IGBT packaging structure and packaging method

Abstract

The present invention relates to the technical field of packaging structures, and specifically to an IGBT packaging structure and a packaging method. An IGBT packaging structure includes a packaging shell and a vibration damping component. The packaging shell has an upper base plate and a lower base plate. A plurality of limiters are arranged between the upper base plate and the lower base plate at equal intervals along the edge direction thereof. Each of the limiters is used to limit the packaging position of an IGBT module. Each of the limiters is also provided with a vibration damping component connected to the corresponding IGBT module. A heat dissipation component is also provided in the packaging shell. In the present invention, the heat dissipation component is integrated into the packaging structure and is in close contact with the vibration damping component, so that after heat is generated from the IGBT module, it is first transferred to the vibration damping component directly connected thereto, and then the heat continues to flow to the heat dissipation component through the thermal conductivity characteristics of the vibration damping component, thereby ensuring that the heat can be efficiently transferred and improving the overall energy conversion efficiency and service life.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging structures, and in particular to an IGBT packaging structure and an IGBT packaging method. Background Art

[0002] Most of the existing IGBT module packaging structures are embedded in the shell and then directly encapsulated by glue pouring inside the shell. During the packaging process, a cover plate is added after glue pouring for sealing. Such a packaging method will reduce the heat dissipation efficiency of the IGBT module. The direct glue pouring packaging method increases the weight of the device, which is difficult to meet the use requirements in some occasions with high weight requirements.

[0003] The currently disclosed Chinese patent CN116884935A discloses an IGBT module heat dissipation device and a packaging structure, including a packaging shell, a connection terminal and a bottom plate, the packaging shell is symmetrically provided with bolt holes for fixing, the side wall of the packaging shell is provided with a side wall groove for auxiliary heat dissipation, the packaging shell is evenly provided with a number of connection ports for wiring, the packaging shell is provided with a connection terminal, the bottom of the packaging shell is embedded with a bottom plate, and also includes a first limiting component, the bottom of the packaging shell is provided with the first limiting component; the first limiting component includes an N-type push plate, a first fixing column, a second fixing column, a blocking plate and a toggle plate, the bottom of the packaging shell is slidably connected to the N-type push plate, and the bottom plate is symmetrically rotated. The first fixed column is movably connected, the blocking plate is fixed on the first fixed column, the toggle plate is obliquely fixed on the first fixed column, the second fixed column is symmetrically fixed on the N-type push plate, the toggle plate is slidably connected to the second fixed column, and also includes a clamping component, and the clamping component is arranged at the bottom of the packaging shell; the clamping component includes a fixed frame, a hook plate and a spring, the fixed frame is fixed to the bottom of the packaging shell, the hook plate is slidably connected to the fixed frame, the hook plate and the N-type push plate are in mating contact, a spring is arranged between the hook plate and the fixed frame, and also includes a heat dissipation component, and the heat dissipation component is arranged on the side wall groove of the packaging shell; the heat dissipation component includes a fixed outer frame and a hair dryer, the fixed outer frame is fixed to the side wall groove of the packaging shell, and the hair dryer is installed on the fixed outer frame.

[0004] According to the above patent, the above patent reduces the thickness of the packaging shell by opening a sidewall groove on the side of the packaging shell, and further improves the heat conduction efficiency of the packaging shell. At the same time, the IGBT module is sealed through the bottom plate, so that the IGBT module can be firmly fixed in the packaging shell. The process does not require glue pouring, which can further reduce the weight of the device. In addition, the heat dissipation efficiency of the packaging shell can be further improved by setting a heat dissipation component on the sidewall groove, so that the heat dissipation effect is further improved. However, although this method has a heat dissipation effect, the design of the sidewall groove may weaken the overall mechanical strength of the packaging shell, especially when subjected to external force impact or high vibration environment, it may increase the risk of deformation or damage of the shell, thereby resulting in a weakened heat dissipation effect. Therefore, there is a need for a packaging structure that can improve the heat dissipation effect while ensuring that the IGBT packaging has a vibration reduction effect. Summary of the invention

[0005] In view of the problems existing in the prior art, an IGBT packaging structure is provided. In the present invention, a heat dissipation component is integrated into the packaging structure and is in close contact with a vibration reduction component, so that after heat is generated from the IGBT module, it is first transferred to the vibration reduction component directly connected thereto, and then the heat continues to flow to the heat dissipation component through the thermal conduction characteristics of the vibration reduction component, thereby ensuring efficient heat transfer and improving the overall energy conversion efficiency and service life.

