Method for rapidly manufacturing micro-nano channels and method for preparing micro-nano ridges

Abstract

The invention relates to a method for rapidly manufacturing micro-nano channels and a method for preparing micro-nano ridges; a method for rapidly manufacturing array micro-nano channels, cross-type array micro-nano channels and array micro-nano ridges at low cost; using PDMS flexible material as a substrate and BN series photoresist as a target material, the array micro-nano channels can be directly obtained through a simple stripping process; changing the stripping starting point can obtain the cross-type array micro-nano channels without affecting the original pattern; stripping and removing the BN series photoresist can obtain the array micro-nano ridges. The method for rapidly manufacturing micro-nano channels and the method for preparing micro-nano ridges of the invention are highly efficient and innovative, low in cost, easy to implement, and have great application potential and commercial value.

Description

Technical Field

[0001] The invention relates to the field of micro-electromechanical technology, and in particular to a method for rapidly manufacturing micro-nano channels and a method for preparing micro-nano ridges. Background Art

[0002] Nanofabrication technology can manufacture nanoscale structures with high precision, and nanostructures and devices have a wide range of applications in optical devices, metamaterials, nanofluids, and biomedicine due to their excellent physical properties and unique structural characteristics. Therefore, nanofabrication technology is very important to meet the urgent needs of various applications.

[0003] Currently, nano-manufacturing technologies mostly use high-precision ion beam direct writing, electron beam exposure and laser direct writing methods, etc. However, these methods all rely on expensive experimental equipment, greatly increasing the manufacturing process cost, and also have the characteristics of serial time-consuming process. Summary of the invention

[0004] The present invention overcomes the deficiencies of the prior art and provides a method for rapidly manufacturing micro-nano channels and a method for preparing micro-nano ridges, which are highly efficient and innovative, low-cost, easy to implement, and have great application potential and commercial value.

[0005] To achieve the above object, the technical solution adopted by the present invention is: a method for rapidly manufacturing micro-nano channels, comprising the following steps:

[0006] Step 1, obtaining a flexible layer composite substrate, wherein the flexible layer composite substrate comprises a substrate and a flexible substrate layer disposed on the substrate, and spin coating a photoresist on the surface of the flexible substrate layer;

[0007] Step 2, heating the flexible layer assembly substrate on which the photoresist is spin-coated;

[0008] Step 3, cooling the flexible layer composite substrate with photoresist processed in step 2 to room temperature;

[0009] Step 4, pull up and peel off the flexible base layer with photoresist on the flexible layer composite substrate with photoresist processed in step 3 from one side of the flexible base layer to the other side opposite to form a plurality of array micro-nano channels on the photoresist on the flexible base layer.

[0010] In a preferred embodiment of the present invention, after step 4, the method further comprises placing the flexible substrate layer with arrayed micro-nano channels and photoresist under ultraviolet light and exposing the layer for 3 to 4 minutes to cure the photoresist.

[0011] In a preferred embodiment of the present invention, when the flexible base layer in the flexible layer combined substrate is a PDMS flexible base layer, the base is a glass base; the preparation method of the base comprises the following steps:

[0012] Step a1, stirring PDMS and curing agent in a volume ratio of 5:1 to 10:1 for 5 to 10 minutes to obtain a PDMS mixed solution,

[0013] Step a2, placing the PDMS mixture in a vacuum environment for 20 to 30 minutes to remove excess bubbles in the PDMS mixture;

[0014] Step a3, pouring the PDMS mixed solution after the operation in step a2 onto the glass substrate, and then placing the glass substrate with the PDMS mixed solution in a vacuum environment for 20 to 30 minutes to remove bubbles generated in the PDMS mixed solution during the process operation;

[0015] Step a4, then placing the glass substrate with the PDMS mixed liquid after the operation in step a3 in a horizontal oven at 60~80℃ for curing for 2~4h; then cooling to room temperature, using a coating tool to remove the PDMS material with uneven edges to obtain a glass substrate coated with a PDMS flexible base layer and use it as a flexible layer composite substrate.

