Method, device and electronic device for measuring surface temperature of implantable medical device

Abstract

The present specification provides a method, apparatus and electronic device for measuring the surface temperature of an implantable medical device, the method comprising: determining a steady-state temperature value near the temperature sensor when the implantable medical device continuously operates at a current power; determining a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device; calculating a temperature difference between the temperature sensor and the hottest position on the outer surface based on the first heat flow value and the first thermal resistance value, and determining the difference between the steady-state temperature value and the temperature difference as the surface temperature value of the hottest position on the outer surface.

Description

Technical Field

[0001] The present specification relates to the field of medical device technology, and in particular to a method, device and electronic device for measuring the surface temperature of an implantable medical device. Background Art

[0002] Implantable medical devices are an important part of modern medical technology, with a wide range of applications, including pacemakers, neurostimulators, cochlear implants, etc. These devices are implanted in the human body and come into direct contact with human tissue to monitor, regulate and treat.

[0003] Since implantable medical devices need to work inside the human body, regulations require that the surface temperature of implantable medical devices must be controlled to a maximum of 39°C to avoid damaging human tissue. Therefore, it is necessary to monitor the external surface temperature of implantable medical devices in real time and adjust the power of implantable medical devices to ensure that the external surface temperature is always kept within 39°C.

[0004] The related technology generally involves installing a temperature sensor in an implantable medical device and regarding the temperature measured by the temperature sensor as the outer surface temperature of the implantable medical device. However, due to the thermal resistance in the heat flow path between the temperature sensor and the outer surface, there is a difference between the temperature measured by the temperature sensor and the actual temperature of the outer surface, which affects the accuracy of measuring the outer surface temperature of the implantable medical device. Summary of the invention

[0005] To overcome the problems existing in the related art, this specification provides a method, an apparatus and an electronic device for measuring the surface temperature of an implantable medical device.

[0006] According to a first aspect of an embodiment of this specification, a method for measuring the surface temperature of an implantable medical device is provided, the method being applied to an implantable medical device equipped with a temperature sensor, the method comprising:

[0007] determining a steady-state temperature value near the temperature sensor when the implantable medical device continues to operate at a current power;

[0008] Determining a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and a hottest location on an outer surface of the implantable medical device;

[0009] The temperature difference between the temperature sensor and the hottest position of the outer surface is calculated based on the first heat flow value and the first thermal resistance value, and the difference between the steady-state temperature value and the temperature difference is determined as the surface temperature value of the hottest position of the outer surface.

[0010] According to a second aspect of an embodiment of this specification, there is provided a device for measuring the surface temperature of an implantable medical device, the device being applied to an implantable medical device equipped with a temperature sensor, the device comprising:

[0011] a steady-state temperature value determination module, used to determine a steady-state temperature value near the temperature sensor when the implantable medical device continues to operate at a current power;

[0012] a heat flow path parameter determination module, configured to determine a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device;

[0013] A surface temperature value determination module is used to calculate the temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flux value and the first thermal resistance value, and determine the difference between the steady-state temperature value and the temperature difference as the surface temperature value of the hottest position of the outer surface.

[0014] According to a third aspect of the embodiments of this specification, an electronic device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the steps of the method described in the first aspect are implemented.

[0015] According to a fourth aspect of the embodiments of this specification, a computer-readable storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, the steps of the method described in the first aspect are implemented.

[0016] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0017] In the embodiments of this specification, the steady-state temperature value near the temperature sensor when the implantable medical device is continuously working at the current power is first determined, and then the first heat flow value and the first thermal resistance value on the heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device are determined, and the temperature difference between the temperature sensor and the hottest position on the outer surface is calculated based on the first heat flow value and the first thermal resistance value, and finally the difference between the steady-state temperature value and the temperature difference is determined as the surface temperature value of the hottest position on the outer surface. It can be seen that this solution improves the accuracy of measuring the surface temperature of the implantable medical device by adding the heat loss influence factor on the heat flow path between the temperature sensor and the outer surface of the implantable medical device on the basis of the steady-state temperature value of the temperature sensor.

[0018] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0020] Figure 1 It is a structural schematic diagram of an implantable medical device according to an exemplary embodiment of this specification.

[0021] Figure 2 The present specification is a flowchart of a method for measuring the surface temperature of an implantable medical device according to an exemplary embodiment.

[0022] Figure 3 Schematic diagram of a heat flow path between a temperature sensor and the hottest position on an outer surface according to an exemplary embodiment of the present specification.

[0023] Figure 4 It is a schematic diagram of a heat flow path between a heat generating module, a temperature sensor and the hottest position on an outer surface according to an exemplary embodiment of the present specification.

