A waterproof and breathable structure, manufacturing method and packaging structure

Abstract

The present invention relates to the technical field of micro-electromechanical systems, and discloses a waterproof and breathable structure, a manufacturing method and a packaging structure, wherein the manufacturing method comprises: providing a substrate; forming a plurality of columnar protrusions on one side of the substrate, with grooves between adjacent columnar protrusions, and adjacent grooves are interconnected; making a metal structure filled in the grooves, and connecting the metal structures in the interconnected grooves; making a cavity that passes through the middle of the substrate, so that in the thickness direction of the substrate, the columnar protrusions located within the projection range of the cavity are etched, and the metal structure located within the projection range of the cavity is exposed, forming a mesh structure; making a hydrophobic film layer. By setting a metal mesh structure embedded in the substrate, the waterproof and breathable structure has high mechanical strength, durability, corrosion resistance and consistency, and can maintain the mesh structure without deformation and damage under greater pressure and mechanical stress, thereby ensuring the continuity of waterproof performance.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-electromechanical systems, and in particular to a waterproof and breathable structure, a manufacturing method and a packaging structure. Background Art

[0002] MEMS chip refers to Micro-Electro-Mechanical Systems, which is a chip that integrates micro-mechanical structures, electronic components and microprocessors. Currently, MEMS chips have been widely used in various electronic products, including smartphones, tablets, automobiles, medical equipment, etc. For MEMS chips used in electronic products, waterproofing is an important consideration.

[0003] The existing waterproof measure for MEMS chips is to attach a waterproof screen or waterproof film with a mesh structure to the installation location of the MEMS chip. However, this waterproof structure has some potential problems. First, due to the material and structural limitations of the waterproof screen or waterproof film, they are easily affected by pressure and undergo irreversible deformation, thereby reducing the waterproof effect. Secondly, due to the differences in the manufacturing process, the consistency of this type of waterproof structure is poor, and it is difficult to ensure that the waterproof and breathable performance between different products or batches remains consistent, so that the reliability and stability of the waterproof performance of the MEMS chip cannot be ensured. Summary of the invention

[0004] The embodiments of the present invention provide a waterproof and breathable structure, a manufacturing method and a packaging structure, aiming to improve the reliability and consistency of the waterproof and breathable structure and improve the waterproof performance of a MEMS chip.

[0005] In order to solve the above technical problems, the embodiments of the present invention disclose the following technical solutions:

[0006] In a first aspect, a method for manufacturing a waterproof and breathable structure is provided, comprising:

[0007] providing a substrate;

[0008] Etching a surface of one side of the substrate to form a plurality of columnar protrusions on one side of the substrate, wherein grooves are provided between adjacent columnar protrusions, and adjacent grooves are interconnected;

[0009] Manufacturing a metal structure, wherein the metal structure is filled in the grooves, and the metal structures in the interconnected grooves are connected;

[0010] Making a cavity, wherein the cavity passes through the middle of the substrate, wherein in the thickness direction of the substrate, the columnar protrusion located within the projection range of the cavity is etched, and the metal structure located within the projection range of the cavity is exposed;

[0011] Making a hydrophobic film layer, wherein the hydrophobic film layer at least covers the exposed surface of the metal structure;

[0012] The metal structures exposed in the cavity together form a mesh structure.

[0013] In addition to or as an alternative to one or more of the features disclosed above, the substrate includes a support layer and an insulating layer, the support layer and the insulating layer are stacked along the thickness direction of the substrate, and the layer structure where the insulating layer is located is used to form the columnar protrusion.

[0014] In addition to or as an alternative to one or more of the features disclosed above, the columnar protrusion is a cylinder, and the diameter of the columnar protrusion is between 3.5 μm and 5 μm;

[0015] And / or, the columnar protrusion is a polygonal column, and the minimum distance between two opposite surfaces of the columnar protrusion is between 3.5 μm and 5 μm.

[0016] In addition to or as an alternative to one or more of the features disclosed above, a minimum spacing between adjacent columnar protrusions is between 0.5 μm and 1 μm.

