Semiconductor lead frame mold grinding device and method

Abstract

The present invention discloses a semiconductor lead frame mold grinding device and method, belonging to the field of mold processing technology, including: a base; a grinding device plate, the grinding device plate is fixedly connected to the edge of one end of the top of the base; a positioning mechanism, which is provided with two groups, both of which are arranged on the base, and each group of positioning mechanisms includes a positioning component, a rotating component, a pushing component, a horizontal pushing block, a docking plate and a vertical pushing block. The semiconductor lead frame mold grinding device and method can position the mold block in multiple positions through the use of the positioning mechanism, improve the stability during use, avoid shaking during the grinding process, and have a simple structure, easy use, and improve the use effect. Through the use of the positioning mechanism, corresponding adjustments can be made according to the size of the mold block, so that the device can meet the size of different mold blocks, improve the overall flexibility of use, and ensure the use effect.

Description

Technical Field

[0001] The invention belongs to the technical field of mold processing, and in particular relates to a semiconductor lead frame mold grinding device and method. Background Art

[0002] Semiconductor lead frame mold is an industrial mold used to manufacture semiconductor lead frames. This mold is widely used in the manufacturing industry of electronic components and integrated circuits, especially in consumer electronics such as mobile phones and computers, as well as electronic equipment in the fields of automobiles, aerospace, and high-tech industries such as medical equipment and instruments.

[0003] The semiconductor lead frame mold is mainly composed of a main structure part and a molding part. The semiconductor lead frame manufactured by it is a frame structure used to fix and connect the packaged chip and the external leads in the semiconductor package. This frame is mainly composed of chip pads and pins. The chip pads provide mechanical support for the chip during the packaging process, while the pins are electrical and thermal paths connecting the chip to the outside of the package.

[0004] The grinding of semiconductor lead frame molds is a key process in the manufacturing process. It needs to be processed by a grinder to ensure the integrity of the mold shape. During the mold grinding process, positioning is required. In traditional technology, a clamp is used to clamp the mold positioning block. Different models of mold positioning blocks require the use of different clamps, which is inconvenient to operate and has low work efficiency. Summary of the invention

[0005] The purpose of the present invention is to: through the use of a positioning mechanism, the mold block can be positioned in multiple positions, the stability during use can be improved, and shaking during the grinding process can be avoided. The structure is simple, the use is easy, and the use effect is improved. Through the use of the adjustment mechanism, corresponding adjustments can be made according to the size of the mold block, so that the device can meet the sizes of different mold blocks, improve the overall flexibility of use, and ensure the use effect.

[0006] The technical solution adopted by the present invention is as follows: A semiconductor lead frame mold grinding device, comprising:

[0007] Base;

[0008] A grinding device plate, wherein the grinding device plate is fixedly connected to an edge of a top end of the base;

[0009] A positioning mechanism, which is provided with two groups, both of which are arranged on the base, and each group of the positioning mechanism includes a positioning component, a rotating component, a pushing component, a horizontal pushing block, a docking plate and a vertical pushing block. A positioning plate is installed on the top of the base, the positioning component is arranged in the positioning plate, the rotating component is arranged on the positioning plate, the pushing component is arranged on the rotating component, the horizontal pushing block is installed on the pushing component, the vertical pushing block is installed on the pushing component, and the docking plate is fixedly connected to one side of the top of the positioning plate;

[0010] A mold block, wherein the mold block is installed on the top of the two positioning plates;

[0011] A positioning mechanism is arranged in the base, and the positioning mechanism is connected to one of the positioning plates, and is used to adjust the position of one of the positioning plates. The positioning mechanism includes a limiting component, a synchronization component, two shift threaded rods and a shift motor. The limiting component is arranged in the base, and the two shift threaded rods are arranged in the base. The shift motor is fixedly connected to one end of the base, and the output end of the shift motor is fixedly connected to one end of one of the shift threaded rods.

