A semiconductor component decontamination device based on high-purity gas purging

Abstract

The present invention discloses a semiconductor component decontamination device based on high-purity gas purging, and relates to the technical field of semiconductor component decontamination devices. The semiconductor component decontamination device based on high-purity gas purging comprises a fixed frame, a side surface of the fixed frame is rotatably connected to a rotating shaft, the rotating shaft is symmetrically arranged with a vertical center line of the fixed frame as a reference, the outer surface of the rotating shaft is transmission-connected to a conveyor belt, and the side surface of the conveyor belt close to the fixed frame is evenly fixedly connected with bumps. When the device is in use, the gas evenly covers the surface of the semiconductor component, ensuring that every corner of the semiconductor component can be purged by the gas, thereby reducing cleaning dead angles, and at the same time, avoiding certain areas of the semiconductor surface from being damaged by a large impact force during decontamination due to being close to the purging hole, so that the semiconductor component is decontaminated at the same place each time, maintaining the consistency and traceability of the decontamination process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component decontamination devices, and in particular to a semiconductor component decontamination device based on high-purity gas purging. Background Art

[0002] Semiconductor components refer to the key components used to manufacture semiconductor devices, including chips, wafers, transistors, integrated circuits, etc. Semiconductor components play an important role in electronic devices and are the basis for current control and signal processing. In modern electronic technology, semiconductor components are widely used in various electronic products such as computers, mobile phones, televisions, and communication equipment. With the continuous advancement of science and technology, the performance and integration of semiconductor components are also constantly improving, which has promoted the rapid development of electronic technology.

[0003] During the use of semiconductor components, pollutants such as dust, grease, moisture, etc. on their surface will reduce the performance and reliability of the devices. These pollutants will cause the electrical performance of electronic devices to decline, signal transmission to be blocked, and even cause circuit short circuits, open circuits and other faults. Therefore, in order to avoid these problems, semiconductor component cleaning devices are usually used to remove dirt and impurities on the surface of semiconductor components.

[0004] However, the existing semiconductor component decontamination device may encounter the following problems during use:

[0005] The working principle of the semiconductor component cleaning device is to use high-purity gas to spray onto the surface of the semiconductor component, and use the power of the airflow to carry away dirt and impurities, thereby achieving the purpose of cleaning and cleaning. However, the gas nozzle of the existing semiconductor component cleaning device is usually fixed on the inner wall of the cleaning box. Therefore, when cleaning the semiconductor component, the position of the semiconductor component far away from the gas nozzle cannot be completely covered, resulting in some positions on the surface of the semiconductor component cannot be fully cleaned, and it is easy to form a cleaning dead corner and cause dirt residue, affecting the final cleaning effect. At the same time, the area of ​​the semiconductor component close to the gas nozzle will be subjected to a greater impact force when being cleaned, which is easy to cause damage to the surface of the semiconductor component.

[0006] Therefore, the present invention proposes a semiconductor component decontamination device based on high-purity gas purging to make up for and improve the shortcomings of the prior art. Summary of the Invention

[0007] (1) Technical problems solved

[0008] In view of the deficiencies of the prior art, the present invention provides a semiconductor component decontamination device based on high-purity gas purging, which solves the problems raised in the above background technology.

[0009] (2) Technical solution

[0010] The transmission mechanism is a plurality of pairs of gears, each of which is connected to the transmission mechanism, and the plurality of pairs of gears are connected to the transmission mechanism, and the plurality of pairs of gears are connected to the transmission mechanism.

[0011] Preferably, the push rod and the protrusion are located on the same vertical section, and the push rod can be engaged with the protrusion.

[0012] The top of the fixing plate is fixedly connected to the fixing seat, and the top of the fixing plate is fixedly connected to the fixing seat.

[0013] Preferably, the fixing plate extends above the fixing seat, and a soft pad is provided on one side surface of the fixing plate close to the center line of the fixing seat.

