Display panel, method for manufacturing display panel, and electronic device

Abstract

The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device, and relate to the field of display technology. In the display panel, at least part of the second conductive layer is connected to the first conductive trace in the first conductive layer through at least one first opening, the second conductive layer is provided with a second opening in the first connection area, and the orthographic projection of at least one first opening on the substrate is outside the orthographic projection of at least one second opening on the substrate. The stability of signal transmission can be ensured, thereby ensuring that the display panel has a good display effect and improving the user experience.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation of flat panel display technology after liquid crystal, and it has many unique advantages such as self-luminescence, full solid state, light weight, flexibility, etc. With the continuous improvement of display panel structure, the stability of display effect of display panel will be affected to a certain extent. Summary of the invention

[0003] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for preparing a display panel, and an electronic device.

[0004] In a first aspect of the present application, a display panel is provided, the display panel having a display area and a non-display area, the non-display area including a first connection area and a second area, the second area being located on a side of the first connection area away from the display area, the display panel comprising:

[0005] substrate;

[0006] A first conductive layer is located on the substrate, the first conductive layer includes a first conductive trace, and the first conductive trace is located in the first connection area and the second area.

[0007] A first insulating layer, located on a side of the first conductive layer away from the substrate and located in the first connection region;

[0008] The isolation structure layer is located on a side of the first insulating layer away from the substrate. The isolation structure layer extends to the first connection area. The opening density of the first connection area is greater than the opening density of the second area.

[0009] In a possible implementation of the present application, the first insulating layer is provided with a first opening, and in the first connection region, the isolation structure layer is electrically connected to the first conductive trace through at least one first opening;

[0010] Optionally, in the first connection region, the isolation structure layer is provided with a second opening, and an orthographic projection of at least one first opening on the substrate is located outside an orthographic projection of the second opening on the substrate;

[0011] Optionally, in the first connection region, the first conductive trace is provided with a fourth opening, and an orthographic projection of the fourth opening on the substrate is located outside an orthographic projection of the first opening and the second opening on the substrate;

[0012] Optionally, in the second area, the first conductive trace is provided with a sixth opening.

[0013] In a second aspect, the present application further provides a display panel, the display panel having a display area and a non-display area, the non-display area including a first connection area, and the display panel comprising:

[0014] substrate;

[0015] A first conductive layer, located on the substrate, the first conductive layer comprising a first conductive trace;

[0016] A first insulating layer is provided with a first opening;

[0017] An isolation structure layer is located on a side of the first insulating layer away from the first conductive layer, and the isolation structure layer is provided with a second opening located in the first connection area and an isolation opening located in the display area;

[0018] a light emitting device layer, comprising a plurality of light emitting devices, at least a portion of the light emitting devices being located within the isolation openings;

[0019] In the first connection region, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through at least one first opening, and an orthographic projection of the first opening on the substrate is outside an orthographic projection of the second opening on the substrate.

[0020] In a possible implementation of the present application, the first insulating layer includes an organic layer.

[0021] Alternatively, the display panel further includes a second insulating layer, the second insulating layer is located between the first conductive layer and the first insulating layer, and the second insulating layer includes a third opening; in the first connection region, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through the connected first opening and the third opening; the first insulating layer is an inorganic layer, and the second insulating layer is an organic layer;

[0022] And / or, the display panel further includes a third insulating layer, the third insulating layer is located between the substrate and the first conductive layer, the first conductive layer is provided with a fourth opening in the first connection region, and the third insulating layer is an organic layer.

[0023] In a third aspect, the present application further provides a display panel, comprising:

[0024] substrate;

[0025] A first conductive layer, located on the substrate, the first conductive layer comprising a first conductive trace;

[0026] The first insulating layer is provided with a first opening,

[0027] The second conductive layer is located on a side of the first insulating layer away from the first conductive layer. In the first connection area, at least a portion of the second conductive layer is electrically connected to the first conductive trace through at least one first opening. The second conductive layer is provided with a second opening in the first connection area, and an orthographic projection of at least one first opening on the substrate is located outside an orthographic projection of the second opening on the substrate.

[0028] In a possible implementation of the present application, in the first connection region, the second opening is filled with an insulating material;

[0029] and / or, in the first connection region, the first openings and the second openings are arranged alternately in the first direction,

[0030] and / or, in the first connection region, the plurality of first openings are arranged in the second direction, and the first direction and the second direction intersect;

[0031] and / or, in the first connection region, a plurality of second openings are arranged in the second direction;

[0032] and / or, in the first connection area, a plurality of first openings are arranged in an array, a plurality of second openings are arranged in an array, and a density of the first openings is greater than or equal to a density of the second openings;

[0033] and / or, in the first connection region, an orthographic projection of the second opening on the substrate is located within an orthographic projection of the first insulating layer on the substrate;

[0034] And / or, in the first connection region, the orthographic projection of a portion of the first openings on the substrate is located outside the orthographic projection of at least one second opening on the substrate, and the orthographic projection of a portion of the first openings on the substrate overlaps with the orthographic projection of at least one second opening on the substrate;

[0035] And / or, the first connection area is located in the non-display area and / or the frame area of ​​the display panel.

[0036] In a possible implementation of the present application, the first insulating layer includes a pixel defining layer, the pixel defining layer is located on a side of the first conductive layer away from the substrate, and a first opening is provided on the pixel defining layer; or,

[0037] The first insulating layer comprises a first planarization layer, the first planarization layer is located on a side of the first conductive layer away from the substrate, and a first opening is provided on the first planarization layer;

[0038] Alternatively, the first insulating layer includes an organic layer or an inorganic layer.

[0039] In a possible implementation of the present application, the display panel further includes a second insulating layer, where the second insulating layer is located between the first conductive layer and the first insulating layer;

[0040] The second insulating layer includes a third opening;

[0041] In the first connection area, an orthographic projection of at least one first opening on the substrate overlaps an orthographic projection of a third opening on the substrate; at least a portion of the second conductive layer is electrically connected to the first conductive trace through the connected first opening and the third opening;

[0042] In the first connection region, an orthographic projection of the second opening on the substrate is located outside an orthographic projection of the third opening on the substrate.

[0043] In a possible implementation of the present application, an orthographic projection of at least one first opening on the substrate is located within an orthographic projection of the third opening on the substrate;

[0044] and / or, in the first connection region, an area of ​​an orthographic projection of the first opening on the substrate is smaller than an area of ​​an orthographic projection of the third opening on the substrate;

[0045] And / or, one of the first insulating layer and the second insulating layer is an organic layer, and the other is an inorganic layer;

[0046] And / or, the first insulating layer is an inorganic layer, and the second insulating layer is an organic layer;

[0047] And / or, in the first connection area, the plurality of first openings are arranged in an array, and the plurality of third openings are arranged in an array; in the first connection area, the density of the first openings is greater than the density of the third openings;

[0048] and / or, in the first connection region, the plurality of second openings are arranged in an array, and the density of the third openings is greater than or equal to the density of the second openings;

[0049] And / or, in the first connection area, one of at least two first openings adjacent to each other in the row direction is connected to a third opening; one of at least two first openings adjacent to each other in the column direction is connected to a third opening; the row direction intersects with the column direction;

[0050] and / or, in the first connection region, an orthographic projection of the second opening on the substrate is located within an orthographic projection of the second insulating layer on the substrate;

[0051] And / or, the first insulating layer includes a pixel defining layer, the pixel defining layer is located on a side of the first conductive layer away from the substrate, and the pixel defining layer is provided with a first opening;

[0052] And / or, the second insulating layer includes a first planarization layer, the first planarization layer is located between the first conductive layer and the first insulating layer; and the first planarization layer includes a third opening.

[0053] In a possible implementation of the present application, in the first connection region, the first conductive layer is provided with a fourth opening; and an orthographic projection of the fourth opening on the substrate is located outside an orthographic projection of the third opening on the substrate.

[0054] In a possible implementation of the present application, the display panel further includes a third insulating layer, which is located on a side of the first conductive layer away from the first insulating layer; the second conductive layer is located on a side of the first conductive layer away from the substrate;

[0055] and / or, in the first connection region, an orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the second opening and the third opening on the substrate;

[0056] And / or, the third insulating layer includes a second planarization layer, and the second planarization layer is located on a side of the first conductive layer away from the first insulating layer;

[0057] and / or, in the first connection region, the orthographic projection of a portion of the first opening on the substrate overlaps with the orthographic projection of the fourth opening on the substrate; the orthographic projection of a portion of the first opening on the substrate is outside the orthographic projection of the fourth opening on the substrate; or the orthographic projection of the fourth opening on the substrate is outside the orthographic projection of the first opening on the substrate;

[0058] and / or, in the first connection region, the orthographic projections of the second opening and the fourth opening on the substrate are located within the orthographic projection of the second insulating layer on the substrate;

[0059] And / or, the second insulating layer includes a first planarization layer, and in the first connection region, the orthographic projections of the second opening and the fourth opening on the substrate are located within the orthographic projections of the first planarization layer on the substrate;

[0060] and / or, the second insulating layer fills the fourth opening;

[0061] and / or, the second insulating layer is connected to the third insulating layer through the fourth opening;

[0062] And / or, the second insulating layer includes a first planarization layer, and the first planarization layer fills the fourth opening;

[0063] And / or, the third insulating layer includes a second planarization layer, and the first planarization layer is connected to the second planarization layer through a fourth opening.

[0064] In a possible implementation of the present application, in the first connection region, the first openings include first-type first openings and second-type first openings, an orthographic projection of the first-type first openings on the substrate overlaps an orthographic projection of the third openings on the substrate, and at least a portion of the second conductive layer is electrically connected to the first conductive trace through the connected first-type first openings and the third openings;

[0065] In the first connection region, an orthographic projection of the second type of first opening on the substrate at least partially overlaps with an orthographic projection of the second opening on the substrate.

[0066] In a possible implementation of the present application, the orthographic projection of the first opening of the first type on the substrate is located within the orthographic projection of the third opening on the substrate;

[0067] And / or, the first openings further include a third type of first openings, and the orthographic projections of the second type of first openings and / or the third type of first openings on the substrate are located outside the orthographic projections of the third openings on the substrate;

[0068] and / or, in the first connection region, the orthographic projection of the second type of first opening and / or the third type of first opening on the substrate is located within the orthographic projection of the second insulating layer on the substrate;

[0069] and / or, in the first connection region, the orthographic projection of the second type of first opening on the substrate is located within the orthographic projection of the second opening on the substrate;

[0070] and / or, in the first connection region, an orthographic projection of the third type of first opening on the substrate is located within an orthographic projection of the second conductive layer on the substrate;

[0071] And / or, in the first connection region, the first conductive layer is provided with a fourth opening, and in the first connection region, an orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the first opening of the first type and the second type of first opening on the substrate;

[0072] and / or, in the first connection region, an orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the second opening and the third opening on the substrate;

[0073] and / or, the orthographic projection of the third type of first opening on the substrate overlaps with the orthographic projection of the fourth opening on the substrate;

[0074] And / or, the display panel further comprises a first hole structure and a second hole structure located in the first connection area, the first hole structure comprises a first type of first opening and a third opening; the second hole structure comprises a second type of first opening and a second opening,

[0075] The display panel further comprises a first type of row arrangement structure and / or a second type of row arrangement structure located in the first connection area; in the first connection area, the first type of row arrangement structure comprises a first hole structure and a second hole structure arranged alternately in the first direction; and / or, the second type of row arrangement structure comprises a first hole structure and a fourth opening arranged alternately in the first direction; and / or, the display panel further comprises a first type of column arrangement structure and / or a second type of column arrangement structure located in the first connection area; the first type of column arrangement structure comprises a first hole structure and a second hole structure arranged alternately in the second direction; and / or, the second type of column arrangement structure comprises a first hole structure and a fourth opening arranged alternately in the second direction; the first direction and the second direction intersect;

[0076] And / or, in the first connection region, the first type of row arrangement structure and the second type of row arrangement structure are alternately arranged along the second direction; and / or, the first type of column arrangement structure and the second type of column arrangement structure are alternately arranged along the first direction;

[0077] and / or, in the first hole structure, the orthographic projection area of ​​the first opening of the first type on the substrate is smaller than the orthographic projection area of ​​the third opening on the substrate; and / or, in the second hole structure, the orthographic projection area of ​​the second type of first opening on the substrate is smaller than the orthographic projection area of ​​the second opening on the substrate; the orthographic projection of the first opening on the substrate is outside the orthographic projection of the fourth opening on the substrate;

[0078] and / or, in the first connection region, the density of the first openings of the first type is greater than the density of the first openings of the second type;

[0079] and / or, in the first connection region, the density of the first openings of the first type is greater than the density of the fourth openings;

[0080] and / or, in the first connection region, the density of the second type of first openings is equal to the density of the fourth openings;

[0081] and / or, in the first connection region, the density of the third openings is greater than the density of the fourth openings;

[0082] and / or, in the first connection region, the density of the first openings of the first type is equal to the density of the third openings;

[0083] and / or, in the first connection region, the density of the second type of first openings is equal to the density of the second openings;

[0084] and / or, in the first connection region, the density of the first pore structure is greater than the density of the second pore structure;

[0085] and / or, in the first connection region, the density of the first pore structure is greater than the density of the fourth openings;

[0086] And / or, in the first connection region, the density of the second pore structure is equal to the density of the fourth openings.

[0087] In a possible implementation of the present application, in the first connection region, the first conductive layer is provided with a fourth opening;

[0088] In the first connection region, an orthographic projection of the fourth opening on the substrate is located outside an orthographic projection of the second opening on the substrate;

[0089] and / or, in the first connection region, the orthographic projection of a portion of the first opening on the substrate overlaps with the orthographic projection of the fourth opening on the substrate; the orthographic projection of a portion of the first opening on the substrate is outside the orthographic projection of the fourth opening on the substrate; or the orthographic projection of the fourth opening on the substrate is outside the orthographic projection of the first opening on the substrate;

[0090] and / or, in the first connection area, the second openings and the first openings are alternately distributed in the first direction, and the second openings and the fourth openings are alternately distributed in the second direction, wherein the first direction and the second direction intersect;

[0091] and / or, in the first connection area, the fourth openings and the first openings are alternately distributed in the first direction, and the second openings and the fourth openings are alternately distributed in the second direction, wherein the first direction and the second direction intersect;

[0092] And / or, in the first connection area, the second openings and the first openings are alternately distributed in the first direction, and the first openings and the fourth openings are alternately distributed in the second direction, wherein the first direction and the second direction intersect.

[0093] In a possible implementation of the present application, in the first connection area, the second opening and the first opening are alternately distributed in the first direction, and the second opening and the fourth opening are alternately distributed in the second direction, wherein the first direction intersects the second direction; the row where the second opening and the first opening are located and the row where the fourth opening is located are alternately arranged along the column direction, and / or the column where the second opening and the fourth opening are located and the column where the first opening is located are alternately arranged along the row direction, and the row direction may be parallel to the first direction; and the column direction may be parallel to the second direction;

[0094] Alternatively, in the first connection area, the fourth opening and the first opening are alternately distributed in the first direction, and the second opening and the fourth opening are alternately distributed in the second direction, wherein the first direction intersects the second direction; the row where the fourth opening and the first opening are located and the row where the second opening is located are alternately arranged along the column direction, and / or the column where the second opening and the fourth opening are located and the column where the first opening is located are alternately arranged along the row direction, and the row direction may be parallel to the first direction; and the column direction may be parallel to the second direction;

[0095] Alternatively, in the first connection area, the second openings and the first openings are alternately arranged in the first direction, and the first openings and the fourth openings are alternately arranged in the second direction, wherein the first direction intersects the second direction; the second openings and the first openings are located in a row and ...

[0096] Alternatively, in the first connection area, the second opening and the first opening are alternately distributed in the first direction, the second opening and the first opening are alternately distributed in the second direction, the first opening and the fourth opening are alternately distributed in the first direction, and the first opening and the fourth opening are alternately distributed in the second direction, wherein the first direction and the second direction intersect; the row where the second opening and the first opening are located and the row where the first opening and the fourth opening are located are alternately arranged along the column direction, and / or the column where the first opening and the fourth opening are located and the column where the first opening and the second opening are located are alternately arranged along the row direction, and the row direction may be parallel to the first direction; the column direction may be parallel to the second direction.

[0097] In a possible implementation of the present application, in the first connection area, a plurality of first openings are arranged in an array, a plurality of second openings are arranged in an array, a plurality of fourth openings are arranged in an array, a density of the first openings is greater than or equal to a density of the fourth openings, and / or a density of the second openings is equal to a density of the fourth openings;

[0098] and / or, in the first connection region, the fourth opening is filled with an insulating material;

[0099] and / or, in the first connection region, an orthographic projection of the fourth opening on the substrate is located within an orthographic projection of the first insulating layer on the substrate;

[0100] and / or, the first connection region is located in a border region of the display panel;

[0101] And / or, the display panel further includes a third insulating layer, and the third insulating layer is located on a side of the first conductive layer away from the first insulating layer;

[0102] and / or, the third insulating layer is an organic layer,

[0103] And / or, the third insulating layer is a second planarization layer.

[0104] In one possible implementation of the present application, the display panel includes a display area and a first area, the first area is located on a side of the first connection area away from the first conductive trace, and / or the first area is located between the display area and the first connection area; the second conductive layer is provided with a fifth opening in the first area.

