A collaborative method for Internet of Things nodes bonding silver wire devices

Abstract

The present application provides a collaborative method for the Internet of Things nodes of a silver wire bonding device, which belongs to the communication field of the Internet of Things and is used to reduce the network overhead in the scenario of large-scale silver wire bonding devices. The silver wire bonding auxiliary node device that belongs to the same group as the silver wire bonding main node device needs to be located near the bonding of the silver wire bonding main node device. The method includes: when the silver wire bonding main node device is connected to the network, the silver wire bonding main node device determines the spatial beam set of the type 1 code book, the type 1 code book is used for the communication between the silver wire bonding main node device and the network, and the two spatial beams in the spatial beam of the type 1 code book are non-orthogonal; the silver wire bonding main node device synchronizes the spatial beam of the type 1 code book to the silver wire bonding auxiliary node device according to the fact that the silver wire bonding auxiliary node device and the silver wire bonding main node device belong to the same group, so as to use the silver wire bonding auxiliary node device to communicate with the network.

Description

Technical Field

[0001] The present application relates to the communication field of the Internet of Things, and in particular to a coordination method for Internet of Things nodes of a silver wire bonding device. Background Art

[0002] Silver wire bonding equipment is a kind of precision production equipment, which is mainly used to produce high-quality silver wire. The working principle of this equipment is to heat and stretch the silver bar through a precision mechanical arm to form a thin silver wire. With the development of science and technology and the advancement of industrial automation technology, silver wire bonding equipment has been able to access the network and realize remote control. The advantages of network access are obvious. It allows operators to control equipment away from the production line, greatly improving production efficiency and safety. At the same time, through the network, the operating status of the equipment can be monitored in real time, and problems can be discovered and solved in time, further ensuring production quality.

[0003] However, with the development of large-scale clustering, more and more silver bonding wire devices are connected to the network, which undoubtedly increases the burden on the network and causes a large network overhead, which requires an optimized design. Summary of the invention

[0004] An embodiment of the present application provides a collaboration method for Internet of Things nodes of silver wire bonding devices, so as to reduce network overhead in a large-scale silver wire bonding device scenario.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, a collaborative method for an Internet of Things node of a bonding silver wire device is provided, which is applied to a bonding silver wire main node device, and a bonding silver wire auxiliary node device belonging to the same group as the bonding silver wire main node device needs to be located near the bonding of the bonding silver wire main node device. The method includes: when the bonding silver wire main node device is connected to the network, the bonding silver wire main node device determines a spatial beam set of a type 1 codebook, the type 1 codebook is used for communication between the bonding silver wire main node device and the network, and two spatial beams in the spatial beams of the type 1 codebook are non-orthogonal; the bonding silver wire main node device synchronizes the spatial beam of the type 1 codebook to the bonding silver wire auxiliary node device according to the fact that the bonding silver wire auxiliary node device and the bonding silver wire main node device belong to the same group, so as to use the bonding silver wire auxiliary node device to communicate with the network.

[0007] Optionally, the type 1 codebook corresponds to M layers, the spatial domain beams of the type 1 codebook include M spatial domain beams, the M layers correspond one-to-one to the M spatial domain beams, the M layers are an integer greater than 4, the group includes N bonded silver wire auxiliary node devices, and N is an integer greater than or equal to 1.

[0008] Optionally, if MN=K is greater than 1, then there are K orthogonal spatial beams among the M spatial beams, and N spatial beams except the K spatial beams among the M spatial beams are non-orthogonal, the K spatial beams are configured for communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the N bonding silver wire auxiliary node devices and the network for communication; if MN=K is equal to 1, then the M spatial beams are non-orthogonal, the K spatial beams among the M spatial beams are configured for communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the N bonding silver wire auxiliary node devices and the network for communication.

[0009] Optionally, M layers of the bonded silver wire master node device share the use of K spatial domain beams.

[0010] Optionally, when the silver-wire master node device is connected to the network, the silver-wire master node device determines the spatial beam set of the type 1 codebook, including: when the silver-wire master node device is connected to the network, the silver-wire master node device receives the spatial beam resource set from the network; if MN=K is greater than 1, the silver-wire master node device selects K spatial beams from the spatial beam set corresponding to the same oversampling factor according to the spatial beam resource set, and the silver-wire master node device selects K spatial beams from the spatial beam set corresponding to the N oversampling factors according to the spatial beam resource set. A spatial beam is selected from the beam set, and a total of N spatial beams are selected. Any two spatial beams in the spatial beam set corresponding to the same sampling factor are orthogonal, and the beams in two spatial beam sets corresponding to any two oversampling factors among the N oversampling factors are not orthogonal; if MN=K is equal to 1, the bonding silver wire master node device selects a spatial beam from the spatial beam sets corresponding to each of the M oversampling factors according to the spatial beam resource set, and a total of M spatial beams are selected. The beams in two spatial beam sets corresponding to any two oversampling factors among the M oversampling factors are not orthogonal.

[0011] Optionally, the first dimension of the spatial beam resource set includes N1 spatial beams, the second dimension of the spatial beam resource set includes N2 spatial beams, the oversampling factors are represented by O1 and O2, the spatial beam resource set includes a total of N1*O1*N2*Q2 spatial beams, a combination of values ​​of O1 and O2 corresponds to an oversampling factor, and all orthogonal spatial beams corresponding to an oversampling factor in the spatial beam resource set are the spatial beam set corresponding to the oversampling factor.

[0012] Optionally, for the ith bonded silver wire auxiliary node device among N bonded silver wire auxiliary node devices, i is an integer traversing from 1 to N, the bonded silver wire main node device synchronizes the spatial domain beam of the type 1 code book to the bonded silver wire auxiliary node device based on the fact that the bonded silver wire auxiliary node device and the bonded silver wire main node device belong to the same group, including: the bonded silver wire main node device sends the precoded PIM information and indication information of the bonded silver wire main node device to the ith bonded silver wire auxiliary node device based on the fact that the ith bonded silver wire auxiliary node device and the bonded silver wire main node device belong to the same group, the PIM information including the spatial domain beam of the type 1 code book, and the indication information indicating that the ith bonded silver wire auxiliary node device uses the ith spatial domain beam among the N spatial domain beams; wherein the ith bonded silver wire auxiliary node device is configured to report PIM information to the network without performing channel state measurement CSI with the network, so that the network uses the PIM information as the CSI measurement result of the ith bonded silver wire auxiliary node device and the network.

