A production cutting process for wafers

Abstract

The present invention relates to the field of wafer production technology, and in particular to a production cutting process for wafers, comprising a mounting seat, and also comprising: a workbench, fixed to the top of the mounting seat by a supporting column, for placing a single crystal silicon rod to be cut and providing support during the cutting process; a cutting unit, for cutting the single crystal silicon rod placed on the workbench; during the cutting process, the cutting line first contacts the upper surface of the single crystal silicon rod, and the mounting frame moves downward to drive the spraying unit to move downward and contact the upper surface of the single crystal silicon rod. On the one hand, the spraying unit can limit the cutting trajectory of the cutting line so that the cutting line can stably cut into the single crystal silicon rod. On the other hand, the spraying unit gradually increases the speed of cutting fluid supply as the cutting depth of the cutting unit increases, so that the supply of cutting fluid to the cutting position is maintained when the cutting depth increases, which is conducive to improving the full contact between the cutting line and the cutting fluid.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and in particular to a production cutting process for wafers. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches (crystal rod diameter 300mm).

[0003] The prior art discloses some invention patents of single crystal silicon rod cutting machines. The Chinese invention patent with application number CN201810916253.1 discloses a single crystal silicon rod cutting machine with a wide range of applications, which includes a bottom plate, on which a No. 1 base, a No. 2 base, a rotating plate, a No. 3 base and a clamping plate are arranged; a diamond cutting wire is arranged above the No. 3 base, and a horizontal bar and a vertical bar are arranged on one side of the diamond cutting wire; a wire winding drum and a support are connected to the top of the diamond cutting wire; tensioning wheels, threaded rods C and bearings A are connected to both sides of the diamond cutting wire; a moving frame is connected to each bearing A; a motor D, a gear and a rack are arranged between the two moving frames; a guide wheel and a threaded rod D are arranged below each tensioning wheel; a conveyor belt is arranged below the diamond cutting wire; and a PLC controller is arranged on the vertical bar. The present invention not only makes the operation easier, improves the scope of application and improves efficiency, but also has the advantages of high intelligence, good structural stability and good mechanism flexibility.

[0004] In the process of cutting single crystal silicon rods, the existing method of adding cutting fluid is to spray it onto the surface of the single crystal silicon rod. Since the cutting line diameter is very small, the resulting cutting gap is very narrow. When the cutting depth is large, the cutting fluid is not easy to penetrate into the cutting position, resulting in insufficient cutting fluid at the cutting position, causing the cutting line to be easily damaged and the cutting to be uneven. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings in the prior art that the cutting gap is very narrow due to the small cutting line diameter, and when the cutting depth is large, the cutting fluid is not easy to penetrate into the cutting position, resulting in insufficient cutting fluid at the cutting position, causing the cutting line to be easily damaged and the cutting to be uneven. A production cutting process for wafers is proposed to solve the problems existing in the prior art.

[0006] The present invention provides a production cutting process for wafers, the cutting process comprising the following steps:

[0007] Step 1: Place the polished single crystal silicon rod of appropriate size on the workbench in the cutting device;

[0008] Step 2: Use the clamping part in the cutting device to clamp the single crystal silicon rod at the center of the workbench;

[0009] Step 3: Start the cutting unit in the cutting device to cut the clamped single crystal silicon rod into multiple slices, and start the spraying unit in the cutting device to spray cutting fluid to the cutting position;

[0010] Step 4: Collect the cut slices for subsequent processing;

[0011] Wherein, the cutting device described in step 1 to step 4 includes a mounting seat, and further includes:

[0012] A workbench, fixed to the top of the mounting seat through a support column, for placing the single crystal silicon rod to be cut and providing support during the cutting process;

[0013] A cutting unit, used for cutting the single crystal silicon rod placed on the workbench;

[0014] A clamping portion, installed on the top of the workbench, for positioning and clamping the single crystal silicon rod placed on the workbench, so that the single crystal silicon rod is aligned with the cutting unit after positioning;

[0015] The spraying unit is used to uniformly supply cutting fluid by limiting the trajectory of the cutting unit during the cutting process, and gradually increase the speed of cutting fluid supply as the cutting depth of the cutting unit increases, so as to maintain the cutting fluid supply at the cutting position when the cutting depth increases.

[0016] In a further embodiment, it also includes:

[0017] The shielding unit is used to shield both sides of the spraying unit so that when the cutting unit moves downward for cutting, both sides of the water outlet position at the bottom of the spraying unit are shielded to reduce the cutting fluid flowing out along the gap when the cutting unit moves downward.

