A semiconductor material bending test device
By designing semiconductor material bending testing equipment, using hydraulic cylinder and motor-driven pressure plate systems to achieve accurate bending detection, the electric telescopic rod is adapted to semiconductors of different widths, the atomized spray head simulates the humidity environment, and uses activated carbon adsorption box and heater for High temperature detection solves the problems of inaccurate testing and debris splashing in the prior art, and improves testing efficiency and safety.
Patent Information
- Application Number
- CN202411390866.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2044-10-08
AI Technical Summary
The existing semiconductor bending test devices require time-consuming and laborious position calibration during use, and the test results are inaccurate, and it is easy to cause debris to splash during high temperature and humidity detection, affecting safety and efficiency.
A semiconductor material bending testing equipment is designed, including an operating box, calibration mechanism, humidification mechanism and heating mechanism. Four-point bending and three-point bending detection are achieved through hydraulic cylinders, motor-driven pressure plates and slide rod systems, and electric telescopic rods are adapted. Semiconductors of different widths, atomized spray heads simulate the humidity environment, and use activated carbon adsorption boxes and heaters for high temperature detection.
Improve the accuracy and efficiency of the test, reduce the operating steps, adapt to semiconductors of different widths, ensure detection equality, and clean up debris and drying equipment after detection, improving the functional diversity and safety of the equipment.
Smart Images
Figure CN118883309B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of detection devices, and in particular to a semiconductor material bending test device. Background Art
[0002] The bending test is a test to determine the mechanical properties of materials when subjected to bending loads. It is one of the basic methods for testing the mechanical properties of materials. The bending test is often used to determine the bending strength and relatively compare the deformation capacity of materials. Semiconductor materials are a type of electronic material with semiconductor properties and conductivity between conductors and insulators. They can be used to make semiconductor devices and integrated circuits and are widely used in various fields. Semiconductor materials need to be bent during production.
[0003] When using the existing semiconductor bending test device, it is necessary to calibrate the position of the test material according to the scale. This process is time-consuming, and the test results will not be accurate if the center is inaccurate. When the semiconductor material suddenly breaks during the test, some fragments splash and the resulting fragments can easily injure people or equipment. There are three-point bending detection and four-point bending detection for bending detection. According to the use environment of the semiconductor material, high temperature detection and humidity monitoring are also required. Each item requires multiple steps, which is time-consuming and labor-intensive. For this reason, we propose a semiconductor material bending test device. Summary of the invention
[0004] In order to make up for the deficiencies of the prior art and solve at least one technical problem raised in the background technology, the present invention proposes a semiconductor material bending test device.
[0005] The technical solution adopted by the present invention to solve its technical problems is: a semiconductor material bending test equipment, including an operating box, the front end of the operating box is rotatably connected to an observation window, the upper end of the operating box is installed with a calibration mechanism, one side of the calibration mechanism at the upper end of the operating box is installed with a humidifying mechanism, a placement mechanism is installed below the calibration mechanism inside the operating box, a baffle is fixedly connected below the placement mechanism inside the operating box, two groups of symmetrical collecting grooves are opened on the inner side of the baffle, a collecting box is slidably connected below the inner baffle of the operating box, and a heating mechanism is installed on one side of the operating box.
[0006] Preferably, the calibration mechanism includes a hydraulic cylinder fixedly connected to the operating box, the output shaft of the hydraulic cylinder is fixedly connected to the first pressure rod, a spring is arranged on the outer side of the first pressure rod, a sleeve is slidably connected to the outer side of the first pressure rod near the lower end, the upper end of the spring is fixedly connected to the first pressure rod, the lower end of the spring is fixedly connected to the sleeve, and two groups of symmetrical first sliding rods are fixedly connected to the outer side of the sleeve.
[0007] Preferably, the lower end of the first pressure rod is fixedly connected to the second pressure rod, the outer side of the second pressure rod is fixedly connected to an L-shaped mounting plate, the rear end of the L-shaped mounting plate is installed with a first motor, the lower end of the second pressure rod is rotatably connected to the first rotating shaft through a retaining ring, the rear end of the first rotating shaft is fixedly connected to the output shaft of the first motor, and the outer side of the first rotating shaft is fixedly connected to two groups of symmetrical pressure plates, and the two groups of pressure plates are rectangles with the same four sides.
