A chip atomic clock stability optimization method and system based on machine learning

Abstract

The present invention discloses a chip atomic clock stability optimization method and system based on machine learning. The method comprises: acquiring data information of the chip atomic clock; setting a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock and an aging effect measurement model of the chip atomic clock, and respectively calculating the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index of the chip atomic clock according to the data information; setting a comprehensive stability measurement model of the chip atomic clock, calculating the comprehensive stability measurement index according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, fitting the comprehensive stability measurement model of the chip atomic clock so that the comprehensive stability measurement index is closest to a preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

Description

Technical Field

[0001] The present invention belongs to the technical field of atomic clock stability optimization, and more specifically, relates to a chip atomic clock stability optimization method and system based on machine learning. Background Art

[0002] The stability of a chip atomic clock is a measure of its ability to maintain accurate time under various environmental conditions. Its stability can be examined from two aspects: short-term stability (phase noise) and long-term stability (frequency drift).

[0003] Factors affecting the stability of chip atomic clocks:

[0004] Temperature changes: Temperature fluctuations can affect the frequency stability of the oscillator. Precision temperature control measures can reduce this effect.

[0005] Power supply noise: An unstable power supply will introduce noise, affecting the frequency of the oscillator;

[0006] Mechanical vibration and shock: External mechanical vibration and shock can cause temporary shifts in the oscillator frequency;

[0007] Aging effect: Aging of components will cause frequency drift, which is an important factor affecting long-term stability;

[0008] Radiation environment: Especially in the aerospace and military fields, the radiation environment will affect the stability of the chip atomic clock;

[0009] However, there is no technical solution in the prior art that can comprehensively consider the impact of multiple factors on the stability of chip atomic clocks, thereby providing effective assistance to the research and development of chip atomic clocks. Summary of the invention

[0010] In order to solve the above technical problems, the present invention proposes a chip atomic clock stability optimization method based on machine learning, comprising:

[0011] Acquire data information of the chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, environmental humidity and atmospheric pressure;

[0012] Setting a frequency stability measurement model of a chip atomic clock, a phase noise measurement model of a chip atomic clock, a temperature sensitivity measurement model of a chip atomic clock, and an aging effect measurement model of a chip atomic clock, and calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock respectively according to the data information;

[0013] A comprehensive stability measurement model of the chip atomic clock is set, and a comprehensive stability measurement index is calculated according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index. The comprehensive stability measurement model of the chip atomic clock is fitted so that the comprehensive stability measurement index is closest to the preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

[0014] Furthermore, the frequency stability measurement model of the chip atomic clock includes:

[0015] ,

[0016] in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is a frequency stability measurement index of the chip atomic clock.

[0017] Furthermore, the phase noise measurement model of the chip atomic clock includes:

[0018] ,

[0019] in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index.

[0020] Furthermore, the temperature sensitivity measurement model of the chip atomic clock includes:

[0021] ,

[0022] in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at that time.

[0023] Furthermore, the aging effect measurement model of the chip atomic clock includes:

[0024] ,

[0025] in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index.

[0026] Furthermore, the comprehensive measurement model of the stability of the chip atomic clock includes:

[0027] ,

[0028] in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

[0029] Furthermore, all adjustment factors and weights are fitted by gradient descent method or ant colony algorithm.

[0030] The present invention also proposes a chip atomic clock stability optimization system based on machine learning, comprising:

[0031] A data acquisition module is used to acquire data information of the chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, ambient humidity and atmospheric pressure;

[0032] Setting a model module, used to set a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock, and an aging effect measurement model of the chip atomic clock, and respectively calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock according to the data information;

[0033] The optimization module is used to set the comprehensive measurement model of stability of the chip atomic clock, and calculate the comprehensive measurement index of stability according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, and fit the comprehensive measurement model of stability of the chip atomic clock so that the comprehensive measurement index of stability is closest to the preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

[0034] Furthermore, the frequency stability measurement model of the chip atomic clock includes:

[0035] ,

[0036] in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is a frequency stability measurement index of the chip atomic clock.

[0037] Furthermore, the present invention also proposes an electronic device, comprising a processor and a storage medium connected to the processor, wherein the storage medium stores a plurality of instructions, and the instructions can be loaded and executed by the processor so that the processor can execute code including a chip atomic clock stability optimization method based on machine learning.