[0016] In a preferred embodiment of the present invention, the photoresist layer spin-coated on the flexible substrate layer in step 1 is a BN series photoresist, wherein the photoresist is spin-coated at a speed of 1000-5000 rpm and the spin-coating time is 30 s;

[0017] In step 2, the step of heating the flexible layer combined substrate spun with photoresist includes: placing the flexible base layer spun with photoresist on a horizontal hot plate at 65-85° C. for pre-baking for 20-30 minutes, and removing excess solvent in the photoresist.

[0018] In a preferred embodiment of the present invention, in step 4, pulling up and peeling off the flexible substrate layer with photoresist from one side of the flexible substrate layer to the other opposite side on the substrate comprises the following steps: pulling up and peeling off the flexible substrate layer with photoresist from left to right or from right to left on the substrate to obtain an array of micro-nano channels;

[0019] And / or, in step 4, pulling and peeling the flexible substrate layer with photoresist on the substrate from one side of the flexible substrate layer to the other opposite side includes the following steps: pulling and peeling the flexible substrate layer with photoresist on the substrate from left to right or from right to left to obtain an array of micro-nano channels, and then pulling and peeling the flexible substrate layer with photoresist on the substrate in a diagonal direction to obtain a cross-array of micro-nano channels.

[0020] In a preferred embodiment of the present invention, the photoresist is pulled up and peeled off from the flexible substrate layer at a uniform speed, thereby obtaining an array of micro-nano channels with equal spacing;

[0021] And / or, the pulling and peeling angle between the pulled-up flexible substrate layer portion and the unpulled flexible substrate layer portion is 45° to 135°.

[0022] In a preferred embodiment of the present invention, the BN series photoresist can be replaced by RFJ series photoresist, AZ series photoresist, BP series photoresist, or SU-8 series photoresist, PMMA series photoresist;

[0023] And / or, the PDMS flexible substrate layer can be replaced with a sealing film, a PET flexible substrate, a PI flexible substrate, a PMMA flexible film, a hydrogel film, or a rubber layer;

[0024] And / or, the glass substrate can be replaced with a PMMA board, a PET board, or a PI board;

[0025] And / or, the pulled-up peeling angle between the pulled-up flexible substrate layer portion and the unpulled flexible substrate layer portion is 90°.

[0026] In a preferred embodiment of the present invention, a micro-nano channel is prepared by using a method for rapidly manufacturing a micro-nano channel.

[0027] In a preferred embodiment of the present invention, a method for rapidly manufacturing micro-nano ridges is provided. Based on the method for rapidly manufacturing micro-nano channels, after obtaining array micro-nano channels on a flexible substrate layer and before ultraviolet exposure, the photoresist is stripped off and removed from the flexible substrate layer to obtain an array micro-nano ridge on the flexible substrate layer; after obtaining the array micro-nano ridges, the flexible substrate layer with the array micro-nano ridges is placed under ultraviolet light to expose the array micro-nano ridges on the flexible substrate layer to cure the photoresist of the array micro-nano ridges.

[0028] In a preferred embodiment of the present invention, a micro-nano ridge is prepared by using the method for rapidly manufacturing micro-nano ridges.

[0029] The present invention solves the defects existing in the technical background, and the beneficial technical effects of the present invention are:

[0030] The method for rapidly manufacturing micro-nano channels and the method for preparing micro-nano ridges of the present invention are highly efficient, innovative, low-cost, easy to implement, and have great application potential and commercial value.

[0031] The present invention discloses a method for rapidly manufacturing array micro-nano channels, cross-array micro-nano channels and array micro-nano ridges. The present invention uses a flexible material as a substrate and a BN series photoresist as a target material. The array micro-nano channels can be directly obtained through a simple stripping process; the cross-array micro-nano channels can be obtained without affecting the original pattern by changing the stripping starting point; the array micro-nano ridges can be obtained by stripping and removing the BN series photoresist. The method is efficient, innovative, low-cost and easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0033] Figure 1 It is a process flow chart for manufacturing a PDMS flexible substrate in a preferred embodiment of the present invention.

