Chemical copper plating device for production of circuit board

Abstract

The application provides a chemical copper plating device for circuit board production, which comprises a workbench, a box body installed on one side of the surface of the workbench, a rotating device arranged on the surface of the workbench, a rotating device arranged on one side of the rotating device, two adjusting assemblies respectively arranged on two sides of the rotating device, two placing devices respectively arranged below the two adjusting assemblies, two connecting frames respectively connected to two sides of the surface of the box body, an air outlet assembly arranged on the surface of the connecting frame, and a driving device arranged on one side of the box body. The chemical copper plating device for circuit board production is provided, connecting frames, a plurality of air outlet pipes with connecting heads, a communication pipe, a conveying pipe and a driving device are arranged on the left and right sides of the box body, and the rotating device, the rotating device, the adjusting assembly and the placing device are operated in cooperation, so that the liquid on the surface of the circuit board can be preliminarily treated when the circuit board is taken out from the outside of the box body after the copper plating operation in the inside of the box body.

Description

TECHNICAL FIELD

[0001] The application relates to the field of circuit board production, in particular to a chemical copper plating device for circuit board production. BACKGROUND

[0002] The circuit board is also called ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board and printed circuit board, and is electronic equipment.

[0003] At present, the chemical copper plating technology is commonly used in the circuit board production and processing process. In the circuit board production and processing process, the circuit board needs to be subjected to copper plating treatment. In order to facilitate the copper plating treatment of the circuit board, a chemical copper plating device is usually used for assistance.

[0004] However, the patent application with the publication number CN219490160U disclosed in the prior art drives the circuit board to rotate to the upper side of the copper plating tank by starting the rotating motor, drives the one-way threaded rod to rotate by starting the first motor, drives the top plate to move downward by connecting the one-way threaded rod and the threaded rod, moves and limits the top plate by the sliding connection of the limiting rod and the limiting rod, drives the circuit board to fall into the copper plating tank for copper plating treatment by the top plate through the mounting plate, and realizes the automatic copper plating treatment of the circuit board.

[0005] However, the chemical copper plating device can place the circuit board in the treatment box for operation, but the circuit board carries liquid after being taken out from the copper plating tank after the copper plating is completed, and needs to be transported to the drying equipment for drying, and the liquid on the surface of the circuit board cannot be preliminarily treated after being taken out.

[0006] Therefore, it is necessary to provide a chemical copper plating device for circuit board production to solve the above technical problems. SUMMARY

[0007] The application provides a chemical copper plating device for circuit board production, which solves the problem that the liquid carried by the circuit board cannot be preliminarily treated after the copper plating device is taken out after the copper plating of the circuit board is completed.

[0008] To solve the above technical problems, the application provides a chemical copper plating device for circuit board production, which comprises:

[0009] A workbench is installed on one side of the surface of the workbench.

[0010] A rotating device is arranged on the surface of the workbench and located on one side of the box.

[0011] A rotating device is arranged on one side of the rotating device and above the box body;

[0012] Two adjusting assemblies are arranged on both sides of the rotating device.

[0013] Two placing devices are arranged below the two adjusting assemblies, and each placing device comprises a hydraulic telescopic rod, the bottom end of the hydraulic telescopic rod is connected with a rectangular plate, the bottom of the rectangular plate is sequentially connected with a plurality of placing racks from left to right, and rubber pads are attached to the inner walls of the placing racks.

[0014] Two connecting racks are connected to both sides of the surface of the box body, the surface of the connecting rack is provided with an air outlet assembly, the air outlet assembly comprises a plurality of air outlet pipes, the top end of each air outlet pipe is connected with a connector, a communication pipe is connected between the connectors, and one side of one connector is connected with a conveying pipe.

[0015] A driving device is arranged on one side of the box body.

[0016] Preferably, the rotating device comprises a mounting rack, the bottom of the mounting rack is provided with a driving motor, and one end of the output shaft of the driving motor is fixedly connected with a lifting frame through a shaft coupling.