[0008] Preferably, the opposite ends of the two groups of pressure plates are commonly fixedly connected with three groups of connecting rods, the opposite ends of the two groups of pressure plates are commonly fixedly connected with a second semicircular block near the upper end, the opposite ends of the two groups of pressure plates are commonly fixedly connected with a first semicircular block near one side, and the lower ends of the two groups of pressure plates are commonly fixedly connected with two groups of symmetrical L-shaped pressure blocks, the second semicircular block is fixed vertically at ninety degrees, and the first semicircular block is fixed at an inclined surface at forty-five degrees.
[0009] Preferably, the placement mechanism includes two groups of second sliding bars fixedly connected to the operation box, the outer sides of the two groups of second sliding bars are slidably connected with two groups of symmetrical first sliding blocks, the upper ends of the first sliding blocks are fixedly connected with a support rod, the outer sides of the support rods near the upper ends are fixedly connected with a trapezoidal placing groove, the two groups of trapezoidal placing grooves are symmetrically designed with hypotenuses, an electric telescopic rod is installed on the inner side of the support rod, a semiconductor body is installed between the two groups of trapezoidal placing grooves, the ends of the two groups of trapezoidal placing grooves away from each other are fixedly connected with an inclined fixing plate, the lower ends of the two groups of inclined fixing plates are fixedly connected with the second sliding blocks, the inner sides of the two groups of second sliding blocks are slidably connected to the second sliding bars, and the ends of the two groups of inclined fixing plates close to each other are respectively fixedly connected to the two groups of first sliding blocks.
[0010] Preferably, the heating mechanism comprises an activated carbon adsorption box fixedly connected to the operation box, an upper end of the activated carbon adsorption box is fixedly connected to an exhaust pipe, one end of the exhaust pipe is fixedly connected to an exhaust fan, and the other end of the exhaust fan is fixedly connected to an L-shaped input pipe.
[0011] Preferably, the rear end of the activated carbon adsorption box is fixedly connected to an exhaust fan, the output port of the exhaust fan is fixedly connected to an exhaust hose, the other end of the exhaust hose is fixedly connected to a heater, the other end of the heater is fixedly connected to a curved surface nozzle, and the curved surface nozzle is parallel to the semiconductor body.
[0012] Preferably, the humidifying mechanism includes a water tank fixedly connected to an operating box, an electromagnetic water pump is fixedly connected to the outside of the water tank, a water supply hose is fixedly connected to the output port of the electromagnetic water pump, an atomizing spray head is fixedly connected to the lower end of the water supply hose, the atomizing spray head is parallel to the semiconductor body, the atomizing spray head is fixedly connected to a chain through a bracket, two groups of symmetrical second rotating shafts are rotatably connected to the inner side of the chain, front and rear ends of the two groups of second rotating shafts are rotatably connected to C-shaped fixing splints, the ends of the two groups of C-shaped fixing splints away from the operating box are fixedly connected, a second motor is installed at the rear end of one of the two groups of C-shaped fixing splints, and the output shaft of the second motor is fixedly connected to the second rotating shaft at the front end.
[0013] Preferably, a T-shaped push rod is fixedly connected to the lower end of the chain, and the lower end of the T-shaped push rod is in contact with the baffle.
[0014] Compared with the prior art, the present invention provides a semiconductor material bending test device, which has the following beneficial effects:
[0015] 1. The first motor drives the pressing plate to perform four-point bending detection and three-point bending detection, which greatly improves the practicability of the device, reduces the operation steps, and improves work efficiency. The first semicircular clamp and the second semicircular clamp block can control the maximum rotation angle of the L-shaped pressing block within forty-five degrees, thereby improving the accuracy of device operation. The pressing plates are all rectangles with the same four sides, which can make the downward force more balanced and avoid improper operation caused by uneven force.
[0016] 2. The symmetrical bevel design of the trapezoidal placement groove can adapt to semiconductors of different widths, which improves the versatility of the device and expands its usage scenarios. The semiconductor can be lifted by the electric telescopic rod to make the position of the semiconductor horizontal, so that the force is more balanced during semiconductor detection.