[0006] To solve the problems of the prior art, the present invention provides an IGBT packaging structure, comprising a packaging shell and a vibration reduction component arranged therein for reducing vibration of the IGBT module, the packaging shell having an upper base plate and a lower base plate, the vibration reduction component being arranged between the upper base plate and the lower base plate, a plurality of limit members being arranged between the upper base plate and the lower base plate at equal intervals along the edge direction thereof, each of the limit members being used to limit the packaging position of an IGBT module, each of the limit members being also provided with a vibration reduction component connected to the corresponding IGBT module, a heat dissipation component for dissipating heat from the IGBT module being further provided in the packaging shell, the heat dissipation component being contact-connected to the vibration reduction component, and when the IGBT module is packaged, the IGBT module conducts heat to the vibration reduction component, thereby indirectly conducting heat to the heat dissipation component, so that the IGBT module can obtain effective heat dissipation while having a vibration reduction effect.

[0007] Preferably, the packaging shell also has a sleeve frame surrounding the upper base plate and the lower base plate, and a plurality of ventilation holes are provided on both sides of the sleeve frame. Filter plates for filtering air are provided on both sides of the sleeve frame facing the ventilation holes, and the sleeve frame is provided with slots for the two ends of the filter plate to be inserted therein, and the filter plate is detachably connected thereto through the slots on the sleeve frame.

[0008] Preferably, the limiting member is a guide rod structure with two ends passing through the upper base plate and the lower base plate, the IGBT module has a through opening detachably mounted on the limiting member, and the upper and lower surfaces of the IGBT module are provided with the vibration reduction assembly.

[0009] Preferably, the vibration damping assembly includes a thermally conductive layer bonded to the surface of the IGBT module, and a metal pressure plate bonded to the surface of the thermally conductive layer, the thermally conductive layer and the metal pressure plate both have openings for the limiter to pass through, the metal pressure plate is an elastic structure, and both ends of the metal pressure plate are provided with connecting parts to provide support for it.

[0010] Preferably, the connecting member is an axial rod structure, and a support block for fixing a pair of connecting members therein is fixedly provided between the upper base plate and the lower base plate, the axial direction of the connecting member is perpendicular to the axial direction of the limiting member, and the end of the metal pressure plate has an elastic clip extending toward the direction of the connecting member and wrapped thereon, and the elastic clips at both ends of the metal pressure plate can press the thermal conductive layer in cooperation with the corresponding connecting member, and the IGBT module is pressed between the two metal pressure plates.

[0011] Preferably, the vibration reduction assembly further comprises a vibration reduction spring sleeved on the limiter, wherein two ends of the vibration reduction spring are respectively fixedly connected to the limiter and the metal pressure plate, and the vibration reduction spring is combined with the metal pressure plate to achieve vibration reduction effect on the IGBT module.

[0012] Preferably, the surface of each metal pressure plate is provided with the heat dissipation component, and the heat dissipation component includes a heat dissipation layer adhered to the surface of the metal pressure plate, and a heat exchange tube in contact with the heat dissipation layer, the metal pressure plate is clamped between the heat dissipation layer and the heat conductive layer, the heat exchange tube has a water inlet end and a water outlet end which vertically pass through the corresponding upper base plate or lower base plate, and elastic pressure parts are provided between the water inlet end and the water outlet end of the heat exchange tube and the corresponding upper base plate or lower base plate, and the elastic pressure parts are used to keep the heat exchange tube in close contact with the heat dissipation layer.

[0013] Preferably, the surface of the heat dissipation layer has grooves for the heat exchange tubes to be embedded therein, and the portion where the heat exchange tubes are in contact with the heat dissipation layer is in a meandering shape along the edge direction of the heat dissipation layer.

[0014] Preferably, the elastic pressure member has a pressure spring sleeved on the corresponding water inlet end or water outlet end of the heat exchange tube, and the upper base plate and the lower base plate are fixedly provided with sealing gaskets sleeved thereon at the water inlet end and water outlet end corresponding to each heat exchange tube, and the water inlet end and water outlet end of each heat exchange tube are provided with a pipe joint, and the pressure spring is fixedly connected between the corresponding sealing gasket and the pipe joint.

