A semiconductor wafer warpage measuring instrument for simultaneously inspecting multiple products

Abstract

The present invention provides a semiconductor wafer warpage measuring instrument for simultaneously inspecting multiple products, and relates to the technical field of warpage measuring devices, comprising: a driving part; a transposition part is arranged inside the driving part; a middle solid part is arranged on the top of the driving part; a measuring part is arranged inside the middle solid part; a position adjustment T-frame is slidably connected in a position adjustment slot, so that adjustment processing is conveniently carried out under the drive of an electric telescopic rod, and the spacing between a scanner, a curved slider and a wafer is conveniently controlled; and a scanner and a stabilizing block are respectively fixed on a moving block, so that reciprocating adjustment is conveniently carried out under the action of the electric telescopic rod, so that the warpage of the wafer can be measured by contact with the wafer, and the problem that the current traditional warpage measuring device mainly performs measurement processing by scanning, but in the measurement process, a one-to-one measurement method is usually adopted, resulting in a long measurement time required when there are many measurement tasks, resulting in low measurement efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of warpage measuring devices, and in particular to a semiconductor wafer warpage measuring instrument for simultaneously detecting a plurality of products. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer, and the warpage of the semiconductor wafer needs to be measured before it is put into use, so a warpage measuring device is needed.

[0003] As for the current traditional warpage measurement device, the measurement process is mainly carried out by scanning. However, during the measurement process, a one-to-one measurement method is usually adopted, which results in a longer measurement time when there are more measurement tasks, making its measurement efficiency low. Summary of the invention

[0004] The disclosed embodiment relates to a semiconductor wafer warpage measuring instrument for simultaneously inspecting multiple products, which comprises a measuring part, wherein a position adjustment T-frame is slidably connected in a position adjustment slot, so that adjustment processing is facilitated by an electric telescopic rod, and the spacing between a scanner, a curved slide block and a wafer is conveniently controlled; and a scanner and a stabilizing block are respectively fixed on a moving block, so that reciprocating adjustment is facilitated by the action of an electric telescopic rod, so that the warpage of the wafer can be measured by contact with the wafer, and the use of the measuring part is convenient.

[0005] In a first aspect of the present disclosure, a semiconductor wafer warpage measuring instrument for simultaneously detecting multiple products is provided, which specifically comprises: a driving part; the driving part comprises a supporting bottom shell, a supporting block and a driving block; the supporting bottom shell is configured as a cylindrical structure, a rectangular protrusion is provided on the outer wall of the supporting bottom shell, a circular ring-shaped groove is provided on the top of the supporting bottom shell, the circular ring-shaped groove of the supporting bottom shell is connected with a rectangular groove, a cylindrical groove is provided at the bottom of the supporting bottom shell, and a synchronous motor is provided at the bottom of the supporting bottom shell; a transposition part is provided inside the driving part, and the transposition part comprises a transposition ring; the transposition ring is rotatably connected to the inside of the supporting bottom shell, a fixed-point plug-in block is inserted on the outer wall of the transposition ring, and the transposition ring is connected to the driving block by a latch; the transposition ring is configured as a circular ring structure, a latch is provided on the inner wall of the transposition ring, arc-shaped through holes are equidistantly opened on the transposition ring, and a hemispherical slot is provided on the outer wall of the transposition ring; A middle solid part is provided on the top of the driving part, and the middle solid part includes a middle solid block, a position adjustment groove and a control panel; the middle solid block is fixed to the top of the supporting block by screws; the middle solid block, the middle solid block is arranged as a rectangular parallelepiped structure, the top of the middle solid block is arranged with an electric telescopic rod, and the bottom of the middle solid block is arranged with a disc-shaped structure; a measuring part is provided inside the middle solid part, and the measuring part includes a position adjustment T-frame, a scanner, a stabilizing block and a curved slider; the position adjustment T-frame is slidably connected in the position adjustment groove, the position adjustment T-frame is connected to the electric telescopic rod on the middle solid block, the scanner is electrically connected to the control panel, and the curved slider is electrically connected to the control panel; the curved slider is arranged as a cylindrical structure, a cylindrical groove is provided on the top of the curved slider, a rectangular block is provided in the cylindrical groove of the curved slider, a spring is provided in the cylindrical groove of the curved slider, a contact head is provided at the bottom of the curved slider, and the curved slider is slidably connected to the bottom of the stabilizing block.