[0017] 3. The humidification mechanism can be used to test semiconductors in a simulated humidity environment, and water vapor can be used to clean the inside of the operating box and simultaneously clean broken semiconductor fragments. The heating mechanism can be used to test semiconductors in a high temperature environment, which improves the functional diversity of the equipment. The inside of the device can be dried after humidity monitoring to ensure that the device is in a dry state after cleaning. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor material bending test device proposed by the present invention;
[0019] Figure 2 This is a schematic diagram of the overall structure of a semiconductor material bending test device proposed by the present invention;
[0020] Figure 3 This is an overall schematic diagram of a calibration mechanism for a semiconductor material bending test device proposed by the present invention;
[0021] Figure 4 A schematic cross-sectional view of a calibration mechanism for a semiconductor material bending test device proposed by the present invention Figure 1 ;
[0022] Figure 5 A schematic cross-sectional view of a calibration mechanism for a semiconductor material bending test device proposed by the present invention Figure 2 ;
[0023] Figure 6 This is a schematic diagram of the overall structure of a placement mechanism for a semiconductor material bending test device proposed by the present invention;
[0024] Figure 7 A schematic cross-sectional view of the overall structure of a placement mechanism for a semiconductor material bending test device proposed by the present invention;
[0025] Figure 8 This is a schematic diagram of the overall structure of a heating mechanism of a semiconductor material bending test device proposed by the present invention;
[0026] Fig. 9 A schematic cross-sectional view of the overall structure of a heating mechanism for a semiconductor material bending test device proposed by the present invention
[0027] Fig.10 This is a schematic diagram of the overall structure of a humidification mechanism for a semiconductor material bending test device proposed in the present invention.
[0028] In the figure: 1, operating box; 2, observation window; 3, collection box; 4, calibration mechanism; 41, hydraulic cylinder; 42, first pressure rod; 43, spring; 44, sleeve; 45, first slide bar; 46, second pressure rod; 47, L-shaped mounting plate; 48, first motor; 49, first rotating shaft; 410, connecting rod; 411, first semicircular block; 412, L-shaped pressure block; 413, pressure plate; 414, second semicircular block; 5, placement mechanism; 51, second slide bar; 52, first slider; 53, support rod; 54, trapezoidal placement groove; 55, inclined surface fixing Fixed plate; 56, second slider; 57, electric telescopic rod; 6, heating mechanism; 61, activated carbon adsorption box; 62, exhaust pipe; 63, exhaust fan; 64, L-shaped input pipe; 65, exhaust fan; 66, exhaust hose; 67, heater; 68, arc nozzle; 7, humidification mechanism; 71, water tank; 72, electromagnetic water pump; 73, water hose; 74, atomizing spray head; 75, chain; 76, second rotating shaft; 77, C-shaped fixed clamp; 78, second motor; 79, T-shaped push rod; 8, baffle; 9, collection tank; 10, semiconductor body. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0030] See also Figure 1-Figure 10 A semiconductor material bending test device comprises an operation box 1, the front end of the operation box 1 is rotatably connected with an observation window 2, a calibration mechanism 4 is installed on the upper end of the operation box 1, a humidifying mechanism 7 is installed on one side of the calibration mechanism 4 at the upper end of the operation box 1, a placing mechanism 5 is installed below the calibration mechanism 4 inside the operation box 1, a baffle 8 is fixedly connected below the placing mechanism 5 inside the operation box 1, two groups of symmetrical collecting grooves 9 are opened on the inner side of the baffle 8, a collecting box 3 is slidably connected below the inner baffle 8 of the operation box 1, and a heating mechanism 6 is installed on one side of the operation box 1.
[0031] In this embodiment, the calibration mechanism 4 includes a hydraulic cylinder 41 fixedly connected to the operating box 1, the output shaft of the hydraulic cylinder 41 is fixedly connected to the first pressure rod 42, a spring 43 is arranged on the outer side of the first pressure rod 42, and a sleeve 44 is slidably connected to the outer side of the first pressure rod 42 near the lower end, the upper end of the spring 43 is fixedly connected to the first pressure rod 42, the lower end of the spring 43 is fixedly connected to the sleeve 44, and two groups of symmetrical first sliding rods 45 are fixedly connected to the outer side of the sleeve 44.