[0034] Figure 2 It is a process flow chart for preparing cross-array micro-nano channels in a preferred embodiment of the present invention.

[0035] Figure 3 It is a process flow chart for preparing array micro-nano channels in a preferred embodiment of the present invention.

[0036] Figure 4 It is a process flow chart for preparing array micro-nano ridges in a preferred embodiment of the present invention.

[0037] Figure 5 It is a microscope picture of the preparation of array micro-nano channels in a preferred embodiment of the present invention.

[0038] Figure 6 It is a microscope picture of the preparation of the cross-array micro-nano channels in the preferred embodiment of the present invention.

[0039] Figure 7 It is a microscope picture of the preparation of array micro-nano ridges in a preferred embodiment of the present invention.

[0040] Figure 8 It is a metallographic microscope image of an array of micro-nano channels prepared using AZ series photoresists in a preferred embodiment of the present invention.

[0041] Fig. 9 It is a metallographic microscope image of an array of micro-nano channels prepared using BP series photoresists in a preferred embodiment of the present invention.

[0042] Fig.10 It is a metallographic microscope image of an array of micro-nano channels prepared by using a BN series photoresist in a preferred embodiment of the present invention.

[0043] Fig.11 It is a metallographic microscope image of an array of micro-nano channels prepared using SU-8 photoresist in a preferred embodiment of the present invention.

[0044] Fig.12 It is a schematic curve of the line spacing of the channels produced on the BN series photoresist corresponding to different thicknesses of the PDMS flexible substrate layer when the BN series photoresist is used to prepare the array micro-nano channels under different spin coating speeds in the preferred embodiment of the present invention.

[0045] Fig.13 It is a schematic curve of the line spacing of the channels produced on the BN series photoresist at different pull-up and peeling angles when the BN series photoresist is used to prepare the array micro-nano channels in the preferred embodiment of the present invention.

[0046] Fig.14 It is a schematic curve of the depth and width of the channel produced on the BN series photoresist at different pull-up and peeling angles when the BN series photoresist is used to prepare the array micro-nano channel in the preferred embodiment of the present invention, when the spin coating speed is 3000 rpm and the PDMS thickness is 1 mm.

[0047] Fig.15 It is a parameter curve of the height and width of the micro-nano ridge when the BN series photoresist is used to prepare the micro-nano ridge in the preferred embodiment of the present invention, the spin coating speed is 5000 rpm, and the PDMS thickness is 0.5 mm.

[0048] In the figure: 1-glass substrate; 2-PDMS flexible substrate; 3-BN series photoresist; 4-array micro-nano channels; 5-ultraviolet light; 6-cross array micro-nano channels; 7-array micro-nano ridges, 8-oven. DETAILED DESCRIPTION

[0049] The present invention will now be further described in detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention. Embodiment 1

[0050] like Figure 1-Figure 11 As shown, a method for rapidly manufacturing a micro-nano channel comprises the following steps:

[0051] Step 1, obtaining a flexible layer composite substrate, the flexible layer composite substrate comprising a substrate and a flexible substrate layer arranged on the substrate, and spin coating a photoresist on the surface of the flexible substrate layer. The photoresist spin-coated on the flexible substrate layer adopts BN series photoresist 3, wherein the spin coating speed of the photoresist is 1000-5000 rpm, and the spin coating time is 30s.

[0052] Specifically, when the flexible base layer in the flexible layer combined substrate is a PDMS flexible base layer, the base is a glass base; the preparation method of the base includes the following steps:

[0053] Step a1, stirring PDMS and a curing agent in a volume ratio of 5:1 to 10:1 for 5 to 10 minutes to obtain a PDMS mixed solution;

[0054] Step a2, placing the PDMS mixture in a vacuum environment for 20 to 30 minutes to remove excess bubbles in the PDMS mixture;

[0055] Step a3, pouring the PDMS mixed solution after the operation in step a2 onto the glass substrate 1, and then placing the glass substrate with the PDMS mixed solution in a vacuum environment for 20 to 30 minutes to remove bubbles generated in the PDMS mixed solution during the process operation;

[0056] Step a4, then placing the glass substrate with the PDMS mixed liquid after the operation in step a3 in a horizontal oven 8 at 60~80°C for curing for 2~4h; then cooling to room temperature, using a coating tool to remove the PDMS material with uneven edges to obtain a glass substrate 1 coated with a PDMS flexible substrate layer 2 and used as a flexible layer composite substrate.