[0024] Figure 5 Schematic diagram of a heat flow path between the hottest position on the outer surface and a distal position on the human body according to an exemplary embodiment of the present specification.

[0025] Figure 6 It is a schematic structural diagram of an implantable medical device including multiple heating modules and a single temperature sensor according to an exemplary embodiment of this specification.

[0026] Figure 7 It is a structural schematic diagram of a heat flow path among multiple heat-generating modules, a single temperature sensor and the hottest position on the outer surface according to an exemplary embodiment of this specification.

[0027] Figure 8 It is a schematic diagram of an implantable medical device including multiple heating modules and multiple temperature sensors according to an exemplary embodiment of this specification.

[0028] Fig. 9 It is a schematic diagram of a heat flow path among multiple heat-generating modules, multiple temperature sensors and the hottest position on the outer surface according to an exemplary embodiment of the present specification.

[0029] Fig.10 It is a structural schematic diagram of an electronic device according to an exemplary embodiment of the present specification.

[0030] Fig.11 The present specification is a block diagram of an apparatus for measuring the surface temperature of an implantable medical device according to an exemplary embodiment. DETAILED DESCRIPTION

[0031] like Figure 1 As shown, the implantable medical device 1 may include at least a power supply module 11, a heating module 12, a temperature sensor 13 and an over-temperature judgment module 14. The power supply module 11 is used to supply power to the heating module 12 and the over-temperature judgment module 14. The implantable medical device 1 includes but is not limited to a neurostimulator, a cardiac pacemaker, a cochlear implant and other devices. Neurostimulators include but are not limited to spinal cord neurostimulators (SCS), peripheral nerve stimulators (PNS) and tibial nerve stimulators (TNS).

[0032] Due to the presence of the heating module 12, the outer surface temperature of the implantable medical device 1 is usually higher than body temperature, and the position with the highest outer surface temperature is called the "hottest position on the outer surface". It is understandable that the hottest position on the outer surface may be located at any position on the outer surface of the device. According to relevant regulations, the maximum outer surface temperature of the implantable medical device 1 cannot exceed 39°C. Therefore, the implantable medical devices currently produced on the market need to monitor their own temperature changes in real time and adjust the working mode in time to avoid overheating. For example, when it is monitored that the outer surface temperature of the implantable medical device 1 is about to reach 39°C, the implantable medical device 1 is cooled by reducing the power of the implantable medical device 1.

[0033] Since the heat generated by the implantable medical device 1 is almost entirely derived from high-power functional modules, these high-power functional modules can be regarded as heating modules 12, and the temperature of these heating modules 12 is monitored in particular. It is understandable that the heating module 12 is not the specific name of the functional module of the implantable medical device 1, but refers to the functional module that mainly generates heat during the operation of the implantable medical device 1. For example, high-power functional modules such as microprocessor modules, stimulation modules or wireless communication modules can all be regarded as heating modules 12.

[0034] In this solution, the temperature sensor 13 can be integrated as a functional unit inside the heating module 12 as in the related art, or independently installed near the heating module 12 to measure the temperature near the heating module 12. Different from the related art, the position of the temperature sensor 13 in this solution may not be coupled to the position of the heating module 12. In other words, the position of the temperature sensor 13 may be independent of the position of the heating module 12.

[0035] The over-temperature judgment module 14 can be a microprocessor specifically used to execute the over-temperature judgment logic. Of course, the over-temperature judgment logic can also share the existing microprocessor of the implantable medical device 1 for execution. In the related art, the over-temperature judgment module 14 obtains the temperature value measured by the temperature sensor 13, and compares it with the temperature threshold (the temperature threshold can be 39°C as required by the regulations), and when the temperature value is greater than the temperature threshold, instructs the heating module 12 to reduce the temperature of the outer surface of the implantable medical device 1 by reducing the power. However, due to the heat loss in the heat flow path between the temperature sensor 13 and the outer surface of the implantable medical device 1, the temperature value measured by the temperature sensor 13 is generally higher than the surface temperature value on the outer surface of the implantable medical device 1. It can be seen that the temperature value measured by the temperature sensor 13 cannot represent the actual temperature value of the outer surface of the implantable medical device 1, which ultimately causes the outer surface temperature of the implantable medical device 1 determined by the related art to be inaccurate.

[0036] In response to the above technical problems, this specification proposes a method for measuring the surface temperature of an implantable medical device. The accuracy of measuring the surface temperature of the implantable medical device 1 is improved by adding the heat loss influencing factor on the heat flow path between the temperature sensor 13 and the outer surface of the implantable medical device 1 on the basis of the temperature value measured by the temperature sensor 13.