[0017] Preferably, the rotating device comprises a motor, one end of the output shaft of the motor is fixedly connected with a rotating plate through a shaft coupling.

[0018] Preferably, the adjusting assembly comprises a fixing frame, one side of the fixing frame is provided with a hydraulic rod, one end of the hydraulic rod is connected with an adjusting block, and the inside of the rotating plate is provided with an adjusting groove matched with the adjusting block.

[0019] Preferably, the inside of the adjusting block is provided with a threaded block, the surface of the threaded block is threadedly connected with a threaded sleeve, and the bottom end of the threaded block is connected with the hydraulic telescopic rod.

[0020] Preferably, the driving device comprises an air pump, the input end and the output end of the air pump are respectively connected with an air inlet pipe and a connecting pipe, one end of the connecting pipe is connected with a U-shaped connecting pipe, and the end of the U-shaped connecting pipe is connected with the end of the conveying pipe.

[0021] Preferably, the bottom of the workbench is provided with a supporting plate, and the surface of the supporting plate is provided with a collecting box.

[0022] Preferably, one side of the workbench surface is provided with a storage assembly, the storage assembly comprises a storage rack, sliding grooves are formed in the inner walls of the storage rack on both sides, a plurality of sliding blocks are sequentially and slidably connected inside the two sliding grooves from top to bottom, and storage plates are connected between the plurality of sliding blocks.

[0023] Preferably, a plurality of grooves are sequentially formed in the surface of the storage plate from left to right, rubber pads are attached to the inner walls of the grooves on both sides, and limit pins are arranged between the storage rack and the sliding blocks.

[0024] Preferably, a movable assembly is arranged between the rectangular plate and the plurality of placement racks, the movable assembly comprises a movable channel, a plurality of threaded connecting rods are sequentially arranged inside the movable channel from left to right, mounting sleeves are connected to the bottom ends of the threaded connecting rods, mounting blocks are arranged inside the mounting sleeves, and threaded sleeves are threadedly connected to the surfaces of the threaded connecting rods.

[0025] Compared with the related art, the chemical copper plating device for circuit board production has the following beneficial effects:

[0026] The chemical copper plating device for circuit board production is provided, and the connecting frame, the plurality of gas outlet pipes with connecting heads, the communication pipe, the conveying pipe, and the driving device are cooperated with the rotating device, the rotating device, the adjusting assembly, and the placement device to operate, so that the liquid on the surface of the circuit board can be preliminarily treated when the circuit board is taken out from the outside of the box after the copper plating operation in the inside of the box, and the liquid on the surface of the circuit board will not drop when the circuit board is placed in the inside of the drying equipment after the copper plating is completed. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided.

[0028] Figure 2 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 1 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided.

[0029] The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 3 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 1 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided.

[0030] The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 4 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 1 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided.

[0031] The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 5 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 1 The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided.

[0032] The structure schematic diagram of the first embodiment of the chemical copper plating device for circuit board production is provided. Figure 6A structure schematic view of a second embodiment of the chemical copper plating device for circuit board production provided by the present application is shown in the figure;

[0033] Figure 7 A structure schematic view of a third embodiment of the chemical copper plating device for circuit board production provided by the present application is shown in the figure; Figure 6 A D part enlarged schematic view shown in the figure;

[0034] Figure 8 A structure schematic view of a third embodiment of the chemical copper plating device for circuit board production provided by the present application is shown in the figure;

[0035] Figure 9 A structure schematic view of a third embodiment of the chemical copper plating device for circuit board production provided by the present application is shown in the figure; Figure 8 A structure schematic view of a third embodiment of the chemical copper plating device for circuit board production provided by the present application is shown in the figure.