[0057] Step 2, heating the flexible layer composite substrate spun with photoresist. The step of heating the flexible layer composite substrate spun with photoresist includes: placing the flexible base layer spun with photoresist on a horizontal hot plate at 65-85°C for 20-30 minutes, and removing excess solvent in the photoresist.

[0058] Step 3, cooling the flexible layer composite substrate with photoresist processed in step 2 to room temperature.

[0059] Step 4, the flexible base layer with photoresist on the flexible layer composite substrate with photoresist processed in step 3 is pulled up and peeled off from one side of the flexible base layer to the other side opposite thereto, and a plurality of array micro-nano channels 4 are formed on the photoresist on the flexible base layer.

[0060] Working principle:

[0061] In this embodiment, Figure 8 This is a metallographic microscope image of an array of micro-nano channels 4 prepared using AZ series photoresists. Fig. 9 It is a metallographic microscope image of array micro-nano channels 4 prepared using BP series photoresists. Fig.10 It is a metallographic microscope image of an array micro-nano channel 4 prepared using a BN series photoresist. Fig.11 This is a metallographic microscope image of an array of micro-nano channels 4 prepared using SU-8 photoresist. Figure 8-Figure 11 As shown, the effect of preparing array micro-nano channels 4 and array micro-nano ridges 7 by BN series photoresist is better than that by AZ series photoresist, BP series photoresist and SU-8 photoresist, and the obtained array micro-nano channels 4 have a more stable structure and a higher degree of alignment.

[0062] In this embodiment, the BN series photoresist is less brittle than SU-8 photoresist and has a certain toughness. When it is pulled up and peeled off, cracks are generated to generate micro-nano channels 4. In addition, the preparation method of the present application is simple to operate, and no additional stress concentration points need to be pre-made. The array micro-nano channels 4 can be obtained by directly peeling off. Embodiment 2

[0063] On the basis of the first embodiment, after step 4, the method further includes placing the flexible substrate layer with the array micro-nano channels 4 under ultraviolet light 5 and exposing it for 3 to 4 minutes to cure the photoresist. Preferably, in this embodiment, the photoresist is cured by exposing it for 4 minutes. Embodiment 3

[0064] like Figure 1-Figure 4 As shown, a method for rapidly manufacturing a micro-nano channel comprises the following steps:

[0065] Step 1, obtaining a flexible layer composite substrate, the flexible layer composite substrate comprising a substrate and a flexible substrate layer arranged on the substrate, and spin coating a photoresist on the surface of the flexible substrate layer. The photoresist spin-coated on the flexible substrate layer adopts BN series photoresist 3, wherein the spin coating speed of the photoresist is 1000-5000 rpm, and the spin coating time is 30s. Preferably, in this embodiment, the spin coating speed of the photoresist is 3000 rpm;

[0066] When the flexible base layer in the flexible layer combined substrate is a PDMS flexible base layer 3, the base is a glass base; the preparation method of the base comprises the following steps:

[0067] Step a1, stirring PDMS and curing agent in a volume ratio of 5:1 to 10:1 for 5 to 10 minutes to obtain a PDMS mixed solution. The volume ratio of PDMS to curing agent can be 5:1, or 7:1, or 7.5:1, or 8:1, or 10:1; in this embodiment, the volume ratio of PDMS to curing agent is preferably 7.5:1; stirring for 8 minutes;

[0068] Step a2, placing the PDMS mixture in a vacuum environment for 20 to 30 minutes; preferably, in this embodiment, placing the PDMS mixture in a vacuum environment for 25 minutes; removing excess bubbles in the PDMS mixture;

