Laser chip testing device

Abstract

The present invention relates to a laser chip testing device applied to the testing field, comprising a device body, a plurality of testing channels arranged in the device body, a testing platform fixedly installed on the lower inner wall of the testing channel, and the left end of the testing platform extends to the outside of the testing channel. The negative pressure suction cup and the adsorption balance auxiliary system are used in cooperation to effectively achieve the purpose of non-rigid clamping of the laser chip by the device body. On the one hand, while reducing the difficulty of clamping, it can also effectively avoid damage to the laser chip caused by the clamping process, thereby ensuring the safety and effectiveness of the laser chip testing process. On the other hand, during the testing process, according to the change of the clamping adsorption pressure caused by the temperature, the clamping adsorption pressure can be dynamically balanced, effectively ensuring the constant effect of the clamping adsorption pressure, ensuring the stability of the laser chip clamping, thereby effectively reducing the error of the laser chip during the testing process, and improving the accuracy of the device body test.

Description

Technical Field

[0001] The present invention relates to a chip testing device, in particular to a laser chip testing device applied in the testing field. Background Art

[0002] A laser chip is a microchip that integrates a laser structure. It generates lasers mainly through current or light injection, and can achieve high-power and high-efficiency output. Laser chip testing is the process of evaluating the performance, stability and quality of laser chips. It mainly verifies the reliability of laser chips through photoelectric characteristic testing, electrical characteristic testing, temperature characteristic testing and other special testing methods to meet various application requirements.

[0003] The laser chip testing device is a device used to perform performance testing and quality control on laser chips. It is mainly composed of a laser chip fixture, a laser driver, an optical measurement system, a temperature control device and a data acquisition system, thereby realizing the detection and evaluation of the performance quality of the laser chip.

[0004] During the application of the laser chip testing device in the prior art, the temperature in the test channel constantly changes, which will cause the laser fixing frame to produce clamping deformation, changing its clamping effect on the laser chip. Therefore, it will not only cause damage to the laser chip, but also easily affect the connection stability between the laser chip and the laser driver, affect the transmission of electrical signals, increase test errors, reduce the reliability of test results, and further affect the effectiveness of the laser chip test. Summary of the invention

[0005] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is how to reduce the error caused by unstable clamping during the laser chip testing process and improve the testing accuracy of the laser chip testing device.

[0006] In order to solve the above problems, the present invention provides a laser chip testing device, comprising a device body, a plurality of test channels are arranged in the device body, a test platform is fixedly installed on the lower inner wall of the test channel, and the left end of the test platform extends to the outside of the test channel, a test drive slot and a test slot located on the right side of the test drive slot and connected to the test drive slot are opened at the upper end of the test platform, electric slide rails are installed on the front and rear inner walls of the test drive slot, a slide seat is slidably installed on the electric slide rail, a negative pressure suction cup is fixedly connected to the right end of the slide seat, and the negative pressure suction cup is slidably matched with the test drive slot and the test slot, a plurality of suction cup slot groups are opened at the upper end of the negative pressure suction cup, a plurality of negative pressure cavities are opened in the negative pressure suction cup, a plurality of negative pressure holes connected to the negative pressure cavities at corresponding positions are opened on the lower inner wall of the suction cup slot group, and a plurality of adsorption pipelines connected to the negative pressure cavities are fixedly connected to the left end of the negative pressure suction cup;

[0007] The device body is equipped with an adsorption balance auxiliary system that cooperates with the negative pressure suction cup. The adsorption balance auxiliary system includes an adsorption balance processing unit. The input end of the adsorption balance processing unit is connected to an adsorption pressure acquisition unit, an adsorption parameter acquisition unit and a test data acquisition unit. The output end of the adsorption balance processing unit is connected to an adsorption pressure control unit and an adsorption data output unit.

[0008] The input end of the adsorption pressure acquisition unit is connected to the signal of the pressure probe arranged in the negative pressure chamber, the input end of the adsorption parameter acquisition unit is connected to the signal of the control panel arranged at the front end of the device body, the input end of the test data acquisition unit is connected to the signal of the data acquisition system arranged in the device body, the output end of the adsorption pressure regulation unit is connected to the signal of the adsorption pump and the regulation valve group arranged at the rear end of the device body and connected to the adsorption pipeline, and the output end of the adsorption data output unit is connected to the signal of the control panel arranged at the front end of the device body.

[0009] In the above-mentioned laser chip testing device, the purpose of non-rigid clamping of the laser chip by the device body is effectively achieved. The clamping adsorption pressure can be dynamically balanced according to the change of temperature, thereby ensuring the stability of the laser chip clamping and improving the accuracy of the device body test.

[0010] As a supplement to the present application, a channel door driving structure is fixedly installed at the upper end of the test channel, a channel door is fixedly connected to the lower end of the channel door driving structure, the lower end of the channel door extends into the test channel and is in sliding cooperation with the test channel.

