Cooling device, process equipment and substrate manufacturing method

Abstract

The invention provides a cooling device, process equipment and a substrate manufacturing method. The cooling device is used for cooling gas discharged by the process equipment. The cooling device comprises a pre-cooling unit and a secondary cooling unit which are sequentially arranged on an exhaust pipeline of the process equipment in the gas exhaust direction. The pre-cooling unit is provided with a gas inlet end and a gas outlet end, the pre-cooling unit comprises at least one cooling group arranged between the gas inlet end and the gas outlet end, the pre-cooling unit is configured to be used for cooling gas to a first temperature, and the first temperature is higher than a condensation point at which the gas is solidified; the secondary cooling unit comprises at least one cooling pipe with the inner diameter larger than or equal to the threshold value and a cooling assembly arranged on the outer wall of the cooling pipe, the cooling pipe communicates with the exhaust end, the secondary cooling unit is configured to be used for cooling the gas to the second temperature, and the second temperature is smaller than the first temperature. According to the cooling device, the process equipment and the substrate manufacturing method provided by the invention, two-step cooling of the process gas can be realized, and phenomena such as blockage of the exhaust pipe are reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a cooling device and process equipment, and a substrate manufacturing method. Background Art

[0002] Organic Light Emitting Diode (OLED) is an active light-emitting display device with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and extremely high response speed. With the continuous development of display technology, OLED technology is increasingly used in flexible display devices. With the continuous advancement of science and technology, higher requirements are placed on display devices. However, in the related technology, OLED display substrates have defects such as dark spots on the screen. Summary of the invention

[0003] In order to solve at least one of the problems in the above-mentioned prior art, the embodiments of the present disclosure provide a cooling device and process equipment, and a substrate manufacturing method.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] In a first aspect, an embodiment of the present disclosure provides a cooling device for cooling gas discharged from a process device; the cooling device comprises a pre-cooling unit and a secondary cooling unit which are sequentially arranged on an exhaust pipeline of the process device along a gas discharge direction; wherein:

[0006] The pre-cooling unit has an air inlet end and an air outlet end, the pre-cooling unit includes at least one cooling group disposed between the air inlet end and the air outlet end, and the pre-cooling unit is configured to cool the gas to a first temperature, the first temperature being greater than a sublimation point at which the gas solidifies;

[0007] The secondary cooling unit includes at least one cooling pipe with an inner diameter greater than or equal to a threshold and a cooling assembly arranged on the outer wall of the cooling pipe, the cooling pipe is connected to the exhaust end, and the secondary cooling unit is configured to cool the gas to a second temperature, which is lower than the first temperature.

[0008] Exemplarily, the pre-cooling unit includes at least two cooling groups arranged in series or in parallel, and the pre-cooling unit also includes a cooling medium distribution pipeline, which is connected to the cooling groups, and the cooling medium distribution pipeline is configured to be able to independently provide cooling medium to each cooling group.

[0009] Exemplarily, the cooling medium distribution pipeline includes at least two cooling medium branch pipelines and a control switch, each of the cooling medium branch pipelines is correspondingly connected to at least one of the cooling groups, and the control switch is used to control the on / off state of each of the cooling medium branch pipelines.

[0010] Exemplarily, the cooling group includes a cooling coil group, and each cooling coil group includes a plurality of cooling coils arranged at intervals.

[0011] Exemplarily, the cooling assembly includes a cooling coil wound around the cooling pipe.

[0012] In a second aspect, an embodiment of the present disclosure provides a process device, comprising:

[0013] A process chamber, wherein the process chamber is connected to an exhaust pipeline; and

[0014] The cooling device as described above is arranged on the exhaust pipe.

[0015] In a second aspect, an embodiment of the present disclosure provides a method for manufacturing a substrate, which uses the process equipment as described above to form a first film layer on the substrate, wherein during the process of forming the first film layer, the gas discharged from the process chamber is cooled by the cooling device.

[0016] Exemplarily, cooling the gas exhausted from the process chamber by the cooling device specifically includes:

[0017] Precooling the gas exhausted from the process chamber by the precooling unit so that the gas is cooled to a first temperature at which the gas remains in a gaseous state;

[0018] The gas cooled by the pre-cooling unit is secondarily cooled by the secondary cooling unit, so that the gas is cooled to a second temperature at which at least a portion of the gas solidifies into a solid state.