[0014] Preferably, a baffle is fixedly connected to the upper surface of the fixing seat, and the baffle is symmetrically arranged with respect to the center line of the fixing seat, and both sides of the baffle are arranged as inclined surfaces.

[0015] Preferably, the surface of the fixing bracket close to the motor side is fixedly connected to an air pump, the surface of the fixing bracket close to the conveyor belt side is fixedly connected to a connecting pipe, the connecting pipe passes through the fixing bracket and extends to the side of the fixing bracket close to the air pump, and one end of the connecting pipe passes through the fixing bracket and is connected to the air pump, the surface of the fixing bracket close to the conveyor belt side is fixedly connected to a fixing box, the lower surfaces of the two side plates of the fixing box are set as inclined surfaces, the lower surface of the connecting pipe is evenly connected to a hose, the end of the hose away from the connecting pipe passes through the fixed box and extends to the inside of the fixed box, the interior of the fixed box is slidably connected with a purge pipe, the end of the hose extending to the inside of the fixed box is connected to the purge pipe, and the lower surface of the purge pipe is evenly provided with purge holes.

[0016] Preferably, the purge hole is opened at an angle, and the closer the purge hole is to the hose, the smaller its aperture size gradually decreases.

[0017] Preferably, an auxiliary rod is fixedly connected to the upper surface of the slider, and one end of the auxiliary rod away from the slider extends into the interior of the fixed box, and the other end extending into the interior of the fixed box is fixedly connected to the purge pipe.

[0018] Preferably, the upper surface of the fixed box is connected to a dust suction pipe, and the dust suction pipe is fixedly connected to the fixing frame.

[0019] (3) Beneficial effects

[0020] The semiconductor component decontamination device based on high-purity gas purging provided by the present invention has the following beneficial effects:

[0021] 1. Connect the purge tube to the slider through the auxiliary rod. When in use, the slider drives the purge tube to move from left to right inside the fixed box through the auxiliary rod. During the movement of the purge tube, the gas sprayed through the purge hole is evenly covered from left to right to the surface of the semiconductor component, thereby decontaminating the semiconductor surface and ensuring that every corner of the semiconductor component can be purged by the gas, thereby reducing cleaning dead corners and avoiding residual dirt. At the same time, when the purge tube moves, all parts of the semiconductor surface can be purged with gas of the same force, so that the surface of the semiconductor component can be evenly decontaminated. It can also avoid the situation where some areas of the semiconductor surface are close to the purge hole due to the fixed position of the purge tube, resulting in greater impact force during decontamination, causing damage to the semiconductor surface, and the situation where the area is far away from the purge hole and cannot be properly purged by gas, thereby reducing the damage caused to the semiconductor component during decontamination and making its surface evenly purged and decontaminated.

[0022] 2. By using a push rod to push the bump, the bump drives the conveyor belt to move. Since the bumps are evenly arranged, the conveyor belt can move the same distance each time, and the semiconductor components transported above the conveyor belt through the fixed seat can move the same distance, so that the semiconductors to be decontaminated above the fixed seat are transported to the position directly below the fixed box for decontamination each time, thereby making the surface of the semiconductor components decontaminated at the same place each time. Decontamination at the same position each time can maintain the consistency and traceability of the decontamination process of the same batch of semiconductor components. By accurately controlling the position of the semiconductor components during each decontamination, it can be ensured that the same decontamination parameters and processes are used to decontaminate the surface of the semiconductor components, and the decontamination results are more consistent and predictable.

