Inkjet dotting method for semiconductor wafer testing

Abstract

The present application discloses an inkjet dotting method for semiconductor wafer testing, which is applied to a loading and unloading module, including: obtaining a tested wafer from a testing station, placing the wafer to be tested at the testing station, so that the wafer testing device on the testing station can test the wafer to be tested; during the test of the wafer testing device, placing the tested wafer at the dotting station, so that the inkjet dotting device on the dotting station can dot the tested wafer; during the dotting of the inkjet dotting device, obtaining the wafer to be tested for the next test from the storage station; obtaining the dotted wafer from the dotting station, and placing the dotted wafer at the storage station. In the present application, the wafer testing device does not need to occupy its own testing time due to inkjet dotting, which can improve the efficiency of wafer testing.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to an inkjet dotting method for semiconductor wafer testing. Background Art

[0002] In semiconductor production, as the size of wafers increases and the size of components decreases, a wafer can be divided into thousands of identical or different chips as needed. Due to the process design or the characteristics of the material itself, the final wafer has normal chips and defective chips. Generally, a test machine and a probe card are used to test each chip on the wafer to ensure that the electrical characteristics and performance of the chip meet the design specifications. If a defective chip is found during the wafer testing process, it needs to be marked. Specifically, an inkjet dotting device is used to dot the defective chip, and the defective chip location information will be formed in different forms of coordinate files according to different test equipment.

[0003] Since defective chips are inevitably produced during the production process, the method of using an inkjet dotting device for dotting in the prior art is usually to install the inkjet dotting device at a fixed position on the test machine. After the wafer test is completed, the machine moves according to the coordinate file of the defective chip to perform inkjet dotting on the defective chip. This method requires the machine to spend time on inkjet dotting after each wafer is tested, and the next wafer cannot be tested immediately, which takes up the test time of the machine and often reduces the test capacity of the machine. Summary of the invention

[0004] The purpose of this application is to provide an inkjet dotting method for semiconductor wafer testing to solve the technical problem that the inkjet dotting of existing wafer testing machines affects the testing efficiency in the prior art. The preferred technical solutions among the many technical solutions provided in this application can produce many technical effects as described below.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] The present application provides an inkjet dotting method for semiconductor wafer testing, which is applied to a loading and unloading module, and includes: obtaining a tested wafer from a testing station, placing a wafer to be tested on the testing station, so that a wafer testing device on the testing station can test the wafer to be tested; during the testing of the wafer testing device, placing the tested wafer at a dotting station, so that the inkjet dotting device on the dotting station can dot the tested wafer; during the dotting of the inkjet dotting device, obtaining a wafer to be tested for the next test from a storage station; obtaining a dotted wafer from the dotting station, and placing the dotted wafer on the storage station.

[0007] In some embodiments, the loading and unloading module includes a loading robot arm and an unloading robot arm, and the wafer testing device includes a wafer carrier for carrying wafers; obtaining the tested wafer from the testing station includes: driving the unloading robot arm to extend to the bottom of the tested wafer, the unloading robot arm lifts the tested wafer off the wafer carrier, and the unloading robot arm absorbs the tested wafer and then retracts.

[0008] In some embodiments, placing the wafer to be tested on the test station includes: driving the loading robot arm to extend above the wafer carrier, the loading robot arm stops adsorbing the wafer to be tested and places the wafer to be tested on the wafer carrier; driving the loading robot arm to retract.

[0009] In some embodiments, the inkjet dotting device includes an adsorption platform for supporting wafers; placing the measured wafer at the dotting station includes: driving the unloading robot arm to extend above the adsorption platform of the inkjet dotting device, the unloading robot arm stops adsorbing the measured wafer and places the measured wafer on the adsorption platform; driving the unloading robot arm to retract.

[0010] In some embodiments, obtaining the wafer to be tested for the next test from the storage station includes: driving the loading robot arm to extend, taking out the wafer to be tested for the next test from the wafer storage device, and aligning the center of the wafer to be tested for the next test.

[0011] In some embodiments, obtaining the dotted wafer from the dotting station includes: driving the unloading robot arm to extend to the bottom of the adsorption platform and lift the dotted wafer, and the unloading robot arm adsorbs the dotted wafer; and driving the unloading robot arm to retract.