[0013] Optionally, the method further includes: the bonding silver wire master node device broadcasts a measurement reference signal for side link measurement; the bonding silver wire master node device receives measurement results of each of P bonding silver wire nodes, where P is an integer greater than 1 or equal to 1, j is an integer traversing from 1 to P, and the measurement result of the jth bonding silver wire node among the P bonding silver wire nodes is used to indicate the signal strength of the measurement reference signal received by the jth bonding silver wire node; the bonding silver wire master node device selects a signal from the P bonding silver wire nodes according to the measurement results of each of the P bonding silver wire nodes. Q bonding silver wire nodes with strength greater than the signal strength threshold, Q is an integer greater than 1 or equal to 1 and less than or equal to P; if Q is greater than M-1, M-1=N, then the bonding silver wire main node device determines the N bonding silver wire nodes with the largest signal strengths among the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices, if Q is less than or equal to M-1, Q=N, then the bonding silver wire main node device determines the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices; the bonding silver wire main node device establishes a side connection with the N bonding silver wire auxiliary node devices.

[0014] Optionally, the structure and performance of the antenna panels of the silver wire bonding main node device and the N silver wire bonding auxiliary node devices are the same.

[0015] In a second aspect, a collaborative system of Internet of Things nodes of a bonding silver wire device is provided, the system comprising a bonding silver wire main node device, a bonding silver wire auxiliary node device belonging to the same group as the bonding silver wire main node device needs to be located near the bonding of the bonding silver wire main node device, the system is configured as follows: when the bonding silver wire main node device is connected to the network, the bonding silver wire main node device determines a spatial beam set of a type 1 codebook, the type 1 codebook is used for communication between the bonding silver wire main node device and the network, and two spatial beams in the spatial beams of the type 1 codebook are non-orthogonal; the bonding silver wire main node device synchronizes the spatial beam of the type 1 codebook to the bonding silver wire auxiliary node device according to the fact that the bonding silver wire auxiliary node device and the bonding silver wire main node device belong to the same group, for use by the bonding silver wire auxiliary node device to communicate with the network.

[0016] Optionally, the type 1 codebook corresponds to M layers, the spatial domain beams of the type 1 codebook include M spatial domain beams, the M layers correspond one-to-one to the M spatial domain beams, the M layers are an integer greater than 4, the group includes N bonded silver wire auxiliary node devices, and N is an integer greater than or equal to 1.

[0017] Optionally, if MN=K is greater than 1, then there are K orthogonal spatial beams among the M spatial beams, and N spatial beams except the K spatial beams among the M spatial beams are non-orthogonal, the K spatial beams are configured for communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the N bonding silver wire auxiliary node devices and the network for communication; if MN=K is equal to 1, then the M spatial beams are non-orthogonal, the K spatial beams among the M spatial beams are configured for communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the N bonding silver wire auxiliary node devices and the network for communication.

[0018] Optionally, M layers of the bonded silver wire master node device share the use of K spatial domain beams.

[0019] Optionally, when the silver-wire master node device is connected to the network, the silver-wire master node device determines the spatial beam set of the type 1 codebook, including: when the silver-wire master node device is connected to the network, the silver-wire master node device receives the spatial beam resource set from the network; if MN=K is greater than 1, the silver-wire master node device selects K spatial beams from the spatial beam set corresponding to the same oversampling factor according to the spatial beam resource set, and the silver-wire master node device selects K spatial beams from the spatial beam set corresponding to the N oversampling factors according to the spatial beam resource set. A spatial beam is selected from the beam set, and a total of N spatial beams are selected. Any two spatial beams in the spatial beam set corresponding to the same sampling factor are orthogonal, and the beams in two spatial beam sets corresponding to any two oversampling factors among the N oversampling factors are not orthogonal; if MN=K is equal to 1, the bonding silver wire master node device selects a spatial beam from the spatial beam sets corresponding to each of the M oversampling factors according to the spatial beam resource set, and a total of M spatial beams are selected. The beams in two spatial beam sets corresponding to any two oversampling factors among the M oversampling factors are not orthogonal.

[0020] Optionally, the first dimension of the spatial beam resource set includes N1 spatial beams, the second dimension of the spatial beam resource set includes N2 spatial beams, the oversampling factors are represented by O1 and O2, the spatial beam resource set includes a total of N1*O1*N2*Q2 spatial beams, a combination of values ​​of O1 and O2 corresponds to an oversampling factor, and all orthogonal spatial beams corresponding to an oversampling factor in the spatial beam resource set are the spatial beam set corresponding to the oversampling factor.

[0021] Optionally, for the ith bonded silver wire auxiliary node device among N bonded silver wire auxiliary node devices, i is an integer traversing from 1 to N, the bonded silver wire main node device synchronizes the spatial domain beam of the type 1 code book to the bonded silver wire auxiliary node device based on the fact that the bonded silver wire auxiliary node device and the bonded silver wire main node device belong to the same group, including: the bonded silver wire main node device sends the precoded PIM information and indication information of the bonded silver wire main node device to the ith bonded silver wire auxiliary node device based on the fact that the ith bonded silver wire auxiliary node device and the bonded silver wire main node device belong to the same group, the PIM information including the spatial domain beam of the type 1 code book, and the indication information indicating that the ith bonded silver wire auxiliary node device uses the ith spatial domain beam among the N spatial domain beams; wherein the ith bonded silver wire auxiliary node device is configured to report PIM information to the network without performing channel state measurement CSI with the network, so that the network uses the PIM information as the CSI measurement result of the ith bonded silver wire auxiliary node device and the network.