[0006] At least in some embodiments, the support block is configured as a cylindrical structure, and the support block is fixedly connected to the top of the support bottom shell; the drive block is configured as a columnar gear structure, and the drive block is connected to the synchronous motor on the support bottom shell.

[0007] At least in some embodiments, the driving unit also includes a fixed-point plug; the fixed-point plug is configured as a rectangular block structure, a cylindrical structure is provided on the fixed-point plug, a spring is provided on the fixed-point plug, and the fixed-point plug is slidably connected in a rectangular groove supporting the bottom shell.

[0008] At least in some embodiments, the transposition part also includes a socket and an alignment plug; the socket is configured as a rectangular through hole, and the socket is equidistantly arranged on the transposition ring; the alignment plug is configured as a rectangular block structure, a torsion motor is provided at the bottom of the alignment plug, and the alignment plug is stuck inside the socket.

[0009] At least in some embodiments, the transposition part further includes a crystal supporting plate; the crystal supporting plate is configured as a disc-shaped structure, a supporting block is provided on the top of the crystal supporting plate, and the crystal supporting plate is connected to a torsion motor on the alignment plug block.

[0010] At least in some embodiments, the middle solid part also includes a side support plate; the position adjustment groove is arranged as a rectangular structure, the position adjustment groove is connected with a rectangular through hole, and the position adjustment groove is opened inside the middle solid block; the side support plate is arranged as a T-shaped structure, the side support plate is provided with an inclined square plate, and the side support plate is fixed to the outer wall of the middle solid block by screws; the control panel is fixed to the inclined square plate of the side support plate.

[0011] At least in some embodiments, the measuring part also includes an adjustment slot; the position adjustment T-frame is arranged as a T-shaped structure, a spring is arranged at the bottom of the position adjustment T-frame, a rectangular through hole is arranged on the position adjustment T-frame, and an electric telescopic rod is arranged in the rectangular through hole of the position adjustment T-frame; the adjustment slot is arranged as a rectangular through hole, the adjustment slot is connected with a rectangular sliding slot, and there are three groups of adjustment slots in total, and the three groups of adjustment slots are respectively opened on the position adjustment T-frame.

[0012] At least in some embodiments, the measuring part also includes a moving block; the moving block is arranged as a rectangular block structure, a cylindrical protrusion is arranged on the outer wall of the moving block, a U-shaped structure is arranged on the moving block, and there are three groups of moving blocks in total, the three groups of moving blocks are respectively slidably connected in the three groups of adjustment grooves, and the three groups of moving blocks are respectively connected to the electric telescopic rod on the position adjustment T-frame.

[0013] At least in some embodiments, the scanner is configured as a square plate-shaped structure, a scanning probe is provided at the bottom of the scanner, and there are two groups of scanners in total, and the two groups of scanners are respectively fixed to the bottoms of the two groups of moving blocks; the stabilizing block is configured as a square plate-shaped structure, a cylindrical protrusion is provided at the bottom of the stabilizing block, a rectangular sliding groove is provided on the outer wall of the cylindrical protrusion of the stabilizing block, and the stabilizing block is fixed to the bottom of the moving block.

[0014] The semiconductor wafer warpage measuring instrument for simultaneously testing multiple products provided by the present invention has the following beneficial effects:

[0015] The present invention is provided with a support block and a fixed-point plug-in block. By fixing the support block to the top of the supporting bottom shell, it is convenient to support other structures of the device so that the device as a whole remains stable. By inserting the fixed-point plug-in block inside the supporting bottom shell, it is convenient to be stuck in the transposition ring while extending and retracting, so as to locate the relative position of the transposition ring.

