A high-precision circuit board with high efficiency and heat dissipation

Abstract

The present invention discloses a high-precision circuit board with high efficiency and heat dissipation, including a multi-layer circuit board, a heat dissipation hole is opened on the multi-layer circuit board, a guide component is arranged below the multi-layer circuit board for guiding the wind blowing through the lower surface of the multi-layer circuit board into the heat dissipation hole, and a suction shell is arranged above the multi-layer circuit board for driving the flow rate of hot air flowing upward inside the heat dissipation hole. In the present invention, when the air-cooling component blows air to the multi-layer circuit board, the wind will flow along the upper surface of the upper circuit board and the lower surface of the lower circuit board, and the lower surface of the lower circuit board is provided with a guide component. When the wind flows through, it will drive the sphere inside the mesh cage to bounce continuously, and the sphere itself will block and guide a part of the wind to blow into the heat dissipation hole, so that the wind inside the heat dissipation hole will form a flow through the guidance, and the sphere will bounce continuously. When the sphere moves toward the heat dissipation hole, it will generate thrust for the wind flowing into the heat dissipation hole.

Description

Technical Field

[0001] The invention mainly relates to the technical field of circuit boards, and in particular to a high-efficiency heat dissipation and high-precision circuit board. Background Art

[0002] A multi-layer high-precision circuit board is a circuit board with multiple layers of precision circuit board soft copper. In actual use, it has more control functions and is relatively precise. The circuit board will generate a lot of heat during operation. Existing circuit boards usually dissipate heat and cool down by air cooling. The air cooling equipment is set on the side of the circuit board, and the air flow is accelerated by blowing. The wind passes through the surface of the circuit board to dissipate heat for the circuit board. However, the circuit board in the middle layer can usually only dissipate heat through the heat dissipation holes connected to the upper and lower circuit boards.

[0003] The heat dissipation holes opened on existing circuit boards are usually too small, and when the air-cooling equipment is blowing air, wind will pass through both the upper and lower layers of the multi-layer circuit board, which will cause wind to pass through both ends of the heat dissipation hole. Wind will enter both ends of the heat dissipation hole, and the inside of the heat dissipation hole cannot be connected, resulting in the internal heat cannot be dissipated well, and the flow of wind direction cannot be formed. As a result, the heat dissipation effect of the circuit board in the middle is poor. Summary of the invention

[0004] The technical solution of the present invention aims at the technical problem that the existing technical solutions are too single, and provides a solution that is significantly different from the existing technologies. It mainly provides a high-precision circuit board with high efficiency in heat dissipation, which is used to solve the technical problem proposed in the above background technology that the middle-layer circuit board dissipates heat through heat dissipation holes, the heat dissipation holes are small, and wind blows through the upper and lower surfaces of the multi-layer circuit board. In this way, wind enters both the upper and lower openings of the heat dissipation holes, and a flowing wind direction cannot be formed, resulting in the heat of the middle-layer circuit board cannot be dissipated.

[0005] The technical solution adopted by the present invention to solve the above technical problems is:

[0006] A high-efficiency heat dissipation and high-precision circuit board comprises a multi-layer circuit board, wherein the multi-layer circuit board is provided with heat dissipation holes, a guide component is arranged below the multi-layer circuit board for guiding the wind blowing through the lower surface of the multi-layer circuit board into the heat dissipation holes, and an air suction shell is arranged above the multi-layer circuit board for driving the flow rate of hot air flowing upward inside the heat dissipation holes.

[0007] Preferably, the multi-layer circuit board comprises an upper circuit board, a middle circuit board and a lower circuit board, and the middle circuit board is arranged between the upper circuit board and the lower circuit board.

[0008] Preferably, the upper circuit board, the middle circuit board and the lower circuit board are all provided with heat dissipation holes, and the heat dissipation holes on the upper circuit board, the middle circuit board and the lower circuit board are all interconnected.

[0009] Preferably, the air suction housing comprises an air inlet housing and an air outlet housing, and both the air inlet housing and the air outlet housing are welded to the upper surface of the upper circuit board through a first soldering plate.

[0010] Preferably, the air inlet housing is an arc-shaped housing with an inner cavity from large to small, the air outlet housing is a rectangular housing with an inner cavity of the same size as the smallest inner cavity of the air inlet housing, and the inner cavities of the air inlet housing and the air outlet housing are connected to each other.

[0011] Preferably, the guide assembly comprises a mesh cage, the mesh cage is hemispherical as a whole, and the mesh cage is welded to the lower surface of the lower circuit board through a second soldering plate.

