Chip fixing device for chip processing equipment

Abstract

The present invention discloses a chip fixing device for chip processing equipment, which belongs to the field of chip processing technology, and comprises a carrier platform and a device body, and also comprises: a temperature regulating mechanism, which is used to regulate the temperature of a fixing material laid on a carrying surface of the carrier platform and the temperature of a processing area of ​​the chip during chip processing; a humidity regulating mechanism, which is used to regulate the humidity of an environment in which the fixing material laid on the carrying surface of the carrier platform is located; a positioning component, which is used to position and limit the chip; a control system, which regulates the temperature and humidity of the environment in which the fixing material is located by controlling the temperature regulating mechanism and the humidity regulating mechanism; wherein the temperature regulating mechanism comprises a heater, and also comprises: a cooling component; the present invention can quickly fix the chip on the carrier platform at a temperature and humidity suitable for the fixing material, and can also accurately cool down the local area to be processed during chip processing.

Description

Technical Field

[0001] The invention belongs to the technical field of chip processing, and in particular relates to a chip fixing device for chip processing equipment. Background Art

[0002] Integrated circuits, also known as microcircuits, microchips, and wafers / chips in electronics, are a way of miniaturizing circuits, mainly semiconductor devices, but also passive components, and are often manufactured on the surface of semiconductor wafers.

[0003] Chips are generally fixed and mounted on a carrier surface for processing. Since the performance of the fixing material is affected by the humidity and temperature of the environment, the fixing material needs to be kept under suitable temperature and humidity conditions to quickly limit and fix the chip. At the same time, when processing the chip, a comprehensive cooling method is generally used to cool the chip, which wastes resources.

[0004] A chip fixing device for chip processing equipment is proposed, which can provide suitable temperature and humidity, enable the chip to be quickly fixed on the carrier table through the fixing material, and can accurately cool the local area of ​​the chip processing. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a chip fixing device for chip processing equipment to solve the above problems.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: A chip fixing device for chip processing equipment, comprising a carrier platform and a device body, wherein the carrier platform is installed in the device body, and a sealing cover body for sealing the internal space of the device body is provided on the device body, and further comprising:

[0007] A temperature regulating mechanism is installed on the carrier platform and is used to regulate the temperature of the fixed material laid on the carrier surface of the carrier platform, and to regulate the temperature of the processing area of ​​the chip during chip processing;

[0008] A humidity regulating mechanism is installed on the bearing platform and is used to regulate the humidity of the environment in which the fixed material laid on the bearing surface of the bearing platform is located;

[0009] A positioning component, mounted on the carrier, is used to position and limit the chip;

[0010] The control system adjusts the temperature and humidity of the environment where the fixed material is located by controlling the temperature control mechanism and the humidity control mechanism;

[0011] Wherein, the temperature adjustment mechanism includes a heater, the heater is installed on the inner side of the upper end of the chip, and also includes:

[0012] A cooling component is installed on the bearing platform and is used to cool down the fixed materials laid on the bearing surface of the bearing platform;

[0013] The cooling assembly includes a partition, a first valve component and a first temperature sensor, wherein the partition is arranged in a third cavity opened on the bearing platform and is fixedly connected to the bearing platform, the partition divides the third cavity into a first cooling cavity and a plurality of second cooling cavities distributed in a rectangular shape, the first cooling cavity is connected to the second cooling cavity through a first valve component installed on the partition, a plurality of the first temperature sensors are correspondingly arranged in the second cooling cavity, the first temperature sensor is embedded and fixedly connected to the inner side of the upper end of the bearing platform, and further includes:

[0014] The cooling unit is installed on the bearing platform and is used to introduce the gas cooling material and the liquid cooling material into the first cooling cavity and mix them.

[0015] On the basis of the above technical solution, the present invention also provides the following optional technical solution:

[0016] Further technical solution: the cooling unit includes a cooling cylinder, a cooling pipe and a second piston plate. The two cooling cylinders are symmetrically installed on the supporting platform and are connected to the first cooling cavity through a first atomizing nozzle installed on the inner end. The cooling pipe is rotatably connected to the cooling cylinder. The second piston plate and the cooling cylinder are limited and slide. A pushing column is fixedly connected to the second piston plate and slides with a spiral groove provided on the cooling pipe. The cooling pipe is connected to the second cooling cavity. The second piston plate divides the cavity in the cooling cylinder into an air cavity and a liquid cavity. The cooling pipe is connected to the air cavity through a second valve installed thereon. A gas nozzle is installed at one end of the inner side of the cooling pipe. A stirring fan blade is fixedly connected to the cooling pipe, and the stirring fan blade is located in the liquid cavity.