[0069] Step a3, pouring the PDMS mixed solution after the operation in step a2 onto the glass substrate, and then placing the glass substrate with the PDMS mixed solution in a vacuum environment for 20 to 30 minutes; preferably, in this embodiment, placing it in a vacuum environment for 25 minutes; removing bubbles generated in the PDMS mixed solution during the process operation;

[0070] Step a4, then placing the glass substrate with the PDMS mixed liquid after the operation in step a3 in a horizontal oven 8 at 60-80°C for curing for 2-4 hours; preferably, in this embodiment, placing it in a horizontal oven 8 at 70°C for curing for 3 hours; then cooling to room temperature, using a coating tool to remove the PDMS material with uneven edges to obtain a glass substrate coated with a PDMS flexible substrate layer 2 and use it as a flexible layer composite substrate.

[0071] Step 2, heating the flexible layer composite substrate spun with photoresist. The step of heating the flexible layer composite substrate spun with photoresist includes: placing the flexible base layer spun with photoresist on a 65-85°C horizontal hot plate for pre-baking for 20-30 minutes; preferably, in this embodiment, placing it on a 75°C horizontal hot plate for pre-baking for 25 minutes; removing excess solvent in the photoresist.

[0072] Step 3, cooling the flexible layer composite substrate with photoresist processed in step 2 to room temperature;

[0073] Step 4, pull up and peel off the flexible base layer with photoresist on the flexible layer composite substrate with photoresist processed in step 3 from left to right or from right to left on the substrate, and form a plurality of array micro-nano channels 4 on the photoresist on the flexible base layer.

[0074] After step 4, the method further includes placing the flexible substrate layer with the array micro-nano channels 4 under ultraviolet light 5 and exposing it for 3 to 4 minutes to cure the photoresist. Preferably, in this embodiment, the photoresist is cured by exposing it for 4 minutes. Embodiment 4

[0075] like Figure 1-Figure 4 As shown, a method for rapidly manufacturing a micro-nano channel comprises the following steps:

[0076] Step 1, obtaining a flexible layer composite substrate, the flexible layer composite substrate comprising a substrate and a flexible substrate layer arranged on the substrate, and spin coating a photoresist on the surface of the flexible substrate layer. The photoresist spin-coated on the flexible substrate layer adopts BN series photoresist 3, wherein the spin coating speed of the photoresist is 2500-3500 rpm, and the spin coating time is 30s. Preferably, in this embodiment, the spin coating speed of the photoresist is 3000 rpm;

[0077] When the flexible base layer in the flexible layer combined substrate is a PDMS flexible base layer 3, the base is a glass base; the preparation method of the base comprises the following steps:

[0078] Step a1, stirring PDMS and curing agent in a volume ratio of 5:1 to 10:1 for 8 minutes to obtain a PDMS mixed solution. Further, the volume ratio of PDMS and curing agent can be 5:1, or 7:1, or 7.5:1, or 8:1, or 10:1. In this embodiment, the volume ratio of PDMS and curing agent is preferably 7.5:1;

[0079] Step a2, placing the PDMS mixture in a vacuum environment for 25 minutes to remove excess bubbles in the PDMS mixture;

[0080] Step a3, pouring the PDMS mixed solution after the operation in step a2 onto the glass substrate, and then placing the glass substrate with the PDMS mixed solution in a vacuum environment for 25 minutes to remove bubbles generated in the PDMS mixed solution during the process operation;

[0081] Step a4, then place the glass substrate with the PDMS mixed liquid after the operation in step a3 in a horizontal oven 8 at 70°C for curing for 3 hours; then cool to room temperature, use a coating tool to remove the PDMS material with uneven edges, and obtain a glass substrate coated with a PDMS flexible base layer 2 as a flexible layer composite substrate.

[0082] Step 2, heating the flexible layer composite substrate spun with photoresist. The step of heating the flexible layer composite substrate spun with photoresist includes: placing the flexible base layer spun with photoresist on a 75° C. horizontal hot plate for pre-baking for 25 minutes, and removing excess solvent in the photoresist.