[0037] Next, the embodiments of this specification are described in detail:

[0038] like Figure 2 As shown, Figure 2 This is a flow chart of a method for measuring the surface temperature of an implantable medical device according to an exemplary embodiment of the present specification. The method can be applied to Figure 1 The implantable medical device 1 comprises steps 201-203:

[0039] Step 201: Determine a steady-state temperature value near the temperature sensor when the implantable medical device continues to operate at a current power.

[0040] Step 202: Determine a first heat flow value and a thermal resistance value on a heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device.

[0041] Step 203: Calculate the temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flux value and the thermal resistance value, and determine the difference between the steady-state temperature value and the temperature difference as the surface temperature value of the hottest position of the outer surface.

[0042] In this embodiment, by adding the heat loss influencing factor on the heat flow path between the temperature sensor 13 and the outer surface of the implantable medical device 1 on the basis of the temperature value measured by the temperature sensor 13, the accuracy of measuring the surface temperature of the implantable medical device 1 can be improved.

[0043] When the implantable medical device 1 starts to work at a certain power, its temperature gradually rises and tends to a steady-state temperature. The heat generated by the implantable medical device 1 at this power continues to be stable near the steady-state temperature value. For example, assuming that the implantable medical device 1 continues to work at power A, its temperature rise trend is 37°C, 37.5°C, 37.8°C, 38°C, 38°C, then the steady-state temperature value can be considered to be 38°C. For another example, assuming that the implantable medical device 1 continues to work at power B, its temperature rise trend is 37°C, 37.5°C, 37.8°C, 38.2°C, 38.5°C, 38.5°C, then the steady-state temperature value can be considered to be 38.5°C.

[0044] In an illustrated embodiment, when the implantable medical device 1 continues to work at the current power, the over-temperature judgment module 14 collects at least two actual temperature values ​​of the temperature sensor 13, and obtains a steady-state temperature value by fitting at least two actual temperature values. Exemplarily, the actual temperature value can be fitted by a logarithmic fitting function to obtain a steady-state temperature value. Of course, this specification does not limit the fitting method, and those skilled in the art can seek a suitable fitting function type through multiple simulation experiments. If cooling measures are taken when the actual measured value of the temperature sensor 13 exceeds the temperature threshold, the human body is already in an over-temperature environment, which violates regulatory requirements. In this solution, the steady-state temperature value corresponding to the current power is predicted based on the actual temperature value measured by the temperature sensor, and an over-temperature judgment is made based on the predicted steady-state temperature value, so that the over-temperature risk of the implantable medical device 1 when working at the current power can be discovered in advance and responded to in advance.

[0045] In one illustrated embodiment, Figure 3 As shown, there is a first thermal resistance 31 on the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface. It should be noted that, Figure 3 Although the first thermal resistance value 31 is drawn as an independent rectangle, the thermal resistance value is essentially an abstract representation of the overall thermal resistance of the heat flow path, rather than indicating that thermal resistance exists only in the middle of the path. The thermal resistance values ​​of other figures are similar to this, which is hereby explained.

[0046] The hottest position 32 on the outer surface may refer to the position where the heat on the outer surface of the implantable medical device 1 is most severe when the device is in operation. The position may be determined by simulation experiments, and this specification does not limit the method of determining the hottest position 32 on the outer surface. Due to the presence of the first thermal resistor 31, when the heat near the temperature sensor 13 flows to the hottest position 32 on the outer surface, the temperature of the hottest position 32 on the outer surface is lower than the temperature near the temperature sensor 13. The relationship between the temperature near the temperature sensor 13 and the temperature of the hottest position 32 on the outer surface is shown in Formula 1:

[0047] (Formula 1)

[0048] in, represents the temperature near the temperature sensor 13, represented by the steady-state temperature value obtained in step 201, represents the temperature at the hottest location 32 on the outer surface, The first thermal resistance value 31 represents the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface, It represents the first heat flow value on the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface.

[0049] It can be seen from Formula 1 that after determining the first heat flow value and the first thermal resistance value 31, the over-temperature judgment module 14 can calculate the temperature difference between the temperature sensor 13 and the hottest position 32 of the outer surface based on the first heat flow value and the first thermal resistance value 31. and the steady-state temperature value determined in step 201 Temperature difference The difference is determined as the surface temperature value of the hottest position 32 on the outer surface .

[0050] The first thermal resistance value 31 of the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface can be determined by simulation experiments. The method for determining the first heat flow value will be introduced in subsequent embodiments and will not be described here.

[0051] In this embodiment, the steady-state temperature value of the temperature sensor 13 obtained by calculation is On this basis, the accuracy of measuring the surface temperature of the implantable medical device 1 can be improved by adding the heat loss influencing factor on the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface.

