A power electronic component testing system and testing method

Abstract

The present invention belongs to the field of electronic component performance testing, and is a power electronic component testing system and a testing method. The testing system comprises a test bracket, a heat sink arranged in the test bracket, and a clamping device arranged on the heat sink for mounting the electronic component. The clamping device comprises a positioning plate arranged on the heat sink, two test boards arranged relatively on the positioning plate, a mounting area formed between two adjacent test boards for mounting the electronic component, a thermocouple arranged on one test board and extending upward to contact and connect with the electronic component in the mounting area, two connecting mechanisms respectively arranged on the two test boards to contact and connect the power supply with two leads of the electronic component, a first fixing mechanism to fix the electronic component in the mounting area, and two second fixing mechanisms to contact and connect the two leads with the two connecting mechanisms respectively. The present application specifically defines the structure of the clamping device, and one or more electronic components are clamped, and life and power tests can be performed without welding.

Description

Technical Field

[0001] The invention belongs to the field of electronic component performance testing, and in particular relates to a power electronic component testing system and a testing method. Background Art

[0002] Power electronic components are indispensable key components in modern electronic equipment. Due to their advantages such as miniaturization and high power, they are widely used in aerospace, aviation, radar, microwave communications and other fields.

[0003] The life test conditions of power electronic components are carried out according to the provisions of Method 108 of GJB360B-2009. The test requires that the power electronic components should be installed horizontally on a heat sink of appropriate size to meet the requirements of the specification when the product is working under DC or AC voltage at full load rated power consumption. The heat dissipation method can be divided into air cooling and water cooling. The choice of heat sink mainly depends on the power size of the product and the customer's usage.

[0004] The power reliability test of power electronic components requires that the flange base be heated from 25°C to 100°C, and the product be immediately powered on for 3s and powered off for 3s. After 10 sets of pulse tests, the heating power is cut off to cool it to 25°C, and multiple cycle tests are performed according to the standard. After the test, the flange base of the sample must be kept at 100~105°C, and 1.5 times the rated power must be added for continuous testing to reach the target duration.

[0005] Due to the harsh product test conditions, in addition to applying power, it is also necessary to consider the product flange temperature measurement, product heat dissipation, and continuous stable heating conditions. Among them, the life test needs to consider the environmental requirements and product status under long-term working conditions. The product cannot be damaged during the test, and the next test can be continued after the test.

[0006] At present, the commonly used method is to solder the product on the carrier by reflow soldering, and then attach the carrier to the heat sink by silicone grease. This method cannot test multiple products at the same time. The manual and reflow soldering methods are time-consuming and labor-intensive with low work efficiency. One product corresponds to one carrier, which wastes resources. In addition, the product cannot be reused after testing due to the welding installation method, which needs further improvement. Summary of the invention

[0007] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a power electronic component testing system and a testing method.

[0008] The present invention adopts the following technical solution:

[0009] A power electronic component testing system, wherein the electronic component comprises an electronic component body and two leads arranged on the electronic component body relatively, a test bracket, a heat sink arranged in the test bracket and a clamping device arranged on the heat sink for mounting the electronic component.

[0010] The clamping device includes a positioning plate arranged on a heat dissipation device, two test boards arranged relatively to the positioning plate, a mounting area formed between two adjacent test boards for mounting electronic components, a thermocouple arranged on one test board and extending upward to contact and connect with the electronic components in the mounting area, two connecting mechanisms respectively arranged on the two test boards to contact and connect a power source with two leads of the electronic components, a first fixing mechanism to fix the electronic components in the mounting area, and two second fixing mechanisms to contact and connect the two leads with the two connecting mechanisms respectively.

[0011] Furthermore, a plurality of electronic components are installed at intervals in the installation area, a plurality of thermocouples are provided, and the plurality of thermocouples are respectively in contact with and connected to the plurality of electronic components.

