A silicon wafer guiding device for etching and cleaning machine

Abstract

The present invention belongs to the technical field of photovoltaic automation equipment, and discloses a silicon wafer guiding device for an etching and cleaning machine, comprising a transport mechanism and a pillar, a mounting frame is installed on the top of the pillar, and a guiding mechanism is installed inside the mounting frame; the guiding mechanism comprises a telescopic rod 1 and a support column, the telescopic end of the telescopic rod 1 is fixedly connected to a connecting frame, a fixing plate 1 is fixedly installed on the bottom of the connecting frame, and the fixing plate 1 is slidably installed on the outer surface of the support column. The device directly contacts the silicon wafer with a guide ball, and rotates relative to the silicon wafer during the process of applying pressure to the right on the silicon wafer, pushing the silicon wafer to the midline area of ​​each group of alignment mechanisms, that is, completing the guiding operation of the silicon wafer. During this process, the silicon wafer moves in a direction vertical to the transport direction of the device, without sliding friction with any other components, thereby reducing the degree of wear of the silicon wafer during the guiding process and effectively protecting the safety of the silicon wafer.

Description

Technical Field

[0001] The invention belongs to the technical field of photovoltaic automation equipment, and in particular relates to a silicon wafer guiding device for an etching and cleaning machine. Background Art

[0002] During semiconductor production, silicon wafers must be strictly cleaned because even trace amounts of contamination can cause device failure. The purpose of cleaning is to remove contaminants on the surface of the silicon wafer. Currently, silicon wafer cleaning is divided into physical cleaning and chemical cleaning, of which chemical cleaning relies on an etching cleaning machine. The etching cleaning machine uses a mixed solution of HF / HNO3 / H2SO4 to corrode the lower surface and edge of the silicon wafer after diffusion, remove the N-type silicon at the edge, and insulate the upper and lower surfaces of the silicon wafer from each other, thereby reducing edge leakage. The silicon wafer needs to be transported before entering the etching cleaning machine. In the prior art, a roller is used to transport the silicon wafer. In order to prevent it from shifting, a sleeve structure for limiting and correcting deviation is generally installed on the surface of the roller. By limiting and abutting the silicon wafer, it is returned to the normal moving path. However, when the sleeve structure using a circular rotation method contacts the silicon wafer, it will slide relative to the contact part of the silicon wafer, which is easy to cause wear on the edge of the silicon wafer, causing the silicon wafer to be damaged and fail. Summary of the invention

[0003] The object of the present invention is to provide a silicon wafer guiding device for an etching and cleaning machine to solve the problems raised in the above-mentioned background technology.

[0004] In order to achieve the above-mentioned object, the present invention provides the following technical solution: a silicon wafer guiding device for an etching and cleaning machine, comprising a transport mechanism and a support, a mounting frame is installed on the top of the support, and a guiding mechanism is installed inside the mounting frame;

[0005] The guide mechanism comprises a telescopic rod 1 and a support column, the telescopic end of the telescopic rod 1 is fixedly connected with a connecting frame, a fixing plate 1 is fixedly installed at the bottom of the connecting frame, the fixing plate 1 is slidably installed on the outer surface of the supporting column, a telescopic rod 2 is installed on the top of the fixing plate 1, a fixing plate 2 is fixedly installed at the telescopic end of the telescopic rod 2, a guide column is fixedly installed on the inner wall of the fixing plate 2, a plurality of groups of sliders are slidably installed on the outer surface of the guide column, a vacuum suction cup is fixedly connected to the bottom of the slider, a silicon wafer is adsorbed on the bottom of the vacuum suction cup, a connecting plate located on the right side of the fixing plate 2 is slidably installed on the outer surface of the supporting column, and a plurality of groups of alignment mechanisms are fixedly installed on the bottom of the connecting plate;

[0006] The alignment mechanism includes four connecting columns fixedly connected to the bottom of the connecting plate, the bottom of the connecting column is fixedly connected to a support block, the outer surface of the connecting column is rotatably mounted with a rotating drum, the outer surface of the rotating drum is provided with a mounting groove, and a guide ball is rotatably mounted inside the mounting groove, and the four connecting columns are evenly divided front and back and symmetrically distributed.