[0015] The present invention also provides an IGBT packaging method, comprising the following steps:

[0016] S1. Place the IGBT module at the position defined by the limiter;

[0017] S2. Assemble the vibration reduction assembly on the limiter;

[0018] S3. Embed the heat dissipation component between the upper base plate and the lower base plate to ensure close contact with the vibration reduction component and establish a heat conduction path from the vibration reduction component to the heat dissipation component of the IGBT module;

[0019] S4. Install the filter plate on the side of the corresponding ventilation hole of the casing, and encapsulate the casing between the upper bottom plate and the lower bottom plate.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention not only enhances the integrity of the packaging structure through the combination of the sleeve frame and the filter plate, but also realizes the effective protection and management of the internal environment. The coordinated use of the ventilation holes and the filter plate ensures the air circulation required for heat dissipation, while isolating pollutants, creating a cool and clean operating environment, improving the stability and long-term reliability of the IGBT module and the entire packaging structure, reducing the failure rate caused by environmental factors, extending the service life of the product, and optimizing its working performance in harsh environments such as dusty and humid environments.

[0022] 2. The present invention not only strengthens the protection measures for the IGBT module by using a vibration-damping spring in combination with a metal pressure plate, but also improves the vibration resistance and stability of the IGBT module. Even under extreme temperature changes or high-intensity vibration environments, the correct position and functional integrity of the IGBT module can be guaranteed. The uniform pressure of the metal pressure plate on the thermal conductive layer promotes more efficient heat transfer from the IGBT module to the metal pressure plate, thereby transferring the heat to the heat dissipation component through the metal pressure plate, which helps to improve the heat dissipation efficiency and extend the service life of the IGBT module.

[0023] 3. The present invention greatly increases the contact area with the heat dissipation layer through the design of the winding heat exchange tube, and ensures that the contact between the heat exchange tube and the heat dissipation layer remains tight and gapless through the elastic pressure piece, thereby maximizing the heat exchange efficiency, thereby accelerating the heat transfer process, improving the overall heat dissipation performance, and facilitating the operation of the IGBT module within a safe temperature range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional structural schematic diagram of an IGBT packaging structure.

[0025] Figure 2 It is a schematic diagram of the three-dimensional structural decomposition of an IGBT packaging structure.

[0026] Figure 3 It is a partial plan cross-sectional view of an IGBT packaging structure.

[0027] Figure 4 It is a partial three-dimensional structural cross-sectional view of an IGBT packaging structure.

[0028] Figure 5 yes Figure 3 A cross-sectional view of the three-dimensional structure at AA.

[0029] Figure 6 yes Figure 3 An enlarged schematic diagram of point B.

[0030] Figure 7 The invention is a three-dimensional structural diagram of an upper base plate, a lower base plate, a vibration reduction component and a heat dissipation component of an IGBT packaging structure.

[0031] Figure 8 The diagram is a left view of an upper base plate, a lower base plate, a vibration reduction assembly and a heat dissipation assembly of an IGBT packaging structure.

[0032] Fig. 9 yes Figure 8 Cross-sectional view of the three-dimensional structure at CC.

[0033] Fig.10 yes Fig. 9 An enlarged schematic diagram of point D.

[0034] The numbers in the figure are: 1-packaging shell; 11-upper base plate; 12-lower base plate; 13-limiting member; 14-sleeve frame; 141-ventilation hole; 142-filter plate; 2-IGBT module; 3-vibration damping assembly; 31-heat conductive layer; 32-metal pressure plate; 321-elastic clip; 322-vibration damping spring; 33-connecting member; 331-support block; 4-heat dissipation assembly; 41-heat dissipation layer; 42-heat exchange tube; 421-water inlet end; 422-water outlet end; 43-elastic pressure member; 431-pressure spring; 432-sealing gasket; 433-pipe joint. DETAILED DESCRIPTION

[0035] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0036] See also Figure 1-Figure 5As shown, an IGBT packaging structure includes a packaging shell 1 and a vibration reduction component 3 arranged therein for reducing vibration of an IGBT module 2. The packaging shell 1 has an upper base plate 11 and a lower base plate 12. The vibration reduction component 3 is arranged between the upper base plate 11 and the lower base plate 12. A plurality of limit members 13 are arranged between the upper base plate 11 and the lower base plate 12 at equal intervals along the edge direction thereof. Each of the limit members 13 is used to limit the packaging position of an IGBT module 2. Each of the limit members 13 is also provided with a vibration reduction component 3 connected to the corresponding IGBT module 2. A heat dissipation component 4 for dissipating heat from the IGBT module 2 is also provided in the packaging shell 1. The heat dissipation component 4 is contact-connected with the vibration reduction component 3. When the IGBT module 2 is packaged, the IGBT module 2 transfers heat to the vibration reduction component 3, thereby indirectly transferring heat to the heat dissipation component 4, so that the IGBT module 2 can obtain effective heat dissipation while having a vibration reduction effect.