[0052] In an illustrated embodiment, the over-temperature determination module 14 determines the surface temperature value of the hottest position on the outer surface of the implantable medical device 1. After that, the surface temperature value can be When the temperature is greater than the first temperature threshold or the steady-state temperature value is greater than the second temperature threshold, the implantable medical device 1 is instructed to operate at a power lower than the current power, and specifically, the heating module 12 is instructed to operate at a power lower than the current power. Of course, in addition to the heating module 12, other functional modules can also be instructed to operate at a power lower than the current power. In addition, the operation of the implantable medical device 1 can also be suspended for a period of time to achieve rapid cooling without affecting the treatment effect. Among them, the first temperature threshold and the second temperature threshold can be lower than the maximum temperature of 39°C required by regulations.

[0053] Next, how to determine the first heat flow value is described, as detailed in the following embodiment:

[0054] In one illustrated embodiment, Figure 4 As shown, there is a third thermal resistor 41 on the heat flow path between the heating module 12 and the temperature sensor 13, and there is a first thermal resistor 31 on the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface. The third thermal resistor 41 and the first thermal resistor 31 can be obtained through simulation experiments. In addition, when the influence of the heat dissipation of the heating module 12 on the first heat flow is considered separately, the power P of the heating module 12 of the implantable medical device 1 and the first heat flow can be obtained through simulation experiments. The first function of the relationship between , see formula 2:

[0055] (Formula 2)

[0056] After obtaining the current power value of the heating module 12, the over-temperature judgment module 14 inputs it into the first function to obtain the first heat flow value .

[0057] In an illustrated embodiment, a power consumption monitoring module may be connected to the outside of the heating module 12, and the power consumption monitoring module is used to monitor the current power of the heating module 12 and send the current power value to the over-temperature judgment module 14. Of course, a power consumption monitoring unit may also be integrated inside the heating module 12 to monitor the current power of the heating module 12 and send the current power to the over-temperature judgment module 14. This specification does not limit the way in which the over-temperature judgment module 14 obtains the current power value of the heating module 12.

[0058] In an embodiment shown, the temperature near the temperature sensor 13 can be established by simulation experiments under the condition that the influence of the heat dissipation of the temperature sensor 13 on the first heat flow is considered separately. With the first heat flow The second function of the relationship between , see formula 3:

[0059] (Formula 3)

[0060] The over-temperature judgment module 14 can obtain the second function and input the steady-state temperature value into the second function to obtain the first heat flow value .

[0061] In an embodiment shown, the power P of the heating module 12 and the temperature near the temperature sensor can be established by simulation experiments while considering the influence of the heat dissipation of the heating module 12 and the temperature sensor 13 on the first heat flow. and the first heat flow The third function of the relationship between , see formula 4:

[0062] (Formula 4)

[0063] After obtaining the third function, the over-temperature judgment module 14 can calculate the current power value P and the steady-state temperature value of the heating module 12. At the same time, input it into the third function to get the first heat flow value .

[0064] Understandably, It can be any function type, and this specification does not impose any restrictions on it. For example, , ,in, , is the coefficient.

[0065] The maximum surface temperature of the implantable medical device 1 required by the regulations is based on the normal human body temperature of 37°C, and a temperature rise of 2°C is added to this base as the maximum surface temperature of the implantable medical device 1. Another meaning of the regulatory requirements indicates that a temperature rise of less than 2°C based on personal body temperature will not cause harm to the human body. However, the normal body temperature of some people with low body temperature may be around 36°C, and the outer surface temperature of the implantable medical device 1 of 39°C has actually caused harm to such people. On the contrary, for the low body temperature group of 36°C, according to the temperature rise requirement of 2°C, the maximum temperature of the outer surface of the implantable medical device 1 should not exceed 38°C. However, the implantable medical devices 1 on the market generally set the temperature threshold according to the maximum temperature of 39°C, without taking into account the differences between people with different body temperatures. In response to this problem, this specification proposes an improved solution, please refer to the following embodiments for details:

[0066] In one illustrated embodiment, Figure 5As shown, there is a second thermal resistance 51 on the heat flow path between the hottest position 32 on the outer surface and the distal position 52 of the human body. The distal position 52 of the human body can be understood as a position in the human body that is not affected by the heat dissipation of the implanted medical device 1. For example, if the implanted medical device 1 is a cardiac pacemaker, the distal position 52 of the human body can be a foot. The second thermal resistance 51 on the heat flow path between the hottest position 32 on the outer surface and the distal position 52 of the human body can be determined through simulation experiments. The surface temperature of the hottest position 32 on the outer surface and the human body temperature at the remote location 52 of the human body The relationship between is shown in Formula 5:

[0067] (Formula 5)

[0068] in, is the second thermal resistance value. represents the temperature difference between the outer surface temperature of the implantable medical device 1 and the actual temperature of the human body. The temperature value measured by the temperature sensor 13 is introduced when calculating, and the temperature value is related to the personal body temperature environment. Therefore, the above formula is used to calculate The influence of human body temperature difference is taken into account.