[0023] 3. A fixing plate is connected to the inside of the placement groove through sliding. When in use, the fixing plate fixes the semiconductor components to be decontaminated. By fixing the semiconductor components, it can be ensured that the semiconductor components will not accidentally slide inside the placement groove during being transported to the position below the fixed box, causing scratches on the surface of the semiconductor components, thereby reducing the risk of scratches on the surface of the semiconductor components. In addition, by fixing the semiconductor components through the fixing plate, the position of the semiconductor components can be prevented from moving due to airflow purge during the gas decontamination process, thereby maintaining the stability of the position of the semiconductor components during the decontamination process and avoiding unstable decontamination effects caused by the movement of the semiconductor components during the decontamination process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0025] Figure 2 This is a schematic diagram of a cutaway top view of the three-dimensional structure of the main body of the present invention;

[0026] Figure 3 For the present invention Figure 2 Schematic diagram of the enlarged structure of A;

[0027] Figure 4 This is a schematic diagram of a partially cutaway structure of a fixing box according to the present invention;

[0028] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure of B;

[0029] Figure 6 For the present invention Figure 4 Schematic diagram of the enlarged structure of C in the middle;

[0030] Figure 7 It is a schematic diagram of the partial cross-section structure of the fixing seat of the present invention;

[0031] Figure 8 For the present invention Figure 7Schematic diagram of the enlarged structure of D in the middle.

[0032] The numbers in the figure represent:

[0033] 1. Fixed frame; 2. Rotating shaft; 3. Conveyor belt; 4. Bump; 5. Motor; 6. Connecting rod 1; 7. Connecting rod 2; 8. Slide 1; 9. Slider; 10. Push rod; 11. Stop column; 12. Fixed ring; 13. Spring 1; 14. Fixed seat; 15. Slide 2; 16. Fixed plate; 17. Spring 2; 18. Placement slot; 19. Baffle; 20. Air pump; 21. Connecting pipe; 22. Fixed box; 23. Hose; 24. Purge pipe; 25. Purge hole; 26. Auxiliary rod; 27. Dust suction pipe. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] refer to Figures 1 to 8 According to a preferred embodiment of the present invention, a semiconductor component decontamination device based on high-purity gas purging will be described in detail below. A semiconductor component decontamination device based on high-purity gas purging includes a fixed frame 1, a side surface of the fixed frame 1 is rotatably connected to a rotating shaft 2, the rotating shaft 2 is symmetrically arranged with respect to the vertical center line of the fixed frame 1, the outer surface of the rotating shaft 2 is transmission-connected to a conveyor belt 3, the side surface of the conveyor belt 3 close to the fixed frame 1 is evenly fixedly connected with a bump 4, the surface of the fixed frame 1 away from the rotating shaft 2 is fixedly connected to a motor 5, the output shaft end of the motor 5 passes through the fixed frame 1 and extends to the fixed frame 1 On the side close to the rotating shaft 2, the output shaft of the motor 5 extends to one end of the rotating shaft 2 and is fixedly connected to a connecting rod 6. The end of the connecting rod 6 away from the motor 5 is rotatably connected to a connecting rod 2 7. A slide groove 8 is provided on the surface of the side of the fixed frame 1 close to the rotating shaft 2. A slider 9 is slidably connected inside the slide groove 8. The slider 9 is rotatably connected to the end of the connecting rod 2 7 away from the connecting rod 6. The surface of the slider 9 close to the conveyor belt 3 is rotatably connected to a push rod 10. The surface of the slider 9 close to the conveyor belt 3 is fixedly connected to a stop column 11. The stop column 11 limits the counterclockwise rotation angle of the push rod 10, so that the push rod 10 pushes the conveyor belt 3 to move through the protrusion 4.

[0036] The push rod 10 and the bump 4 are located on the same vertical section, and the push rod 10 can be engaged with the bump 4. The bump 4 is engaged with the push rod 10, so that the push rod 10 pushes the bump 4 to drive the conveyor belt 3 fixedly connected to the bump 4 to move. When the conveyor belt 3 moves, it simultaneously drives the fixing seat 14 fixedly connected by the fixing ring 12 to move. Since the bumps 4 are evenly arranged, the fixing seat 14 can move the same distance each time, thereby allowing the semiconductor components above the fixing seat 14 to be decontaminated at the same place.