[0012] Preferably, a sphere is arranged inside the mesh cage, and the sphere moves continuously inside the mesh cage.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: when the air-cooling component blows air to the multi-layer circuit board, the wind will flow along the upper surface of the upper circuit board and the lower surface of the lower circuit board. A guide component is provided on the lower surface of the lower circuit board. When the wind flows through, it will drive the sphere inside the grid cage to bounce continuously. The sphere itself will block and guide a part of the wind to blow into the heat dissipation hole. In this way, the wind inside the heat dissipation hole will form a flow through the guidance, move from the lower circuit board toward the upper circuit board, take away the heat flow generated by the middle circuit board to achieve heat dissipation, and the sphere will bounce continuously. When the sphere moves toward the heat dissipation hole, it will generate thrust for the wind flowing into the heat dissipation hole, which can increase the wind flow rate and improve the heat dissipation effect.

[0014] When wind passes through the upper circuit board, it will enter the air inlet shell. The air inlet shell is an arc-shaped shell with an opening that gradually decreases. In this way, when the wind flows through the air inlet shell to the air outlet shell, the wind speed becomes faster and the pressure becomes smaller. The air outlet shell is arranged above the heat dissipation holes of the upper circuit board. The hot air flowing upward through the heat dissipation holes merges with the wind flowing inside the upper air inlet shell, thereby increasing the flow rate of the hot air. At the same time, the wind speed becomes faster and the pressure becomes smaller, which will generate suction on the hot air flowing upward from the heat dissipation holes, increase the rate at which the hot air flows upward, and improve the heat dissipation effect on the middle circuit board.

[0015] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention;

[0018] Figure 3 It is a schematic diagram of the top view structure of the present invention;

[0019] Figure 4 It is a bottom view structural schematic diagram of the present invention;

[0020] The markings in the figure are:

[0021] 1. Upper circuit board; 2. Middle circuit board; 3. Lower circuit board; 4. Heat dissipation holes; 5. Air inlet shell; 6. Air outlet shell; 7. First soldering plate; 8. Grid cage; 9. Second soldering plate; 10. Sphere. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings, but the present invention can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the content disclosed in the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly connected by technicians in the technical field to which the present invention belongs. The terminology used in the specification of the present invention is for the purpose of describing specific embodiments and is not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] Please refer to the attached Figure 1-Figure 4 A high-efficiency heat dissipation and high-precision circuit board includes a multi-layer circuit board, a heat dissipation hole 4 is opened on the multi-layer circuit board, a guide component is arranged below the multi-layer circuit board for guiding the wind blowing through the lower surface of the multi-layer circuit board into the heat dissipation hole 4, and an air suction shell is arranged above the multi-layer circuit board for driving the flow rate of hot air flowing upward inside the heat dissipation hole 4.

[0026] The specific operation process of the present invention is as follows: when the circuit board is running, the air cooling component starts to blow air, and the air generated by the air cooling component flows along the upper surface and the lower surface of the multi-layer circuit board. The lower surface of the lower circuit board 3 is provided with a guide component. When the wind flows through, the guide component will guide the wind to blow into the heat dissipation hole 4 of the lower circuit board 3, and the guide component will also generate thrust for the wind entering the heat dissipation hole 4 from time to time, accelerating the wind flowing into the heat dissipation hole 4, so that the wind inside the heat dissipation hole 4 will form a flow through the guidance, move from the lower circuit board 3 toward the upper circuit board 1, and take away the heat flow generated by the middle circuit board 2 to achieve heat dissipation;

[0027] When the wind passes through the upper circuit board 1, it will enter the interior of the air suction shell, and the inner cavity of the air suction shell will shrink. In this way, when the wind passes into the interior of the air suction shell, the inner cavity will shrink. At this time, the wind speed becomes faster and the pressure becomes smaller. The hot air flowing upward through the heat dissipation holes 4 will merge with the accelerated wind flowing inside the upper air suction shell, thereby increasing the flow rate of the hot air. At the same time, the wind speed becomes faster and the pressure becomes smaller, which will generate suction on the hot air flowing upward through the heat dissipation holes 4, thereby increasing the rate at which the hot air flows upward.

[0028] Please refer to Figure 1-Figure 4 The multilayer circuit board includes an upper circuit board 1, a middle circuit board 2 and a lower circuit board 3. The middle circuit board 2 is arranged between the upper circuit board 1 and the lower circuit board 3. Heat dissipation holes 4 are opened on the upper circuit board 1, the middle circuit board 2 and the lower circuit board 3, and the heat dissipation holes 4 on the upper circuit board 1, the middle circuit board 2 and the lower circuit board 3 are interconnected.

[0029] The heat dissipation holes 4 opened on the upper circuit board 1, the middle circuit board 2 and the lower circuit board 3 are on a line. By guiding the wind on the upper surface of the upper circuit board 1 and the wind on the lower surface of the lower circuit board 3, the flowing wind is driven to enter from the heat dissipation holes 4 of the lower circuit board 3, pass through the heat dissipation holes 4 opened in the middle circuit board 2, carry the hot air upward, and be discharged through the upper circuit board 1, thereby realizing the air flow and heat dissipation inside the heat dissipation holes 4 inside the multi-layer circuit board.