[0017] Further technical solution: The humidity regulating mechanism includes a first piston plate, a second linear moving part and a nozzle, the first piston plate is arranged in a second cavity opened in the support platform, the second cavity is connected to the first cavity opened in the support platform, the first piston plate and the second cavity are slidably matched, the output end of the second linear moving part located in the second cavity is fixedly connected to the first piston plate, and a third valve part is installed on the second linear moving part, one end of the nozzle extends into the first cavity and is fixedly connected to the support platform, and a second atomizing nozzle is installed at the other end of the nozzle, and the first cavity is filled with a liquid for regulating the humidity in the device body.

[0018] Further technical solution: it also includes a connecting mechanism for connecting the supporting platform and the device body, the connecting mechanism includes a limit cylinder, a piston push plate, a support rod, a first rod body and an electric valve component, the four limit cylinders are distributed in a rectangular shape in the first cavity and are fixedly connected to the supporting platform, the limit cylinder is connected to the first cavity through the electric valve component installed thereon, the support rod is fixedly connected to the piston push plate, the piston push plate is arranged in the limit cylinder and slides with the limit cylinder, the support rod passes through the supporting platform and slides with the supporting platform, a first rod body is fixedly connected between two of the support rods, the first rod body is hinged on the device body, and a second rod body is fixedly connected between the other two support rods, the second rod body slides with a limit slide cylinder fixedly connected to the device body.

[0019] Further technical solution: The positioning assembly includes a first mounting plate, a first linear moving part and a pressure plate, the first mounting plate is fixedly connected to the supporting platform, the pressure plate is fixedly connected to the output end of the first linear moving part, the other end of the first linear moving part is embedded and fixedly connected to the first mounting plate, and the four first mounting plates are distributed in a rectangular shape on the outside of the supporting platform.

[0020] Further technical solution: The control system comprises:

[0021] A monitoring module is used to monitor and obtain humidity information in the device body and temperature information on the bearing surface of the bearing platform;

[0022] A storage module is used to store the data information obtained by the monitoring module and establish a data set;

[0023] The processing module is used to retrieve the temperature information and humidity information at the current moment in the storage module and form judgment information;

[0024] A control module, used for receiving the judgment information and controlling the temperature adjustment mechanism and the humidity adjustment mechanism according to the judgment information;

[0025] Wherein, the monitoring module includes:

[0026] The humidity monitoring unit is installed in the device body and is used to monitor and obtain humidity information in the device body, and is a humidity sensor;

[0027] A temperature monitoring unit is installed on the bearing surface of the bearing platform and is used to monitor and obtain temperature information of the bearing surface, and is a second temperature sensor;

[0028] Wherein, the processing module includes:

[0029] A threshold unit, used to retrieve the humidity information in the device body and the temperature information of the bearing surface of the bearing platform in the storage module at the current moment, and compare the two with the preset humidity threshold and temperature threshold. If at least one of them exceeds the corresponding threshold, judgment information is formed; and

[0030] The analysis unit is used to retrieve the humidity information in the device body at the current moment and the temperature information of the support surface of the support platform in the storage module to form a humidity prediction value and a temperature prediction value, and compare the two formed prediction values ​​with the preset humidity threshold and temperature threshold. If at least one of them exceeds the corresponding threshold, judgment information is formed, the temperature prediction value and the humidity prediction value are associated to form an associated value, and the formed associated value is compared with the preset associated value threshold. If the associated value exceeds the associated value threshold, judgment information is formed.

[0031] Further technical solution: The specific processing method of the analysis unit is:

[0032] S1. Obtain the temperature information and humidity information at the current moment from the data set in the storage module, which are recorded as T1, T2, ..., T i-1 , R1, R2, ..., R i-1 ;

[0033] S2. Predict the temperature information and humidity information at the next moment by linear regression, and obtain the corresponding prediction value T i , R i , and T i , R i Compare with the preset temperature threshold and humidity threshold, and if at least one of them exceeds the corresponding threshold, form judgment information;

[0034] S3. Based on the predicted value, estimate the correlation value of the temperature at the next moment, that is, the temperature at the next moment, and the humidity at the next moment. The calculation method is as follows:

[0035]

[0036] Among them, N is the number of items, T t,i is the temperature at time t, i.e. the temperature at the next moment, R t,i is the humidity at time t, i.e. the next moment;

[0037] S4, comparing the obtained correlation value with a preset correlation value threshold, and if the predicted value is greater than the preset threshold, forming judgment information;

[0038] S5. Transmit the above-formed judgment information to the control module for related module control.