[0037] The package shell 1 is composed of an upper base plate 11 and a lower base plate 12, which are precisely assembled to form a stable shell structure. On this basis, a plurality of limiters 13 arranged at equal intervals along the edge not only define the precise packaging position of each IGBT module 2, but are also directly connected to the IGBT module 2 through a vibration reduction component 3, aiming to absorb external vibration and protect it from mechanical stress damage. When the IGBT module 2 is installed, each IGBT module 2 is connected to the vibration reduction component 3 on its corresponding limiter 13. These vibration reduction components 3 adopt an elastic structure, which can effectively absorb and disperse the vibration energy transmitted from the outside, maintain the stable operation of the IGBT module 2 in a high-frequency vibration environment, extend the service life, and at the same time, the heat dissipation component Component 4 is integrated into the packaging shell 1 and is in close contact with the vibration reduction component 3, which means that after the heat is generated from the IGBT module 2, it is first transferred to the vibration reduction component 3 directly connected to it, and then the heat continues to flow to the heat dissipation component 4 through the thermal conductivity of the vibration reduction component 3. This indirect heat transfer method ensures that the heat can be transferred efficiently, while maintaining the mechanical isolation between the IGBT module 2 and the heat dissipation path, avoiding thermal stress directly acting on the IGBT module 2 itself. The heat dissipation component 4 quickly dissipates the accumulated heat to the external environment, which not only ensures the temperature stability of the IGBT module 2 under high-power operation, but also effectively prevents performance degradation or damage caused by overheating, thereby improving the reliability and efficiency of the IGBT packaging structure.

[0038] See also Figure 1-Figure 5As shown, the packaging shell 1 also has a sleeve frame 14 surrounding the upper base plate 11 and the lower base plate 12, and a plurality of ventilation holes 141 are provided on both sides of the sleeve frame 14. Filter plates 142 for filtering air are provided on both sides of the sleeve frame 14 facing the ventilation holes 141. The sleeve frame 14 is provided with slots for the two ends of the filter plate 142 to be inserted therein, and the filter plate 142 is detachably connected therein through the slots on the sleeve frame 14.

[0039] When installing the sleeve frame 14, first, fix the sleeve frame 14 between the upper base plate 11 and the lower base plate 12 to ensure that the upper base plate 11 and the lower base plate 12 are sleeved therein, and the ventilation holes 141 are evenly distributed on both sides of the sleeve frame 14 to facilitate air circulation. Then, select the filter plate 142 designed to match the ventilation holes 141, and use the cooperation between the two ends of the filter plate 142 and the card slot to ensure that the filter plate 142 is firmly installed and easy to disassemble, so as to facilitate future cleaning or replacement to maintain good filtering performance. The main function of the filter plate 142 is to purify the air flowing through the ventilation holes 141, prevent external dust, moisture or other harmful particles from entering the interior of the packaging shell 1, and protect the IGBT module 2 and the internal circuit from pollution.

[0040] See also Figure 3-Figure 6 As shown, the limiter 13 is specifically a guide rod structure with two ends passing through the upper base plate 11 and the lower base plate 12. The IGBT module 2 has a through opening detachably mounted on the limiter 13. The upper and lower surfaces of the IGBT module 2 are both provided with the vibration reduction assembly 3.

[0041] The limiter 13 adopts a guide rod design with both ends passing through the upper base plate 11 and the lower base plate 12, ensuring the precise alignment and firm connection between the upper base plate 11 and the lower base plate 12. The IGBT module 2 has a special through hole, which can be just mounted on the limiter 13 to achieve precise positioning and quick installation of the IGBT module 2. The IGBT module 2 slides onto the limiter 13 through its through hole and is confined in the vibration reduction assembly 3 on the upper and lower surfaces. The vibration reduction assembly 3 equipped on the upper and lower surfaces of the IGBT module 2 is in direct contact with the IGBT module 2, absorbing external vibration energy, reducing the stress concentration of the IGBT module 2 caused by vibration, protecting the IGBT module 2 from damage, and achieving highly stable installation of the IGBT module 2 in the packaging structure, ensuring that the IGBT module 2 can maintain good electrical connection and thermal management performance even in a high-frequency vibration environment, greatly improving vibration resistance and long-term operation reliability.