[0105] In a possible implementation of the present application, the second conductive layer includes at least part of the isolation structure; the display panel also includes a light-emitting device, the isolation structure encloses at least in the display area to form an isolation opening, and at least part of the light-emitting device is located in the isolation opening; in the display area, a plurality of isolation openings are arranged in an array; in the first area, a plurality of fifth openings are arranged in an array; the fifth openings and the isolation openings are arranged in the same manner;

[0106] And / or, the display panel further includes a dummy light emitting device, and in the first region, the fifth opening is filled with a film layer of at least a portion of the dummy light emitting device, wherein the first region is located in a non-display region of the display panel;

[0107] and / or, an orthographic projection of the first conductive trace on the substrate is located in a non-display area outside the first area;

[0108] and / or, in the first connection region, a plurality of second openings are arranged in an array; the second openings and the fifth openings are arranged in the same manner; and / or, an orthographic projection area of ​​the second openings on the substrate is smaller than an orthographic projection area of ​​the fifth openings on the substrate;

[0109] and / or, the isolation opening and the corresponding fifth opening have the same shape and size;

[0110] And / or, the display panel further includes a pixel circuit, the pixel circuit is electrically connected to the first electrode of the light-emitting device corresponding to the isolation opening of the display area, and the dummy light-emitting device corresponding to the fifth opening is insulated from the pixel circuit;

[0111] And / or, the first conductive layer is located between the film layer where the light-emitting device is located and the substrate;

[0112] And / or, the first insulating layer includes a pixel defining layer, the pixel defining layer is provided with a pixel opening, in the first connection region, the pixel opening is connected to the corresponding isolation opening, and the pixel opening exposes at least a portion of the first electrode of the light emitting device;

[0113] And / or, in the first region, the pixel opening is connected to the corresponding fifth opening, and the pixel opening exposes at least a portion of the first electrode of the dummy light-emitting device.

[0114] In a possible implementation of the present application, the display panel further includes a second area, the second area is located on a side of the first connection area close to the first conductive trace, and / or the second area is located on a side of the first connection area away from the display area of ​​the display panel, and in the second area, the first conductive trace is provided with a sixth opening.

[0115] In a possible implementation of the present application, in the second region, the sixth opening is filled with an insulating material;

[0116] and / or, an orthographic projection of the second conductive layer on the substrate is located outside the second region;

[0117] and / or, in the first connection area, the plurality of first openings are arranged in an array, and the plurality of second openings are arranged in an array; in the second area, the plurality of sixth openings are arranged in an array;

[0118] and / or, the density of the first opening is greater than or equal to the density of the sixth opening, and / or, the density of the second opening is equal to the density of the sixth opening;

[0119] and / or, the opening density of the first connection region is greater than the opening density of the second region;

[0120] and / or, in the first connection region, the first conductive layer is provided with a fourth opening;

[0121] and / or, the plurality of fourth openings are arranged in an array;

[0122] and / or, the density of the fourth opening is equal to the density of the sixth opening;

[0123] and / or, the arrangement of the plurality of fourth openings is the same as the arrangement of the plurality of sixth openings;

[0124] and / or, in the second region, the first insulating layer is provided with a seventh opening, and the orthographic projection of part or all of the seventh opening on the substrate overlaps with the orthographic projection of the sixth opening on the substrate; and / or, the orthographic projection of part or all of the seventh opening on the substrate is located outside the orthographic projection of the sixth opening on the substrate;

[0125] and / or, in the second region, a plurality of seventh openings are arranged in an array;

[0126] and / or, in the second region, the density of the seventh openings is equal to the density of the sixth openings;

[0127] and / or, the density of the seventh openings in the second region is less than or equal to the density of the first openings in the first connection region;

[0128] and / or, the arrangement of the plurality of seventh openings is the same as the arrangement of the plurality of first openings;

[0129] And / or, the display panel also includes a third insulating layer, which is located on a side of the first conductive layer away from the first insulating layer; the third insulating layer is located between the first conductive layer and the substrate, and the orthographic projection of the sixth opening on the substrate is located within the orthographic projection of the third insulating layer on the substrate.

[0130] In a possible implementation of the present application, the first connection area is located in a border area of ​​the display panel;

[0131] And / or, the first conductive trace is used to transmit a first power supply voltage signal;

[0132] And / or, the display panel further comprises a light emitting device, and in a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting material layer and a second electrode which are stacked; the second electrode is electrically connected to the first conductive trace;

[0133] And / or, the second conductive layer includes at least part of an isolation structure, at least part of the isolation structure is located between the light-emitting devices, and the second electrode is electrically connected to the first conductive trace through the isolation structure;

[0134] And / or, the first conductive layer further includes a second conductive trace, the second conductive trace is insulated from the first conductive trace, and the second conductive trace is used to transmit a second power supply voltage signal;

[0135] And / or, the display panel further includes a pixel circuit, the pixel circuit is electrically connected to the first electrode of the light-emitting device, and the second conductive trace is electrically connected to the pixel circuit;

[0136] And / or, the display panel further includes:

[0137] A plurality of conductive material layers are stacked in sequence between the substrate and the film layer where the light-emitting device is located, and an insulating layer is arranged between adjacent conductive material layers;

[0138] The first conductive layer is a conductive material layer farthest from the substrate among the multiple conductive material layers.

[0139] In a possible implementation of the present application, the isolation structure includes a first isolation portion and a second isolation portion, and in a direction away from the substrate, the first isolation portion and the second isolation portion are stacked in sequence;

[0140] The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0141] An orthographic projection area of ​​the first isolation portion on the substrate is smaller than an orthographic projection area of ​​the second isolation portion on the substrate.

[0142] In a possible implementation of the present application, the isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence;

[0143] The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate;

[0144] and / or, an orthographic projection area of ​​the first isolation portion on the substrate is smaller than an orthographic projection area of ​​the third isolation portion on the substrate;

[0145] And / or, the material of the first isolation portion includes aluminum, silver or copper, the material of the second isolation portion includes titanium or molybdenum, and the material of the third isolation portion includes molybdenum or titanium;

[0146] And / or, the display panel further comprises a first encapsulation layer, the first encapsulation layer comprises a plurality of encapsulation units arranged at intervals, and is located on a side of the light-emitting device away from the substrate, and different encapsulation units are used to encapsulate light-emitting devices in different isolation openings,

[0147] and / or, two adjacent packaging units are disconnected at a side of the isolation structure away from the substrate;

[0148] And / or, an edge of the packaging unit is located on a side of the isolation structure away from the substrate, and is spaced apart from a side of the isolation structure away from the substrate;

[0149] and / or, the packaging unit is an inorganic packaging unit;

[0150] And / or, the display panel further includes a second encapsulation layer;

[0151] The second encapsulation layer is located on a side of the first encapsulation layer away from the substrate, and the second encapsulation layer at least covers the first encapsulation layer; in the first connection area, the second opening is filled with the second encapsulation layer;

[0152] and / or, the second encapsulation layer has a flat surface on a side away from the substrate;

[0153] And / or, the display panel further includes a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate;

[0154] And / or, the third encapsulation layer is an inorganic encapsulation layer, and the second encapsulation layer is an organic encapsulation layer.

[0155] In a fourth aspect, the present application further provides a method for preparing a display panel, wherein the display panel has a display area and a non-display area, wherein the non-display area includes a first connection area, and the method includes:

[0156] providing a substrate;

[0157] Fabricating a first conductive layer on the substrate, wherein the first conductive layer includes a first conductive trace;

[0158] A first insulating layer is formed on a side of the first conductive layer away from the substrate, and a first opening is formed on the first insulating layer;

[0159] An isolation structure layer is formed on a side of the first insulating layer away from the first conductive layer, and a second opening located in the first connection area and an isolation opening located in the display area are formed in the isolation structure layer, so that in the first connection area, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through at least one first opening, and an orthographic projection of the first opening on the substrate is located outside an orthographic projection of the second opening on the substrate;

[0160] A light emitting device layer is manufactured, wherein the light emitting device layer includes a plurality of light emitting devices, and at least a portion of the light emitting devices is located in the isolation opening.

[0161] In a fifth aspect, the present application also provides an electronic device, the electronic device comprising the display panel of any one of the first aspect or the display panel of the second aspect or the display panel of the third aspect.

[0162] The present application provides a display panel, a method for manufacturing a display panel, and an electronic device, in which at least part of a second conductive layer is connected to a first conductive trace in the first conductive layer through at least one first opening, the second conductive layer is provided with a second opening in a first connection region, and the orthographic projection of at least one first opening on a substrate is outside the orthographic projection of at least one second opening on a substrate. The stability of signal transmission can be ensured, thereby ensuring that the display panel has a good display effect and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0163] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0164] Figure 1 A schematic diagram illustrating the regional distribution of the display panel provided in this embodiment;

[0165] Figure 2a Example Figure 1 One of the partial cross-sectional schematic diagrams of the first connection area in the MM direction;

[0166] Figure 2b One of the schematic diagrams of the opening distribution in the first connection zone is illustrated;

[0167] Figure 3 An example of a connection diagram of the conductive traces in the first conductive layer provided in this embodiment in the border area is provided;

[0168] Figure 4 Example Figure 1 One of the partial cross-sectional schematic diagrams of the display area in the NN direction;

[0169] Figure 5 Example Figure 1 The second schematic diagram of a partial cross section of the display area in the NN direction;

[0170] Figure 6 A schematic diagram illustrating the positional relationship between the isolation opening and the light emitting device is shown;

[0171] Figure 7a One of the schematic diagrams of opening holes in the border area is illustrated;

[0172] Figure 7b One of the partial cross-sectional schematic diagrams of the first region is illustrated;

[0173] Figure 8 Example Figure 1 The third schematic diagram of the local cross section of the middle display area in the NN direction;

[0174] Fig. 9 Example Figure 1 The fourth schematic diagram of a partial cross section of the middle display area in the NN direction;

[0175] Fig.10 Example Figure 1 The fifth schematic diagram of the local cross section of the middle display area in the NN direction;

[0176] Fig.11 Example Figure 1 The sixth schematic diagram of the local cross section of the middle display area in the NN direction;

[0177] Fig.12a Example Figure 1 The second schematic diagram of a partial cross section of the first connection area in the MM direction;

[0178] Figure 12bThe second schematic diagram of the opening distribution of the first connection zone is illustrated;

[0179] Fig.13a Example Figure 1 The third schematic diagram of the local cross section of the first connection area in the MM direction;

[0180] Fig.13b Example Figure 1 Schematic diagram of a partial cross section of the first connection area in the MM direction (IV);

[0181] Fig.13c Example Figure 1 Schematic diagram of a partial cross section of the first connection area in the MM direction No. 5;

[0182] Fig.13d Example Figure 1 Schematic diagram of a partial cross section of the first connection area in the MM direction No. 6;

[0183] Fig.14a Example Figure 1 Schematic diagram of a partial cross section of the first connection area in the MM direction No. 7;

[0184] Fig.14b Example Figure 1 Schematic diagram of a partial cross section of the first connection area in the MM direction No. 8;

[0185] Fig.14c The third schematic diagram of the opening distribution of the first connection zone is illustrated;

[0186] Fig.14d The fourth schematic diagram of the opening distribution of the first connection zone is illustrated;

[0187] Fig.14e The fifth schematic diagram of the opening distribution of the first connection zone is illustrated;

[0188] Fig.14f The sixth schematic diagram of the opening distribution of the first connection zone is illustrated;

[0189] Figure 14g The seventh schematic diagram of the opening distribution of the first connection zone is illustrated;

[0190] Figure 14h An eighth schematic diagram of the opening distribution of the first connection zone is illustrated;

[0191] Fig.14i Example Figure 1 9. Schematic diagram of a partial cross section of the first connection area in the MM direction;

[0192] Fig.14j Example Figure 1 Schematic diagram of a local cross section of the first connection area in the MM direction No. 10;

[0193] Figure 14k The ninth schematic diagram of the opening distribution of the first connection zone is illustrated;

[0194] Fig.15 The second schematic diagram of the opening of the border area is illustrated;

[0195] Fig.16a One of the partial cross-sectional schematic diagrams of the second region is illustrated;

[0196] Fig.16b A second partial cross-sectional schematic diagram of the second region is illustrated;

[0197] Fig.16c The third schematic diagram of the opening of the border area is illustrated;

[0198] Fig.17 The schematic diagram illustrates a process flow of a method for manufacturing a display panel provided in this embodiment.

[0199] Main icons: 1-display panel; 101-first connection area; 102-first area; 103-second area; 111-transistor; 12-first conductive layer; 121-first conductive trace; 122-second conductive trace; 1201-fourth opening; 1202-sixth opening; 1101-substrate; 1102-buffer layer; 1103-active layer; 1104-gate insulating layer; 1105-gate; 1106-source; 1107-drain; 1108-capacitor dielectric layer; 1109-interlayer insulating layer; 111-transistor; 1110-first capacitor electrode; 1111-second capacitor electrode; 13-first insulating layer ;1301-first opening;131-pixel defining layer;14-second conductive layer;1401-second opening;1402-fifth opening;15-light-emitting device;151-first electrode;152-light-emitting material layer;153-second electrode;16-isolation structure;161-isolation opening;162-first isolation part;163-second isolation part;164-third isolation part;171-first encapsulation layer;1711-encapsulation unit;172-second encapsulation layer;173-third encapsulation layer;18-second insulating layer;1801-third opening;181-first planarization layer;19-third insulating layer;191-second planarization layer. DETAILED DESCRIPTION

[0200] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0201] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another. It will also be understood that expressions used in the singular include plural expressions unless the expression in the singular has an obviously different meaning in the context.

[0202] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0203] In some display panels, in order to reduce the difficulty of the evaporation process of the light-emitting material, an isolation structure is arranged on the first insulating layer between the pixel openings. When the light-emitting material layer and the cathode layer are evaporated throughout the entire layer, the light-emitting material layer and the cathode layer between adjacent pixel openings can be disconnected at the position of the isolation structure. Through multiple evaporation and multiple etching processes, corresponding pixel unit film layers (i.e., light-emitting device patterning) can be formed in the pixel openings corresponding to light-emitting devices of different colors, and different light-emitting devices are packaged using separate packaging units.

[0204] Patent PCT / CN2023 / 134518, patent 202310759370.2, patent 202310740412.8, patent 202310707209.0, patent 202311499823.9, patent 202310692671.8, patent 202311091555.7 and patent 202311346196.5 record relevant technical solutions of isolation structure and encapsulation layer, and their contents are incorporated into this application by reference for reference.

[0205] The inventors have discovered that the above-mentioned display panel may have the problem of poor display effect (for example, low display uniformity). After analyzing the above-mentioned problem, the inventors found that in the above-mentioned display panel, the cathode layer of the light-emitting device is overlapped with the conductive layer (for example, which can be used to form an isolation structure), and the cathodes of different light-emitting devices are connected together through the conductive layer (which can be used to form an isolation structure), and the power supply voltage signal (for example, ELVSS signal) is provided through the conductive layer (such as the film layer where the isolation structure is located) and the conductive trace in the border area. The main reason for the above-mentioned problem is the unstable electrical connection between the conductive trace and the conductive layer.

[0206] After further analyzing the reasons for the unstable electrical connection between the conductive traces and the conductive layer, the inventors found that it was mainly because the gas released from the film layer below the isolation structure may accumulate at the electrical connection position, which can easily cause the isolation structure layer to separate from the film layer below, and further cause the conductive traces and the conductive layer to peel off at the electrical connection position. Specifically, the patterning process of the light-emitting device layer involves a high-temperature process, which will cause the film layer below the isolation structure (such as the organic material layer) to release gas under high temperature conditions. If the released gas cannot be discharged in time, it will accumulate between the film layers, such as at the electrical connection position. In this way, under the action of the continuously accumulated gas pressure, the conductive traces and the conductive layer will separate from each other at the electrical connection position, causing peeling.

[0207] In order to ensure the display effect of the above-mentioned display panel, the conductive traces need to be stably connected to the conductive layer in the frame area. For this purpose, the inventor innovatively designs the following technical solutions to solve the above-mentioned technical problems. The specific implementation scheme of this application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above-mentioned solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in this embodiment below for the above-mentioned problems should all be the contributions made by the inventor to this application in the process of invention and creation, and should not be understood as technical contents known to those skilled in the art.

[0208] Please refer to Figure 1 and Figure 2a , Figure 1 The schematic diagram of the regional distribution of the display panel provided by this embodiment is illustrated. Figure 1 is a top view, Figure 2a Example Figure 1 Schematic diagram of the cross section of the middle frame area in the MM direction. In this embodiment, exemplarily, the display panel 1 includes a display area 1A and a frame area 1B, the frame area 1B is arranged around at least part of the display area 1A, the display area 1A is used to display an image, and the frame area 1B can be arranged as various signal routings for providing electrical signals to the light-emitting devices in the display area 1A. Exemplarily, taking the shape of the display panel 1 as a rectangle as an example, the display area 1A can be a rectangle, the frame area 1B can be a rectangular ring surrounding the display area 1A, and the frame area 1B can be formed by enclosing an upper frame area, a lower frame area, a left frame area, and a right frame area. The frame area 1B can be located in the non-display area of ​​the display panel.