[0022] Optionally, the system is further configured as follows: the bonding silver wire master node device broadcasts a measurement reference signal for side link measurement; the bonding silver wire master node device receives measurement results of each of P bonding silver wire nodes, where P is an integer greater than 1 or equal to 1, j is an integer traversing from 1 to P, and the measurement result of the jth bonding silver wire node among the P bonding silver wire nodes is used to indicate the signal strength of the measurement reference signal received by the jth bonding silver wire node; the bonding silver wire master node device selects a signal from the P bonding silver wire nodes according to the measurement results of each of the P bonding silver wire nodes. Q bonding silver wire nodes whose signal strength is greater than the signal strength threshold, Q is an integer greater than 1 or equal to 1 and less than or equal to P; if Q is greater than M-1, M-1=N, then the bonding silver wire main node device determines the N bonding silver wire nodes with the largest signal strength among the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices; if Q is less than or equal to M-1, Q=N, then the bonding silver wire main node device determines the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices; the bonding silver wire main node device establishes a side connection with the N bonding silver wire auxiliary node devices.

[0023] Optionally, the structure and performance of the antenna panels of the silver wire bonding main node device and the N silver wire bonding auxiliary node devices are the same.

[0024] In summary, the silver wire bonding auxiliary node device that belongs to the same group as the silver wire bonding main node device needs to be located near the bonding of the silver wire bonding main node device, such as a relatively close distance, so that the channels of the two and the network can be regarded as consistent in the spatial dimension. On this basis, the silver wire bonding main node device can synchronize the spatial domain beam set of its own type 1 code book to the silver wire bonding auxiliary node device for the silver wire bonding auxiliary node device to communicate with the network. In this way, the silver wire bonding auxiliary node device does not need to perform channel measurement with the network, nor does it need to report the measurement results of the type 1 code book. In the scenario of large-scale clusters, the network side overhead can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the architecture of a collaborative system of Internet of Things nodes for bonding silver wire devices provided in an embodiment of the present application;

[0026] Figure 2 A schematic flow chart of a collaborative method for IoT nodes of a silver wire bonding device provided in an embodiment of the present application;

[0027] Figure 3 A schematic diagram of an application scenario of a collaborative method for an Internet of Things node for bonding silver wire devices provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the structure of a control device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] In the embodiment of the present application, "indication" may include direct indication and indirect indication, and may also include explicit indication and implicit indication. The information indicated by a certain information (such as the first indication information, the second indication information, or the third indication information, etc. below) is called information to be indicated. In the specific implementation process, there are many ways to indicate the information to be indicated, such as but not limited to, the information to be indicated can be directly indicated, such as the information to be indicated itself or the index of the information to be indicated. The information to be indicated can also be indirectly indicated by indicating other information, wherein there is an association relationship between the other information and the information to be indicated. It is also possible to indicate only a part of the information to be indicated, while the other parts of the information to be indicated are known or agreed in advance. For example, the indication of specific information can also be realized by means of the arrangement order of each information agreed in advance (such as specified by the protocol), thereby reducing the indication overhead to a certain extent. At the same time, the common parts of each information can also be identified and uniformly indicated to reduce the indication overhead caused by indicating the same information separately.

[0030] In addition, the specific indication method may also be various existing indication methods, such as but not limited to the above-mentioned indication methods and various combinations thereof. The specific details of the various indication methods can refer to the prior art and will not be repeated herein. As can be seen from the above, for example, when it is necessary to indicate multiple information of the same type, different indication methods may be used for different information. In the specific implementation process, the desired indication method can be selected according to specific needs. The embodiment of the present application does not limit the selected indication method. In this way, the indication method involved in the embodiment of the present application should be understood to cover various methods that can enable the party to be indicated to obtain the information to be indicated.

[0031] "Pre-definition" or "pre-configuration" can be implemented by pre-saving corresponding codes, tables or other methods that can be used to indicate relevant information in the device, and the embodiments of the present application do not limit the specific implementation method. Among them, "saving" can mean saving in one or more memories. The one or more memories can be set separately or integrated in an encoder or decoder, a processor, or a communication device. The one or more memories can also be partially set separately and partially integrated in a decoder, a processor, or a communication device. The type of memory can be any form of storage medium, which is not limited by the embodiments of the present application.

[0032] The "protocol" involved in the embodiments of the present application may refer to a protocol family in the communication field, a standard protocol with a similar protocol family frame structure, or a related protocol used in future communication systems, and the embodiments of the present application do not make specific limitations on this.

[0033] In the embodiments of the present application, descriptions such as "when...", "in the case of...", "if" and "if" all mean that the device will make corresponding processing under certain objective circumstances. It does not limit the time, nor does it require the device to have a judgment action when implementing it, nor does it mean that there are other limitations.

[0034] In the description of the embodiments of the present application, unless otherwise specified, " / " indicates that the objects associated before and after are in an "or" relationship. For example, A / B can represent A or B; "and / or" in the embodiments of the present application is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. These three situations, where A and B can be singular or plural. In addition, in the description of the embodiments of the present application, unless otherwise specified, "multiple" refers to two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple. In addition, in order to facilitate the clear description of the technical solution of the embodiments of the present application, in the embodiments of the present application, the words "first" and "second" are used to distinguish the same or similar items with basically the same functions and effects. Those skilled in the art will appreciate that words such as "first" and "second" do not limit the quantity and execution order, and words such as "first" and "second" do not necessarily limit the difference. At the same time, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way for easy understanding.

[0035] The network architecture and business scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. A person of ordinary skill in the art can appreciate that with the evolution of the network architecture and the emergence of new business scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0036] To facilitate understanding of the embodiments of the present application, first Figure 1 The control system applicable to the embodiment of the present application is described in detail by taking the dynamic update system of the wireless communication configuration shown in FIG. Figure 1A schematic diagram of the architecture of a collaborative system of Internet of Things nodes for bonding silver wire devices applicable to the method provided in an embodiment of the present application.

[0037] like Figure 1 As shown, the collaborative system of the Internet of Things node of the bonding silver wire device may include: a terminal device and a network side device.