[0012] The positioning component comprises:

[0013] A top assembly, disposed in the positioning plate, for adjusting the position of the vertical push block; and

[0014] A reset assembly is arranged in the positioning plate and is used to reset the position of the lateral push block;

[0015] The jacking assembly includes a jacking cylinder and an L-shaped jacking plate, a jacking cavity is provided in the positioning plate, the jacking cylinder is fixedly connected to the bottom center of the jacking cavity, and the L-shaped jacking plate is fixedly connected to the output end of the jacking cylinder;

[0016] The reset assembly includes a reset spring and a support rod, wherein the support rod is fixedly connected to one side of the upper inner wall of the top cavity, the reset spring is fixedly connected to one side of the upper inner wall of the top cavity, and the reset spring is sleeved on the outer surface of the support rod;

[0017] The rotating component includes a limiting component, a horizontal rotating rod and a vertical rotating rod. The top two sides of the positioning plate are provided with rotating grooves. The horizontal rotating rod is rotatably connected to one of the rotating grooves. The vertical rotating rod is slidably connected to the other rotating groove. The limiting component is arranged on the vertical rotating rod and connected to the rotating groove. An adjustable contact rod is installed at one end of the bottom of the horizontal rotating rod.

[0018] The limiting assembly includes a positioning groove and a positioning rod, wherein the positioning groove is provided on the vertical rotating rod, the positioning rod is fixedly connected to one of the rotating grooves, and the rotating groove is slidably connected to the positioning groove;

[0019] The pushing component includes a transverse pushing cylinder and a vertical pushing cylinder, wherein the transverse pushing cylinder is fixedly connected to the top of the transverse rotating rod, and the output end of the transverse pushing cylinder is fixedly connected to the transverse pushing block, and the vertical pushing cylinder is fixedly connected to the top of the vertical rotating rod, and the output end of the vertical pushing cylinder is fixedly connected to the vertical pushing block;

[0020] During positioning, the top cylinder contracts, causing the vertical rotating rod to descend and be perpendicular to the positioning plate. The vertical pushing block is extended by the vertical pushing cylinder to press and position the top of the mold block. When the top cylinder contracts, the adjustable contact rod is relaxed, and the lateral rotating rod is rotated by the elastic force of the return spring and is perpendicular to the positioning plate. The lateral pushing block is extended by the lateral pushing cylinder to position the side of the mold block. The surface of the mold block is polished by the polishing mechanism installed on the grinding device plate.

[0021] Among them, the limiting component includes two limiting grooves and a movable limiting plate. The two limiting grooves are respectively opened on both sides of the base. The two ends of the movable limiting plate are respectively slidably connected to the limiting grooves, and the two ends of the movable limiting plate are respectively threadedly connected to the two displacement threaded rods.

[0022] Wherein, the synchronous component includes two synchronous gears and a synchronous toothed belt, each of the synchronous gears is fixedly connected to one end of each shift threaded rod, the synchronous toothed belt is sleeved on the two synchronous gears, and the synchronous toothed belt and the two synchronous gears are meshed with each other.

[0023] A semiconductor lead frame mold grinding method comprises the following steps:

[0024] Step 1, size correspondence: According to the size of the mold block, adjust the relative distance between the two positioning plates. During the adjustment, the shift motor controls one of the shift threaded rods to rotate, and the two shift threaded rods are rotated synchronously through two synchronous gears and synchronous toothed belts, so that the movable limit plate moves in the two limit grooves, adjusts the position of one of the positioning plates, changes the distance between the two positioning plates, and ensures the positioning of both ends of the mold block;

[0025] Step 2, position fixing: the mold block is positioned by two sets of positioning mechanisms. When positioning, the top cylinder contracts to make the vertical rotating rod descend and be perpendicular to the positioning plate. The vertical pushing block is extended by the vertical pushing cylinder to press and position the top of the mold block. When the top cylinder contracts, the adjustable contact rod is loosened, and the horizontal rotating rod is rotated by the elastic force of the reset spring and is perpendicular to the positioning plate. The horizontal pushing block is extended by the horizontal pushing cylinder to position the side of the mold block, thus completing the overall positioning of the mold block.

[0026] Step 3: Grinding: Grind the surface of the mold block by using the grinding mechanism installed on the grinding device plate.

[0027] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0028] (1) In the present invention, the mold block can be positioned at multiple positions by using the positioning mechanism, thereby improving the stability during use and avoiding shaking during the grinding process. The structure is simple, the use is easy, and the use effect is improved.