[0039] The present invention provides a chip fixing device for chip processing equipment, which has the following beneficial effects compared with the prior art:

[0040] 1. The humidity regulating mechanism is selectively started according to the humidity information obtained by the control system, and the humidity of the inside of the device body, that is, the environment where the fixed material is located, is adjusted until it is at a suitable humidity for the fixed material. At the same time, the temperature regulating mechanism adjusts the temperature inside the device body and the temperature information of the bearing surface of the carrier according to the temperature information obtained by the control system, that is, when the temperature is too low, the heater is started to increase the temperature inside the device body. When the temperature is too low, the cooling unit introduces the gas cooling substance and the liquid cooling substance into the first cooling cavity and mixes them. At this time, the first valve is opened until the temperature of the bearing surface of the carrier reaches a temperature suitable for the fixed material. At this time, the relevant technicians cover the chip on the fixed material and position it through the positioning component to achieve the technical effect of quickly limiting and fixing the chip. At the same time, when the chip is processed, the first temperature sensor can detect the temperature of the chip processing area. If the temperature of the processing area is too high, the corresponding first valve is opened to introduce the mixed gas cooling substance and liquid cooling substance into the corresponding interior to cool the processing area;

[0041] 2. The relevant technicians introduce the pressurized gas cooling material into the cooling pipe. At this time, part of the gas cooling material enters the air cavity through the second valve member, and part of it is sprayed from the gas nozzle into the second cooling cavity. The gas cooling material entering the air cavity pushes the second piston plate to perform linear movement along the length direction of the cooling cylinder. At the same time, the push column fixedly connected to the second piston plate slides along the spiral groove provided on the cooling pipe and squeezes the inner wall of the spiral groove, so that the cooling pipe performs horizontal rotation. The cooling pipe pushes the stirring blade to rotate synchronously to stir the liquid cooling material in the liquid cavity. At the same time, the second piston plate squeezes the liquid cooling material in the liquid cavity, so that the liquid cooling material is sprayed from the first atomizing nozzle into the second cooling cavity. At this time, the gas cooling material sprayed from the two cooling cylinders carries the atomized liquid cooling material to collide in the second cooling cavity, and forms turbulence for mixing, and is quickly distributed and filled in the second cooling cavity. The purpose of this arrangement is to introduce the gas cooling material and the liquid cooling material into the second cooling cavity and fully mix them in the second cooling cavity to cool the fixed material and the processed chip;

[0042] 3. The monitoring module monitors and obtains the humidity information in the device body and the temperature information of the bearing surface of the carrier platform, and transmits them to the storage module for storage and establishment of a data set. The threshold unit retrieves the humidity information in the device body and the temperature information of the bearing surface of the carrier platform at the current moment in the storage module, and compares the two with the preset humidity threshold and temperature threshold. If at least one of them exceeds the corresponding threshold, a judgment information is formed. The analysis unit retrieves the humidity information in the device body and the temperature information of the bearing surface of the carrier platform at the current moment in the storage module to form a humidity prediction value and a temperature prediction value, and compares the two predicted values ​​with the preset humidity threshold and temperature threshold. If at least one of them exceeds the corresponding threshold, a judgment information is formed, and the temperature prediction value is analyzed. And the humidity prediction value is associated to form a correlation value, and the formed correlation value is compared with the preset correlation value threshold. If the correlation value exceeds the correlation value threshold, a judgment information is formed, and the control module receives the judgment information and controls the heater or cooling component in the temperature control mechanism according to the judgment information to achieve the purpose of regulating the temperature of the bearing surface of the carrier table, and controls the second linear moving part in the humidity adjustment mechanism to achieve the purpose of regulating the humidity in the device body, that is, by regulating the temperature and humidity of the environment in which the fixed material is located, the fixed material is prompted to quickly and effectively confine the chip on the bearing surface of the carrier table. At the same time, when the chip is processed, the control module can also control the cooling component to cool the chip processing area that exceeds the preset temperature, thereby improving the chip production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0044] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0045] Figure 3 It is a structural schematic diagram of the humidity regulating mechanism and the temperature regulating mechanism of the present invention.

[0046] Figure 4 It is a structural schematic diagram of the connecting mechanism of the present invention.

[0047] Figure 5 It is a schematic structural diagram of the partition of the present invention.

[0048] Figure 6 For the present invention Figure 3 A-section structure enlarged schematic diagram.

[0049] Figure 7 For the present invention Figure 4 Enlarged schematic diagram of the structure of part B in the middle.

[0050] Figure 8 It is a schematic diagram of the structure of the control system of the present invention.

[0051] Figure numerals: 1. Carrying platform; 101. First cavity; 102. Second cavity; 103. Third cavity; 1031. First cooling cavity; 1032. Second cooling cavity; 2. Device body; 3. Connecting mechanism; 301. Positioning cylinder; 302. Piston push plate; 303. Support rod; 304. First rod; 305. Electric valve; 306. Positioning slide; 307. Second rod; 4. Fixing material; 5. Chip; 6. Positioning assembly; 601. First mounting plate; 602. First linear motion member; 603. Pressing plate; 7. Humidity adjustment mechanism; 701. First piston plate; 702. Second linear motion member Moving parts; 703, nozzle; 8, temperature regulating mechanism; 801, heater; 802, cooling assembly; 8021, partition; 8022, first valve member; 8023, first temperature sensor; 8024, cooling unit; 80241, cooling cylinder; 80242, cooling pipe; 80243, second piston plate; 80244, stirring blade; 80245, second valve member; 9, control system; 9011, temperature monitoring unit; 9012, humidity monitoring unit; 902, storage module; 903, processing module; 9031, threshold unit; 9032, analysis unit; 904, control module. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0053] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0054] See also Figures 1 to 6 , provided in one embodiment of the present invention, is a chip fixing device for chip processing equipment, comprising a carrier 1 and a device body 2, wherein the carrier 1 is installed in the device body 2 through a connecting mechanism, and a sealing cover (not shown in the figure) for sealing the internal space of the device body 2 is provided on the device body 2, and further comprising:

[0055] The temperature regulating mechanism 8 is installed on the carrier platform 1 and is used to regulate the temperature of the fixing material 4 laid on the carrier surface of the carrier platform 1, and to regulate the temperature of the processing area of ​​the chip 5 when the chip 5 is processed;

[0056] The humidity regulating mechanism 7 is installed on the carrying platform 1 and is used to regulate the humidity of the environment where the fixing material 4 laid on the carrying surface of the carrying platform 1 is located;

[0057] A positioning component 6, mounted on the carrier 1, is used to position and define the chip 5;

[0058] The control system 9 adjusts the temperature and humidity of the environment where the fixing material 4 is located by controlling the temperature control mechanism 8 and the humidity control mechanism 7;

[0059] The temperature regulating mechanism 8 includes a heater 801, which is mounted on the inner side of the upper end of the chip 5, and further includes:

[0060] The cooling component 802 is installed on the bearing platform 1 and is used to cool down the fixing material 4 laid on the bearing surface of the bearing platform 1;

[0061] The cooling assembly 802 includes a partition 8021, a first valve 8022 and a first temperature sensor 8023. The partition 8021 is arranged in the third cavity 103 opened on the carrier 1 and is fixedly connected to the carrier 1. The partition 8021 divides the third cavity 103 into a first cold supply cavity 1031 and a plurality of second cold supply cavities 1032 distributed in a rectangular shape. The first cold supply cavity 1031 is connected to the second cold supply cavity 1032 through the first valve 8022 installed on the partition 8021. A plurality of the first temperature sensors 8023 are correspondingly arranged in the second cold supply cavity 1032. The first temperature sensor 8023 is embedded and fixedly connected to the inner side of the upper end of the carrier 1, and further includes:

[0062] The cooling unit 8024 is installed on the support platform 1 and is used to introduce the gas cooling material and the liquid cooling material into the first cooling cavity 1031 and mix them.

[0063] In the embodiment of the present invention, the humidity regulating mechanism 7 is selectively started according to the humidity information obtained by the control system 9, and the humidity of the inside of the device body 2, that is, the environment where the fixing material 4 is located, is adjusted until it is at a suitable humidity for the fixing material 4. At the same time, the temperature regulating mechanism 8 adjusts the temperature inside the device body 2 and the temperature information of the bearing surface of the bearing platform 1 according to the temperature information obtained by the control system 9, that is, when the temperature is too low, the heater 801 is started to increase the temperature inside the device body 2. When the temperature is too low, the cooling unit 8024 introduces the gas cooling material and the liquid cooling material into the first cooling cavity 1031. And mix, at this time, open the first valve component 8022 until the temperature of the bearing surface of the bearing platform 1 reaches a temperature suitable for the fixing material 4, at this time, the relevant technical personnel cover the chip 5 on the fixing material 4, and position it through the positioning component 6, so as to achieve the technical effect of quickly limiting and fixing the chip 5. At the same time, when the chip 5 is processed, the first temperature sensor 8023 can monitor the temperature of the processing area of ​​the chip 5. If the temperature of the processing area is too high, open the corresponding first valve component 8022 to introduce the mixed gas cooling material and liquid cooling material into the corresponding 8031 ​​to cool the processing area.

[0064] Specifically, a discharge pipe (not shown in the figure) for discharging the mixture of gaseous cooling material and liquid cooling material in the first cooling cavity 1031 is embedded in the partition 8021. The discharge pipe is connected to the first cooling cavity 1031 through a first joint (not shown in the figure) installed on the partition 8021. The output end of the discharge pipe passes through the support platform 1 and the device body 2 and extends to the outside of the device body 2. The purpose of this arrangement is to discharge the ineffective gaseous cooling material and liquid cooling material in the second cooling cavity 1032.