[0042] See also Figure 3-Figure 6As shown, the vibration reduction assembly 3 includes a heat-conducting layer 31 bonded to the surface of the IGBT module 2, and a metal pressure plate 32 bonded to the surface of the heat-conducting layer 31, the heat-conducting layer 31 and the metal pressure plate 32 both have through-holes for the limiter 13 to pass through, the metal pressure plate 32 is an elastic structure, and both ends of the metal pressure plate 32 are provided with connecting parts 33 to provide support for it.

[0043] During the assembly process, the heat-conducting layer 31 is first accurately attached to the upper surface or the lower surface of the IGBT module 2, and then the metal pressing plate 32 with a perforation is covered on the surface of the heat-conducting layer 31 to ensure that the two are completely fitted, and the perforations of the metal pressing plate 32 and the heat-conducting layer 31 are aligned with the limiting piece 13, and the IGBT module 2, the heat-conducting layer 31 and the metal pressing plate 32 are positioned by the limiting piece 13. The two ends of the metal pressing plate 32 provide necessary elastic support through the connecting pieces 33, and also ensure the stability of the overall structure. As an elastic structure, the metal pressing plate 32 can effectively absorb the IGBT module 2 during operation. Or vibrations of various frequencies encountered during transportation, reducing the impact and potential damage of vibration on sensitive components inside the IGBT module 2. Even under conditions of continuous vibration, the IGBT module 2 can be well positioned and contact pressure is maintained, avoiding the problem of loose thermal contact caused by vibration. The addition of the thermal conductive layer 31 not only provides an additional heat dissipation path for the IGBT module 2, but also forms an efficient heat conduction path through close contact with the metal pressure plate 32, so that heat can be transferred from the IGBT module 2 to the heat dissipation component 4 more quickly, reducing thermal resistance and improving heat dissipation efficiency.

[0044] See also Figure 4-Figure 9 As shown, the connecting member 33 is specifically an axial rod structure, and a support block 331 for fixing a pair of connecting members 33 therein is fixedly provided between the upper base plate 11 and the lower base plate 12, and the axial direction of the connecting member 33 is perpendicular to the axial direction of the limiting member 13, and the end of the metal pressure plate 32 has an elastic clip 321 extending toward the direction of the connecting member 33 and wound thereon, and the elastic clips 321 at both ends of the metal pressure plate 32 can cooperate with the corresponding connecting member 33 to exert a pressing effect on the thermal conductive layer 31, and the IGBT module 2 is pressed between the two metal pressure plates 32.

[0045] A pair of support blocks 331 are pre-installed between the upper base plate 11 and the lower base plate 12. These support blocks 331 are used to fix the connecting piece 33 to ensure that the shaft structure of the connecting piece 33 can stand firmly therebetween. The two ends of the metal pressure plate 32 form elastic clips 321 extending toward the connecting piece 33 and being able to be wound thereon, so that the metal pressure plate 32 can not only be fastened to the connecting piece 33, but also provide the metal pressure plate 32 with a vibration reduction capability under the action of the elastic clips 321, ensuring that a uniform and appropriate clamping force is applied to the IGBT module 2. When the metal pressure plate 32 cooperates with the corresponding connecting piece 33 through the elastic clips 321 at its two ends, the metal pressure plate 32 will apply a pressure to the heat conducting layer 3 located therebetween. 1 applies pressure, thereby indirectly producing a balanced pressing effect on the upper and lower surfaces of the IGBT module 2, ensuring that the IGBT module 2 is firmly fixed in the entire packaging structure, reducing the displacement that may be caused by thermal expansion or mechanical vibration, thereby maintaining good thermal contact and electrical connection, and ensuring the correct position and functional integrity of the IGBT module 2 even in extreme temperature changes or high-intensity vibration environments. The uniform pressing of the metal pressing plate 32 on the heat-conducting layer 31 promotes more effective heat transfer from the IGBT module 2 to the metal pressing plate 32, thereby transferring the heat to the heat dissipation component 4 through the metal pressing plate 32, which helps to improve the heat dissipation efficiency and extend the service life of the IGBT module 2.

