LED headlight for ADB and preparation method thereof

Abstract

The present invention provides an LED headlight for ADB and a preparation method thereof, wherein the LED headlight comprises a metal isolator with reflective properties, which is embedded in an isolation groove between the light conversion layer on the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip, and the upper surface of the metal isolator is not higher than the upper surface of the light conversion layer, and the upper surface of the light conversion layer is a side surface away from the light-emitting upper surface of the LED chip. It is conducive to solving the problem of light crosstalk under smaller spacing, and the preparation process is simple. Compared with the ALD side coating solution, this process is simpler and more efficient, which is conducive to faster mass production, thereby improving production efficiency and reducing costs.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an LED headlamp applied to ADB and a preparation method thereof. Background Art

[0002] As car lights become increasingly intelligent, the Adaptive Driving Beam (ADB) system automatically adjusts the brightness, angle and shape of the light beam based on the input signal of the sensor, which can provide better lighting effects and greatly improve the safety of night driving, with unique advantages. Most new Adaptive Driving Beam (ADB) systems use LED matrix design. Based on the quality requirements of car lights, how to ensure the uniformity of the light pattern of the LED light source and solve the problem of cross-lighting under small spacing has become a challenge.

[0003] The traditional solution to prevent light crosstalk between adjacent LED chips is to fill the gaps between the LED chips with reflective white glue. However, since there is a large amount of colloid in the white glue, a certain thickness is usually required to fully reflect the light and prevent light crosstalk. This means that the spacing between the LED chips must be above 200µm or even 400µm, which cannot meet the requirements of small spacing.

[0004] At present, some companies use the ALD (Atomic Layer Deposition) coating process to coat the side walls of each LED chip and its fluorescent film with a reflective coating to solve the cross-light problem. However, this method requires a more difficult coating process, which is time-consuming and costly. A coating cycle takes several days to complete, which seriously affects production efficiency. Summary of the invention

[0005] In order to overcome the above shortcomings, the present invention provides an LED headlight applied to ADB and a preparation method thereof, which adopts a more efficient and economical solution to effectively solve the problem of cross-talk of LED light sources at small spacing.

[0006] The technical solution provided by the present invention is:

[0007] In one aspect, the present invention provides an LED headlight for ADB, comprising:

[0008] A plurality of LED chips are arranged in an array at a preset pitch and fixed on the surface of a wiring substrate; each LED chip has a light-emitting top and a light-emitting side, and a chip electrode is also provided on the surface opposite to the light-emitting top, and the light-emitting top of the LED chip is arranged upward;

[0009] A first reflective adhesive layer on the surface of the wiring substrate and filled between the LED chips, wherein the upper surface of the first reflective adhesive layer is not higher than the plane where the LED chip emits light, and the upper surface of the first reflective adhesive layer is a side surface away from the chip electrode;

[0010] A light conversion layer is formed on the surface of each LED chip, the light conversion layer at least covers the light-emitting surface of the corresponding LED chip, and an isolation groove is formed between at least the light conversion layers on the surfaces of adjacent LED chips, exposing the upper surface of the first reflective adhesive layer between the LED chips;

[0011] A metal isolation member with reflective properties is embedded in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip, and the upper surface of the metal isolation member is not higher than the upper surface of the light conversion layer, and the upper surface of the light conversion layer is the side surface away from the light-emitting surface of the LED chip.

[0012] In another aspect, the present invention provides a method for preparing an LED headlight, comprising:

[0013] S01. Provide a plurality of LED chips, each of which has a light-emitting top surface and a light-emitting side surface, and a chip electrode is provided on a surface opposite to the light-emitting top surface; arrange the LED chips in an array with the light-emitting top surface facing upward at a preset spacing, and fix them on the surface of a wiring substrate;

[0014] S02, filling light reflective material between the LED chips and curing it to form a first reflective adhesive layer, wherein the upper surface of the first reflective adhesive layer is not higher than the plane where the LED chip emits light, and the upper surface of the first reflective adhesive layer is a side surface away from the chip electrode;

[0015] S03, attaching a whole piece of light conversion layer to the surface of the LED chip, wherein the light conversion layer is arranged close to the light-emitting surface of the LED chip;

[0016] S04, forming an isolation groove in the light conversion layer at least between adjacent LED chips;

[0017] S05. A metal isolation member with reflective properties is embedded in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip, and the upper surface of the metal isolation member is not higher than the upper surface of the light conversion layer. The upper surface of the light conversion layer is the side surface away from the light-emitting surface of the LED chip, so as to obtain an LED headlight.

[0018] The LED headlights and preparation methods for ADB provided by the present invention form isolation grooves in the light conversion layer between adjacent LED chips and embed metal isolation parts to isolate and reflect the light emitted to the side by the LED chips, thereby preventing light from crossing between adjacent LED chips. Compared with the solution of filling white glue between LED chips, the isolation performance of the metal isolation parts is better, and the light crossing problem under smaller spacing can be solved, that is, the pixels can be arranged more closely per unit area, and the process is simple and the cost is low, which is conducive to the application of LED in ADB. Compared with the ALD side coating solution, this process is simpler and more efficient, which is conducive to faster mass production, thereby improving production efficiency and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a cross-sectional schematic diagram of an LED headlight according to a first embodiment of the present invention;

[0020] Figure 2 is a cross-sectional schematic diagram of an LED headlight according to a second embodiment of the present invention;

[0021] Figure 3 is a cross-sectional schematic diagram of an LED headlight according to a third embodiment of the present invention;

[0022] Figure 4 is a cross-sectional schematic diagram of an LED headlight according to a fourth embodiment of the present invention;

[0023] Figure 5 is a cross-sectional schematic diagram of an LED headlight according to a fifth embodiment of the present invention;

[0024] Figure 6 It is a schematic diagram of a structure in which LED chips are arranged and fixed on the surface of a wiring substrate in one embodiment of the present invention;

[0025] Figure 7 It is a schematic diagram of a structure in which a first reflective adhesive layer is formed between LED chips in one embodiment of the present invention;

[0026] Figure 8 This is a schematic diagram of a structure in which a whole light conversion layer is attached to the surface of an LED chip in one embodiment of the present invention;

[0027] Fig. 9 It is a schematic diagram of a structure in which an isolation groove is formed in a light conversion layer between adjacent LED chips in one embodiment of the present invention;

[0028] Fig.10 It is a schematic diagram of a structure in which a metal isolation member is embedded in an isolation groove in one embodiment of the present invention;

[0029] Fig.11 It is a schematic diagram of a structure for forming a second reflective adhesive layer in one embodiment of the present invention;

[0030] Reference numerals:

[0031] 10-wiring substrate, 1-LED chip, 11-light-emitting top, 12-light-emitting side, 13-chip electrode, 2-first reflective adhesive layer, 3-light conversion layer, 31-isolation groove, 4-metal isolation component, 41-metal isolation subcomponent, 5-second reflective adhesive layer. DETAILED DESCRIPTION

[0032] In order to more clearly illustrate the implementation cases of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings and other implementation methods can be obtained based on these drawings without creative work.