[0011] As a supplement to the present application, the suction cup groove group is composed of a plurality of independent concentric circle grooves, and a single negative pressure cavity cooperates with a single concentric circle groove.

[0012] As a further improvement of the present application, the adsorption balance processing unit includes a data receiving module, the output end of the data receiving module is connected to the adsorption pressure processing module and the dynamic pressure processing module, the output end of the adsorption pressure processing module is connected to the adsorption instruction output module and the adsorption data output module, the output end of the dynamic pressure processing module is connected to the dynamic balance compensation module, and the output end of the dynamic balance compensation module is connected to the adsorption instruction output module signal;

[0013] The input end of the data receiving module is respectively connected to the adsorption pressure acquisition unit, the adsorption parameter acquisition unit and the test data acquisition unit, the output end of the adsorption instruction output module is connected to the adsorption pressure control unit, and the output end of the adsorption data output module is connected to the adsorption data output unit.

[0014] As a further improvement of the present application, photosensitive probes are fixedly connected to the four corners of the upper end of the suction cup groove group, and the input end of the adsorption balance processing unit is also connected to a photosensitive position acquisition unit, and the input end of the photosensitive position acquisition unit is connected to the photosensitive probe signal.

[0015] As a further improvement of the present application, the right end of the test channel is fixedly connected with an abutment sensing plate matched with the test platform, the upper end of the abutment sensing plate is fixedly installed with a test driver, and the left ends of the abutment sensing plate and the test driver both extend into the test channel;

[0016] A pair of sensing grooves are opened at the left end of the abutting sensing plate, an elastic pressure-sensitive column is embedded in the right inner wall of the sensing groove, a pair of sensing plug plates matching the sensing grooves are fixedly connected to the right end of the negative pressure suction cup, a trigger cavity is opened in the elastic pressure-sensitive column, a supporting spring is fixedly connected between the left and right inner walls of the trigger cavity, and trigger columns arranged on the inner side of the supporting springs are fixedly connected to the left and right inner walls of the trigger cavity, the input end of the adsorption balance processing unit is also connected to the test position sensing unit, and the input end of the test position sensing unit is connected to the trigger column signal.

[0017] As another improvement of the present application, the upper and lower inner walls of the sensing groove are fixedly connected with a balance sensing package that cooperates with the sensing plug plate, the upper and lower inner walls of the balance sensing package are fixedly connected with abutment guide pillars, the input end of the adsorption balance processing unit is connected with a deformation collection unit, and the input end of the deformation collection unit is connected with the abutment guide pillar signal.

[0018] As another improvement of the present application, the output end of the adsorption balance processing unit is also connected to an abnormal marking unit and an abnormal warning unit, the output end of the abnormal marking unit is connected to the adsorption data output unit signal, and the output end of the abnormal warning unit is connected to the alarm signal set on the device body.

[0019] In summary, through the cooperation of the negative pressure suction cup and the adsorption balance auxiliary system, the purpose of non-rigid clamping of the laser chip by the device body can be effectively achieved. On the one hand, while reducing the difficulty of clamping, it can also effectively avoid damage to the laser chip during the clamping process, ensuring the safety and effectiveness of the laser chip testing process. On the other hand, during the test process, the clamping adsorption pressure can be dynamically balanced according to the change of the clamping adsorption pressure caused by temperature, effectively ensuring the constant effect of the clamping adsorption pressure, ensuring the stability of the laser chip clamping, and thus effectively reducing the error of the laser chip during the test process, improving the accuracy of the device body test, and by ensuring the clamping stability, it can also effectively ensure the stability of the laser chip and the test driver plug-in, further ensuring the data stability and effectiveness of the laser chip during the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is an axonometric view of the device body of the first to third embodiments of the present application;

[0021] Figure 2 This is a control logic diagram of the adsorption equilibrium auxiliary system of the first to third embodiments of the present application;

[0022] Figure 3 This is an exploded diagram of the test channel and test platform of the first to third implementation modes of the present application;

[0023] Figure 4 This is a top view of the test platform and the negative pressure suction cup in the first to third embodiments of the present application;

[0024] Figure 5 For the first to third implementations of this application Figure 4 A partial enlarged view of the middle part;

[0025] Figure 6 This is an axonometric diagram of the coordination of the test channel and the test platform during the laser chip test process of the first to third embodiments of the present application;

[0026] Figure 7 This is a front cross-sectional view of the cooperation between the test channel and the test platform during the laser chip test process of the first to third embodiments of the present application;

[0027] Figure 8 For the first to third implementations of this application Figure 7 A partial enlarged view of point B in the middle;

[0028] Fig. 9 This is an axonometric diagram of the coordination of the test channel and the test platform during the laser chip clamping process of the first to third embodiments of the present application;

[0029] Fig.10 This is a front cross-sectional view of the cooperation between the test channel and the test platform during the laser chip clamping process of the first to third embodiments of the present application;

[0030] Fig.11 For the first to third implementations of this application Fig.10 A partial enlarged view of point C in the middle;

[0031] Fig.12 This is an axonometric diagram of the test platform and the negative pressure suction cup of the first to third embodiments of the present application when not in use;

[0032] Fig.13 This is a top view of the test platform and negative pressure suction cup of the first to third embodiments of the present application when not in use;

[0033] Fig.14 This is an axonometric cross-sectional view of the negative pressure suction cup according to the third embodiment of the present application.