[0012] Furthermore, the first fixing mechanism includes a first fixing pressure strip extending along the arrangement direction of the multiple electronic components, a plurality of first elastic insulating pressure columns arranged on the opposite surfaces of the first fixing pressure strip and the positioning plate and respectively opposite to the multiple thermocouples, two first clearance holes respectively arranged at both ends of the first fixing pressure strip and extending along the arrangement direction of the multiple electronic components, two first fixing screw holes respectively arranged on the positioning plate and opposite to the two first clearance holes, and two first locking bolts respectively passing through the two first clearance holes and cooperating with the relative first fixing screw holes.

[0013] Furthermore, the connection mechanism includes a power connector arranged on the test board, a main conductor arranged on the test board and connected to the power connector, and a plurality of branch conductors arranged at intervals on the main conductor and respectively corresponding to a plurality of electronic components.

[0014] Furthermore, the two second fixing mechanisms are respectively arranged on both sides of the first fixing mechanism, and the second fixing mechanisms include a second fixing strip extending along the arrangement direction of the multiple electronic components, a plurality of second elastic insulating pressure columns arranged on the opposite surface of the second fixing strip and the positioning plate and can be respectively opposite to the leads of the multiple electronic components, two second clearance holes respectively arranged at both ends of the second fixing strip, two second fixing screw holes extending downward from the test board to the positioning plate and respectively opposite to the two second clearance holes, and two second locking bolts respectively passing through the two second clearance holes and cooperating with the relative second fixing screw holes.

[0015] Furthermore, the thermocouple includes a thermocouple body and a connecting wire connected to the thermocouple body, and the test board is provided with a threading hole extending upward from its lower end, and one end of the connecting wire extends upward through the threading hole to contact and connect with the relative electronic component.

[0016] Furthermore, the test bracket is provided with a mounting seat for installing a heat dissipation device, the heat dissipation device includes a heat dissipation seat detachably connected to the mounting seat and a heat dissipation mechanism cooperating with the heat dissipation seat, and the positioning plate is detachably connected to the heat dissipation seat.

[0017] Furthermore, the heat dissipation mechanism is a heat dissipation fan arranged opposite to the test bracket and the heat dissipation seat or a water cooling component arranged in the heat dissipation seat, and the water cooling component includes a circulating water circuit meandering in the heat dissipation seat and a water inlet joint and a water outlet interface arranged on the heat dissipation seat and connected to both ends of the circulating water circuit respectively.

[0018] Furthermore, a plurality of first limit strips are arranged at intervals on the heat sink, and a first limit groove cooperating with the plurality of first limit strips is formed on the opposite surface of the positioning plate and the heat sink, and the first limit strip includes a first connecting section arranged on the heat sink and a first limit section arranged in an irregular shape on the first connecting section.

[0019] A method for testing the life of an electronic component is based on any of the above-mentioned test systems and the specific steps are as follows:

[0020] After applying thermal conductive silicone grease on the bottom of the electronic component, place it in the installation area, and make the two leads on both sides of the electronic component overlap the two connecting mechanisms on the two test boards respectively; then fix the electronic component installed in the installation area by the first fixing mechanism, and make the thermocouple contact and connect with the electronic component; then fix the leads on the opposite connecting mechanism by the second fixing mechanism, and complete the installation of the electronic component;

[0021] When testing the life of electronic components, the power supply is controlled to operate so that the electronic components operate under a DC or AC voltage with full load rated power consumption, and corresponding tests are performed. During the test, when the electronic components need to be cooled, the heat dissipation device is controlled to operate.

[0022] From the above description of the present invention, it can be seen that compared with the prior art, the beneficial effects of the present invention are as follows: the present application limits the structural composition of the test system and specifically limits the structure of the clamping device to clamp one or more electronic components, and can perform life tests and power tests without welding, thereby effectively improving work efficiency. The overall structure is simple and easy to disassemble and assemble, which effectively reduces damage to electronic components during the test process, so that the tested electronic components can be reused. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is the structural diagram of the test system;

[0024] Figure 2 Schematic diagram of part of the test system structure Figure 1 ;

[0025] Figure 3 Schematic diagram of part of the test system structure Figure 2 ;

[0026] Figure 4 Schematic diagram of part of the test system structure Figure 3 ;