[0007] As a preferred solution of the present invention, the telescopic rod 1 is fixedly installed on the left side of the inner wall of the installation frame, the support column is arranged in two groups and is symmetrically distributed on the front and rear sides of the telescopic rod 1, the two ends of the support column are respectively fixedly connected to the left and right sides of the inner wall of the installation frame, the outer surface of the support column is also movably sleeved with a spring located on the right side of the connecting plate, and the two ends of the spring are respectively elastically connected to the connecting plate and the installation frame.

[0008] As a preferred solution of the present invention, the cross-sectional shape of the connecting plate is "L"-shaped, a reinforcing block is fixedly installed on the inner wall of the connecting plate, the shape of the reinforcing block is a right triangle, and the reinforcing blocks are arranged in multiple groups and are equidistantly distributed on the connecting plate.

[0009] As a preferred solution of the present invention, the transport mechanism includes two groups of bases, a support frame is fixedly installed between the two groups of bases, and transmission rollers symmetrically distributed on the left and right are rotatably installed, a conveyor belt is installed on the outer surface of the transmission roller, a motor is installed on the front side of the conveyor belt and is used to drive the transmission roller, and the pillar is fixedly installed on the top of the base.

[0010] As a preferred solution of the present invention, permanent magnet block 2 is fixedly installed on the right side of the connecting plate, and permanent magnet block 1 is fixedly installed on the right side of the inner wall of the installation frame. The opposite surfaces of permanent magnet block 1 and permanent magnet block 2 are opposite to each other, and the areas of permanent magnet block 1 and permanent magnet block 2 are the same, and the front faces are kept facing each other.

[0011] As a preferred solution of the present invention, the number of groups of the alignment mechanisms is opposite to the silicon wafer, and a gap is left between the silicon wafer and the alignment mechanisms.

[0012] As a preferred solution of the present invention, a convex block is provided on the right side of the outer surface of the guide column and is adapted to engage with the inner wall of the slider, so that the slider can only slide along the axis of the guide column.

[0013] As a preferred solution of the present invention, the longitudinal section of the second fixing plate is in a "U" shape, and the top of the second fixing plate is still higher than the left plane of the connecting plate when the second fixing plate moves to the lowest point.

[0014] As a preferred solution of the present invention, when the silicon wafer is driven rightward by the telescopic rod, its surface only rotates and abuts against the outer surface of the guide ball.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. The device realizes the zero sliding friction function in the process of guiding the silicon wafer by providing a guiding mechanism. The second telescopic rod is provided to drive the vacuum suction cup to move downward, and the vacuum suction cup is used to vacuum adsorb and fix the silicon wafer, and then the silicon wafer is driven upward to the height of the guide ball, and the telescopic rod is used to drive it to the right, so that the silicon wafer abuts against the alignment mechanism, and the four rotating cylinders in each group of alignment mechanisms abut against the silicon wafer, so that the guide ball is in direct contact with the silicon wafer, and in the process of applying pressure to the right on the silicon wafer, it rotates relative to the silicon wafer, and pushes the silicon wafer to the center line area of ​​each group of alignment mechanisms, that is, the guiding operation of the silicon wafer is completed. In this process, the silicon wafer moves in the vertical direction of the transportation direction of the device, and there is no sliding friction with any other parts, which reduces the wear of the silicon wafer in the guiding process and effectively protects the safety of the silicon wafer.

[0017] 2. At the same time, a slider is installed by sliding on the guide column, and the slider is used to connect the vacuum suction cup. When the silicon wafer adsorbed by the vacuum suction cup is driven upward by the telescopic rod 2 and leaves the surface of the conveyor belt, the silicon wafer can drive the vacuum suction cup and the slider to slide freely along the outer surface of the guide column through the reaction force generated by the contact with the alignment mechanism, thereby changing the displacement of the silicon wafer perpendicular to its transportation direction and realizing the synchronous guiding and correcting function. The outer surface of the rotating cylinder is provided with a mounting groove, and the guide ball is rotatably installed therein. When the silicon wafer abuts the guide ball, it will rotate and adapt at the same time, avoiding the sliding friction between the silicon wafer and the guide ball when guiding the silicon wafer. When the silicon wafer is lowered by the vacuum suction cup for free fall, it can roll relative to the guide ball to avoid sliding wear.