[0033] An embodiment of the present invention is an LED headlight applied to ADB, comprising:

[0034] A plurality of LED chips are arranged in an array with a preset spacing and fixed on the surface of a wiring substrate; each LED chip has a light-emitting top and a light-emitting side, and a chip electrode is also provided on the surface opposite to the light-emitting top, and the light-emitting top of the LED chip is arranged to face upward; a first reflective adhesive layer is formed on the surface of the wiring substrate and filled between the LED chips, the upper surface of the first reflective adhesive layer is not higher than the plane where the light-emitting top of the LED chip is located, and the upper surface of the first reflective adhesive layer is a side surface away from the chip electrode; a light conversion layer is formed on the surface of each LED chip, the light conversion layer at least covers the light-emitting top of the corresponding LED chip, and an isolation groove is formed between the light conversion layers on the surfaces of adjacent LED chips, exposing the upper surface of the first reflective adhesive layer between the LED chips; a metal isolation member with reflective performance is embedded in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip, and the upper surface of the metal isolation member is not higher than the upper surface of the light conversion layer, and the upper surface of the light conversion layer is a side surface away from the light-emitting top of the LED chip.

[0035] The multiple LED chips used in the LED headlights are arranged and fixed on the surface of the wiring substrate in the shape required by the product, such as being arranged as a square matrix, a circular matrix or other shapes as a whole. The specific overall shape is independently designed according to the product use and quality requirements. The shape of the LED chip itself is generally square, and can also be designed into other shapes (such as circles, polygons, etc.). This embodiment does not impose any restrictions on this. In order to ensure that the overall light type of the LED headlight is uniform, the spacing between the LED chips needs to be controlled within a certain range to prevent the spacing from being too large to produce light and dark lines with inconsistent brightness. In addition, arranging a suitable number of LED chips within a certain area is conducive to controlling the lighting and extinguishing of some LED chips according to actual conditions. The wiring substrate can be a ceramic circuit board, a glass-based TFT substrate, any rigid substrate based on PCB (Printed Circuit Board), glass, etc., or a flexible substrate with PET (Polyethylene Terephthalate), PI (Polyimide), PEN (Polyethylene Naphthalate), etc. as the main material. The above substrates can be transparent or opaque; in the actual application process, technicians in this field can flexibly select a suitable substrate according to actual needs, and this embodiment does not impose specific restrictions on this. Wires, vias, pads, etc. are formed on the surface of the wiring substrate to provide electrical connections for the LED chips, so as to facilitate the subsequent on-off control of each LED chip. Each LED chip is fixed to the corresponding position on the surface of the wiring substrate by solid crystal welding.

[0036] The first reflective adhesive layer is filled between each LED chip, with the light-emitting surface of the LED chip facing upward and the chip electrode surface facing downward, and the lower surface of the first reflective adhesive layer is flush with the chip electrode surface (i.e., the wiring substrate surface), and the upper surface is not higher than the light-emitting surface of the LED chip; the thickness of the first reflective adhesive layer can at least cover the chip electrode side, isolate the chip electrodes of adjacent LED chips, and form isolation between the positive and negative electrodes of the same LED chip to prevent short circuits during welding, and cover the circuits on the surface of the wiring substrate to protect the circuits from damage in subsequent operations; the material of the first reflective adhesive layer is a mixture of resin and light-reflective particles, and the resin can be a thermosetting resin such as epoxy resin, thermosetting polyimide resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting polyurethane resin, etc., preferably a thermosetting silicone resin or epoxy resin. The light-reflecting particles are generally white inorganic pigments, such as oxides such as titanium oxide, zinc oxide, zirconium oxide, carbonates such as white lead (lead carbonate), calcium carbonate, clay minerals such as kaolinite, etc., preferably titanium oxide, which is doped into the resin at a suitable concentration so that the first reflective adhesive layer has a certain reflectivity. In addition, the first reflective adhesive layer can also be formed on the light-emitting side of the LED chip to block and reflect the side light to prevent light from crossing between adjacent LED chips. Regardless of whether the first reflective adhesive layer is formed on the light-emitting side of the LED chip, a metal spacer is embedded on the surface of the first reflective adhesive layer.

[0037] The light conversion layer is arranged on the surface of each LED chip above the light source, with a thickness of 70μm~120μm. Specifically, it can be a hard ceramic fluorescent sheet, a glass fluorescent sheet, or a soft fluorescent glue layer. The wavelength conversion material inside converts the transmitted light into another wavelength. The wavelength conversion material is a fluorescent body that can be excited by the light emitted by the LED chip, so as to obtain an LED headlight with a different light color from that emitted by the LED chip. The composition of the wavelength conversion material can be at least one or more of the following: garnet-type fluorescent body, nitrogen oxide fluorescent body, aluminate fluorescent body, nitride fluorescent body, sulfide fluorescent body, KSF fluorescent body, etc. An isolation groove is formed between the light conversion layers corresponding to adjacent LED chips. The depth of the isolation groove is consistent with the thickness of the light conversion layer, so that the light conversion layers corresponding to each LED chip are independent of each other and do not adhere to the light conversion layer corresponding to another LED chip. The width of the isolation groove is generally less than the spacing between the LED chips, so that the light conversion layer can cover the entire surface of the light-emitting surface of the LED chip. The groove can be made by using a blade, etc., which can also be determined according to the actual application, as long as the purpose can be achieved. In other embodiments, there are also isolation grooves with a width greater than or equal to the LED chip spacing, which can be designed according to product requirements. In order to achieve the bonding of the light conversion layer, a thinner bonding layer made of thermosetting resin is also included between the light-emitting surface of the LED chip and the light conversion layer. In other embodiments, light conversion layers corresponding to the size of the LED chip can also be used and pasted one by one on the surface of each LED chip, without the need to use a blade to make grooves; however, if the pasting accuracy is not high, the light conversion layer may rotate, shift, etc., making the width of the isolation grooves between the light conversion layers uneven, affecting the embedding of the metal isolation parts; therefore, compared with pasting a whole piece of light conversion layer, the alignment accuracy required by this method is higher.