[0037] The upper surface of the conveyor belt 3 is evenly fixedly connected with a fixing ring 12, and the fixing ring 12 is set to a telescopic structure. The interior of the fixing ring 12 is fixedly connected with a spring 13. The upper surface of the fixing ring 12 is fixedly connected with a fixing seat 14. The top of the spring 13 is fixedly connected to the fixing seat 14. The interior of the fixing seat 14 is provided with a chute 2 15. The interior of the chute 2 15 is slidably connected with a fixing plate 16. The top of the fixing plate 16 extends above the fixing seat 14. One side surface of the fixing plate 16 is fixedly connected with a spring 2 17. The end of the spring 2 17 away from the fixing plate 16 is fixed with the chute 2 15. The inner wall is fixedly connected, the fixing plate 16 and the spring 17 are symmetrically arranged with the vertical center line of the fixing seat 14 as a reference, and the fixing plates 16 on both sides squeeze the semiconductor components and fix the semiconductor components in the placement groove 18 opened above the fixing seat 14 to ensure that their position is stable and will not shift during transportation, and to ensure that the surface of the semiconductor components will not be scratched due to sliding during transportation, thereby reducing the risk of scratches on the surface of the semiconductor components. The upper surface of the fixing seat 14 is provided with a placement groove 18, and the fixing plate 16 extends to one end above the fixing seat 14 and is slidably connected to the inside of the placement groove 18.

[0038] The fixing plate 16 extends above the fixing seat 14 , and a soft pad is provided on one side of the fixing plate 16 close to the center line of the fixing seat 14 , so that the fixing plates 16 on both sides can reduce the damage to the surface of the semiconductor component caused by squeezing when fixing the semiconductor component.

[0039] The upper surface of the fixing base 14 is fixedly connected with a baffle 19 . The baffle 19 is symmetrically arranged with respect to the center line of the fixing base 14 , and both sides of the baffle 19 are arranged as inclined surfaces.

[0040] An air pump 20 is fixedly connected to the surface of the fixed frame 1 near the motor 5, and a connecting pipe 21 is fixedly connected to the surface of the fixed frame 1 near the conveyor belt 3. The connecting pipe 21 passes through the fixed frame 1 and extends to the side of the fixed frame 1 near the air pump 20, and one end of the connecting pipe 21 passes through the fixed frame 1 and is connected to the air pump 20. A fixed box 22 is fixedly connected to the surface of the fixed frame 1 near the conveyor belt 3. The lower surfaces of the two side plates of the fixed box 22 are set to be inclined surfaces, and the lower surface of the connecting pipe 21 is evenly connected to a hose 23, and the end of the hose 23 away from the connecting pipe 21 passes through the fixed box 22 and extends to the inside of the fixed box 22. The inside of the fixed box 22 is slidably connected with a purge pipe 24, and the end of the hose 23 extending to the inside of the fixed box 22 is connected to the purge pipe 24, and the lower surface of the purge pipe 24 is evenly provided with purge holes 25.

[0041] The purge hole 25 is opened at an angle, and the closer the purge hole 25 is to the hose 23 , the smaller its aperture gradually decreases.

[0042] An auxiliary rod 26 is fixedly connected to the upper surface of the slider 9, and the auxiliary rod 26 extends to the inside of the fixed box 22 at one end away from the slider 9, and the end of the auxiliary rod 26 extending to the inside of the fixed box 22 is fixedly connected to the purge pipe 24. When in use, the slider 9 drives the purge pipe 24 fixedly connected to the auxiliary rod 26 through the auxiliary rod 26 to move inside the fixed box 22 toward the center line of the fixed box 22, so that the high-purity gas sprayed from the inside of the purge pipe 24 to the surface of the semiconductor component to be decontaminated through the purge hole 25 can evenly cover the surface of the semiconductor component to be decontaminated, ensuring that every corner of the semiconductor component can be purged by the gas. At the same time, when the purge pipe 24 moves, the gas can be evenly sprayed to the surface of the semiconductor component, avoiding damage to the semiconductor surface due to certain areas of the semiconductor surface being close to the purge hole 25 during decontamination.