[0034] Description of the numbers in the figure:

[0035] 1 device body, 2 test channel, 21 channel door drive structure, 22 channel door, 3 test platform, 31 test drive slot, 32 test slot, 33 electric slide rail, 34 slide seat, 4 test driver, 5 negative pressure suction cup, 51 suction cup slot group, 52 negative pressure hole, 53 negative pressure cavity, 54 sensing plug plate, 6 adsorption pipeline, 7 abutting sensing plate, 71 sensing slot, 72 elastic pressure-sensitive column, 73 balance sensing package, 8 photosensitive probe. DETAILED DESCRIPTION

[0036] The following is a detailed description of three implementation methods of the present application in conjunction with the accompanying drawings.

[0037] The first implementation method:

[0038] Figure 1 - Fig.13 A device body 1 is shown, in which a plurality of test channels 2 are arranged, and a heat-insulating material is arranged in the test channel 2 to reduce the temperature dissipation and ensure the effectiveness of temperature control. A test platform 3 is fixedly installed on the lower inner wall of the test channel 2, and the left end of the test platform 3 extends to the outside of the test channel 2. A test drive slot 31 and a test slot 32 located on the right side of the test drive slot 31 and connected to the test drive slot 31 are opened at the upper end of the test platform 3. Electric slide rails 33 are installed on the front and rear inner walls of the test drive slot 31. The electric slide rails 33 are prior art and are directly quoted here without making any changes to their structure and principle. Technical personnel in the field can select an electric slide rail 33 of appropriate specifications for application according to actual needs, so it will not be described here. A slide seat 34 is slidably installed on the electric slide rail 33, and a negative pressure suction cup 5 is fixedly connected to the right end of the slide seat 34, and the negative pressure suction cup 5 is slidably matched with the test drive slot 31 and the test slot 32. A plurality of suction cup slot groups 51 are opened at the upper end of the negative pressure suction cup 5, and a plurality of negative pressure cavities 53 are opened in the negative pressure suction cup 5. A plurality of negative pressure holes 52 connected to the negative pressure cavities 53 at corresponding positions are opened on the lower inner wall of the suction cup slot group 51, and a plurality of adsorption pipelines 6 connected to the negative pressure cavities 53 are fixedly connected to the left end of the negative pressure suction cup 5;

[0039] The device body 1 is equipped with an adsorption balance auxiliary system that cooperates with the negative pressure suction cup 5. The adsorption balance auxiliary system includes an adsorption balance processing unit. The input end of the adsorption balance processing unit is connected to an adsorption pressure acquisition unit, an adsorption parameter acquisition unit and a test data acquisition unit. The output end of the adsorption balance processing unit is connected to an adsorption pressure control unit and an adsorption data output unit.

[0040] The input end of the adsorption pressure acquisition unit is connected to the signal of the pressure probe arranged in the negative pressure chamber 53, the input end of the adsorption parameter acquisition unit is connected to the signal of the control panel arranged at the front end of the device body 1, the input end of the test data acquisition unit is connected to the signal of the data acquisition system arranged in the device body 1, the output end of the adsorption pressure regulation unit is connected to the signal of the adsorption pump and the regulating valve group arranged at the rear end of the device body 1 and connected to the adsorption pipeline 6, and the output end of the adsorption data output unit is connected to the signal of the control panel arranged at the front end of the device body 1. Through the cooperation of the negative pressure suction cup 5 and the adsorption balance auxiliary system, the purpose of non-rigid clamping of the laser chip by the device body 1 is effectively achieved. On the one hand, it is to reduce While reducing the difficulty of clamping, it can also effectively avoid damage to the laser chip during the clamping process, ensuring the safety and effectiveness of the laser chip testing process. On the other hand, during the test process, it can dynamically balance the clamping adsorption pressure according to the change of the clamping adsorption pressure caused by the temperature, effectively ensuring the constant effect of the clamping adsorption pressure, ensuring the stability of the laser chip clamping, and thus effectively reducing the error of the laser chip during the test process, improving the accuracy of the test of the device body 1, and can also effectively ensure the stability of the connection between the laser chip and the test driver 4 by ensuring the clamping stability, further ensuring the data stability and effectiveness of the laser chip during the test process.

[0041] Figure 1 - Fig.13 It is shown that a channel door driving structure 21 is fixedly installed on the upper end of the test channel 2. The channel door driving structure 21 can be a hydraulic cylinder or an electric push rod to realize the driving effect on the channel door 22. The lower end of the channel door driving structure 21 is fixedly connected to the channel door 22. The lower end of the channel door 22 extends into the test channel 2 and is in sliding cooperation with the test channel 2. The cooperation between the channel door driving structure 21 and the channel door 22 can realize the opening and closing of the test channel 2, realize the effectiveness and uniformity of the temperature in the channel when testing the laser chip, reduce the difficulty of temperature control and narrow the test range, and improve the test efficiency of the device body 1.