[0038] The metal isolator is embedded in the isolation groove between the surface of the first reflective glue layer and the light conversion layer through external force, which plays the role of isolation and reflection, preventing the LED chip from emitting light from the location of the isolation groove, so that the LED chip only emits light from the surface of the light conversion layer above the light source. Since the distance between the LED chips is small, it is difficult to completely block the light by filling the isolation groove with conventional white glue, which is easy to cause cross-light; compared with the conventional solution of using white glue for reflection, this embodiment uses metal isolators for reflection, which can prevent the cross-light of adjacent LED chips at a smaller spacing. The material of the metal isolator is usually required to have good reflective properties, such as metals or alloys such as Ag and Al, and can also be other materials wrapped with a metal surface, as long as it has good reflective properties; in addition, in order to make the LED headlights more durable, the surface of the metal isolator needs to have certain anti-oxidation properties, such as forming a thin anti-oxidation coating on the surface. The thickness of the metal spacer can at least cover the side of the light conversion layer, but the upper surface does not exceed the upper surface of the light conversion layer. More preferably, the upper surface of the metal spacer is flush with the upper surface of the light conversion layer; the lower surface of the metal spacer is in contact with the upper surface of the first reflective adhesive layer, that is, the combination of the metal spacer and the first reflective adhesive layer can completely cover the entire LED chip (including the light conversion layer): when the upper surface of the first reflective adhesive layer is flush with the light-emitting surface on the LED chip, Figure 1 In the first embodiment shown, three LED chips 1 are fixed on the surface of the wiring substrate 10, and the first reflective adhesive layer 2 is filled from the surface of the chip electrode 13 of the LED chip 1 (i.e., the surface of the wiring substrate) to the light-emitting upper surface 11, completely covering the light-emitting side surface 12, and the metal isolation member 4 is embedded in the isolation groove 31 on the surface of the first reflective adhesive layer, and the thickness of the metal isolation member only covers the side surface of the light conversion layer 3; when the upper surface of the first reflective adhesive layer is flush with the surface where the chip electrode on the LED chip is located, as shown in FIG. Figure 2 In the second embodiment shown, three LED chips 1 are also fixed on the surface of the wiring substrate 10. The thickness of the first reflective adhesive layer 2 only wraps the side of the chip electrode 13 of the LED chip 1 to prevent adverse conditions such as short circuits when soldering the patch. The metal isolation member 4 is embedded in the isolation groove 31 from the light-emitting side 12 of the LED chip to the light-emitting top 11 and the side of the light conversion layer 3 on the surface of the first reflective adhesive layer 2. That is to say, the metal isolation member is not only embedded in the isolation groove, but also embedded in the gap between the LED chips, that is, the thickness of the metal isolation member also covers the light-emitting side of the LED chip; in other embodiments, it is not ruled out that the upper surface of the first reflective adhesive layer is between the surface where the chip electrode is located on the LED chip and the light-emitting top, such as Figure 3In the third embodiment shown, the upper surface of the first reflective adhesive layer 2 is located in the middle of the light-emitting side of the LED chip, and a metal isolation member is provided in the isolation groove on its surface (including between the LED chips); however, as long as the metal isolation member is embedded in the isolation groove between the light conversion layers, it can play the role of isolating and reflecting the light between adjacent LED chips.

[0039] In addition, in addition to being formed between the light conversion layers, the isolation grooves can also penetrate into the first reflective adhesive layer, that is, the isolation grooves are formed in the light conversion layer and part of the first reflective adhesive layer between adjacent LED chips. In the process of opening the isolation grooves, after the light conversion layer is cut, the first reflective adhesive layer is cut downward to a set depth (the specific depth is designed according to actual conditions), and then a metal isolation piece is embedded in the isolation groove; that is, the isolation grooves are formed in the light conversion layer and part of the first reflective adhesive layer between adjacent LED chips. In this way, the lower end of the metal isolation piece penetrates into the first reflective adhesive layer and is constrained by the first reflective adhesive layer, so that the connection is more stable. Figure 4 In the fourth embodiment shown, the upper surface of the first reflective adhesive layer 2 on the surface of the wiring substrate is flush with the light-emitting surface. In addition to being formed between the light conversion layers 3, the isolation groove 31 also penetrates into part of the first reflective adhesive layer 2. At this time, the metal isolation member 4 is embedded in the isolation groove, and the lower end penetrates into the first reflective adhesive layer.

[0040] In order to facilitate the embedding of metal isolation parts into LED headlights, the metal isolation parts can be designed to be in the shape of a long filamentary structure. The length of the metal isolation parts is much larger than the size of their cross-section. In order to prevent light leakage, light crosstalk and other undesirable phenomena, for each individual LED chip in the LED headlight, the length of the metal isolation parts arranged around it should be at least greater than or equal to the length of the edge of the LED chip. The overall length should not be less than the length of the edge of the corresponding LED chip. It should be embedded in the isolation groove on the surface of the first reflective adhesive layer along the side of each LED chip, which can completely isolate adjacent LED chips without leaving any gaps. In one example, an LED headlight includes square LED chips arranged in an M*N array, with the horizontal arrangement defined as rows and the vertical arrangement defined as columns. A long filamentary metal spacer is embedded on the surface of the first reflective adhesive layer between each two adjacent rows of LED chips by external force, and a metal spacer is also embedded between two adjacent columns of LED chips by external force. In this way, the metal spacer completely wraps the edge of each LED chip, but this method is difficult to handle at the intersection of rows and columns; therefore, a long filamentary metal spacer can also be gradually embedded along the edge shape of the LED chip, such as gradually embedding a circle along the edge of an LED chip from a certain point and then returning to the starting point, and then continuing to embed toward the edge of another adjacent LED chip, and so on, gradually completing the embedding and filling of the edge isolation grooves of all LED chips. The cross-section of the metal isolator is usually a regular shape, such as circular, elliptical, square, polygonal, which is convenient for embedding in the isolation groove (and the gap between LEDs). Since the metal isolator is squeezed by external force and embedded in the isolation groove, the cross-section may be deformed by the force, and it can even be a flat structure after various regular metal isolators are flattened. In one example, since the hardness of the metal material used for the metal isolator is not large, during the embedding process, its cross-section changes from a circle to an ellipse that adapts to the isolation groove (and the gap between LEDs). Therefore, the cross-sectional shape of the metal isolator may not be fixed, as long as it can be easily accommodated in the isolation groove (and the gap between LEDs), and this embodiment does not impose any restrictions on this.