[0017] In addition to or as an alternative to one or more of the features disclosed above, the etching of one side surface of the substrate to form a plurality of columnar protrusions on one side of the substrate, wherein grooves are provided between adjacent columnar protrusions, and adjacent grooves are interconnected, including:

[0018] Manufacturing a first photoresist structure, wherein the first photoresist structure covers a surface of one side of the substrate;

[0019] Etching the first photoresist structure so that a plurality of preset convex portions are formed on the first photoresist structure, preset grooves are provided between adjacent preset convex portions, adjacent preset grooves are interconnected, and a portion of the surface of the substrate is exposed in the preset grooves;

[0020] Etching the substrate in the preset groove along the thickness direction of the substrate to form the columnar protrusion and the groove on the substrate;

[0021] The first photoresist structure is removed.

[0022] In addition to one or more of the features disclosed above, or as an alternative, before the metal structure is made, the metal structure is filled in the groove, and the metal structures in the connected grooves are connected, the manufacturing method further includes:

[0023] A metal film layer is manufactured, wherein the metal film layer at least covers the inner wall of each of the grooves.

[0024] In addition to or as an alternative to one or more of the features disclosed above, a cavity is fabricated, the cavity passing through the middle of the substrate, wherein in the thickness direction of the substrate, the columnar protrusion located within the projection range of the cavity is etched, and the metal structure located within the projection range of the cavity is exposed, including:

[0025] Manufacturing a first auxiliary support structure, wherein the first auxiliary support structure covers a surface of the substrate having a metal structure and covers an exposed surface of the metal structure;

[0026] Manufacturing a second photoresist structure, wherein the second photoresist structure covers a surface of the substrate on a side away from the metal structure;

[0027] Making a preset cavity, wherein the preset cavity runs through the middle of the second photoresist structure, and a portion of the surface of the substrate is exposed in the preset cavity;

[0028] Etching the substrate in the preset cavity along the thickness direction of the substrate to form a cavity penetrating the middle portion of the substrate;

[0029] The second photoresist structure is removed.

[0030] In addition to or as an alternative to one or more of the features disclosed above, the metal structure is attached to the metal film layer by electroplating filling and is deposited in the trench.

[0031] In a second aspect, a waterproof and breathable structure is provided, comprising:

[0032] A substrate having a cavity extending through the thickness of the substrate;

[0033] A plurality of metal structures, wherein the plurality of metal structures are arranged at intervals and connected to each other, a portion of the metal structures are exposed in the cavity to form a mesh structure, and a portion of the metal structures are embedded in a surface of one side of the substrate;

[0034] A hydrophobic film layer at least covers the exposed surface of the metal structure.

[0035] In addition to or as an alternative to one or more of the features disclosed above, the substrate includes a support layer and an insulating layer, the support layer and the insulating layer are stacked along the thickness direction of the substrate, and the metal structure is embedded in the insulating layer.

[0036] In addition to or as an alternative to one or more of the features disclosed above, a metal film layer is further included, and the metal film layer covers a portion of the surface of the metal structure.

[0037] In a third aspect, a packaging structure of a MEMS chip is provided, comprising: a packaging shell, a MEMS chip and the waterproof and breathable structure disclosed above, wherein the MEMS chip is arranged in the packaging shell, the packaging shell is provided with a vent hole, and the waterproof and breathable structure is installed at the vent hole.

[0038] One of the above technical solutions has the following advantages or beneficial effects: the present application makes a metal structure in the groove of the substrate so that the metal structure can be embedded in the groove, and the adjacent metal structures can also be connected to each other. After removing the columnar protrusion, part of the metal structure can form a mesh structure. The metal mesh structure can prevent liquid from penetrating through tiny pores by using its fine pore size and surface tension effect. Specifically, the surface tension forces water droplets to remain on the surface of the mesh without passing through the mesh. Compared with traditional flexible waterproof membranes or waterproof wire meshes, the metal mesh structure has higher mechanical strength, durability and corrosion resistance, and can maintain the mesh structure without deformation or damage under greater pressure and mechanical stress, thereby ensuring the continuity of waterproof performance. Moreover, through the process of etching and filling, the metal structure is accurately embedded in the groove in the substrate to ensure the consistency and precision of the structure. Since these processes can strictly control the thickness, mesh size and material distribution of each layer, it is ensured that the waterproof and breathable structure has consistent performance in different batches of products.