[0019] Exemplarily, the first temperature is greater than or equal to 125°C; and the second temperature is less than 125°C.

[0020] Exemplarily, the pre-cooling of the gas exhausted from the process chamber by the pre-cooling unit so as to cool the gas to a first temperature at which the gas remains in a gaseous state specifically includes:

[0021] The cooling medium is provided to the target number of the cooling groups through the cooling medium distribution pipeline, so as to individually control the operation of the target number of the cooling groups, so that the gas reaches the first temperature after being cooled by the pre-cooling unit.

[0022] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0023] In the above scheme, by arranging a pre-cooling unit and a secondary cooling unit in the cooling device, the pre-cooling unit can cool the gas discharged from the process equipment to a first temperature above the desublimation point where the gas solidifies, thereby avoiding a sudden drop in gas temperature and the generation of a large amount of impurities such as solid powder, which leads to accumulation and blockage in the pre-cooling unit and causes exhaust abnormality. The secondary cooling unit can further cool the gas cooled by the pre-cooling unit to solidify part of the gas, and the secondary cooling unit adopts a cooling pipe with a thicker inner diameter, so that even if the gas solidifies in the cooling pipe, it is not easy to be blocked. When the cooling device is applied to the manufacture of the first film layer on the substrate, the blockage of the exhaust pipeline caused by exhaust abnormality can be reduced, and part of the gas can be avoided from being left on the surface of the first film layer due to the inability to discharge the gas from the process chamber in time, thereby improving the display problem caused by the presence of foreign matter protruding on the surface of the first film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram showing the structure of the cooling device and process equipment provided in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0028] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0029] It should be understood that in the exemplary embodiments of the present disclosure, when a layer or an element is referred to as being on another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate. "A and B are arranged on the same layer" means that after A and B adopt the same film forming process to form a film layer for forming a specific pattern, a layer structure is formed by a single patterning process using the same mask.

[0030] After describing in detail the cooling device, process equipment, and substrate manufacturing method provided by the embodiments of the present disclosure, the following description is made of the related technologies:

[0031] With the continuous advancement of technology, higher requirements are placed on display devices. However, in the related art, OLED display substrates have defects such as dark spots on the screen.

[0032] The inventors of this application have found through research that one of the reasons for the above problems is:

[0033] In the related technology, the mainstream process flow of OLED display substrate is to first make a driving backplane, and then make anode, organic light-emitting layer and cathode film layers on the driving backplane. Among them, the basic structure of the anode film layer is a stacked structure formed by a first transparent conductive layer, a metal layer and a second transparent conductive layer. The function of the anode is to provide holes for the organic light-emitting layer. The organic light-emitting layer is evaporated on the surface of the anode, and the flatness of the anode surface is a key factor affecting the dark spot of OLED.

[0034] In recent years, due to the continuous progress of science and technology, people have put forward higher requirements for display devices, especially for the management of dark spots that affect the display effect; the current mainstream process route of mobile phone screen technology is OLED, and its basic structure is LTPS or LTPO backplane drive circuit + anode + organic light-emitting material + cathode. The basic structure of the anode film layer is ITO + Ag + ITO, which provides holes for the light-emitting layer; the OLED light-emitting film layer is evaporated on the surface of the anode, and the flatness of the anode surface is the key factor affecting the dark spots of OLED.

[0035] In order to improve the flatness of the anode, an organic flat layer is made on the surface of the driving circuit of the driving backplane, and then the anode is physically plated on the organic flat layer. Usually, the organic flat layer is prepared by coating, exposure, development, and curing processes. Among them, the curing process becomes a key process that affects the flatness of the anode due to the influence of airflow and organic volatiles.

[0036] During the curing process, the maximum temperature of the gas discharged from the equipment can reach over 250°C. Due to safety and environmental protection requirements, the factory exhaust temperature is required to be below 30°C, and a cooling device is usually required at the end of the equipment exhaust port. After the high-temperature gas passes through the cooling device, it quickly drops from high temperature to below 30°C and is then discharged into the factory exhaust pipe.