[0016] In addition, a transposition ring and a crystal support plate are provided. By opening a socket on the transposition ring, it is convenient to fix the crystal support plate in cooperation with the docking block, and the crystal support plate is driven to rotate by the torsion motor at the bottom of the docking block while maintaining stability, so that the two sets of scanners can scan and process the top wafer. By rotatably connecting the transposition ring to the inside of the supporting bottom shell, the relative position of the corresponding wafer can be adjusted during the rotation.

[0017] In addition, a position adjustment T-frame is provided, and by slidingly connecting the position adjustment T-frame in the position adjustment slot, position adjustment can be performed conveniently under the action of the electric telescopic rod on the middle solid block to assist in bringing the scanner, the curved slide block and the wafer closer together. At the same time, by fixing different measuring structures on the position adjustment T-frame, measurement processing can be performed conveniently when the wafer is moved under the measuring structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0019] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0020] In the attached picture:

[0021] Figure 1 A schematic diagram of a three-dimensional assembly structure according to an embodiment of the present invention is shown;

[0022] Figure 2 A schematic diagram of a bottom-up structure of a three-dimensional assembly according to an embodiment of the present invention is shown;

[0023] Figure 3 A schematic diagram showing a decomposition structure according to an embodiment of the present invention is shown;

[0024] Figure 4 A schematic diagram showing an exploded bottom-up structure according to an embodiment of the present invention is shown;

[0025] Figure 5 A schematic diagram showing a partial cutaway structure according to an embodiment of the present invention is shown;

[0026] Figure 6 The embodiment according to the present invention is shown. Figure 5 The schematic diagram of the enlarged structure of part A is shown;

[0027] Figure 7 The embodiment according to the present invention is shown. Figure 5 The schematic diagram of the enlarged structure of part B is shown;

[0028] Figure 8 A schematic diagram showing an assembly structure of a driving unit according to an embodiment of the present invention is shown;

[0029] Fig. 9 A schematic diagram showing an assembly structure of a transposition part according to an embodiment of the present invention is shown;

[0030] Fig.10 A schematic diagram showing an assembly structure of a middle solid part according to an embodiment of the present invention is shown;

[0031] Fig.11A schematic diagram showing an assembly structure of a measuring part according to an embodiment of the present invention is shown.

[0032] Reference numerals list

[0033] 1. Driving unit; 101. Supporting bottom shell; 102. Supporting block; 103. Driving block; 104. Fixed point plug block;

[0034] 2. Transposition part; 201. Transposition ring; 202. Socket; 203. Alignment plug; 204. Crystal support plate;

[0035] 3. Middle solid part; 301. Middle solid block; 302. Position adjustment slot; 303. Side support plate; 304. Control panel;

[0036] 4. Measuring unit; 401. Position adjustment T-frame; 402. Adjustment slot; 403. Moving block; 404. Scanner; 405. Stabilizing block; 406. Sliding block. DETAILED DESCRIPTION

[0037] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and examples.