[0209] The display panel 1 includes a substrate 1101, a first conductive layer 12, a first insulating layer 13 and a second conductive layer 14. The first conductive layer 12 is located on the substrate 1101. The first conductive layer 12 includes a first conductive trace 121. The first insulating layer 13 is provided with a first opening 1301. For example, the first opening 1301 penetrates the first insulating layer 13 in a direction perpendicular to the plane where the substrate 1101 is located (Z direction in the figure). The second conductive layer 14 is located on a side of the first insulating layer 13 away from the first conductive layer 12. At least part of the second conductive layer 14 is electrically connected to the first conductive trace 121 through the first connection area 101, wherein the first connection area 101 may be located Figure 1 The display area 1A in the Figure 1 In the border area 1B. In detail, in the first connection area 101, at least part of the second conductive layer 14 is electrically connected to the first conductive trace 121 through at least one (for example, multiple) first openings 1301, and the second conductive layer 14 is provided with a second opening 1401 in the first connection area 101, for example, the second opening 1401 penetrates the second conductive layer 14 in a direction perpendicular to the plane where the substrate 1101 is located (Z direction in the figure). In this embodiment, the orthographic projection of at least one first opening 1301 on the substrate 1101 is located outside the orthographic projection of at least one second opening on the substrate 1101. The orthographic projection of at least one first opening 1301 on the substrate 1101 does not overlap with the orthographic projection of at least one second opening on the substrate 1101, or is separated, or is arranged at intervals. For example, the orthographic projection of the first opening 1301 on the substrate 1101 is located outside the orthographic projection of the second opening on the substrate 1101.

[0210] In the above structure, at least part of the second conductive layer 14 is connected to the first conductive trace 121 in the first conductive layer 12 through the first opening 1301, and the second conductive layer 14 is provided with the second opening 1401 in the first connection area 101, and the orthographic projection of at least one first opening 1301 on the substrate 1101 is located outside the orthographic projection of at least one second opening 1401 on the substrate 1101. In this way, the second conductive layer 14 and the first conductive trace 121 can have a larger connection area, and the second opening 1401 can release the gas generated by the film layer and / or the first insulating layer below the second conductive layer 14, so as to avoid the gas from accumulating at the connection position between the second conductive layer 14 and the first conductive trace 121, thereby ensuring that the second conductive layer 14 and the first conductive trace 121 can be stably connected. At the same time, the connection between the second conductive layer 14 and the first conductive trace 121 can be achieved only through the first opening 1301, so that the connection distance can be shortened to reduce the connection impedance, and the stability of signal transmission can be ensured, thereby ensuring that the display panel 1 has a good display effect and improving the user experience.

[0211] Optionally, the first conductive layer 12, the first insulating layer 13, and the second conductive layer 14 are located on the same side of the substrate 1101. Optionally, the first conductive layer 12, the first insulating layer 13, and the second conductive layer 14 are sequentially stacked along a direction Z away from the substrate 1101. Alternatively, the second conductive layer 14, the first insulating layer 13, and the first conductive layer 12 are sequentially stacked along a direction Z away from the substrate 1101.

[0212] In this embodiment, the first insulating layer 13 includes an organic layer or an inorganic layer. The first insulating layer 13 may be an organic layer, or the first insulating layer 13 may be an inorganic layer. Figure 2a The first insulating layer 13 includes a pixel defining layer 131, which is located on a side of the first conductive layer 12 away from the substrate 1101, and a first opening 1301 is provided on the pixel defining layer; or, the first insulating layer 13 includes a first planarization layer, which is located on a side of the first conductive layer 12 away from the substrate 1101, and a first opening 1301 is provided on the first planarization layer.

[0213] The pixel defining layer 131 may include a pixel opening and a pixel defining portion. The light-emitting material layer may be located in the pixel opening. The pixel defining portion may be enclosed to form the pixel opening. The isolation structure is located on the side of the pixel defining layer 131 away from the first conductive layer, or the isolation structure is located in the give-way opening in the pixel defining layer 131. The film layer where the first electrode is located is located between the pixel defining layer 131 and the first planarization layer. In the first connection area 101, the pixel opening may be connected to the corresponding isolation opening. The pixel opening may expose at least part of the first electrode of the light-emitting device. The pixel defining layer 131 may be an inorganic insulating layer. Optionally, in the first connection area 101, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening 161 on the substrate. Optionally, in the first connection area 101, the orthographic projection area of ​​the pixel opening on the substrate is smaller than the orthographic projection area of ​​the isolation opening 161 on the substrate.

[0214] The first openings 1301 may be evenly distributed in the first connection region 101 to ensure that the electrical connection points between the second conductive layer 14 and the first conductive trace 121 are sufficient and evenly distributed, thereby ensuring the electrical connection effect.

[0215] For example, in the first connection area 101, a plurality of first openings 1301 are arranged in a first direction (the X-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and / or a plurality of first openings 1301 are arranged in a second direction (the Y-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. The first openings 1301 may be polygonal or circular, such as rectangular, square, or strip.

[0216] The second openings 1401 may be evenly distributed in the first connection area 101 to ensure that there are enough exhaust points and that they are evenly distributed, thereby avoiding gas accumulation leading to film separation and poor electrical connection.

[0217] For example, in the first connection area 101, a plurality of second openings 1401 are arranged in a first direction (such as the X-axis direction in the figure) (for example, they can be arranged at equal intervals or at unequal intervals), and / or a plurality of second openings 1401 are arranged in a second direction (such as the Y-axis direction in the figure) (for example, they can be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. The second opening 140 can be polygonal or circular, such as rectangular, square, or strip.

[0218] In some embodiments, please refer to Figure 2b , illustratively, in the first connection area 101 , the first openings 1301 and the second openings 1401 are alternately arranged in a first direction (eg, the X-axis direction in the figure).

[0219] Exemplarily, in the first connection area 101, the plurality of first openings 1301 are arranged in the second direction (such as the Y-axis direction in the figure), and the first direction and the second direction intersect. Optionally, in the first connection area 101, the plurality of first openings 1301 may be arranged in an array, for example, including multiple rows and columns.

[0220] Exemplarily, in the first connection area 101, the plurality of second openings 1401 are arranged in a second direction (eg, the Y-axis direction in the figure). Optionally, in the first connection area 101, the plurality of second openings 1401 are arranged in an array, for example, including multiple rows and columns.

[0221] For example, in the first connection area 101, the plurality of first openings 1301 are arranged in an array, the plurality of second openings 1401 are arranged in an array, and the density of the first openings 1301 is greater than or equal to the density of the second openings 1401. For example, in the first connection area 101, the spacing between two adjacent first openings 1301 is less than the spacing between two adjacent second openings 1401.

[0222] The density of the first openings 1301 may not be equal to the density of the second openings 1401. The density of the first openings 1301 may be greater than the density of the second openings 1401.

[0223] In this embodiment, in the first connection region 101 , the orthographic projection of the second opening 1401 on the substrate 1101 is located within the orthographic projection of the first insulating layer 13 on the substrate 1101 .

[0224] Please refer to Figure 3In this embodiment, the first conductive trace 121 is used to transmit a first power supply voltage signal (e.g., an ELVSS signal). In the first connection area 101, at least a portion of the second conductive layer 14 is electrically connected to the first conductive trace 121 through the first opening 1301. The first conductive trace 121 can provide the same power supply voltage signal for different light-emitting devices in the display area 1A. Exemplarily, the first connection area 101 is located in the border area 1B of the display panel 1. In this embodiment, unless otherwise specified, in the following description, the first connection area 101 is located in the border area 1B of the display panel 1 for description.

[0225] For further information, please refer to Figure 4 , the display panel 1 further includes a light emitting device 15. In the direction Z away from the substrate 11, the light emitting device 15 includes a first electrode 151, a light emitting material layer 152 and a second electrode 153 arranged in layers, and the second electrode 153 is connected to the first conductive trace 121. In this embodiment, the second conductive layer 12 includes at least part of the isolation structure 16, and at least part of the isolation structure 16 is located between the light emitting devices 15. In detail, the second electrode 153 is electrically connected to the first conductive trace 121 through the isolation structure 16. The isolation structure can enclose a plurality of isolation openings. The isolation structure can form a plurality of light emitting units of various different colors arranged at intervals and a second electrode corresponding to the light emitting unit in the light emitting layer and the electrode layer without a fine metal mask, thereby reducing the preparation cost of the display panel. The isolation structure 16 can isolate the light emitting material layer 152 and the second electrode 153 in the light emitting device 15, so that different light emitting devices 15 are independent of each other, so as to improve the crosstalk between adjacent light emitting devices 15 and enhance the display effect. Adjacent light emitting devices 15 are independent of each other and can be independently packaged to improve the packaging yield. At the same time, due to the existence of the isolation structure, the light-emitting material layer 152 and the second electrode 153 in each color of the light-emitting device 15 in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask plate to save the production cost of the display panel. At least part of the isolation structure 16 can be located between adjacent light-emitting devices 15.

[0226] Please refer again Figure 3, the first conductive layer 12 further includes a second conductive trace 122, the second conductive trace 122 and the first conductive trace 121 are insulated, wherein the second conductive trace 122 is used to transmit a second power supply voltage signal. The first power supply voltage signal and the second power supply voltage signal are different voltage signals, one of the second power supply voltage signal and the first power supply voltage signal is a high voltage (for example, ELVDD), and the other is a low voltage (for example, ELVSS). Exemplarily, the voltage value of the second power supply voltage signal is greater than the voltage value of the first power supply voltage signal, that is, the first conductive trace 121 transmits a first power supply voltage signal with a smaller voltage value, and the second conductive trace 122 transmits a second power supply voltage signal with a larger voltage value. In this embodiment, a chip can be used to provide power supply voltage signals for the first conductive trace 121 and the second conductive trace 122 respectively, and the chip can include a display driver chip 3 (DDIC) and / or a power chip 2 (POWER IC). The power chip 2 can be bound and connected to a flexible circuit board FPC. The display driver chip 3 can be bound and connected to a display panel. The flexible circuit board FPC can be bound and connected to the display driver chip 3. The power chip 2 can provide a power voltage signal to the first conductive trace 121 and the second conductive trace 122 .

[0227] In this embodiment, the display panel 1 further includes a pixel circuit, the pixel circuit is electrically connected to the first electrode 151 of the light emitting device 15, and the second conductive trace 122 is electrically connected to the pixel circuit. The pixel circuit may include a transistor and a storage capacitor. The pixel circuit may generate a driving current to drive the light emitting device 15 to emit light.

[0228] Please refer to Figure 5 The display panel 1 further includes a plurality of conductive material layers, which are sequentially stacked between the substrate 1101 and the film layer where the light-emitting device 15 is located, and an insulating layer is provided between adjacent conductive material layers, wherein the first conductive layer 12 is the conductive material layer farthest from the substrate 1101 among the plurality of conductive material layers. With such a design, the connection distance between the second conductive layer 14 and the first conductive trace 121 can be reduced, thereby reducing the connection impedance. Optionally, the first conductive layer 12 is the conductive material layer closest to the second conductive layer 14 among the plurality of conductive material layers.

[0229] Optionally, the first conductive layer is a conductive material layer that is adjacent to the conductive material layer farthest from the substrate among the multiple conductive material layers. The first conductive material layer 12 may be a conductive material layer M4. For example, five conductive material layers are stacked in sequence between the substrate 1101 and the film layer where the light-emitting device 15 is located, and the conductive material layer farthest from the substrate among the five conductive material layers is the fifth conductive material layer. The first conductive layer 12 may be the fifth conductive material layer or the fourth conductive material layer. The fourth conductive material layer M4 is a conductive material layer that is adjacent to the conductive material layer farthest from the substrate among the multiple conductive material layers, and there are three conductive material layers between the fourth conductive material layer M4 and the substrate 1101. An insulating layer is provided between adjacent conductive material layers.

[0230] Further, please refer again to Figure 5 The display panel 1 further includes an active layer 1103, the active layer 1103 includes a source region (S region), a channel region (P-si region) and a drain region (D region), the transistor 111 in the pixel circuit includes a gate 1105, a source 1106 and a drain 1107 formed by a conductive material layer, the orthographic projection of the gate 1105 on the substrate 1101 overlaps the orthographic projection of the channel region on the substrate 1101, the source 1106 is connected to the source region, and the drain 1107 is connected to the drain region. In this embodiment, the first electrode 151 is connected to the source 1106 or the drain 1107 of the transistor 111.

[0231] Please refer again Figure 5 , the specific film layer structure of the array substrate forming the pixel circuit is described in detail below. Figure 5 It is the film structure of the display area.

[0232] The array substrate may include a substrate 1101 , a buffer layer 1102 , an active layer 1103 , a plurality of conductive material layers, and an insulating layer located between adjacent conductive material layers.

[0233] The substrate 1101 may be a rigid substrate (e.g., a glass substrate) or a flexible substrate (e.g., including a polyimide layer). The buffer layer 1102 is located on one side of the substrate 1101. The active layer 1103 is located on the side of the buffer layer 1102 away from the substrate 1101. In this embodiment, the buffer layer 1102 may be formed of an inorganic material, such as silicon oxide, silicon nitride, silicon oxynitride, etc. In this embodiment, the buffer layer 1102 may be a double-layer structure of a silicon nitride (SiNx) layer and a silicon oxide (SiOx) layer sequentially formed on the substrate 1101.

[0234] The active layer 1103 is formed on the buffer layer 1102 and partially covers the buffer layer 1102. The active layer 1103 can be formed of an inorganic semiconductor (such as amorphous silicon or polycrystalline silicon), an organic semiconductor or an oxide semiconductor. The active layer 1103 can include a source region (S), a drain region (D) and a channel region (such as P-Si).

[0235] A plurality of conductive material layers and insulating layers between adjacent conductive material layers form a gate insulating layer 1104, a gate 1105, a source 1106, a drain 1107, a capacitor dielectric layer 1108, an interlayer insulating layer 1109, and a first capacitor electrode 1110 and a second capacitor electrode 1111 for forming a capacitor. The storage capacitor may include the first capacitor electrode 1110 and the second capacitor electrode 1111.

[0236] The gate insulating layer 1104 is formed on the active layer 1103 and the buffer layer 1102 not covered by the active layer 1103 to insulate and isolate the active layer 1103 from the gate 1105. The gate insulating layer 1104 may be made of materials such as silicon oxide or silicon nitride, but is not limited thereto.

[0237] The gate 1105 is formed on one side of the gate insulating layer 1104 at a position corresponding to the active layer 1103. The gate 1105 can be formed using one or more of metals such as Al, Mo, Cu, Ti or other metal materials with low resistivity. At the same time, a first capacitor electrode 1110 of a capacitor is also formed on the gate insulating layer 1104. The first capacitor electrode 1110 is formed on the gate insulating layer 1104 and partially covers the gate insulating layer 1104. The material of the first capacitor electrode 1110 and the gate 1105 can be the same. A first conductive material layer (e.g., a first metal layer M1) can be made on the gate insulating layer 1104 to achieve the purpose of simultaneously making the gate 1105 and the first capacitor electrode 1110.

[0238] The capacitor dielectric layer 1108 is formed on the gate insulating layer 1104 and covers the gate 1105 and the first capacitor electrode 1110. The second capacitor electrode 1111 is located on the side of the capacitor dielectric layer 1108 corresponding to the first capacitor electrode 1110 that is away from the substrate 1101. The orthographic projection of the second capacitor electrode 1111 on the substrate 1101 overlaps with the orthographic projection of the first capacitor electrode 1110 on the substrate 1101. The capacitor dielectric layer 1108 is used to insulate and isolate the gate 1105 from the source 1106 and the drain 1107, and to insulate and isolate the first capacitor electrode 1110 from the second capacitor electrode 1111. The capacitor dielectric layer 1108 electrically insulates the gate 1105 from the source 1106 and the drain 1107, respectively, and forms a storage capacitor with the first capacitor electrode 1110 and the second capacitor electrode 1111. The capacitor dielectric layer 1108 can also be formed of inorganic materials, such as silicon nitride and silicon oxide. The second capacitor electrode 1111 is located in a second conductive material layer (eg, a second metal layer M2 ) formed above the capacitor dielectric layer 1108 .

[0239] The interlayer insulating layer 1109 is formed on the capacitor dielectric layer 1108 and covers the second capacitor electrode 1111, and is used to isolate the source electrode 1106, the drain electrode 1107 and the second capacitor electrode 1111, so that the source electrode 1106, the drain electrode 1107 and the second capacitor electrode 1111 are insulated from each other. The interlayer insulating layer 1109 can also be formed of an inorganic material (such as silicon nitride and silicon oxide). The structure of the interlayer insulating layer 1109 can be a double-layer or triple-layer structure formed of silicon nitride and silicon oxide.

[0240] The source electrode 1106 and the drain electrode 1107 are formed on the interlayer insulating layer 1109, and the source electrode 1106 is electrically connected to the source region (S) in the active layer 1103 through a through hole, and the drain electrode 1107 is electrically connected to the drain region (D) in the active layer 1103 through a through hole. The electrode materials of the gate electrode 1105, the source electrode 1106, the drain electrode 1107, the first capacitor electrode 1110, and the second capacitor electrode 1111 can be one or more of metal Al, Mo, Cu, Ti or other metal materials with low resistivity. The source electrode 1106 and the drain electrode 1107 are located in a third conductive material layer (third metal layer M3) made on the interlayer insulating layer 1109. In this embodiment, the driving layer 13 includes a TFT (Thin Film Transistor) structure formed by the gate electrode 1105, the source electrode 1106, the drain electrode 1107 and the active layer 1103.