[0018] In a further embodiment, it also includes:

[0019] A cleaning component, used to remove silicon dust adhering to the cutting unit, so as to reduce the interference of silicon dust adhering to the cutting of the cutting unit;

[0020] The scraping piece is used to scrape and collect the silicon dust on the cleaning component.

[0021] In a further embodiment, the spraying unit comprises:

[0022] A water outlet assembly, the water outlet assembly is connected to an external cutting fluid cylinder through a pipeline, so that the external cutting fluid cylinder transports cutting fluid to the inside of the water outlet assembly through active force;

[0023] The lifting and making way component is used to drive the water outlet component to make way and move vertically, so that the port of the water outlet component remains in contact with the upper surface of the single crystal silicon rod during the cutting process, making it easier for the cutting fluid to enter the interior of the cutting gap.

[0024] In a further embodiment, the water outlet assembly comprises:

[0025] The water outlet box is supported by vertical movement through the lifting and giving way assembly;

[0026] A flow channel is provided inside the water outlet box and is used to connect an external cutting fluid cylinder so that the cutting fluid is transported to the cutting gap through the flow channel;

[0027] A limiter is arranged at the bottom of the water outlet box body, and is used to limit the initial cutting trajectory of the cutting unit, reduce the initial cutting deviation of the cutting unit, so that the water outlet port of the water outlet box body is aligned with the cutting gap to increase the amount of cutting fluid entering.

[0028] In a further embodiment, the flow channel comprises:

[0029] A cavity is provided inside the water outlet box, the cavity is communicated with the pipeline, and is used for storing the cutting fluid entering through the pipeline;

[0030] A plurality of water outlets are provided, which are opened at the bottom of the water outlet box and communicated with the cavity, and are used to spray the cutting fluid into the corresponding cutting gap.

[0031] In a further embodiment, the shielding unit comprises:

[0032] Two side plates are provided, which are symmetrically slidably connected to the two sides of the water outlet box body, and are used to cover the openings on both sides of the limiter during the cutting process, so as to reduce the leakage of cutting fluid from the opening of the limiter during the cutting process of the cutting unit;

[0033] The telescopic member is used to elastically support the side plate vertically, so as to gradually support the side plate to move toward the limiting member during the movement and cutting process of the cutting unit.

[0034] In a further embodiment, it also includes:

[0035] A support member is provided corresponding to the side plate and is used to support the cut portion of the single crystal silicon rod, so that the cut portion of the single crystal silicon rod is supported to reduce the possibility of breakage;

[0036] The driving assembly is used to drive the supporting member to move downward to support the cut portion of the single crystal silicon rod after the cutting unit has cut more than half of the single crystal silicon rod.

[0037] In a further embodiment, it also includes:

[0038] The opening and closing component is used to control the speed at which the cutting fluid is discharged from the water outlet component to increase the output distance of the cutting fluid output from the water outlet component.

[0039] In a further embodiment, the clamping portion comprises:

[0040] There are four clamping plates, all of which are slidably connected to the top of the workbench, and the four clamping plates form a group of two;

[0041] A driving member is installed inside the workbench and is used to drive the two groups of clamping plates to move towards each other by the same distance, so that the two groups of clamping plates can clamp the single crystal silicon rod in the middle of the workbench.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. During the cutting process, the cutting line first contacts the upper surface of the single crystal silicon rod, and the mounting frame moves downward to drive the spray unit to move downward and contact the upper surface of the single crystal silicon rod. On the one hand, the spray unit can limit the cutting trajectory of the cutting line so that the cutting line can stably cut into the single crystal silicon rod. On the other hand, the spray unit gradually increases the speed of cutting fluid supply as the cutting depth of the cutting unit increases, so as to maintain the supply of cutting fluid at the cutting position when the cutting depth increases, which is conducive to improving the full contact between the cutting line and the cutting fluid.

[0044] 2. The provided limiting groove can limit the cutting track of the cutting line when the cutting line cuts the upper surface of the single crystal silicon rod, thereby reducing the sliding of the cutting line, so that the distance between adjacent cutting tracks is the same, which is beneficial to improve the thickness uniformity of the slices.

[0045] 3. The baffle, arc plate and water outlet box fix the slices from multiple angles, which is conducive to positioning the slices and preventing the end of the slice from breaking when the single crystal silicon rod is cut to the lower part. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 The figure is a flow chart of the cutting method of the cutting device of the present invention.

[0047] Figure 2 It is a first overall structural schematic diagram of the present invention.

[0048] Figure 3It is a second overall structural schematic diagram of the present invention.

[0049] Figure 4 It is a schematic diagram of the cleaning component structure of the present invention.

[0050] Figure 5 It is a plan cross-sectional view of a cleaning component of the present invention.