[0029] (2) In the present invention, by using the positioning mechanism, corresponding adjustments can be made according to the size of the mold block, so that the device can meet the sizes of different mold blocks, improve the overall flexibility of use, and ensure the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a partial cross-sectional view of the present invention;

[0031] Figure 2 It is a first perspective stereogram of the present invention;

[0032] Figure 3 It is a second viewing angle stereogram of the present invention;

[0033] Figure 4 It is a partial cross-sectional view of the positioning mechanism of the present invention;

[0034] Figure 5 It is a three-dimensional diagram of the positioning mechanism of the present invention.

[0035] Markings in the figure: 1. Base; 2. Synchronous gear; 3. Movable limit plate; 4. Synchronous toothed belt; 5. Positioning plate; 6. Lateral push cylinder; 7. Lateral push block; 8. Mold block; 9. Vertical push block; 10. Vertical push cylinder; 11. Vertical rotation rod; 12. Reset spring; 13. Horizontal rotation rod; 14. L-shaped top plate; 15. Top cylinder; 16. Limit groove; 17. Shift threaded rod; 18. Shift motor; 19. Top cavity; 20. Grinding device plate; 21. Rotation groove; 22. Adjustment groove; 23. Support rod; 24. Adjustable contact rod; 25. Docking plate; 26. Positioning rod. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0037] Embodiment 1, refer to Figure 1-5 : A semiconductor lead frame mold grinding device, comprising:

[0038] Base 1;

[0039] A grinding device plate 20, the grinding device plate 20 is fixedly connected to an edge of one end of the top of the base 1;

[0040] The positioning mechanism is provided with two groups, both of which are arranged on the base 1, and each group of positioning mechanisms includes a positioning component, a rotating component, a pushing component, a horizontal pushing block 7, a docking plate 25 and a vertical pushing block 9. A positioning plate 5 is installed on the top of the base 1, the positioning component is arranged in the positioning plate 5, the rotating component is arranged on the positioning plate 5, the pushing component is arranged on the rotating component, the horizontal pushing block 7 is installed on the pushing component, and the vertical pushing block 9 is installed on the pushing component, and the docking plate 25 is fixedly connected to one side of the top of the positioning plate 5;

[0041] A mold block 8, which is installed on the top of the two positioning plates 5;

[0042] The positioning mechanism is arranged in the base 1, and the positioning mechanism is connected to one of the positioning plates 5, and is used to adjust the position of one of the positioning plates 5. The positioning mechanism includes a limiting component, a synchronization component, two shift threaded rods 17 and a shift motor 18. The limiting component is arranged in the base 1, and the two shift threaded rods 17 are arranged in the base 1. The shift motor 18 is fixedly connected to one end of the base 1, and the output end of the shift motor 18 is fixedly connected to one end of one of the shift threaded rods 17;

[0043] Adjustment components include:

[0044] A top assembly, disposed in the positioning plate 5, for adjusting the position of the vertical push block 9; and

[0045] A reset assembly is provided in the positioning plate 5 and is used to reset the position of the lateral push block 7;

[0046] The top position assembly includes a top position cylinder 15 and an L-shaped top position plate 14. A top position cavity 19 is provided in the positioning plate 5. The top position cylinder 15 is fixedly connected to the bottom center of the top position cavity 19. The L-shaped top position plate 14 is fixedly connected to the output end of the top position cylinder 15.

[0047] The reset assembly includes a reset spring 12 and a support rod 23, the support rod 23 is fixedly connected to one side of the upper inner wall of the top cavity 19, the reset spring 12 is fixedly connected to one side of the upper inner wall of the top cavity 19, and the reset spring 12 is sleeved on the outer surface of the support rod 23;

[0048] The rotating component includes a limiting assembly, a horizontal rotating rod 13 and a vertical rotating rod 11. Rotating grooves 21 are provided on both sides of the top of the positioning plate 5. The horizontal rotating rod 13 is rotatably connected to one of the rotating grooves 21. The vertical rotating rod 11 is slidably connected to the other rotating groove 21. The limiting assembly is arranged on the vertical rotating rod 11, and the limiting assembly is connected to the rotating groove 21. An adjustable contact rod 24 is installed at one end of the bottom of the horizontal rotating rod 13.