[0043] The upper surface of the fixed box 22 is connected to a dust suction pipe 27, which is fixedly connected to the fixed frame 1. The dust suction pipe 27 sucks the dust and other impurities cleaned from the surface of the semiconductor components to the outside of the fixed box 22 to prevent the blown-off dust and other impurities from falling onto the surface of the semiconductor components again.

[0044] The following is the entire working process and working principle of the above embodiment:

[0045] Turn on the air pump 20 and the motor 5 before use.

[0046] When in use, the user presses the two fixing plates 16 respectively toward the edge of the fixing seat 14. At this time, the spring 2 17 fixedly connected to the fixing plate 16 is squeezed. Then, after the semiconductor component to be cleaned is placed between the two fixing plates 16 on the upper surface of the placement groove 18, the user no longer presses the two fixing plates 16 respectively toward the edge of the fixing seat 14. The spring 2 17 is no longer squeezed, and the rebound force of the spring 2 17 pushes the two fixing plates 16 to move toward the position close to the center line of the fixing seat 14, fixing the semiconductor component to be cleaned, so that the semiconductor component will not accidentally slide during the process of being transported to the bottom of the fixing box 22, causing surface scratches, thereby reducing the risk of surface scratches on the semiconductor component. At the same time, the fixing plate 16 fixes the semiconductor component to be cleaned, and can also prevent the semiconductor component from moving due to airflow blowing during the gas decontamination process, thereby maintaining the stability of the position of the semiconductor component during the decontamination process, and avoiding unstable decontamination effect caused by the movement of the semiconductor component during the decontamination process.

[0047] Then, the output shaft of the motor 5 drives the connecting rod 1 6 fixed thereto to rotate. During the rotation of the connecting rod 1 6, the connecting rod 2 7 connected to the connecting rod 1 6 is driven to rotate. When the connecting rod 2 7 rotates, the slider 9 connected to the connecting rod 2 7 is driven to slide left and right inside the slide groove 1 8. When the slider 9 slides in the direction close to the fixed box 22, the push rod 10 connected to one side of the slider 9 pushes the protrusion 4 to move in the direction close to the fixed box 22. When the protrusion 4 moves in the direction close to the fixed box 22, the conveyor belt 3 fixedly connected to the protrusion 4 is driven to rotate counterclockwise on the surface of the rotating shaft 2. When the conveyor belt 3 rotates, it drives the fixed ring 12 fixedly connected to the surface to move in the direction close to the fixed box 22. When the fixed ring 12 moves, it drives the fixed seat 14 fixedly connected to the fixed ring 12 to move in the direction close to the fixed box 22. When the fixed seat 14 moves, it drives the semiconductor component to be decontaminated placed in the placement groove 18 opened above the fixed seat 14 to move in the direction close to the fixed box 22.

[0048] Through the above structure, the push rod 10 is used to push the conveyor belt 3 through the protrusion 4 to drive the fixed seat 14 to move. Since the protrusions 4 are evenly arranged, the push rod 10 drives the conveyor belt 3 to move the same distance each time through the protrusion 4. When the conveyor belt 3 moves, it simultaneously drives the fixed seat 14 fixedly connected to it by the fixing ring 12 to move, so that the fixed seat 14 can move the same distance each time. Since the fixed seat 14 moves the same distance each time, the semiconductor components to be decontaminated transported in the placement groove 18 opened above the fixed seat 14 can move the same distance each time, so that the semiconductors to be decontaminated above the fixed seat 14 are transported to the position directly below the fixed box 22 for decontamination each time, and thus the surface of the semiconductor components to be decontaminated are decontaminated at the same place each time. Decontamination at the same position each time can maintain the consistency and traceability of the decontamination process of the same batch of semiconductor components. By accurately controlling the position during each decontamination, it can be ensured that the same decontamination parameters and processes are used to decontaminate the surface of the semiconductor components, and the decontamination results are more consistent and predictable.