[0038] Example 1: Please refer to Figures 1 to 11:The present invention proposes a semiconductor wafer warpage measuring instrument for simultaneously detecting multiple products, comprising: a driving part 1; the driving part 1 comprises a supporting bottom shell 101, a supporting block 102 and a driving block 103; the supporting bottom shell 101 is set to a cylindrical structure, a rectangular protrusion is arranged on the outer wall of the supporting bottom shell 101, a circular ring-shaped groove is arranged on the top of the supporting bottom shell 101, the circular ring-shaped groove of the supporting bottom shell 101 is connected with a rectangular groove, a cylindrical groove is arranged at the bottom of the supporting bottom shell 101, and a synchronous motor is arranged at the bottom of the supporting bottom shell 101; the supporting bottom shell 101 is used to assist in the installation and fixing of other structures of the device, so that the device as a whole remains stable and is convenient for the adjustment of the device as a whole Processing; a transposition part 2 is provided inside the driving part 1, and the transposition part 2 includes a transposition ring 201; the transposition ring 201 is rotatably connected to the inside of the supporting bottom shell 101, and a fixed point plug 104 is inserted on the outer wall of the transposition ring 201, and the transposition ring 201 is connected to the driving block 103 through a latch; the transposition ring 201 is set as a circular ring structure, and a latch is provided on the inner wall of the transposition ring 201. Arc-shaped through holes are equidistantly opened on the transposition ring 201, and a hemispherical slot is provided on the outer wall of the transposition ring 201; the transposition ring 201 is used to rotate under the drive of the driving block 103, so as to facilitate the adjustment of the relative position of the wafer and facilitate the measurement and processing of the warpage of the semiconductor wafer; the top of the driving part 1 A middle solid part 3 is provided, and the middle solid part 3 includes a middle solid block 301, a position adjustment slot 302 and a control panel 304; the middle solid block 301 is fixed to the top of the support block 102 by screws; the middle solid block 301 is set as a rectangular parallelepiped structure, the top of the middle solid block 301 is provided with an electric telescopic rod, and the bottom of the middle solid block 301 is provided with a disc-shaped structure; the middle solid block 301 is used to assist in the installation and fixation of other structures of the middle solid part 3, so as to facilitate the adjustment process while maintaining stability; a measuring part 4 is provided inside the middle solid part 3, and the measuring part 4 includes a position adjustment T frame 401, a scanner 404, a stabilizing block 405 and a curved slider 406; the position adjustment T frame 401 is slidably connected In the position adjustment slot 302, the position adjustment T-frame 401 is connected to the electric telescopic rod on the middle solid block 301, the scanner 404 is electrically connected to the control panel 304, and the curved slider 406 is electrically connected to the control panel 304; the curved slider 406 is set as a cylindrical structure, the top of the curved slider 406 is provided with a cylindrical groove, the cylindrical groove of the curved slider 406 is provided with a rectangular block, the cylindrical groove of the curved slider 406 is provided with a spring, the bottom of the curved slider 406 is provided with a contact head, and the curved slider 406 is slidably connected to the bottom of the stabilizing block 405; the curved slider 406 is used to perform telescopic processing during the rotation of the wafer to facilitate the measurement of the warpage of the wafer.

[0039] Embodiment 2: Based on Embodiment 1, Figure 8As shown, the support block 102 is configured as a cylindrical structure, and the support block 102 is fixedly connected to the top of the support bottom shell 101; the support block 102 is used to support the centering solid part 3 and the measuring part 4, so as to facilitate the stability of the device as a whole; the driving block 103 is configured as a columnar gear structure, and the driving block 103 is connected to the synchronous motor on the support bottom shell 101; the driving block 103 is used to rotate under the drive of the synchronous motor, so as to facilitate the control of the transposition ring 201 for torsion processing; the driving part 1 also includes a fixed point plug-in block 104; the fixed point plug-in block 104 is configured as a rectangular block structure, the fixed point plug-in block 104 is provided with a cylindrical structure, the fixed point plug-in block 104 is provided with a spring, and the fixed point plug-in block 104 is slidably connected in the rectangular groove of the support bottom shell 101; the fixed point plug-in block 104 is used to perform telescopic adjustment in the support bottom shell 101, so as to facilitate the positioning processing of the transposition ring 201 by inserting it in the transposition ring 201.