[0037] In order to achieve precise control of pixels, the organic flat layer material contains additives and exists in the form of polymer cross-linking. However, the high-temperature stability of the organic flat layer material is poor, and the vaporization temperature is low. It will vaporize under the high-temperature process conditions of 250°C and be discharged in the form of gas with the organic exhaust. When the temperature is lower than 125°C, it will quickly solidify. When the organic additives are quickly cooled into solid powder after passing through the cooling device, long-term use will cause the exhaust cooling device to be blocked. When the exhaust cooling device is blocked, it will cause abnormal exhaust in the process chamber, and the organic volatiles cannot be discharged in time. They will remain on the surface of the organic film of the flat layer in the form of organic residues, causing small granular protrusions in the local organic film, affecting the flatness of the anode film layer; the protrusions cause a short circuit between the anode and the cathode, which will cause abnormal sub-pixel luminescence and lead to dark spots.

[0038] Based on this, in order to solve the above problems, a cooling device, process equipment, and a substrate manufacturing method are provided in the embodiments of the present disclosure.

[0039] like Figure 1 As shown, the cooling device provided in the embodiment of the present disclosure is used to cool the gas discharged from the process equipment.

[0040] The cooling device includes a pre-cooling unit 100 and a secondary cooling unit 200, and the pre-cooling unit 100 and the secondary cooling unit 200 are sequentially arranged on the exhaust pipeline 300 of the process equipment along the gas exhaust direction. In this way, the high-temperature gas discharged by the process equipment can be cooled by the pre-cooling unit 100 and the secondary cooling unit 200 in sequence, that is, the cooling process of the high-temperature gas can be divided into two steps.

[0041] like Figure 1 As shown, the pre-cooling unit 100 has an air inlet end A and an exhaust end B, and the pre-cooling unit 100 includes at least one cooling group 110 arranged between the air inlet end A and the exhaust end B. The pre-cooling unit 100 is configured to cool the gas to a first temperature, which is greater than the sublimation point at which the gas solidifies.

[0042] The secondary cooling unit 200 includes at least one cooling pipe 210 having an inner diameter greater than or equal to a threshold value and a cooling assembly 220 arranged on the outer wall of the cooling pipe 210. The cooling pipe 210 is connected to the exhaust end B. The secondary cooling unit 200 is configured to cool the gas to a second temperature, which is lower than the first temperature.

[0043] In the above scheme, by arranging the pre-cooling unit 100 and the secondary cooling unit 200 in the cooling device, the cooling process of the high-temperature gas can be divided into two steps. First, the pre-cooling unit 100 can cool the gas discharged from the process equipment to a first temperature above the sublimation point where the gas solidifies, thereby avoiding a sudden drop in gas temperature and the generation of a large amount of impurities such as solid powder, which leads to accumulation and blockage in the pre-cooling unit 100 and causes exhaust abnormality; then, the secondary cooling unit 200 can further cool the gas cooled by the pre-cooling unit 100 to solidify part of the gas, and the secondary cooling unit 200 adopts a cooling pipe 210 with a thicker inner diameter, so that even if the gas solidifies in the cooling pipe 210, it is not easy to be blocked.

[0044] When the cooling device is used to manufacture the first film layer on the display substrate, it can reduce the blockage of the exhaust pipe 300 caused by abnormal exhaust, etc., and avoid part of the gas remaining on the surface of the first film layer due to the inability to discharge the gas from the process chamber in time, thereby improving the display problems caused by the presence of foreign matter protruding on the surface of the first film layer.

[0045] As described above, for the curing process of the organic film layer on the display substrate, the organic volatiles in the high-temperature gas coming out of the curing equipment will become solid powder below 125°C. Therefore, in some embodiments, when the cooling device is applied to the curing process of the organic film layer on the substrate, the first temperature may be greater than the sublimation point at which the gas solidifies. For example, the first temperature may be greater than or equal to 125°C. In general, the exhaust gas needs to be reduced to below 30°C before being discharged into the factory exhaust duct 30. Therefore, illustratively, the second temperature may be less than 125°C, and further, the second temperature may be less than or equal to 30°C.

[0046] It should be understood that the cooling device is not limited to use on curing equipment for film layers such as organic flat layers on display substrates, but can also be used in gas emission scenarios of other process equipment. Depending on the temperature and composition of the gas emitted by the process equipment, the first temperature and the second temperature can also be other temperature thresholds.