[0042] Figure 2 The adsorption balance processing unit includes a data receiving module, the output end of the data receiving module is connected to the adsorption pressure processing module and the dynamic pressure processing module, the output end of the adsorption pressure processing module is connected to the adsorption instruction output module and the adsorption data output module, the output end of the dynamic pressure processing module is connected to the dynamic balance compensation module, and the output end of the dynamic balance compensation module is connected to the adsorption instruction output module signal;

[0043] The input end of the data receiving module is respectively connected to the adsorption pressure acquisition unit, the adsorption parameter acquisition unit and the test data acquisition unit, the output end of the adsorption instruction output module is connected to the adsorption pressure control unit, and the output end of the adsorption data output module is connected to the adsorption data output unit. Through the setting of the dual processing modules of the adsorption pressure processing module and the dynamic pressure processing module, it is possible to ensure that the negative pressure suction cup 5 maintains the stability of adsorption of the laser chip while also achieving the function of dynamically compensating the adsorption pressure of the negative pressure suction cup 5, thereby promoting the environmental adaptability of the negative pressure suction cup 5, avoiding changes in the adsorption pressure of the negative pressure suction cup 5 due to temperature changes, effectively ensuring the stability of the negative pressure suction cup 5 in clamping the laser chip, and ensuring the data validity during the laser chip testing process.

[0044] Figure 1 and Figure 2 It is shown that the output end of the adsorption balance processing unit is also connected to an abnormal marking unit and an abnormal warning unit. The output end of the abnormal marking unit is connected to the adsorption data output unit signal, and the output end of the abnormal warning unit is connected to the alarm signal set on the device body 1. The abnormal marking unit and the abnormal warning unit can mark, display and remind the abnormal data of the negative pressure suction cup 5, which can promote the emergency response rate of the staff, timely maintain and repair the negative pressure suction cup 5, process the test process according to the data, and ensure the safety of the test process.

[0045] Figure 1 - Fig.13It is shown that after the adsorption balance auxiliary system is installed in the device body 1 and the negative pressure suction cup 5 is installed, the technician first inputs parameter settings to the adsorption parameter acquisition unit through the control panel on the device body 1 according to the application specifications and test range of the device body 1. The parameters include but are not limited to the standard adsorption pressure of the suction cup groove group 51, which can be set to a level to meet the application of laser chips of different specifications, the adjustable range of adsorption pressure, the adsorption pressure compensation direction, the relevant specification data of the negative pressure suction cup 5, and then the adsorption parameter acquisition unit transmits the received parameters to the data receiving module in the adsorption balance processing unit. After the data receiving module classifies and processes each parameter, it transmits the data to the adsorption pressure processing module and the dynamic pressure processing module respectively. Then the technician also connects the adsorption balance auxiliary system to the data acquisition system in the device body 1, so that the test data acquisition unit can collect the test status, control instructions and test temperature of the device body 1 through the data acquisition system, and the test data acquisition unit transmits the collected test data to the data receiving module in the adsorption balance processing unit. After the data receiving module classifies and processes each parameter, it transmits the data to the adsorption pressure processing module and the dynamic pressure processing module respectively. Due to the coordinated cooperation of the dual processing modules, the adsorption pressure processing module processes, controls and outputs the specified adsorption pressure of the negative pressure suction cup 5 and subsequent related temperature data, pressure data, displacement data and other data. The dynamic pressure processing module mainly processes the specified adsorption pressure of the negative pressure suction cup 5 and the pressure change dynamics and temperature data during the test, so as to ensure the effectiveness of the adsorption of the negative pressure suction cup 5. While reducing the data processing burden, it effectively improves the data processing rate and accuracy, and improves the timeliness and effectiveness of the dynamic balance adjustment of the adsorption pressure.