[0036] Labels in the figure: 1, workbench, 2, box body,

[0037] 3, rotating device, 31, mounting frame, 32, driving motor, 33, lifting frame,

[0038] 4, rotating device, 41, motor, 42, rotating plate,

[0039] 5, adjusting assembly, 51, fixing frame, 52, hydraulic rod, 53, adjusting block, 54, adjusting groove, 55, threaded block, 56, threaded connecting sleeve,

[0040] 6, placing device, 61, hydraulic telescopic rod, 62, rectangular plate, 63, placing frame, 64, rubber pad,

[0041] 7, connecting frame,

[0042] 8, air outlet assembly, 81, air outlet pipe, 82, connecting head, 83, communicating pipe, 84, conveying pipe,

[0043] 9, driving device, 91, air pump, 92, air inlet pipe, 93, connecting pipe, 94, U-shaped connecting pipe,

[0044] 10, supporting plate, 11, collecting box,

[0045] 12, storage assembly, 121, storage frame, 122, sliding chute, 123, sliding block, 124, storage plate, 125, groove, 126, rubber pad, 127, limiting bolt,

[0046] 13, movable assembly, 131, movable slot, 132, threaded connecting rod, 133, mounting sleeve, 134, mounting block, 135, threaded sleeve. DETAILED DESCRIPTION

[0047] The present application is further described below in combination with the figures and embodiments.

[0048] First embodiment

[0049] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 wherein, Figure 1 is a schematic diagram of the structure of a first embodiment of a chemical copper plating device for circuit board production provided by the application; Figure 2 is an enlarged schematic diagram of part A shown in Figure 1 ; Figure 3 is an enlarged schematic diagram of part B shown in Figure 1 ; Figure 4 is an enlarged schematic diagram of part C shown in Figure 1 ; Figure 5 is a schematic diagram of the overall structure of the device shown in Figure 1 . A chemical copper plating device for circuit board production comprises:

[0050] a workbench 1, one side of the surface of the workbench 1 is provided with a box 2;

[0051] a rotating device 3, the rotating device 3 is arranged on the surface of the workbench 1 and located at one side of the box 2;

[0052] a rotating device 4, the rotating device 4 is arranged at one side of the rotating device 3 and above the box 2;

[0053] an adjusting assembly 5, the number of the adjusting assembly 5 is two, and the two adjusting assemblies 5 are arranged at two sides of the rotating device 4 respectively;

[0054] a placing device 6, the number of the placing device 6 is two, and the two placing devices 6 are arranged below the two adjusting assemblies 5 respectively, the placing device 6 comprises a hydraulic telescopic rod 61, the bottom end of the hydraulic telescopic rod 61 is connected with a rectangular plate 62, the bottom of the rectangular plate 62 is sequentially connected with a plurality of placing racks 63 from left to right, and rubber pads 64 are attached to the inner walls of the two sides of the placing racks 63;

[0055] a connecting frame 7, the number of the connecting frame 7 is two, and the two connecting frames 7 are connected to the two sides of the surface of the box 2 respectively, the surface of the connecting frame 7 is provided with an air outlet assembly 8, the air outlet assembly 8 comprises a plurality of air outlet pipes 81, the top ends of the plurality of air outlet pipes 81 are connected with connecting heads 82, the plurality of connecting heads 82 are connected with a communication pipe 83, and one side of one of the connecting heads 82 is connected with a conveying pipe 84;

[0056] a driving device 9, the driving device 9 is arranged at one side of the box 2.

[0057] The rotating device 3 comprises a mounting frame 31, the bottom of the mounting frame 31 is provided with a driving motor 32, one end of the output shaft of the driving motor 32 is fixedly connected with a lifting frame 33 through a shaft coupling.

[0058] The mounting frame 31 is mounted on the surface of the workbench 1, the driving motor 32 and the motor 41 are both servo motors, and are powered by an external power supply. The driving motor 32 is used to drive the lifting frame 33 to move the placing device 6 from above the box body 2 to the outside of the workbench 1, so as to facilitate the installation of the circuit board on the placing rack 63. When the circuit board is installed, the driving motor 32 is started to drive the lifting frame 33 to rotate, and the placing device 6 is driven to rotate to the outside of the workbench 1 through the rotating plate 42. After the placing device 6 is rotated to the outside of the workbench 1, the driving motor 32 is stopped, and then the circuit board is installed in the placing rack 63. After the circuit board is installed, the driving motor 32 is started again to rotate the entire device to above the box body 2 and stop the driving motor 32.