[0047] In addition, it should be understood that the cooling device can also be applied to the curing process of the organic flat layer on the display substrate, but is not limited thereto, and can also be applied to the curing process of other film layers on the display substrate.

[0048] In addition, in some embodiments of the present disclosure, the pre-cooling unit 100 may include at least two cooling groups 110, and the at least two cooling groups 110 may be arranged in series or in parallel, and the operation of each cooling group 110 may be distributed and controlled separately. When different numbers of the cooling groups 110 are working, the cooling effect on the gas is different. Therefore, by controlling the number of the cooling groups 110 in operation, multi-level control of the pre-cooling unit 100 can be achieved.

[0049] For example, Figure 1As shown, the pretreatment unit 100 includes three cooling groups 110, namely, a level I cooling group, a level II cooling group, and a level III cooling group. When one cooling group 110 is working, for example, when the level I cooling group is working, the gas can be cooled to a third temperature; when two cooling groups 110 are working, for example, when the level I and level II cooling groups are working, the gas can be cooled to a fourth temperature; when three cooling groups 110 are working, for example, when the level I, level II, and level III cooling groups are all working, the gas can be cooled to the first temperature. Exemplarily, the third temperature is greater than the fourth temperature, and the fourth temperature is greater than the first temperature. In this way, the cooling device can be applied to more application scenarios, and the appropriate number of cooling groups 110 can be selected to work according to the temperature and composition of the exhaust gas. When the temperature of the gas after cooling through the precooling unit 100 is required to be higher, some cooling groups 110 can be set to be non-operating; when the temperature of the gas after cooling through the precooling unit 100 is required to be lower, more cooling groups 110 or all cooling groups 110 can be opened.

[0050] In some embodiments, the cooling group 110 may include a cooling coil group, each of which includes a plurality of cooling coils 111 (Cooling coil) arranged at intervals. Since the spacing between the cooling coils 111 is generally small, if the organic volatile gas solidifies there, it is easy to get blocked. In this embodiment, even if the spacing between the cooling coils 111 is small, since the gas will not solidify there, it is still in a gaseous state and will not solidify to form white powder, thereby reducing the risk of blockage of the pre-cooling unit 100. It should be understood that the specific structure of the cooling group 110 is not limited thereto.

[0051] In order to realize that each cooling group 110 is individually controllable, in some embodiments, as Figure 1 As shown, the pre-cooling unit 100 may further include a cooling medium distribution pipeline 120, which is connected to the cooling group 110, and the cooling medium distribution pipeline 120 is configured to be able to independently provide cooling medium to each cooling group 110. In other words, by controlling whether the cooling medium distribution pipeline 120 provides cooling medium to each cooling group 110, multi-level control of the pre-cooling unit 100 is achieved.

[0052] In some exemplary embodiments, the cooling medium distribution pipeline 120 includes at least two cooling medium branch pipelines 121 and a control switch 122, each cooling medium branch pipeline 121 is correspondingly connected to at least one cooling group 110, and the control switch 122 is used to control the on-off state of each cooling medium branch pipeline 121. In this way, by controlling the on-off state of each cooling medium branch pipeline 121 through the control switch 122, multi-level control of the pre-cooling unit 100 can be achieved.

[0053] It should be noted that the above is only an exemplary description of realizing that each cooling group 110 is individually controllable, and in actual application, it is not limited to this.

[0054] In addition, in some embodiments, in the secondary cooling unit 200, the inner diameter of the cooling pipe 210 is greater than or equal to a threshold. In other words, the inner diameter of the cooling pipe 210 is relatively thick, for example, the threshold may be 80A, and the inner diameter of the cooling pipe 210 is above 80A. A cooling assembly 220 may be provided on the outer wall of the cooling pipe 210, for example, the cooling assembly 220 may include a cooling coil 111 wound on the cooling pipe 210.

[0055] However, the cooling assembly 220 is not limited thereto. For example, the cooling assembly 220 may further include a cooling sleeve located outside the cooling tube 210, a cooling medium channel is formed between the cooling sleeve and the outer wall of the cooling tube 210, a medium inlet and a medium outlet are provided on the cooling medium channel, and cooling is achieved by heat exchange between the cooling medium and the gas in the cooling tube 210.