[0018] 3. Use telescopic rod 1 to drive the connecting frame, vacuum suction cup and silicon wafer to push the rotating drum and connecting plate to the right, and continuously compress the spring, so that the alignment mechanism generates a reaction force when it contacts the silicon wafer, and assists the silicon wafer in moving and guiding. As telescopic rod 1 drives the silicon wafer to the right to the rightmost side, the smaller the distance between permanent magnet block 1 and permanent magnet block 2, the greater the magnetic attraction it generates, and gradually offsets the rebound force from the spring. When the vacuum suction cup lowers the silicon wafer, the magnetic attraction can offset the rebound force from the spring, ensuring that the silicon wafer is only affected by gravity when falling, making the guiding function of the device better. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front schematic diagram of the structure of the present invention;

[0020] Figure 2 It is a top view schematic diagram of the structure of the present invention;

[0021] Figure 3 It is a front cutaway schematic diagram of the structure of the present invention;

[0022] Figure 4 For the present invention Figure 3 A magnified schematic diagram of the structure at center A;

[0023] Figure 5 For the present invention Figure 3 A magnified schematic diagram of the structure at B in the middle;

[0024] Figure 6 The overall coordination diagram of the guide mechanism of the present invention is shown in FIG. Figure 1 ;

[0025] Figure 7 It is a top view and cutaway schematic diagram of the vacuum suction cup, the connecting column, the supporting block and the rotating drum of the present invention;

[0026] Figure 8 The overall coordination diagram of the guide mechanism of the present invention is shown in FIG. Figure 2 ;

[0027] Fig. 9 It is a partial separation schematic diagram of the guide mechanism of the present invention.

[0028] In the figure: 1. transport mechanism; 10. base; 11. conveyor belt; 12. motor; 14. support frame; 2. pillar; 3. mounting frame; 4. guide mechanism; 40. telescopic rod 1; 41. connecting frame; 42. fixed plate 1; 43. telescopic rod 2; 44. support column; 45. spring; 46. connecting plate; 47. reinforcing block; 48. permanent magnet block 1; 49. permanent magnet block 2; 410. fixed plate 2; 411. guide column; 412. slider; 413. vacuum suction cup; 414. connecting column; 415. support block; 416. rotating drum; 417. mounting groove; 418. guide ball; 419. bump; 5. silicon wafer. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figures 1 to 9 As shown, an embodiment of the present invention provides a silicon wafer guiding device for an etching and cleaning machine, comprising a transport mechanism 1 and a support 2, a mounting frame 3 is mounted on the top of the support 2, and a guiding mechanism 4 is mounted inside the mounting frame 3;

[0031] The guide mechanism 4 includes a telescopic rod 1 40 and a support column 44, the telescopic end of the telescopic rod 1 40 is fixedly connected to a connection frame 41, a fixed plate 1 42 is fixedly installed at the bottom of the connection frame 41, and the fixed plate 1 42 is slidably installed on the outer surface of the support column 44, a telescopic rod 2 43 is installed on the top of the fixed plate 1 42, and a fixed plate 2 410 is fixedly installed at the telescopic end of the telescopic rod 2 43, and a guide column 411 is fixedly installed on the inner wall of the fixed plate 2 410, and multiple groups of sliders 412 are slidably installed on the outer surface of the guide column 411, and a vacuum suction cup 413 is fixedly connected to the bottom of the slider 412, and a silicon wafer 5 is adsorbed on the bottom of the vacuum suction cup 413, and a connecting plate 46 located on the right side of the fixed plate 2 410 is slidably installed on the outer surface of the support column 44, and multiple groups of alignment mechanisms are fixedly installed on the bottom of the connecting plate 46;

[0032] The alignment mechanism includes four connecting columns 414 fixedly connected to the bottom of the connecting plate 46, the bottom of the connecting column 414 is fixedly connected to a support block 415, a rotating drum 416 is rotatably mounted on the outer surface of the connecting column 414, a mounting groove 417 is provided on the outer surface of the rotating drum 416, and a guide ball 418 is rotatably mounted inside the mounting groove 417, and the four connecting columns 414 are evenly divided and symmetrically distributed in the front and back.