[0027] Figure 5 for Figure 3 A partial structural enlarged schematic diagram;

[0028] Figure 6 for Figure 4 A partial structural enlarged schematic diagram;

[0029] Figure 7 It is a schematic diagram of the structure of the water cooling component;

[0030] In the figure, 1-test bracket, 2-heat dissipation device, 3-clamping device, 4-electronic component, 11-mounting seat, 111-second limiting strip, 13-test cavity, 14-fixing plate, 21-heat dissipation seat, 22-cooling fan, 23-circulating water circuit, 24-water inlet joint, 25-water outlet joint, 26-first limiting strip, 261-first connecting section, 262-first limiting section, 27-second limiting groove, 31-positioning plate, 311-first limiting groove, 32-test board, 33-installation area, 34-thermocouple, 341-connecting wire, 3 5-connecting mechanism, 351-power connector, 352-main conductor, 353-branch conductor, 36-first fixing mechanism, 361-first fixing pressure strip, 362-first elastic insulating pressure column, 363-first clearance hole, 364-first fixing screw hole, 365-first locking bolt, 37-second fixing mechanism, 371-second fixing pressure strip, 372-second elastic insulating pressure column, 373-second clearance hole, 374-second fixing screw hole, 375-second locking bolt, 41-electronic component body, 42-lead, 43-connecting flange. DETAILED DESCRIPTION

[0031] The present invention is further described below through specific implementation modes.

[0032] Reference Figures 1 to 7 As shown, a power electronic component testing system comprises a test bracket 1, a heat sink 2 arranged in the test bracket 1, and a clamping device 3 arranged on the heat sink 2 for mounting an electronic component 4.

[0033] The electronic component 4 includes an electronic component body 41 and two leads 42 arranged opposite to each other on the electronic component body 41 . Specifically, a connecting flange 43 is arranged at the bottom of the electronic component body 41 .

[0034] The test bracket 1 is provided with a mounting seat 11 for mounting the heat dissipation device 2 .

[0035] The clamping device 3 includes a positioning plate 31 arranged on the heat dissipation device 2, two test boards 32 arranged relatively on the positioning plate 31, a mounting area 33 formed between two adjacent test boards 32 for mounting the electronic component 4, a thermocouple 34 arranged on one test board 32 and extending upward to contact and connect with the electronic component 4 in the mounting area 33, two connecting mechanisms 35 respectively arranged on the two test boards 32 and contact and connect with two leads 42 of the electronic component, a first fixing mechanism 36 for fixing the electronic component in the mounting area 33, and two second fixing mechanisms 37 for making the two leads 32 contact and connect with the two connecting mechanisms 35 respectively.

[0036] The mounting area 33 is provided with a plurality of electronic components 4 installed at intervals. During testing, the electronic components 4 are clamped in the mounting area 33 so that the leads 42 at both ends thereof are respectively overlapped on the relative connection mechanisms 35 .

[0037] There are multiple thermocouples 34, and the multiple thermocouples 34 are respectively in contact and connected with multiple electronic components 4. Specifically, the thermocouple 34 includes a thermocouple body and a connecting wire 341 connected to the thermocouple body. Correspondingly, the test board 32 is provided with a threading hole extending upward from its lower end, and one end of the connecting wire 341 extends upward through the threading hole to contact and connect with the relative electronic component 4.

[0038] The connecting mechanism 35 includes a power connector 351 arranged on the test board 32, a main conductor 352 arranged on the test board 32 and connected to the power connector 351, and a plurality of branch conductors 353 arranged at intervals on the main conductor 352 and respectively corresponding to a plurality of electronic components 4; when the electronic component 4 is tested, the leads 42 at both ends thereof are respectively overlapped on two corresponding branch conductors 353.