[0049] The limiting assembly includes a positioning slot 22 and a positioning rod 26. The positioning slot 22 is provided on the vertical rotating rod 11. The positioning rod 26 is fixedly connected to one of the rotating slots 21, and the rotating slot 21 is slidably connected to the positioning slot 22.

[0050] The pushing component includes a transverse pushing cylinder 6 and a vertical pushing cylinder 10. The transverse pushing cylinder 6 is fixedly connected to the top of the transverse rotating rod 13, and the output end of the transverse pushing cylinder 6 is fixedly connected to the transverse pushing block 7. The vertical pushing cylinder 10 is fixedly connected to the top of the vertical rotating rod 11, and the output end of the vertical pushing cylinder 10 is fixedly connected to the vertical pushing block 9.

[0051] During positioning, the top cylinder 15 contracts, causing the vertical rotating rod 11 to descend and be perpendicular to the positioning plate 5. The vertical pushing block 9 is extended by the vertical pushing cylinder 10 to press and position the top of the mold block 8. When the top cylinder 15 contracts, the adjustable contact rod 24 is relaxed, and the lateral rotating rod 13 is rotated by the elastic force of the return spring 12 and is perpendicular to the positioning plate 5. The lateral pushing block 7 is extended by the lateral pushing cylinder 6 to position the side of the mold block 8. The surface of the mold block 8 is polished by the polishing mechanism installed on the grinding device plate 20.

[0052] In this embodiment: the grinding device plate 20 is installed on the base 1, and the grinding device installed on the grinding device plate 20 is used accordingly. The grinding device can be selected according to the needs, and no further details are given here. The material of the lateral pushing block 7 and the docking plate 25 is relatively soft, which will not affect the structural use of the mold block 8 and ensure the overall stability. The model of the shifting motor 18 can be selected from those available on the market as needed, and no further details are given here. The shifting motor 18 controls one of the shifting threaded rods 17 to rotate to ensure the overall use. The positioning component controls the position of the rotating part to improve the use effect, and the resetting component controls the rotating part to reset the position. The model of the top cylinder 15 can be selected from those available on the market as needed, and no further details are given here. The extension and retraction of the top cylinder 15 controls the height adjustment of the L-shaped top plate 14 to ensure the overall use. The bottom of the return spring 12 is connected to the rotating part, and the supporting rod 23 inside it ensures the position of the return spring 12 so that it will not bend. The horizontal rotating rod 13 is "L"-shaped, and the bottom of the return spring 12 is fixedly connected to the horizontal rotating rod 13. The bottom of the vertical rotating rod 11 is rotatably connected to the top end of the L-shaped top plate 14, so that the lifting and lowering of the L-shaped top plate 14 can control the movement of the vertical rotating rod 11. The adjusting groove 22 and the positioning rod 26 cooperate with each other to limit the position of the vertical rotating rod 11 during the movement to ensure the use effect. The models of the horizontal pushing cylinder 6 and the vertical pushing cylinder 10 can be selected from those available on the market as needed. I will not go into details here. The horizontal pushing cylinder 6 and the vertical pushing cylinder 10 are used to adjust the horizontal pushing block 7 and the vertical pushing block 9 respectively to control the position and use the corresponding mold block 8.

[0053] Specifically, the limiting component includes two limiting grooves 16 and a movable limiting plate 3. The two limiting grooves 16 are respectively opened on both sides of the base 1. The two ends of the movable limiting plate 3 are respectively slidably connected in the limiting grooves 16, and the two ends of the movable limiting plate 3 are respectively threadedly connected with the two displacement threaded rods 17.

[0054] In this embodiment: the two ends of the movable limiting plate 3 are respectively in the two limiting grooves 16, and the position of the movable limiting plate 3 is controlled by rotating the two displacement threaded rods 17, driving the positioning plate 5 thereon to move the position, thereby completing the corresponding adjustment of the sizes of different mold blocks 8.

[0055] Specifically, the synchronous component includes two synchronous gears 2 and a synchronous belt 4. Each synchronous gear 2 is fixedly connected to one end of each shift threaded rod 17. The synchronous belt 4 is sleeved on the two synchronous gears 2, and the synchronous belt 4 and the two synchronous gears 2 are meshed with each other.