[0051] Figure 6 It is a schematic structural diagram of the first embodiment of the lifting assembly of the present invention.

[0052] Figure 7 It is a schematic structural diagram of a second embodiment of the lifting assembly of the present invention.

[0053] Figure 8 For the present invention Figure 6 A magnified view of the structure at center.

[0054] Fig. 9 It is a schematic diagram of the opening and closing component structure of the present invention.

[0055] Fig.10 It is a schematic diagram of the structure of the spray unit of the present invention.

[0056] Fig.11 For the present invention Fig.10 Enlarged view of the structure at C in the middle.

[0057] Fig.12 For the present invention Fig. 9 A magnified view of the structure at point B.

[0058] Fig.13 It is a schematic structural diagram of the clamping portion of the present invention.

[0059] Fig.14 For the present invention Fig.13 Enlarged view of the structure at D in the middle.

[0060] In the figure: 1. workbench; 2. water outlet box; 3. side plate; 4. mounting seat; 5. clamping plate; 6. mounting frame; 7. rotating roller; 8. cutting line; 9. driving motor; 10. first cylinder; 11. pipeline; 12. second cylinder; 13. first pressure sensor; 14. limiting groove; 15. water outlet; 16. chamber; 17. cross bar; 18. elastic telescopic rod; 19. arc plate; 20. baffle; 21. first motor; 22. first gear; 23. first rack; 24. second pressure sensor; 25. cross plate; 26. sliding plate; 27. third cylinder; 28. second motor; 29. ​​mounting groove; 30. second gear; 31. second rack; 32. rubber roller; 33. wire groove; 34. collecting box; 35. scraper; 36. electric push rod. DETAILED DESCRIPTION

[0061] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0062] like Figures 1 to 14 A production cutting process for wafers is shown, the cutting process comprising the following steps:

[0063] Step 1: placing the polished single crystal silicon rod of appropriate size on the workbench 1 in the cutting device;

[0064] Step 2: Use the clamping part in the cutting device to clamp the single crystal silicon rod at the center of the workbench 1;

[0065] Step 3: Start the cutting unit in the cutting device to cut the clamped single crystal silicon rod into multiple slices, and start the spraying unit in the cutting device to spray cutting fluid to the cutting position;

[0066] Step 4: Collect the cut slices for subsequent processing;

[0067] The cutting device in steps 1 to 4 includes a mounting base 4, and further includes:

[0068] The workbench 1 is fixed to the top of the mounting base 4 through a support column, and is used to place the single crystal silicon rod to be cut and provide support during the cutting process;

[0069] A cutting unit, used for cutting the single crystal silicon rod placed on the workbench 1;

[0070] A clamping part, installed on the top of the workbench 1, is used to position and clamp the single crystal silicon rod placed on the workbench 1, so that the single crystal silicon rod is aligned with the cutting unit after positioning;

[0071] A spraying unit is used to uniformly supply cutting fluid by limiting the trajectory of the cutting unit during the cutting process, and gradually increase the speed of supplying the cutting fluid as the cutting depth of the cutting unit increases, so as to maintain the supply of cutting fluid at the cutting position when the cutting depth increases;

[0072] In the specific implementation process, the cutting unit includes:

[0073] The mounting frame 6 is mounted on the top of the mounting seat 4 through a lifting assembly;

[0074] As an optional embodiment, Figure 2 and Figure 3 As shown, the cutting unit also includes:

[0075] There are three rotating rollers 7, all of which are rotatably connected to the side wall of the mounting frame 6;

[0076] A cutting wire 8 is wound in the slots formed on the three rotating rollers 7 and is used to cut the single crystal silicon rods;

[0077] A driving motor 9 is installed on one side of the mounting frame 6 and is used to drive the rotating roller 7 to rotate, so that the rotating roller 7 drives the cutting line 8 to move;

[0078] The lifting assembly includes two first cylinders 10, both of which are fixed to the top of the mounting seat 4, and both of which are fixedly connected to the mounting frame 6;

[0079] The principle of silicon wafer multi-wire cutting technology is to form a wire net by winding a cutting wire 8 on the main wire roller, and the cutting wire 8 cuts the single crystal silicon rod by high-speed reciprocating movement. It is a common cutting method of existing multi-wire cutting machines and will not be described in detail here.