[0039] Embedding the metal mesh structure into the substrate instead of attaching it to the surface greatly reduces the direct impact of external pressure on the metal mesh, further improving the anti-deformation ability. The hydrophobic film layer covering the metal structure and the inner wall of the cavity provides additional waterproof protection. The hydrophobic film covers the surface of the metal structure, which can prevent liquid penetration without completely blocking air circulation, achieving a balance between waterproofness and breathability. Furthermore, the mesh structure formed by the metal structure exposed in the cavity maintains breathability while being waterproof. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0041] Figure 1 is a step diagram of a method for manufacturing a waterproof and breathable structure provided in an embodiment of the present application;

[0042] Figure 2-16 is a process diagram of a method for manufacturing a waterproof and breathable structure provided in an embodiment of the present application;

[0043] Figure 17-19 This is a schematic structural diagram of a substrate with a waterproof and breathable structure provided according to an embodiment of the present application;

[0044] Fig. 20Yes Figure 5 Top view of the .

[0045] Description of reference numerals:

[0046] 00, columnar protrusion; 01, groove;

[0047] 10. Substrate; 101. Support layer; 102. Insulation layer.

[0048] 20. first photoresist structure; 201. preset convex portion; 202. preset groove;

[0049] 30. Metal structure; 301. Metal film layer;

[0050] 40. Cavity;

[0051] 50. A first auxiliary support structure;

[0052] 60. Second photoresist structure; 601. Preset cavity

[0053] 70. Hydrophobic film layer;

[0054] 80. A second auxiliary support structure. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and beneficial effects of the present invention more clear, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described in this specification are only for explaining the present invention, not for limiting the present invention.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] The present invention discloses a method for manufacturing a waterproof and breathable structure. Figure 1 The manufacturing method of the waterproof and breathable structure comprises:

[0060] S100. Providing a substrate;

[0061] S200. Etching a surface of one side of the substrate to form a plurality of columnar protrusions on one side of the substrate, wherein grooves are provided between adjacent columnar protrusions, and adjacent grooves are interconnected;

[0062] S300. Manufacturing a metal structure, filling the metal structure in the groove, and connecting the metal structures in the interconnected grooves;

[0063] S400. A cavity is fabricated, the cavity passes through the middle of the substrate, wherein in the thickness direction of the substrate, the columnar protrusion located within the projection range of the cavity is etched, and the metal structure located within the projection range of the cavity is exposed, and the metal structure exposed in the cavity together forms a mesh structure;

[0064] S500. Making a hydrophobic film layer, wherein the hydrophobic film layer at least covers the exposed surface of the metal structure.

[0065] In step S100, the substrate 10 is provided as Figure 2 and Fig.17 Specifically, refer to Figure 2In some embodiments, the substrate 10 only includes the support layer 101, and the support layer 101 is a silicon structure, which can be single crystal silicon, polycrystalline silicon, or a stack of single crystal silicon and polycrystalline silicon. Fig.17 In some embodiments, the substrate 10 further includes an insulating layer 102, and the support layer 101 and the insulating layer 102 are stacked along the thickness direction of the substrate 10, wherein the support layer 101 is single crystal silicon or polycrystalline silicon or a stack of single crystal silicon and polycrystalline silicon, and the insulating layer 102 is silicon oxide. In some embodiments, the thickness of the substrate 10 is generally 30 μm-100 μm.