[0038] The device on the network side may be a radio access network (RAN) device. The RAN device is also called a target RAN device, and the RAN device may be a device that provides access to the terminal. For example, the RAN device may include: The RAN device may also include 5G, such as a gNB in ​​a new radio (NR) system, or one or a group of (including multiple antenna panels) antenna panels of a base station in 5G, or a network node constituting a gNB, a transmission point (TRP or transmission point, TP) or a transmission measurement function (TMF), such as a baseband unit (BBU), or a centralized unit (CU) or a distributed unit (DU), an RSU with a base station function, or a wired access gateway, or a core network element of 5G. Alternatively, the RAN device may also include an access point (AP) in a wireless fidelity (WiFi) system, a wireless relay node, a wireless backhaul node, various forms of macro base stations, micro base stations (also known as small stations), relay stations, access points, wearable devices, vehicle-mounted devices, etc. Alternatively, the RAN device may also include a next-generation mobile communication system, such as a 6G access network device, such as a 6G base station, or in the next-generation mobile communication system, the network device may also have other naming methods, which are all covered within the protection scope of the embodiments of the present application, and the present application does not make any limitation on this.

[0039] The terminal device may be a terminal having a communication function with a network (mobile communication network), or a chip or chip system that can be set in the terminal. The terminal device may also be referred to as a user equipment (UE), an access terminal, a user unit, a user station, a mobile station, a mobile station, a remote station, a remote terminal, a mobile device, a user terminal, a terminal, a wireless communication device, a user agent or a user device. The terminal device in the embodiment of the present application may be a mobile phone, a tablet computer (Pad), a computer with a wireless transceiver function, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, a vehicle-mounted terminal, an RSU with terminal function, etc. The terminal device of the present application may also be a vehicle-mounted module, a vehicle-mounted module, a vehicle-mounted component, a vehicle-mounted chip or a vehicle-mounted unit built into a vehicle as one or more components or units, and the vehicle may implement the method provided by the present application through the built-in vehicle-mounted module, vehicle-mounted module, vehicle-mounted component, vehicle-mounted chip or vehicle-mounted unit. The communication between terminals may be communication between terminals, which may also be called side communication.

[0040] The terminal device is provided with an antenna panel (pannel), which can transmit or receive multiple beams in different directions, which are called multiple beams of the antenna panel.

[0041] Beam (or spatial beam) refers to a special directional sending or receiving effect formed by the transmitter or receiver of a network device or terminal through an antenna array, similar to the beam formed by a flashlight converging light in one direction. Sending and receiving signals in the form of beams can effectively increase the transmission distance of signals.

[0042] The beam may be a wide beam, a narrow beam, or other types of beams. The beam forming technology may be a beam forming technology or other technologies. The beam forming technology may specifically be a digital beam forming technology, an analog beam forming technology, or a hybrid digital / analog beam forming technology.

[0043] Beams generally correspond to resources. For example, when performing beam measurement, the network device measures different beams through different resources, and the terminal feeds back the measured resource quality, so that the network device can know the quality of the corresponding beam. During data transmission, the beam can also be indicated by its corresponding resource. For example, the network device indicates a transmission configuration indication-state through the transmission configuration index (TCI) field in the downlink control information (DCI), and the terminal determines the beam corresponding to the reference resource based on the reference resource contained in the TCI-state.

[0044] In the communication protocol, the beam can be specifically characterized as a digital beam, an analog beam, a spatial domain filter, a spatial filter, a spatial parameter, TCI, a TCI-state, etc. The beam used to send a signal can be called a transmission beam (or Tx beam), a spatial domain transmission filter, a spatial transmission filter, a spatial domain transmission parameter, a spatial transmission parameter, etc. The beam used to receive a signal can be called a reception beam (or Rx beam), a spatial domain reception filter, a spatial reception filter, a spatial domain reception parameter, a spatial reception parameter, etc.

[0045] It can be understood that the embodiments of the present application are uniformly described using beams, but beams can be replaced by other equivalent concepts and are not limited to the concepts mentioned above.

[0046] It can also be understood that the embodiment of the present application is introduced by taking the terminal device in the form of a bonding silver wire device as an example.

[0047] The following will be combined Figure 2The interaction process between the devices in the above system is specifically introduced through the method embodiment. The collaborative method of the Internet of Things node of the silver wire bonding device provided in the embodiment of the present application can be applied to the above system, which is specifically introduced below.

[0048] Figure 2 A schematic diagram of a collaborative method for an Internet of Things node of a silver wire bonding device provided in an embodiment of the present application. The process of the collaborative method for an Internet of Things node of a silver wire bonding device is as follows:

[0049] S201, when the silver wire master node device is connected to the network, the silver wire master node device determines a spatial beam set of a type 1 codebook.

[0050] The type 1 codebook is used for communication between the bonded silver wire main node device and the network. The two spatial domain beams in the spatial domain beam of the type 1 codebook are non-orthogonal. The M layers corresponding to the type 1 codebook, or the bonded silver wire main node device supports M layers, also known as rank M, where M layers are an integer greater than 4, i.e., a high rank scenario. For example, the spatial domain beam of the type 1 codebook can include M spatial domain beams, where the M layers correspond one-to-one to the M spatial domain beams, and the group includes N bonded silver wire auxiliary node devices, where N is an integer greater than or equal to 1.

[0051] In one case, if MN=K is greater than 1, there are K orthogonal spatial beams among the M spatial beams, and N spatial beams other than the K spatial beams among the M spatial beams are non-orthogonal, and the K spatial beams are configured for the communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the communication between the N bonding silver wire auxiliary node devices and the network. In another case, if MN=K is equal to 1, the M spatial beams are non-orthogonal, and the K spatial beams among the M spatial beams are configured for the communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the communication between the N bonding silver wire auxiliary node devices and the network.

[0052] That is to say, the spatial beams used for the same device need to be orthogonal to avoid interference. However, different devices are distinguished by their spatial positions, so non-orthogonal spatial beams can be used, such as quasi-orthogonal beams, that is, the inner product is 1 / L, where L is the sequence length.

[0053] The M layers of the bonded silver wire main node device share K spatial beams. For example, M=5, i.e. rank5, K=2, which means that the flows corresponding to the 5 layers are mapped to 2 spatial beams.