[0041] In another embodiment, the metal spacer includes a plurality of metal spacer sub-components, and the plurality of metal spacer sub-components can be arranged in a vertical stacking manner on the surface of the first reflective adhesive layer, such as Figure 2 As shown, three metal isolation components 41 are vertically stacked on the surface of the first reflective adhesive layer 2 and in the isolation grooves between the light conversion layers (as well as the gaps between the LED chips); they can also be arranged in a horizontal manner on the surface of the first reflective adhesive layer, such as Figure 5 In the fifth embodiment shown, two metal spacers 41 are embedded side by side in the spacer groove 31 between the surface of the first reflective adhesive layer 2 and the light conversion layer 3; they can also be horizontally unfolded and vertically stacked at the same time, such as Figure 3As shown, the metal spacers 41 with a flat elliptical cross section are arranged in an array in the isolation groove 31 between the surface of the first reflective adhesive layer 2 and the light conversion layer 3 (as well as the gap between the LED chips). Regardless of the arrangement, the metal spacers are closely arranged in the isolation groove (as well as the gap between the LED chips), embedded in the surface of the first reflective adhesive layer along the side of each LED chip, and occupy the space in the isolation groove as much as possible. If the material used for the metal spacers has good ductility, it can be deformed by external force during the embedding process and completely fill the isolation groove (as well as the gap between the LED chips), so that the space between the LED chips (as well as the light conversion layers) is filled with the metal spacers without any gaps. When other conditions are the same, compared with the method of directly embedding a metal isolation component, the cross-sectional area of ​​the metal isolation component is smaller than the cross-sectional area of ​​the single metal isolation component in the previous embodiment, so that multiple metal isolation components can be simultaneously accommodated in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer; the advantage of this method is that for metal isolation components at different positions and heights, different materials and shapes can be designed to meet the performance requirements of different parts in a targeted manner; for example, for multiple metal isolation components arranged in a vertical stack, the metal isolation component at the top layer can be made of a darker metal material to improve the overall LED size. In order to improve the contrast of the lamp, the metal isolation sub-components located at the lower layer are made of metal materials with higher reflectivity to meet the needs of isolating the light of adjacent LED chips and preventing cross-light. In addition, multiple metal isolation sub-components located in the same isolation groove have at least one regularly shaped cross-section, and multiple metal isolation sub-components in the metal isolation sub-components have the same regularly shaped cross-section; or metal isolation sub-components located in different parts can also be designed with cross-sections of different shapes, that is, multiple metal isolation sub-components in the same isolation groove have more than two different regularly shaped cross-sections, so as to better match each other and completely fill the surface of the first reflective adhesive layer, the isolation groove (and the gap between LEDs).

[0042] The embedding method of the metal isolator is basically the same as that of the metal isolator in the previous embodiment: the shape of the metal isolator is also a long strip-shaped filament structure, and the length is much larger than the size of its cross section. In order to prevent undesirable phenomena such as light leakage and light crosstalk, for each individual LED chip in the LED headlight, the length of the metal isolator arranged around it should be at least greater than or equal to the length of the edge of the LED chip, and the adjacent LED chips can be completely isolated without any gaps. Multiple long strip-shaped filament-shaped metal isolators can be gradually embedded on the surface of the first reflective adhesive layer between each adjacent row of LED chips by external force, and multiple long strip-shaped filament-shaped metal isolators can also be embedded between two adjacent columns of LED chips by external force, so that multiple metal isolators cooperate with each other to completely wrap the edge of each LED chip; or the long strip-shaped metal isolators can be gradually embedded along the edge shape of the LED chip, such as gradually embedding a circle along the edge of an LED chip from a certain point and then returning to the origin, and then continuing to embed to the edge of another adjacent LED chip, and so on, gradually completing the embedding and filling of the edge isolation grooves of all LED chips.

[0043] The second reflective adhesive layer is formed on the surface of the first reflective adhesive layer. Since the metal spacer (and the metal spacer sub-component) itself is solid, when it is embedded in the surface of the first reflective adhesive layer and the isolation groove of the light conversion layer (and the gap between the LEDs), there may be corners that cannot be filled, resulting in holes. In order to avoid the holes affecting the light-emitting effect of the LED headlights, after the metal spacer (or the metal spacer sub-component) is embedded, in this embodiment, a second reflective adhesive layer is further formed on the surface of the first reflective adhesive layer and in the isolation groove (when the isolation groove penetrates deep into the first reflective adhesive layer, the second reflective adhesive layer is simultaneously formed along the shape of the isolation groove). The second reflective adhesive layer is a liquid with fluidity before solidification. When it is injected into the surface of the first reflective adhesive layer, it can flow freely into the gap not filled by the metal spacer. It can also assist the LED headlights with micro-vibration to make the liquid flow faster and more fully. Then it is solidified to form a second reflective adhesive layer. After solidification, the upper surface of the second reflective adhesive layer is flush with the upper surface of the light conversion layer (if the surface of the second reflective adhesive layer after solidification is higher than the upper surface of the light conversion layer, it can be physically ground to be flush with the light conversion layer). At this time, the upper surface of the metal spacer is also flush with the upper surface of the light conversion layer. Figure 1-Figure 5As shown, the second reflective adhesive layer 5 fully fills the space not occupied by the metal spacer on the surface of the first reflective adhesive layer 2 and in the isolation groove between the light conversion layer (and the gap between the LEDs); a second reflective adhesive layer is formed between the LED chips on the surface of the first reflective adhesive layer and in the isolation groove, the upper surface of the second reflective adhesive layer is flush with the upper surface of the light conversion layer, and the metal spacer is embedded in the second reflective adhesive layer. Therefore, the metal spacer is embedded and fixed in the second reflective adhesive layer, which to a certain extent enhances the stability of the metal spacer and the firmness of the connection, forms a close combination with the surrounding materials, reduces the risk of displacement caused by vibration or external force, and makes the connection of the metal spacer more reliable, thereby ensuring the performance stability of the LED headlight. In addition, the second reflective adhesive layer has good adhesion and sealing properties, and can also prevent the penetration of moisture and gas, prevent oxidation and corrosion of the metal spacer, thereby extending its service life. The second reflective adhesive layer is made of the same material as the first reflective adhesive layer, which is also a mixture of resin and light-reflective particles. The resin can be epoxy resin, thermosetting polyimide resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting polyurethane resin and other thermosetting resins, preferably thermosetting silicone resin and epoxy resin. The light-reflective particles are generally white inorganic pigments, such as oxides such as titanium oxide, zinc oxide, zirconium oxide, carbonates such as white lead (lead carbonate) and calcium carbonate, clay minerals such as kaolin (kaolinite), etc., preferably titanium oxide, which is doped into the resin at a suitable concentration so that the second reflective adhesive layer has a certain reflectivity.