[0066] Refer to 5 and Fig. 20 , Fig. 20 for Figure 5 In step S200, a plurality of columnar protrusions 00 are formed on one side of the substrate 10 by etching a surface of one side of the substrate 10. There are grooves 01 between adjacent columnar protrusions 00, and adjacent grooves 01 are interconnected. Fig.19 , when the substrate 10 includes a supporting layer 101 and an insulating layer 102, step 200 etches a side surface of the substrate 10 where the insulating layer 102 is located, and the layer structure where the insulating layer 102 is located is used to form a columnar protrusion 00, and the etching depth is less than the thickness of the insulating layer 102. In some embodiments, the columnar protrusion 00 is a cylinder, and the diameter of the columnar protrusion 00 is between 3.5μm-5.0μm. In some embodiments, the columnar protrusion 00 is a polygonal column, and the minimum distance between the two opposite faces of the columnar protrusion 00 is between 3.5μm-5.0μm. In the drawings provided in the present application, the columnar protrusion 00 is illustrated as a cylinder. Furthermore, in some embodiments, the minimum spacing between adjacent columnar protrusions 00 is between 0.5μm-1.0μm (i.e., the minimum groove width of the groove 01).

[0067] Further, in some embodiments, the columnar protrusion 00 is manufactured on the substrate 10 by the following steps: Figure 3 First, a first photoresist structure 20 is formed so that the first photoresist structure 20 covers one side surface of the substrate 10; then, the first photoresist structure 20 is etched so that a plurality of preset convex portions 201 are formed on the first photoresist structure 20, and preset grooves 202 are provided between adjacent preset convex portions 201, and adjacent preset grooves 202 are interconnected, and a portion of the surface of the substrate 10 is exposed in the preset grooves 202; then, referring to Figure 4, along the thickness direction of the substrate 10, the substrate 10 is etched in the preset groove 202 to form a columnar protrusion 00 and a groove 01 on the substrate 10; finally, the first photoresist structure 20 is removed. By adjusting the size of the preset protrusion 201 and the preset groove 202, it is possible to ensure that consistent columnar protrusions 00 and grooves 01 are formed on the surface of the substrate 10, thereby ensuring that in mass production, the structure of each substrate 10 can maintain the same size and shape, thereby improving the consistency of the waterproof and breathable structure. At the same time, through the coverage of the first photoresist structure 20, the etching process only occurs in the preset groove 202 area, which can protect the non-etched area from being over-etched, and also reduces the etching time. Similarly, referring to Fig.18 and Fig.19 When the substrate 10 includes a support layer 101 and an insulating layer 102 , the columnar protrusion 00 and the groove 01 can also be manufactured by the above method.

[0068] Reference Figure 8 In step S300, a metal structure 30 is fabricated. The metal structure 30 is filled in the trench 01. The metal structures 30 in the interconnected trenches 01 are connected. In some embodiments, a metal film layer 301 is fabricated before fabricating the metal structure 30. Figure 6 The metal film layer 301 at least covers the inner wall of each groove 01. Specifically, the metal film layer 301 can be prepared by physical vapor deposition (PVD). During the preparation process, the metal material evaporates in the form of a solid and is deposited on the inner wall of the groove 01 to form a thin film. Figure 8 After the metal film layer 301 is manufactured, the metal material can be attached to the metal film layer 301 and deposited in the groove 01 by electroplating filling. Figure 7 In practical applications, the metal film layer 301 may not only cover the inner wall of the groove 01, but also cover the surface of the substrate 10 and the surface of the columnar protrusion 00. Therefore, when manufacturing the metal structure 30, the following may occur: Figure 7The situation shown is that part of the metal material is attached to the surface of the substrate 10 and the surface of the columnar protrusion 00. In this case, it is necessary to remove the metal material on the surface of the substrate 10 and the surface of the columnar protrusion 00 through an etching process or a chemical mechanical polishing process. Further, in order to prevent the metal material from adhering to the surface of the substrate 10 and the surface of the columnar protrusion 00, in some embodiments, the metal structure 30 is manufactured by a BottomUp electroplating process. The BottomUp electroplating process can deposit the metal material from the bottom of the groove 01, so that the metal material gradually fills the entire groove 01, rather than starting electroplating from the surface of the substrate 10. At the same time, the metal material can preferably be copper metal. Copper metal has good chemical stability, and can also prevent the metal material from adhering to the surface of the substrate 10 during the electroplating process. At the same time, copper metal has sufficient mechanical strength and ductility, and the stability and anti-deformation property of the waterproof and breathable structure formed by copper metal are also better.