[0241] The film layer structure of the above-mentioned array substrate is only an example provided in this embodiment. In other embodiments, the array substrate may include more film layers or only include part of the above-mentioned film layers.

[0242] In this embodiment, please combine Figure 1 , refer to Figure 6 , Figure 7a and Figure 7b The second conductive layer 14 includes at least part of the isolation structure 16, the display panel 1 also includes light emitting devices 15, and at least part of the isolation structure 16 is located between the light emitting devices 15. The display panel 1 also includes a first region 102, the first region 102 is located on a side of the first connection region 101 away from the first conductive trace 12, and the second conductive layer 14 is provided with a fifth opening 1402 in the first region 102.

[0243] Optionally, the first region 102 is located between the display region 10A and the first connection region 101. Exemplarily, the first region 102 is located in the non-display region and / or the frame region of the display panel. The first connection region 101 and the first region 102 are both located in the frame region 10B. The isolation structure 16 encloses at least the display region 1A to form an isolation opening 161, and at least a portion of the light-emitting device 15 is located in the isolation opening 161.

[0244] Optionally, the second conductive layer 14 is provided with a fifth opening 1402 in the first region 102. Optionally, the display panel further includes a dummy light-emitting device 15', and in the first region 102, the fifth opening 1402 is filled with a film layer of at least part of the dummy light-emitting device 15', and the film layer of the dummy light-emitting device 15' filled in the fifth opening 1402 can be manufactured simultaneously with the film layer of the light-emitting device 15 evaporated in the isolation opening 161 in the display area 1A, for example, the fifth opening 1402 is filled with an evaporated light-emitting material layer 152 and a second electrode 153, and for another example, the fifth opening 1402 is filled with a light-emitting material layer 152, but the first region 102 does not have a first electrode 151 and / or a second electrode 153. In this embodiment, the first electrode of the light-emitting device corresponding to the fifth opening 1402 is not connected to an external signal, and is not electrically connected to the pixel circuit. For example, the second insulating layer is not provided with a via hole electrically connecting the first electrode of the dummy light-emitting device corresponding to the fifth opening 1402 and the pixel circuit. Even if a complete light-emitting device 15' is formed in the fifth opening 1402, the light-emitting device 15' will not emit light, that is, the first area 102 is located in the non-display area and / or the frame area of ​​the display panel. Exemplarily, other insulating materials can also be filled in the fifth opening 1402. The fifth opening 1402 can penetrate the second conductive layer 14 in a direction perpendicular to the plane where the substrate 1101 is located (Z direction in the figure).

[0245] In this embodiment, the orthographic projection of the first conductive trace 121 on the substrate 11 is located in the non-display area outside the first area 102 .

[0246] In this embodiment, please refer to Figure 7a and Figure 7bIn the display area 1A, a plurality of isolation openings 161 are arranged in an array. In the first area 102, a plurality of fifth openings 1402 are arranged in an array. The fifth opening 1402 and the isolation opening 161 are arranged in the same manner. The fifth opening 1402 and the pixel opening of the display area (i.e., the light-emitting area) have the same arrangement, shape, and size. With such a design, the problem of uneven morphology of the isolation opening 1401 at the edge of the display area 1A affecting display uniformity due to uneven etching when the second conductive layer 14 at the edge of the display area 1A is etched to form the isolation opening 1401 can be solved. The shape and size of the fifth opening 1402 are the same as or similar to the shape and size of the isolation opening 161. Optionally, in the first region 102, a plurality of second openings 1401 are arranged in an array, the second openings 1401 and the fifth openings 1402 are arranged in the same manner, and / or the orthographic projection area of ​​the second openings 1402 on the substrate 1101 is smaller than the orthographic projection area of ​​the fifth openings 1402 on the substrate 1101. Optionally, the arrangement of the isolation openings 161 is the same as the arrangement of the pixels. Optionally, the arrangement of the fifth openings 1402 is the same as the arrangement of the pixels. Optionally, the cross-section of the isolation openings 1401 perpendicular to the substrate and the cross-section of the fifth openings 1402 perpendicular to the substrate may have the same shape, for example, a T-shape or an I-shape. The fifth opening 1402 may be formed by enclosing an isolation structure.

[0247] Optionally, an orthographic projection area of ​​the second opening 1402 on the substrate 1101 is smaller than an orthographic projection area of ​​the isolation opening 161 on the substrate 1101 .

[0248] Optionally, the isolation opening 161 and the corresponding fifth opening 1402 have the same shape and size. For example, for a light emitting device and a dummy light emitting device of the same color, the isolation opening 161 corresponding to the light emitting device and the corresponding fifth opening 1402 of the dummy light emitting device have the same shape and size.

[0249] Optionally, the display panel further includes a pixel circuit, the pixel circuit is electrically connected to the first electrode of the light emitting device 15 corresponding to the isolation opening 161 of the display area, and the dummy light emitting device 15' corresponding to the fifth opening 1402 is insulated from the pixel circuit. Optionally, a pixel circuit may be provided in the first area 102, or a pixel circuit may not be provided in the first area 102.

[0250] Optionally, in the first region 102, the pixel defining layer is provided with a pixel opening, and the pixel opening is connected to the corresponding fifth opening 1402. The pixel opening may expose at least part of the first electrode of the dummy light-emitting device 15'. Optionally, in the first region 102, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the fifth opening 1402 on the substrate. Optionally, in the first region 102, the orthographic projection area of ​​the pixel opening on the substrate is smaller than the orthographic projection area of ​​the fifth opening 1402 on the substrate.

[0251] In this embodiment, the second conductive layer 14 is located on a side of the first conductive layer 121 away from the substrate 1101 , and the first conductive layer 121 is located between the film layer where the light emitting device 15 is located and the substrate 1101 .

[0252] For further information, please refer to Figure 8 , the isolation structure 16 includes a first isolation portion 162 and a second isolation portion 163, and in a direction away from the substrate 1101, the first isolation portion 162 and the second isolation portion 163 are stacked in sequence, for example, the second electrode 153 of the light-emitting device 15 overlaps the first isolation portion 162. The orthographic projection of the first isolation portion 162 on the substrate 1101 is located within the orthographic projection of the second isolation portion 163 on the substrate 1101. Optionally, the orthographic projection area of ​​the first isolation portion 162 on the substrate 1101 is smaller than the orthographic projection area of ​​the second isolation portion 163 on the substrate 1101. The cross-section of the isolation structure 16 may be T-shaped. At least one of the first isolation portion 162 and the second isolation portion 163 may include a conductive material. At least one of the first isolation portion 162 and the second isolation portion 163 may be electrically connected to the second electrode 153.

[0253] In this embodiment, please refer to Fig. 9 , the isolation structure 16 further includes a third isolation portion 164. In the direction away from the substrate 1101, the third isolation portion 164, the first isolation portion 162 and the second isolation portion 163 are stacked in sequence. For example, the second electrode 153 of the light-emitting device 15 is also overlapped with the third isolation portion 164. The orthographic projection of the first isolation portion 162 on the substrate 1101 is located within the orthographic projection of the third isolation portion 164 on the substrate 1101. Optionally, the orthographic projection area of ​​the first isolation portion 162 on the substrate 1101 is smaller than the orthographic projection area of ​​the third isolation portion 164 on the substrate 1101. In this embodiment, the orthographic projection area of ​​the third isolation portion 164 on the substrate 1101 is also smaller than the orthographic projection area of ​​the second isolation portion 163 on the substrate 1101. The cross section of the isolation structure 16 may be in an I-shape. At least one of the third isolation portion 164, the first isolation portion 162 and the second isolation portion 163 may include a conductive material. At least one of the third isolation portion 164 , the first isolation portion 162 , and the second isolation portion 163 may be electrically connected to the second electrode 153 .

[0254] In this embodiment, the material of the first isolation portion 162 includes aluminum, silver or copper, the material of the second isolation portion 163 includes titanium or molybdenum, and the material of the third isolation portion 164 includes molybdenum or titanium.

[0255] Optionally, the second electrodes 153 of the plurality of light emitting devices are electrically connected via the isolation structure 16. Optionally, the second electrodes 153 of the plurality of light emitting devices are electrically connected to the first conductive trace 121 via the isolation structure 16.

[0256] For further information, please refer to Fig.10 The display panel 1 further includes a first encapsulation layer 171 , which includes a plurality of encapsulation units 1711 arranged at intervals and located on a side of the light-emitting device 15 away from the substrate 1101 . Different encapsulation units 1711 are used to encapsulate the light-emitting devices 15 in different isolation openings 161 .

[0257] Optionally, two adjacent encapsulation units 1711 are disconnected on the side of the isolation structure 16 away from the substrate 1101. Optionally, the edge of the encapsulation unit is located on the side of the isolation structure away from the substrate, and is spaced from the side of the isolation structure away from the substrate. Optionally, the encapsulation unit 1711 is an inorganic encapsulation unit. In this embodiment, the encapsulation unit 1711 can be distributed in the display area 1A and the first area 102, and there is no encapsulation unit 1711 distributed in the first connection area 101.

[0258] For further information, please refer to Fig.11 The display panel 1 further includes a second encapsulation layer 172, which is located on a side of the first encapsulation layer 171 away from the substrate 1101, and the second encapsulation layer 172 at least covers the first encapsulation layer 171. For example, the second encapsulation layer 172 has a flat surface on a side away from the substrate 1101, and the second encapsulation layer 172 can be distributed in the display area 1A and the frame area 1B.

[0259] In some embodiments, the display panel 1 further includes a third encapsulation layer 173 . The third encapsulation layer 173 is located on a side of the second encapsulation layer 172 away from the substrate 1101 . The third encapsulation layer 173 may be distributed in the display area 1A and the frame area 1B.

[0260] In some embodiments, the third encapsulation layer 173 is an inorganic encapsulation layer, and the second encapsulation layer 172 is an organic encapsulation layer.

[0261] Optionally, a packaging unit 1711 is provided on a side of the dummy light emitting device 15 ′ away from the substrate 1101 .

[0262] In the display area 1A, an active layer 1103, a gate insulating layer 1104, a conductive layer M1 where the gate 1105 is located, a capacitor dielectric layer 1108, a conductive layer M2 where the second capacitor electrode 1111 is located, an interlayer insulating layer 1109, a conductive layer M3 where the source 1106 and the drain 1107 are located, a third planarization layer PLN1, a conductive layer M4, a second planarization layer PLN2, a first conductive layer 12, a first planarization layer PLN3, and a film layer where the light-emitting device is located are stacked in sequence along a direction Z away from the substrate 1101. The first conductive layer is a conductive layer M4.

[0263] Please refer to Fig.12aIn this embodiment, the display panel 1 further includes a second insulating layer 18, the second insulating layer 18 is located between the first conductive layer 12 and the first insulating layer 13, and the second insulating layer 18 includes a third opening 1801 in the first connection area 101. In the first connection area 101, at least part of the second conductive layer 14 is electrically connected to the first conductive trace 121 through the connected first opening 1301 and the third opening 1801. The third opening 1801 can penetrate the second insulating layer 18 in a direction perpendicular to the plane where the substrate 1101 is located (Z direction in the figure).

[0264] Optionally, in the first connection region 101 , an orthographic projection of at least one first opening 1301 on the substrate 1101 overlaps with an orthographic projection of the third opening 1801 on the substrate 1101 .

[0265] Optionally, in the first connection area 101 , the orthographic projection of at least one first opening 1301 on the substrate 1101 is located within the orthographic projection of the third opening 1801 on the substrate 1101 , that is, at least one first opening 1301 is connected to the corresponding third opening 1801 .

[0266] Optionally, in the first connection area 101, the area of ​​the orthographic projection of the first opening 1301 on the substrate 1101 is smaller than the area of ​​the orthographic projection of the third opening 1801 on the substrate 1101. With such a design, the exposed area of ​​the first conductive trace 121 at the position of the first opening 1301 can be large enough to increase the overlap area between the first conductive trace 121 and the second conductive layer 14 and reduce the overlap resistance. In the first connection area 101, in the first opening 1301 and the third opening 1801 that are connected, the area of ​​the orthographic projection of the first opening 1301 on the substrate 1101 is smaller than the area of ​​the orthographic projection of the third opening 1801 on the substrate 1101.

[0267] In some embodiments, one of the first insulating layer 13 and the second insulating layer 18 is an organic layer, and the other is an inorganic layer. Exemplarily, the first insulating layer 13 is an inorganic layer, and the second insulating layer 18 is an organic layer. Exemplarily, the second insulating layer 18 is an inorganic layer, and the first insulating layer 13 is an organic layer.

[0268] In some embodiments, in the first connection region 101 , an orthographic projection of the second opening 1402 on the substrate 1101 is located outside an orthographic projection of the third opening 1801 on the substrate 1101 .

[0269] In some embodiments, in the first connection area 101, a plurality of third openings 1801 are arranged in a first direction (the X-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and / or, a plurality of third openings 1801 are arranged in a second direction (the Y-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. Optionally, the plurality of third openings 1801 are arranged in an array, for example, including multiple rows and multiple columns. The third openings 1801 may be polygonal or circular, for example, rectangular, square, or strip-shaped.

[0270] In some embodiments, in the first connection region 101 , a plurality of first openings 1301 are arranged in an array, and / or a plurality of third openings 1801 are arranged in an array, for example, the density of the first openings 1301 is greater than the density of the third openings 1801 .

[0271] Optionally, in the first connection area 101, the density of the third openings 1801 is greater than or equal to the density of the second openings 1401. Optionally, in the first connection area 101, the density of the third openings 1801 is greater than or equal to the density of the fourth openings 1201. For example, in the first connection area, the spacing between two adjacent third openings 1801 is less than or equal to the spacing between two adjacent second openings 1401. For example, in the first connection area, the spacing between two adjacent third openings 1801 is less than or equal to the spacing between two adjacent fourth openings 1201.

[0272] Illustratively, in the first connection area 101, at least one of at least two first openings 1301 adjacent to each other along the row direction (e.g., the X-axis direction in the figure) is connected to a third opening 1801; and / or, at least one of at least two first openings 1301 adjacent to each other along the column direction (e.g., the Y-axis direction in the figure) is connected to a third opening 1801, wherein the row direction intersects with the column direction, for example, may be perpendicular.

[0273] For example, please refer to Figure 12b In the first connection area 101, one of at least two first openings 1301 adjacent to each other along the row direction (e.g., the X-axis direction in the figure) is connected to a third opening 1801; one of at least two first openings 1301 adjacent to each other along the column direction (e.g., the Y-axis direction in the figure) is connected to a third opening 1801, wherein the row direction intersects with the column direction, for example, they may be perpendicular. In the first connection area 101, the density of the first openings 1301 is twice the density of the third openings 1801. That is, in this embodiment, a portion of the first openings 1301 may be used to connect the first conductive trace 121 to the second conductive layer 14, and another portion of the first openings 1301 may be used to release the gas generated by the first insulating layer 13.

[0274] In some embodiments, in the first connection region 101 , an orthographic projection of the second opening 1401 on the substrate 1101 is located within an orthographic projection of the second insulating layer 18 on the substrate 1101 .

[0275] In some embodiments, please combine again Fig.11 and Fig.12a The first insulating layer 13 includes a pixel defining layer 131, which is located on the side of the first conductive layer 12 away from the substrate 1101, and a first opening 1301 is provided on the pixel defining layer 131. The second insulating layer 18 includes a first planarization layer 181, which is located between the first conductive layer 12 and the first insulating layer 13. The first planarization layer 181 includes a third opening 1801, and in the first connection area 101, the first opening 1301 and the third opening 1801 are connected, and the orthographic projection of the first opening 1301 on the substrate 1101 is located within the orthographic projection of the third opening 1801 on the substrate 1101.

[0276] The third openings 1801 may be evenly distributed in the first connection region 101 to ensure that the electrical connection points between the second conductive layer 14 and the first conductive trace 121 are sufficient and evenly distributed, thereby ensuring the electrical connection effect.

[0277] Furthermore, in this embodiment, a portion of the orthographic projection of the first opening 1301 on the substrate 1101 is located within the orthographic projection of the third opening 1801 on the substrate 1101, and another portion of the orthographic projection of the first opening 1301 on the substrate 1101 is located outside the orthographic projection of the third opening 1801 on the substrate 1101.

[0278] For example, please refer to Fig.13a , Fig.13b , Fig.13c , Fig.13d In this embodiment, in the first connection area 101, the first openings 1301 include first-type first openings 1301a. The first openings 1301 also include second-type first openings 1301b and / or third-type first openings 1301c.

[0279] The orthographic projection of the first type first opening 1301a on the substrate 1101 overlaps with the orthographic projection of the third opening 1801 on the substrate 1101. At least a portion of the second conductive layer 14 is electrically connected to the first conductive trace through the connected first type first opening 1301a and the third opening 1801.

[0280] The first type of first openings 1301a may be evenly distributed in the first connection area 101 to ensure that the electrical connection points between the second conductive layer 14 and the first conductive trace 121 are sufficient and evenly distributed, thereby ensuring the electrical connection effect.