[0039] The first fixing mechanism 36 comprises a first fixing pressure strip 361 extending along the arrangement direction of the plurality of electronic components 4, a plurality of first elastic insulating pressure columns 362 arranged on the opposite surface of the first fixing pressure strip 361 and the positioning plate 31 and respectively corresponding to the plurality of thermocouples 34, two first clearance holes 363 respectively arranged at both ends of the first fixing pressure strip 361 and extending along the arrangement direction of the plurality of electronic components 4, two first fixing screw holes 364 respectively arranged on the positioning plate 31 and corresponding to the two first clearance holes 363, and two first locking bolts 365 respectively passing through the two first clearance holes 363 and matching with the corresponding first fixing screw holes 364; the first elastic insulating pressure column 362 can keep the connecting wire 34 of the corresponding thermocouple 34 in stable contact with the electronic component 4, so as to detect the temperature change of the corresponding electronic component 4 in real time; Among them, a first strip-shaped first clearance hole 363 is set on the first fixed pressure strip 361, so that the position of the first fixed pressure strip 361 can be adjusted according to the electronic components 4 of different sizes, so that the multiple first elastic insulating pressure columns 362 are opposite to the multiple electronic components 4; when the electronic components 4 are clamped, the position of the first fixed pressure strip 361 is adjusted so that the multiple first elastic insulating pressure columns 362 thereon are respectively opposite to the connecting wires 341 of the multiple thermocouples 34, and then the first locking bolt 365 cooperates with the first fixing screw hole 364, so that the first fixed pressure strip 361 is pressed on the electronic component bodies 41 of the multiple electronic components 4, and the multiple first elastic insulating pressure columns 362 are against the relative connecting wires 341, so that the connecting wires 341 are in contact and connected with the electronic components 4, thereby completing the initial fixation of the electronic components 4.

[0040] The two second fixing mechanisms 37 are respectively arranged on both sides of the first fixing mechanism 36. Specifically, the second fixing mechanism 37 includes a second fixing pressure strip 371 extending along the arrangement direction of the plurality of electronic components 4, a plurality of second elastic insulating pressure columns 372 arranged on the surface of the second fixing pressure strip 371 opposite to the positioning plate 31 and respectively opposite to the plurality of electronic component leads 42, two second clearance holes 373 respectively arranged at both ends of the second fixing pressure strip 371, two second fixing screw holes 374 extending downward from the test plate 32 to the positioning plate 31 and respectively opposite to the two second clearance holes 373, and two second locking bolts 375 respectively passing through the two second clearance holes 373 and cooperating with the second fixing screw holes 374 opposite to each other; further A plurality of second fixing screw holes 374 are provided, and the plurality of second fixing screw holes 374 are arranged at intervals along a direction perpendicular to the arrangement of the plurality of electronic components 4, so as to adjust the distance between the two test boards 32, and then adjust the size of the installation area 33 to adapt to the testing of electronic components 4 of different sizes; when the electronic components 4 are clamped, the position of the second fixing pressure strip 371 is adjusted so that the plurality of second elastic insulating pressure columns 372 are respectively opposite to the one side leads 42 of the plurality of electronic components 4, and then the plurality of second elastic insulating pressure columns 372 are respectively pressed against the relative leads 42 through the cooperation of the second fixing screw holes 374 and the second locking bolts 375, so as to ensure a stable connection between the electronic component leads 42 and the relative connecting mechanism 35.

[0041] The heat dissipation device 2 includes a heat dissipation seat 21 detachably connected to the mounting seat 11 and a heat dissipation mechanism cooperating with the heat dissipation seat 21, wherein the positioning plate 31 is detachably connected to the heat dissipation seat 21; specifically, the heat dissipation mechanism is a heat dissipation fan 22 arranged opposite to the test bracket 1 and the heat dissipation seat 21 or a water-cooling component arranged in the heat dissipation seat 21; further, the test bracket 1 includes two test cavities 13 arranged at intervals. During testing, a wind heat dissipation mechanism or a water-cooled heat dissipation mechanism can be installed in the two test cavities 13 respectively according to the test requirements, or a wind heat dissipation mechanism or a water-cooled heat dissipation mechanism can be installed in the two test cavities at the same time.

[0042] When the heat dissipation mechanism is a heat dissipation fan 22, the clamping device 3 is arranged on the side of the heat dissipation seat 21. At this time, multiple thermocouples 34 are in a vertical state. In order to prevent them from falling off during a long period of life experiment, a fixing plate 14 for fixing the connecting wire 341 is also provided on the lower side of the test bracket 1, and both ends of the fixing plate 14 are fastened to the test bracket 1 by screws.