[0069] Reference Fig.16 In step S400, a cavity 40 is made, and the cavity 40 passes through the middle of the substrate 10. In the thickness direction of the substrate 10, the columnar protrusion 00 located within the projection range of the cavity 40 is etched, and the metal structure 30 located within the projection range of the cavity 40 is exposed. Specifically, the cavity 40 can be made by the following steps, referring to Fig. 9 First, a first auxiliary support structure 50 is manufactured. The first auxiliary support structure 50 covers the surface of the substrate 10 having the metal structure 30 and the exposed surface of the metal structure 30. Fig.10 In some embodiments, after the first auxiliary support structure 50 is fabricated, the substrate 10 is thinned so that the substrate 10 can be subsequently etched to form the cavity 40. The substrate 10 can usually be thinned to about 65 μm. The thinned substrate 10 is usually subjected to chemical mechanical polishing to eliminate damage stress. Fig.11 After the first auxiliary support structure 50 is fabricated, a second photoresist structure 60 is usually fabricated on the side of the substrate 10 away from the metal structure 30. The second photoresist structure 60 covers the surface of the side of the substrate 10 away from the metal structure 30, and a preset cavity 601 is photoetched in the middle of the second photoresist structure 60. Part of the surface of the substrate 10 is exposed in the preset cavity 601. Fig.12 Finally, the substrate 10 is etched in the preset cavity 601 along the thickness direction of the substrate 10 to form a cavity 40 that passes through the middle of the substrate 10, so that the columnar protrusion 00 located within the projection range of the cavity 40 is etched, and the metal structure 30 located within the projection range of the cavity 40 is exposed. After the cavity 40 is formed, the second photoresist structure 60 is removed.

[0070] Specifically, the cavity 40 is opened from the side of the substrate 10 away from the metal structure 30, and the first auxiliary support structure 50 is set on the side of the substrate 10 with the metal structure 30, which can protect the metal structure 30 and prevent the metal structure 30 from being locally deformed or warped during the subsequent process of opening the cavity 40 on the substrate 10. Further, in some embodiments, the first auxiliary support structure 50 can be a stacked glass substrate and a UV bonding film, or a stacked glass substrate and a laser debonding film. Specifically, the UV bonding film or the laser debonding film is between the glass substrate and the substrate 10. The glass substrate as the first auxiliary support structure 50 can provide good mechanical support and effectively resist external mechanical stress and deformation. The UV bonding film has a strong adhesive force formed by chemical reaction after ultraviolet light irradiation, can achieve precise alignment and bonding at a lower temperature, and provide a long-lasting and uniform bonding effect, ensuring that in the subsequent processing steps, the bonding surface of the glass substrate and the substrate 10 remains stable and will not separate. Laser debonding can precisely control the debonding process of the film layer by laser irradiation, so that the glass substrate can be easily and non-destructively separated from the substrate 10 after processing. This process avoids the stress and damage that may be caused by mechanical peeling, thereby maintaining the integrity of the substrate 10 and the metal structure 30.

[0071] Further, in some embodiments, etching the substrate 10 in the preset cavity 601 along the thickness direction of the substrate 10 to form a cavity 40 that penetrates the middle of the substrate 10 is performed in two steps. First, the substrate 10 is etched in the preset cavity 601 along the thickness direction of the substrate 10 by inductively coupled plasma dry etching (ICP dry etching) to form a back cavity, and the cavity bottom of the back cavity is about 15 μm away from the side surface of the substrate 10 with the metal structure 30. Then, the substrate 10 is further etched by wet etching to form a cavity 40 that penetrates the substrate 10, so that part of the metal structure 30 is exposed. The use of a double etching process can take advantage of the high precision of dry etching and the mildness and efficiency of wet etching to provide a more accurate and reliable processing process. It helps to improve etching efficiency, protect the embedded metal mesh structure, optimize surface quality, and reduce the influence of stress and damage, which helps to improve the processing consistency of the waterproof and breathable structure.