[0044] In general, the first reflective adhesive layer at least covers the surface of the wiring substrate and the chip electrode side at the bottom of the LED chip, and the upper surface can be in the middle of the light-emitting side of the LED chip, or flush with the light-emitting top; the metal spacer is embedded in the isolation groove from the surface of the first reflective adhesive layer to the light conversion layer, and its lower end can also be designed to penetrate into the first reflective adhesive layer (in this case, the isolation groove is also formed in the first reflective adhesive layer); the second reflective adhesive layer is filled in the area between the LED chips (including the light conversion layer) that is not filled by the first reflective adhesive layer and the metal spacer; in this way, in the LED headlight, the gap between the LED chips (including the light conversion layer) on the surface of the wiring substrate is completely filled with the combination of the first reflective adhesive layer, the metal spacer and the second reflective adhesive layer; metal is used as a barrier to isolate and reflect between adjacent LED chips, which can avoid cross-talk at a small pitch, and the lower end of the metal spacer is constrained by the first reflective adhesive layer and is filled with the second reflective adhesive layer around it, so that it can be stably and firmly connected to the LED chip.

[0045] Compared with the solution of filling white glue between LED chips, the solution of embedding metal spacers achieves better isolation and reflection effects, so it can achieve LED chip arrangement at a smaller pitch. In one example, when the distance between adjacent LED chips is 30μm-100μm, it can prevent light from crossing between adjacent LED chips. At this time, the width of the isolation groove is also 30μm-100μm, in which metal spacers are embedded to isolate and reflect light emitted from adjacent areas, so that each LED chip emits light in the form of Lambertian distribution, and the resulting LED headlights form a uniform light distribution.

[0046] Another embodiment of the present invention is a method for preparing an LED headlight, comprising:

[0047] S01, provide multiple LED chips, such as Figure 6 As shown, the LED chip 1 has a light-emitting upper surface 11 and a light-emitting side surface 12, and a chip electrode 13 is also provided on the surface opposite to the light-emitting upper surface; the LED chips are arranged with the light-emitting upper surface 11 facing upward in an array with a preset spacing and fixed on the surface of the wiring substrate 10. Multiple LED chips are arranged and fixed on the surface of the wiring substrate in the shape required by the product, such as a square matrix, a circular matrix or other shapes as a whole. The specific overall shape formed is independently designed according to the product use and quality requirements. The shape of the LED chip itself is generally square, and can also be designed into other shapes (such as circles, polygons, etc.), which is not limited in this embodiment; in order to ensure the uniformity of the overall light type of the LED headlight, the spacing between the LED chips needs to be controlled within a certain range to prevent the spacing from being too large to produce dark lines with significantly reduced brightness; and arranging a suitable number of LED chips within a certain area is conducive to controlling the lighting and extinguishing of some LED chips according to actual conditions. The wiring substrate can be a ceramic circuit board, a glass-based TFT substrate, any rigid substrate based on PCB (Printed Circuit Board), glass, etc., or a flexible substrate with PET (Polyethylene Terephthalate), PI (Polyimide), PEN (Polyethylene Naphthalate), etc. as the main material. The above substrates can be transparent or opaque; in the actual application process, those skilled in the art can flexibly select a suitable substrate according to actual needs, and this embodiment does not impose specific restrictions on this. Wires, vias, pads, etc. are formed on the surface of the wiring substrate to provide electrical connections to the LED chips and realize on-off control of each LED chip. Each LED chip is fixed to a corresponding position on the surface of the wiring substrate by die bonding.

[0048] S02, fill the light reflective material between the LED chips and solidify it to form a first reflective adhesive layer, the upper surface of the first reflective adhesive layer is not higher than the plane where the light-emitting surface of the LED chip is located, and the upper surface of the first reflective adhesive layer is the side surface away from the chip electrode. The first reflective adhesive layer is filled between each LED chip, the light-emitting surface of the LED chip faces upward, the chip electrode faces downward, and the lower surface of the first reflective adhesive layer is flush with the chip electrode surface, and the upper surface is not higher than the light-emitting surface of the LED chip; the thickness of the first reflective adhesive layer can at least cover the side of the chip electrode, isolate the chip electrodes of adjacent LED chips, and form isolation between the positive and negative electrodes of the same LED chip to prevent short circuits during welding, and cover the circuits on the surface of the wiring substrate to protect the circuits from damage in subsequent operations; the material of the first reflective adhesive layer is a mixture of resin and light reflective particles, and the resin can be a thermosetting resin such as epoxy resin, thermosetting polyimide resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting polyurethane resin, etc., preferably thermosetting silicone resin and epoxy resin. The light-reflecting particles are generally white inorganic pigments, such as oxides such as titanium oxide, zinc oxide, zirconium oxide, lead white (lead carbonate), carbonates such as calcium carbonate, clay minerals such as kaolinite, etc., preferably titanium oxide, which is doped into the resin at a suitable concentration to make the first reflective adhesive layer have a certain reflectivity. In addition, if Figure 7 As shown, the first reflective adhesive layer 2 can also be formed on the side wall of the light-emitting side 12 of the LED chip 1, with the lower surface flush with the chip electrode 13 on the wiring substrate surface, and the upper surface flush with the light-emitting top 11, to block and reflect the side light to prevent light from crossing between adjacent LED chips. It should be emphasized that regardless of whether the first reflective adhesive layer is formed on the light-emitting side of the LED chip, the subsequent metal isolation member is formed on the surface of the first reflective adhesive layer.

[0049] S03, attaching a whole piece of light conversion layer to the surface of the LED chip, with the light conversion layer being arranged close to the light-emitting surface of the LED chip. Figure 8 As shown, the light conversion layer 3 is arranged on the surface of each LED chip light-emitting surface 11, with a thickness of 70μm~120μm. Specifically, it can be a hard ceramic fluorescent sheet, a glass fluorescent sheet, or a soft fluorescent glue layer. The internal wavelength conversion material converts the transmitted light into another wavelength. The wavelength conversion material is a phosphor that can be excited by the light emitted by the LED chip, so as to obtain an LED headlight with a different light color from that emitted by the LED chip. The composition of the wavelength conversion material can be at least one or more of the following: garnet type phosphor, nitrogen oxide phosphor, aluminate phosphor, nitride phosphor, sulfide phosphor, KSF phosphor, etc.

[0050] S04, forming an isolation groove in the light conversion layer at least between adjacent LED chips. Fig. 9As shown, an isolation groove 31 is formed between the light conversion layers 3 corresponding to adjacent LED chips 1. The depth of the isolation groove is consistent with the thickness of the light conversion layer, so that the light conversion layers corresponding to each LED chip are independent of each other and do not adhere to the light conversion layers corresponding to another LED chip or other non-luminous areas. The width of the isolation groove is generally smaller than the spacing between the LED chips, so that the light conversion layer can cover the entire light-emitting surface of the LED chip. The groove can be made by using a blade, etc., which can also be determined according to the actual application, as long as the purpose can be achieved. In other embodiments, there are also isolation grooves with a width greater than or equal to the spacing between the LED chips, which can be designed according to product requirements. In order to achieve the bonding of the light conversion layer, a thinner bonding layer made of thermosetting resin is also included between the light-emitting surface of the LED chip and the light conversion layer.