[0065] See also Figure 3 as well as Figure 6 As an embodiment of the present invention, the cooling unit 8024 includes a cooling cylinder 80241, a cooling pipe 80242 and a second piston plate 80243. The two cooling cylinders 80241 are symmetrically installed on the supporting platform 1 and are both connected to the first cooling cavity 1031 through a first atomizing nozzle (not shown in the figure) installed at the inner end. The cooling pipe 80242 is rotatably connected to the cooling cylinder 80241. The second piston plate 80243 and the cooling cylinder 80241 are limited and slidable. The second piston plate 8024 3 is fixedly connected to a pushing column (not shown in the figure) which is slidably matched with a spiral groove (not shown in the figure) provided on the cooling pipe 80242, the cooling pipe 80242 is connected with the second cooling cavity 1032, the second piston plate 80243 divides the cavity in the cooling cylinder 80241 into an air cavity (not shown in the figure) and a liquid cavity (not shown in the figure), the cooling pipe 80242 is connected with the air cavity through the second valve member 80245 installed thereon, and a gas nozzle (not shown in the figure) is installed at one inner end of the cooling pipe 80242.

[0066] Specifically, the cooling pipe 80242 is fixedly connected with a stirring blade 80244, and the stirring blade 80244 is located in the liquid cavity. The purpose of this arrangement is to use the rotation of the cooling pipe 80242 to drive the stirring blade 80244 to rotate in the horizontal direction, so as to stir the liquid cooling material in the liquid cavity and prevent it from being precipitated or separated.

[0067] In the embodiment of the present invention, relevant technicians introduce pressurized gas cooling material into the cooling pipe 80242. At this time, part of the gas cooling material enters the air cavity through the second valve member 80245, and part of it is sprayed from the gas nozzle into the second cooling cavity 1032. The gas cooling material entering the air cavity pushes the second piston plate 80243 to perform linear movement along the length direction of the cooling cylinder 80241. At the same time, the pushing column fixedly connected to the second piston plate 80243 slides along the spiral groove provided on the cooling pipe 80242 and squeezes the inner wall of the spiral groove, so that the cooling pipe 80242 rotates in the horizontal direction. The cooling pipe 80242 pushes the stirring blade 80244 to perform synchronous The second piston plate 80243 squeezes the liquid cooling material in the liquid chamber, and the liquid cooling material is sprayed from the first atomizing nozzle into the second cooling chamber 1032. At this time, the gas cooling material sprayed from the two cooling cylinders 80241 carries the atomized liquid cooling material and collides with each other in the second cooling chamber 1032, and forms turbulence for mixing, and is quickly distributed and filled in the second cooling chamber 1032. The purpose of this arrangement is to introduce the gas cooling material and the liquid cooling material into the second cooling chamber 1032 and fully mix them in the second cooling chamber 1032, so as to cool the fixed material and the processed chip 5.

[0068] See also Figures 1 to 3 The humidity regulating mechanism 7 includes a first piston plate 701, a second linear moving member 702 and a nozzle 703. The first piston plate 701 is arranged in a second cavity 102 opened in the support platform 1. The second cavity 102 is connected with the first cavity 101 opened in the support platform 1. The first piston plate 701 and the second cavity 102 are slidably matched. The output end of the second linear moving member 702 located in the second cavity 102 is fixedly connected to the first piston plate 701, and a third valve member is installed on the second linear moving member 702. One end of the nozzle 703 extends into the first cavity 101 and is fixedly connected to the support platform 1. The other end of the nozzle 703 is installed with a second atomizing nozzle. The first cavity 101 is filled with a liquid for regulating the humidity in the device body 2.

[0069] In an embodiment of the present invention, the second linear moving member 702 pushes the first piston plate 701 to slide along the second cavity 102, the first piston plate 701 squeezes the liquid in the first cavity 101 and pressurizes it into the nozzle 703, and the liquid in the nozzle 703 is sprayed into the device body 2 through the second atomizing nozzle, thereby achieving the technical effect of adjusting the humidity in the device body 2.

[0070] See also Figure 1 , Figure 4 as well as Figure 7The connecting mechanism includes a limiting cylinder 301, a piston push plate 302, a support rod 303, a first rod body 304 and an electric valve component 305. The four limiting cylinders 301 are distributed in a rectangular shape in the first cavity 101 and are fixedly connected to the bearing platform 1. The limiting cylinder 301 is connected to the first cavity 101 through the electric valve component 305 installed thereon. The support rod 303 is fixedly connected to the piston push plate 302. The piston push plate 302 is arranged in the limiting cylinder 301 and slides with the limiting cylinder 301. The support rod 303 passes through the bearing platform 1 and slides with the bearing platform 1. The first rod body 304 is fixedly connected between two of the support rods 303. The first rod body 304 is hinged on the device body 2. The second rod body 307 is fixedly connected between the other two support rods 303. The second rod body 307 slides with the limiting slide cylinder 306 fixedly connected to the device body 2.