[0083] Step 3, cooling the flexible layer composite substrate with photoresist processed in step 2 to room temperature;

[0084] Step 4, pull up and peel off the flexible base layer with photoresist on the flexible layer composite substrate with photoresist processed in step 3 from left to right or from right to left on the substrate, and form a plurality of array micro-nano channels 4 on the photoresist on the flexible base layer.

[0085] After step 4, the method further includes placing the flexible substrate layer with the array micro-nano channels 4 under ultraviolet light 5 and exposing it for 3.5 minutes to cure the photoresist. Embodiment 5

[0086] like Figure 1-Figure 4 As shown, in step 4, the flexible substrate layer with photoresist is pulled up and peeled off from one side of the flexible substrate layer to the other side opposite to the flexible substrate layer on the substrate, including the following steps:

[0087] The flexible substrate layer with photoresist is pulled up and peeled off from left to right or from right to left on the substrate to obtain an array of micro-nano channels 4, and then the flexible substrate layer with photoresist is pulled up and peeled off in a diagonal direction on the substrate to obtain a cross-array of micro-nano channels 6.

[0088] After step 4, the method further includes placing the flexible substrate layer with the cross-array micro-nano channels 6 under ultraviolet light 5 and exposing it for 3 to 4 minutes to cure the photoresist. Preferably, in this embodiment, the photoresist is cured by exposing it for 4 minutes. Embodiment 6

[0089] On the basis of any one of the first to fifth embodiments, the photoresist is pulled up and peeled off from the flexible substrate layer at a uniform speed, thereby obtaining an equidistant array of micro-nano channels 4 or an equidistant cross array of micro-nano channels 6 . Embodiment 7

[0090] The BN series photoresist 3 of any one of the first to sixth embodiments can be replaced with RFJ series photoresist, AZ series photoresist, BP series photoresist, SU-8 series photoresist, or PMMA series photoresist. The PDMS flexible substrate layer 2 of any one of the first to sixth embodiments can be replaced with a sealing film, a PET flexible substrate, a PI flexible substrate, a PMMA flexible film, a hydrogel film, or a rubber layer. The glass substrate of any one of the first to sixth embodiments can be replaced with a PMMA board, a PET board, or a PI board.

[0091] like Figure 8 This is a metallographic microscope image of an array of micro-nano channels prepared using AZ series photoresists. Fig. 9 This is a metallographic microscope image of an array of micro-nano channels prepared using BP series photoresists. Fig.10 This is a metallographic microscope image of an array of micro-nano channels prepared using BN series photoresists. Fig.11 This is a metallographic microscope image of an array of micro-nano channels made with SU-8 photoresist. Figure 8-Figure 11 As shown, the effect of preparing array micro-nano channels 4 and array micro-nano ridges 7 by BN series photoresists is better than that by AZ series photoresists, BP series photoresists, and SU-8 photoresists. The obtained array micro-nano channels 4 and array micro-nano ridges 7 have more stable structures and higher collimation. Embodiment 8

[0092] A method for preparing micro-nano ridges based on any one of the first to seventh embodiments, after obtaining the array micro-nano channels 4 on the flexible substrate layer and before UV exposure and curing, the photoresist is stripped off from the flexible substrate layer to obtain the array micro-nano ridges 7 on the flexible substrate layer. After obtaining the array micro-nano ridges 7, the flexible substrate layer with the array micro-nano ridges 7 is placed under UV light 5, and the array micro-nano ridges 7 on the flexible substrate layer are exposed for 3 to 4 minutes to cure the photoresist of the array micro-nano ridges 7. Preferably, in this embodiment, the photoresist of the array micro-nano ridges 7 is cured by exposure for 4 minutes. Embodiment 9