[0046] During the application test of the device body 1, the staff or the manipulator places the laser chip on the upper end of the negative pressure suction cup 5, and reserves the insertion position of the laser chip according to the position of the gold finger on the laser chip. Then the staff closes the door of the device body 1, and starts the test program of the device body 1 through the control panel, and specifies the adsorption pressure of the negative pressure suction cup 5. Then the adsorption parameter acquisition unit transmits the data to the data receiving module in the adsorption balance processing unit. The data receiving module converts the received command adsorption pressure data and transmits them to the adsorption pressure processing module and the dynamic pressure processing module respectively. The adsorption pressure processing module sends adsorption control data to the adsorption command output module according to the data. The adsorption command output module controls the action of the adsorption pressure control unit, controls the adsorption pump and the corresponding control valve group, so that the adsorption pump can produce negative pressure adsorption at the joint of the suction cup groove group 51 and the laser chip through the cooperation of the adsorption pipeline 6, the negative pressure cavity 53 and the negative pressure hole 52, so as to realize the adsorption and clamping effect of the negative pressure suction cup 5 on the laser chip. Then the optical measurement system of the device body 1 controls the electric slide rail 33 to work, and the electric The moving distance of the negative pressure suction cup 5 driven by the slide 33 through the slide 34 is set by the program. After the staff selects the test program according to the specifications of the laser chip, the optical measurement system will control the electric slide 33 to adjust the slide 34 to produce the set moving distance according to the set test degree, drive the slide 34 to slide in the test drive slot 31, so that the negative pressure suction cup 5 drives the laser chip to move into the test channel 2 under the push of the slide 34, and makes the gold finger position of the laser chip plugged into the test driver 4 until the laser chip and the test driver 4 are plugged in and stop, and then start the channel door drive structure 21 to drive the channel door 22 to move downward to close the test channel 2. After the test channel 2 is closed, the optical measurement system controls the test driver 4 to take effect and test the performance of the laser chip. Then the temperature control device controls the temperature in the test channel 2 to change and test the performance of the laser chip at different temperatures. The data acquisition system collects the temperature data, laser data and electrical signal data of the test driver 4 in the test channel 2, and analyzes and judges the performance of the laser chip.

[0047] During the test of the laser chip by the device body 1, due to the change of the test temperature in the test channel 2, when the temperature drops, the air pressure in the negative pressure chamber 53 will be pressurized due to the low temperature, and then the pressure probe will transmit the pressure data at this time to the adsorption pressure acquisition unit, and the adsorption pressure acquisition unit will transmit the data to the data receiving module in the adsorption balance processing unit. The data receiving module converts the data and transmits it to the dynamic pressure processing module. The dynamic pressure processing module processes the pressure at this time and the originally specified adsorption pressure. When it is judged that the pressure difference data is large, the pressure difference data is transmitted to the dynamic balance compensation module. The dynamic balance compensation module calculates the compensation for the adsorption pressure adjustment according to the pressure difference data at this time, and then transmits the compensation data to the adsorption instruction output module. The adsorption instruction output module controls the action of the adsorption pressure control unit according to the compensation data at this time, so that the adsorption pump and the control valve produce a pressure relief action, thereby reducing the adsorption pressure of the negative pressure suction cup 5 on the laser chip at this time, avoiding the deformation of the laser chip due to excessive adsorption pressure, thereby effectively ensuring the stability of the clamping force, ensuring the stability of the laser chip, reducing the test error, and improving the test accuracy.

[0048] During the test of the laser chip by the device body 1, due to the change of the test temperature in the test channel 2, when the temperature rises, the air pressure in the negative pressure chamber 53 will produce a depressurization effect due to the high temperature, and then the pressure probe will transmit the pressure data at this time to the adsorption pressure acquisition unit, and the adsorption pressure acquisition unit will transmit the data to the data receiving module in the adsorption balance processing unit. The data receiving module will convert the data and transmit it to the dynamic pressure processing module. The dynamic pressure processing module processes the pressure at this time and the originally specified adsorption pressure. When it is judged that the pressure difference data is large, the pressure difference data is transmitted to the dynamic balance compensation module. The dynamic balance compensation module calculates the compensation for the adsorption pressure adjustment according to the pressure difference data at this time, and then transmits the compensation data to the adsorption instruction output module. The adsorption instruction output module controls the action of the adsorption pressure control unit according to the compensation data at this time, so that the adsorption pump and the control valve produce a pressurization action, thereby increasing the adsorption pressure of the negative pressure suction cup 5 on the laser chip at this time, avoiding the unstable adsorption of the laser chip due to too small adsorption pressure, and avoiding the abnormal test caused by vibration caused by loose clamping of the chip laser chip, thereby effectively ensuring the stability of the laser chip, reducing the test error, and improving the test accuracy.

[0049] In the process of continuous dynamic balance of adsorption pressure, the data receiving module will receive the pressure data transmitted by the adsorption pressure acquisition unit and the test data transmitted by the test data acquisition unit, and the data receiving module will transmit these data to the adsorption pressure processing module. After the adsorption pressure data module analyzes and processes these data, it outputs the adsorption data to the adsorption data output unit through the adsorption data output module, so that the adsorption data output unit displays the adsorption status of the negative pressure suction cup 5 on the laser chip during the test through the control panel, and after the adsorption pressure processing module collects the pressure fluctuation data, it analyzes and processes its fluctuation changes. If the pressure data keeps increasing or decreasing continuously after the temperature in the test channel 2 drops or rises, and there is no recovery trend, that is, in the two If the adsorption pressure data in the compensation cycle still does not show a trend of recovering the specified adsorption pressure, it is judged that the adsorption pressure of the negative pressure suction cup 5 is in an abnormal state at this time, and then the abnormal signal is transmitted to the abnormal warning unit through the adsorption data output module, and the abnormal data is transmitted to the abnormal marking unit, so that the abnormal warning unit activates the alarm to remind the staff of the abnormal condition, and the abnormal marking unit sends an abnormal data mark to the adsorption data output unit, and marks and displays the original output data, so that the staff can observe the abnormal state and related abnormal data of the negative pressure suction cup 5 in time through the display of the control panel, so that the staff can judge the state of the negative pressure suction cup 5 at this time, and make appropriate emergency response according to the data of the negative pressure suction cup 5, so as to ensure the safety of the test process and the validity of the test data.