[0046] See also Figure 3-Figure 6 As shown, the vibration reduction assembly 3 also includes a vibration reduction spring 322 sleeved on the limit member 13, and the two ends of the vibration reduction spring 322 are respectively fixedly connected to the limit member 13 and the metal pressure plate 32, and the vibration reduction spring 322 is combined with the metal pressure plate 32 to achieve a vibration reduction effect on the IGBT module 2.

[0047] Through the cooperation between the vibration-damping spring 322 and the metal pressure plate 32, the mechanical stress on the IGBT module 2 is greatly reduced, effectively preventing chip cracks, solder joint detachment and other faults caused by vibration, and extending the service life and reliability of the IGBT module 2. The vibration-damping spring 322 not only reduces vibration, but also provides a dynamically adjusted clamping force between the IGBT module 2 and the metal pressure plate 32, which means that even under different working conditions, it can still automatically adjust to maintain appropriate pressure on the IGBT module 2, ensuring good thermal contact and not damaging the IGBT module 2 due to excessive pressure.

[0048] See also Figure 2 , Figure 8 , Fig. 9 and Fig.10As shown, the surface of each metal pressure plate 32 is provided with the heat dissipation component 4, and the heat dissipation component 4 includes a heat dissipation layer 41 bonded to the surface of the metal pressure plate 32, and a heat exchange tube 42 in contact with the heat dissipation layer 41. The metal pressure plate 32 is clamped between the heat dissipation layer 41 and the heat conductive layer 31. The heat exchange tube 42 has an inlet end 421 and a water outlet end 422 vertically passing through the corresponding upper base plate 11 or lower base plate 12. An elastic pressing member 43 is provided between the inlet end 421 and the water outlet end 422 of the heat exchange tube 42 and the corresponding upper base plate 11 or lower base plate 12. The elastic pressing member 43 is used to keep the heat exchange tube 42 in close contact with the heat dissipation layer 41.

[0049] Elastic pressing parts 43 are provided at the interfaces between the water inlet end 421 and the water outlet end 422 of the heat exchange tube 42 and the upper base plate 11 or the lower base plate 12. The function of these elastic pressing parts 43 is to ensure that the contact between the heat exchange tube 42 and the heat dissipation layer 41 remains tight and gapless, maximize the heat exchange efficiency, and avoid poor contact caused by vibration. When the IGBT module 2 generates heat during operation, the heat is first transferred to the metal pressure plate 32 through the heat conductive layer 31, and then quickly diffuses to the heat dissipation layer 41 on the surface of the metal pressure plate 32. The heat dissipation layer 41 then transfers the heat to the heat exchange tube 42 closely attached thereto, and coolant is introduced through the water inlet end 421 of the heat exchange tube 42. The coolant circulates inside the heat exchange tube 42, takes away the heat and is discharged through the water outlet end 422 of the heat exchange tube 42, and the water inlet end 421 is continuously replenished with low-temperature coolant to maintain a continuous heat exchange process.

[0050] See also Figure 2 , Figure 8 and Fig. 9 As shown, the surface of the heat dissipation layer 41 has a groove for the heat exchange tube 42 to be embedded therein, and the portion where the heat exchange tube 42 contacts the heat dissipation layer 41 is in a meandering shape along the edge direction of the heat dissipation layer 41 .

[0051] The surface of the heat dissipation layer 41 has grooves that match the shape of the heat exchange tube 42, allowing the heat exchange tube 42 to not only fit the surface of the heat dissipation layer 41, but also be embedded therein. The portion of the heat exchange tube 42 that contacts the heat dissipation layer 41 is meandering along the edge. Such a layout not only increases the surface area of ​​heat exchange, but also ensures a tighter and more continuous heat conduction path between the two. When the IGBT module 2 generates heat during operation, the heat is transferred to the metal pressure plate 32 through the heat conductive layer 31, and then quickly transported to the heat dissipation layer 41 by the metal pressure plate 32. When the coolant flows in the heat exchange tube 42, it takes away the heat in the heat dissipation layer 41, thereby improving the overall heat dissipation performance and helping to maintain the IGBT module 2 operating within a safe temperature range.