[0072] Reference Fig.16 In step S500, a hydrophobic film layer 70 is formed, and the hydrophobic film layer 70 at least covers the exposed surface of the metal structure 30. Figure 13-Figure 16When making the hydrophobic film layer 70, a second auxiliary support structure 80 is first made on the side of the substrate 10 away from the metal structure 30. The second auxiliary support structure 80 covers the surface of one side of the substrate 10 and closes the cavity 40. After the second auxiliary support structure 80 is made, the first auxiliary support structure 50 is removed, and then the hydrophobic film layer 70 is plated on the exposed surface of the metal structure 30. After the hydrophobic film layer 70 is plated, the second auxiliary support structure 80 is removed. Specifically, in some embodiments, the hydrophobic film layer 70 is also plated on the exposed surface of the substrate 10 (including the inner wall of the cavity 40). Specifically, the second auxiliary support structure 80 can be a UV film, and the hydrophobic film layer 70 can be a SAM coating (FDTS (perfluorodecyltrichlorosilane) material) or a Teflon (polytetrafluoroethylene coating) coating.

[0073] The present invention also discloses a waterproof and breathable structure. Fig.16 The invention comprises: a substrate 10, a plurality of metal structures 30 and a hydrophobic film layer 70. The substrate 10 has a cavity 40 that penetrates the thickness of the substrate 10. The plurality of metal structures 30 are arranged at intervals and connected to each other, and some of the metal structures 30 are exposed in the cavity 40 to form a mesh structure, and some of the metal structures 30 are embedded in one side surface of the substrate 10. The hydrophobic film layer 70 covers at least one side surface of the substrate 10 having the metal structure 30, the inner wall of the cavity 40 and the exposed surface of the metal structure 30.

[0074] Reference Fig.19 In some embodiments, the substrate 10 includes a support layer 101 and an insulating layer 102 , the support layer 101 and the insulating layer 102 are stacked along the thickness direction of the substrate 10 , and the metal structure 30 is embedded in the insulating layer 102 .

[0075] In some embodiments, the waterproof and breathable structure further includes a metal film layer 301 , and the metal film layer 301 covers a portion of the surface of the metal structure 30 .

[0076] The embodiment of the present invention further discloses a packaging structure of a MEMS chip, comprising: a packaging shell, a MEMS chip and the above disclosed waterproof and breathable structure, wherein the MEMS chip is arranged in the packaging shell, the packaging shell is provided with a vent hole, and the waterproof and breathable structure is installed at the vent hole.

[0077] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for manufacturing a waterproof and breathable structure, characterized in that: include: providing a substrate; Etching a surface of one side of the substrate to form a plurality of columnar protrusions on one side of the substrate, wherein grooves are provided between adjacent columnar protrusions, and adjacent grooves are interconnected; Manufacturing a metal structure, wherein the metal structure is filled in the grooves, and the metal structures in the interconnected grooves are connected; Making a cavity, wherein the cavity passes through the middle of the substrate, wherein in the thickness direction of the substrate, the columnar protrusion located within the projection range of the cavity is etched, and the metal structure located within the projection range of the cavity is exposed; Making a hydrophobic film layer, wherein the hydrophobic film layer at least covers the exposed surface of the metal structure; The metal structures exposed in the cavity together form a mesh structure.

2. The method for manufacturing a waterproof and breathable structure according to claim 1, characterized in that: The substrate comprises a supporting layer and an insulating layer, wherein the supporting layer and the insulating layer are stacked along a thickness direction of the substrate, and the layer structure where the insulating layer is located is used to form the columnar protrusion.