[0059] The rotating device 4 comprises a motor 41, one end of the output shaft of the motor 41 is fixedly connected with a rotating plate 42 through a shaft coupling.

[0060] The motor 41 is fixedly installed at one end of the lifting frame 33, and the motor 41 is used to drive the rotating plate 42 to drive the circuit boards on the two placing devices 6 to be placed in batches in the box body 2 for copper plating operation. The fixing frame 51 is installed at the end of the rotating plate 42, and the hydraulic rod 52 is used to drive the adjusting block 53 to move in the adjusting groove 54, so as to move the placing device 6 to the middle position of the box body 2. When the position of the placing device 6 is adjusted, the hydraulic rod 52 is started to drive the adjusting block 53 to move in the adjusting groove 54. When the adjusting block 53 moves in the adjusting groove 54, the placing device 6 is driven to move through the threaded block 55. After the placing device 6 is moved to the appropriate position, the work of the hydraulic rod 52 is stopped, and then the hydraulic telescopic rod 61 is started to drive the rectangular plate 62 to move downward. When the rectangular plate 62 moves downward, the circuit boards in the plurality of placing racks 63 below are moved to the inside of the box body 2 for copper plating operation.

[0061] The adjusting assembly 5 comprises a fixing frame 51, one side of the fixing frame 51 is provided with a hydraulic rod 52, one end of the hydraulic rod 52 is connected with an adjusting block 53, and the inside of the rotating plate 42 is provided with an adjusting groove 54 matched with the adjusting block 53.

[0062] The inside of the adjusting block 53 is provided with a threaded block 55, the surface of the threaded block 55 is threadedly connected with a threaded connecting sleeve 56, and the bottom end of the threaded block 55 is connected with the hydraulic telescopic rod 61.

[0063] The driving device 9 comprises a gas pump 91, the input end and the output end of the gas pump 91 are respectively connected with an air inlet pipe 92 and a connecting pipe 93, one end of the connecting pipe 93 is connected with a U-shaped connecting pipe 94, and the end of the U-shaped connecting pipe 94 is connected with the end of the conveying pipe 84.

[0064] The plurality of air outlet pipes 81 are all mounted on the surface of the connecting frame 7.

[0065] The bottom of the workbench 1 is provided with a supporting plate 10, and the surface of the supporting plate 10 is provided with a collecting box 11.

[0066] The working principle of the chemical copper plating device for circuit board production provided by the application is as follows:

[0067] When the circuit board is taken out from the inside of the box 2 after the copper plating is completed, and is moved to one side of the box 2, the gas pump 91 is started to convey the external gas to the inside of the U-shaped connecting pipe 94 through the air inlet pipe 92 and the connecting pipe 93, and then the gas is conveyed to the inside of the communicating pipe 83 through the two conveying pipes 84, and then the gas is conveyed to the inside of the plurality of air outlet pipes 81 through the plurality of connecting heads 82, and finally the gas is blown to the surface of the circuit board through the plurality of air outlet pipes 81, so that the liquid on the surface of the circuit board is cleaned, and when the liquid on the surface of the circuit board drops, the liquid can be collected through the collecting box 11 below the workbench 1.

[0068] Compared with the related art, the chemical copper plating device for circuit board production provided by the application has the following beneficial effects:

[0069] The chemical copper plating device for circuit board production provided by the application is provided with the connecting frame 7, the plurality of air outlet pipes 81 with connecting heads 82, the communicating pipe 83, the conveying pipe 84 and the driving device 9 on the left and right sides of the box 2, and the cooperation of the rotating device 3, the rotating device 4, the adjusting assembly 5 and the placing device 6, so that the liquid on the surface of the circuit board can be preliminarily treated when the circuit board is taken out from the outside of the box 2 after the copper plating operation in the inside of the box 2, and the liquid on the surface of the circuit board will not drop when the circuit board is placed in the inside of the drying equipment after the copper plating is completed.