[0080] Specifically, in the process of cutting the single crystal silicon rod, the existing cutting fluid is added in a manner of spraying it onto the surface of the single crystal silicon rod. Since the diameter of the cutting line 8 is very small, the resulting cutting gap is very narrow. When the cutting depth is large, the cutting fluid is not easy to penetrate into the cutting position, resulting in insufficient cutting fluid at the cutting position, causing the cutting line 8 to be easily damaged, and also easily causing uneven cutting. This embodiment of the present invention can solve the above problems. The specific implementation method is as follows. First, the staff places the polished single crystal silicon rod on the workbench 1, and then uses the clamping part to clamp the single crystal silicon rod in the center of the workbench 1. Then the staff starts the drive motor 9, and the drive motor 9 drives the rotating roller 7 to rotate, and the rotating roller 7 drives the cutting line 8 to move quickly. Then the staff The operator starts the first cylinder 10, and the two first cylinders 10 jointly drive the mounting frame 6 to move downward, so that the mounting frame 6 drives the cutting line 8 to move downward to cut the single crystal silicon rod. During the cutting process, the cutting line 8 first contacts the upper surface of the single crystal silicon rod, and the mounting frame 6 moves downward to drive the spraying unit to move downward to contact the upper surface of the single crystal silicon rod. On the one hand, the spraying unit can limit the cutting trajectory of the cutting line 8 so that the cutting line 8 can stably cut into the single crystal silicon rod. On the other hand, the spraying unit gradually increases the speed of the cutting fluid supply as the cutting depth of the cutting unit increases, so as to maintain the supply of cutting fluid at the cutting position when the cutting depth increases, which is conducive to improving the full contact between the cutting line 8 and the cutting fluid.

[0081] In the further implementation process, it also includes:

[0082] The shielding unit is used to shield the two sides of the spraying unit, so that when the cutting unit moves downward for cutting, the two sides of the water outlet position at the bottom of the spraying unit are shielded to reduce the cutting fluid from flowing out along the gap when the cutting unit moves downward;

[0083] Specifically, when the cutting unit and the spraying unit move downward, they drive the shielding unit to move downward synchronously. After the spraying unit moves downward to fit with the upper surface of the single crystal silicon rod, the spraying unit begins to maintain a fit state with the single crystal silicon rod. The cutting unit moves downward to drive the shielding unit to continue to move downward, while the spraying unit moves upward to make way, so that the shielding unit moves downward relative to the spraying unit to shield both sides of the water outlet end at the bottom of the spraying unit and the opening of the cutting gap to reduce the outflow of cutting fluid, thereby facilitating the cutting fluid to enter the cutting position and fully contact the cutting line 8.

[0084] In the further implementation process, it also includes:

[0085] A cleaning component is used to remove silicon dust adhering to the cutting unit to reduce the interference of silicon dust adhering to the cutting unit;

[0086] A scraping piece, used to scrape and collect silicon dust on the cleaning component;

[0087] In a specific implementation process, there are two cleaning components, which are symmetrically arranged on the side wall of the mounting frame 6. When the cutting line 8 reciprocates and cyclically moves to cut the single crystal silicon rod, the cleaning component is used to clean the cutting line 8 after passing through the single crystal silicon rod;

[0088] As an optional embodiment, Figure 4 and Figure 5 As shown, the cleaning assembly includes a rubber roller 32, which is rotatably connected to the side wall of the mounting frame 6, and the outer ring of the rubber roller 32 is provided with a plurality of wire grooves 33 in a linear array, and the wire grooves 33 correspond to the cutting lines 8 one by one;

[0089] The scraping member includes a collecting box 34, which is fixed on the side wall of the mounting frame 6. A plurality of scraping blades 35 are fixed in a linear array on one side of the collecting box 34 facing the corresponding rubber roller 32, and the scraping blades 35 correspond to the line grooves 33 one by one.

[0090] Specifically, during the process of the cutting wire 8 cutting the single crystal silicon rod, corundum particles will be embedded on the cutting wire 8 to improve the cutting ability, but the ground silicon powder will accumulate in the middle of the corundum particles, reducing the cutting ability of the corundum and causing great obstacles to the movement of the cutting wire 8. This embodiment of the present invention can solve the above problems. The specific implementation method is as follows: after the cutting wire 8 moves out of the cutting gap and passes through the wire groove 33, the rubber roller 32 inside the wire groove 33 adheres the silicon dust adhered to the cutting wire 8 to the side wall of the rubber roller 32, so that the cutting wire 8 is cleaned and excessive silicon dust is prevented from entering the guide roller to damage the cutting wire 8. In the process of the cutting wire 8 moving and driving the rubber roller 32 to rotate, the scraper 35 and the rubber roller 32 generate relative movement, so that the scraper 35 scrapes off the silicon dust adhered to the side wall of the wire groove 33, and sends the silicon dust to the collection tank through the inclined surface of the scraper 35, which is beneficial to maintain the adhesion of the rubber roller 32 and facilitate the recovery of the silicon dust.