[0054] Specifically, when the bonding silver wire master node device is connected to a network (such as a RAN device), the bonding silver wire master node device receives a spatial beam resource set from the network (specifically, it can be received during the channel measurement with the RAN device); if MN=K is greater than 1, the bonding silver wire master node device selects K spatial beams from the spatial beam set corresponding to the same oversampling factor according to the spatial beam resource set, and the bonding silver wire master node device selects one spatial beam from the spatial beam sets corresponding to N oversampling factors respectively according to the spatial beam resource set, and selects a total of N spatial beams, any two spatial beams in the spatial beam set corresponding to the same sampling factor are orthogonal, and the N oversampling factors are orthogonal. The beams in the two spatial beam sets corresponding to any two oversampling factors in the sampling factor are non-orthogonal; if MN=K is equal to 1, the bonding silver wire master node device selects a spatial beam from the spatial beam sets corresponding to M oversampling factors according to the spatial beam resource set, and a total of M spatial beams are selected. The beams in the two spatial beam sets corresponding to any two oversampling factors in the M oversampling factors are non-orthogonal. The advantage of selecting non-orthogonal is that the number of orthogonal spatial beams is limited, while the number of non-orthogonal spatial beams is relatively more. Selecting non-orthogonal spatial beams can save the resources of orthogonal spatial beams for use by other devices while meeting communication needs, thereby improving resource utilization.

[0055] Among them, the first dimension of the spatial beam resource set contains N1 spatial beams, the second dimension of the spatial beam resource set contains N2 spatial beams, the oversampling factors are represented by O1 and O2, the spatial beam resource set contains a total of N1*O1*N2*Q2 spatial beams, a combination of O1 and O2 corresponds to an oversampling factor, and all orthogonal spatial beams corresponding to an oversampling factor in the spatial beam resource set are the spatial beam set corresponding to the oversampling factor.

[0056] For example, Figure 3 As shown, Figure 3 Each circle in the figure represents a spatial beam, with 8 rows and 16 columns, for a total of 128 spatial beams. Figure 3 Taking the red box in the lower left corner as an example, the oversampling factor is represented by the spatial beam in the red box. For example, the spatial beam in the 8th row and the 1st column corresponds to O1=1, O2=1, the spatial beam in the 8th row and the 2nd column corresponds to O1=2, O2=1, the spatial beam in the 7th row and the 1st column corresponds to O1=1, O2=2, and so on. When the oversampling factor is determined, or the corresponding spatial beam is determined, all spatial beams orthogonal to the spatial beam constitute the spatial beam set corresponding to the oversampling factor, such as Figure 3 All the spatial beams shown in red circles are the set of spatial beams corresponding to an oversampling factor. Figure 3All the spatial beams shown by the circles filled with slashes are the spatial beam sets corresponding to another oversampling factor, and any two beams in the two spatial beam sets are not orthogonal.

[0057] If the bonding silver wire main node device and N bonding silver wire auxiliary node devices are to share the type 1 code book of the bonding silver wire main node device, the structure and performance of the antenna panels of the bonding silver wire main node device and the N bonding silver wire auxiliary node devices shall be the same, that is, the values ​​of N1, O1, N2, and Q2 mentioned above shall be the same, which can be specifically implemented during design and manufacturing.

[0058] The physical positions of the bonding silver wire main node device and the bonding silver wire auxiliary node device can be set manually, such as installation and setting according to the production line. The bonding silver wire main node device can discover the bonding silver wire auxiliary node device and build a group to execute S201-S202 to complete the spatial beam configuration. For example, the bonding silver wire main node device can broadcast a measurement reference signal for side link measurement. The bonding silver wire main node device receives the measurement results of each of P bonding silver wire nodes, where P is an integer greater than 1 or equal to 1, and j is an integer traversing from 1 to P. The measurement result of the jth bonding silver wire node among the P bonding silver wire nodes is used to indicate the signal strength of the measurement reference signal received by the jth bonding silver wire node.

[0059] The bonding silver wire master node device selects Q bonding silver wire nodes with signal strength greater than the signal strength threshold from the P bonding silver wire nodes according to the measurement results of each of the P bonding silver wire nodes, where Q is an integer greater than 1 or equal to 1 and less than or equal to P. Among them, the signal strength greater than the signal strength threshold means that the distance between the two devices is relatively close, such as within 2-3 meters, which can be considered as a channel in physical space, so the type 1 codebook can be shared. If Q is greater than M-1, M-1=N, the bonding silver wire master node device determines the N bonding silver wire nodes with the largest signal strength among the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices. If Q is less than or equal to M-1, Q=N, the bonding silver wire master node device determines the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices, thereby constructing the above-mentioned group based on the N bonding silver wire auxiliary node devices and itself. The bonding silver wire master node device establishes a side connection with the N bonding silver wire auxiliary node devices.

[0060] It can be understood that if the value of M is relatively large and the value of N is relatively small, then each bonding silver wire auxiliary node device can also use 2 / 3 of the spatial domain beams, such as M=8, N=2, M spatial domain beams are 8 spatial domain beams, so 2 / 3 of the orthogonal spatial domain beams can be configured for use by one bonding silver wire auxiliary node device, and another 2 / 3 of the orthogonal spatial domain beams can be configured for use by another bonding silver wire auxiliary node device, and the remaining orthogonal spatial domain beams are still shared by the M layers of the bonding silver wire main node device.

[0061] S202, the bonding silver wire main node device synchronizes the spatial domain beam of the type 1 codebook to the bonding silver wire auxiliary node device according to the bonding silver wire auxiliary node device and the bonding silver wire main node device belonging to the same group, so as to be used for the bonding silver wire auxiliary node device to communicate with the network.

[0062] For the i-th bonded silver wire auxiliary node device among N bonded silver wire auxiliary node devices, i is an integer traversing from 1 to N, and the bonded silver wire main node device sends the precoded PIM information and indication information of the bonded silver wire main node device to the i-th bonded silver wire auxiliary node device according to the i-th bonded silver wire auxiliary node device and the bonded silver wire main node device belonging to the same group, the PIM information includes the spatial domain beam of the type 1 codebook, and the indication information indicates that the i-th bonded silver wire auxiliary node device uses the i-th spatial domain beam among the N spatial domain beams; wherein the i-th bonded silver wire auxiliary node device is configured (which can be factory pre-configured or protocol pre-defined) to report PIM information to the network without performing channel state measurement CSI with the network, so that the network uses the PIM information as the CSI measurement result between the i-th bonded silver wire auxiliary node device and the network.