[0281] Optionally, the orthographic projection of the first-type first opening 1301 a on the substrate 1101 is located within the orthographic projection of the third opening 1801 on the substrate 1101 .

[0282] Optionally, the orthographic projection of the first type first opening 1301a on the substrate 1101 is outside the orthographic projection of the second opening 1401 on the substrate 1101. Optionally, the orthographic projection of the second type first opening 1301b on the substrate 1101 is inside the orthographic projection of the second opening 1401 on the substrate 1101.

[0283] Optionally, in the first connection region, the orthographic projection of the fourth opening 1201 on the substrate is located outside the orthographic projections of the first type of first opening 1301a and the second type of first opening 1301b on the substrate.

[0284] Optionally, in the first connection region, the orthographic projection of the fourth opening 1201 on the substrate is located outside the orthographic projections of the second opening 1401 and the third opening 1801 on the substrate.

[0285] Optionally, the orthographic projection area of ​​the first type first opening 1301 a on the substrate 1101 is smaller than the orthographic projection area of ​​the third opening 1801 on the substrate 1101 .

[0286] Optionally, the orthographic projection of the second-type first opening 1301 b and / or the third-type first opening 1301 c on the substrate 1101 is located outside the orthographic projection of the third opening 1801 on the substrate 1101 .

[0287] like Fig.13a , Fig.13b , Fig.13c , Fig.13d As shown, in the first connection area 101, the orthographic projections of the second type first openings 1301b and / or the third type first openings 1301c on the substrate 1101 are located within the orthographic projections of the second insulating layer 18 on the substrate 1101. The second type first openings 1301b and / or the third type first openings 1301c can be used to release the gas generated by the second insulating layer 18.

[0288] The second type of first openings 1301b may be evenly distributed in the first connection area 101 to ensure that the exhaust points are sufficient and evenly distributed, thereby avoiding gas accumulation leading to film separation and poor electrical connection.

[0289] The third type of first openings 1301c may be evenly distributed in the first connection area 101 to ensure that the exhaust points are sufficient and evenly distributed, thereby avoiding gas accumulation leading to film separation and poor electrical connection.

[0290] In the first connection region 101, the orthographic projection of the second type first opening 1301b on the substrate 1101 at least partially overlaps with the orthographic projection of the second opening 1401 on the substrate 1101. Optionally, the orthographic projection of the second type first opening 1301b on the substrate 1101 is located within the orthographic projection of the second opening 1401 on the substrate 1101.

[0291] Optionally, the orthographic projection area of ​​the second-type first opening 1301 b on the substrate 1101 is smaller than the orthographic projection area of ​​the second opening 1401 on the substrate 1101 .

[0292] Optionally, in the first connection region 101 , the orthographic projection of the third-type first opening 1301 c on the substrate 1101 is located within the orthographic projection of the second conductive layer 14 on the substrate 1101 .

[0293] Optionally, in the first connection region, the first conductive layer 14 is provided with a fourth opening 1201. The orthographic projection of the third type of first opening 1301c on the substrate 1101 overlaps with the orthographic projection of the fourth opening 1201 on the substrate 1101. Optionally, in the first connection region, the orthographic projection of the third type of first opening 1301c on the substrate 1101 is located within the orthographic projection of the fourth opening 1201 on the substrate 1101. The fourth opening 1201 may penetrate the first conductive layer 14 in a direction perpendicular to the plane where the substrate 1101 is located (Z direction in the figure).

[0294] The fourth openings 1201 may be evenly distributed in the first connection area 101 to ensure that there are enough exhaust points and that they are evenly distributed, thereby avoiding gas accumulation leading to film separation and poor electrical connection.

[0295] In the possible implementation of this embodiment, please refer to Fig.14a , Fig.14b The display panel 1 further includes a third insulating layer 19, and the third insulating layer 19 is located on a side of the first conductive layer 12 away from the first insulating layer 13. For example, the third insulating layer 19 may be an organic layer.

[0296] For example, in combination Fig.11 and Fig.14a , Fig.14b The third insulating layer 19 includes a second planarizing layer 191, and the second planarizing layer 191 is located on a side of the first conductive layer 12 away from the first insulating layer 13. The third insulating layer 19 includes a third planarizing layer, and the third planarizing layer is located on a side of the second planarizing layer 191 away from the first conductive layer 12. In the display area 1A, a conductive layer M4 is provided between the second planarizing layer 191 and the third planarizing layer.

[0297] In the first connection area 101, the first conductive layer 12 is provided with a fourth opening 1201. The fourth opening 1201 can facilitate the discharge of gas in the third insulating layer 19 below the first conductive layer 12. The fourth opening 1201 can facilitate the discharge of gas in the second planarization layer 191 below the first conductive layer 12. For example, the gas in the second planarization layer 191 below the first conductive layer 12 can be discharged in sequence through the fourth opening 1201, the first opening 1301 and the second opening 1041 along the arrow direction of the curve in the figure. The fourth opening 1201 can also facilitate the discharge of gas in the second planarization layer 191 and the third planarization layer below the first conductive layer 12.

[0298] In some embodiments of the present invention, in the first connection region 101 , the orthographic projection of the fourth opening 1201 on the substrate 1101 is located outside the orthographic projections of the second opening 1401 and the third opening 1801 on the substrate 1101 .

[0299] Optionally, the first connection area 101 is located in a non-display area and / or a frame area of ​​the display panel 1 , such as a lower frame area.

[0300] In some embodiments of the present invention, in the first connection area 101, the orthographic projection of a portion of the first opening 1301 on the substrate 1101 overlaps with the orthographic projection of the fourth opening 1201 on the substrate 1101; the orthographic projection of a portion of the first opening 1301 on the substrate 1101 is located outside the orthographic projection of the fourth opening 1201 on the substrate 1101.

[0301] In some embodiments, the orthographic projection of the fourth opening 1201 on the substrate 1101 is outside the orthographic projection of the first opening 1301 on the substrate 1101. The orthographic projection of the fourth opening 1201 on the substrate 1101 does not overlap with the orthographic projections of all the first openings 1301 on the substrate 1101.

[0302] Further, in the first connection region 101 , the orthographic projections of the second opening 1401 and the fourth opening 1201 on the substrate 1101 are located within the orthographic projection of the second insulating layer 18 on the substrate 1101 .

[0303] The second opening 1401 can release the gas generated by the second insulating layer, and the second opening 1401 and the fourth opening 1201 can release the gas generated by the third insulating layer to avoid gas accumulation at the connection position between the second conductive layer 14 and the first conductive trace 121, thereby ensuring that the second conductive layer 14 and the first conductive trace 121 can be stably connected.

[0304] Exemplarily, the second insulating layer 18 includes a first planarization layer 181 , and in the first connection region 101 , the orthographic projections of the second opening 1401 and the fourth opening 1201 on the substrate 1101 are located within the orthographic projections of the first planarization layer 181 on the substrate 1101 .

[0305] The second opening 1401 can release the gas generated by the first planarization layer 181. The second opening 1401 and the fourth opening 1201 can release the gas generated by the second planarization layer 191 to prevent the gas from accumulating at the connection position between the second conductive layer 14 and the first conductive trace 121, thereby ensuring that the second conductive layer 14 and the first conductive trace 121 can be stably connected.

[0306] In this embodiment, please refer to Fig.14a , Fig.14b , the second insulating layer 18 fills the fourth opening 1201 . Exemplarily, the second insulating layer 18 includes a first planarization layer 181 , and the first planarization layer 181 fills the fourth opening 1201 .

[0307] Optionally, the second insulating layer 18 is connected to the third insulating layer 19 through the fourth opening 1201. Exemplarily, the third insulating layer 19 includes a second planarization layer 191, and the first planarization layer 181 is connected to the second planarization layer 191 through the fourth opening 1201.

[0308] For example, in the first connection region 101 , the air permeability of the material filled in the second opening 1401 is greater than the air permeability of the second conductive layer. Exemplarily, the second opening 1401 may be filled with the second encapsulation layer 172 .

[0309] In some embodiments, in the first connection region 101 , the first conductive layer 12 is provided with a fourth opening 1201 , and the orthographic projection of the fourth opening 1201 on the substrate 1101 is located outside the orthographic projections of the first opening 1301 and the second opening 1401 on the substrate 1101 .

[0310] In some embodiments, in the first connection area 101, a plurality of fourth openings 1201 are arranged in a first direction (the X-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and / or a plurality of fourth openings 1201 are arranged in a second direction (the Y-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. Optionally, the plurality of fourth openings 1201 are arranged in an array, for example, including multiple rows and multiple columns. The fourth openings 1201 may be polygonal or circular, for example, rectangular, square, or strip-shaped.

[0311] Please refer to Fig.14c , Fig.14d , Fig.14e , Fig.14f , Figure 14g , Figure 14hIn the first connection area 101, a plurality of first openings 1301 are arranged in an array, a plurality of second openings 1401 are arranged in an array, and a plurality of fourth openings 1201 are arranged in an array. Optionally, the density of the first openings 1301 is greater than or equal to the density of the fourth openings 1201, and / or the density of the second openings 1401 is equal to the density of the fourth openings 1201. For example, in the first connection area, the spacing between two adjacent first openings is less than the spacing between two adjacent fourth openings 1201. For example, in the first connection area, the spacing between two adjacent second openings is equal to the spacing between two adjacent fourth openings 1201.

[0312] For example, in the first connection area 101, one of at least two first openings 1301 adjacent in the row direction (the X-axis direction in the figure) is connected to one third opening 1801; and / or, one of at least two first openings 1301 adjacent in the column direction (the Y-axis direction in the figure) is connected to one third opening 1801, wherein the first direction intersects with the second direction. For example, the first direction and the second direction may be perpendicular. For example, in the first connection area 101, the density of the first openings 1301 is 2 times or 1.5 times the density of the third openings 1801.

[0313] For example, in the first connection area 101, the gas permeability of the material filled in the fourth opening 1201 is greater than the gas permeability of the first conductive layer. In this embodiment, in the first connection area 101, the fourth opening 1201 is filled with an insulating material, such as the first planarization layer, and the fourth opening 1201 is not filled with a conductive material.

[0314] The orthographic projection of the fourth opening 1201 on the substrate 1101 is located within the orthographic projection of the first insulating layer 13 on the substrate 1101. The first connection region 1101 is located in the frame region 1B of the display panel 1.

[0315] In this embodiment, the display panel 1 further includes a third insulating layer 19, which is located on a side of the first conductive layer 12 away from the first insulating layer 13. The third insulating layer 19 may be an organic layer. The third insulating layer 19 includes a second planarization layer 191, which is located on a side of the first conductive layer 12 away from the first insulating layer 13.

[0316] In a possible implementation of this embodiment, please refer to Fig.14c , Fig.14d The distribution of the first opening 1301, the second opening 1401 and the fourth opening 1201 in the first connection area 101 may be as follows: in the first connection area 101, the second opening 1401 and the first opening 1301 are alternately distributed in the first direction (the X-axis direction in the figure), and / or the second opening 1401 and the fourth opening 1201 are alternately distributed in the second direction (the Y-axis direction in the figure).

[0317] Please refer to Fig.14c , Fig.14d Optionally, the row where the second opening 1401 and the first opening 1301 are located is alternately arranged along the column direction with the row where the fourth opening 1201 is located. And / or, the column where the second opening 1401 and the fourth opening 1201 are located is alternately arranged along the row direction with the column where the first opening 1301 is located. The row direction may be parallel to the first direction. The column direction may be parallel to the second direction.

[0318] In a possible implementation of this embodiment, please refer to Fig.14e , Fig.14f The distribution of the first opening 1301, the second opening 1401 and the fourth opening 1201 in the first connection area 101 can be as follows: the fourth opening 1201 and the first opening 1301 are alternately distributed in the first direction (X-axis direction in the figure), and / or the second opening 1401 and the fourth opening 1201 are alternately distributed in the second direction (Y-axis direction in the figure).

[0319] Please refer to Fig.14e , Fig.14f Optionally, the row where the fourth opening 1201 and the first opening 1301 are located is alternately arranged along the column direction. And / or, the column where the second opening 1401 and the fourth opening 1201 are located is alternately arranged along the row direction. The row direction may be parallel to the first direction. The column direction may be parallel to the second direction.

[0320] In another possible implementation of this embodiment, please refer to Figure 14g , Figure 14h The distribution of the first opening 1301, the second opening 1401 and the fourth opening 1201 in the first connection area 101 can be as follows: the second opening 1401 and the first opening 1301 are alternately distributed in the first direction (X-axis direction in the figure), and / or the first opening 1301 and the fourth opening 1201 are alternately distributed in the second direction (Y-axis direction in the figure).

[0321] Please refer to Figure 14g , Figure 14h Optionally, the row where the second opening 1401 and the first opening 1301 are located is alternately arranged with the row where the fourth opening 1201 is located along the column direction. And / or, the column where the first opening 1301 and the fourth opening 1201 are located is alternately arranged with the column where the second opening 1401 is located along the row direction. The row direction may be parallel to the first direction. The column direction may be parallel to the second direction.

[0322] Optional, Fig.14c , Fig.14d , Fig.14e , Fig.14f , Figure 14g , Figure 14hThe third type of first opening 1301c in the figure can be replaced by the second type of first opening 1301b, and there is no third type of first opening 1301c. Optionally, the first type of first opening 1301a and the second type of first opening 1301b are alternately distributed in the first direction (the X-axis direction in the figure), and / or, the first type of first opening 1301a and the second type of first opening 1301b are alternately distributed in the second direction (the Y-axis direction in the figure).

[0323] Optionally, the second opening 1401 and the first opening 1301 are alternately distributed in the first direction (X-axis direction in the figure), the second opening 1401 and the first opening 1301 are alternately distributed in the second direction (Y-axis direction in the figure), the first opening 1301 and the fourth opening 1201 are alternately distributed in the first direction (X-axis direction in the figure), the first opening 1301 and the fourth opening 1201 are alternately distributed in the second direction (Y-axis direction in the figure), and the row where the second opening 1401 and the first opening 1301 are located and the row where the first opening 1301 and the fourth opening 1201 are located are alternately arranged along the column direction. And / or, the column where the first opening 1301 and the fourth opening 1201 are located and the column where the first opening 1301 and the second opening 1401 are located are alternately arranged along the row direction. The row direction may be parallel to the first direction. The column direction may be parallel to the second direction.

[0324] Optionally, the first region 102 and the first connection region 101 may be arranged in the first direction. Alternatively, the first region 102 and the first connection region 101 may be arranged in the second direction.

[0325] Please refer to Fig.14i , Fig.14j , Figure 14k Optionally, the display panel further includes a first hole structure K1 and a second hole structure K2 located in the first connection area. The first hole structure K1 includes a first type of first opening 1301a and a third opening 1801. For example, in the same first hole structure K1, the orthographic projection of the first type of first opening 1301a on the substrate 1101 overlaps with the orthographic projection of the third opening 1801 on the substrate 1101, for example, the orthographic projection of the first type of first opening 1301a on the substrate 1101 is located within the orthographic projection of the third opening 1801 on the substrate 1101. The second hole structure K2 includes a second type of first opening 1301b and a second opening 1401. In the same second hole structure K2, the orthographic projection of the second type of first opening 1301b on the substrate 1101 overlaps with the orthographic projection of the second opening 1401 on the substrate 1101, for example, the orthographic projection of the second type of first opening 1301b on the substrate 1101 is located within the orthographic projection of the second opening 1401 on the substrate 1101. The dotted box in Figure 14k can represent the outline of the third opening 1801, and the first type of first opening 1301a is located in the dotted box. The solid box can represent the outline of the second opening 1401, and the second type of first opening 1301b is located in the solid box.

[0326] Optionally, in the first connection area 101, the density of the first hole structure K1 is greater than the density of the second hole structure K2. For example, in the first connection area, the distance between two adjacent first hole structures K1 is smaller than the distance between two adjacent second hole structures K2.

[0327] Optionally, in the first connection area 101 , the density of the first hole structures K1 is greater than the density of the fourth openings 1201 . For example, in the first connection area, the distance between two adjacent first hole structures K1 is less than the distance between two adjacent fourth openings 1201 .

[0328] Optionally, in the first connection area 101 , the density of the second hole structures K1 is equal to the density of the fourth openings 1201 . For example, in the first connection area, the spacing between two adjacent second hole structures K1 is equal to the spacing between two adjacent fourth openings 1201 .

[0329] Optionally, the orthographic projection area of ​​the third opening 1801 on the substrate may be greater than or equal to the orthographic projection area of ​​the fourth opening 1201 on the substrate.

[0330] Optionally, the orthographic projection area of ​​the third opening 1801 on the substrate may be greater than or equal to the orthographic projection area of ​​the second opening 1401 on the substrate.

[0331] Optionally, the orthographic projection area of ​​the fourth opening 1201 on the substrate may be greater than, equal to, or smaller than the orthographic projection area of ​​the second opening 1401 on the substrate.

[0332] Optionally, the orthographic projection area of ​​the first opening 1301 on the substrate may be smaller than the orthographic projection area of ​​the second opening 1401 on the substrate.

[0333] Optionally, the orthographic projection area of ​​the first opening 1301 on the substrate may be smaller than the orthographic projection area of ​​the fourth opening 1201 on the substrate.