[0043] When the heat dissipation mechanism is a water cooling assembly, the clamping device 3 is arranged on the top surface of the heat dissipation seat 21, and the water cooling assembly includes a circulating water channel 23 meandering in the heat dissipation seat 21 and a water inlet joint 24 and a water outlet joint 25 arranged on the heat dissipation seat 21 and connected to both ends of the circulating water channel 23 respectively.

[0044] The specific structure of the detachable connection between the positioning plate 31 and the heat sink 21 is as follows: a plurality of first limiting strips 26 are arranged at intervals on the heat sink 21, and a first limiting groove 311 cooperating with the plurality of first limiting strips 26 is formed on the opposite surfaces of the positioning plate 31 and the heat sink 21, and the first limiting strip 26 includes a first connecting section 261 arranged on the heat sink 21 and a first limiting section 262 arranged in an irregular shape on the first connecting section 261, wherein the cross-section of the first limiting section 262 is elliptical, and through the setting of the irregular first limiting section 262, the positioning plate 31 cannot be separated from the heat sink 21 in the positive direction.

[0045] The specific structure of the detachable connection between the heat sink 21 and the mounting seat 11 is as follows: a plurality of second limiting strips 111 are arranged at intervals on the mounting seat 11, and a second limiting groove 27 cooperating with the plurality of second limiting strips 111 is formed on the opposite surfaces of the heat sink 21 and the mounting seat 11, wherein the structure of the second limiting strip 111 is the same as that of the first limiting strip 26 to prevent the heat sink 21 from detaching from the mounting seat 11 in the forward direction.

[0046] A method for testing the life of an electronic component is based on the above-mentioned testing system, and the specific steps are as follows:

[0047] According to the size of the electronic component 4, the distance between the two test boards 32 is adjusted so that the installation area 33 meets the installation requirements of the electronic component 4;

[0048] Apply thermal conductive silicone grease to the bottom of the electronic component connection flange 43, then place and install it in the area 33, and make the two leads 42 on both sides of the electronic component 4 overlap the two opposite branch wires 253 on the two test boards 32 respectively; then use the first fixing mechanism 36 to preliminarily fix the electronic component 4 installed in the installation area 33, and make the thermocouple 34 contact and connect with the electronic component 4; then use the second fixing mechanism 37 to fix the lead 42 on the opposite connection mechanism 35, and complete the installation of the electronic component 4;

[0049] When testing the life of electronic components, the power supply is controlled to operate so that the electronic components 4 operate under a DC or AC voltage with full rated power consumption, and corresponding tests are performed. During the test, when the electronic components 4 need to be cooled, the heat dissipation device 2 is controlled to operate.

[0050] During the test, the parameters and environment in the test process are adjusted according to the test standards specified by the national standard or the enterprise military standard to complete the life or power test of the electronic components; among them, the test standards for life or power are well-known content, and its specific content will not be further elaborated here.

[0051] The present application limits the structural composition of the test system and specifically limits the structure of the clamping device 3 to clamp one or more electronic components 4. Life testing and power testing can be performed without welding, thereby effectively improving work efficiency. The overall structure is simple and easy to assemble and disassemble, effectively reducing damage to electronic components during the test process, so that the tested electronic components can be reused.