[0070] Second embodiment

[0071] Please refer to Figure 6 and Figure 7 , based on the first embodiment of the application, the second embodiment of the application provides another chemical copper plating device for circuit board production. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0072] Specifically, the second embodiment of the present application provides a chemical copper plating device for circuit board production, which is different from the prior art in that a receiving assembly 12 is arranged on one side of the surface of the workbench 1, the receiving assembly 12 comprises a receiving rack 121, sliding grooves 122 are arranged on both sides of the inner wall of the receiving rack 121, a plurality of sliding blocks 123 are sequentially and slidably connected inside the two sliding grooves 122 from top to bottom, and receiving plates 124 are connected between the plurality of sliding blocks 123.

[0073] A plurality of grooves 125 are sequentially arranged on the surface of the receiving plate 124 from left to right, rubber pads 126 are arranged on both sides of the inner wall of the groove 125, and a limiting bolt 127 is arranged between the receiving rack 121 and the sliding block 123.

[0074] The use of the rubber pad 126 can play a role in extruding and fixing after the circuit board is placed in the groove 125, the receiving rack 121 is arranged on one side of the surface of the workbench 1, and the use of the sliding groove 122 and the sliding block 123 can adjust the spacing between the plurality of receiving plates 124.

[0075] The working principle of the chemical copper plating device for circuit board production provided by the present application is as follows:

[0076] In use, when the circuit board after copper plating is temporarily placed, first, the receiving plate 124 inside the receiving rack 121 is pulled to adjust the up-down position, when the receiving plate 124 moves upwards, the sliding blocks 123 on both sides slide inside the sliding grooves 122 on the inner wall of the receiving rack 121, and when the position of the receiving plate 124 is adjusted, the limiting bolt 127 is used to pass through the receiving rack 121 and is fixed with the sliding block 123 inside the sliding groove 122.

[0077] After the receiving plate 124 inside the receiving rack 121 is fixed, the treated circuit board is inserted into the groove 125 on the surface of the receiving plate 124.

[0078] Compared with the related art, the chemical copper plating device for circuit board production provided by the present application has the following beneficial effects:

[0079] The chemical copper plating device for circuit board production provided by the present application can temporarily place the circuit board after copper plating and preliminary treatment of the surface liquid on one side of the surface of the workbench 1.

[0080] Third embodiment

[0081] Please refer to Figure 8 and Figure 9, based on the first embodiment of the application provides a kind of chemical copper deposition device for circuit board production, the third embodiment of the application proposes another chemical copper deposition device for circuit board production.The third embodiment is only the preferred mode of the first embodiment, and the implementation of the third embodiment does not affect the separate implementation of the first embodiment.

[0082] Specifically, the third embodiment of the application provides a kind of chemical copper deposition device for circuit board production, which is different from the first embodiment of the application.The chemical copper deposition device for circuit board production is provided with a movable assembly 13 between the rectangular plate 62 and the plurality of placing racks 63.The movable assembly 13 includes a movable slot 131, and a plurality of threaded connecting rods 132 are sequentially arranged inside the movable slot 131 from left to right.The bottom end of the threaded connecting rod 132 is connected with a mounting sleeve 133, the inside of the mounting sleeve 133 is provided with a mounting block 134, and the surface of the threaded connecting rod 132 is threadedly connected with a threaded sleeve 135.

[0083] The movable slot 131 is opened on the surface of the rectangular plate 62, the size of the threaded sleeve 135 is larger than the width of the movable slot 131, and the shape of the inside of the mounting sleeve 133 and the shape of the mounting block 134 are both T-shaped.

[0084] The working principle of the chemical copper deposition device for circuit board production provided by the application is as follows:

[0085] When using, when installing between the plurality of placing racks 63 and the rectangular plate 62, first connect the placing rack 63 with the mounting block 134 with the threaded connecting rod 132 with the mounting sleeve 133, after installing the placing rack 63, pass the threaded connecting rod 132 above the mounting sleeve 133 through the movable slot 131 inside the rectangular plate 62, after the threaded connecting rod 132 passes through the movable slot 131, adjust the position of the placing rack 63, and then fix the threaded connecting rod 132 with the threaded sleeve 135.