[0334] Optionally, the display panel further includes a first type of row arrangement structure and / or a second type of row arrangement structure located in the first connection area 101 . In the first connection area 101, the first type of row arrangement structure includes a first hole structure K1 and a second hole structure K2 that are alternately arranged (for example, arranged at equal intervals or unequal intervals) in a first direction (X-axis direction in the figure); and / or, the second type of row arrangement structure includes a first hole structure K1 and a fourth opening 1401 that are alternately arranged (for example, arranged at equal intervals or unequal intervals) in the first direction (X-axis direction in the figure); and / or, the display panel also includes a first type of column arrangement structure and / or a second type of column arrangement structure located in the first connection area; the first type of column arrangement structure includes a first hole structure K1 and a second hole structure K2 that are alternately arranged (for example, arranged at equal intervals or unequal intervals) in a second direction (Y-axis direction in the figure); and / or, the second type of column arrangement structure includes a first hole structure K1 and a fourth opening 1401 that are alternately arranged (for example, arranged at equal intervals or unequal intervals) in a second direction (Y-axis direction in the figure); the first direction and the second direction intersect, for example, and may be perpendicular.

[0335] Optionally, in the first connection area, the first type of row arrangement structure and the second type of row arrangement structure are alternately arranged along the second direction (Y-axis direction in the figure) (for example, they can be arranged at equal intervals or at unequal intervals); and / or, the first type of column arrangement structure and the second type of column arrangement structure are alternately arranged along the first direction (X-axis direction in the figure) (for example, they can be arranged at equal intervals or at unequal intervals).

[0336] The first hole structure K1 can be evenly distributed in the first connection area 101 to ensure that the electrical connection points between the second conductive layer 14 and the first conductive trace 121 are sufficient and evenly distributed to ensure the electrical connection effect. The second hole structure K2 can be evenly distributed in the first connection area 101 to ensure that the exhaust points are sufficient and evenly distributed to avoid gas accumulation leading to film separation and poor electrical connection effect. The more electrical connection points there are, the smaller the lap resistance between the second conductive layer 14 and the first conductive trace 121. However, there should not be too many electrical connection points, which will cause the area, number or density of the second opening 1401, the second hole structure K2 and other air holes to decrease, which is not conducive to gas discharge. Therefore, the arrangement of the electrical connection holes and the air holes is reasonably set through the above arrangement method to ensure the electrical connection effect and the air permeability effect.

[0337] Optionally, in the first hole structure K1, the orthographic projection of the first type first opening 1301a on the substrate is located within the orthographic projection of the third opening 1801 on the substrate; and / or, in the second hole structure K2, the orthographic projection of the second type first opening 1301b on the substrate is located within the orthographic projection of the second opening 1401 on the substrate.

[0338] Optionally, in the first hole structure K1, the orthographic projection shape of the first type first opening 1301a on the substrate is the same as the orthographic projection shape of the third opening 1801 on the substrate; and / or, in the second hole structure K2, the orthographic projection shape of the second type first opening 1301b on the substrate is the same as the orthographic projection shape of the second opening 1401 on the substrate.

[0339] Optionally, in the first hole structure K1, the orthographic projection center of the first type of first opening 1301a on the substrate coincides with the orthographic projection center of the third opening 1801 on the substrate. And / or, in the second hole structure K2, the orthographic projection center of the second type of first opening 1301b on the substrate coincides with the orthographic projection center of the second opening 1401 on the substrate.

[0340] Optionally, in the first hole structure K1 , the first type of first opening 1301 a is connected to the third opening 1801 . And / or, in the second hole structure K2 , the second type of first opening 1301 b is connected to the second opening 1401 .

[0341] Please refer to Fig.14i , Fig.14j , Figure 14k Optionally, in the first hole structure K1, the orthographic projection area of ​​the first type first opening 1301a on the substrate is smaller than the orthographic projection area of ​​the third opening 1801 on the substrate; and / or, in the second hole structure K2, the orthographic projection area of ​​the second type first opening 1301b on the substrate is smaller than the orthographic projection area of ​​the second opening 1401 on the substrate.

[0342] Please refer to Fig.14i , Fig.14j , Figure 14k Optionally, the orthographic projection of the first opening 1301 on the substrate is outside the orthographic projection of the fourth opening 1201 on the substrate.

[0343] Please refer to Fig.14j Optionally, the cross section of the second opening 1401 perpendicular to the substrate may be the same as the cross section of the isolation opening perpendicular to the substrate, for example, a T-shape or an I-shape. The second opening 1401 may be formed by enclosing the isolation structure.

[0344] Optionally, in the first connection area, the density of the first type of first openings is greater than the density of the second type of first openings. For example, in the first connection area, the spacing between two adjacent first type of first openings is less than the spacing between two adjacent second type of first openings.

[0345] Optionally, in the first connection area, the density of the first type of first openings is greater than the density of the fourth openings. For example, in the first connection area, the spacing between two adjacent first type of first openings is less than the spacing between two adjacent fourth openings. Optionally, in the first connection area, the density of the second type of first openings is equal to the density of the fourth openings.

[0346] Optionally, in the first connection area, the density of the third openings is greater than the density of the fourth openings. For example, in the first connection area, the distance between two adjacent third openings is less than the distance between two adjacent fourth openings.

[0347] Optionally, in the first connection region, the density of the first openings of the first type is equal to the density of the third openings.

[0348] Optionally, in the first connection region, the density of the second type of first openings is equal to the density of the second openings.

[0349] Optionally, in the first connection region, the second hole structure K2 and the fourth opening 1201 are alternately arranged along the third direction. The third direction may intersect with the first direction, and the third direction may intersect with the second direction. The third direction may be parallel to the substrate. The first direction may be parallel to the substrate. The second direction may be parallel to the substrate.

[0350] Optionally, in the first connection area, a plurality of first hole structures K1 are arranged along the third direction. The display panel further includes a third type of row arrangement structure and / or a fourth type of row arrangement structure located in the first connection area; in the first connection area, the third type of row arrangement structure includes a second hole structure K2 and a fourth opening 1201 alternately arranged in the third direction. The fourth type of row arrangement structure includes a plurality of first hole structures K1 arranged in the third direction. The third type of row arrangement structure and the fourth type of row arrangement structure are alternately arranged along the fourth direction. The third direction intersects with the fourth direction. The fourth direction may intersect with the first direction, and the fourth direction may intersect with the second direction.

[0351] Furthermore, please combine Figure 1 , refer to Fig.15 In this embodiment, the display panel 1 further includes a second region 103, the second region 103 is located on a side of the first connection region 101 close to the first conductive trace 121, and / or, the second region 103 is located on a side of the first connection region 101 away from the display region of the display panel. In the second region 103, the first conductive layer 12 is provided with a sixth opening 1202. The sixth opening 1202 may penetrate the first conductive layer 12 in a direction perpendicular to the plane where the substrate 1101 is located (Z direction in the figure).

[0352] In the second region 103, the gas permeability of the material filled in the sixth opening 1202 is greater than the gas permeability of the first conductive layer 12. For example, in the second region 103, the sixth opening 1202 is filled with an insulating material, such as an organic insulating material, and the sixth opening 1202 can be used to discharge the gas released from the film layer below the first conductive trace 121 in the second region 103.

[0353] The orthographic projection of the second conductive layer 14 on the substrate 1101 is located outside the second region 103. The orthographic projection of the second conductive layer 14 on the substrate 1101 does not overlap with the second region 103. The second region 103 may be located in a non-display region and / or a frame region of the display panel.

[0354] For example, in the second region 103, the orthographic projection of the sixth opening 1202 on the substrate 1101 is located within the orthographic projection of the third insulating layer 19 on the substrate 1101. The sixth opening 1202 can release the gas generated by the third insulating layer. For example, the third insulating layer 19 can be an organic layer. The first opening 1301, the second opening 1401, the fourth opening 1201, the fifth opening 1402, the sixth opening 1202, etc. can release the gas generated by the third insulating layer 19 to avoid gas accumulation at the connection position between the second conductive layer 14 and the first conductive trace 121, and ensure that the second conductive layer 14 and the first conductive trace 121 can be stably connected. The sixth opening 1202 can release the gas generated by the second planarization layer and / or the third planarization layer. The first opening 1301, the second opening 1401, the fourth opening 1201, the fifth opening 1402, the sixth opening 1202, etc. can release the gas generated by the second planarization layer PLN2 and / or the third planarization layer PLN1.

[0355] In this embodiment, in the first connection region 101 , a plurality of first openings 1301 are arranged in an array, and a plurality of second openings 1401 are arranged in an array.

[0356] In some embodiments, in the second region 103, a plurality of sixth openings 1202 are arranged in a first direction (the X-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and / or a plurality of sixth openings 1202 are arranged in a second direction (the Y-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. Optionally, the plurality of sixth openings 1202 are arranged in an array, for example, including multiple rows and multiple columns. The sixth openings 1202 may be polygonal or circular, for example, rectangular, square, or strip-shaped.

[0357] Optionally, in the second area 103, a plurality of sixth openings 1202 are arranged in an array.

[0358] Optionally, the density of the first openings 1301 is greater than or equal to the density of the sixth openings 1202, and / or the density of the second openings 1401 is equal to the density of the sixth openings 1202. For example, the spacing between two adjacent first openings 1301 is smaller than the spacing between two adjacent sixth openings 1202.

[0359] In this embodiment, in the first connection region 101 , the first conductive layer 12 is provided with fourth openings 1201 , and a plurality of fourth openings 1201 are arranged in an array, and the density of the fourth openings 1201 is equal to the density of the sixth openings 1202 .

[0360] Optionally, the arrangement of the plurality of fourth openings 1201 is the same as the arrangement of the plurality of sixth openings 1202. With such a design, the first conductive trace 121 located in the first connection region 101 and the second region 103 has evenly distributed openings, ensuring that the gas released from the film layer below the first conductive trace 121 can be evenly released without causing accumulation problems in local areas.

[0361] Optionally, the second region 103 and the first connection region 101 may be arranged in the first direction. Alternatively, the second region 103 and the first connection region 101 may be arranged in the second direction.

[0362] Optionally, the first region 102, the first connection region 101 and the second region 103 are arranged in sequence along the first direction. Alternatively, the first region 102, the first connection region 101 and the second region 103 are arranged in sequence along the second direction.

[0363] In some embodiments, the plurality of sixth openings 1202 in the second region 103 and the plurality of fourth openings 1201 in the first connection region 101 are arranged in a first direction (the X-axis direction in the figure) (e.g., they may be arranged at equal intervals or at unequal intervals), and / or the plurality of sixth openings 1202 in the second region 103 and the plurality of fourth openings 1201 in the first connection region 101 are arranged in a second direction (the Y-axis direction in the figure) (e.g., they may be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. Optionally, the plurality of sixth openings 1202 in the second region 103 and the plurality of fourth openings 1201 in the first connection region 101 are arranged in an array, for example, including multiple rows and multiple columns.

[0364] The conductive layer may include a metal layer and / or a metal oxide layer (eg, an indium tin oxide layer).

[0365] See Fig.16a , Fig.16b and Fig.16c In the second region 103 , the first insulating layer 13 is provided with a seventh opening 1302 .

[0366] In the second region 103, a plurality of seventh openings 1302 are arranged in a first direction (the X-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and / or a plurality of seventh openings 1302 are arranged in a second direction (the Y-axis direction in the figure) (for example, they may be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. Optionally, a plurality of seventh openings 1302 are arranged in an array, for example, including multiple rows and columns. The seventh opening 1302 may be polygonal or circular, such as rectangular, square, or strip. The seventh opening 1302 may release the gas generated by the second insulating layer 18 and / or the third insulating layer 19, avoid gas accumulation at the connection position between the second conductive layer 14 and the first conductive trace 121, and ensure that the second conductive layer 14 and the first conductive trace 121 can be stably connected. The seventh opening 1302 may penetrate the first insulating layer 13 in a direction perpendicular to the plane where the substrate 1101 is located (the Z direction in the figure).

[0367] The orthographic projection of part or all of the seventh opening 1302 on the substrate 1101 overlaps with the orthographic projection of the sixth opening 1202 on the substrate 1101. Exemplarily, the orthographic projection of part of the seventh opening 1302 on the substrate 1101 may at least partially overlap, for example, coincide with the orthographic projection of the sixth opening 1202 on the substrate 1101, or the orthographic projection of all of the seventh openings 1302 on the substrate 1101 may at least partially overlap, for example, coincide with the orthographic projection of the sixth opening 1202 on the substrate 1101. When the orthographic projection of the seventh opening 1302 on the substrate 1101 completely overlaps with the orthographic projection of the sixth opening 1202 on the substrate 1101, the orthographic projection area of ​​the seventh opening 1302 on the substrate 1101 may be smaller than the orthographic projection area of ​​the sixth opening 1202 on the substrate 1101. In this embodiment, in the second region 103, the orthographic projection of part or all of the seventh opening 1302 on the substrate 1101 may be located outside the orthographic projection of the sixth opening 1202 on the substrate 1101. In other words, the orthographic projection of part of the seventh opening 1302 on the substrate 1101 may be located outside the orthographic projection of the sixth opening 1202 on the substrate 1101, while the orthographic projection of another part of the seventh opening 1302 on the substrate 1101 at least partially overlaps with the orthographic projection of the sixth opening 1202 on the substrate 1101; or, the orthographic projection of all the seventh openings 1302 on the substrate 1101 may be located outside the orthographic projection of the sixth opening 1202 on the substrate 1101. In this embodiment, in the second region 103, the seventh opening 1302 and the sixth opening 1202 may have the same distribution density.

[0368] Further, in the second area 103, the plurality of seventh openings 1302 are arranged in an array; the plurality of seventh openings 1302 in the second area 103 and the plurality of first openings 1301 in the first connection area 101 are arranged in a first direction (the X-axis direction in the figure) (for example, they can be arranged at equal intervals or at unequal intervals), and / or, the plurality of seventh openings 1302 in the second area 103 and the plurality of first openings 1301 in the first connection area 101 are arranged in a second direction (the Y-axis direction in the figure) (for example, they can be arranged at equal intervals or at unequal intervals), and the first direction and the second direction intersect. Optionally, the plurality of seventh openings 1302 in the second area 103 and the plurality of first openings 1301 in the first connection area 101 are arranged in an array, for example, including multiple rows and multiple columns. That is, in this embodiment, the arrangement of the seventh openings 1302 in the second area 103 can be the same as the arrangement of the first openings 1301 in the first connection area 101. Exemplarily, the density of the seventh openings 1302 in the second region 103 is less than or equal to the density of the first openings 1301 in the first connection region 101 .

[0369] When preparing the first insulating layer, the second insulating layer, the third insulating layer and other organic layers, although they are baked after coating, they cannot be completely dried. In the subsequent process or use, the organic layer will release gas, such as water vapor or volatile additives. By setting each opening to release the gas of the organic layer, it is avoided that the gas accumulates at the connection position of the second conductive layer and the first conductive trace and the film separation phenomenon occurs, so as to ensure that the second conductive layer and the first conductive trace can be stably connected.

[0370] After etching the second conductive layer 14 (i.e., the isolation structure layer) to form the isolation opening and the second opening, light-emitting devices of various colors will be formed (i.e., the patterning process of the light-emitting device layer). The patterning process of the light-emitting device layer can be as follows: first, the first color light-emitting layer, the electrode layer, and the first inorganic packaging layer corresponding to the first color light-emitting device are formed on the entire surface, and then the first color light-emitting material layer, the electrode layer, and the first inorganic packaging layer in the isolation opening corresponding to the first color light-emitting device are retained, and the light-emitting material layer, the electrode layer, and the first inorganic packaging layer in the isolation opening corresponding to the remaining color light-emitting devices are etched; then, the second color light-emitting material layer, the electrode layer, and the first inorganic packaging layer corresponding to the second color light-emitting device are formed on the entire surface, and then the second color light-emitting material layer, the electrode layer, and the first inorganic packaging layer in the isolation opening corresponding to the second color light-emitting device are retained, and the second color light-emitting material layer, the electrode layer, and the first inorganic packaging layer in the isolation opening corresponding to the remaining color light-emitting devices are etched, and so on to form light-emitting devices of all colors. During the patterning process of the light-emitting device layer (i.e., when preparing the light-emitting device), affected by the process temperature, the first insulating layer 13 and / or the second insulating layer 18 and / or the third insulating layer 19 generate gas, which can be released through the above-mentioned openings to avoid gas accumulation at the connection position between the second conductive layer 14 (i.e., the isolation structure layer) and the first conductive trace 121, thereby ensuring that the second conductive layer 14 (i.e., the isolation structure layer) and the first conductive trace 121 can be stably connected.

[0371] Optionally, the opening density of the first connection area 101 is greater than the opening density of the second area 103. For example, the openings of the first connection area 101 may include at least two of the first opening 1301, the second opening 1401, the third opening 1801, and the fourth opening 1201. The openings of the second area 103 may include the sixth opening 1202 and / or the seventh opening 1302.

[0372] The first insulating layer may be located in at least one of the first connection region 101, the first region 102, and the second region 103. The second insulating layer may be located in at least one of the first connection region 101, the first region 102, and the second region 103. The third insulating layer may be located in at least one of the first connection region 101, the first region 102, and the second region 103. The second opening 1401, the fourth opening 1201, the second type of first opening 1301b, the third type of first opening 1301c, the sixth opening 1202, and the seventh opening 1302 may be used to release gases generated by organic layers such as the first insulating layer 13 and / or the second insulating layer 18 and / or the third insulating layer 19.