[0033] The device realizes the zero sliding friction function in the process of guiding the silicon wafer by providing a guiding mechanism 4, and drives the vacuum suction cup 413 to move downward by providing a telescopic rod 2 43, and uses the vacuum suction cup 413 to vacuum adsorb and fix the silicon wafer 5, and then drives the silicon wafer 5 upward to the height of the guide ball 418, and drives it to move to the right by the telescopic rod 1 40, so that the silicon wafer 5 abuts against the alignment mechanism, and uses the four rotating cylinders 416 in each group of alignment mechanisms to abut against the silicon wafer 5, so that the guide ball 418 is in direct contact with the silicon wafer 5, and rotates relative to the silicon wafer 5 during the process of applying pressure to the right on the silicon wafer 5, and pushes the silicon wafer 5 to the center line area of ​​each group of alignment mechanisms, that is, the guiding operation of the silicon wafer 5 is completed. In this process, the silicon wafer 5 moves in the vertical direction of the transportation direction of the device, and there is no sliding friction with any other parts, thereby reducing the wear degree of the silicon wafer 5 in the guiding process and effectively protecting the safety of the silicon wafer 5.

[0034] At the same time, a slider 412 is slidably installed on the guide column 411, and the slider 412 is used to connect the vacuum suction cup 413. When the silicon wafer 5 sucked by the vacuum suction cup 413 is driven upward by the telescopic rod 43 and leaves the surface of the conveyor belt 11, the silicon wafer 5 can drive the vacuum suction cup 413 and the slider 412 to slide freely along the outer surface of the guide column 411 through the reaction force generated by the contact with the alignment mechanism, thereby changing the displacement of the silicon wafer 5 perpendicular to its transportation direction, and realizing the synchronous guiding and correcting function. The outer surface of the rotating cylinder 416 is provided with a mounting groove 417, and the guide ball 418 is rotatably installed therein. When the silicon wafer 5 abuts against the guide ball 418, it will rotate and adapt at the same time, and the sliding friction between the silicon wafer 5 and the guide ball 418 is avoided when the silicon wafer 5 is guided. When the silicon wafer 5 is lowered by the vacuum suction cup 413 for free fall, it can roll relative to the guide ball 418 to avoid sliding wear.

[0035] Among them, the telescopic rod 1 40 is fixedly installed on the left side of the inner wall of the installation frame 3, and the support column 44 is set in two groups and symmetrically distributed on the front and rear sides of the telescopic rod 1 40. The two ends of the support column 44 are respectively fixedly connected to the left and right sides of the inner wall of the installation frame 3. The outer surface of the support column 44 is also movably sleeved with a spring 45 located on the right side of the connecting plate 46. The two ends of the spring 45 are elastically connected to the connecting plate 46 and the installation frame 3 respectively.

[0036] The connecting frame 41, the vacuum suction cup 413 and the silicon wafer 5 are driven to the right by the telescopic rod 40 to push the rotating cylinder 416 and the connecting plate 46, and the spring 45 is continuously compressed, so that the alignment mechanism generates a reaction force when it abuts against the silicon wafer 5, and assists the silicon wafer 5 in moving and guiding. As the telescopic rod 40 drives the silicon wafer 5 to the right to move to the rightmost side, the smaller the distance between the permanent magnet block 1 48 and the permanent magnet block 2 49, the greater the magnetic attraction force it generates, and gradually offsets the rebound force from the spring 45. When the vacuum suction cup 413 lowers the silicon wafer 5, the magnetic attraction force can offset the rebound force from the spring 45, ensuring that the silicon wafer 5 is only affected by gravity when falling, so that the guiding function of the device is better.