[0040] In the embodiments of the present disclosure, Fig. 9 As shown, the transposition part 2 also includes a socket 202 and an alignment plug 203; the socket 202 is set as a rectangular through hole, and the socket 202 is equidistantly arranged on the transposition ring 201; the socket 202 is used to assist in fixing the alignment plug 203, so as to facilitate the support of the crystal support plate 204; the alignment plug 203 is set as a rectangular block structure, and a torsion motor is provided at the bottom of the alignment plug 203, and the alignment plug 203 is stuck in the inside of the socket 202; the alignment plug 203 is used to assist in fixing the crystal support plate 204, so as to facilitate adjustment processing; the transposition part 2 also includes a crystal support plate 204; the crystal support plate 204 is set as a disc-shaped structure, and a support block is provided on the top of the crystal support plate 204, and the crystal support plate 204 is connected to the torsion motor on the alignment plug 203; the crystal support plate 204 is used to support the semiconductor wafer, so as to facilitate measurement processing.

[0041] In the embodiments of the present disclosure, Fig.10 As shown, the middle solid part 3 also includes a side support plate 303; the position adjustment groove 302 is set as a rectangular structure, the position adjustment groove 302 is connected with a rectangular through hole, and the position adjustment groove 302 is opened inside the middle solid block 301; the position adjustment groove 302 is used to assist in constraining the measuring part 4 to facilitate the adjustment of the wafer; the side support plate 303 is set as a T-shaped structure, and an inclined square plate is provided on the side support plate 303, and the side support plate 303 is fixed to the outer wall of the middle solid block 301 by screws; the side support plate 303 is used to fix the control panel 304, so that the control panel 304 remains stable as a whole; the control panel 304 is fixed to the inclined square plate of the side support plate 303; the control panel 304 is used to control and adjust the device as a whole to facilitate the measurement of the wafer.

[0042] In the embodiments of the present disclosure, Fig.11As shown, the measuring part 4 also includes an adjusting slot 402; the position-adjustable T-frame 401 is set as a T-shaped structure, the bottom of the position-adjustable T-frame 401 is provided with a spring, the position-adjustable T-frame 401 is provided with a rectangular through hole, and the rectangular through hole of the position-adjustable T-frame 401 is provided with an electric telescopic rod; the position-adjustable T-frame 401 is used to assist in the installation and fixation of other structures of the measuring part 4 to facilitate the stability of the device as a whole; the adjusting slot 402 is set as a rectangular through hole, the adjusting slot 402 is connected with a rectangular sliding slot, and the adjusting slot 402 is provided with three groups, and the three groups of adjusting slots 402 are respectively opened on the position-adjustable T-frame 401; the adjusting slot 402 is used to assist in the installation and fixation of the moving block 403, so that the moving block 403 can be adjusted; the measuring part 4 also includes a moving block 403; the moving block 403 is set as a rectangular block structure, the outer wall of the moving block 403 is provided with a cylindrical protrusion, the moving block 403 is provided with a U-shaped structure, and the moving block 403 is provided with three groups, and the three groups of moving blocks 403 slide respectively The scanner 404 is movably connected in three groups of adjustment slots 402, and the three groups of moving blocks 403 are respectively connected to the electric telescopic rods on the position adjustment T-frame 401; the moving block 403 is used to make overall adjustments under the action of the electric telescopic rod, so as to facilitate the adjustment of the relative position of the scanner 404 and the stabilizing block 405; the scanner 404 is set as a square plate structure, and a scanning probe is provided at the bottom of the scanner 404. There are two groups of scanners 404, and the two groups of scanners 404 are respectively fixed to the bottom of the two groups of moving blocks 403; the scanner 404 is used to scan the wafer to facilitate the scanning of the warpage of the wafer; the stabilizing block 405 is set as a square plate structure, and a cylindrical protrusion is provided at the bottom of the stabilizing block 405. A rectangular sliding groove is provided on the outer wall of the cylindrical protrusion of the stabilizing block 405, and the stabilizing block 405 is fixed to the bottom of the moving block 403; the stabilizing block 405 is used to assist in adjusting the curved slider 406, so as to facilitate the measurement and processing of the warpage of the wafer.