[0069] In an illustrated embodiment, when the surface temperature value is greater than the first temperature threshold or the steady-state temperature value is greater than the second temperature threshold, the over-temperature judgment module 14 instructs the implantable medical device 1 to operate at a power lower than the current power. When the surface temperature value is not greater than the temperature threshold, the second thermal resistance value from the hottest position on the outer surface to the distal position of the human body is obtained. , at the second thermal resistance value With the first heat flow value The product of ) is greater than the temperature difference threshold, indicating that the implantable medical device 1 is running at a power lower than the current power. Among them, the temperature difference threshold can be selected as 2°C. That is, when the difference between the temperature at the far end of the human body (representing the normal body temperature of the human body) and the temperature at the hottest position on the outer surface is greater than 2°C, it indicates that the surface temperature at the hottest position on the outer surface of the implantable medical device 1 is 2°C higher than the current body temperature of the human body, which exceeds the range of damage that the human body can withstand. It can be seen that in this embodiment, over-temperature judgment is performed by means of temperature difference, which can take into account the temperature differences of different groups of people and control the working power of the implantable medical device 1 in a more targeted manner.

[0070] In addition to selecting a functional module with the largest heat dissipation of the implantable medical device 1 as a heating module and using it to represent the overall heating of the implantable medical device 1, the heating effects of more functional modules can also be considered, and the heating influence factors of multiple heating modules can be introduced when establishing a model for measuring the surface temperature of the implantable medical device. For details, see the following embodiments:

[0071] In an illustrated embodiment, the implantable medical device 1 may include a plurality of heating modules. Figure 6 As shown, two heating modules are used as an example. For example, the processor module in the implantable medical device 1 can be regarded as the heating module 12A, and the electrical stimulation module can be regarded as the heating module 12B. A temperature sensor 13 can be installed near the heating module 12A and the heating module 12B. The temperature sensor 13 is connected to the over-temperature judgment module 14, and the over-temperature judgment module 14 is connected to the heating module 12A and the heating module 12B, and is used to instruct the heating module 12A and the heating module 12B to reduce power in the case of over-temperature. Of course, in addition to instructing the heating module to reduce power when judging over-temperature, the over-temperature judgment module 14 can also instruct the non-heating module to reduce power. This specification does not limit the processing method of the over-temperature judgment module 14 in the case of over-temperature.

[0072] like Figure 7 As shown, there is a third thermal resistor 41A on the heat flow path between the heating module 12A and the temperature sensor 13, there is a third thermal resistor 41B on the heat flow path between the heating module 12B and the temperature sensor 13, and there is a first thermal resistor 31 on the heat flow path between the temperature sensor 13 and the hottest position 32 on the outer surface.

[0073] When determining the surface temperature value of the hottest position 32 of the outer surface, different from a single heating module, the method of determining the first heat flow value of the temperature sensor 13 is changed:

[0074] The second heat flow values ​​on the heat flow paths between the heat generating modules 12A, 12B and the temperature sensor 13 are determined respectively, and the average value of the second heat flow values ​​corresponding to the heat generating modules can be used as the first heat flow value.

[0075] For any heating module, the first heat flow value and the second heat flow value are expressions of the same heat flow object on different heat flow paths. Therefore, the second heat flow value can also be calculated using formulas 2-4. For details, please refer to the aforementioned embodiment for calculating the first heat flow value, which will not be repeated in this specification.

[0076] In this embodiment, by introducing the heating factors of multiple heating modules into the established model for measuring the surface temperature of the implantable medical device, and taking the average of the second heat flow values ​​calculated based on the multiple heating modules as the first heat flow value of the temperature sensor, the error caused by the modeling deviation can be reduced. In addition, the model only uses one temperature sensor, which can reduce the production cost of the implantable medical device and the design complexity of the device.

[0077] In another illustrative embodiment, Figure 8 As shown, a temperature sensor 13A and a temperature sensor 13B can be installed near the heating module 12A and the heating module 12B, respectively. Of course, the temperature sensor can also be integrated into the heating module in the form of an integrated unit, and this specification does not impose any restrictions on this. The temperature sensor 13A and the temperature sensor 13B can be connected to the over-temperature judgment module 14 so that the over-temperature judgment module 14 can collect the temperature measured by them. The over-temperature judgment module 14 is connected to the heating module 12A and the heating module 12B, respectively, and instructs them to operate at a power lower than the current power when judging over-temperature.