[0056] In some embodiments, Figure 1 As shown, there can be multiple cooling tubes 210 in the secondary cooling unit 200, and the multiple cooling tubes 210 are arranged in parallel, and the corresponding cooling coils 111 are respectively arranged on the outer wall of each cooling tube 210. Increasing the number of the cooling tubes 210 arranged in parallel can improve the efficiency of gas cooling, ensure the gas cooling effect, and prevent the phenomenon of organic volatile white powder blocking the pipeline. There is no limit on the number of the cooling tubes 210.

[0057] By arranging the secondary cooling unit 200 at the rear section of the pre-cooling unit 100, the volatile organic matter gas can be solidified in the secondary cooling unit 200. The secondary cooling unit 200 adopts a cooling pipe 210 with a relatively large inner diameter, and the outer wall of the cooling pipe 210 is wound with a cooling coil 111, etc., so that the secondary cooling unit 200 can achieve a good cooling effect.

[0058] It can be seen that the cooling device provided in the embodiment of the present disclosure can effectively avoid pipeline blockage caused by condensation of gas containing organic volatiles to form solid powder accumulation through a two-step cooling method, and the gas cooling process is divided into two steps. During pre-cooling, the gas is still in a gaseous state, and will only be converted into a solid state during secondary cooling. The ambient airflow during the process can be effectively controlled, and impurities on organic film layers such as organic flat layers on the substrate can be fundamentally prevented from remaining, and the flatness of the anode can be ensured, thereby improving display defects such as dark spots on the OLED display substrate.

[0059] In addition, if Figure 1 As shown, an embodiment of the present disclosure further provides a process equipment, which includes: a process chamber 10 and a cooling device 20 provided in an embodiment of the present disclosure, the process chamber is connected to an exhaust pipeline 300, and the cooling device is arranged on the exhaust pipeline 300.

[0060] The process equipment provided in the embodiment of the present disclosure includes the cooling device provided in the embodiment of the present disclosure. Since the principle of solving the problem by the process equipment is similar to the principle of solving the problem by the above cooling device, the embodiment of the process equipment provided in the embodiment of the present disclosure can refer to the embodiment of the above cooling device provided in the embodiment of the present disclosure, and will not be repeated here.

[0061] In addition, the embodiment of the present disclosure also provides a substrate manufacturing method, using the process equipment provided by the embodiment of the present disclosure to form a first film layer on the substrate. The first film layer includes but is not limited to an organic flat layer.

[0062] The substrate manufacturing method comprises the following steps:

[0063] Step S01, using the process equipment provided by the embodiment of the present disclosure to form a first film layer on a substrate, wherein during the process of forming the first film layer, the gas exhausted from the process chamber is cooled by the cooling device.

[0064] Exemplarily, cooling the gas exhausted from the process chamber by the cooling device specifically includes:

[0065] Precooling the gas exhausted from the process chamber by the precooling unit 100 so that the gas is cooled to a first temperature at which the gas remains in a gaseous state;

[0066] The gas cooled by the pre-cooling unit 100 is secondarily cooled by the secondary cooling unit 200 so that the gas is cooled to a second temperature at which at least a portion of the gas solidifies into a solid state.

[0067] As described above, for the curing process of the organic film layer on the display substrate, the organic volatiles in the high-temperature gas coming out of the curing equipment will become solid powder below 125°C. Therefore, in some embodiments, when the cooling device is applied to the curing process of the organic film layer on the substrate, the first temperature may be greater than the sublimation point at which the gas solidifies. For example, the first temperature may be greater than or equal to 125°C. In general, the exhaust gas needs to be reduced to below 30°C before being discharged into the factory exhaust duct. Therefore, illustratively, the second temperature may be less than 125°C, and further, the second temperature may be less than or equal to 30°C.

[0068] It should be understood that the cooling device is not limited to being used on the curing equipment of the organic flat layer on the display substrate, but can also be used in the process gas emission scenarios of other film layers on the substrate. Depending on the temperature and composition of the process gas emission, the first temperature and the second temperature can also be other temperature thresholds.

[0069] In addition, illustratively, the pre-cooling process of the gas exhausted from the process chamber by the pre-cooling unit 100 so as to cool the gas to a first temperature at which the gas remains in a gaseous state specifically includes:

[0070] The cooling medium is provided to the target number of the cooling groups 110 through the cooling medium distribution pipeline 120 to individually control the operation of the target number of the cooling groups 110 so that the gas reaches the first temperature after being cooled by the pre-cooling unit 100 .