[0091] In a further embodiment, the spraying unit comprises:

[0092] A water outlet assembly, the water outlet assembly is connected to an external cutting fluid cylinder through a pipeline 11, so that the external cutting fluid cylinder transports cutting fluid to the inside of the water outlet assembly through the main force;

[0093] The lifting and making way component is used to drive the water outlet component to make way and move vertically, so that the port of the water outlet component keeps in contact with the upper surface of the single crystal silicon rod during the cutting process, so as to facilitate the cutting fluid to enter the inside of the cutting gap;

[0094] In the specific implementation process, the lifting and giving way assembly includes a first pressure sensor 13, which is telescopically mounted at the bottom of the water outlet box 2;

[0095] As an optional embodiment, Figure 6 As shown, the lifting and giving way component also includes:

[0096] The second cylinder 12 is fixed to the bottom of the mounting frame 6 through a support rod, and a water outlet assembly is installed at the telescopic end of the second cylinder 12;

[0097] Specifically, during the downward movement of the mounting frame 6, the mounting frame 6 drives the second cylinder 12 to move downward, and the second cylinder 12 drives the water outlet assembly to move downward synchronously. After the water outlet assembly is in contact with the upper surface of the single crystal silicon rod, the first pressure sensor 13 is squeezed, and then the second cylinder 12 is started. The second cylinder 12 drives the water outlet assembly to move upward, and the moving speed is the same as the speed at which the mounting frame 6 moves downward, so that the water outlet assembly is in contact with the upper surface of the single crystal silicon rod, so that the water outlet assembly can directly spray cutting fluid on the cutting line 8 and the cutting position of the single crystal silicon rod.

[0098] As an optional embodiment, Figure 7 As shown, the lifting and giving way component includes:

[0099] An electric push rod 36, a water outlet assembly is installed on the top of the electric push rod 36 through a connecting rod;

[0100] Specifically, during the downward movement of the mounting frame 6, the electric push rod 36 drives the water outlet assembly to move downward synchronously. After the water outlet assembly is in contact with the upper surface of the single crystal silicon rod, the first pressure sensor 13 is squeezed, and then the electric push rod 36 stops moving, so that the water outlet assembly is always in contact with the upper surface of the single crystal silicon rod.

[0101] In further implementation, the water outlet components include:

[0102] The water outlet box 2 is supported by vertical movement of the lifting and giving way assembly;

[0103] A flow channel is provided inside the water outlet box 2 and is used to connect an external cutting fluid cylinder so that the cutting fluid is transported to the cutting gap through the flow channel;

[0104] A limiter is provided at the bottom of the water outlet box 2, and is used to limit the initial cutting track of the cutting unit, reduce the initial cutting deviation of the cutting unit, so that the water outlet port of the water outlet box 2 is aligned with the cutting gap to increase the amount of cutting fluid entering;

[0105] In the specific implementation process, the bottom of the water outlet box 2 is provided with an arc surface, and the arc surface is adapted to the curvature of the upper surface of the single crystal silicon rod;

[0106] As an optional embodiment, Figure 8 As shown, the limiting member is specifically a plurality of limiting grooves 14, and a plurality of limiting grooves 14 are linearly arrayed and opened at the bottom of the water outlet box 2. The number of the limiting grooves 14 is the same as the number of turns of the cutting line 8, and each cutting line 8 passes through a limiting groove 14;

[0107] Specifically, after the lifting and giving way assembly drives the water outlet box 2 to move downward to fit with the upper surface of the single crystal silicon rod, the limiting groove 14 is provided to limit the cutting trajectory of the cutting line 8 when the cutting line 8 cuts the upper surface of the single crystal silicon rod, thereby reducing the sliding of the cutting line 8 so that the distance between adjacent cutting trajectories is the same, which is beneficial to improve the thickness uniformity of the slices.

[0108] In further implementation, the flow path includes:

[0109] A cavity is provided inside the water outlet box 2, the cavity is communicated with the pipe 11, and is used to store the cutting fluid entering through the pipe 11;

[0110] A plurality of water outlets 15 are provided, which are opened at the bottom of the water outlet box 2 and communicated with the cavity, and are used to spray the cutting fluid into the corresponding cutting gap;

[0111] As an optional embodiment, the cavity is specifically as follows Fig. 9 The chamber 16 shown has a top portion connected to the pipe 11 and a bottom portion connected to the water outlet 15;

[0112] Specifically, when adding cutting fluid, the cutting fluid is first introduced into the pipe 11 from the outside, then enters the chamber 16 from the pipe 11, and finally is discharged into each limit groove 14 from each water outlet 15. On the one hand, it can lubricate the side walls of the limit groove 14 to prevent the cutting line 8 from scratching the side walls of the limit groove 14. On the other hand, it can directly enter the cutting gap through the limit groove 14, which is beneficial to reduce the waste of cutting fluid.