[0078] like Fig. 9 As shown, there is a third thermal resistor 41A on the heat flow path between the heating module 12A and the temperature sensor 13A, there is a third thermal resistor 41B on the heat flow path between the heating module 12B and the temperature sensor 13B, there is a first thermal resistor 31A on the heat flow path between the temperature sensor 13A and the hottest position 32 on the outer surface, and there is a first thermal resistor 31B on the heat flow path between the temperature sensor 13B and the hottest position 32 on the outer surface.

[0079] A first heat flow value and a first thermal resistance value on a heat path between each temperature sensor and the hottest point 32 on the outer surface of the implantable medical device 1 are determined.

[0080] For any temperature sensor, the temperature difference between the temperature sensor and the hottest position 32 of the outer surface is calculated based on the first heat flow value and the first thermal resistance value corresponding to the temperature sensor, and the difference between the steady-state temperature value of the temperature sensor and the temperature difference is determined as the statistical surface temperature value of the hottest position 32 of the outer surface corresponding to the temperature sensor, and the average value or maximum value of all statistical surface temperature values ​​is used as the surface temperature value of the implantable medical device 1.

[0081] For example, for the temperature sensor 13A, the current power value of the heating module 12A is input into Formula 2, or the steady-state temperature value of the temperature sensor 13A is input into Formula 3, or the current power value of the heating module 12A and the steady-state temperature value of the temperature sensor 13A are simultaneously input into Formula 4, and the first heat flow value on the heat flow path between the temperature sensor 13A and the hottest position 32 on the outer surface can be obtained.

[0082] By inputting the steady-state temperature value of the temperature sensor 13A and the first heat flow value corresponding to the temperature sensor 13A into Formula 1, a first statistical surface temperature value of the hottest position 32 on the outer surface corresponding to the temperature sensor 13A can be obtained.

[0083] Similarly, for the temperature sensor 13B, the current power value of the heating module 12B is input into Formula 2, or the steady-state temperature value of the temperature sensor 13B is input into Formula 3, or the current power value of the heating module 12B and the steady-state temperature value of the temperature sensor 13B are simultaneously input into Formula 4, and the first heat flow value on the heat flow path between the temperature sensor 13B and the hottest position 32 on the outer surface can be obtained.

[0084] The second statistical surface temperature value of the hottest position 32 on the outer surface corresponding to the temperature sensor 13B can be obtained by inputting the steady-state temperature value of the temperature sensor 13B and the first heat flow value corresponding to the temperature sensor 13B into Formula 1.

[0085] Finally, the average value or the maximum value of the first statistical surface temperature value and the second statistical surface temperature value is taken as the surface temperature value of the implantable medical device 1 .

[0086] In this embodiment, a temperature sensor is configured for each heating module based on the consideration of the heat flow influence of multiple heating modules, so that the heat flow influence factors of different heating modules can be calculated more accurately. In addition, the surface temperature value finally calculated is the average or maximum value of the statistical surface temperature values ​​corresponding to all heating modules, which can reduce the error caused by modeling deviation and improve the accuracy of modeling.

[0087] Corresponding to the embodiments of the aforementioned method, this specification also provides embodiments of a device and a terminal to which it is applied.

[0088] like Fig.10 As shown, Fig.10 It is a structural diagram of an electronic device 1000 shown in this specification according to an exemplary embodiment. At the hardware level, the device includes a processor 1002, an internal bus 1004, a network interface 1006, a memory 1008 and a non-volatile memory 1010, and of course may also include hardware required for other services. One or more embodiments of this specification can be implemented based on software, such as the processor 1002 reading the corresponding computer program from the non-volatile memory 1010 into the memory 1008 and then running it. Of course, in addition to the software implementation, one or more embodiments of this specification do not exclude other implementations, such as logic devices or a combination of software and hardware, etc., that is, the execution subject of the following processing flow is not limited to each logic module, but can also be hardware or logic devices.

[0089] like Fig.11 As shown, Fig.11 This specification is a device for measuring the surface temperature of an implantable medical device according to an exemplary embodiment. The device can be applied to Fig.10 The electronic device 1000 shown in the figure is used to implement the technical solution of this specification. The electronic device 1000 may be an implantable medical device equipped with a temperature sensor. The device includes:

[0090] A steady-state temperature value determination module 1102, configured to determine a steady-state temperature value near the temperature sensor when the implantable medical device continues to operate at a current power;

[0091] A heat flow path parameter determination module 1104, configured to determine a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device;

[0092] The surface temperature value determination module 1106 is used to calculate the temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flux value and the first thermal resistance value, and determine the difference between the steady-state temperature value and the temperature difference as the surface temperature value of the hottest position of the outer surface.