[0373] For example, the first insulating layer and / or the second insulating layer disposed between the first connection area 101, the second conductive layer and the first conductive trace is an organic layer, and the second opening 1401 and the second type of first opening 1301b can release the gas generated by the first insulating layer and / or the second insulating layer. For example, the first insulating layer and / or the second insulating layer disposed between the first connection area 101, the second conductive layer and the first conductive trace is an inorganic layer, and the third insulating layer is an organic layer, the second opening 1401 and the second type of first opening 1301b can release the gas generated by the third insulating layer, and the fourth opening 1201 can release the gas generated by the third insulating layer.

[0374] The distance between the two adjacent openings may be the minimum distance between the centers of the two adjacent openings, or the minimum distance between the edges of the two adjacent openings.

[0375] Based on the same inventive concept, the present application also provides a display panel, the display panel having a display area and a non-display area, the non-display area including a first connection area, and the display panel including:

[0376] Substrate 1101;

[0377] A first conductive layer 12, located on the substrate 1101, the first conductive layer 12 includes a first conductive trace 121;

[0378] The first insulating layer 13 is provided with a first opening 1301;

[0379] The isolation structure layer 14 is located on a side of the first insulating layer 13 away from the first conductive layer 12. The isolation structure layer 14 is provided with a second opening 1401 located in the first connection area 101 and an isolation opening 161 located in the display area. In the first connection area, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through at least one first opening. The orthographic projection of the first opening 1301 on the substrate 1101 is located outside the orthographic projection of the second opening 1401 on the substrate 1101.

[0380] The light emitting device layer includes a plurality of light emitting devices 15 , and at least a portion of the light emitting devices 15 is located in the isolation openings.

[0381] The second opening 1401 in this embodiment can release the gas generated by the film layer below the isolation structure layer 14 and / or the first insulating layer when preparing the light-emitting device, so as to avoid the accumulation of gas at the connection position between the isolation structure layer 14 and the first conductive trace 121, and ensure that the isolation structure layer 14 and the first conductive trace 121 can be stably connected. In addition, the connection between the isolation structure layer 14 and the first conductive trace 121 can be achieved through the first opening 1301, and the connection distance can be shortened to reduce the connection impedance, thereby ensuring the stability of signal transmission, thereby ensuring that the display panel 1 has a good display effect and improving the user experience. The first insulating layer 13 can be located on the side of the first conductive layer 12 away from the substrate 1101.

[0382] Optionally, the first insulating layer includes an organic layer, or the display panel also includes a second insulating layer, the second insulating layer is located between the first conductive layer and the first insulating layer, and the second insulating layer includes a third opening; in the first connection area, at least part of the isolation structure layer is electrically connected to the first conductive trace through the connected first opening and third opening; the first insulating layer is an inorganic layer, and the second insulating layer is an organic layer; and / or, the display panel also includes a third insulating layer, the third insulating layer is located between the substrate and the first conductive layer, in the first connection area, the first conductive layer is provided with a fourth opening, and the third insulating layer is an organic layer.

[0383] This embodiment can be combined with some or all of the technical features in the above embodiments, which will not be described in detail here.

[0384] Based on the same inventive concept, the present application also provides a display panel, the display panel having a display area and a non-display area, the non-display area including a first connection area 101 and a second area 103, the second area 103 is located on a side of the first connection area 101 away from the display area, and the display panel includes:

[0385] Substrate 1101;

[0386] A first conductive layer 12 is located on the substrate 1101 . The first conductive layer 12 includes a first conductive trace 121 . The first conductive trace 121 is located in the first connection region 101 and the second region 103 .

[0387] The first insulating layer 13 is located on a side of the first conductive layer 12 away from the substrate 1101 and located in the first connection region 101;

[0388] The isolation structure layer 14 is located on a side of the first insulating layer 13 away from the substrate 1101 . The isolation structure layer 14 extends to the first connection region 101 . The opening density of the first connection region 101 is greater than that of the second region 103 .

[0389] Optionally, the opening density of the first connection area 101 is the sum of the number of openings provided in all film layers of the first connection area 101, divided by the area of ​​the first connection area 101, to obtain a ratio. Optionally, the opening density of the first connection area 101 is the sum of the number of openings provided in all film layers of the first connection area 101 per unit area. Optionally, the opening density of the second area 103 is the sum of the number of openings provided in all film layers of the second area 103, divided by the area of ​​the second area 103, to obtain a ratio. Optionally, the opening density of the second area 103 is the sum of the number of openings provided in all film layers of the second area 103 per unit area. For the same area or unit area, the more corresponding openings, the greater the corresponding opening density.

[0390] In the present embodiment, the partial openings of the first connection area 101 can release the gas generated by the lower film layer of the second conductive layer and / or the first insulating layer when preparing the light-emitting device, thereby avoiding the accumulation of gas at the connection position between the second conductive layer and the first conductive trace 121, thereby ensuring that the second conductive layer and the first conductive trace 121 can be stably connected. In addition, the connection between the second conductive layer and the first conductive trace 121 can be achieved through the partial openings of the first connection area 101, thereby ensuring the stability of signal transmission, thereby ensuring that the display panel 1 has a good display effect and improving the user experience.

[0391] Optionally, the first insulating layer 13 may include an organic layer and / or an inorganic layer. The first insulating layer 13 may include a pixel defining layer and / or a first planarization layer.

[0392] Optionally, the first insulating layer 13 is provided with a first opening 1301 , and in the first connection region 101 , the isolation structure layer is electrically connected to the first conductive trace 121 through at least one first opening 1301 .

[0393] Optionally, in the first connection region 101 , the isolation structure layer is provided with a second opening 1401 , and an orthographic projection of at least one first opening 1301 on the substrate is located outside the orthographic projection of the second opening 1401 on the substrate.

[0394] Optionally, in the first connection region 101 , the first conductive trace is provided with a fourth opening 1201 , and the orthographic projection of the fourth opening 1201 on the substrate is located outside the orthographic projections of the first opening 1301 and the second opening 1401 on the substrate.

[0395] Optionally, the opening of the first connection area 101 may include: a first opening 1301 provided in the first insulating layer 13. Optionally, the opening of the first connection area 101 may include: a fourth opening 1201 provided in the first conductive trace 121. Optionally, the opening of the first connection area 101 may include: a second opening 1401 provided in the second conductive layer 14.

[0396] Optionally, the display panel may further include a second insulating layer 18 . The opening of the first connection region 101 may include: a third opening 1801 provided in the second insulating layer 18 .

[0397] Optionally, in the second region 103 , the first conductive trace is provided with a sixth opening 1202 . Optionally, in the second region 103 , the openings of the first insulating layer 13 may further include a seventh opening 1302 .

[0398] Optionally, the openings in the second region 103 may include a sixth opening 1202 provided in the first conductive trace. The openings in the second region 103 may include a seventh opening 1302 provided in the first insulating layer 13.

[0399] This embodiment can be combined with some or all of the technical features in the above embodiments, which will not be described in detail here.

[0400] Based on the same inventive concept, the present application also provides a method for preparing a display panel, see Fig.17 , the steps of the preparation method may include the following:

[0401] Step S110, providing a substrate;

[0402] Step S120, manufacturing a first conductive layer on the substrate, wherein the first conductive layer includes a first conductive trace;

[0403] Step S130, forming a first insulating layer on a side of the first conductive layer away from the substrate, and forming a first opening on the first insulating layer;

[0404] Step S140, forming an isolation structure layer on a side of the first insulating layer away from the first conductive layer, and opening a second opening located in the first connection area and an isolation opening located in the display area in the isolation structure layer, so that in the first connection area, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through at least one first opening, and an orthographic projection of the first opening on the substrate is located outside an orthographic projection of the second opening on the substrate;

[0405] Step S150 , manufacturing a light-emitting device layer, wherein the light-emitting device layer includes a plurality of light-emitting devices, and at least a portion of the light-emitting device 15 is located in the isolation opening.

[0406] The method for preparing a display panel provided in this example can be used to prepare the display panel in the above embodiments, and can be combined with some or all of the technical features in the above embodiments, which will not be described in detail here.

[0407] Optionally, the first insulating layer includes an organic layer. Between step S110 and step S120, the method further includes: forming a third insulating layer on the substrate, and correspondingly forming a first conductive layer on a side of the third insulating layer away from the substrate. In the first connection region, the first conductive layer is provided with a fourth opening, and the third insulating layer is an organic layer.

[0408] Between step S120 and step S130, the method further includes: forming a second insulating layer on a side of the first conductive layer away from the substrate, and correspondingly forming a first insulating layer on a side of the second insulating layer away from the substrate. The second insulating layer includes a third opening; in the first connection region, at least part of the isolation structure layer is electrically connected to the first conductive trace through the connected first opening and the third opening; the first insulating layer is an inorganic layer, and the second insulating layer is an organic layer.

[0409] Based on the same inventive concept, this embodiment also provides an electronic device, which uses the display panel in the above embodiment to display images. Since the display panel has a stable electrical connection structure, the signal transmission of the display panel is very stable, ensuring the display effect of the display panel, which helps to improve the user experience and the market competitiveness of electronic products. The electronic device may include a mobile phone, a wearable device, a notebook, a tablet computer, etc.

[0410] The present application provides a display panel, a method for preparing a display panel, and an electronic device. In the display panel, at least part of the second conductive layer is connected to the first conductive trace in the first conductive layer through at least one first opening, the second conductive layer is provided with a second opening in the first connection area, and the orthographic projection of at least one first opening on the substrate does not overlap with the orthographic projection of at least one second opening on the substrate. This allows the second conductive layer and the first conductive trace to have a larger connection area. In addition, the second opening can release the gas generated by the film layer and / or the first insulating layer below the second conductive layer to avoid gas accumulation at the connection position between the second conductive layer and the first conductive trace, thereby ensuring that the second conductive layer and the first conductive trace can be stably connected. At the same time, the connection between the second conductive layer and the first conductive trace can be achieved only through the first opening, which can shorten the connection distance to reduce the connection impedance and ensure the stability of signal transmission, thereby ensuring that the display panel has a good display effect and improving the user experience.

[0411] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0412] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, combination, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area, the non-display area includes a first connection area and a second area, the second area is located on a side of the first connection area away from the display area, and the display panel includes: substrate; A first conductive layer, located on the substrate, the first conductive layer comprising a first conductive trace, and the first conductive trace is located in the first connection area and the second area; A first insulating layer, located on a side of the first conductive layer away from the substrate and located in the first connection region; an isolation structure layer, located at a side of the first insulating layer away from the substrate, the isolation structure layer extending to the first connection region; The first insulating layer is provided with a first opening, and in the first connection area, the isolation structure layer is electrically connected to the first conductive trace through at least one of the first openings; In the first connection region, the isolation structure layer is provided with a second opening, and an orthographic projection of at least one of the first openings on the substrate is located outside an orthographic projection of the second opening on the substrate; In the first connection area, the first conductive trace is provided with a plurality of fourth openings, and the orthographic projections of the fourth openings on the substrate are located outside the orthographic projections of the first opening and the second opening on the substrate; The opening density of the first connection area is greater than the opening density of the second area.

2. The display panel according to claim 1, wherein: In the second area, the first conductive trace is provided with a plurality of sixth openings.

3. A display panel, characterized in that: The display panel has a display area and a non-display area, the non-display area includes a first connection area, and the display panel includes: substrate; A first conductive layer, located on the substrate, the first conductive layer comprising a first conductive trace; A first insulating layer is provided with a first opening; an isolation structure layer, located at a side of the first insulating layer away from the first conductive layer, the isolation structure layer being provided with a second opening located in the first connection area and an isolation opening located in the display area; a light emitting device layer, comprising a plurality of light emitting devices, at least a portion of the light emitting devices being located within the isolation opening; In the first connection area, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through at least one of the first openings, and an orthographic projection of the first opening on the substrate is outside an orthographic projection of the second opening on the substrate; In the first connection area, the first conductive trace is provided with a plurality of fourth openings, and the orthographic projections of the fourth openings on the substrate are located outside the orthographic projections of the first opening and the second opening on the substrate; In the first connection area, the first openings and the fourth openings are alternately arranged in a first direction, and the first openings and the fourth openings are alternately arranged in a second direction, wherein the first direction and the second direction intersect.

4. The display panel according to claim 3, wherein: The first insulating layer includes an organic layer, Alternatively, the display panel further includes a second insulating layer, the second insulating layer is located between the first conductive layer and the first insulating layer, and the second insulating layer includes a third opening; in the first connection area, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through the connected first opening and the third opening; the first insulating layer is an inorganic layer, and the second insulating layer is an organic layer; And / or, the display panel further includes a third insulating layer, the third insulating layer is located between the substrate and the first conductive layer, and the third insulating layer is an organic layer.

5. A display panel, characterized in that: The display panel has a display area and a non-display area, and the non-display area includes a first connection area, including: substrate; A first conductive layer, located on the substrate, the first conductive layer comprising a first conductive trace; The first insulating layer is provided with a first opening, a second conductive layer, located on a side of the first insulating layer away from the first conductive layer, wherein at least a portion of the second conductive layer is electrically connected to the first conductive trace through at least one of the first openings in a first connection region, the second conductive layer is provided with a second opening in the first connection region, and an orthographic projection of at least one of the first openings on the substrate is located outside an orthographic projection of the second opening on the substrate; In the first connection area, the first conductive trace is provided with a plurality of fourth openings, and the orthographic projections of the fourth openings on the substrate are located outside the orthographic projections of the first opening and the second opening on the substrate; In the first connection area, the first openings and the fourth openings are alternately arranged in a first direction, and / or the second openings and the fourth openings are alternately arranged in a second direction, wherein the first direction and the second direction intersect.

6. The display panel according to claim 5, wherein: In the first connection area, the second opening is filled with an insulating material; and / or, in the first connection area, the first openings and the second openings are alternately arranged in a first direction, and / or, in the first connection area, a plurality of the first openings are arranged in a second direction, and the first direction and the second direction intersect; and / or, in the first connection area, a plurality of the second openings are arranged in a second direction; And / or, in the first connection area, a plurality of the first openings are arranged in an array, a plurality of the second openings are arranged in an array, and the density of the first openings is greater than or equal to the density of the second openings; and / or, in the first connection region, an orthographic projection of the second opening on the substrate is located within an orthographic projection of the first insulating layer on the substrate; and / or, in the first connection region, orthographic projections of some of the first openings on the substrate are outside the orthographic projections of at least one of the second openings on the substrate, and orthographic projections of some of the first openings on the substrate overlap with the orthographic projections of at least one of the second openings on the substrate; And / or, the first connection area is located in the non-display area and / or the frame area of ​​the display panel.

7. The display panel according to claim 5, wherein: The first insulating layer comprises a pixel defining layer, the pixel defining layer is located on a side of the first conductive layer away from the substrate, and the first opening is disposed on the pixel defining layer; or, The first insulating layer includes a first planarization layer, the first planarization layer is located on a side of the first conductive layer away from the substrate, and the first opening is provided on the first planarization layer; Alternatively, the first insulating layer includes an organic layer or an inorganic layer.

8. The display panel according to claim 5, wherein: The display panel further includes a second insulating layer, wherein the second insulating layer is located between the first conductive layer and the first insulating layer; The second insulating layer includes a third opening; In the first connection region, an orthographic projection of at least one of the first openings on the substrate overlaps with an orthographic projection of the third opening on the substrate; At least a portion of the second conductive layer is electrically connected to the first conductive trace through the first opening and the third opening that are connected; In the first connection region, an orthographic projection of the second opening on the substrate is located outside an orthographic projection of the third opening on the substrate.

9. The display panel according to claim 8, wherein: An orthographic projection of at least one of the first openings on the substrate is located within an orthographic projection of the third opening on the substrate; and / or, in the first connection region, an area of ​​an orthographic projection of the first opening on the substrate is smaller than an area of ​​an orthographic projection of the third opening on the substrate; And / or, one of the first insulating layer and the second insulating layer is an organic layer, and the other is an inorganic layer; And / or, the first insulating layer is an inorganic layer, and the second insulating layer is an organic layer; And / or, in the first connection area, a plurality of the first openings are arranged in an array, and a plurality of the third openings are arranged in an array; in the first connection area, the density of the first openings is greater than the density of the third openings; and / or, in the first connection area, a plurality of the second openings are arranged in an array, and the density of the third openings is greater than or equal to the density of the second openings; And / or, in the first connection area, one of at least two first openings adjacent to each other in a row direction is connected to one of the third openings; one of at least two first openings adjacent to each other in a column direction is connected to one of the third openings; the row direction intersects with the column direction; and / or, in the first connection region, an orthographic projection of the second opening on the substrate is located within an orthographic projection of the second insulating layer on the substrate; And / or, the first insulating layer includes a pixel defining layer, the pixel defining layer is located on a side of the first conductive layer away from the substrate, and the first opening is provided on the pixel defining layer; And / or, the second insulating layer includes a first planarization layer, the first planarization layer is located between the first conductive layer and the first insulating layer; and the first planarization layer includes the third opening.