[0050] It should be noted that the test driver 4, optical measurement system, temperature control device and data acquisition system arranged in the device body 1 are all existing technologies. This embodiment is a direct reference and no changes are made to their structures and principles. The test driver 4 is used to provide power and signal drive to activate the laser chip; the optical measurement system is mainly used to detect and record the light intensity, wavelength and other parameters output by the laser and to control the movement of the test channel 2 and the electric slide rail 33; the temperature control device is used to control the temperature of the laser chip during operation to ensure a stable test environment; the data acquisition system is used to record and analyze test results, evaluate the performance and stability of the laser chip, and cooperate with the adsorption balance auxiliary system to achieve the stability of the negative pressure suction cup 5 clamping the laser chip.

[0051] Second implementation method:

[0052] Figure 1 - Fig.13 It is shown that the right end of the test channel 2 is fixedly connected with an abutting induction plate 7 that matches the test platform 3, the upper end of the abutting induction plate 7 is fixedly installed with a test driver 4, and the left ends of the abutting induction plate 7 and the test driver 4 both extend into the test channel 2;

[0053] A pair of sensing grooves 71 are provided at the left end of the abutting sensing plate 7, and an elastic pressure-sensitive column 72 is embedded in the right inner wall of the sensing groove 71. A pair of sensing plug plates 54 matching the sensing groove 71 are fixedly connected to the right end of the negative pressure suction cup 5. A trigger cavity is provided in the elastic pressure-sensitive column 72, and a supporting spring is fixedly connected between the left and right inner walls of the trigger cavity. The left and right inner walls of the trigger cavity are fixedly connected with trigger columns arranged on the inner side of the supporting spring. The input end of the adsorption balance processing unit is also connected to a test position sensing unit, and the input end of the test position sensing unit is connected to the trigger column signal. Through the cooperation of the sensing plug plate 54 and the elastic pressure-sensitive column 72, the automatic plugging effect of the negative pressure suction cup 5 on the laser chip is effectively realized. While promoting the automated development of the test process of the device body 1, it can also ensure the stability of the plugging force, improve the plugging accuracy of the laser chip and the test driver 4, and thus ensure the effectiveness of subsequent tests.

[0054] Figure 2 and Figure 4 - Fig.11 It is shown that the upper and lower inner walls of the sensing groove 71 are fixedly connected with a balance sensing package 73 that cooperates with the sensing plug plate 54, and the upper and lower inner walls of the balance sensing package 73 are fixedly connected with abutment guide pillars, and the abutment guide pillars are set to the left side, and the input end of the adsorption balance processing unit is connected with the deformation collection unit, and the input end of the deformation collection unit is connected with the abutment guide pillar signal. Through the setting of the balance sensing package 73 and the deformation collection unit, the deformation data generated by the negative pressure suction cup 5 during the temperature change process can be effectively collected, which assists the device body 1 or the staff to judge the error, and further improves the test accuracy of the device body 1.

[0055] Figure 1 - Fig.13It is shown that after the electric slide rail 33 drives the slide seat 34 to drive the negative pressure suction cup 5 into the test channel 2 and the laser chip and the test driver 4 are plugged in, the sensing plug plate 54 will be inserted into the sensing slot 71 and squeeze the elastic pressure-sensitive column 72, causing the elastic pressure-sensitive column 72 to produce an extrusion deformation, causing the supporting spring inside it to contract, and after the trigger columns on the left and right inner walls abut, a trigger signal is sent to the test position sensing unit, and the test position sensing unit transmits the trigger signal to the data receiving module of the adsorption balance processing unit, and the data receiving module converts the data and transmits it to the adsorption pressure processing module. In the subsequent test channel 2 closed test process, the trigger column is in a constant abutment state. If the trigger column does not abut, that is, the test position sensing unit stops transmitting the trigger signal to the data receiving module, the adsorption pressure is at After the trigger signal received by the management module disappears, and at this time the test data acquisition unit still transmits to the data receiving module that the laser chip is in the performance test stage, it is judged that the negative pressure suction cup 5 at this time has an abnormality, and then the abnormal signal is transmitted to the abnormal warning unit through the adsorption data output module, and the abnormal data is transmitted to the abnormal marking unit, so that the abnormal warning unit activates the alarm to remind the staff of the abnormal condition, and the abnormal marking unit sends an abnormal data mark to the adsorption data output unit, and marks and displays the original output data, so that the staff can observe the abnormal state and related abnormal data of the negative pressure suction cup 5 in time through the display of the control panel, so that the staff can judge the state of the negative pressure suction cup 5 at this time, and can make appropriate emergency response according to the data of the negative pressure suction cup 5, so as to ensure the safety of the test process and the validity of the test data.