[0012] The present application also provides an inkjet dotting method for semiconductor wafer testing, which is applied to an inkjet dotting device, wherein the inkjet dotting device includes a dotting module, a driving module and an adsorption carrier, and is located at a dotting station; the method includes: receiving a coordinate file sent by a wafer testing device; controlling the driving module based on the coordinate file to move the adsorption carrier to the bottom of the dotting module, so that the defective chip of the tested wafer on the adsorption carrier is aligned with the dotting module; controlling the dotting module to dot the defective chip of the tested wafer to obtain a dotted wafer.

[0013] In some embodiments, the driving module includes a Z-axis cylinder slide for driving the dotting module to move in a direction close to or away from the adsorption carrier.

[0014] The present application also provides an inkjet dotting method for semiconductor wafer testing, comprising: a loading and unloading module obtains a tested wafer from a testing station, and places a wafer to be tested on the testing station, so that a wafer testing device on the testing station can test the wafer to be tested; during the testing of the wafer testing device, the loading and unloading module places the tested wafer on the dotting station, so that the inkjet dotting device on the dotting station can dot the tested wafer; during the dotting of the inkjet dotting device, the loading and unloading module obtains a wafer to be tested for the next test from a storage station; The inkjet dotting device includes a dotting module, a driving module and an adsorption carrier, the inkjet dotting device receives a coordinate file sent by the wafer testing device; the inkjet dotting device controls the driving module based on the coordinate file to move the adsorption carrier to the bottom of the dotting module, so that the defective chip of the tested wafer on the adsorption carrier is aligned with the dotting module; the inkjet dotting device controls the dotting module to dot the defective chip of the tested wafer; the loading and unloading module obtains the dotted wafer from the dotting station and places the dotted wafer at the storage station.

[0015] The present application also provides an inkjet dotting device for semiconductor wafer testing, the device comprising: a loading and unloading module, a wafer testing device arranged at a testing station, an inkjet dotting device arranged at a dotting station, and a wafer storage device arranged at a storage station; the loading and unloading module is configured to obtain a tested wafer from the testing station, place a wafer to be tested at the testing station, so that the wafer testing device at the testing station can test the wafer to be tested; during the testing of the wafer testing device, the tested wafer is placed at the dotting station, so that the inkjet dotting device at the dotting station can dot the tested wafer; during the dotting of the inkjet dotting device, the tested wafer is taken from the storage station; Obtain a wafer to be tested for the next test, obtain a dotted wafer from the dotting station, and place the dotted wafer at the storage station; the wafer testing device is configured to test the wafer to be tested; the inkjet dotting device includes a dotting module, a driving module and an adsorption carrier, the inkjet dotting device is configured to receive a coordinate file sent by the wafer testing device, and control the driving module to move the adsorption carrier to the bottom of the dotting module based on the coordinate file, so that the defective chip of the tested wafer on the adsorption carrier is aligned with the dotting module, and the dotting module is controlled to dot the defective chip of the tested wafer; the wafer storage device is configured to store wafers.

[0016] Implementing one of the above technical solutions of the present application has the following advantages or beneficial effects: In the present application, after the test of the wafer testing device is completed, the loading and unloading module takes out the tested wafer and places the wafer to be tested on the wafer testing device so that the wafer testing device can continue to test the wafer to be tested; while the wafer testing device is testing the wafer to be tested, the tested wafer is dotted by the inkjet dotting device in the loading and unloading machine, and during the inkjet dotting, the wafer to be tested for the next test can be obtained from the storage station; after the inkjet dotting is completed, the dotted wafer is returned to the wafer storage device. In this process, generally speaking, the test time of a wafer is relatively long, and the wafer testing device does not need to occupy its own test time due to the need for its own inkjet dotting, which can improve the efficiency of wafer testing. In addition, during the inkjet dotting, the loading and unloading module can simultaneously retrieve materials from the wafer storage device. In this case, the time during which the wafer cannot be replaced immediately after the test and needs to wait for the wafer dotting to be completed can be shortened, thereby improving the efficiency of the wafer testing device; at the same time, the waiting time of inkjet dotting is used to obtain the wafer to be tested, thereby improving the utilization rate and reducing the testing cost without adding additional equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. It is obvious that the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 It is a flow chart of an inkjet dotting method for semiconductor wafer testing according to an embodiment of the present application.

[0019] Figure 2 It is a schematic diagram of the layout of each device in the embodiment of the present application.

[0020] Figure 3 It is a schematic diagram of the chip positions on the wafer of an embodiment of the present application.

[0021] Figure 4 It is a structural schematic diagram of the loading and unloading module of the embodiment of the present application.

[0022] Figure 5 It is a schematic diagram of the structure of the inkjet dotting device of an embodiment of the present application.