[0086] Compared with the related art, the chemical copper deposition device for circuit board production provided by the application has the following beneficial effects:

[0087] The chemical copper deposition device for circuit board production provided by the application can increase, reduce and adjust the spacing of the placing rack 63 according to the number of circuit boards installed by setting the movable assembly 13 between the rectangular plate 62 and the plurality of placing racks 63.

[0088] The above is only an embodiment of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent process transformation using the content of the application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.

Claims

1. A chemical copper deposition device for circuit board production, characterized in that: include: A workbench, with a box installed on one side of the workbench surface; A rotating device, the rotating device is arranged on the surface of the workbench and located on one side of the box; A rotating device, the rotating device is arranged on one side of the rotating device and located above the box; There are two adjusting components, and the two adjusting components are respectively arranged on both sides of the rotating device; A placement device, wherein the number of the placement devices is two, and the two placement devices are respectively arranged below the two adjustment assemblies. The placement device includes a hydraulic telescopic rod, the bottom end of the hydraulic telescopic rod is connected to a rectangular plate, and the bottom of the rectangular plate is sequentially connected to a plurality of placement racks from left to right, and rubber pads are bonded to both sides of the inner wall of the placement rack; A connecting frame, wherein the number of the connecting frames is two, and the two connecting frames are respectively connected to both sides of the surface of the box body. The surface of the connecting frame is provided with an air outlet assembly, and the air outlet assembly includes a plurality of air outlet pipes, the top ends of the plurality of air outlet pipes are connected to connectors, and the plurality of connectors are connected to connecting pipes, and one side of one of the connectors is connected to a delivery pipe; A driving device, the driving device being arranged on one side of the box; The rotating device includes a mounting frame, a driving motor is installed at the bottom of the mounting frame, and one end of the output shaft of the driving motor is fixedly connected to the lifting frame through a coupling; The rotating device includes a motor, and one end of the motor output shaft is fixedly connected to a rotating plate through a coupling; The adjustment assembly includes a fixing frame, a hydraulic rod is installed on one side of the fixing frame, an adjustment block is connected to one end of the hydraulic rod, and an adjustment slot adapted to the adjustment block is opened inside the rotating plate; A threaded block is provided inside the adjusting block, a threaded connection sleeve is threadedly connected to the surface of the threaded block, and the bottom end of the threaded block is connected to the hydraulic telescopic rod; The driving device includes an air pump, the input end and output end of the air pump are respectively connected to an air inlet pipe and a connecting pipe, one end of the connecting pipe is connected to a U-shaped connecting pipe, and the end of the U-shaped connecting pipe is connected to the end of the delivery pipe.

2. The chemical copper deposition device for circuit board production according to claim 1, characterized in that: A support plate is provided at the bottom of the workbench, and a collection box is provided on the surface of the support plate.

3. The chemical copper deposition device for circuit board production according to claim 1, characterized in that: A storage assembly is provided on one side of the workbench surface, and the storage assembly includes a storage rack. Slide grooves are provided on both sides of the inner wall of the storage rack. Multiple sliders are slidably connected inside the two slide grooves from top to bottom, and storage plates are connected between the multiple sliders.

4. The chemical copper deposition device for circuit board production according to claim 3, characterized in that: A plurality of grooves are sequentially provided on the surface of the storage plate from left to right, and rubber pads are adhered on both sides of the inner walls of the grooves, and a limiting bolt is provided between the storage rack and the slider.

5. The chemical copper deposition device for circuit board production according to claim 1, characterized in that: A movable component is arranged between the rectangular plate and the multiple placement racks, and the movable component includes a movable through groove. A plurality of threaded connecting rods are arranged in sequence from left to right inside the movable through groove. The bottom end of the threaded connecting rod is connected to a mounting sleeve, and a mounting block is arranged inside the mounting sleeve. The surface of the threaded connecting rod is threadedly connected to a threaded sleeve.

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