[0056] In this embodiment, the two synchronous gears 2 have the same size, and the two synchronous gears 2 are rotated synchronously by the synchronous toothed belt 4, so as to control the two shifting threaded rods 17 to rotate synchronously.

[0057] A semiconductor lead frame mold grinding method comprises the following steps:

[0058] Step 1, size correspondence: according to the size of the mold block 8, the relative distance between the two positioning plates 5 is adjusted. During the adjustment, the shift motor 18 controls one of the shift threaded rods 17 to rotate, and the two shift threaded rods 17 are rotated synchronously through the two synchronous gears 2 and the synchronous toothed belt 4, so that the movable limit plate 3 moves in the two limit grooves 16, and the position of one of the positioning plates 5 is adjusted, and the distance between the two positioning plates 5 is changed to ensure the positioning of both ends of the mold block 8;

[0059] Step 2, position fixing: the mold block 8 is positioned by two sets of positioning mechanisms. When positioning, the top cylinder 15 contracts to make the vertical rotating rod 11 descend and be perpendicular to the positioning plate 5. The vertical pushing cylinder 10 extends the vertical pushing block 9 to press and position the top of the mold block 8. When the top cylinder 15 contracts, the adjustable contact rod 24 is loosened, and the lateral rotating rod 13 rotates by the elastic force of the return spring 12 and is perpendicular to the positioning plate 5. The lateral pushing block 7 is extended by the lateral pushing cylinder 6 to position the side of the mold block 8, thereby completing the overall positioning of the mold block 8.

[0060] Step 3: Grinding: The surface of the mold block 8 is grinded by a grinding mechanism installed on the grinding device plate 20 .

[0061] The control method of the present invention is to control by manually starting and closing the switch. The wiring diagram of the power element and the provision of power supply are common knowledge in the field, and the present invention is mainly used to protect mechanical devices, so the present invention will no longer explain the control method and wiring layout in detail.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor lead frame mold grinding device, characterized in that: include: Base (1); A grinding device plate (20), wherein the grinding device plate (20) is fixedly connected to an edge of one end of the top of the base (1); A positioning mechanism, wherein two groups are provided, both groups of the positioning mechanisms are provided on a base (1), each group of the positioning mechanisms comprises a positioning component, a rotating component, a pushing component, a lateral pushing block (7), a docking plate (25) and a vertical pushing block (9), a positioning plate (5) is installed on the top of the base (1), the positioning component is provided in the positioning plate (5), the rotating component is provided on the positioning plate (5), the pushing component is provided on the rotating component, the lateral pushing block (7) is installed on the pushing component, the vertical pushing block (9) is installed on the pushing component, and the docking plate (25) is fixedly connected to one side of the top of the positioning plate (5); A mold block (8), wherein the mold block (8) is mounted on the top of the two positioning plates (5); A positioning mechanism is arranged in the base (1), and the positioning mechanism is connected to one of the positioning plates (5) for adjusting the position of one of the positioning plates (5), the positioning mechanism comprising a limiting component, a synchronization component, two shift threaded rods (17) and a shift motor (18), the limiting component is arranged in the base (1), the two shift threaded rods (17) are both arranged in the base (1), the shift motor (18) is fixedly connected to one end of the base (1), and the output end of the shift motor (18) is fixedly connected to one end of one of the shift threaded rods (17); The positioning component comprises: A top position assembly is arranged in the positioning plate (5) and is used to adjust the position of the vertical push block (9); as well as A reset assembly is disposed in the positioning plate (5) and is used to reset the position of the lateral push block (7); The jacking assembly comprises a jacking cylinder (15) and an L-shaped jacking plate (14); a jacking cavity (19) is provided in the positioning plate (5); the jacking cylinder (15) is fixedly connected to the bottom center of the jacking cavity (19); and the L-shaped jacking plate (14) is fixedly connected to the output end of the jacking cylinder (15); The reset assembly comprises a reset spring (12) and a support rod (23), wherein the support rod (23) is fixedly connected to one side of an upper inner wall of the top cavity (19), the reset spring (12) is fixedly connected to one side of an upper inner wall of the top cavity (19), and the reset spring (12) is sleeved on the outer surface of the support rod (23); The rotating component comprises a limiting component, a transverse rotating rod (13) and a vertical rotating rod (11); rotating grooves (21) are provided on both sides of the top of the positioning plate (5); the transverse rotating rod (13) is rotatably connected to one of the rotating grooves (21); the vertical rotating rod (11) is slidably connected to the other rotating groove (21); the limiting component is arranged on the vertical rotating rod (11), and the limiting component is connected to the rotating groove (21); an adjustable contact rod (24) is installed at one end of the bottom of the transverse rotating rod (13); The limiting assembly comprises a positioning groove (22) and a positioning rod (26), wherein the positioning groove (22) is formed on the vertical rotating rod (11), the positioning rod (26) is fixedly connected to one of the rotating grooves (21), and the rotating groove (21) is slidably connected to the positioning groove (22); The pushing component comprises a transverse pushing cylinder (6) and a vertical pushing cylinder (10), wherein the transverse pushing cylinder (6) is fixedly connected to the top of the transverse rotating rod (13), and the output end of the transverse pushing cylinder (6) is fixedly connected to the transverse pushing block (7), and the vertical pushing cylinder (10) is fixedly connected to the top of the vertical rotating rod (11), and the output end of the vertical pushing cylinder (10) is fixedly connected to the vertical pushing block (9); During positioning, the top cylinder (15) contracts, causing the vertical rotating rod (11) to descend and become perpendicular to the positioning plate (5). The vertical pushing cylinder (10) extends the vertical pushing block (9) to press and position the top of the mold block (8). When the top cylinder (15) contracts, the adjustable contact rod (24) is relaxed, and the lateral rotating rod (13) rotates by the elastic force of the return spring (12) and becomes perpendicular to the positioning plate (5). The lateral pushing cylinder (6) extends the lateral pushing block (7) to position the side of the mold block (8). The surface of the mold block (8) is polished by the polishing mechanism installed on the polishing device plate (20).