[0052] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the application scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A power electronic component testing system, wherein the electronic component comprises an electronic component body and two leads arranged opposite to each other on the electronic component body, characterized in that: The invention comprises a test bracket, a heat dissipation device arranged in the test bracket and a clamping device arranged on the heat dissipation device for mounting electronic components. The clamping device includes a positioning plate arranged on the heat dissipation device, two test plates arranged on the positioning plate opposite to each other, a mounting area formed between two adjacent test plates for mounting electronic components, a thermocouple arranged on one test plate and extending upward to contact and connect with the electronic components in the mounting area, two connecting mechanisms respectively arranged on the two test plates to contact and connect the power supply with two leads of the electronic components, a first fixing mechanism to fix the electronic components in the mounting area, and two second fixing mechanisms to contact and connect the two leads with the two connecting mechanisms respectively; The installation area is provided with a plurality of electronic components at intervals, and a plurality of thermocouples are provided, and the plurality of thermocouples are respectively in contact with and connected to the plurality of electronic components; The first fixing mechanism comprises a first fixing pressure strip extending along the arrangement direction of the plurality of electronic components, a plurality of first elastic insulating pressure columns arranged on the opposite surface of the first fixing pressure strip and the positioning plate and respectively corresponding to the plurality of thermocouples, two first clearance holes respectively arranged at both ends of the first fixing pressure strip and extending along the arrangement direction of the plurality of electronic components, two first fixing screw holes respectively arranged on the positioning plate and corresponding to the two first clearance holes, and two first locking bolts respectively passing through the two first clearance holes and cooperating with the corresponding first fixing screw holes; The thermocouple includes a thermocouple body and a connecting wire connected to the thermocouple body. The test board is provided with a threading hole extending upward from its lower end. One end of the connecting wire extends upward through the threading hole to contact and connect with the relative electronic component.

2. A power electronic component testing system according to claim 1, characterized in that: The connection mechanism comprises a power connector arranged on the test board, a main conductor arranged on the test board and connected to the power connector, and a plurality of branch conductors arranged at intervals on the main conductor and respectively corresponding to a plurality of electronic components.

3. A power electronic component testing system according to claim 1, characterized in that: The two second fixing mechanisms are respectively arranged on both sides of the first fixing mechanism, and the second fixing mechanisms include a second fixing pressure strip extending along the arrangement direction of the multiple electronic components, a plurality of second elastic insulating pressure columns arranged on the opposite surface of the second fixing pressure strip and the positioning plate and can be respectively opposite to the leads of the multiple electronic components, two second clearance holes respectively arranged at both ends of the second fixing pressure strip, two second fixing screw holes extending downward from the test board to the positioning plate and respectively opposite to the two second clearance holes, and two second locking bolts respectively passing through the two second clearance holes and cooperating with the opposite second fixing screw holes.

4. A power electronic component testing system according to claim 1, characterized in that: The test bracket is provided with a mounting seat for mounting a heat dissipation device, the heat dissipation device comprises a heat dissipation seat detachably connected to the mounting seat and a heat dissipation mechanism matched with the heat dissipation seat, and the positioning plate is detachably connected to the heat dissipation seat.

5. A power electronic component testing system according to claim 4, characterized in that: The heat dissipation mechanism is a heat dissipation fan arranged opposite to the test bracket and the heat dissipation seat or a water cooling component arranged in the heat dissipation seat. The water cooling component includes a circulating water circuit meandering in the heat dissipation seat and a water inlet joint and a water outlet interface arranged on the heat dissipation seat and connected to both ends of the circulating water circuit respectively.

6. A power electronic component testing system according to claim 4, characterized in that: A plurality of first limiting strips are arranged at intervals on the heat sink, and a first limiting groove cooperating with the plurality of first limiting strips is formed on the opposite surface of the positioning plate and the heat sink, and the first limiting strip includes a first connecting section arranged on the heat sink and a first limiting section arranged in an irregular shape on the first connecting section.

7. A method for testing the life of an electronic component, characterized in that: The test is performed based on the test system according to any one of claims 1 to 6, and the specific steps are as follows: After applying thermal conductive silicone grease on the bottom of the electronic component, place it in the installation area, and make the two leads on both sides of the electronic component overlap the two connecting mechanisms on the two test boards respectively; then fix the electronic component installed in the installation area by the first fixing mechanism, and make the thermocouple contact and connect with the electronic component; then fix the leads on the opposite connecting mechanism by the second fixing mechanism, and complete the installation of the electronic component; When testing the life of electronic components, the power supply is controlled to operate so that the electronic components operate under a DC or AC voltage with full load rated power consumption, and corresponding tests are performed. During the test, when the electronic components need to be cooled, the heat dissipation device is controlled to operate.

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