[0071] When different numbers of the cooling groups 110 are in operation, the cooling effects on the gas are different. Therefore, by controlling the number of the cooling groups 110 in operation, multi-level control of the pre-cooling unit 100 can be achieved.

[0072] For example, when one cooling group 110 is working, the gas can be cooled to the third temperature, when two cooling groups 110 are working, the gas can be cooled to the fourth temperature, and when three cooling groups 110 are working, the gas can be cooled to the first temperature. Exemplarily, the third temperature is greater than the fourth temperature, and the fourth temperature is greater than the first temperature. In this way, the cooling device can be applied to more application scenarios, and a suitable number of cooling groups 110 can be selected to work according to the temperature and composition of the exhaust gas. When the temperature of the gas after being cooled by the pre-cooling unit 100 is required to be higher, some cooling groups 110 can be set to be non-operating; when the temperature of the gas after being cooled by the pre-cooling unit 100 is required to be lower, more cooling groups 110 or all cooling groups 110 can be turned on.

[0073] There are a few points to note:

[0074] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0075] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0076] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0077] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A cooling device for cooling the gas discharged from a process equipment; characterized in that: The cooling device comprises a pre-cooling unit and a secondary cooling unit which are sequentially arranged on the exhaust pipeline of the process equipment along the gas discharge direction; wherein, The pre-cooling unit has an air inlet end and an air outlet end, the pre-cooling unit includes at least one cooling group disposed between the air inlet end and the air outlet end, and the pre-cooling unit is configured to cool the gas to a first temperature, the first temperature being greater than a sublimation point at which the gas solidifies; The secondary cooling unit includes at least one cooling pipe with an inner diameter greater than or equal to a threshold and a cooling assembly arranged on the outer wall of the cooling pipe, the cooling pipe is connected to the exhaust end, and the secondary cooling unit is configured to cool the gas to a second temperature, which is lower than the first temperature.

2. The cooling device according to claim 1, characterized in that: The pre-cooling unit includes at least two cooling groups arranged in series or in parallel, and the pre-cooling unit also includes a cooling medium distribution pipeline, which is connected to the cooling groups and is configured to be able to independently provide cooling medium to each cooling group.

3. The cooling device according to claim 2, characterized in that: The cooling medium distribution pipeline includes at least two cooling medium branch pipelines and a control switch, each of the cooling medium branch pipelines is correspondingly connected to at least one of the cooling groups, and the control switch is used to control the on-off state of each of the cooling medium branch pipelines.

4. The cooling device according to claim 1, characterized in that: The cooling group includes a cooling coil group, and each cooling coil group includes a plurality of cooling coils arranged at intervals.

5. The cooling device according to claim 2, characterized in that: The cooling assembly includes a cooling coil wound around the cooling pipe.

6. A process equipment, characterized in that: include: A process chamber, wherein the process chamber is connected to an exhaust pipeline; and The cooling device according to any one of claims 1 to 5, wherein the cooling device is arranged on the exhaust pipe.

7. A method for manufacturing a substrate, characterized in that: A first film layer is formed on a substrate using the process equipment as described in claim 6, wherein during the process of forming the first film layer, the gas exhausted from the process chamber is cooled by the cooling device.

8. The method according to claim 7, characterized in that Cooling the gas exhausted from the process chamber by the cooling device specifically includes: Precooling the gas exhausted from the process chamber by the precooling unit so that the gas is cooled to a first temperature at which the gas remains in a gaseous state; The gas cooled by the pre-cooling unit is secondarily cooled by the secondary cooling unit, so that the gas is cooled to a second temperature at which at least a portion of the gas solidifies into a solid state.

9. The method according to claim 8, characterized in that The first temperature is greater than or equal to 125°C; the second temperature is less than 125°C.

10. The method according to claim 8, characterized in that When applied to the cooling device according to claim 2, the pre-cooling unit performs a pre-cooling treatment on the gas exhausted from the process chamber so that the gas is cooled to a first temperature at which the gas remains in a gaseous state, specifically comprising: The cooling medium is provided to the target number of the cooling groups through the cooling medium distribution pipeline, so as to individually control the operation of the target number of the cooling groups, so that the gas reaches the first temperature after being cooled by the pre-cooling unit.

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