[0023] Figure 6 It is a structural block diagram of the processing device of an embodiment of the present application.

[0024] In the figure: 10, wafer carrier; 2, loading and unloading module; 20, unloading robot arm; 21, synchronous wheel module; 22, rotating module; 23, Z-axis module; 24, loading robot arm; 3, inkjet dotting device; 30, dotting module; 31, driving module; 32, adsorption carrier; 310, displacement platform; 311, rotating platform; 312, Z-axis cylinder slide; 4, wafer storage device; 5, processing equipment; 51, memory; 52, processor. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present application clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, wherein various exemplary embodiments that may be used to implement the present application are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods, and devices that are consistent with some aspects disclosed in the present application as detailed in the attached claims, and other embodiments may also be used, or the embodiments listed herein may be modified in structure and function without departing from the scope and essence of the present application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", etc. indicate the orientation or positional relationship based on the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "multiple" means two or more. The terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0027] In order to illustrate the technical solution described in the present application, a specific embodiment is provided below, and only the parts related to the embodiment of the present application are shown.

[0028] like Figure 1 and Figure 2 As shown, the present application provides an inkjet dotting method for semiconductor wafer testing, which is applied to a loading and unloading module 2, including:

[0029] S1. Obtain a wafer that has been tested from a test station, and place a wafer to be tested on the test station, so that a wafer testing device (not shown) on the test station can test the wafer to be tested.

[0030] In some embodiments, the wafer testing device may be a wafer testing machine. A wafer may have multiple chips, and the types of the chips may be the same or different. In some embodiments, the wafer testing machine may test all or part of the chips on the wafer to obtain a tested wafer.

[0031] In some embodiments, Figure 2 As shown, the wafer testing device may include a wafer stage 10 for carrying the wafer. It should be noted that: Figure 2 What is shown is only the approximate position and mutual distance of each device, which can actually be adjusted according to the needs. At the same time, each component can be integrated into one or more devices according to the needs, for example, the loading and unloading module 2 and the inkjet dotting device 3 can be integrated into the same device, for example, the loading and unloading module 2 and the inkjet dotting device 3 can be integrated into the loading and unloading machine, which is not limited here. By integrating each device, the space occupied by the device can be reduced.

[0032] In some embodiments, the wafer tester may output a coordinate file after testing each chip on the wafer. The coordinate file may include the coordinate information of the chip. The coordinate file may correspond to the tested wafer. After being tested by the wafer tester, the plurality of chips may include normal chips and defective chips. The coordinate information may include at least the coordinate information of several defective chips.

[0033] In some embodiments, the coordinate information of the coordinate file may be identified. For example, the wafer tester may identify the wafer based on the wafer notch.

[0034] In some embodiments, the coordinate information of different chips can be converted and output, so that the coordinate files of different chips are converted into a preset coordinate format, and then the coordinate files of new defective chips are output, thereby improving the compatibility of different chips and saving the cost required for identifying different chips.

[0035] In some embodiments, Figure 3 As shown, the preset coordinate format may include at least an angle value and a distance value of the chip. Figure 3 The θ value shown is the angle value, and the s value is the distance value. The reference point corresponding to the angle value or distance value of the chip can be set according to the needs. For example, the reference point corresponding to the distance value can be the center point of the wafer, etc., which is not limited here.

[0036] In some embodiments, Figure 2 and Figure 4As shown, the loading and unloading module 2 may include a robot for clamping wafers, and the robot may include a loading robot 24 and an unloading robot 20. The unloading robot 20 may be configured to move wafers between the wafer testing device, the inkjet dotting device 3, and the wafer storage device 4. The loading robot 24 may be configured to move wafers between the wafer testing device and the wafer storage device 4.

[0037] In some embodiments, Figure 4 As shown, the loading and unloading module 2 may include a synchronous wheel module 21 for moving the robot arm in the Y1 direction, a Z-axis module 23 for moving the robot arm up and down in the Z1 direction, and a rotating module 22 for rotating the robot arm in the R1 direction. The Y1 direction may refer to the extension direction of the fork of the robot arm. That is to say, when the fork of the robot arm points to different directions, the Y1 direction will also change accordingly. The Y1 direction may be the direction facing the loading and unloading module 2. For example, when the loading and unloading module 2 faces the test station, it can be considered that the test station is in the Y1 direction.

