of multiple weighing substrates 21 in the air through the built-in altimeter to confirm whether the upper surface of the substrate 21 is parallel to the grinding plane 111. If not, continue to adjust the substrate 2 or adjust the adsorption platform 12 until the upper surface of the substrate 21 is parallel to the grinding plane 111.

[0066] Another embodiment of the present invention further provides a grinding device 1 for use in the substrate grinding method described in any of the above embodiments, such as Figures 1 to 6 As shown, the grinding device 1 includes a grinding wheel 11, an adsorption platform 12 and an adjusting bolt 13;

[0067] The adsorption platform 12 is placed flat on the installation surface, the upper surface of the adsorption platform 12 is the adsorption surface 121, and the adsorption surface 121 is provided with an adsorption hole 1211 connected to the air source; the lower surface of the grinding wheel 11 is the grinding plane 111, and the adsorption surface 121 is parallel to the grinding plane 111; the adsorption platform 12 is provided with a threaded hole 123 passing through the adsorption platform 12, the axis of the threaded hole 123 is perpendicular to the adsorption platform 12, and the adjusting bolt 13 is threadedly matched with the threaded hole 123.

[0068] When the grinding device 1 provided in this embodiment is used to grind the substrate 2, the adsorption platform 12 is placed flat on the mounting surface of the workbench. Figure 1 As shown, the second grinding surface 231 is placed on the adsorption surface 121 of the adsorption platform 12, and the adsorption surface 121 of the adsorption platform 12, the grinding plane 111 of the grinding wheel 11 and the mounting surface of the workbench are all horizontally arranged; the protrusions of the first grinding surface 221 are ground away by the grinding wheel 11, and here only the protrusions of the first grinding surface 221 need to be eliminated, and the concave points of the first grinding surface 221 can be retained; as shown in FIG. Figure 2 As shown, the first grinding surface 221 forms a reference plane 222 .

[0069] like Figure 3 As shown, the reference plane 222 is then placed on the adsorption surface 121 of the adsorption platform 12. Since the reference plane 222 is flat after rough grinding, it can fit with the adsorption surface 121. Then, the angle between the upper surface of the substrate 21 and the reference plane 222 is measured, and the adjusting bolt 13 is rotated so that the lower end of the adjusting bolt 13 passes through the threaded hole 123. The adsorption platform 12 is raised by adjusting the bolt 13. The distance by which the adsorption platform 12 is raised is equal to the maximum thickness of the first coating 22 minus the minimum thickness of the first coating 22, so that the lower surface of the substrate 21 is parallel to the grinding plane 111. Then, the second grinding surface 231 of the substrate 21 is subjected to standard grinding by the grinding wheel 11, as shown in FIG. Figure 4 As shown, at this time, the thickness of each region of the second coating 23 after grinding is consistent. Figure 5 As shown, the substrate 2 is turned over, and the second grinding surface 231 after standard grinding is placed on the adsorption surface 121 of the adsorption platform 12. Since the second grinding surface 231 after standard grinding is a planar structure, it can fit with the adsorption surface 121. The adjusting bolt 13 is turned to retract the lower end of the adjusting bolt 13 into the threaded hole, so that the adsorption platform 12 is placed flat on the installation surface. Since the thickness of each area of ​​the lower substrate 21 remains consistent after grinding, and the installation surface, adsorption surface 121 and grinding plane 111 are all set horizontally, the upper surface of the substrate 21 is parallel to the grinding plane 111. Then, the reference plane 222 is subjected to standard grinding by the grinding wheel 11 until the flatness of the reference plane 222 meets the requirements, and the grinding operation of the substrate 2 is completed. Figure 6 and Figure 8 As shown, after being ground using the grinding device 1 provided by the present application, the thickness of each region of the first coating layer 22 and the second coating layer 23 of the substrate 2 is uniform, and the thickness of the first coating layer 22 and the second coating layer 23 can be accurately controlled.

[0070] According to one embodiment of the present invention, the upper surface of the adsorption platform 12 is provided with a groove 122, and the bottom wall of the groove 122 is provided with the threaded hole 123; since the groove 122 is provided on the upper surface of the adsorption platform 12, and the threaded hole 123 is provided in the groove 122, when the adsorption platform 12 is not raised, the bolt can be accommodated in the groove 122, and will not affect the adsorption platform 12 being placed flat on the installation surface of the workbench.

[0071] Optional, such as Fig.10 and Fig.11 As shown, a plurality of grooves 122 are provided on the upper surface of the adsorption platform 12, and a threaded hole 123 is provided in each of the grooves 122. By providing a plurality of threaded holes 123, each threaded hole 123 is threadedly connected to an adjusting bolt 13, and the plurality of adjusting bolts 13 provide more reliable support for the adsorption platform 12; in this embodiment, one threaded hole 123 may be provided in one groove 122, that is, the threaded hole 123 corresponds to the groove 122 one by one, or multiple threaded holes 123 may be provided in each groove 122; preferably, as Fig.10 and Fig.11 As shown, in the present application, the lower surface of the adsorption platform 12 is provided with three grooves 122, each groove 122 is provided with a threaded hole 123, and the three threaded holes 123 are evenly distributed along the circumferential interval on the edge of the adsorption platform 12, that is, the circular angles corresponding to the axes of two adjacent threaded holes 123 are both 120°.