[0093] Optionally, the implantable medical device is equipped with multiple temperature sensors, each of which is used to measure the temperature near different heating modules of the implantable medical device, and the heat flow path parameter determination module 1104 is specifically used to determine the first heat flow value and the first thermal resistance value on the heat path between each temperature sensor and the hottest point on the outer surface of the implantable medical device. The surface temperature value determination module 1106 is specifically used to calculate the temperature difference between the temperature sensor and the hottest point on the outer surface for any temperature sensor based on the first heat flow value and the first thermal resistance value corresponding to the temperature sensor, and determine the difference between the steady-state temperature value of the temperature sensor and the temperature difference as the statistical surface temperature value of the hottest point on the outer surface corresponding to the temperature sensor, and take the average or maximum value of all statistical surface temperature values ​​as the surface temperature value.

[0094] Optionally, the implantable medical device includes multiple heating modules, and the heat flow path parameter determination module 1104 is specifically used to determine the second heat flow value on the heat flow path between each heating module and the temperature sensor, and take the average value of the second heat flow values ​​corresponding to each heating module as the first heat flow value.

[0095] Optionally, the steady-state temperature value determining module 1102 is specifically configured to collect at least two actual temperature values ​​measured by the temperature sensor, and obtain the steady-state temperature value by fitting the at least two actual temperature values.

[0096] Optionally, the heat flow path parameter determination module 1104 is specifically used to obtain a first function representing the relationship between the power of the implantable medical device and the first heat flow, and input the current power value of the implantable medical device into the first function to obtain the first heat flow value.

[0097] Optionally, the heat flow path parameter determination module 1104 is specifically used to obtain a second function representing the relationship between the temperature near the temperature sensor and the first heat flow, and input the steady-state temperature value into the second function to obtain the first heat flow value; or, obtain a third function representing the relationship between the power of the implantable medical device, the temperature near the temperature sensor and the first heat flow, and input the current power value and the steady-state temperature value of the implantable medical device into the third function at the same time to obtain the first heat flow value.

[0098] Optionally, the apparatus further includes an over-temperature judgment module 1108, which is used to instruct the implantable medical device to operate at a power lower than the current power when the surface temperature value is greater than a first temperature threshold or the steady-state temperature value is greater than a second temperature threshold; to obtain a second thermal resistance value from the hottest position of the outer surface to a distal position of the human body when the surface temperature value is not greater than the temperature threshold; and to instruct the implantable medical device to operate at a power lower than the current power when the product of the second thermal resistance value and the first heat flow value is greater than a temperature difference threshold.

[0099] Alternatively, the over-temperature judgment module 1108 may also be configured to instruct the implantable medical device to operate at a power lower than the current power when the surface temperature value is greater than a first temperature threshold or the steady-state temperature value is greater than a second temperature threshold.

[0100] The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, which will not be repeated here.

[0101] For the device embodiment, since it basically corresponds to the method embodiment, the relevant parts can refer to the partial description of the method embodiment. The device embodiment described above is only schematic, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. Ordinary technicians in this field can understand and implement it without paying creative work.

[0102] The present specification also provides a computer-readable storage medium having a computer program stored thereon, and when the program is executed by a processor, the steps of any of the aforementioned methods for measuring the surface temperature of an implantable medical device provided in the present application are implemented.

[0103] Specifically, computer-readable media suitable for storing computer program instructions and data include all forms of non-volatile memory, media and memory devices, including, for example, semiconductor memory devices (such as EPROM, EEPROM and flash memory devices), magnetic disks (such as internal hard disks or removable disks), magneto-optical disks, and CD ROM and DVD-ROM disks.

Claims

1. A device for measuring the surface temperature of an implantable medical device, characterized in that: The device is applied to an implantable medical device equipped with a temperature sensor, and the device comprises: a steady-state temperature value determination module, used to determine a steady-state temperature value near the temperature sensor when the implantable medical device continues to operate at a current power; A heat flow path parameter determination module, used for determining a first heat flow value and a first thermal resistance value on the heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device; the determining the first heat flow value on the heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device comprises: obtaining a second function representing the relationship between the temperature near the temperature sensor and the first heat flow, and inputting the steady-state temperature value into the second function to obtain the first heat flow value; or obtaining a third function representing the relationship between the power of the implantable medical device, the temperature near the temperature sensor and the first heat flow, and simultaneously inputting the current power value and the steady-state temperature value of the implantable medical device into the third function to obtain the first heat flow value; a surface temperature value determination module, configured to calculate a temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flux value and the first thermal resistance value, and determine a difference between the steady-state temperature value and the temperature difference as a surface temperature value of the hottest position of the outer surface; An over-temperature judgment module is used to instruct the implantable medical device to operate at a power lower than the current power when the surface temperature value is greater than a first temperature threshold or the steady-state temperature value is greater than a second temperature threshold; to obtain a second thermal resistance value from the hottest position of the outer surface to a distal position of the human body when the surface temperature value is not greater than the temperature threshold; and to instruct the implantable medical device to operate at a power lower than the current power when the product of the second thermal resistance value and the first heat flow value is greater than a temperature difference threshold.