[0038] In some embodiments, Figure 4 As shown, the loading and unloading module 2 may have a plurality of synchronous wheel modules 21. One of the plurality of synchronous wheel modules 21 may correspond to the loading robot arm 24, that is, it may be used to control the loading robot arm 24 to extend or retract along the Y1 direction; correspondingly, another synchronous wheel module 21 may correspond to the unloading robot arm 20, that is, it may be used to control the unloading robot arm 20 to extend or retract along the Y1 direction.

[0039] In some embodiments, the rotating module 22 can be controlled to rotate in the R1 direction so that the robot arm faces each station. At this time, it can be considered that the station the robot arm faces is the station the loading and unloading module 2 faces. Specifically, the station may include a test station, a dotting station, and a storage station. For example, when the rotating module 22 rotates to make the robot arm face the test station, the synchronous wheel module 21 can be controlled to drive the robot arm to extend or retract in the Y1 direction to take away the wafer on the wafer stage 10 or place the wafer on the wafer stage 10 of the wafer tester.

[0040] In some embodiments, obtaining a tested wafer from a testing station may include:

[0041] The unloading robot arm 20 is driven to extend to the bottom of the measured wafer, and the unloading robot arm 20 lifts the measured wafer off the wafer carrier 10 . The unloading robot arm 20 absorbs the measured wafer and then retracts.

[0042] In some embodiments, after the wafer testing device completes the test of the wafer to be tested, the wafer stage 10 can be moved to the unloading position. When the wafer stage 10 moves to the unloading position, the ejector pins on the wafer stage 10 can lift the wafer, and at this time, the wafer testing device can send a control instruction to the loading and unloading module 2 to instruct the loading and unloading module 2 to perform loading and unloading operations. The loading and unloading operation can refer to obtaining the tested wafer from the wafer stage 10 and placing the wafer to be tested on the wafer stage 10, so that the wafer testing device can test the wafer to be tested.

[0043] In some embodiments, the fork of the unloading robot arm 20 may be provided with a vacuum adsorption channel so that the unloading robot arm 20 can adsorb the wafer, that is, the unloading robot arm 20 can adsorb the measured wafer. Correspondingly, the fork of the loading robot arm 24 may also be provided with a vacuum adsorption channel so that the loading robot arm 24 can adsorb the wafer.

[0044] In some embodiments, the Z-axis module 23 can be controlled to move the robot arm to the unloading position. Subsequently, the unloading robot arm 20 can be driven to extend below the measured wafer, and at this time, the Z-axis module 23 can be driven to lift upward to drive the unloading robot arm 20 to lift the measured wafer off the wafer stage 10; the unloading robot arm 20 can absorb the measured wafer, and finally the synchronous wheel module 21 is controlled to drive the unloading robot arm 20 to retract.

[0045] In some embodiments, placing the wafer to be tested at the test station may include: driving the loading robot arm 24 to extend above the wafer carrier 10, the loading robot arm 24 stops adsorbing the wafer to be tested and places the wafer to be tested on the wafer carrier 10; and driving the loading robot arm 24 to retract.

[0046] In some embodiments, the Z-axis module 23 can be controlled to move the robot arm to the loading position, which can refer to the position where the loading robot arm 24 is aligned with the wafer stage 10. The synchronous wheel module 21 can be controlled to drive the loading robot arm 24 to extend above the ejector pin of the wafer stage 10, and then the loading robot arm 24 can be controlled to stop adsorbing the wafer to be tested; at this time, the Z-axis module 23 can be driven to move downward to drive the loading robot arm 24 to place the wafer to be tested on the ejector pin of the wafer stage 10, and then the synchronous wheel module 21 can be controlled to drive the loading robot arm 24 to retract.

[0047] S2. During the test of the wafer testing device, the tested wafer is placed on the dotting station so that the inkjet dotting device 3 on the dotting station can dot the tested wafer. During the dotting of the inkjet dotting device 3, the wafer to be tested for the next test is obtained from the storage station.

[0048] In some embodiments, the dotting station may be provided with an inkjet dotting device 3 for dotting the measured wafers, and the storage station may be provided with a wafer storage device 4 for storing wafers.

[0049] In some embodiments, the wafer storage device 4 may be a wafer boat. The wafer boat may be a wafer transfer box, which is a container used to protect, transport, and store wafers during semiconductor manufacturing. The wafer boat may store a plurality of dotted wafers and a plurality of wafers to be tested.