[0063] In summary, the silver wire bonding auxiliary node device that belongs to the same group as the silver wire bonding main node device needs to be located near the bonding of the silver wire bonding main node device, such as a relatively close distance, so that the channels of the two and the network can be regarded as consistent in the spatial dimension. On this basis, the silver wire bonding main node device can synchronize the spatial domain beam set of its own type 1 code book to the silver wire bonding auxiliary node device for the silver wire bonding auxiliary node device to communicate with the network. In this way, the silver wire bonding auxiliary node device does not need to perform channel measurement with the network, nor does it need to report the measurement results of the type 1 code book. In the scenario of large-scale clusters, the network side overhead can be reduced.

[0064] Combination of the above Figure 2 The collaborative method of the Internet of Things node of the bonding silver wire device provided in the embodiment of the present application is described in detail. The collaborative system of the Internet of Things node of the bonding silver wire device for executing the collaborative method of the Internet of Things node of the bonding silver wire device provided in the embodiment of the present application is described below.

[0065] The system includes a bonding silver wire main node device, and a bonding silver wire auxiliary node device belonging to the same group as the bonding silver wire main node device needs to be located near the bonding of the bonding silver wire main node device. The system is configured as follows: when the bonding silver wire main node device is connected to the network, the bonding silver wire main node device determines a spatial beam set of a type 1 code book, and the type 1 code book is used for communication between the bonding silver wire main node device and the network, and two spatial beams in the spatial beams of the type 1 code book are non-orthogonal; the bonding silver wire main node device synchronizes the spatial beam of the type 1 code book to the bonding silver wire auxiliary node device based on the fact that the bonding silver wire auxiliary node device and the bonding silver wire main node device belong to the same group, so that the bonding silver wire auxiliary node device can communicate with the network.

[0066] Optionally, the type 1 codebook corresponds to M layers, the spatial domain beams of the type 1 codebook include M spatial domain beams, the M layers correspond one-to-one to the M spatial domain beams, the M layers are an integer greater than 4, the group includes N bonded silver wire auxiliary node devices, and N is an integer greater than or equal to 1.

[0067] Optionally, if MN=K is greater than 1, then there are K orthogonal spatial beams among the M spatial beams, and N spatial beams except the K spatial beams among the M spatial beams are non-orthogonal, the K spatial beams are configured for communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the N bonding silver wire auxiliary node devices and the network for communication; if MN=K is equal to 1, then the M spatial beams are non-orthogonal, the K spatial beams among the M spatial beams are configured for communication between the bonding silver wire main node device and the network, and the N spatial beams are configured one-to-one to the N bonding silver wire auxiliary node devices and the network for communication.

[0068] Optionally, M layers of the bonded silver wire master node device share the use of K spatial domain beams.

[0069] Optionally, when the silver-wire master node device is connected to the network, the silver-wire master node device determines the spatial beam set of the type 1 codebook, including: when the silver-wire master node device is connected to the network, the silver-wire master node device receives the spatial beam resource set from the network; if MN=K is greater than 1, the silver-wire master node device selects K spatial beams from the spatial beam set corresponding to the same oversampling factor according to the spatial beam resource set, and the silver-wire master node device selects K spatial beams from the spatial beam set corresponding to the N oversampling factors according to the spatial beam resource set. A spatial beam is selected from the beam set, and a total of N spatial beams are selected. Any two spatial beams in the spatial beam set corresponding to the same sampling factor are orthogonal, and the beams in two spatial beam sets corresponding to any two oversampling factors among the N oversampling factors are not orthogonal; if MN=K is equal to 1, the bonding silver wire master node device selects a spatial beam from the spatial beam sets corresponding to each of the M oversampling factors according to the spatial beam resource set, and a total of M spatial beams are selected. The beams in two spatial beam sets corresponding to any two oversampling factors among the M oversampling factors are not orthogonal.

[0070] Optionally, the first dimension of the spatial beam resource set includes N1 spatial beams, the second dimension of the spatial beam resource set includes N2 spatial beams, the oversampling factors are represented by O1 and O2, the spatial beam resource set includes a total of N1*O1*N2*Q2 spatial beams, a combination of values ​​of O1 and O2 corresponds to an oversampling factor, and all orthogonal spatial beams corresponding to an oversampling factor in the spatial beam resource set are the spatial beam set corresponding to the oversampling factor.

[0071] Optionally, for the ith bonded silver wire auxiliary node device among N bonded silver wire auxiliary node devices, i is an integer traversing from 1 to N, the bonded silver wire main node device synchronizes the spatial domain beam of the type 1 code book to the bonded silver wire auxiliary node device based on the fact that the bonded silver wire auxiliary node device and the bonded silver wire main node device belong to the same group, including: the bonded silver wire main node device sends the precoded PIM information and indication information of the bonded silver wire main node device to the ith bonded silver wire auxiliary node device based on the fact that the ith bonded silver wire auxiliary node device and the bonded silver wire main node device belong to the same group, the PIM information including the spatial domain beam of the type 1 code book, and the indication information indicating that the ith bonded silver wire auxiliary node device uses the ith spatial domain beam among the N spatial domain beams; wherein the ith bonded silver wire auxiliary node device is configured to report PIM information to the network without performing channel state measurement CSI with the network, so that the network uses the PIM information as the CSI measurement result of the ith bonded silver wire auxiliary node device and the network.

[0072] Optionally, the system is further configured as follows: the bonding silver wire master node device broadcasts a measurement reference signal for side link measurement; the bonding silver wire master node device receives measurement results of each of P bonding silver wire nodes, where P is an integer greater than 1 or equal to 1, j is an integer traversing from 1 to P, and the measurement result of the jth bonding silver wire node among the P bonding silver wire nodes is used to indicate the signal strength of the measurement reference signal received by the jth bonding silver wire node; the bonding silver wire master node device selects a signal from the P bonding silver wire nodes according to the measurement results of each of the P bonding silver wire nodes. Q bonding silver wire nodes whose signal strength is greater than the signal strength threshold, Q is an integer greater than 1 or equal to 1 and less than or equal to P; if Q is greater than M-1, M-1=N, then the bonding silver wire main node device determines the N bonding silver wire nodes with the largest signal strength among the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices; if Q is less than or equal to M-1, Q=N, then the bonding silver wire main node device determines the Q bonding silver wire nodes as N bonding silver wire auxiliary node devices; the bonding silver wire main node device establishes a side connection with the N bonding silver wire auxiliary node devices.