[0093] On the basis of any one of the first to eighth embodiments, a pulling and peeling angle between the pulled-up flexible base layer portion and the unpulled-up flexible base layer portion is 45° to 135°. Fig.13 : is a schematic curve of the line spacing of the channels generated on the BN series photoresist at different pull-up and peeling angles when the BN series photoresist is used to prepare the array micro-nano channels in the preferred embodiment of the present invention, wherein the pull-up and peeling angle is the angle between the pulled-up flexible substrate layer part and the unpulled flexible substrate layer part, such as Fig.13 The pull-up peeling angle has little effect on the line spacing. Fig.14 1 is a schematic curve of the depth and width of the channel produced on the BN series photoresist at different pull-up and peeling angles when the BN series photoresist is used to prepare the array micro-nano channel in the preferred embodiment of the present invention, when the spin coating speed is 3000 rpm and the PDMS thickness is 1 mm, wherein the pull-up and peeling angle is the angle between the pulled-up flexible substrate layer part and the unpulled flexible substrate layer part, such as Fig.14 The pull-up peeling angle has a significant effect on the depth and width of the channel, and the pull-up peeling angle can be 45° to 135°. In a preferred embodiment, when the pull-up peeling angle is close to 90°, the depth of the channel is relatively deeper and the width is relatively wider than when the pull-up peeling angle is close to 45° or 135°. Embodiment 10

[0094] On the basis of any one of Embodiments 1 to 9, a micro-nano channel is prepared by using the method for rapidly manufacturing a micro-nano channel. Embodiment 11

[0095] On the basis of any one of Embodiments 1 to 9, a micro-nano ridge is prepared by using the method for preparing a micro-nano ridge.

[0096] Working principle:

[0097] The method for rapidly manufacturing micro-nano channels and the method for preparing micro-nano ridges of the present invention are highly efficient, innovative, low-cost, easy to implement, and have great application potential and commercial value.

[0098] The present invention discloses a method for rapidly manufacturing array micro-nano channels 4, cross-type array micro-nano channels 6 and array micro-nano ridges 7. The present invention uses a flexible material as a substrate and a BN series photoresist 3 as a target material. The array micro-nano channels 6 can be directly obtained through a simple stripping process; the cross-type array micro-nano channels 6 can be obtained without affecting the original pattern by changing the stripping starting point; the array micro-nano ridges 7 can be obtained by stripping and removing the BN series photoresist 3. The method is efficient, innovative, low-cost and easy to implement.

[0099] The above specific implementation methods are specific support for the scheme ideas proposed in the present invention, and cannot be used to limit the protection scope of the present invention. Any equivalent changes or equivalent modifications made on the basis of this technical scheme in accordance with the technical ideas proposed in the present invention still fall within the scope of protection of the technical scheme of the present invention.

Claims

1. A method for rapidly manufacturing micro-nano channels, characterized in that: The following steps are involved: Step 1, obtaining a flexible layer composite substrate, wherein the flexible layer composite substrate comprises a substrate and a flexible substrate layer disposed on the substrate, and spin coating a photoresist on the surface of the flexible substrate layer; Step 2, heating the flexible layer assembly substrate on which the photoresist is spin-coated; Step 3, cooling the flexible layer composite substrate with photoresist processed in step 2 to room temperature; Step 4, pulling up and peeling the flexible base layer with photoresist on the flexible layer composite substrate with photoresist processed in step 3 from one side of the flexible base layer to the other side opposite thereto, and forming a plurality of array micro-nano channels (6) on the photoresist on the flexible base layer; The process of pulling the flexible substrate layer with the photoresist from one side of the flexible substrate layer to the other side on the substrate comprises the following steps: The flexible substrate layer with photoresist is pulled up and peeled off from left to right or from right to left on the substrate to obtain an array of micro-nano channels (6); And / or, in step 4, the step of pulling the flexible substrate layer with the photoresist from one side of the flexible substrate layer to the other side on the substrate to peel it off comprises the following steps: The flexible substrate layer with photoresist is pulled up and peeled off from left to right or from right to left on the substrate to obtain an array of micro-nano channels (6), and then the flexible substrate layer with photoresist is pulled up and peeled off in a diagonal direction on the substrate to obtain a cross-array of micro-nano channels (6).