[0050] In some embodiments, the inkjet dotting device 3 can be used to perform inkjet dotting on a number of defective chips on a tested wafer. The inkjet dotting device 3 can be integrated with the loading and unloading module 2 in a loading and unloading machine. The loading and unloading machine can receive the coordinate file sent by the wafer testing device, and the inkjet dotting device 3 can dot the corresponding tested wafer based on the coordinate file. The inkjet dotting device 3 may include an adsorption carrier 32 for carrying the wafer. The interior of the adsorption carrier 32 may have a vacuum channel to adsorb the wafer.

[0051] In some embodiments, placing the measured wafer on the dotting station may include: driving the unloading robot arm 20 to extend above the adsorption platform 32 of the inkjet dotting device 3, the unloading robot arm 20 stops adsorbing the measured wafer and places the measured wafer on the adsorption platform 32; driving the unloading robot arm 20 to retract.

[0052] In some embodiments, the synchronous wheel module 21 can be controlled to drive the unloading robot arm 20 to extend above the adsorption platform 32 of the inkjet dotting device 3, and then the unloading robot arm 20 can be controlled to stop adsorbing the measured wafer. At this time, the Z-axis module 23 is controlled to drive the unloading robot arm 20 to descend and place the measured wafer on the adsorption platform 32. The adsorption platform 32 can start the vacuum adsorption of the measured wafer; then the synchronous wheel module 21 is controlled to drive the unloading robot arm 20 to retract.

[0053] In some embodiments, while the wafer testing device is testing the wafer to be tested, the inkjet dotting device 3 can dot the tested wafer. The tested wafer here can be the tested wafer that has been tested in the last test. In this case, compared with the method of performing the next test after the dotting is completed, the test time of the wafer testing device can be fully utilized to perform inkjet dotting in parallel, thereby improving the test efficiency of the wafer testing device.

[0054] In some embodiments, obtaining the wafer to be tested for the next test from the storage station may include: driving the loading robot arm 24 to extend, taking out the wafer to be tested for the next test from the wafer storage device 4, and aligning the center of the wafer to be tested for the next test. It should be noted that the wafer to be tested here may be different from the wafer to be tested mentioned above, that is, it may not be the same wafer. The wafer to be tested taken out here can be the wafer to be tested by the wafer testing device next time, that is, it can be considered as a complete process for testing, marking and storing the wafer next time.

[0055] In some embodiments, while the inkjet dotting device 3 is dotting the tested wafer, the wafer to be tested for the next test can be taken out from the wafer storage device 4, and the center of the circle of the wafer to be tested for the next test can be aligned. After the center of the circle is aligned, the dotted wafer can be retrieved from the dotting station after the inkjet dotting device 3 completes the dotting. In this case, the dotting time of the inkjet dotting device 3 can be fully utilized to perform material retrieval and center of circle alignment in parallel, thereby further improving efficiency.

[0056] In some embodiments, during the inkjet dotting process, the synchronous wheel module 21 can be controlled to drive the loading robot 24 to extend and take out the wafer to be tested from the wafer storage device 4, then retract and complete the center alignment. After the loading robot 24 absorbs the wafer to be tested, the synchronous wheel module 21 can be controlled to drive the loading robot 24 to retract.

[0057] S3. Obtain the dotted wafer from the dotting station and place the dotted wafer at the storage station.

[0058] In some embodiments, obtaining the dotted wafer from the dotting station may include: driving the unloading robot arm 20 to extend to the bottom of the adsorption platform 32 and lift the dotted wafer, and the unloading robot arm 20 adsorbs the dotted wafer; driving the unloading robot arm 20 to retract.

[0059] In some embodiments, after the inkjet dotting device 3 completes the inkjet dotting, the synchronous wheel module 21 can be controlled to drive the unloading robot arm 20 to extend to the bottom of the adsorption platform 32, and then the Z-axis module 23 can be controlled to drive the unloading robot arm 20 to rise and lift the dotted wafer, and then the unloading robot arm 20 can be controlled to adsorb the dotted wafer, and finally the synchronous wheel module 21 can be controlled to drive the unloading robot arm 20 to retract.

[0060] In some embodiments, placing the dotted wafer in a storage station may include: driving the unloading robot arm 20 to extend into the interior of the wafer storage device 4, the unloading robot arm 20 stops adsorbing the dotted wafer and places the dotted wafer into the interior of the wafer storage device 4; driving the unloading robot arm 20 to retract.

[0061] In some embodiments, the synchronous wheel module 21 can be controlled to drive the unloading robot arm 20 to extend into the wafer boat, and then the unloading robot arm 20 can be controlled to stop adsorbing the dotted wafers and place the dotted wafers on the slots of the wafer boat. Finally, the synchronous wheel module 21 can be controlled to drive the unloading robot arm 20 to retract.