[0052] See also Figure 2 , Figure 8 , Fig. 9 and Fig.10As shown, the elastic pressure member 43 has a pressure spring 431 which is sleeved on the corresponding water inlet end 421 or water outlet end 422 of the heat exchange tube 42, and the upper base plate 11 and the lower base plate 12 are fixedly provided with a sealing gasket 432 sleeved thereon at the water inlet end 421 and the water outlet end 422 of each heat exchange tube 42, and each of the water inlet end 421 and the water outlet end 422 of the heat exchange tube 42 is provided with a pipe joint 433, and the pressure spring 431 is fixedly connected between the corresponding sealing gasket 432 and the pipe joint 433.

[0053] The pressure spring 431 is sleeved on the water inlet end 421 or the water outlet end 422 of the heat exchange tube 42. Its elastic characteristics apply a constant pressing force to the heat exchange tube 42, so that the heat exchange tube 42 remains in close contact with the heat dissipation layer 41. The sealing gasket 432 prevents external dust from entering the packaging shell 1. When the heat exchange tube 42 is activated, the water pump is connected to the water pump through the pipe joint 433 at the water inlet end 421 and the water outlet end 422 of the heat exchange tube 42. The water pump is not shown in the figure, so as to realize the flow of coolant inside the heat exchange tube 42 and ensure a continuous heat dissipation effect.

[0054] An IGBT packaging method, applied to an IGBT packaging structure, comprises the following steps:

[0055] S1, placing the IGBT module 2 at the position defined by the limiting member 13;

[0056] S2, assembling the vibration reduction assembly 3 on the limiting member 13;

[0057] S3, embed the heat dissipation component 4 between the upper base plate 11 and the lower base plate 12, ensure close contact with the vibration reduction component 3, and establish a heat conduction path from the vibration reduction component 3 to the heat dissipation component 4 of the IGBT module 2;

[0058] S4, installing the filter plate 142 on the side of the sleeve frame 14 corresponding to the ventilation hole 141, and encapsulating the sleeve frame 14 between the upper bottom plate 11 and the lower bottom plate 12.

[0059] The present invention integrates the heat dissipation component 4 into the packaging structure and is in close contact with the vibration reduction component 3, so that after the heat is generated from the IGBT module 2, it is first transferred to the vibration reduction component 3 directly connected thereto, and then the heat continues to flow to the heat dissipation component 4 through the thermal conductivity characteristics of the vibration reduction component 3, thereby ensuring that the heat can be efficiently transferred. At the same time, the mechanical isolation between the IGBT module 2 and the heat dissipation path is maintained to avoid thermal stress directly acting on the IGBT module 2 itself, which not only effectively absorbs external vibrations and protects the IGBT module 2 from mechanical damage, but also ensures rapid conduction and dissipation of heat to prevent overheating, thereby improving the overall energy conversion efficiency and service life.

[0060] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. An IGBT packaging structure, characterized in that: The invention comprises a packaging shell (1) and a vibration reduction component (3) arranged therein for reducing vibration of an IGBT module (2), the packaging shell (1) comprising an upper base plate (11) and a lower base plate (12), the vibration reduction component (3) being arranged between the upper base plate (11) and the lower base plate (12), a plurality of stoppers (13) being arranged between the upper base plate (11) and the lower base plate (12) at equal intervals along the edge direction of the packaging shell (1), each stopper (13) being used to limit the packaging position of an IGBT module (2), each stopper (13) being provided with a vibration reduction component (3) connected to a corresponding IGBT module (2), the packaging shell (1) being further provided with a heat dissipation component (4) for dissipating heat from the IGBT module (2), the heat dissipation component (4) being contact-connected to the vibration reduction component (3), and when the IGBT module (2) is packaged, the IGBT module (2) conducts heat to the vibration reduction component (3), thereby indirectly conducting heat to the heat dissipation component (4).

2. An IGBT packaging structure according to claim 1, characterized in that: The packaging shell (1) further comprises a sleeve frame (14) surrounding the upper bottom plate (11) and the lower bottom plate (12); a plurality of ventilation holes (141) are provided on both sides of the sleeve frame (14); filter plates (142) for filtering air are provided on both sides of the sleeve frame (14) facing the ventilation holes (141); the sleeve frame (14) comprises slots for receiving two ends of the filter plate (142); the filter plate (142) is detachably connected to the sleeve frame (14) via the slots on the sleeve frame (14).