[0073] Optionally, the structure and performance of the antenna panels of the silver wire bonding main node device and the N silver wire bonding auxiliary node devices are the same.

[0074] Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. For example, the electronic device may be a terminal, or a chip (system) or other components or assemblies that may be provided in a terminal. Figure 4 As shown, the electronic device 400 may include a processor 401. Optionally, the electronic device 400 may further include a memory 402 and / or a transceiver 403. The processor 401 is coupled with the memory 402 and the transceiver 403, such as being connected via a communication bus.

[0075] Combine the following Figure 4 The components of the electronic device 400 are described in detail:

[0076] The processor 401 is the control center of the electronic device 400, and may be a processor or a general term for multiple processing elements. For example, the processor 401 is one or more central processing units (CPUs), or may be application specific integrated circuits (ASICs), or may be one or more integrated circuits configured to implement the embodiments of the present application, such as one or more microprocessors (digital signal processors, DSPs), or one or more field programmable gate arrays (FPGAs).

[0077] Optionally, the processor 401 can execute various functions of the electronic device 400 by running or executing the software program stored in the memory 402 and calling the data stored in the memory 402, such as executing the above Figure 2 A collaborative method for bonding silver wire devices to IoT nodes is shown.

[0078] In a specific implementation, as an embodiment, the processor 401 may include one or more CPUs, such as Figure 4 CPU0 and CPU1 are shown in FIG.

[0079] In a specific implementation, as an embodiment, the electronic device 400 may also include multiple processors. Each of these processors may be a single-core processor (single-CPU) or a multi-core processor (multi-CPU). The processor here may refer to one or more devices, circuits, and / or processing cores for processing data (such as computer program instructions).

[0080] The memory 402 is used to store the software program for executing the solution of the present application, and the execution is controlled by the processor 401. The specific implementation method can refer to the above method embodiment, which will not be repeated here.

[0081] Optionally, the memory 402 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a random access memory (RAM) or other types of dynamic storage devices that can store information and instructions, or an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory 402 may be integrated with the processor 401, or may exist independently and access the computer through the interface circuit ( Figure 4 (not shown) is coupled to the processor 401, which is not specifically limited in this embodiment of the present application.

[0082] The transceiver 403 is used for communication with other electronic devices. For example, if the electronic device 400 is a terminal, the transceiver 403 can be used to communicate with a network device, or with another terminal device. For another example, if the electronic device 400 is a network device, the transceiver 403 can be used to communicate with a terminal, or with another network device.

[0083] Optionally, the transceiver 403 may include a receiver and a transmitter ( Figure 4 The receiver is used to implement a receiving function, and the transmitter is used to implement a sending function.

[0084] Optionally, the transceiver 403 may be integrated with the processor 401, or may exist independently and communicate with the electronic device 400 through an interface circuit ( Figure 4 (not shown) is coupled to the processor 401, which is not specifically limited in this embodiment of the present application.

[0085] Understandably, Figure 4 The structure of the electronic device 400 shown in the figure does not constitute a limitation on the electronic device, and the actual electronic device may include more or fewer components than those shown in the figure, or combine certain components, or arrange the components differently.

[0086] In addition, the technical effects of the electronic device 400 can refer to the technical effects of the methods described in the above method embodiments, which will not be repeated here.

[0087] It should be understood that the processor in the embodiments of the present application may be a central processing unit (CPU), and the processor may also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0088] It should also be understood that the memory in the embodiments of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of random access memory (RAM) are available, such as static RAM (SRAM), dynamic random access memory (DRAM), synchronous DRAM (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link DRAM (SLDRAM), and direct rambus RAM (DR RAM).

[0089] The above embodiments can be implemented in whole or in part by software, hardware (such as circuits), firmware or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server or data center to another website, computer, server or data center by wired (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (for example, a floppy disk, a hard disk, a tape), an optical medium (for example, a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state hard disk.

[0090] It should be understood that the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship, but it may also indicate an "and / or" relationship. Please refer to the context for specific understanding.

[0091] In this application, "at least one" means one or more, and "plurality" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0092] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0093] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0094] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0095] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0096] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0097] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0098] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, and other media that can store program codes.

[0099] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for coordinating nodes of an Internet of Things (IoT) for bonding silver wire devices, characterized in that: Applied to a silver wire bonding main node device, a silver wire bonding auxiliary node device belonging to the same group as the silver wire bonding main node device needs to be located near the bonding of the silver wire bonding main node device, and the method includes: When the bonding silver wire master node device is connected to a network, the bonding silver wire master node device determines a set of spatial domain beams of a type 1 codebook, the type 1 codebook is used for communication between the bonding silver wire master node device and the network, and two spatial domain beams in the spatial domain beams of the type 1 codebook are non-orthogonal; The silver wire bonding master node device synchronizes the spatial domain beam of the type 1 codebook to the silver wire bonding master node device according to the silver wire bonding master node device and the silver wire bonding master node device belonging to the same group, so that the silver wire bonding master node device communicates with the network; The type 1 codebook corresponds to M layers, the spatial domain beam of the type 1 codebook includes M spatial domain beams, the M layers correspond to the M spatial domain beams one-to-one, the M layers are an integer greater than 4, the group includes N silver wire auxiliary node devices, and N is an integer greater than or equal to 1; If MN=K is greater than 1, there are K orthogonal spatial beams among the M spatial beams, and N spatial beams other than the K spatial beams among the M spatial beams are non-orthogonal, the K spatial beams are configured for communication between the silver wire bonding master node device and the network, and the N spatial beams are configured one-to-one for communication between the N silver wire bonding slave node devices and the network; If MN=K is equal to 1, the M spatial domain beams are non-orthogonal, the K spatial domain beams among the M spatial domain beams are configured for communication between the silver wire bonding master node device and the network, and the N spatial domain beams are configured one-to-one for communication between the N silver wire bonding slave node devices and the network; The M layers of the bonded silver wire master node device share the K spatial domain beams.