2. The method for rapidly manufacturing micro-nano channels according to claim 1, characterized in that: After step 4, the method further includes placing the flexible substrate layer with the arrayed micro-nano channels (6) and photoresist under ultraviolet light (5) and exposing the layer for 3 to 4 minutes to cure the photoresist.

3. The method for rapidly manufacturing micro-nano channels according to claim 1, characterized in that: When the flexible base layer in the flexible layer composite substrate is a PDMS flexible base layer (2), and the substrate is a glass substrate (1), the method for preparing the flexible layer composite substrate comprises the following steps: Step a1, stirring PDMS and curing agent in a volume ratio of 5:1 to 10:1 for 5 to 10 minutes to obtain a PDMS mixed solution, Step a2, placing the PDMS mixture in a vacuum environment for 20 to 30 minutes to remove excess bubbles in the PDMS mixture; Step a3, pouring the PDMS mixed solution after the operation in step a2 onto the glass substrate (1), and then placing the glass substrate (1) with the PDMS mixed solution in a vacuum environment for 20 to 30 minutes to remove bubbles generated in the PDMS mixed solution during the process operation; Step a4, subsequently placing the glass substrate (1) with the PDMS mixed liquid after the operation in step a3 in a horizontal oven (8) at 60-80° C. for curing for 2-4 hours; then cooling to room temperature, using a coating tool to remove the PDMS material with uneven edges, to obtain a glass substrate (1) coated with a PDMS flexible base layer (2) and used as a flexible layer composite substrate.

4. The method for rapidly manufacturing micro-nano channels according to claim 3, characterized in that: In step 1, a layer of photoresist is spin-coated on the flexible substrate layer using a BN series photoresist (3), wherein the photoresist is spin-coated at a speed of 1000-5000 rpm and the spin-coating time is 30 s; In step 2, the step of heating the flexible layer composite substrate spun with photoresist includes: placing the flexible layer composite substrate spun with photoresist on a horizontal hot plate at 65-85° C. for forward baking for 20-30 minutes, and removing excess solvent in the photoresist.

5. The method for rapidly manufacturing micro-nano channels according to claim 4, characterized in that: The photoresist is pulled up and peeled off from the flexible substrate layer at a uniform speed, thereby obtaining an array of micro-nano channels (6) with equal spacing; The pulling and peeling angle between the pulled-up flexible substrate layer portion and the unpulled flexible substrate layer portion is 45° to 135°.

6. The method for rapidly manufacturing micro-nano channels according to claim 5, characterized in that: The BN series photoresist (3) can be replaced by RFJ series photoresist, AZ series photoresist, BP series photoresist, SU-8 series photoresist, PMMA series photoresist; And / or, the PDMS flexible substrate layer (2) can be replaced by a sealing film, a PET flexible substrate, a PI flexible substrate, a PMMA flexible film, a hydrogel film, or a rubber layer; And / or, the glass substrate (1) can be replaced by a PMMA board, a PET board, or a PI board; And / or, the pulled-up peeling angle between the pulled-up flexible substrate layer portion and the unpulled flexible substrate layer portion is 90°.

7. A micro-nano channel, characterized in that: The micro-nano channel is prepared by using the method for rapidly manufacturing a micro-nano channel as described in any one of claims 1 to 6.

8. A method for rapidly manufacturing micro-nano ridges, characterized in that: On the basis of the method for rapidly manufacturing micro-nano channels as described in any one of claims 1 to 6, after obtaining the array micro-nano channels (6) on the flexible substrate layer and before ultraviolet exposure, the photoresist is stripped off from the flexible substrate layer to obtain the array micro-nano ridges (7) on the flexible substrate layer; After the array micro-nano ridges (7) are obtained, the flexible substrate layer with the array micro-nano ridges (7) is placed under ultraviolet light (5) to expose the array micro-nano ridges (7) on the flexible substrate layer to cure the photoresist of the array micro-nano ridges (7).

9. A micro-nano ridge, characterized in that: The micro-nano ridges are prepared by the method for rapidly manufacturing micro-nano ridges as described in claim 8.

Images