[0062] The present application also relates to an inkjet dotting method for semiconductor wafer testing, which is applied to an inkjet dotting device 3. Figure 5As shown, the inkjet dotting device 3 may include a dotting module 30, a driving module 31 and an adsorption carrier 32, and is located at a dotting station. In some embodiments, the inkjet dotting method may include: receiving a coordinate file sent by a wafer testing device; controlling the driving module 31 based on the coordinate file to move the adsorption carrier 32 to the bottom of the dotting module 30, so that the defective chip of the tested wafer on the adsorption carrier 32 is aligned with the dotting module 30; controlling the dotting module 30 to perform inkjet dotting on the defective chip of the tested wafer to obtain a dotted wafer.

[0063] In some embodiments, the dotting module 30 may be an inkjet dotting device. Figure 5 As shown, the driving module 31 may include a displacement platform 310 and a rotation platform 311 .

[0064] In some embodiments, an inkjet dotting device can be used to mark unqualified chips, that is, defective chips, on the surface of the tested wafer to facilitate subsequent screening of defective chips.

[0065] In some embodiments, Figure 5 As shown, the displacement platform 310 can be used to drive the adsorption stage 32 and the wafer on the adsorption stage 32 to move along the Y2 direction. The rotation platform 311 can be used to drive the adsorption stage 32 and the wafer on the adsorption stage 32 to rotate along the R2 direction.

[0066] In some embodiments, the displacement platform 310 may be driven by a ball screw, and the rotation platform 311 may be driven by a hollow rotation platform.

[0067] In some embodiments, Figure 5 As shown, the driving module 31 may include a Z-axis cylinder slide 312 for driving the dotting module 30 to move in a direction close to or away from the adsorption carrier 32.

[0068] In some embodiments, the Z-axis cylinder slide 312 can be connected to the inkjet dotting device to drive the inkjet dotting device to move up and down along the Z2 direction. In this way, the inkjet dotting device can be convenient for inkjet dotting, and a certain space can be reserved for the robot arm to take the wafer off the adsorption stage 32 or place the wafer on the adsorption stage 32.

[0069] In some embodiments, the displacement platform 310 can be controlled to move the adsorption stage 32 to a corresponding position according to the distance value of the defective chip, so that the defective chip is located below the inkjet dotting device. In some embodiments, the rotation platform 311 can be controlled to rotate the adsorption stage 32 to a corresponding position according to the angle value, so that the defective chip is located below the inkjet dotting device. In some embodiments, the displacement platform 310 and the rotation platform 311 can be controlled to perform linkage positioning. In this way, the inkjet dotting device 3 can be compatible with fully automatic dotting of wafers of various sizes.

[0070] The present application also relates to an inkjet dotting method for semiconductor wafer testing, which may include:

[0071] The loading and unloading module 2 obtains the tested wafers from the testing station and places the wafers to be tested on the testing station so that the wafer testing device on the testing station can test the wafers to be tested.

[0072] During the test of the wafer testing device, the loading and unloading module 2 places the tested wafer on the dotting station so that the inkjet dotting device 3 on the dotting station can dot the tested wafer.

[0073] During the dotting of the inkjet dotting device 3 , the loading and unloading module 2 obtains the wafer to be tested for the next test from the storage station.

[0074] The inkjet dotting device 3 includes a dotting module 30 , a driving module 31 and an adsorption stage 32 . The inkjet dotting device 3 receives a coordinate file sent by the wafer testing device.

[0075] The inkjet dotting device 3 controls the driving module 31 to move the adsorption stage 32 to below the dotting module 30 based on the coordinate file, so that the defective chips of the tested wafer on the adsorption stage 32 are aligned with the dotting module 30 .

[0076] The inkjet dotting device 3 controls the dotting module 30 to perform inkjet dotting on the defective chips of the tested wafer.

[0077] The loading and unloading module 2 obtains the dotted wafers from the dotting station and places the dotted wafers in the storage station.

[0078] The present application also relates to an inkjet dotting device for semiconductor wafer testing, which may include: a loading and unloading module 2, a wafer testing device arranged at a testing station, an inkjet dotting device 3 arranged at a dotting station, and a wafer storage device 4 arranged at a storage station.