[0071] In an embodiment of the present invention, when there is a drop or slope on the ground of the environment in which the device body 2 is located, the support rod 303 at a higher position pushes the piston push plate 302 to slide in the vertical direction along the limiting cylinder 301. At this time, the piston push plate 302 squeezes the liquid in the limiting cylinder 301 and the first cavity 101 to flow in the first cavity 101. The flowing liquid pushes the piston push plate 302 at a lower position to drive the support rod 303 to perform linear movement in the vertical direction and press the device body 2 to compensate for the ground drop in the environment in which the device body 2 is located. At this time, the electric valve member 305 is closed to cause the support platform 1 to be in a horizontal balance state. At the same time, relevant technical personnel can also drive the second linear motion member 702 to drive the first piston plate 701 to squeeze the liquid in the first cavity 101 to flow, thereby achieving the technical effect of adjusting the height position of the support platform 1 in the device body 2.

[0072] See also Figures 1-2 As an embodiment of the present invention, the positioning assembly 6 includes a first mounting plate 601, a first linear moving member 602 and a pressure plate 603. The first mounting plate 601 is fixedly connected to the supporting platform 1, the pressure plate 603 is fixedly connected to the output end of the first linear moving member 602, and the other end of the first linear moving member 602 is embedded and fixedly connected to the first mounting plate 601. Four first mounting plates 601 are distributed in a rectangular shape on the outside of the supporting platform 1.

[0073] In the embodiment of the present invention, the purpose of this arrangement is to use the first linear motion member 602 to push the pressure plate 603 to perform linear motion in the horizontal direction, so as to achieve the technical effect of driving a plurality of pressure plates 603 to press against the side of the chip 5 to position and limit the chip 5.

[0074] See also Figure 8As an embodiment of the present invention, the control system 9 comprises:

[0075] The monitoring module 901 is used to monitor and obtain the humidity information in the device body 2 and the temperature information of the carrying surface of the carrying platform 1;

[0076] The storage module 902 is used to store the data information obtained by the monitoring module 901 and establish a data set;

[0077] The processing module 903 is used to retrieve the temperature information and humidity information at the current moment in the storage module 902 and form judgment information;

[0078] The control module 904 is used to receive the judgment information and control the temperature adjustment mechanism 8 and the humidity adjustment mechanism 7 according to the judgment information;

[0079] Wherein, the monitoring module 901 includes:

[0080] The humidity monitoring unit 9012 is installed in the device body 2 and is used to monitor and obtain humidity information in the device body 2. It is a humidity sensor;

[0081] The temperature monitoring unit 9011 is installed on the bearing surface of the bearing platform 1 and is used to monitor and obtain the temperature information of the bearing surface. It is a second temperature sensor;

[0082] Wherein, the processing module 903 includes:

[0083] The threshold unit 9031 is used to retrieve the humidity information in the device body 2 and the temperature information of the carrying surface of the carrying platform 1 at the current moment from the storage module 902, and compare the two with the preset humidity threshold and temperature threshold. If at least one of them exceeds the corresponding threshold, a judgment information is formed; and

[0084] The analysis unit 9032 is used to retrieve the humidity information in the device body 2 at the current moment and the temperature information of the carrying surface of the carrying platform 1 from the storage module 902 to form a humidity prediction value and a temperature prediction value, and to compare the two prediction values ​​formed with a preset humidity threshold value and a temperature threshold value. If at least one of them exceeds the corresponding threshold value, judgment information is formed, the temperature prediction value and the humidity prediction value are associated to form an associated value, and the associated value is compared with the preset associated value threshold value. If the associated value exceeds the associated value threshold value, judgment information is formed;

[0085] The specific processing method of the analysis unit 9032 is as follows:

[0086] S1. Obtain the temperature information and humidity information at the current moment from the data set in the storage module 902, which are recorded as T1, T2, ..., Ti-1 , R1, R2, ..., R i-1 ;

[0087] S2. Predict the temperature information and humidity information at the next moment by linear regression, and obtain the corresponding prediction value T i , R i , and T i , R i Compare with the preset temperature threshold and humidity threshold, and if at least one of them exceeds the corresponding threshold, form judgment information;

[0088] S3. Based on the predicted value, estimate the correlation value of the temperature at the next moment, that is, the temperature at the next moment, and the humidity at the next moment. The calculation method is as follows:

[0089]

[0090] Among them, N is the number of items, T t,i is the temperature at time t, i.e. the temperature at the next moment, R t,i is the humidity at time t, i.e. the next moment;

[0091] S4, comparing the obtained correlation value with a preset correlation value threshold, and if the predicted value is greater than the preset threshold, forming judgment information;

[0092] S5. Transmit the above-formed judgment information to the control module 904 for related module control.