[0051] In addition, in addition to being formed between the light conversion layers, the isolation groove can also penetrate into the first reflective adhesive layer, that is, the isolation groove is formed in the light conversion layer and part of the first reflective adhesive layer between adjacent LED chips. In the process of opening the isolation groove, after completing the cutting of the light conversion layer, the first reflective adhesive layer continues to be cut downward to a set depth (the specific depth is designed according to actual conditions), and then a metal isolation piece is embedded in the isolation groove; in this way, the lower end of the metal isolation piece penetrates into the first reflective adhesive layer, and is constrained by the first reflective adhesive layer so that the connection is more stable.

[0052] In other embodiments, a light conversion layer corresponding to the size of the LED chip can be used and pasted one by one on the surface of each LED chip, without the need to use a blade to make grooves; however, if the pasting accuracy is not high, the light conversion layer may rotate, shift, etc., causing the width of the isolation grooves between the light conversion layers to be uneven, affecting the embedding of the metal isolation parts; therefore, compared with pasting a whole piece of light conversion layer, the alignment accuracy required by this method is higher.

[0053] S05. A metal isolation member with reflective properties is embedded in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip, and the upper surface of the metal isolation member is not higher than the upper surface of the light conversion layer. The upper surface of the light conversion layer is the side surface away from the light-emitting upper surface of the LED chip, so as to obtain an LED headlight.

[0054] like Fig.10As shown, the metal isolator 4 is embedded in the isolation groove 31 between the surface of the first reflective adhesive layer 2 and the light conversion layer 3 by external force, and plays the role of isolation and reflection, preventing the LED chip from emitting light from the position of the isolation groove, so that the LED chip only emits light from the surface of the light conversion layer above the light source. Since the distance between the LED chips is small, it is difficult to completely block the light by filling the isolation groove with conventional white glue, which is easy to cause cross-light; compared with the conventional solution of using white glue for reflection, this embodiment uses metal isolators for reflection, which can prevent the cross-light of adjacent LED chips at a smaller spacing. The material of the metal isolator is usually required to have good reflective properties, such as metals or alloys such as Ag and Al, and can also be other materials wrapped with a metal surface, as long as it has good reflective properties; in addition, in order to make the LED headlights more durable, the surface of the metal isolator needs to have certain anti-oxidation properties, such as forming a thin anti-oxidation coating on the surface. The thickness of the metal spacer can at least cover the side of the light conversion layer, but the upper surface does not exceed the upper surface of the light conversion layer. More preferably, the upper surface of the metal spacer is flush with the upper surface of the light conversion layer; the lower surface of the metal spacer is in contact with the upper surface of the first reflective adhesive layer, that is, the metal spacer and the first reflective adhesive layer can be combined to completely cover the side of the entire LED chip (including the light conversion layer). In this embodiment, the upper surface of the first reflective adhesive layer 2 is flush with the light-emitting surface of the LED chip, and the thickness of the metal spacer 4 only covers the side of the light conversion layer; in other embodiments, the upper surface of the first reflective adhesive layer can be flush with the surface where the chip electrode on the LED chip is located, and the metal spacer is not only embedded in the isolation groove, but also embedded in the gap between the LED chips, that is, the thickness of the metal spacer also covers the light-emitting side of the LED chip; in other embodiments, it is not excluded that there is also a situation where the upper surface of the first reflective adhesive layer is between the surface where the chip electrode on the LED chip is located and the light-emitting surface, but as long as the metal spacer is embedded in the isolation groove between the light conversion layers, it can play the role of isolating and reflecting the light between adjacent LED chips.

[0055] In order to facilitate the embedding of metal isolation parts into LED headlights, the metal isolation parts can be designed to be in the shape of a long filamentary structure. The length of the metal isolation parts is much larger than the size of their cross-section. In order to prevent light leakage, light crosstalk and other undesirable phenomena, for each individual LED chip in the LED headlight, the length of the metal isolation parts arranged around it should be at least greater than or equal to the length of the edge of the LED chip. They should be embedded in the isolation grooves on the surface of the first reflective adhesive layer along the sides of each LED chip, which can completely isolate adjacent LED chips without leaving any gaps. In one example, an LED headlight includes square LED chips arranged in an M*N array, with the horizontal arrangement defined as rows and the vertical arrangement defined as columns. A long filamentary metal spacer is embedded on the surface of the first reflective adhesive layer between each two adjacent rows of LED chips by external force, and a metal spacer is also embedded between two adjacent columns of LED chips by external force, so that the metal spacer completely wraps the edge of each LED chip; however, this method is difficult to handle at the intersection of rows and columns, and therefore, a method of gradually embedding the long filamentary metal spacer along the edge shape of the LED chip can also be used, such as gradually embedding a circle along the edge of an LED chip from a certain point and then returning to the starting point, and then continuing to embed toward the edge of another adjacent LED chip, and so on, gradually completing the embedding and filling of the edge isolation grooves of all LED chips. The cross-section of the metal isolator is usually a regular shape, such as circular, elliptical, square, polygonal, etc., which is convenient for embedding in the isolation groove (and the gap between LEDs). When the metal isolator is squeezed by external force and embedded in the isolation groove, the cross-section may be deformed by the force, and it can even be a flat structure after various regular metal isolators are flattened. In one example, since the hardness of the metal material used for the metal isolator is not large, during the embedding process, its cross-section changes from a circle to an ellipse that adapts to the isolation groove (and the gap between LEDs). Therefore, the cross-sectional shape of the metal isolator may not be fixed, as long as it can be easily accommodated in the isolation groove (and the gap between LEDs), and this embodiment does not impose any restrictions on this.

[0056] In another embodiment, the metal isolation element includes a plurality of metal isolation elements, which can be arranged in a vertical stacked manner on the surface of the first reflective adhesive layer, or arranged in a horizontally expanded manner on the surface of the first reflective adhesive layer, or in a manner in which both horizontal expansion and vertical stacking are overlapped. When other conditions are the same, compared with the method of directly embedding a metal isolation component, the cross-sectional area of ​​the metal isolation component is smaller than the cross-sectional area of ​​the single metal isolation component in the previous embodiment, so that multiple metal isolation components can be accommodated on the surface of the first reflective adhesive layer at the same time; the advantage of this method is that metal isolation components at different positions and heights can be designed with different materials and shapes to meet the performance requirements of different parts in a targeted manner; for example, for multiple metal isolation components arranged in a vertically stacked manner, the metal isolation component located on the top layer can be made of a darker metal material to improve the contrast of the entire LED headlight, and the metal isolation component located on the lower layer can be made of a metal material with a higher reflectivity to meet the requirements of isolating the light of adjacent LED chips and preventing cross-talk; in addition, metal isolation components located in different positions can also be designed with different cross-sectional shapes to better match each other and completely fill the surface of the first reflective adhesive layer, the isolation groove (and the gap between LEDs), but at least one metal isolation component should have a regular cross-sectional shape.