[0043] Specific usage and function of this embodiment: In the present invention, when in use, the wafer is placed on the top of the crystal support plate 204 through the external conveying structure to facilitate maintaining the stability of the wafer, and then the synchronous motor is started through the external control center to drive the driving block 103 to rotate, so that the driving block 103 is controlled by the gear to rotate and adjust the transposition ring 201, and the relative position of the crystal support plate 204 is adjusted during the rotation, so that the crystal support plate 204 on which the wafer is placed is moved to the bottom of the first-level scanner 404, and after the adjustment is completed, the corresponding electric telescopic rod on the position adjustment T-frame 401 is started to control the moving block 403 to slide and adjust in the adjustment groove 402, so as to facilitate the scanner 404 to scan the bottom wafer, and after the scanning is completed, the control motor is started again, so that the wafer after one scan is rotated ninety degrees through the transposition ring 201, so that it is moved to the bottom of the scanner 404 of the next level, and after the position adjustment is completed, the bottom is started. The torsion motor at the top is convenient to drive the top crystal support plate 204 to twist, so as to drive the crystal support plate 204 to twist, so as to adjust the relative position of the wafer, and then start the relative electric telescopic rod to drive the secondary scanner 404 to adjust the position. When convenient, the scanning lines of the scanning on both sides are in a vertical state, so as to present the cross scanning lines relative to the wafer. Then, the wafer that has completed the secondary scanning is moved to the bottom of the curved slider 406 through the synchronous motor and the driving block 103, and by starting the electric telescopic rod, it is convenient to drive the position adjustment T frame 401 to move down while making the curved slider 406 contact with the wafer, and then start the bottom torsion motor to drive the wafer to rotate, and make the wafer rotate synchronously during the rotation process, and force the curved slider 406 to reciprocate through the surface warping during the rotation, so as to generate a synchronous curve inside the control panel 304, and measure the warpage of the wafer in conjunction with the data scanned by the scanner 404.

[0044] In this article, there are a few points to note:

[0045] 1. The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures may refer to general designs.

[0046] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0047] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A semiconductor wafer warpage measuring instrument for simultaneously detecting multiple products, comprising: A driving part (1); characterized in that the driving part (1) comprises a supporting bottom shell (101), a supporting block (102) and a driving block (103); the supporting bottom shell (101) is configured as a cylindrical structure, a rectangular protrusion is provided on the outer wall of the supporting bottom shell (101), a circular ring-shaped groove is provided on the top of the supporting bottom shell (101), the circular ring-shaped groove of the supporting bottom shell (101) is connected to a rectangular groove, a cylindrical groove is provided at the bottom of the supporting bottom shell (101), and a synchronous motor is provided at the bottom of the supporting bottom shell (101); a transposition part (2) is provided inside the driving part (1), and the transposition part (2) comprises a transposition ring (201); the transposition ring (201) is rotatably connected to the inside of the supporting bottom shell (101), and the transposition ring (201) is provided to rotate inside the supporting bottom shell (101) to rotate. A fixed point plug (104) is inserted on the outer wall of the position ring (201), and the transposition ring (201) is connected to the driving block (103) via latch teeth; the transposition ring (201) is arranged as a circular ring structure, and latch teeth are arranged on the inner wall of the transposition ring (201); arc-shaped through holes are opened at equal intervals on the transposition ring (201), and a hemispherical slot is arranged on the outer wall of the transposition ring (201); a middle solid part (3) is arranged on the top of the driving part (1), and the middle solid part (3) comprises a middle solid block (301), a position adjustment groove (302) and a control panel (304); the middle solid block (301) is fixed to the top of the supporting block (102) via screws; the middle solid block (301) is arranged as a rectangular parallelepiped structure, and the middle solid block (301) The top of the middle solid block (301) is provided with an electric telescopic rod, and the bottom of the middle solid block (301) is provided with a disc-shaped structure; a measuring part (4) is provided inside the middle solid part (3), and the measuring part (4) comprises a position adjustment T-frame (401), a scanner (404), a stabilizing block (405) and a curved slider (406); the position adjustment T-frame (401) is slidably connected in the position adjustment groove (302), the position adjustment T-frame (401) is connected to the electric telescopic rod on the middle solid block (301), the scanner (404) is electrically connected to the control panel (304), and the curved slider (406) is electrically connected to the control panel (304); the curved slider (406) is configured as a cylindrical structure, and a cylindrical structure is provided on the top of the curved slider (406). The bottom of the curved slider (406) is provided with a contact head, and the curved slider (406) is slidably connected to the bottom of the stabilizing block (405); the support block (102) is configured as a cylindrical structure, and the support block (102) is fixed to the top of the support bottom shell (101); the drive block (103) is configured as a columnar gear structure, and the drive block (103) is connected to the synchronous motor on the support bottom shell (101); the drive unit (1) also includes a fixed point plug block (104); the fixed point plug block (104) is configured as a rectangular block structure, a cylindrical structure is provided on the fixed point plug block (104), a spring is provided on the fixed point plug block (104), and the fixed point plug block (104) is slidably connected in the rectangular groove of the support bottom shell (101).