[0093] In the embodiment of the present invention, the monitoring module 901 monitors and obtains the humidity information in the device body 2 and the temperature information of the bearing surface of the carrier 1, and transmits them to the storage module 902 for storage and establishment of a data set. The threshold unit 9031 retrieves the humidity information in the device body 2 and the temperature information of the bearing surface of the carrier 1 at the current moment in the storage module 902, and compares the two with the preset humidity threshold value and the temperature threshold value. If at least one of them exceeds the corresponding threshold value, a judgment information is formed. The analysis unit 9032 retrieves the humidity information in the device body 2 and the temperature information of the bearing surface of the carrier 1 at the current moment in the storage module 902 to form a humidity prediction value and a temperature prediction value, and compares the two predicted values ​​with the preset humidity threshold value and the temperature threshold value. If at least one of them exceeds the corresponding threshold value, a judgment information is formed, and the temperature prediction value is determined. The temperature prediction value and the humidity prediction value are associated with each other to form an associated value, and the associated value is compared with a preset associated value threshold. If the associated value exceeds the associated value threshold, a judgment information is formed. The control module 904 receives the judgment information and controls the heater or cooling component 802 in the temperature control mechanism according to the judgment information to achieve the purpose of regulating the temperature of the bearing surface of the carrier 1, and controls the second linear moving part 702 in the humidity adjustment mechanism 7 to achieve the purpose of regulating the humidity in the device body 2, that is, by regulating the temperature and humidity of the environment in which the fixing material 4 is located, the fixing material 4 is prompted to quickly and effectively confine the chip 5 on the bearing surface of the carrier 1. At the same time, when the chip 5 is processed, the control module 904 can also control the cooling component 802 to cool the processing area of ​​the chip 5 that exceeds the preset temperature, thereby improving the production yield of the chip 5.

[0094] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0095] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip fixing device for chip processing equipment, comprising a carrier (1) and a device body (2), wherein the carrier (1) is installed in the device body (2), and a sealing cover body is provided on the device body (2) for sealing the internal space of the device body (2), characterized in that: Also includes: A temperature regulating mechanism (8) is installed on the carrier platform (1) and is used to regulate the temperature of the fixing material (4) laid on the carrier surface of the carrier platform (1), and to regulate the temperature of the processing area of ​​the chip (5) when the chip (5) is processed; A humidity regulating mechanism (7) is installed on the bearing platform (1) and is used to regulate the humidity of the environment in which the fixing material (4) laid on the bearing surface of the bearing platform (1) is located; A positioning component (6) is mounted on the carrier platform (1) and is used to position and define the chip (5); The control system (9) controls the temperature control mechanism (8) and the humidity control mechanism (7) to adjust the temperature and humidity of the environment in which the fixing material (4) is located; The temperature adjustment mechanism (8) comprises a heater (801), the heater (801) is mounted on the inner side of the upper end of the chip (5), and further comprises: A cooling component (802) is installed on the bearing platform (1) and is used to cool the fixing material (4) laid on the bearing surface of the bearing platform (1); The cooling assembly (802) comprises a partition (8021), a first valve component (8022) and a first temperature sensor (8023); the partition (8021) is arranged in a third cavity (103) opened on the carrier (1) and is fixedly connected to the carrier (1); the partition (8021) divides the third cavity (103) into a first cooling cavity (1031) and a plurality of second cooling cavities (1032) distributed in a rectangular shape; the first cooling cavity (1031) is connected to the second cooling cavity (1032) via a first valve component (8022) installed on the partition (8021); a plurality of first temperature sensors (8023) are correspondingly arranged in the second cooling cavity (1032); the first temperature sensor (8023) is embedded and fixedly connected to the inner side of the upper end of the carrier (1); and further comprises: The cooling unit (8024) is installed on the support platform (1) and is used to introduce the gas cooling material and the liquid cooling material into the first cooling cavity (1031) and mix them.

2. The chip fixing device for chip processing equipment according to claim 1, characterized in that: The cooling unit (8024) comprises a cooling cylinder (80241), a cooling pipe (80242) and a second piston plate (80243). The two cooling cylinders (80241) are symmetrically mounted on the support platform (1) and are both connected to the first cooling cavity (1031) via a first atomizing nozzle mounted on the inner end. The cooling pipe (80242) is rotatably connected to the cooling cylinder (80241). The second piston plate (80243) is limitedly slidable with the cooling cylinder (80241). The second piston plate (80243) is fixedly connected to a nozzle opened in the cooling cylinder. The cooling tube (80242) is connected to the second cooling cavity (1032). The second piston plate (80243) divides the cavity in the cooling cylinder (80241) into an air cavity and a liquid cavity. The cooling tube (80242) is connected to the air cavity through a second valve member (80245) installed thereon. A gas nozzle is installed at one end of the inner side of the cooling tube (80242). A stirring blade (80244) is fixedly connected to the cooling tube (80242), and the stirring blade (80244) is located in the liquid cavity.