10. The display panel according to claim 8, wherein: In the first connection region, the first conductive layer is provided with a fourth opening; an orthographic projection of the fourth opening on the substrate is located outside an orthographic projection of the third opening on the substrate.

11. The display panel according to claim 10, wherein: The display panel further comprises a third insulating layer, wherein the third insulating layer is located on a side of the first conductive layer away from the first insulating layer; the second conductive layer is located on a side of the first conductive layer away from the substrate; and / or, in the first connection region, an orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the second opening and the third opening on the substrate; And / or, the third insulating layer includes a second planarization layer, and the second planarization layer is located on a side of the first conductive layer away from the first insulating layer; and / or, in the first connection region, an orthographic projection of a portion of the first opening on the substrate overlaps with an orthographic projection of the fourth opening on the substrate; The orthographic projection of part of the first opening on the substrate is outside the orthographic projection of the fourth opening on the substrate; Alternatively, the orthographic projection of the fourth opening on the substrate is outside the orthographic projection of the first opening on the substrate; and / or, in the first connection region, the orthographic projections of the second opening and the fourth opening on the substrate are located within the orthographic projection of the second insulating layer on the substrate; And / or, the second insulating layer includes a first planarization layer, and in the first connection region, the orthographic projections of the second opening and the fourth opening on the substrate are located within the orthographic projections of the first planarization layer on the substrate; And / or, the second insulating layer fills the fourth opening; And / or, the second insulating layer is connected to the third insulating layer through the fourth opening; And / or, the second insulating layer includes a first planarization layer, and the first planarization layer fills the fourth opening; And / or, the third insulating layer includes a second planarization layer, and the first planarization layer is connected to the second planarization layer through the fourth opening.

12. The display panel according to claim 8, wherein: In the first connection area, the first openings include first-type first openings and second-type first openings, the orthographic projection of the first-type first openings on the substrate overlaps with the orthographic projection of the third openings on the substrate, and at least a portion of the second conductive layer is electrically connected to the first conductive trace through the connected first-type first openings and the third openings; In the first connection region, an orthographic projection of the second-type first opening on the substrate at least partially overlaps with an orthographic projection of the second opening on the substrate.

13. The display panel according to claim 12, wherein: The orthographic projection of the first opening of the first type on the substrate is located within the orthographic projection of the third opening on the substrate; And / or, the first openings further include a third type of first openings, and the orthographic projections of the second type of first openings and / or the third type of first openings on the substrate are located outside the orthographic projections of the third openings on the substrate; and / or, in the first connection region, the orthographic projection of the second-type first opening and / or the third-type first opening on the substrate is located within the orthographic projection of the second insulating layer on the substrate; and / or, in the first connection region, the orthographic projection of the second-type first opening on the substrate is located within the orthographic projection of the second opening on the substrate; and / or, in the first connection region, an orthographic projection of the third type first opening on the substrate is located within an orthographic projection of the second conductive layer on the substrate; And / or, in the first connection region, the first conductive layer is provided with a fourth opening, and in the first connection region, an orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the first opening of the first type and the second type of first opening on the substrate; and / or, in the first connection region, an orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the second opening and the third opening on the substrate; And / or, the orthographic projection of the third type first opening on the substrate overlaps with the orthographic projection of the fourth opening on the substrate; And / or, the display panel further comprises a first hole structure and a second hole structure located in the first connection area, the first hole structure comprises the first type of first opening and the third opening; the second hole structure comprises the second type of first opening and the second opening, The display panel further includes a first type of row arrangement structure and / or a second type of row arrangement structure located in the first connection area; in the first connection area, the first type of row arrangement structure includes the first hole structure and the second hole structure arranged alternately in the first direction; and / or, the second type of row arrangement structure includes the first hole structure and the fourth opening arranged alternately in the first direction; and / or, the display panel further includes a first type of column arrangement structure and / or a second type of column arrangement structure located in the first connection area; the first type of column arrangement structure includes the first hole structure and the second hole structure arranged alternately in the second direction; And / or, the second type of column arrangement structure includes the first hole structures and the fourth openings alternately arranged in a second direction; the first direction and the second direction intersect; and / or, in the first connection region, the first type of row arrangement structure and the second type of row arrangement structure are alternately arranged along the second direction; And / or, the first type of column arrangement structure and the second type of column arrangement structure are alternately arranged along the first direction; and / or, in the first hole structure, the orthographic projection area of ​​the first opening of the first type on the substrate is smaller than the orthographic projection area of ​​the third opening on the substrate; and / or, in the second hole structure, the orthographic projection area of ​​the second type of first opening on the substrate is smaller than the orthographic projection area of ​​the second opening on the substrate; The orthographic projection of the first opening on the substrate is outside the orthographic projection of the fourth opening on the substrate; and / or, in the first connection area, the density of the first type of first openings is greater than the density of the second type of first openings; and / or, in the first connection area, the density of the first openings of the first type is greater than the density of the fourth openings; and / or, in the first connection area, the density of the second type of first openings is equal to the density of the fourth openings; and / or, in the first connection area, the density of the third openings is greater than the density of the fourth openings; and / or, in the first connection area, the density of the first type of first openings is equal to the density of the third openings; and / or, in the first connection area, the density of the second type of first openings is equal to the density of the second openings; and / or, in the first connection region, the density of the first pore structure is greater than the density of the second pore structure; and / or, in the first connection region, the density of the first hole structure is greater than the density of the fourth openings; And / or, in the first connection area, the density of the second hole structure is equal to the density of the fourth openings.

14. The display panel according to claim 5, wherein: In the first connection area, the first conductive layer is provided with a fourth opening; In the first connection region, the orthographic projection of the fourth opening on the substrate is located outside the orthographic projection of the second opening on the substrate; and / or, in the first connection region, an orthographic projection of a portion of the first opening on the substrate overlaps with an orthographic projection of the fourth opening on the substrate; The orthographic projection of part of the first opening on the substrate is outside the orthographic projection of the fourth opening on the substrate; Alternatively, the orthographic projection of the fourth opening on the substrate is outside the orthographic projection of the first opening on the substrate; and / or, in the first connection area, the second opening and the first opening are alternately distributed in the first direction, and the second opening and the fourth opening are alternately distributed in the second direction, wherein the first direction and the second direction intersect; and / or, in the first connection area, the fourth opening and the first opening are alternately distributed in the first direction, and the second opening and the fourth opening are alternately distributed in the second direction, wherein the first direction and the second direction intersect; And / or, in the first connection area, the second openings and the first openings are alternately distributed in a first direction, and the first openings and the fourth openings are alternately distributed in a second direction, wherein the first direction and the second direction intersect.

15. The display panel according to claim 14, wherein: In the first connection area, the second openings and the first openings are alternately distributed in a first direction, and the second openings and the fourth openings are alternately distributed in a second direction, wherein the first direction intersects the second direction; the rows where the second openings and the first openings are located are alternately arranged along the column direction, and / or the columns where the second openings and the fourth openings are located are alternately arranged along the row direction, and the row direction may be parallel to the first direction; and the column direction may be parallel to the second direction; Alternatively, in the first connection area, the fourth opening and the first opening are alternately distributed in a first direction, and the second opening and the fourth opening are alternately distributed in a second direction, wherein the first direction intersects with the second direction; the row where the fourth opening and the first opening are located and the row where the second opening is located are alternately arranged along a column direction, and / or the column where the second opening and the fourth opening are located and the column where the first opening is located are alternately arranged along a row direction, and the row direction may be parallel to the first direction; and the column direction may be parallel to the second direction; Alternatively, in the first connection area, the second opening and the first opening are alternately distributed in the first direction, and the first opening and the fourth opening are alternately distributed in the second direction, wherein the first direction intersects with the second direction; the second opening and the first opening are located in a row and the fourth opening is located in a row and are alternately arranged along a column direction, and / or the first opening and the fourth opening are located in a column and the second opening is located in a column and are alternately arranged along a row direction, and the row direction may be parallel to the first direction; and the column direction may be parallel to the second direction; Alternatively, in the first connection area, the second opening and the first opening are alternately distributed in the first direction, the second opening and the first opening are alternately distributed in the second direction, the first opening and the fourth opening are alternately distributed in the first direction, and the first opening and the fourth opening are alternately distributed in the second direction, wherein the first direction intersects with the second direction; the row where the second opening and the first opening are located and the row where the first opening and the fourth opening are located are alternately arranged along the column direction, and / or the column where the first opening and the fourth opening are located and the column where the first opening and the second opening are located are alternately arranged along the row direction, and the row direction may be parallel to the first direction; and the column direction may be parallel to the second direction.

16. The display panel according to claim 14, wherein: In the first connection area, a plurality of the first openings are arranged in an array, a plurality of the second openings are arranged in an array, a plurality of the fourth openings are arranged in an array, a density of the first openings is greater than or equal to a density of the fourth openings, and / or a density of the second openings is equal to a density of the fourth openings; and / or, in the first connection region, the fourth opening is filled with an insulating material; and / or, in the first connection region, an orthographic projection of the fourth opening on the substrate is located within an orthographic projection of the first insulating layer on the substrate; And / or, the display panel further includes a third insulating layer, and the third insulating layer is located on a side of the first conductive layer away from the first insulating layer; and / or, the third insulating layer is an organic layer, And / or, the third insulating layer is a second planarization layer.

17. The display panel according to claim 5, characterized in that: The display panel includes a display area and a first area, the first area is located on a side of the first connection area away from the first conductive trace, and / or the first area is located between the display area and the first connection area; the second conductive layer is provided with a fifth opening in the first area.

18. The display panel according to claim 17, wherein: The second conductive layer includes at least a portion of an isolation structure; the display panel further includes a light emitting device, the isolation structure at least encloses an isolation opening in the display area, and at least a portion of the light emitting device is located in the isolation opening; In the display area, the plurality of isolation openings are arranged in an array; in the first area, the plurality of fifth openings are arranged in an array; the fifth openings and the isolation openings are arranged in the same manner; And / or, the display panel further includes a dummy light emitting device, and in the first area, the fifth opening is filled with at least a portion of a film layer of the dummy light emitting device, wherein the first area is located in a non-display area of ​​the display panel; and / or, the orthographic projection of the first conductive trace on the substrate is located in a non-display area outside the first area; and / or, in the first connection area, a plurality of the second openings are arranged in an array; the second openings and the fifth openings are arranged in the same manner; and / or, an orthographic projection area of ​​the second opening on the substrate is smaller than an orthographic projection area of ​​the fifth opening on the substrate; and / or, the isolation opening and the corresponding fifth opening have the same shape and size; And / or, the display panel further comprises a pixel circuit, the pixel circuit is electrically connected to the first electrode of the light-emitting device corresponding to the isolation opening of the display area, and the dummy light-emitting device corresponding to the fifth opening is insulated from the pixel circuit; And / or, the first conductive layer is located between the film layer where the light-emitting device is located and the substrate; And / or, the first insulating layer includes a pixel defining layer, the pixel defining layer is provided with a pixel opening, the pixel opening is connected to the corresponding isolation opening in the first connection area, and the pixel opening exposes at least a portion of the first electrode of the light-emitting device; And / or, in the first region, the pixel opening is connected to the corresponding fifth opening, and the pixel opening exposes at least a portion of the first electrode of the dummy light-emitting device.

19. The display panel according to claim 5, wherein: The display panel also includes a second area, which is located on a side of the first connection area close to the first conductive trace, and / or the second area is located on a side of the first connection area away from the display area of ​​the display panel, and in the second area, the first conductive trace is provided with a sixth opening.

20. The display panel according to claim 19, wherein: In the second region, the sixth opening is filled with insulating material; and / or, an orthographic projection of the second conductive layer on the substrate is located outside the second region; And / or, in the first connection area, a plurality of the first openings are arranged in an array, and a plurality of the second openings are arranged in an array; in the second area, a plurality of the sixth openings are arranged in an array; and / or, the density of the first opening is greater than or equal to the density of the sixth opening, and / or, the density of the second opening is equal to the density of the sixth opening; and / or, the opening density of the first connection area is greater than the opening density of the second area; and / or, in the first connection region, the first conductive layer is provided with a fourth opening; And / or, the plurality of fourth openings are arranged in an array; and / or, the density of the fourth opening is equal to the density of the sixth opening; And / or, the arrangement of the plurality of fourth openings is the same as the arrangement of the plurality of sixth openings; And / or, in the second region, the first insulating layer is provided with a seventh opening, and an orthographic projection of part or all of the seventh opening on the substrate overlaps with an orthographic projection of the sixth opening on the substrate; and / or, a part or all of the orthographic projection of the seventh opening on the substrate is located outside the orthographic projection of the sixth opening on the substrate; and / or, in the second area, a plurality of the seventh openings are arranged in an array; and / or, in the second region, the density of the seventh openings is equal to the density of the sixth openings; and / or, the density of the seventh openings in the second region is less than or equal to the density of the first openings in the first connection region; And / or, the arrangement of the plurality of the seventh openings is the same as the arrangement of the plurality of the first openings; And / or, the display panel also includes a third insulating layer, which is located on a side of the first conductive layer away from the first insulating layer; the third insulating layer is located between the first conductive layer and the substrate, and the orthographic projection of the sixth opening on the substrate is located within the orthographic projection of the third insulating layer on the substrate.

21. The display panel according to claim 5, characterized in that: The first conductive trace is used to transmit a first power supply voltage signal; And / or, the display panel further comprises a light emitting device, and in a direction away from the substrate, the light emitting device comprises a first electrode, a light emitting material layer and a second electrode which are stacked; the second electrode is electrically connected to the first conductive trace; And / or, the second conductive layer includes at least part of an isolation structure, at least part of the isolation structure is located between the light-emitting devices, and the second electrode is electrically connected to the first conductive trace through the isolation structure; And / or, the first conductive layer further includes a second conductive trace, the second conductive trace is insulated from the first conductive trace, and the second conductive trace is used to transmit a second power supply voltage signal; And / or, the display panel further comprises a pixel circuit, the pixel circuit is electrically connected to the first electrode of the light emitting device, and the second conductive trace is electrically connected to the pixel circuit; And / or, the display panel further comprises: a plurality of conductive material layers, which are sequentially stacked between the substrate and the film layer where the light-emitting device is located, and an insulating layer is arranged between adjacent conductive material layers; The first conductive layer is a conductive material layer farthest from the substrate among the plurality of conductive material layers.

22. The display panel according to claim 18 or 21, characterized in that: The isolation structure comprises a first isolation portion and a second isolation portion, and in a direction away from the substrate, the first isolation portion and the second isolation portion are stacked in sequence; The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; An orthographic projection area of ​​the first isolation portion on the substrate is smaller than an orthographic projection area of ​​the second isolation portion on the substrate.

23. The display panel according to claim 22, wherein: The isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are stacked in sequence; The orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; and / or, the orthographic projection area of ​​the first isolation portion on the substrate is smaller than the orthographic projection area of ​​the third isolation portion on the substrate; And / or, the material of the first isolation portion includes aluminum, silver or copper, the material of the second isolation portion includes titanium or molybdenum, and the material of the third isolation portion includes molybdenum or titanium; And / or, the display panel further comprises a first encapsulation layer, the first encapsulation layer comprises a plurality of encapsulation units arranged at intervals, and is located on a side of the light-emitting device away from the substrate, and different encapsulation units are used to encapsulate light-emitting devices in different isolation openings, and / or, two adjacent packaging units are disconnected at a side of the isolation structure away from the substrate; And / or, the edge of the packaging unit is located on a side of the isolation structure away from the substrate, and is spaced apart from a side of the isolation structure away from the substrate; And / or, the packaging unit is an inorganic packaging unit; And / or, the display panel further includes a second encapsulation layer; The second encapsulation layer is located on a side of the first encapsulation layer away from the substrate, and the second encapsulation layer at least covers the first encapsulation layer; in the first connection area, the second opening is filled with the second encapsulation layer; and / or, the second encapsulation layer has a flat surface on a side away from the substrate; And / or, the display panel further includes a third encapsulation layer, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate; And / or, the third encapsulation layer is an inorganic encapsulation layer, and the second encapsulation layer is an organic encapsulation layer.

24. A method for preparing a display panel, characterized in that: The display panel has a display area and a non-display area, the non-display area includes a first connection area, and the method includes: providing a substrate; Manufacturing a first conductive layer on the substrate, and opening a plurality of fourth openings on the first conductive layer, wherein the first conductive layer includes a first conductive trace; Forming a first insulating layer on a side of the first conductive layer away from the substrate, and forming a first opening on the first insulating layer; An isolation structure layer is formed on a side of the first insulating layer away from the first conductive layer, and a second opening located in the first connection area and an isolation opening located in the display area are provided in the isolation structure layer, so that in the first connection area, at least a portion of the isolation structure layer is electrically connected to the first conductive trace through at least one of the first openings, the orthographic projection of the first opening on the substrate is located outside the orthographic projection of the second opening on the substrate, wherein the orthographic projection of the fourth opening on the substrate is located outside the orthographic projections of the first opening and the second opening on the substrate, the first opening and the fourth opening are alternately arranged in the first direction, and the first opening and the fourth opening are alternately arranged in the second direction, wherein the first direction and the second direction intersect; A light emitting device layer is manufactured, wherein the light emitting device layer includes a plurality of light emitting devices, and at least a portion of the light emitting devices is located in the isolation opening.

25. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1-24.

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