[0057] The embedding method of the metal isolation sub-component is basically the same as the metal isolation sub-component in the previous embodiment: the shape of the metal isolation sub-component is also a long strip of filamentary structure, the length of which is much larger than the size of its cross-section, and in order to prevent light leakage, light crosstalk and other undesirable phenomena, for each individual LED chip in the LED headlight, the length of the metal isolation sub-components arranged around it should be at least greater than or equal to the length of the edge of the LED chip, and embedded in the isolation groove on the surface of the first reflective adhesive layer along the side of each LED chip, which can completely isolate adjacent LED chips without leaving any gaps. A plurality of long filamentary metal isolation components can be gradually embedded on the surface of the first reflective adhesive layer by external force between each two adjacent rows of LED chips, and a plurality of long filamentary metal isolation components can also be embedded between two adjacent columns of LED chips by external force, so that the plurality of metal isolation components cooperate with each other to completely wrap the edge of each LED chip; or the long filamentary metal isolation components can be gradually embedded along the edge shape of the LED chip, such as gradually embedding a circle along the edge of an LED chip from a certain point and then returning to the starting point, and then continuing to embed toward the edge of another adjacent LED chip, and so on, gradually completing the embedding and filling of the edge isolation grooves of all LED chips.

[0058] In another embodiment, after the metal isolation members are embedded in the formed isolation grooves, the method further includes: in the isolation grooves after all the metal isolation members are embedded, further filling the surface of the first reflective adhesive layer with light reflective material and curing it to form a second reflective adhesive layer flush with the upper surface of the light conversion layer.

[0059] The second reflective adhesive layer is formed on the surface of the first reflective adhesive layer and in the isolation groove; since the metal isolation member (and the metal isolation sub-member) itself is solid, when it is embedded in the surface of the first reflective adhesive layer and the isolation groove of the light conversion layer (and the gap between the LEDs), there may be corners that cannot be filled, resulting in holes. In order to avoid the holes affecting the light-emitting effect of the LED headlights, after the metal isolation member (or the metal isolation sub-member) is embedded, in this embodiment, Fig.11 As shown, a second reflective adhesive layer 5 is further formed on the surface of the first reflective adhesive layer 2; the second reflective adhesive layer is a liquid with fluidity before being cured. When it is injected into the surface of the first reflective adhesive layer, it can flow freely into the gap not filled by the metal spacer 4, and can also assist the LED headlight with micro-vibration, so that the liquid flows faster and more fully; and then the second reflective adhesive layer is cured to form a second reflective adhesive layer. After curing, the upper surface of the second reflective adhesive layer is flush with the upper surface of the light conversion layer (if the surface of the second reflective adhesive layer after curing is higher than the upper surface of the light conversion layer, it can be physically ground to be flush with the light conversion layer). At this time, the upper surface of the metal spacer is also flush with the upper surface of the light conversion layer. Therefore, the metal spacer is embedded and fixed in the second reflective adhesive layer, which to a certain extent enhances the stability of the metal spacer and the firmness of the connection, forms a close combination with the surrounding materials, reduces the risk of displacement caused by vibration or external force, and makes the connection of the metal spacer more reliable, thereby ensuring the performance stability of the LED headlight. In addition, the second reflective adhesive layer has good adhesion and sealing properties, and can also prevent the penetration of moisture and gas, prevent oxidation and corrosion of the metal spacer, and thus extend its service life. The second reflective adhesive layer is made of the same material as the first reflective adhesive layer, which is also a mixture of resin and light-reflective particles. The resin can be epoxy resin, thermosetting polyimide resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting polyurethane resin and other thermosetting resins, preferably thermosetting silicone resin and epoxy resin. The light-reflective particles are generally white inorganic pigments, such as oxides such as titanium oxide, zinc oxide, zirconium oxide, carbonates such as white lead (lead carbonate) and calcium carbonate, clay minerals such as kaolin (kaolinite), etc., preferably titanium oxide, which is doped into the resin at a suitable concentration so that the second reflective adhesive layer has a certain reflectivity.

[0060] In the above-mentioned LED headlights for ADB, when the wiring substrate itself is integrated with a driver chip, it can be directly applied to lighting devices such as the ADB system without the need to connect other driver chips; on the contrary, if the wiring substrate itself does not contain a driver chip, it needs to be connected to the corresponding driver chip before application, and the appropriate driver chip is selected to provide appropriate current and voltage for the LED chip to ensure its normal light emission. This embodiment does not limit the specific structure of the wiring substrate, and the key point is that the wiring substrate must be able to provide a stable electrical connection for the LED chip mounted on its surface. When the wiring substrate itself does not have a driving function, it can be connected to the driver chip through an external circuit, that is, a driver chip independently configured corresponding to each LED chip is configured on the wiring substrate to drive the corresponding LED chip, so as to facilitate the drive of each LED chip therein; or by welding, the LED headlight is welded to the surface of a driver substrate with a driving circuit, and the LED headlight is welded and fixed to the surface of the driver substrate through the wiring substrate, which is used to independently drive each LED chip in the LED headlight, and each LED chip in the LED headlight can be driven independently. The driving substrate includes a printed circuit board (PCB), a thin film transistor (TFT) substrate, etc. The wiring substrate in the LED headlight is fixed to the surface of the driving substrate by welding, and the driving circuit in the driving substrate is electrically connected to the LED chip in the LED headlight to provide an independent driving signal for each LED chip. The above three driving modes can be selected arbitrarily, and this embodiment does not limit this. A metal isolation member with reflective performance is formed between adjacent LED chips in the LED headlight in the headlight, which can effectively isolate and reflect light from adjacent areas. Therefore, the spacing between LEDs is between 30μm-100μm. The entire LED headlight not only meets the requirements of light uniformity, but each LED chip can also be turned on or off independently; therefore, in ADB, the light-emitting area can be adjusted in real time according to actual needs. For example, when driving at night, if a car appears within the illumination range of the LED headlights, at this time, if all the LED chips in the LED headlights are lit, they will directly illuminate the other driver's line of sight, causing glare and increasing safety hazards; the ADB system can, based on the driver's position, specifically extinguish the LED chips in the LED headlights that direct light toward the driver, while the LED chips in other positions remain lit; this way, it can take into account the lighting needs while avoiding the problem of glare to the other party.