[0037] The cross-sectional shape of the connecting plate 46 is "L" shaped, and a reinforcing block 47 is fixedly installed on the inner wall of the connecting plate 46. The reinforcing block 47 is in the shape of a right triangle. The reinforcing blocks 47 are arranged in multiple groups and are equidistantly distributed on the connecting plate 46.

[0038] The connecting plate 46 is used to provide support for the alignment mechanism and convert the thrust from the telescopic rod 40 and the silicon wafer 5 into displacement of the connecting plate 46 on the outer surface of the support column 44. The reinforcing block 47 can enhance the connection tightness of the two mutually perpendicular parts of the connecting plate 46.

[0039] The transport mechanism 1 includes two groups of bases 10, a support frame 14 is fixedly installed between the two groups of bases 10, and rotatably installed transmission rollers symmetrically distributed on the left and right are installed, a conveyor belt 11 is installed on the outer surface of the transmission roller, a motor 12 is installed on the front of the conveyor belt 11, and is used to drive the transmission roller, and the pillar 2 is fixedly installed on the top of the base 10;

[0040] The transport mechanism 1 continuously transports the silicon wafer 5 via the continuously moving conveyor belt 11 , wherein the support frame 14 abuts against the inner surface of the conveyor belt 11 to provide stable support for the silicon wafer.

[0041] Among them, a permanent magnet block 2 49 is fixedly installed on the right side of the connecting plate 46, and a permanent magnet block 1 48 is fixedly installed on the right side of the inner wall of the installation frame 3. The opposite surfaces of the permanent magnet block 1 48 and the permanent magnet block 2 49 are opposite to each other, and the permanent magnet block 1 48 and the permanent magnet block 2 49 have the same area and keep facing each other.

[0042] The side of permanent magnet block 2 49 facing permanent magnet block 1 48 is of N level, and the side of permanent magnet block 1 48 facing permanent magnet block 2 49 is of S level. When connecting plate 46 is driven to move continuously to the right, the magnetic attraction generated by the two will gradually increase and gradually offset the resilience of spring 45. When silicon wafer 5 is lowered by vacuum suction cup 413, connecting plate 46 can be kept from temporarily returning to the left. When silicon wafer 5 is out of contact with guide ball 418, there is a certain distance between the outer edge of silicon wafer 5 and the outer surface of rotating drum 416 during free fall. The size of this distance depends on the part of guide ball 418 protruding from the outer surface of rotating drum 416. This distance is enough for silicon wafer 5 to move completely downward to the bottom of support block 415. During this process, the magnetic attraction offsets part of the resilience generated by spring 45, slows down the leftward return process of rotating drum 416, and avoids contact between silicon wafer 5 and the outer surface of rotating drum 416 during the falling process, thereby maintaining the accurate position of silicon wafer 5 after guidance.

[0043] The number of alignment mechanisms is opposite to the silicon wafer 5, and a gap is left between the silicon wafer 5 and the alignment mechanisms;

[0044] The number of alignment mechanisms corresponds to that of the silicon wafers 5, and they are used to guide and adjust the respective silicon wafers 5. When the telescopic rod 43 and the vacuum suction cup 413 are in the original position, there is a gap between the silicon wafer 5 adsorbed and fixed thereon and the guide ball 418 and the rotating drum 416, to prevent sliding wear between the silicon wafer 5 and the rotating drum 416 when the silicon wafer 5 is brought up.

[0045] A convex block 419 is provided on the right side of the outer surface of the guide column 411 and is adapted to engage with the inner wall of the slider 412 so that the slider 412 can only slide along the axis of the guide column 411.

[0046] The protrusion 419 is adapted to engage with the middle portion of the slider 412 . This design can prevent the slider 412 from being forced to rotate around the axis of the guide post 411 .