[0079] In some embodiments, the loading and unloading module 2 can be configured to obtain the tested wafer from the testing station, place the wafer to be tested on the testing station, so that the wafer testing device on the testing station can test the wafer to be tested; during the testing of the wafer testing device, the tested wafer is placed on the dotting station, so that the inkjet dotting device 3 on the dotting station can dot the tested wafer; during the dotting of the inkjet dotting device 3, the wafer to be tested for the next test is obtained from the storage station, the dotted wafer is obtained from the dotting station, and the dotted wafer is placed on the storage station.

[0080] In some embodiments, the wafer testing apparatus may be configured to test a wafer to be tested.

[0081] In some embodiments, the inkjet dotting device 3 may include a dotting module 30, a driving module 31 and an adsorption platform 32. The inkjet dotting device 3 may be configured to receive a coordinate file sent by a wafer testing device, and control the driving module 31 based on the coordinate file to move the adsorption platform 32 to the bottom of the dotting module 30, so that the defective chip of the tested wafer on the adsorption platform 32 is aligned with the dotting module 30, and the dotting module 30 is controlled to dot the defective chip of the tested wafer.

[0082] In some embodiments, the wafer storage device 4 may be configured to store wafers, for example, wafers to be tested and wafers that have been dotted.

[0083] In the present application, after the test of the wafer testing device is completed, the loading and unloading module 2 can take out the tested wafer from the wafer testing device, and place the wafer to be tested on the wafer testing device, so that the wafer testing device can continue to test the wafer to be tested; while the wafer testing device is testing the wafer to be tested, the tested wafer is dotted by the inkjet dotting device 3 in the loading and unloading machine, and during the inkjet dotting, the loading and unloading module 2 can obtain the wafer to be tested for the next test from the storage station for pre-alignment; after the inkjet dotting is completed, the loading and unloading module 2 returns the dotted wafer to the wafer storage device 4, and waits for the wafer on the test station to finish the test, so as to exchange the tested wafer and the wafer to be tested next time. It can be understood that the inkjet dotting method for semiconductor wafer testing involved in the present application can be a repeatable and cyclic process, that is, it can be repeated multiple times to complete the testing of multiple wafers and the inkjet dotting process in sequence.

[0084] In addition, the test and inkjet dotting processes of the present application can be parallel. For example, after the wafer testing device completes the test of the wafer A to be tested, the loading and unloading module 2 can place the wafer B to be tested in the wafer testing device. At this time, the wafer testing device can test the wafer B to be tested. At the same time, the loading and unloading module 2 can send the tested wafer A to the inkjet dotting device 3 for dotting. Therefore, while the wafer testing device is testing the next wafer to be tested, the inkjet dotting device 3 can dot the tested wafer in parallel.

[0085] In this process, generally speaking, the test time of a wafer is relatively long. The wafer testing device does not need to occupy its own test time due to the need for its own inkjet dotting, which can improve the efficiency of wafer testing. In addition, during the inkjet dotting, the loading and unloading module 2 can simultaneously retrieve materials from the wafer storage device 4. In this case, it can not only shorten the time when the wafer cannot be replaced immediately after the test and needs to wait for the wafer dotting to be completed, thereby improving the efficiency of the wafer testing device; at the same time, it also utilizes the waiting time of inkjet dotting to obtain the wafer to be tested, thereby improving the utilization rate, and there is no need to add additional equipment, thereby reducing the testing cost.

[0086] Those skilled in the art can understand that all or part of the features / steps of the above-mentioned method embodiments can be implemented by methods, data processing systems or computer programs, and these features can be implemented without hardware, entirely by software, or by a combination of hardware and software. The aforementioned computer program can be stored in one or more computer-readable storage media, and the storage medium stores the computer program. When the computer program is executed (such as by a processor), the steps of the above-mentioned inkjet dotting method embodiment for semiconductor wafer testing are executed.

[0087] The aforementioned storage media that can store program codes include: static hard disks, solid-state hard disks, random access memories (SRAM), electrically erasable programmable read-only memories (EEPROM), erasable programmable read-only memories (EPROM), programmable read-only memories (PROM), read-only memories (ROM), optical storage devices, magnetic storage devices, flash memories, magnetic disks or optical disks and / or combinations of the above devices, that is, they can be implemented by any type of volatile or non-volatile storage devices or combinations thereof.

[0088] like Figure 6 As shown, the present application also provides an embodiment of a processing device 5, including one or more processors 52 and a memory 51; wherein the memory 51 is used to store one or more computer programs, and the one or more processors 52 are used to execute one or more computer programs stored in the memory 51, so that the processor 52 executes the features / steps of the above-mentioned inkjet dotting method embodiment for semiconductor wafer testing.