2. The method according to claim 1, characterized in that When the bonding silver wire master node device is connected to the network, the bonding silver wire master node device determines a spatial domain beam set of a type 1 codebook, including: When the silver-wire bonding master node device is connected to the network, the silver-wire bonding master node device receives a set of spatial beam resources from the network; If MN=K is greater than 1, the bonding silver wire master node device selects the K spatial beams from the spatial beam sets corresponding to the same oversampling factor according to the spatial beam resource set, and the bonding silver wire master node device selects one spatial beam from the spatial beam sets corresponding to the N oversampling factors respectively according to the spatial beam resource set, and selects the N spatial beams in total, any two spatial beams in the spatial beam sets corresponding to the same oversampling factor are orthogonal, and the beams in the two spatial beam sets corresponding to any two oversampling factors in the N oversampling factors are non-orthogonal; If MN=K is equal to 1, the bonding silver wire master node device selects a spatial beam from the spatial beam sets corresponding to each of the M oversampling factors according to the spatial beam resource set, and selects a total of the M spatial beams. The beams in the two spatial beam sets corresponding to any two oversampling factors among the M oversampling factors are non-orthogonal.

3. The method according to claim 2, characterized in that The first dimension of the spatial beam resource set includes N1 spatial beams, the second dimension of the spatial beam resource set includes N2 spatial beams, the oversampling factors are represented by O1 and O2, the spatial beam resource set includes a total of N1*O1*N2*Q2 spatial beams, a value combination of O1 and O2 corresponds to an oversampling factor, and all orthogonal spatial beams corresponding to an oversampling factor in the spatial beam resource set are the spatial beam set corresponding to the oversampling factor.

4. The method according to any one of claims 1 to 3, characterized in that For an i-th bonding silver wire auxiliary node device among the N bonding silver wire auxiliary node devices, i is an integer traversing from 1 to N, the bonding silver wire main node device synchronizes the spatial domain beam of the type 1 codebook to the bonding silver wire auxiliary node device according to the bonding silver wire auxiliary node device and the bonding silver wire main node device belonging to the same group, including: The bonding silver wire master node device sends the precoding PIM information and indication information of the bonding silver wire master node device to the i-th bonding silver wire auxiliary node device according to the i-th bonding silver wire auxiliary node device and the bonding silver wire master node device belonging to the same group, wherein the PIM information includes the spatial domain beam of the type 1 codebook, and the indication information indicates that the i-th bonding silver wire auxiliary node device uses the i-th spatial domain beam among the N spatial domain beams; Among them, the i-th bonding silver wire auxiliary node device is configured to report the PIM information to the network without performing channel state measurement CSI with the network, so that the network uses the PIM information as the CSI measurement result between the i-th bonding silver wire auxiliary node device and the network.

5. The method according to claim 4, characterized in that The method further comprises: The silver wire bonding master node device broadcasts a measurement reference signal for side link measurement; The silver bonding wire master node device receives measurement results of P silver bonding wire nodes, where P is an integer greater than 1 or equal to 1, and j is an integer ranging from 1 to P, and the measurement result of the j-th silver bonding wire node among the P silver bonding wire nodes is used to indicate the signal strength of the measurement reference signal received by the j-th silver bonding wire node; The silver bonding wire master node device selects Q silver bonding wire nodes having signal strength greater than a signal strength threshold from the P silver bonding wire nodes according to the respective measurement results of the P silver bonding wire nodes, where Q is an integer greater than 1 or equal to 1 and less than or equal to P; If Q is greater than M-1, M-1=N, the silver-wire main node device determines the N silver-wire nodes with the largest signal strength among the Q silver-wire nodes as the N silver-wire auxiliary node devices; if Q is less than or equal to M-1, Q=N, the silver-wire main node device determines the Q silver-wire nodes as the N silver-wire auxiliary node devices; The silver wire bonding main node device establishes a side connection with the N silver wire bonding auxiliary node devices.

6. The method according to claim 5, characterized in that The structure and performance of the antenna panels of the silver wire bonding main node device and the N silver wire bonding auxiliary node devices are the same.

7. A collaborative system for Internet of Things nodes of silver wire bonding equipment, characterized in that: The system includes a silver wire bonding main node device, and a silver wire bonding auxiliary node device belonging to the same group as the silver wire bonding main node device needs to be located near the bonding of the silver wire bonding main node device, and the system is configured as follows: When the bonding silver wire master node device is connected to a network, the bonding silver wire master node device determines a set of spatial domain beams of a type 1 codebook, the type 1 codebook is used for communication between the bonding silver wire master node device and the network, and two spatial domain beams in the spatial domain beams of the type 1 codebook are non-orthogonal; The silver wire bonding master node device synchronizes the spatial domain beam of the type 1 codebook to the silver wire bonding master node device according to the silver wire bonding master node device and the silver wire bonding master node device belonging to the same group, so that the silver wire bonding master node device communicates with the network; The type 1 codebook corresponds to M layers, the spatial domain beam of the type 1 codebook includes M spatial domain beams, the M layers correspond to the M spatial domain beams one-to-one, the M layers are an integer greater than 4, the group includes N silver wire auxiliary node devices, and N is an integer greater than or equal to 1; If MN=K is greater than 1, there are K orthogonal spatial beams among the M spatial beams, and N spatial beams other than the K spatial beams among the M spatial beams are non-orthogonal, the K spatial beams are configured for communication between the bonding silver wire master node device and the network, and the N spatial beams are configured one-to-one for communication between the N bonding silver wire auxiliary node devices and the network; If MN=K is equal to 1, the M spatial domain beams are non-orthogonal, the K spatial domain beams among the M spatial domain beams are configured for communication between the silver wire bonding master node device and the network, and the N spatial domain beams are configured one-to-one for communication between the N silver wire bonding slave node devices and the network; The M layers of the bonded silver wire master node device share the K spatial domain beams.

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