[0049] After the conveyor belt 3 drives the fixed seat 14 to move to the fixed box 22 through the fixed ring 12, the side plates of the fixed box 22 are squeezed downward by the baffle 19, and the two sides of the baffle 19 are set as inclined surfaces, and the lower surfaces of the two side plates of the fixed box 22 are set as inclined surfaces. Therefore, the side plates of the fixed box 22 are squeezed downward by the baffle 19. When the fixed seat 14 moves downward, the spring 13 located inside the fixed ring 12 and fixedly connected to the fixed seat 14 is squeezed.

[0050] Finally, when the conveyor belt 3 drives the upper fixing seat 14 to move to the bottom of the fixing box 22 through the fixing ring 12, the high-purity gas is transported to the inside of the connecting pipe 21 under the action of the air pump 20. Thereafter, the high-purity gas is transported to the inside of the purge pipe 24 through the hose 23 connected to the fixing box 22. After being transported to the inside of the purge pipe 24, the gas is blown onto the surface of the semiconductor component to be decontaminated through the purge holes 25 opened on the lower surface of the purge pipe 24, thereby purging impurities from the decontaminated semiconductor component. Thereafter, the purged impurities are sucked out of the fixing box 22 through the dust suction pipe 27.

[0051] Furthermore, when the slider 9 slides in the direction away from the fixed box 22, the slider 9 drives the purge tube 24 fixedly connected to the auxiliary rod 26 to move inside the fixed box 22 toward the center line of the fixed box 22 through the auxiliary rod 26. During the movement of the purge tube 24, the high-purity gas sprayed from the inside of the purge tube 24 through the purge hole 25 onto the surface of the semiconductor component to be decontaminated can evenly cover the surface of the semiconductor component to be decontaminated, ensuring that every corner of the semiconductor component can be purged by the gas, thereby reducing cleaning dead corners and avoiding residual dirt. At the same time, when the purge tube 24 moves, all parts of the semiconductor surface can be purged with gas of the same force, so that the surface of the semiconductor component can be evenly decontaminated. It can also avoid the situation where some areas of the semiconductor surface are close to the purge hole 25 due to the fixed position of the purge tube 24, resulting in greater impact force during decontamination, causing damage to the semiconductor surface, and the situation where the area far from the purge hole 25 cannot be properly purged by gas, reducing the damage caused to the semiconductor component during decontamination, so that its surface can be evenly purged and decontaminated.

[0052] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor component decontamination device based on high-purity gas purging, comprising a fixed frame (1), a rotating shaft (2) being rotatably connected to a surface of one side of the fixed frame (1), the rotating shaft (2) being symmetrically arranged with respect to a vertical center line of the fixed frame (1), and a conveyor belt (3) being rotatably connected to an outer surface of the rotating shaft (2), characterized in that: The surface of the conveyor belt (3) on the side close to the fixed frame (1) is evenly fixedly connected with a protrusion (4), the surface of the fixed frame (1) on the side away from the rotating shaft (2) is fixedly connected with a motor (5), the output shaft end of the motor (5) passes through the fixed frame (1) and extends to the side of the fixed frame (1) close to the rotating shaft (2), the output shaft of the motor (5) extends to one end of the rotating shaft (2) and is fixedly connected with a connecting rod (6), the end of the connecting rod (6) away from the motor (5) is rotatably connected with a connecting rod (7), a sliding groove (8) is provided on the surface of the side close to the rotating shaft (2), a slider (9) is slidably connected inside the sliding groove (8), the slider (9) is rotatably connected to the end of the connecting rod (7) away from the connecting rod (6), the surface of the slider (9) on the side close to the conveyor belt (3) is rotatably connected with a push rod (10), and the surface of the slider (9) on the side close to the conveyor belt (3) is fixedly connected with a blocking column (11); The surface of the fixing frame (1) on the side close to the motor (5) is fixedly connected to an air pump (20), and the surface of the fixing frame (1) on the side close to the conveyor belt (3) is fixedly connected to a connecting pipe (21), and the connecting pipe (21) passes through the fixing frame (1) and extends to the side of the fixing frame (1) close to the air pump (20), and one end of the connecting pipe (21) passes through the fixing frame (1) and is connected to the air pump (20), and the surface of the fixing frame (1) on the side close to the conveyor belt (3) is fixedly connected to a fixing box (22), and the fixing box The lower surfaces of the two side plates (22) are both configured as inclined surfaces, and the lower surface of the connecting pipe (21) is evenly connected to a hose (23), and one end of the hose (23) away from the connecting pipe (21) passes through the fixed box (22) and extends to the inside of the fixed box (22). The inside of the fixed box (22) is slidably connected to a purge pipe (24), and one end of the hose (23) extending to the inside of the fixed box (22) is connected to the purge pipe (24), and the lower surface of the purge pipe (24) is evenly provided with purge holes (25); The purge hole (25) is opened at an angle, and the closer the purge hole (25) is to the hose (23), the smaller its aperture size gradually decreases.