[0061] It should be noted that the above embodiments can be freely combined as needed. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention.

Claims

1. An LED headlight applied to ADB, characterized in that: include: A plurality of LED chips are arranged in an array at a preset pitch and fixed on the surface of a wiring substrate; each LED chip has a light-emitting top and a light-emitting side, and a chip electrode is also provided on the surface opposite to the light-emitting top, and the light-emitting top of the LED chip is arranged upward; A first reflective adhesive layer on the surface of the wiring substrate and filled between the LED chips, wherein the upper surface of the first reflective adhesive layer is not higher than the plane where the LED chip emits light, and the upper surface of the first reflective adhesive layer is a side surface away from the chip electrode; A light conversion layer is formed on the surface of each LED chip, the light conversion layer at least covers the light-emitting surface of the corresponding LED chip, and an isolation groove is formed between at least the light conversion layers on the surfaces of adjacent LED chips, exposing the upper surface of the first reflective adhesive layer between the LED chips; A metal spacer with reflective properties, the metal spacer is a long strip-shaped filament structure, embedded in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip by external force, and the upper surface of the metal spacer is not higher than the upper surface of the light conversion layer, and the upper surface of the light conversion layer is the side surface away from the light-emitting upper surface of the LED chip; A second reflective adhesive layer is formed between the LED chips on the surface of the first reflective adhesive layer and in the isolation groove. The upper surface of the second reflective adhesive layer is flush with the upper surface of the light conversion layer, and the metal isolation member is embedded in the second reflective adhesive layer.

2. The LED headlight for ADB as claimed in claim 1, characterized in that: The isolation groove is formed in the light conversion layer between adjacent LED chips and in a portion of the first reflective adhesive layer below the isolation groove in the light conversion layer.

3. The LED headlight for ADB according to claim 1 or 2, characterized in that: The metal isolation piece is a long strip-shaped filament structure with a regular cross-section and an overall length not less than the length of the edge of the corresponding LED chip. It is arranged in the isolation groove along the side of the LED chip.

4. The LED headlight for ADB according to claim 1 or 2, characterized in that: The metal isolation component includes a plurality of metal isolation sub-components, and the metal isolation sub-components are closely arranged on the surface of the first reflective adhesive layer along the side of the LED chip.

5. The LED headlight for ADB as claimed in claim 4, characterized in that: The metal isolation sub-component is a long strip-shaped filament structure with a regular cross-section and an overall length not less than the length of the edge of the corresponding LED chip.

6. The LED headlight for ADB as claimed in claim 5, characterized in that: The plurality of metal spacer components in the metal spacer components have cross sections with the same regular shape, or have cross sections with two or more different regular shapes.

7. The LED headlight for ADB as claimed in claim 1, characterized in that: An upper surface of the metal spacer is flush with an upper surface of the light conversion layer.

8. The LED headlight for ADB as claimed in claim 1, 2, 5, 6 or 7, characterized in that: The distance between adjacent LED chips is 30 μm-100 μm; the width of the grooves between adjacent light conversion layers is 30 μm-100 μm.

9. The LED headlight for ADB as claimed in claim 1, 2, 5, 6 or 7, characterized in that: The wiring substrate is provided with a driving chip independently configured corresponding to each LED chip, and is used to drive the corresponding LED chip.

10. The LED headlight for ADB according to claim 1, 2, 5, 6 or 7, characterized in that: The LED headlight also includes a driving substrate conductively connected to the wiring substrate, which is used to independently drive each LED chip in the LED headlight.

11. A method for preparing an LED headlight, characterized in that: include: S01. Provide a plurality of LED chips, each of which has a light-emitting top surface and a light-emitting side surface, and a chip electrode is provided on a surface opposite to the light-emitting top surface; arrange the LED chips in an array with the light-emitting top surface facing upward at a preset spacing, and fix them on the surface of a wiring substrate; S02, filling light reflective material between the LED chips and curing it to form a first reflective adhesive layer, wherein the upper surface of the first reflective adhesive layer is not higher than the plane where the LED chip emits light, and the upper surface of the first reflective adhesive layer is a side surface away from the chip electrode; S03, attaching a whole piece of light conversion layer to the surface of the LED chip, wherein the light conversion layer is arranged close to the light-emitting surface of the LED chip; S04, forming an isolation groove in the light conversion layer at least between adjacent LED chips; S05. A metal isolator with reflective properties is embedded in the isolation groove between the surface of the first reflective adhesive layer and the light conversion layer on the surface of the LED chip by external force, wherein the metal isolator is a long strip-shaped filament structure, and the upper surface of the metal isolator is not higher than the upper surface of the light conversion layer, and the upper surface of the light conversion layer is the side surface away from the light-emitting upper surface of the LED chip, thereby obtaining an LED headlight; After the metal isolation piece is embedded in the formed isolation groove, the method further includes: in the isolation groove after all the metal isolation pieces are embedded, a light reflective material is further filled on the surface of the first reflective adhesive layer and cured to form a second reflective adhesive layer flush with the upper surface of the light conversion layer.

12. The method for preparing an LED headlamp according to claim 11, characterized in that: The step of forming the isolation groove in the light conversion layer at least between adjacent LED chips includes: forming the isolation groove in the light conversion layer and a part of the first reflective adhesive layer between adjacent LED chips.

13. The method for preparing an LED headlamp according to claim 11 or 12, characterized in that: The metal isolation piece is a long strip-shaped filament structure with a regular cross-section and an overall length not less than the length of the edge of the corresponding LED chip. It is arranged in the isolation groove along the side of the LED chip.

14. The method for preparing an LED headlamp according to claim 11 or 12, characterized in that: The metal isolation component includes a plurality of metal isolation sub-components, and the metal isolation sub-components are closely arranged on the surface of the first reflective adhesive layer along the side of the LED chip.

15. The method for preparing an LED headlamp according to claim 14, characterized in that: The metal isolation sub-component is a long strip-shaped filament structure with a regular cross-section and an overall length not less than the length of the edge of the corresponding LED chip.

16. The method for preparing an LED headlamp according to claim 15, characterized in that: A plurality of the metal spacer elements among the metal spacer elements have at least one cross-section with a regular shape.

17. The method for preparing an LED headlamp according to claim 11, characterized in that: An upper surface of the metal spacer is flush with an upper surface of the light conversion layer.

18. The method for preparing an LED headlamp according to claim 11 or 12 or 15 or 17, characterized in that: The distance between adjacent LED chips is 30 μm-100 μm; the width of the grooves between adjacent light conversion layers is 30 μm-100 μm.

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