[0089] The above is only the preferred embodiment of the present application. Those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application belong to the protection scope of the present application.

Claims

1. An inkjet dotting method for semiconductor wafer testing, characterized in that: include: The loading and unloading module obtains the tested wafer from the test station, and places the wafer to be tested for the next test on the test station, so that the wafer testing device on the test station can test the wafer to be tested; During the test of the wafer testing device, the loading and unloading module places the tested wafer at the dotting station so that the inkjet dotting device at the dotting station can dot the tested wafer; The loading and unloading module obtains the wafer to be tested for the next test from the storage station during the dotting of the inkjet dotting device; the inkjet dotting device includes a dotting module, a driving module and an adsorption stage, and the inkjet dotting device receives the coordinate file sent by the wafer testing device; The inkjet dotting device controls the driving module to move the adsorption stage to below the dotting module based on the coordinate file, so that the defective chip of the measured wafer on the adsorption stage is aligned with the dotting module; The inkjet dotting device controls the dotting module to dot the defective chips on the tested wafer; The loading and unloading module obtains the dotted wafers from the dotting station and places the dotted wafers on the storage station.

2. The inkjet dotting method for semiconductor wafer testing according to claim 1, characterized in that: The loading and unloading module includes a loading robot arm and an unloading robot arm, and the wafer testing device includes a wafer carrier for carrying wafers; obtaining the tested wafer from the testing station includes: driving the unloading robot arm to extend to the bottom of the tested wafer, the unloading robot arm lifts the tested wafer off the wafer carrier, and the unloading robot arm absorbs the tested wafer and then retracts.

3. The inkjet dotting method for semiconductor wafer testing according to claim 2, characterized in that: Placing the wafer to be tested on the test station includes: driving the loading robot arm to extend above the wafer carrier, the loading robot arm stops adsorbing the wafer to be tested and places the wafer to be tested on the wafer carrier; driving the loading robot arm to retract.

4. The inkjet dotting method for semiconductor wafer testing according to claim 2, characterized in that: The inkjet dotting device includes an adsorption stage for carrying the wafer; Placing the measured wafer on the dotting station includes: driving the unloading robot arm to extend above the adsorption stage of the inkjet dotting device, the unloading robot arm stops adsorbing the measured wafer and places the measured wafer on the adsorption stage; The unloading robot arm is driven to retract.

5. The inkjet dotting method for semiconductor wafer testing according to claim 4, characterized in that: The method of obtaining the wafer to be tested for the next test from the storage station includes: driving the loading robot arm to extend, taking out the wafer to be tested for the next test from the wafer storage device, and aligning the center of the wafer to be tested for the next test.

6. The inkjet dotting method for semiconductor wafer testing according to claim 4, characterized in that: The method of obtaining the dotted wafer from the dotting station includes: driving the unloading robot arm to extend to the bottom of the adsorption platform and lift the dotted wafer, and the unloading robot arm adsorbs the dotted wafer; and driving the unloading robot arm to retract.

7. The inkjet dotting method for semiconductor wafer testing according to claim 1, characterized in that: The driving module includes a Z-axis cylinder slide for driving the dotting module to move in a direction close to or away from the adsorption carrier.

8. An inkjet dotting device for semiconductor wafer testing, characterized in that: The equipment includes: a loading and unloading module, a wafer testing device arranged at a testing station, an inkjet dotting device arranged at a dotting station, and a wafer storage device arranged at a storage station; The loading and unloading module is configured to obtain the tested wafer from the testing station, and at the same time place the wafer to be tested for the next test on the testing station, so that the wafer testing device on the testing station can test the wafer to be tested; during the testing of the wafer testing device, the tested wafer is placed on the dotting station, so that the inkjet dotting device on the dotting station can dot the tested wafer; during the dotting of the inkjet dotting device, the tested wafer to be tested for the next test is obtained from the storage station, the dotted wafer is obtained from the dotting station, and the dotted wafer is placed on the storage station; The wafer testing device is configured to test a wafer to be tested; The inkjet dotting device comprises a dotting module, a driving module and an adsorption stage. The inkjet dotting device is configured to receive a coordinate file sent by a wafer testing device, control the driving module based on the coordinate file to move the adsorption stage to below the dotting module, align the defective chip of the tested wafer on the adsorption stage with the dotting module, and control the dotting module to dot the defective chip of the tested wafer; The wafer storage device is configured to store wafers.

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