[0113] In a further implementation, the occlusion unit includes:

[0114] Two side plates 3 are provided, which are symmetrically slidably connected to the two sides of the water outlet box 2, and are used to cover the openings on both sides of the limiter during the cutting process, so as to reduce the leakage of cutting fluid from the opening of the limiter during the cutting process of the cutting unit;

[0115] The telescopic member is used to elastically support the side plate 3 vertically, so as to gradually support the side plate 3 to move toward the limiting member during the cutting process of the cutting unit;

[0116] In the specific implementation process, a horizontal plate 25 is fixed on the top of the side plate 3 to limit the sliding distance of the side plate 3;

[0117] As an optional embodiment, Fig. 9 and Fig.10 As shown, the telescopic member includes two cross bars 17, the two cross bars 17 are respectively fixed to the opposite sides of the cylinder barrel of the second cylinder 12, and elastic telescopic rods 18 are fixed to the bottom of the two cross bars 17, and the telescopic ends of the two elastic telescopic rods 18 are respectively fixedly connected to the corresponding side plates 3;

[0118] Specifically, during the downward movement of the mounting frame 6, the mounting frame 6 drives the second cylinder 12 to move downward, the downward movement of the second cylinder 12 drives the cross bar 17 to move downward, the cross bar 17 drives the elastic telescopic rod 18 to move downward, and the elastic telescopic rod 18 drives the corresponding side plate 3 to move downward. After the water outlet box 2 is in contact with the upper surface of the single crystal silicon rod, as the mounting frame 6 continues to descend, the water outlet box 2 is always in contact with the upper surface of the single crystal silicon rod under the control of the second cylinder 12, and the side plate 3 moves downward relative to the water outlet box 2 to block the openings on both sides of the limit groove 14, so that all the cutting fluid flowing out of the water outlet 15 enters the cutting gap, which is conducive to full contact between the cutting fluid and the cutting line 8.

[0119] In the further implementation process, it also includes:

[0120] The support member is provided corresponding to the side plate 3 and is used to support the cut portion of the single crystal silicon rod, so that the cut portion of the single crystal silicon rod is supported to reduce the possibility of breakage;

[0121] A driving assembly, used for driving the support member to move downward to support the cut portion of the single crystal silicon rod after the cutting unit has cut more than half of the single crystal silicon rod;

[0122] As an optional embodiment, Fig. 9 , Fig.10 , Fig.11 and Fig.12 As shown, the support member includes:

[0123] Two arc plates 19, the two arc plates 19 are respectively fixed to the sides of the two side plates 3 facing away from the water outlet box body 2. When the two arc plates 19 move to the extreme position, they match the curvature of the water outlet box body 2 to form a complete arc;

[0124] Two baffles 20 are respectively slidably inserted into the interior of the two arc-shaped plates 19;

[0125] The drive components include:

[0126] A first motor 21 is fixed to the top of the arc plate 19. A first gear 22 is fixed to the output shaft of the first motor 21. A first rack 23 is fixed to the top of the baffle 20. The first gear 22 meshes with the first rack 23. The first motor 21 is a small motor.

[0127] The second pressure sensor 24 is telescopically mounted on the bottom of the horizontal plate 25;

[0128] Specifically, the side plate 3 can synchronously drive the two arc plates 19 to move downward during the downward movement. When the two arc plates 19 move downward to the bottom, they are combined with the water outlet box 2 to form an arc that fits the surface of the single crystal silicon rod. At the same time, the two arc plates 19 block the outlets on both sides of the cutting gap to reduce the outflow of the cutting fluid from the outlets on both sides of the cutting gap, which is conducive to the full contact between the cutting line 8 and the cutting fluid. In the process of the side plate 3 moving downward, the horizontal plate 25 provided hits the top of the water outlet box 2, indicating that the side plate 3 It moves down to the extreme position, at which time it squeezes the second pressure sensor 24, so that the first motor 21 starts to start, and the first gear 22 of the first motor 21 rotates, and the first gear 22 drives the first rack 23 to move out of the arc plate 19. The baffle 20 moves along the outer wall of the single crystal silicon rod under the push of the first rack 23. The baffle 20, the arc plate 19 and the water outlet box 2 fix the slice from multiple angles, which is conducive to positioning the slice and preventing the end of the slice from breaking when the single crystal silicon rod is cut to the lowermost part.