2. The semiconductor component decontamination device based on high-purity gas purging according to claim 1, characterized in that: The push rod (10) and the protrusion (4) are located on the same vertical section, and the push rod (10) can be engaged with the protrusion (4).

3. The semiconductor component decontamination device based on high-purity gas purging according to claim 1, characterized in that: The upper surface of the conveyor belt (3) is evenly fixedly connected with a fixing ring (12), and the fixing ring (12) is set as a telescopic structure. The interior of the fixing ring (12) is fixedly connected with a spring 1 (13). The upper surface of the fixing ring (12) is fixedly connected with a fixing seat (14). The top of the spring 1 (13) is fixedly connected to the fixing seat (14). The interior of the fixing seat (14) is provided with a chute 2 (15). The interior of the chute 2 (15) is slidably connected with a fixing plate (16). The top of the fixing plate (16) is fixedly connected to the fixing seat (14). The ends of the fixing plate (16) extend above the fixing seat (14), and a spring 2 (17) is fixedly connected to a surface of one side of the fixing plate (16). The end of the spring 2 (17) away from the fixing plate (16) is fixedly connected to the inner wall of the slide groove 2 (15). The fixing plate (16) and the spring 2 (17) are symmetrically arranged with the vertical center line of the fixing seat (14) as a reference. A placement groove (18) is provided on the upper surface of the fixing seat (14), and the end of the fixing plate (16) extending above the fixing seat (14) is slidably connected to the inside of the placement groove (18).

4. The semiconductor component decontamination device based on high-purity gas purging according to claim 3, characterized in that: The fixing plate (16) extends above the fixing seat (14), and a soft cushion is provided on a surface of the fixing plate (16) on one side close to the center line of the fixing seat (14).

5. The semiconductor component decontamination device based on high-purity gas purging according to claim 3, characterized in that: The upper surface of the fixing seat (14) is fixedly connected with a baffle (19), and the baffle (19) is symmetrically arranged with the center line of the fixing seat (14) as a reference, and both sides of the baffle (19) are arranged as inclined surfaces.

6. The semiconductor component decontamination device based on high-purity gas purging according to claim 1, characterized in that: An auxiliary rod (26) is fixedly connected to the upper surface of the slider (9), and one end of the auxiliary rod (26) away from the slider (9) extends into the interior of the fixed box (22), and the end of the auxiliary rod (26) extending into the interior of the fixed box (22) is fixedly connected to the purge pipe (24).

7. The semiconductor component decontamination device based on high-purity gas purging according to claim 1, characterized in that: The upper surface of the fixed box (22) is connected to a dust suction pipe (27), and the dust suction pipe (27) is fixedly connected to the fixed frame (1).

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