[0030] Please refer to Figure 1-Figure 4 The air intake shell includes an air inlet shell 5 and an air outlet shell 6, and the air inlet shell 5 and the air outlet shell 6 are both welded to the upper surface of the upper circuit board 1 through a first soldering plate 7. The air inlet shell 5 is an arc-shaped shell with an inner cavity from large to small, and the air outlet shell 6 is a rectangular shell with an inner cavity of the same size as the smallest inner cavity of the air inlet shell 5, and the inner cavities of the air inlet shell 5 and the air outlet shell 6 are connected to each other.

[0031] When wind passes through the upper circuit board 1, it will enter the air inlet shell 5. The air inlet shell 5 is an arc-shaped shell with an opening that gradually decreases. In this way, when the wind flows through the air inlet shell 5 to the air outlet shell 6, the wind speed becomes faster and the pressure becomes smaller. The air outlet shell 6 is arranged above the heat dissipation hole 4 of the upper circuit board 1. The hot air flowing upward through the heat dissipation hole 4 merges with the wind flowing inside the upper air inlet shell 5, thereby increasing the flow rate of the hot air. At the same time, the wind speed becomes faster and the pressure becomes smaller, which will generate suction on the hot air flowing upward through the heat dissipation hole 4, increase the rate at which the hot air flows upward, and improve the heat dissipation effect on the middle circuit board 2.

[0032] Please refer to Figure 1-Figure 4 The guide assembly includes a mesh cage 8, which is hemispherical as a whole. The mesh cage 8 is welded to the lower surface of the lower circuit board 3 through a second solder plate 9. A sphere 10 is arranged inside the mesh cage 8, and the sphere 10 moves continuously inside the mesh cage 8.

[0033] When the air cooling component blows air to the multi-layer circuit board, the wind will flow along the lower surface of the lower circuit board 3. When the wind flows through the grid cage 8 set on the lower surface of the lower circuit board 3, it will drive the sphere 10 inside the grid cage 8 to bounce continuously. The sphere 10 itself blocks and guides a part of the wind to blow into the heat dissipation hole 4 of the lower circuit board 3. In this way, the wind inside the heat dissipation hole 4 will form a flow through guidance, and flow from the heat dissipation hole 4 of the lower circuit board 3 toward the heat dissipation hole 4 of the upper circuit board 1, and the heat generated by the middle circuit board 2 is taken away by the air flow to achieve heat dissipation, and the wind passing through the grid cage 8 will blow the sphere 10 to bounce continuously inside the grid cage 8. When the sphere 10 moves toward the heat dissipation hole 4 of the lower circuit board 3, a thrust is generated on the wind flowing into the heat dissipation hole 4, which can increase the wind flow rate and improve the heat dissipation effect.

[0034] The above is an exemplary description of the present invention in combination with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as such non-substantial improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation and high-precision circuit board, comprising a multi-layer circuit board, characterized in that: The multi-layer circuit board is provided with a heat dissipation hole (4), a guide component is provided below the multi-layer circuit board for guiding the wind blowing through the lower surface of the multi-layer circuit board into the heat dissipation hole (4), an air suction shell is provided above the multi-layer circuit board for driving the hot air flow rate flowing upward inside the heat dissipation hole (4), the air suction shell includes an air inlet shell (5) and an air outlet shell (6), and the air inlet shell (5) and the air outlet shell (6) are both welded to the upper surface of the upper circuit board (1) through a first soldering plate (7), and the air inlet shell (5) The invention is an arc-shaped shell with an inner cavity from large to small, the air outlet shell (6) is a rectangular shell with an inner cavity of the same size as the smallest inner cavity of the air inlet shell (5), and the inner cavities of the air inlet shell (5) and the air outlet shell (6) are interconnected, the guide component comprises a mesh cage (8), the mesh cage (8) is hemispherical as a whole, the mesh cage (8) is welded to the lower surface of the lower circuit board (3) through a second soldering plate (9), a sphere (10) is arranged inside the mesh cage (8), and the sphere (10) moves continuously inside the mesh cage (8).

2. The high-efficiency heat dissipation and high-precision circuit board according to claim 1, characterized in that: The multi-layer circuit board comprises an upper circuit board (1), a middle circuit board (2) and a lower circuit board (3), wherein the middle circuit board (2) is arranged between the upper circuit board (1) and the lower circuit board (3).

3. The high-efficiency heat dissipation and high-precision circuit board according to claim 2, characterized in that: The upper circuit board (1), the middle circuit board (2) and the lower circuit board (3) are all provided with heat dissipation holes (4), and the heat dissipation holes (4) on the upper circuit board (1), the middle circuit board (2) and the lower circuit board (3) are all interconnected.

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