[0056] After the sensing plug plate 54 is inserted into the sensing slot 71, the balance sensing package 73 will detect the flatness of the negative pressure suction cup 5. If abutment occurs on one side, an abutment signal will be generated. The deformation acquisition unit will transmit the abutment signal to the data receiving module in the adsorption balance processing unit. The data receiving module will transmit the signal to the adsorption pressure processing module. The adsorption pressure processing module will determine that the negative pressure suction cup 5 has a deformation abnormality at this time according to the abutment signal, and then transmit the abnormal signal to the abnormal warning unit through the adsorption data output module. The abnormal data is transmitted to the abnormal marking unit, so that the abnormal warning unit activates the alarm to remind the staff of the abnormal situation. The abnormal marking unit sends an abnormal data mark to the adsorption data output unit, and marks and displays the original output data, so that the staff can observe the abnormal state and related abnormal data of the negative pressure suction cup 5 in time through the display of the control panel, so that the staff can judge the state of the negative pressure suction cup 5 at this time, and can make appropriate emergency response according to the data of the negative pressure suction cup 5 to ensure the safety of the test process and the validity of the test data.

[0057] It should be noted that the elastic pressure-sensing column 72, balance sensing package 73, test position sensing unit and deformation acquisition unit in this embodiment are all optional. The installation of the structure and the expansion of the system are selected according to the testing requirements and accuracy requirements of the device body 1 to improve the economic adaptability of the device body 1 and meet different market demands.

[0058] The third implementation method:

[0059] Figure 1 - Fig.14 It is shown that the suction cup groove group 51 is composed of multiple independent concentric grooves, and a single negative pressure cavity 53 cooperates with the single concentric groove. The multiple negative pressure cavities 53 located at the lower end of the same suction cup groove group 51 can be set in different depths to achieve independent control of the multiple concentric grooves. Through the cooperation of multiple independent concentric grooves and negative pressure cavities 53, the use scope of the negative pressure suction cup 5 can be expanded, which is suitable for testing laser chips of different specifications, thereby ensuring the effectiveness of the adsorption and clamping of the negative pressure suction cup 5.

[0060] Figure 2 and Fig.14 It is shown that photosensitive probes 8 are fixedly connected to the four corners of the upper end of the suction cup groove group 51, and the input end of the adsorption balance processing unit is also connected to a photosensitive position acquisition unit. The input end of the photosensitive position acquisition unit is connected to the photosensitive probe 8 signal. Through the cooperation of the photosensitive probe 8 and the photosensitive position acquisition unit, the intelligence level of the device body 1 is further promoted, and the coverage position of the laser chip can be judged according to the feedback data of the photosensitive probe 8, so as to realize the control effect on different concentric circle grooves and ensure the effectiveness of the negative pressure suction cup 5 in adsorbing the laser chip.

[0061] Figure 1 - Fig.13It is shown that after the staff or the manipulator places the laser chip on the negative pressure suction cup 5 in a specified manner, the laser chip will block the light source of the photosensitive probe 8 located at the lower end thereof. At this time, the photosensitive probe 8 whose light source is blocked will transmit the photosensitive data to the photosensitive position acquisition unit, and the photosensitive position acquisition unit transmits the data to the data receiving module. The data receiving module converts the data and transmits it to the adsorption pressure processing module. The adsorption pressure processing module determines the specifications of the laser chip at this time according to the photosensitive data of the photosensitive probe 8, and then generates a negative pressure adsorption effect on the concentric circle grooves located in the outermost circle with the photosensitive probes 8 at the four corners blocked, and transmits the adsorption control data at this time to the adsorption instruction output module. The adsorption instruction output module sends a control instruction to the adsorption pressure control unit according to the adsorption control data, so that the adsorption pressure control unit controls the control valve group at the corresponding position to open, and starts the adsorption pump, and performs a negative pressure adsorption control effect on the concentric circle grooves and the laser chip through the connection of the adsorption pipeline 6, the negative pressure cavity 53, and the negative pressure hole 52, effectively improving the automation and intelligence of the device body 1 and promoting the test efficiency of the device body 1.