[0129] In a further implementation process, it also includes an opening and closing component for controlling the speed at which the cutting fluid is discharged from the water outlet component to increase the output distance of the cutting fluid output from the water outlet component;

[0130] As an optional embodiment, Fig. 9 As shown, the opening and closing assembly includes two sliding plates 26, which are symmetrically slidably connected to the inside of the cavity, and are used to partially cover the water outlet 15 when the cutting gap is deep, so that the speed of cutting fluid spraying is accelerated, thereby facilitating the cutting fluid to enter the depth of the cutting gap more easily;

[0131] The opening and closing assembly further includes two third cylinders 27, which are respectively fixed on the side walls of the cavity, and the telescopic ends of the two third cylinders 27 are respectively fixedly connected to the corresponding sliding plates 26 through connecting plates;

[0132] Specifically, during the cutting process, the depth of the cutting gap gradually becomes deeper. When the cutting gap depth is shallow, the two third cylinders 27 drive the two sliding plates 26 to move away from each other so that the water outlet 15 is not blocked by the sliding plate 26, and the cutting fluid enters the cutting gap at a slower speed, which is beneficial to prevent the cutting fluid from flowing too fast and impacting the cutting line 8, causing the cutting line 8 to deviate. When the cutting gap depth is deep, the two third cylinders 27 control the two sliding plates 26 to move closer to each other to block the water outlet 15, making the water outlet 15 smaller, thereby accelerating the speed of the cutting fluid spraying out of the water outlet 15, which is beneficial to the cutting fluid entering the deep part of the cutting gap and fully contacting the cutting line 8 at the cutting position.

[0133] In a further implementation, the clamping portion includes:

[0134] There are four clamping plates 5, all of which are slidably connected to the top of the workbench 1, and the four clamping plates 5 form a group of two;

[0135] A driving member is installed inside the workbench 1 and is used to drive the two sets of clamping plates 5 to move towards each other by the same distance, so that the two sets of clamping plates 5 can clamp the single crystal silicon rod in the middle of the workbench 1;

[0136] As an optional embodiment, Fig.13 and Fig.14 As shown, the drive member includes:

[0137] A second motor 28, the second motor 28 is fixed to one side of the workbench 1 through a support frame;

[0138] Two mounting grooves 29 are symmetrically arranged inside the workbench 1;

[0139] The output shaft of the second motor 28 passes through the side wall of the workbench 1, and the second gear 30 is fixed to the part passing through the two mounting grooves 29;

[0140] A second rack 31 is fixed to one side of the four clamping plates 5 facing the corresponding second gear 30, and the two second racks 31 in the same mounting groove 29 are respectively meshed with the opposite sides of the corresponding second gear 30;

[0141] Specifically, after the staff places the single crystal silicon rod on the workbench 1, the second motor 28 is started to drive the two second gears 30 to rotate, and the two gears respectively drive the two second racks 31 meshing therewith to move toward each other the same distance, and the two second racks 31 respectively drive the corresponding clamping plates 5 to move toward each other the same distance, so that the single crystal silicon rod is clamped in the center of the workbench 1, which is conducive to the water outlet box 2 to fit with the upper surface of the single crystal silicon rod when it moves downward.

[0142] Working principle of the present invention:

[0143] First, the staff places the polished single crystal silicon rod on the workbench 1, and then uses the clamping part to clamp the single crystal silicon rod in the center of the workbench 1, and then the staff starts the driving motor 9, the driving motor 9 drives the rotating roller 7 to rotate, and the rotating roller 7 drives the cutting line 8 to move quickly, and then the staff starts the first cylinder 10, and the two first cylinders 10 jointly drive the mounting frame 6 to move downward, so that the mounting frame 6 drives the cutting line 8 to move downward to cut the single crystal silicon rod. During the cutting process, the cutting line 8 first contacts the upper surface of the single crystal silicon rod, and the mounting frame 6 moves downward to drive the spraying unit to move downward and contact the upper surface of the single crystal silicon rod. On the one hand, the spraying unit can limit the cutting trajectory of the cutting line 8 so that the cutting line 8 can stably cut into the single crystal silicon rod. On the other hand, the spraying unit gradually increases the speed of the cutting fluid supply as the cutting depth of the cutting unit increases, so that the cutting fluid supply at the cutting position is maintained when the cutting depth increases, which is conducive to improving the full contact between the cutting line 8 and the cutting fluid.