[0047] The longitudinal cross-section of the second fixing plate 410 is in a "U" shape, and the top of the second fixing plate 410 is still higher than the left plane of the connecting plate 46 when the second fixing plate 410 moves to the lowest point;

[0048] The second fixing plate 410 is connected with a guide column 411, a slider 412 and a vacuum suction cup 413 below, and can abut against the connecting plate 46 to prevent the connecting plate 46 from directly contacting the vacuum suction cup 413 and causing damage.

[0049] When the silicon wafer 5 is driven rightward by the telescopic rod 40, its surface only rotates and abuts against the outer surface of the guide ball 418;

[0050] When the silicon wafer 5 moves upward, it passes by the outer surface of the guide ball 418 and rolls against the outer surface of the guide ball 418 to avoid sliding wear.

[0051] Working principle:

[0052] When the device is working, firstly, the telescopic rod 1 40 is started, and the connecting frame 41, the fixing plate 1 42 and the vacuum suction cup 413 are driven to the leftmost side, the telescopic rod 2 43 is started to drive the vacuum suction cup 413 to the highest point, the transport mechanism 1 is started, and the motor 12 drives the transmission roller and the conveyor belt 11, so that the conveying direction of the conveyor belt 11 is to the right;

[0053] When the silicon wafers are placed on the upper surface of the conveyor belt 11 and are driven to the right by the conveyor belt 11, the second telescopic rod 43 is started to drive the second fixing plate 410, the guide column 411, the slider 412 and the vacuum suction cup 413 to move downward, and the first batch of silicon wafers are adsorbed and fixed by the vacuum suction cup 413, and then the second telescopic rod 43 is started to drive the vacuum suction cup 413 to quickly reset upward;

[0054] Then, the telescopic rod 1 40 is quickly started, and the connecting frame 41, the fixing plate 1 42, the telescopic rod 2 43, the fixing plate 2 410, the vacuum suction cup 413 and the silicon wafer 5 are moved to the right along the outer surface of the support column 44. At this time, the silicon wafer 5 begins to abut against the alignment mechanism and first contacts the guide ball 418.

[0055] On the one hand, the positions of the guide ball 418, the rotating drum 416 and the connecting column 414 are relatively fixed, and the silicon wafer 5 begins to roll and abut against the guide ball 418, and drives the vacuum suction cup 413 and the slider 412 to move along the axis of the guide column 411, so that the horizontal line of the silicon wafer 5 is in line with the front and rear center line of the alignment mechanism. At this time, the vertical movement adjustment of the silicon wafer 5 along the transport direction of the device is completed and moves to the standard position;

[0056] At the same time, as the silicon wafer 5 continues to abut against the guide ball 418 to the right and pushes the connecting plate 46 to the right, the spring 45 is compressed to generate a rebound force. At this time, the distance between the permanent magnet block 49 and the permanent magnet block 1 48 is getting closer and closer, and a continuously increasing magnetic attraction force is generated. After the silicon wafer 5 moves to the rightmost side, the rightward thrust of the permanent magnet block 48, the permanent magnet block 2 49 and the silicon wafer 5 is greater than the rebound force generated by the spring 45. At this time, the vacuum suction cup 413 is closed and the silicon wafer 5 is released downward, so that the silicon wafer 5 falls on the conveyor belt 11.

[0057] Then, the spring 45 pushes the connecting plate 46 to the right, overcomes the magnetic attraction of the permanent magnet block 1 48 and the permanent magnet block 2 49, and slowly resets to the left. At this time, the telescopic rod 1 40 quickly resets to the left, and the above operation is repeated.