2. The device according to claim 1, characterized in that The implantable medical device is equipped with a plurality of temperature sensors, each of which is used to measure the temperature near different heating modules of the implantable medical device. Determining a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device includes: Determining a first heat flow value and a first thermal resistance value on a heat path between each temperature sensor and a hottest point on an outer surface of the implantable medical device; The step of calculating the temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flow value and the first thermal resistance value, and determining the difference between the steady-state temperature value and the temperature difference as the surface temperature value of the hottest position of the outer surface, comprises: For any temperature sensor, the temperature difference between the temperature sensor and the hottest position of the outer surface is calculated based on the first heat flux value and the first thermal resistance value corresponding to the temperature sensor, and the difference between the steady-state temperature value of the temperature sensor and the temperature difference is determined as the statistical surface temperature value of the hottest position of the outer surface corresponding to the temperature sensor, and the average value or maximum value of all statistical surface temperature values ​​is used as the surface temperature value.

3. The device according to claim 1, characterized in that The implantable medical device includes a plurality of heating modules, and determining a first heat flow value on a heat flow path between the temperature sensor and a hottest position on an outer surface of the implantable medical device includes: The second heat flow value on the heat flow path between each heat generating module and the temperature sensor is determined, and the average value of the second heat flow values ​​corresponding to each heat generating module is used as the first heat flow value.

4. The device according to claim 1, characterized in that Determining a steady-state temperature value near the temperature sensor includes: At least two actual temperature values ​​measured by the temperature sensor are collected, and the steady-state temperature value is obtained by fitting the at least two actual temperature values.

5. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the following steps are implemented: Determine a steady-state temperature value near a temperature sensor when the implantable medical device continues to operate at a current power; Determining a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and a hottest location on an outer surface of the implantable medical device; The determining of the first heat flow value on the heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device comprises: obtaining a second function representing the relationship between the temperature near the temperature sensor and the first heat flow, and inputting the steady-state temperature value into the second function to obtain the first heat flow value; or obtaining a third function representing the relationship between the power of the implantable medical device, the temperature near the temperature sensor, and the first heat flow, and simultaneously inputting the current power value of the implantable medical device and the steady-state temperature value into the third function to obtain the first heat flow value; Calculating a temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flow value and the first thermal resistance value, and determining a difference between the steady-state temperature value and the temperature difference as a surface temperature value of the hottest position of the outer surface; In case the surface temperature value is greater than a first temperature threshold or the steady-state temperature value is greater than a second temperature threshold, instructing the implantable medical device to operate at a power lower than the current power; When the surface temperature value is not greater than the temperature threshold, a second thermal resistance value from the hottest position of the outer surface to the distal position of the human body is obtained; when the product of the second thermal resistance value and the first heat flow value is greater than the temperature difference threshold, the implantable medical device is instructed to operate at a power lower than the current power.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the following steps are implemented: Determine a steady-state temperature value near a temperature sensor when the implantable medical device continues to operate at a current power; Determining a first heat flow value and a first thermal resistance value on a heat flow path between the temperature sensor and a hottest location on an outer surface of the implantable medical device; The determining of the first heat flow value on the heat flow path between the temperature sensor and the hottest position on the outer surface of the implantable medical device comprises: obtaining a second function representing the relationship between the temperature near the temperature sensor and the first heat flow, and inputting the steady-state temperature value into the second function to obtain the first heat flow value; or obtaining a third function representing the relationship between the power of the implantable medical device, the temperature near the temperature sensor, and the first heat flow, and simultaneously inputting the current power value of the implantable medical device and the steady-state temperature value into the third function to obtain the first heat flow value; Calculating a temperature difference between the temperature sensor and the hottest position of the outer surface based on the first heat flow value and the first thermal resistance value, and determining a difference between the steady-state temperature value and the temperature difference as a surface temperature value of the hottest position of the outer surface; In case the surface temperature value is greater than a first temperature threshold or the steady-state temperature value is greater than a second temperature threshold, instructing the implantable medical device to operate at a power lower than the current power; When the surface temperature value is not greater than the temperature threshold, a second thermal resistance value from the hottest position of the outer surface to the distal position of the human body is obtained; when the product of the second thermal resistance value and the first heat flow value is greater than the temperature difference threshold, the implantable medical device is instructed to operate at a power lower than the current power.

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