[0144] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. A production cutting process for wafers, characterized in that: The cutting process includes the following steps: Step 1: placing a polished single crystal silicon rod of appropriate size on a workbench (1) in a cutting device; Step 2: Using a clamping part in a cutting device to clamp the single crystal silicon rod at the center of the workbench (1); Step 3: Start the cutting unit in the cutting device to cut the clamped single crystal silicon rod into multiple slices, and start the spraying unit in the cutting device to spray cutting fluid to the cutting position; Step 4: Collect the cut slices for subsequent processing; The cutting device described in step 1 to step 4 includes a mounting seat (4), and further includes: A workbench (1) is fixed to the top of the mounting seat (4) via a support column and is used to place the single crystal silicon rod to be cut and provide support during the cutting process; A cutting unit, used for cutting the single crystal silicon rod placed on the workbench (1); A clamping portion, mounted on the top of the workbench (1), and used to position and clamp the single crystal silicon rod placed on the workbench (1), so that the single crystal silicon rod is aligned with the cutting unit after positioning; A spraying unit, used to uniformly supply cutting fluid by limiting the trajectory of the cutting unit during the cutting process, and gradually increase the speed of supplying the cutting fluid as the cutting depth of the cutting unit increases, so as to maintain the supply of cutting fluid at the cutting position when the cutting depth increases; Also includes: A shielding unit, used to shield both sides of the spraying unit, so that when the cutting unit moves downward for cutting, both sides of the water outlet position at the bottom of the spraying unit are shielded to reduce the cutting fluid from flowing out along the gap when the cutting unit moves downward; The spraying unit comprises: A water outlet component, the water outlet component is connected to an external cutting fluid cylinder through a pipeline (11), so that the external cutting fluid cylinder transports cutting fluid to the inside of the water outlet component through active force; A lifting and making way component is used to drive the water outlet component to make way and move vertically, so that the port of the water outlet component keeps in contact with the upper surface of the single crystal silicon rod during the cutting process, so as to facilitate the cutting fluid to enter the interior of the cutting gap; The water outlet assembly comprises: The water outlet box (2) is supported by vertical movement through the lifting and giving way assembly; A flow channel is provided inside the water outlet box (2) and is used to connect to an external cutting fluid cylinder so that the cutting fluid is transported to the cutting gap through the flow channel; A limiter, arranged at the bottom of the water outlet box (2), used to limit the initial cutting track of the cutting unit, reduce the initial cutting deviation of the cutting unit, so that the water outlet port of the water outlet box (2) remains aligned with the cutting gap, thereby increasing the amount of cutting fluid entering; Also includes: The opening and closing component is used to control the speed at which the cutting fluid is discharged from the water outlet component to increase the output distance of the cutting fluid output from the water outlet component.

2. A production cutting process for wafers according to claim 1, characterized in that: Also includes: A cleaning component, used to remove silicon dust adhering to the cutting unit, so as to reduce the interference of silicon dust adhering to the cutting of the cutting unit; The scraping piece is used to scrape and collect the silicon dust on the cleaning component.

3. A production cutting process for wafers according to claim 1, characterized in that: The flow channel comprises: A cavity is provided inside the water outlet box (2), the cavity is communicated with the pipe (11), and is used for storing cutting fluid entering through the pipe (11); A plurality of water outlets (15) are provided, which are opened at the bottom of the water outlet box (2) and communicated with the cavity, and are used to spray the cutting fluid into the corresponding cutting gap.

4. A production cutting process for wafers according to claim 3, characterized in that: The shielding unit comprises: Two side plates (3) are provided, symmetrically slidably connected to the two sides of the water outlet box (2), and are used to cover the openings on both sides of the limiter during the cutting process, so as to reduce the amount of cutting fluid leaking from the opening of the limiter during the cutting process of the cutting unit; The telescopic member is used to elastically support the side plate (3) vertically, so as to gradually support the side plate (3) to move towards the limiting member during the movement and cutting process of the cutting unit.

5. A production cutting process for wafers according to claim 4, characterized in that: Also includes: A support member is arranged corresponding to the side plate (3) and is used to support the cut portion of the single crystal silicon rod, so that the cut portion of the single crystal silicon rod is supported to reduce the possibility of breakage; The driving assembly is used to drive the supporting member to move downward to support the cut portion of the single crystal silicon rod after the cutting unit has cut more than half of the single crystal silicon rod.

6. A production cutting process for wafers according to claim 1, characterized in that: The clamping portion comprises: There are four clamping plates (5), all of which are slidably connected to the top of the workbench (1), and the four clamping plates (5) are grouped in pairs; A driving member is installed inside the workbench (1) and is used to drive the two groups of clamping plates (5) to move towards each other by the same distance, so that the two groups of clamping plates (5) can clamp the single crystal silicon rod in the middle of the workbench (1).

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