3. The chip fixing device for chip processing equipment according to claim 1, characterized in that: The humidity regulating mechanism (7) comprises a first piston plate (701), a second linear moving member (702) and a nozzle (703); the first piston plate (701) is arranged in a second cavity (102) provided in the support platform (1); the second cavity (102) is connected to the first cavity (101) provided in the support platform (1); the first piston plate (701) and the second cavity (102) are slidably matched; the output end of the second linear moving member (702) in the second cavity (102) is fixedly connected to the first piston plate (701); and a third valve member is installed on the second linear moving member (702); one end of the nozzle (703) extends into the first cavity (101) and is fixedly connected to the support platform (1); the other end of the nozzle (703) is installed with a second atomizing nozzle; and the first cavity (101) is filled with a liquid for regulating the humidity in the device body (2).

4. The chip fixing device for chip processing equipment according to claim 3, characterized in that: The device also includes a connection mechanism (3) for connecting the support platform (1) and the device body (2), wherein the connection mechanism includes a limiting cylinder (301), a piston push plate (302), a support rod (303), a first rod body (304) and an electric valve component (305), wherein the four limiting cylinders (301) are distributed in a rectangular shape in the first cavity (101) and are fixedly connected to the support platform (1), the limiting cylinder (301) is connected to the first cavity (101) through the electric valve component (305) installed thereon, and the support rod (303) is fixedly connected to the piston push plate (302). ), the piston push plate (302) is arranged in the limiting cylinder (301) and slides with the limiting cylinder (301), the support rod (303) passes through the support platform (1) and slides with the support platform (1), a first rod body (304) is fixedly connected between the two support rods (303), the first rod body (304) is hinged on the device body (2), and a second rod body (307) is fixedly connected between the other two support rods (303), and the second rod body (307) slides with a limiting slide cylinder (306) fixedly connected to the device body (2).

5. The chip fixing device for chip processing equipment according to claim 4, characterized in that: The positioning assembly (6) comprises a first mounting plate (601), a first linear moving member (602) and a pressure plate (603); the first mounting plate (601) is fixedly connected to the support platform (1); the pressure plate (603) is fixedly connected to the output end of the first linear moving member (602); the other end of the first linear moving member (602) is embedded and fixedly connected to the first mounting plate (601); four first mounting plates (601) are distributed in a rectangular shape on the outer side of the support platform (1).

6. The chip fixing device for chip processing equipment according to claim 5, characterized in that: The control system (9) comprises: A monitoring module (901) is used to monitor and obtain humidity information in the device body (2) and temperature information on the bearing surface of the bearing platform (1); A storage module (902), used to store the data information acquired by the monitoring module (901) and to establish a data set; A processing module (903) is used to retrieve the temperature information and humidity information at the current moment in the storage module (902) and form judgment information; A control module (904) is used to receive the judgment information and control the temperature adjustment mechanism (8) and the humidity adjustment mechanism (7) according to the judgment information; Wherein, the monitoring module (901) comprises: A humidity monitoring unit (9012) is installed in the device body (2) and is used to monitor and obtain humidity information in the device body (2), and is a humidity sensor; A temperature monitoring unit (9011), installed on the bearing surface of the bearing platform (1), is used to monitor and obtain temperature information of the bearing surface, and is a second temperature sensor; Wherein, the processing module (903) comprises: A threshold unit (9031) is used to retrieve humidity information in the device body (2) and temperature information on the bearing surface of the bearing platform (1) at the current moment from the storage module (902), and compare the two with a preset humidity threshold and temperature threshold, and if at least one of them exceeds the corresponding threshold, form judgment information; and The analysis unit (9032) is used to retrieve the humidity information in the device body (2) at the current moment and the temperature information of the support surface of the support platform (1) in the storage module (902) to form a humidity prediction value and a temperature prediction value, and compare the two prediction values ​​formed with the preset humidity threshold value and the temperature threshold value. If at least one of them exceeds the corresponding threshold, judgment information is formed, the temperature prediction value and the humidity prediction value are associated to form an associated value, and the associated value is compared with the preset associated value threshold. If the associated value exceeds the associated value threshold, judgment information is formed.

7. The chip fixing device for chip processing equipment according to claim 6, characterized in that: The specific processing method of the analysis unit (9032) is: S1. Obtain the temperature information and humidity information at the current moment from the data set in the storage module (902), which are recorded as T1, T2, ..., T i-1 , R1, R2, ..., R i-1 ; S2. Predict the temperature information and humidity information at the next moment by linear regression, and obtain the corresponding prediction value T i , R i , and T i , R i Compare with the preset temperature threshold and humidity threshold, and if at least one of them exceeds the corresponding threshold, form judgment information; S3. Based on the predicted value, estimate the correlation value of the temperature at the next moment, that is, the temperature at the next moment, and the humidity at the next moment. The calculation method is as follows: Among them, N is the number of items, T t,i is the temperature at time t, i.e. the temperature at the next moment, R t,i is the humidity at time t, i.e. the next moment; S4, comparing the obtained correlation value with a preset correlation value threshold, and if the predicted value is greater than the preset threshold, forming judgment information; S5. Transmit the above-formed judgment information to the control module (904) for related module control.

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