[0038] In general, the above technical solution conceived by the present invention has the following beneficial effects compared with the prior art:

[0039] The present invention can optimize the stability of a chip atomic clock from multiple dimensions by setting a frequency stability measurement model of a chip atomic clock, a phase noise measurement model of a chip atomic clock, a temperature sensitivity measurement model of a chip atomic clock, and an aging effect measurement model of a chip atomic clock, thereby improving the design and development efficiency of the chip atomic clock. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a flow chart of the method of embodiment 1 of the present invention;

[0041] Figure 2 It is a structural diagram of the system of embodiment 2 of the present invention. DETAILED DESCRIPTION

[0042] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] The method provided by the present invention can be implemented in the following terminal environment, and the terminal may include one or more of the following components: a processor, a storage medium, and a display screen. The storage medium stores at least one instruction, and the instruction is loaded and executed by the processor to implement the method described in the following embodiment.

[0044] The processor may include one or more processing cores. The processor uses various interfaces and lines to connect various parts in the entire terminal, and executes various functions of the terminal and processes data by running or executing instructions, programs, code sets or instruction sets stored in the storage medium, and calling data stored in the storage medium.

[0045] The storage medium may include a random access memory (RAM) or a read-only memory (ROM). The storage medium may be used to store instructions, programs, codes, code sets or instructions.

[0046] The display screen is used to display the user interface of each application.

[0047] In addition, those skilled in the art can understand that the structure of the above terminal does not constitute a limitation on the terminal, and the terminal may include more or fewer components, or combine certain components, or arrange the components differently. For example, the terminal also includes components such as a radio frequency circuit, an input unit, a sensor, an audio circuit, and a power supply, which will not be described in detail here.

[0048] Example 1

[0049] like Figure 1 As shown, an embodiment of the present invention provides a chip atomic clock stability optimization method based on machine learning, comprising:

[0050] Step 101, obtaining data information of a chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, environmental humidity and atmospheric pressure;

[0051] Step 102, setting a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock, and an aging effect measurement model of the chip atomic clock, and calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock respectively according to the data information;

[0052] Specifically, the frequency stability measurement model of the chip atomic clock includes:

[0053] ,

[0054] in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is a frequency stability measurement index of the chip atomic clock.

[0055] Specifically, the phase noise measurement model of the chip atomic clock includes:

[0056] ,

[0057] in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index.

[0058] Specifically, the temperature sensitivity measurement model of the chip atomic clock includes:

[0059] ,

[0060] in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at that time.

[0061] Specifically, the aging effect measurement model of the chip atomic clock includes:

[0062] ,

[0063] in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index.

[0064] Step 103, setting a comprehensive stability measurement model for the chip atomic clock, and calculating a comprehensive stability measurement index according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, and fitting the comprehensive stability measurement model for the chip atomic clock so that the comprehensive stability measurement index is closest to a preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

[0065] Specifically, the comprehensive measurement model of the stability of the chip atomic clock includes:

[0066] ,

[0067] in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

[0068] Specifically, all adjustment factors and weights are fitted by gradient descent method or ant colony algorithm.

[0069] Example 2

[0070] like Figure 2 As shown, an embodiment of the present invention further provides a chip atomic clock stability optimization system based on machine learning, comprising:

[0071] A data acquisition module is used to acquire data information of the chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, ambient humidity and atmospheric pressure;

[0072] Setting a model module, used to set a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock, and an aging effect measurement model of the chip atomic clock, and respectively calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock according to the data information;

[0073] Specifically, the frequency stability measurement model of the chip atomic clock includes:

[0074] ,

[0075] in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is a frequency stability measurement index of the chip atomic clock.

[0076] Specifically, the phase noise measurement model of the chip atomic clock includes:

[0077] ,

[0078] in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index.

[0079] Specifically, the temperature sensitivity measurement model of the chip atomic clock includes:

[0080] ,

[0081] in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at that time.

[0082] Specifically, the aging effect measurement model of the chip atomic clock includes:

[0083] ,

[0084] in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index.

[0085] The optimization module is used to set the comprehensive measurement model of stability of the chip atomic clock, and calculate the comprehensive measurement index of stability according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, and fit the comprehensive measurement model of stability of the chip atomic clock so that the comprehensive measurement index of stability is closest to the preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

[0086] Specifically, the comprehensive measurement model of the stability of the chip atomic clock includes:

[0087] ,

[0088] in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

[0089] Specifically, all adjustment factors and weights are fitted by gradient descent method or ant colony algorithm.

[0090] Example 3

[0091] An embodiment of the present invention also proposes a storage medium storing a plurality of instructions, wherein the instructions are used to implement the chip atomic clock stability optimization method based on machine learning.

[0092] Optionally, in this embodiment, the above storage medium may be located in any computer terminal in a computer terminal group in a computer network, or in any mobile terminal in a mobile terminal group.