[0058] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer guiding device for an etching and cleaning machine, comprising a transport mechanism (1) and a support (2), wherein a mounting frame (3) is mounted on the top of the support (2), characterized in that: A guide mechanism (4) is installed inside the installation frame (3); The guide mechanism (4) comprises a telescopic rod (40) and a support column (44); the telescopic end of the telescopic rod (40) is fixedly connected to a connection frame (41); a fixing plate (42) is fixedly installed at the bottom of the connection frame (41); the fixing plate (42) is slidably installed on the outer surface of the support column (44); a telescopic rod (43) is installed on the top of the fixing plate (42); a fixing plate (410) is fixedly installed at the telescopic end of the telescopic rod (43); A guide column (411) is fixedly installed on the inner wall of the second plate (410), and a plurality of groups of sliders (412) are slidably installed on the outer surface of the guide column (411), and a vacuum suction cup (413) is fixedly connected to the bottom of the slider (412), and a silicon wafer (5) is adsorbed on the bottom of the vacuum suction cup (413); a connecting plate (46) located on the right side of the second fixed plate (410) is slidably installed on the outer surface of the support column (44), and a plurality of groups of alignment mechanisms are fixedly installed on the bottom of the connecting plate (46); The alignment mechanism comprises four connecting columns (414) fixedly connected to the bottom of the connecting plate (46); the bottom of the connecting column (414) is fixedly connected to a supporting block (415); a rotating drum (416) is rotatably mounted on the outer surface of the connecting column (414); a mounting groove (417) is provided on the outer surface of the rotating drum (416); a guide ball (418) is rotatably mounted inside the mounting groove (417); the four connecting columns (414) are evenly divided and symmetrically distributed front and back; The telescopic rod (40) is fixedly mounted on the left side of the inner wall of the installation frame (3); the support column (44) is arranged in two groups and is symmetrically distributed on the front and rear sides of the telescopic rod (40); the two ends of the support column (44) are respectively fixedly connected to the left and right sides of the inner wall of the installation frame (3); the outer surface of the support column (44) is also movably sleeved with a spring (45) located on the right side of the connecting plate (46); the two ends of the spring (45) are respectively elastically connected to the connecting plate (46) and the installation frame (3); the cross-sectional shape of the connecting plate (46) is "L"-shaped; a reinforcing block (47) is fixedly mounted on the inner wall of the connecting plate (46); the reinforcing block (47) is in the shape of a right triangle; the reinforcing blocks (47) are arranged in multiple groups and are equidistantly distributed on the connecting plate (46).

2. The silicon wafer guiding device for an etching and cleaning machine according to claim 1, characterized in that: The transport mechanism (1) comprises two groups of bases (10), a support frame (14) is fixedly installed between the two groups of bases (10), and transmission rollers symmetrically distributed on the left and right are rotatably installed, a conveyor belt (11) is drive-installed on the outer surface of the transmission roller, and a motor (12) is installed on the front side of the conveyor belt (11) and is used to drive the transmission roller, and the support (2) is fixedly installed on the top of the base (10).

3. The silicon wafer guiding device of an etching and cleaning machine according to claim 2, characterized in that: A second permanent magnet block (49) is fixedly mounted on the right side of the connecting plate (46), and a first permanent magnet block (48) is fixedly mounted on the right side of the inner wall of the mounting frame (3). The opposing surfaces of the first permanent magnet block (48) and the second permanent magnet block (49) are of opposite polarity. The first permanent magnet block (48) and the second permanent magnet block (49) have the same area and are kept facing each other.

4. The silicon wafer guiding device for an etching and cleaning machine according to claim 3, characterized in that: The number of groups of the alignment mechanisms is opposite to the silicon wafer (5), and a gap is left between the silicon wafer (5) and the alignment mechanisms.

5. The silicon wafer guiding device for an etching and cleaning machine according to claim 4, characterized in that: A convex block (419) is provided on the right side of the outer surface of the guide column (411) and is adapted to engage with the inner wall of the slider (412), so that the slider (412) can only slide along the axis of the guide column (411).

6. The silicon wafer guiding device of an etching and cleaning machine according to claim 5, characterized in that: The longitudinal section of the second fixing plate (410) is in a "U" shape, and when the second fixing plate (410) moves to the lowest point, its top is still higher than the left side plane of the connecting plate (46).

7. The silicon wafer guiding device of an etching and cleaning machine according to claim 6, characterized in that: When the silicon chip (5) is driven rightward by the telescopic rod (40), its surface only rotates and abuts against the outer surface of the guide ball (418).

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