2. A semiconductor lead frame mold grinding device as claimed in claim 1, characterized in that: The limiting component comprises two limiting grooves (16) and a movable limiting plate (3), wherein the two limiting grooves (16) are respectively arranged on two sides of the base (1), and the two ends of the movable limiting plate (3) are respectively slidably connected in the limiting grooves (16), and the two ends of the movable limiting plate (3) are respectively threadedly connected to the two displacement threaded rods (17).

3. A semiconductor lead frame mold grinding device as claimed in claim 1, characterized in that: The synchronous component comprises two synchronous gears (2) and a synchronous toothed belt (4); each of the synchronous gears (2) is fixedly connected to one end of each shift threaded rod (17); the synchronous toothed belt (4) is sleeved on the two synchronous gears (2); and the synchronous toothed belt (4) and the two synchronous gears (2) are meshed with each other.

4. A semiconductor lead frame mold grinding method, characterized in that: A semiconductor lead frame mold grinding device according to any one of claims 1 to 3 is used, comprising the following steps: S1. Size correspondence: According to the size of the mold block (8), the relative distance between the two positioning plates (5) is adjusted. During the adjustment, the shift motor (18) controls one of the shift threaded rods (17) to rotate, and the two shift threaded rods (17) are rotated synchronously through two synchronous gears (2) and a synchronous toothed belt (4), so that the movable limit plate (3) moves in the two limit grooves (16), and the position of one of the positioning plates (5) is adjusted, and the distance between the two positioning plates (5) is changed, so as to ensure that both ends of the mold block (8) are positioned; S2. Position fixing: The mold block (8) is positioned by two sets of positioning mechanisms. During positioning, the top cylinder (15) is retracted to make the vertical rotating rod (11) descend and become perpendicular to the positioning plate (5). The vertical pushing cylinder (10) is used to extend the vertical pushing block (9) so that the top of the mold block (8) is pressed and positioned. When the top cylinder (15) is retracted, the adjustable contact rod (24) is released, and the lateral rotating rod (13) is rotated by the elastic force of the return spring (12) and becomes perpendicular to the positioning plate (5). The lateral pushing block (7) is extended by the lateral pushing cylinder (6) so that the side of the mold block (8) is positioned, thereby completing the overall positioning of the mold block (8). S3, grinding: grinding the surface of the mold block (8) by means of a grinding mechanism installed on the grinding device plate (20).

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