[0093] Optionally, in this embodiment, the storage medium is configured to store program codes for executing the following steps: Step 101, obtaining data information of a chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, environmental humidity and atmospheric pressure;

[0094] Step 102, setting a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock, and an aging effect measurement model of the chip atomic clock, and calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock respectively according to the data information;

[0095] Specifically, the frequency stability measurement model of the chip atomic clock includes:

[0096] ,

[0097] in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is a frequency stability measurement index of the chip atomic clock.

[0098] Specifically, the phase noise measurement model of the chip atomic clock includes:

[0099] ,

[0100] in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index.

[0101] Specifically, the temperature sensitivity measurement model of the chip atomic clock includes:

[0102] ,

[0103] in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at that time.

[0104] Specifically, the aging effect measurement model of the chip atomic clock includes:

[0105] ,

[0106] in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index.

[0107] Step 103, setting a comprehensive stability measurement model for the chip atomic clock, and calculating a comprehensive stability measurement index according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, and fitting the comprehensive stability measurement model for the chip atomic clock so that the comprehensive stability measurement index is closest to a preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

[0108] Specifically, the comprehensive measurement model of the stability of the chip atomic clock includes:

[0109] ,

[0110] in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

[0111] Specifically, all adjustment factors and weights are fitted by gradient descent method or ant colony algorithm.

[0112] Example 4

[0113] An embodiment of the present invention also proposes an electronic device, comprising a processor and a storage medium connected to the processor, wherein the storage medium stores a plurality of instructions, and the instructions can be loaded and executed by the processor so that the processor can execute the chip atomic clock stability optimization method based on machine learning.

[0114] Specifically, the electronic device of this embodiment may be a computer terminal, and the computer terminal may include: one or more processors, and a storage medium.

[0115] Among them, the storage medium can be used to store software programs and modules, such as a chip atomic clock stability optimization method based on machine learning in an embodiment of the present invention, and the corresponding program instructions / modules. The processor executes various functional applications and data processing by running the software programs and modules stored in the storage medium, that is, realizing the above-mentioned chip atomic clock stability optimization method based on machine learning. The storage medium may include a high-speed random storage medium, and may also include a non-volatile storage medium, such as one or more magnetic storage systems, flash memory, or other non-volatile solid-state storage media. In some instances, the storage medium may further include a storage medium remotely arranged relative to the processor, and these remote storage media may be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0116] The processor can call the information and application program stored in the storage medium through the transmission system to perform the following steps: Step 101, obtaining data information of the chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, environmental humidity and atmospheric pressure;

[0117] Step 102, setting a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock, and an aging effect measurement model of the chip atomic clock, and calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock respectively according to the data information;

[0118] Specifically, the frequency stability measurement model of the chip atomic clock includes:

[0119] ,

[0120] in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is a frequency stability measurement index of the chip atomic clock.

[0121] Specifically, the phase noise measurement model of the chip atomic clock includes:

[0122] ,

[0123] in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index.

[0124] Specifically, the temperature sensitivity measurement model of the chip atomic clock includes:

[0125] ,

[0126] in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at that time.

[0127] Specifically, the aging effect measurement model of the chip atomic clock includes:

[0128] ,

[0129] in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index.

[0130] Step 103, setting a comprehensive stability measurement model for the chip atomic clock, and calculating a comprehensive stability measurement index according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, and fitting the comprehensive stability measurement model for the chip atomic clock so that the comprehensive stability measurement index is closest to a preset optimal stability index, thereby completing the stability optimization of the chip atomic clock.

[0131] Specifically, the comprehensive measurement model of the stability of the chip atomic clock includes:

[0132] ,

[0133] in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

[0134] Specifically, all adjustment factors and weights are fitted by gradient descent method or ant colony algorithm.

[0135] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0136] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0137] In the several embodiments provided by the present invention, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the system embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0138] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0139] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0140] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only storage medium (ROM, Read-Only Memory), random access storage medium (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0141] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A chip atomic clock stability optimization method based on machine learning, characterized in that: include: Acquire data information of the chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, environmental humidity and atmospheric pressure; Setting a frequency stability measurement model of a chip atomic clock, a phase noise measurement model of a chip atomic clock, a temperature sensitivity measurement model of a chip atomic clock, and an aging effect measurement model of a chip atomic clock, and calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock respectively according to the data information; Setting a comprehensive stability measurement model for the chip atomic clock, and calculating a comprehensive stability measurement index according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index, and the aging effect measurement index, and fitting the comprehensive stability measurement model for the chip atomic clock so that the comprehensive stability measurement index is closest to a preset optimal stability index, thereby completing the stability optimization of the chip atomic clock; Specifically, the frequency stability measurement model of the chip atomic clock includes: ， in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is the frequency stability index of the chip atomic clock; The phase noise measurement model of the chip atomic clock includes: ， in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index; The temperature sensitivity measurement model of the chip atomic clock includes: ， in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at the time; The aging effect measurement model of the chip atomic clock includes: ， in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index; The comprehensive measurement model of the stability of the chip atomic clock includes: ， in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