[0062] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A laser chip testing device, characterized in that: The invention comprises a device body (1), wherein a plurality of test channels (2) are arranged in the device body (1), a test platform (3) is fixedly installed on the lower inner wall of the test channel (2), and the left end of the test platform (3) extends to the outside of the test channel (2), the upper end of the test platform (3) is provided with a test drive slot (31) and a test slot (32) located on the right side of the test drive slot (31) and connected to the test drive slot (31), the front and rear inner walls of the test drive slot (31) are both provided with electric slide rails (33), and the A slide seat (34) is slidably mounted on the electric slide rail (33); a negative pressure suction cup (5) is fixedly connected to the right end of the slide seat (34); a plurality of suction cup groove groups (51) are provided at the upper end of the negative pressure suction cup (5); a plurality of negative pressure cavities (53) are provided in the negative pressure suction cup (5); a plurality of negative pressure holes (52) connected to the negative pressure cavities (53) at corresponding positions are provided on the lower inner wall of the suction cup groove group (51); a plurality of adsorption pipelines (6) connected to the negative pressure cavities (53) are fixedly connected to the left end of the negative pressure suction cup (5); The device body (1) is equipped with an adsorption balance auxiliary system that cooperates with the negative pressure suction cup (5), and the adsorption balance auxiliary system comprises an adsorption balance processing unit, the input end of the adsorption balance processing unit is connected to an adsorption pressure acquisition unit, an adsorption parameter acquisition unit and a test data acquisition unit, and the output end of the adsorption balance processing unit is connected to an adsorption pressure control unit and an adsorption data output unit; The input end of the adsorption pressure acquisition unit is signal-connected to a pressure probe disposed in the negative pressure chamber (53); the input end of the adsorption parameter acquisition unit is signal-connected to a control panel disposed at the front end of the device body (1); the input end of the test data acquisition unit is signal-connected to a data acquisition system disposed in the device body (1); the output end of the adsorption pressure control unit is signal-connected to an adsorption pump and a control valve group disposed at the rear end of the device body (1) and connected to the adsorption pipeline (6); and the output end of the adsorption data output unit is signal-connected to a control panel disposed at the front end of the device body (1); The adsorption balance processing unit includes a data receiving module, the output end of the data receiving module is connected to an adsorption pressure processing module and a dynamic pressure processing module, the output end of the adsorption pressure processing module is connected to an adsorption instruction output module and an adsorption data output module, the output end of the dynamic pressure processing module is connected to a dynamic balance compensation module, and the output end of the dynamic balance compensation module is connected to the adsorption instruction output module signal; The input end of the data receiving module is respectively connected to the adsorption pressure acquisition unit, the adsorption parameter acquisition unit and the test data acquisition unit, the output end of the adsorption instruction output module is connected to the adsorption pressure regulation unit, and the output end of the adsorption data output module is connected to the adsorption data output unit.

2. A laser chip testing device according to claim 1, characterized in that: Photosensitive probes (8) are fixedly connected at the four corners of the upper end of the suction cup groove group (51), and the input end of the adsorption balance processing unit is also connected to a photosensitive position acquisition unit, and the input end of the photosensitive position acquisition unit is connected to the photosensitive probe (8) for signal connection.

3. A laser chip testing device according to claim 1, characterized in that: The right end of the test channel (2) is fixedly connected to an abutting induction plate (7) that matches the test platform (3), the upper end of the abutting induction plate (7) is fixedly mounted with a test driver (4), and the left ends of the abutting induction plate (7) and the test driver (4) both extend into the test channel (2); A pair of sensing grooves (71) are provided at the left end of the abutting sensing plate (7), and an elastic pressure-sensitive column (72) is embedded in the right inner wall of the sensing groove (71). A pair of sensing plug plates (54) matching the sensing grooves (71) are fixedly connected to the right end of the negative pressure suction cup (5), and a trigger cavity is provided in the elastic pressure-sensitive column (72). A support spring is fixedly connected between the left and right inner walls of the trigger cavity, and the left and right inner walls of the trigger cavity are fixedly connected to trigger columns arranged on the inner side of the support spring. The input end of the adsorption balance processing unit is also connected to a test position sensing unit, and the input end of the test position sensing unit is connected to the trigger column signal.

4. A laser chip testing device according to claim 3, characterized in that: The upper and lower inner walls of the sensing groove (71) are fixedly connected with a balance sensing package (73) that matches the sensing plug plate (54), the upper and lower inner walls of the balance sensing package (73) are fixedly connected with abutment guide pillars, the input end of the adsorption balance processing unit is connected with a deformation collection unit, and the input end of the deformation collection unit is connected to the abutment guide pillar signal.

5. The laser chip testing device according to claim 1, characterized in that: A channel door driving structure (21) is fixedly mounted on the upper end of the test channel (2), a channel door (22) is fixedly connected to the lower end of the channel door driving structure (21), and the lower end of the channel door (22) extends into the test channel (2) and is in sliding engagement with the test channel (2).

6. The laser chip testing device according to claim 1, characterized in that: The suction cup groove group (51) is composed of a plurality of independent concentric circle grooves, and a single negative pressure cavity (53) cooperates with the single concentric circle groove.

7. The laser chip testing device according to claim 1, characterized in that: The output end of the adsorption balance processing unit is also connected to an abnormal marking unit and an abnormal warning unit. The output end of the abnormal marking unit is connected to the adsorption data output unit signal. The output end of the abnormal warning unit is connected to the alarm signal provided on the device body (1).

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