3. An IGBT packaging structure according to claim 1, characterized in that: The limiting member (13) is specifically a guide rod structure with two ends penetrating the upper base plate (11) and the lower base plate (12); the IGBT module (2) has a through opening detachably sleeved on the limiting member (13); and the vibration reduction assembly (3) is provided on the upper surface and the lower surface of the IGBT module (2).

4. An IGBT packaging structure according to claim 3, characterized in that: The vibration reduction assembly (3) comprises a heat conducting layer (31) bonded to the surface of the IGBT module (2), and a metal pressing plate (32) bonded to the surface of the heat conducting layer (31), the heat conducting layer (31) and the metal pressing plate (32) both having a through hole for a limiter (13) to pass through, the metal pressing plate (32) being an elastic structure, and connecting pieces (33) for providing support therefor are provided at both ends of the metal pressing plate (32).

5. An IGBT packaging structure according to claim 4, characterized in that: The connecting piece (33) is a shaft structure, and a support block (331) for fixing a pair of connecting pieces (33) therein is fixedly provided between the upper base plate (11) and the lower base plate (12), the axial direction of the connecting piece (33) being perpendicular to the axial direction of the limiting piece (13), and the end of the metal pressure plate (32) having an elastic clip (321) extending in the direction of the connecting piece (33) and wound thereon, and the elastic clips (321) at both ends of the metal pressure plate (32) cooperate with the corresponding connecting piece (33) to press the heat conducting layer (31), and the IGBT module (2) is pressed between the two metal pressure plates (32).

6. The IGBT packaging structure according to claim 5, characterized in that: The vibration reduction assembly (3) further comprises a vibration reduction spring (322) sleeved on the limiting member (13), wherein two ends of the vibration reduction spring (322) are respectively fixedly connected to the limiting member (13) and the metal pressure plate (32).

7. An IGBT packaging structure according to claim 6, characterized in that: The surface of each metal pressing plate (32) is provided with the heat dissipation component (4), the heat dissipation component (4) comprising a heat dissipation layer (41) bonded to the surface of the metal pressing plate (32), and a heat exchange tube (42) in contact with the heat dissipation layer (41), the metal pressing plate (32) being clamped between the heat dissipation layer (41) and the heat conductive layer (31), the heat exchange tube (42) having a water inlet end (421) and a water outlet end (422) vertically passing through the corresponding upper bottom plate (11) or lower bottom plate (12), an elastic pressing member (43) being provided between the water inlet end (421) and the water outlet end (422) of the heat exchange tube (42) and the corresponding upper bottom plate (11) or lower bottom plate (12), the elastic pressing member (43) being used to maintain the heat exchange tube (42) in a state of close contact with the heat dissipation layer (41).

8. An IGBT packaging structure according to claim 7, characterized in that: The surface of the heat dissipation layer (41) has a groove for embedding the heat exchange tube (42) therein, and the portion where the heat exchange tube (42) contacts the heat dissipation layer (41) is in a meandering shape along the edge direction of the heat dissipation layer (41).

9. The IGBT packaging structure according to claim 7, characterized in that: The elastic pressure member (43) comprises a pressure spring (431) sleeved on the corresponding water inlet end (421) or water outlet end (422) of the heat exchange tube (42); the upper base plate (11) and the lower base plate (12) are both fixedly provided with sealing gaskets (432) sleeved thereon at the corresponding water inlet end (421) and water outlet end (422) of each heat exchange tube (42); the water inlet end (421) and water outlet end (422) of each heat exchange tube (42) are both provided with pipe joints (433); the pressure spring (431) is fixedly connected between the corresponding sealing gaskets (432) and the pipe joints (433).

10. An IGBT packaging method, applied to an IGBT packaging structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, placing the IGBT module (2) at a position defined by a limiting member (13); S2, assembling the vibration reduction assembly (3) on the limiting member (13); S3, embedding the heat dissipation component (4) between the upper base plate (11) and the lower base plate (12), ensuring close contact with the vibration reduction component (3), and establishing a heat conduction path from the vibration reduction component (3) to the heat dissipation component (4) of the IGBT module (2); S4. Install the filter plate (142) on the side of the sleeve frame (14) corresponding to the ventilation hole (141), and encapsulate the sleeve frame (14) between the upper bottom plate (11) and the lower bottom plate (12).

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