2. The semiconductor wafer warpage measuring instrument for simultaneously testing multiple products according to claim 1, characterized in that: The transposition part (2) further comprises a socket (202) and an alignment plug block (203); the socket (202) is arranged as a rectangular through hole, and the socket (202) is equidistantly arranged on the transposition ring (201); the alignment plug block (203) is arranged as a rectangular block structure, a torsion motor is arranged at the bottom of the alignment plug block (203), and the alignment plug block (203) is clamped inside the socket (202).

3. The semiconductor wafer warpage measuring instrument for simultaneously testing multiple products according to claim 1, characterized in that: The transposition part (2) further comprises a crystal supporting plate (204); the crystal supporting plate (204) is configured as a disc-shaped structure, a supporting block is provided on the top of the crystal supporting plate (204), and the crystal supporting plate (204) is connected to a torsion motor on the alignment plug block (203).

4. The semiconductor wafer warpage measuring instrument for simultaneously testing multiple products according to claim 1, characterized in that: The middle solid portion (3) further comprises a side support plate (303); the position adjustment groove (302) is arranged as a rectangular parallelepiped structure, the position adjustment groove (302) is connected to a rectangular through hole, and the position adjustment groove (302) is arranged inside the middle solid block (301); the side support plate (303) is arranged as a T-shaped structure, an inclined square plate is arranged on the side support plate (303), and the side support plate (303) is fixed to the outer wall of the middle solid block (301) by means of screws; and the control panel (304) is fixed to the inclined square plate of the side support plate (303).

5. The semiconductor wafer warpage measuring instrument for simultaneously testing multiple products according to claim 1, characterized in that: The measuring part (4) further comprises a moving block (403); the moving block (403) is arranged as a rectangular block structure, a cylindrical protrusion is arranged on the outer wall of the moving block (403), a U-shaped structure is arranged on the moving block (403), and a total of three groups of moving blocks (403) are arranged, the three groups of moving blocks (403) are respectively slidably connected in the three groups of adjustment slots (402), and the three groups of moving blocks (403) are respectively connected to the electric telescopic rods on the position adjustment T-frame (401).

6. The semiconductor wafer warpage measuring instrument for simultaneously testing multiple products according to claim 5, characterized in that: The scanner (404) is configured as a square plate-shaped structure, a scanning probe is provided at the bottom of the scanner (404), two groups of scanners (404) are provided, and the two groups of scanners (404) are respectively fixed to the bottoms of the two groups of moving blocks (403); the stabilizing block (405) is configured as a square plate-shaped structure, a cylindrical protrusion is provided at the bottom of the stabilizing block (405), a rectangular sliding groove is provided on the outer wall of the cylindrical protrusion of the stabilizing block (405), and the stabilizing block (405) is fixed to the bottom of the moving block (403).

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