3. The method for manufacturing a waterproof and breathable structure according to claim 1, characterized in that: The columnar protrusion is a cylinder, and the diameter of the columnar protrusion is between 3.5 μm and 5 μm; And / or, the columnar protrusion is a polygonal column, and the minimum distance between two opposite surfaces of the columnar protrusion is between 3.5 μm and 5 μm.

4. The method for manufacturing a waterproof and breathable structure according to claim 1, characterized in that: The minimum distance between adjacent columnar protrusions is between 0.5 μm and 1 μm.

5. The method for manufacturing a waterproof and breathable structure according to claim 1, characterized in that: The etching of one side surface of the substrate to form a plurality of columnar protrusions on one side of the substrate, wherein grooves are provided between adjacent columnar protrusions, and adjacent grooves are connected to each other, comprises: Manufacturing a first photoresist structure, wherein the first photoresist structure covers a surface of one side of the substrate; Etching the first photoresist structure so that a plurality of preset convex portions are formed on the first photoresist structure, preset grooves are provided between adjacent preset convex portions, adjacent preset grooves are interconnected, and a portion of the surface of the substrate is exposed in the preset grooves; Etching the substrate in the preset groove along the thickness direction of the substrate to form the columnar protrusion and the groove on the substrate; The first photoresist structure is removed.

6. The method for manufacturing a waterproof and breathable structure according to claim 1, characterized in that: Before the metal structure is manufactured, the metal structure is filled in the groove, and the metal structures in the interconnected grooves are connected, the manufacturing method further includes: A metal film layer is manufactured, wherein the metal film layer at least covers the inner wall of each of the grooves.

7. The method for manufacturing a waterproof and breathable structure according to claim 1, characterized in that: A cavity is manufactured, wherein the cavity passes through the middle of the substrate, wherein in the thickness direction of the substrate, the columnar protrusion located within the projection range of the cavity is etched, and the metal structure located within the projection range of the cavity is exposed, including: Manufacturing a first auxiliary support structure, wherein the first auxiliary support structure covers a surface of the substrate having a metal structure and covers an exposed surface of the metal structure; Manufacturing a second photoresist structure, wherein the second photoresist structure covers a surface of the substrate on a side away from the metal structure; Making a preset cavity, wherein the preset cavity runs through the middle of the second photoresist structure, and a portion of the surface of the substrate is exposed in the preset cavity; Etching the substrate in the preset cavity along the thickness direction of the substrate to form a cavity penetrating the middle portion of the substrate; The second photoresist structure is removed.

8. The method for manufacturing a waterproof and breathable structure according to claim 6, characterized in that: The metal structure is attached to the metal film layer by electroplating filling and is deposited in the groove.

9. A waterproof and breathable structure, characterized in that: include: A substrate (10), wherein the substrate (10) has a cavity (40) that passes through the thickness of the substrate (10); A plurality of metal structures (30), the plurality of metal structures (30) are arranged at intervals and connected to each other, a portion of the metal structures (30) is exposed in the cavity (40) to form a mesh structure, and a portion of the metal structures (30) is embedded in a side surface of the substrate (10); A hydrophobic film layer (70), the hydrophobic film layer (70) at least covering the exposed surface of the metal structure (30); The mesh structure formed by the metal structure (30) utilizes its fine pore size and surface tension effect to prevent liquid from penetrating into the interior of the MEMS chip through tiny pores.

10. The waterproof breathable structure according to claim 9, characterized in that: The substrate (10) comprises a supporting layer (101) and an insulating layer (102), wherein the supporting layer (101) and the insulating layer (102) are stacked along the thickness direction of the substrate (10), and the metal structure (30) is embedded in the insulating layer (102).

11. The waterproof breathable structure according to claim 9, characterized in that: It also includes a metal film layer (301), wherein the metal film layer (301) covers a portion of the surface of the metal structure (30).

12. A packaging structure of a MEMS chip, characterized in that: include: A packaging shell, a MEMS chip, and a waterproof and breathable structure as described in any one of claims 9 to 11, wherein the MEMS chip is arranged in the packaging shell, the packaging shell is provided with a vent hole, and the waterproof and breathable structure is installed at the vent hole.

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