2. A chip atomic clock stability optimization method based on machine learning as claimed in claim 1, characterized in that: All adjustment factors and weights are fitted by gradient descent method or ant colony algorithm.

3. A chip atomic clock stability optimization system based on machine learning, characterized in that: include: A data acquisition module is used to acquire data information of the chip atomic clock, wherein the data information includes: the chip atomic clock's own vibration frequency, standard frequency, conductivity, electromagnetic interference intensity, environmental vibration frequency, power spectrum density of phase noise, temperature, reference temperature, ambient humidity and atmospheric pressure; Setting a model module, used to set a frequency stability measurement model of the chip atomic clock, a phase noise measurement model of the chip atomic clock, a temperature sensitivity measurement model of the chip atomic clock, and an aging effect measurement model of the chip atomic clock, and respectively calculating the frequency stability measurement index, phase noise measurement index, temperature sensitivity measurement index, and aging effect measurement index of the chip atomic clock according to the data information; An optimization module, used for setting a comprehensive stability measurement model of the chip atomic clock, and calculating a comprehensive stability measurement index according to the frequency stability measurement index, the phase noise measurement index, the temperature sensitivity measurement index and the aging effect measurement index, and fitting the comprehensive stability measurement model of the chip atomic clock so that the comprehensive stability measurement index is closest to a preset optimal stability index, thereby completing the stability optimization of the chip atomic clock; Specifically, the frequency stability measurement model of the chip atomic clock includes: ， in, is the amount of time, For the Time The chip's atomic clock's own vibration frequency, For the Time Add time interval The chip's atomic clock's own vibration frequency, is the standard frequency of the chip atomic clock, is the first adjustment factor for conductivity, For the Time The conductivity of the chip atomic clock, is the first adjustment factor of electromagnetic interference intensity, For the Time The electromagnetic interference intensity of the chip atomic clock, is the first adjustment factor of the ambient vibration frequency, For the Time The ambient vibration frequency of the chip atomic clock, is the comprehensive adjustment factor of the frequency stability metric index, It is the frequency stability index of the chip atomic clock; The phase noise measurement model of the chip atomic clock includes: ， in, is the phase noise measurement index of the chip atomic clock, The vibration frequency of the chip atomic clock is The power spectral density of the phase noise at is the standard frequency of the chip atomic clock, is the second adjustment factor for electromagnetic interference intensity, The vibration frequency of the chip atomic clock is The electromagnetic interference intensity at is the second adjustment factor of the ambient vibration frequency, The vibration frequency of the chip atomic clock is The ambient vibration frequency at is the comprehensive adjustment factor of the phase noise metric index; The temperature sensitivity measurement model of the chip atomic clock includes: ， in, is the temperature sensitivity index of the chip atomic clock, is the first adjustment factor for temperature, For time The temperature of the chip atomic clock, is the reference temperature, is the second adjustment factor for temperature, is the adjustment factor for ambient humidity, The temperature of the chip atomic clock is The ambient humidity at is the adjustment factor for atmospheric pressure, The temperature of the chip atomic clock is Atmospheric pressure at the time; The aging effect measurement model of the chip atomic clock includes: ， in, is the aging effect measurement index of the chip atomic clock, is the first comprehensive adjustment factor for the aging effect measurement index, is the time adjustment factor, is the third adjustment factor of electromagnetic interference intensity, is the second adjustment factor for conductivity, It is the second comprehensive adjustment factor for the aging effect measurement index; The comprehensive measurement model of the stability of the chip atomic clock includes: ， in, It is a comprehensive index of stability of the chip atomic clock. is the weight of the frequency stability metric index, is the weight of the phase noise metric index, is the weight of the temperature sensitivity index, is the weight of the aging effect measurement index.

4. An electronic device, characterized in that: The method comprises a processor and a storage medium connected to the processor, wherein the storage medium stores a plurality of instructions, and the instructions can be loaded and executed by the processor so that the processor can execute a code including a method according to any one of claims 1 to 2.

Images