[0072] In the description of the present invention, it should be noted that the terms "upper", "lower", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0073] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the inside of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A substrate grinding method, the substrate (2) comprising a substrate (21), a first coating layer (22) and a second coating layer (23) respectively arranged on upper and lower sides of the substrate (21), the upper surface and the lower surface of the substrate (21) being parallel, the substrate (21) being a ceramic sheet, and the first coating layer (22) and the second coating layer (23) being both aluminum layers or gold layers; The surface of the first coating (22) facing away from the substrate (21) is a first grinding surface (221); the surface of the second coating (23) facing away from the substrate (21) is a second grinding surface (231); characterized in that: The grinding method comprises the following steps: Rough grinding, placing the adsorption platform (12) flat on the mounting surface of the workbench, placing the second grinding surface (231) on the adsorption surface (121) of the adsorption platform (12), adjusting the grinding plane (111) of the grinding device (1) to be parallel to the adsorption surface (121); grinding the first grinding surface of the first coating layer (22) by the grinding device (1) to form a reference plane (222); After rough grinding, the error is measured, and the angle between the upper surface of the substrate (21) and the reference plane (222) is measured; Correcting the error based on the result of the measurement error, turning over the substrate (2), placing the reference plane (222) on the adsorption platform (12), and adjusting the substrate (2) or the adsorption platform (12) so that the lower surface of the substrate (21) is parallel to the grinding plane (111) of the grinding device (1); After the error is corrected, the second coating layer (23) is subjected to standard grinding, and the second grinding surface (231) is ground by a grinding device (1) until the flatness of the second grinding surface (231) meets the requirements; The first coating layer (22) is grinded in a standard manner, the substrate (2) is turned over, and the second grinding surface (231) after the standard grinding is placed on the adsorption surface (121) of the adsorption platform (12), the substrate (2) or the adsorption platform (12) is adjusted, and the adsorption surface (121) is made parallel to the grinding plane (111), and the reference plane (222) is grinded by a grinding device (1) until the flatness of the reference plane (222) meets the requirements; The step of correcting the error based on the result of the measurement error so that the upper surface of the substrate (21) is parallel to the grinding plane (111) of the grinding device (1) comprises: Raising at least one area of ​​the adsorption platform (12) so that the adsorption platform (12) is tilted relative to the mounting surface, and the adsorption platform (12) that is raised at least one area is tilted in the same direction as the substrate (21) in the step of measuring the error after rough grinding; and the angle between the adsorption surface (121) of the adsorption platform (12) and the mounting surface is equal to the angle between the upper surface of the substrate (21) and the reference plane (222) in the step of measuring the error after rough grinding; The step of raising at least one area of ​​the adsorption platform (12) comprises: making the adsorption platform (12) tilted comprises: rotating the adjusting bolt (13) so that the adjusting bolt (13) is connected to the threaded hole (123), the lower end of the adjusting bolt (13) passes through the threaded hole (123) and abuts against the mounting surface, and continuing to rotate the adjusting bolt (13) until the adsorption platform (12) is raised; The measurement errors after rough grinding include: Measuring the inclination angle of the upper surface of the substrate (21) relative to the horizontal plane by an angle measuring instrument, wherein the inclination angle of the upper surface of the substrate (21) relative to the horizontal plane is equal to the angle between the upper surface of the substrate (21) and the reference plane (222); The measurement errors after rough grinding include: The maximum thickness L1 and the minimum thickness L2 of the first coating (22) after rough grinding are measured by a thickness measuring device, wherein the first coating (22) and the second coating (23) are both cylindrical structures, and the diameters of the first coating (22) and the second coating (23) are equal to each other and are both D1, wherein the angle α between the reference plane (222) and the upper surface of the substrate (21) is tanα=(L1-L2) / D1; The grinding device (1) comprises a grinding wheel (11), an adsorption platform (12) and an adjusting bolt (13); The adsorption platform (12) is placed flat on the installation surface, the upper surface of the adsorption platform (12) is the adsorption surface (121), and the adsorption surface (121) is provided with an adsorption hole (1211) connected to the air source; The lower surface of the grinding wheel (11) is a grinding plane (111), and the adsorption surface (121) is parallel to the grinding plane (111); The adsorption platform (12) is provided with a threaded hole (123) penetrating the adsorption platform (12); the axis of the threaded hole (123) is perpendicular to the adsorption platform (12); and the adjusting bolt (13) is threadably matched with the threaded hole (123).

2. The substrate polishing method according to claim 1, characterized in that: The first coating layer (22) is provided with a plurality of measuring holes (223) penetrating the first coating layer (22): The inclination angle of the upper surface of the substrate (21) corresponding to each measuring hole (223) relative to the horizontal plane is measured by an angle measuring instrument, and the average value of the multiple inclination angles measured by the multiple measuring holes (223) is taken to obtain the angle between the lower surface of the substrate (21) and the grinding plane (111).

3. The substrate polishing method according to claim 1, characterized in that: Correcting the error based on the result of the measurement error also includes: re-measuring the error after adjusting the substrate (2) or adjusting the adsorption platform (12); if the lower surface of the substrate (21) is not parallel to the grinding plane (111) after the re-measuring, then continuing to adjust the substrate (2) or adjusting the adsorption platform (12); and continuing to re-measuring after the adjustment until the upper surface of the substrate (21) is parallel to the grinding plane (111).

4. The substrate polishing method according to claim 1, characterized in that: The upper surface of the adsorption platform (12) is provided with a groove (122), and the bottom wall of the groove (122) is provided with the threaded hole (123); A plurality of grooves (122) are provided on the upper surface of the adsorption platform (12), and a threaded hole (123) is provided in each of the grooves (122).

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