[0032] Specifically, the hydraulic cylinder 41 is started to output the first pressure rod 42 downward, and the two sets of first slide rods 45 are moved downward through the sleeve 44. At this time, the spring 43 is pulled open, and the first slide rod 45 touches the trapezoidal placement groove 54 and the inclined fixing plate 55 when sliding downward, so that the center of the semiconductor body 10 is parallel to the first pressure rod 42.
[0033] In this embodiment, the lower end of the first pressure rod 42 is fixedly connected to the second pressure rod 46, the outer side of the second pressure rod 46 is fixedly connected to an L-shaped mounting plate 47, the rear end of the L-shaped mounting plate 47 is installed with a first motor 48, the lower end of the second pressure rod 46 is rotatably connected to the first rotating shaft 49 through a retaining ring, the rear end of the first rotating shaft 49 is fixedly connected to the output shaft of the first motor 48, and the outer side of the first rotating shaft 49 is fixedly connected to two groups of symmetrical pressure plates 413, and the two groups of pressure plates 413 are both rectangles with the same four sides.
[0034] Specifically, the first pressure rod 42 moves the pressure plate 413 downward through the second pressure rod 46 and the first rotating shaft 49, and makes the L-shaped pressure block 412 fit with the semiconductor body 10, so that the two groups of L-shaped pressure blocks 412 perform four-point bending detection on the semiconductor body 10 under the output of the hydraulic cylinder 41. The L-shaped mounting plate 47 is used to install the first motor 48, and the pressure plate 413 is driven to rotate by the first motor 48.
[0035] In this embodiment, the opposite ends of the two groups of pressure plates 413 are commonly fixedly connected with three groups of connecting rods 410, the opposite ends of the two groups of pressure plates 413 are commonly fixedly connected with the second semicircular block 414 near the upper end, the opposite ends of the two groups of pressure plates 413 are commonly fixedly connected with the first semicircular block 411 near the one side, and the lower ends of the two groups of pressure plates 413 are commonly fixedly connected with two groups of symmetrical L-shaped pressure blocks 412, the second semicircular block 414 is fixed vertically at ninety degrees, and the first semicircular block 411 is fixed at an inclined surface at forty-five degrees.
[0036] Specifically, the first semicircular block 411 and the second semicircular block 414 are used to limit the maximum rotation angle of the two groups of pressure plates 413 to forty-five degrees, and ensure stability when the two groups of pressure plates 413 are pressed down. The L-shaped pressure block 412 can simultaneously realize four-point bending detection, and then rotate forty-five degrees to perform three-point bending detection.
[0037] In this embodiment, the placement mechanism 5 includes two groups of second sliding bars 51 fixedly connected to the operation box 1, and the outer sides of the two groups of second sliding bars 51 are slidably connected with two groups of symmetrical first sliding blocks 52. The upper end of the first sliding block 52 is fixedly connected with a support rod 53, and the outer side of the support rod 53 near the upper end is fixedly connected with a trapezoidal placement groove 54. The two groups of trapezoidal placement grooves 54 are symmetrically designed with hypotenuses, and an electric telescopic rod 57 is installed on the inner side of the support rod 53. A semiconductor body 10 is installed between the two groups of trapezoidal placement grooves 54. The ends of the two groups of trapezoidal placement grooves 54 that are far away from each other are fixedly connected with an inclined fixing plate 55, and the lower ends of the two groups of inclined fixing plates 55 are fixedly connected with a second sliding block 56. The inner sides of the two groups of second sliding blocks 56 are slidably connected to the second sliding bars 51, and the ends of the two groups of inclined fixing plates 55 that are close to each other are fixedly connected to the two groups of first sliding blocks 52 respectively.
[0038] Specifically, the two groups of support rods 53 are pulled apart and the distance is adjusted by the second slide bar 51, and the semiconductor body 10 is placed between the two groups of trapezoidal placement grooves 54. The trapezoidal design of the trapezoidal placement groove 54 is to adapt to semiconductor bodies 10 of different widths. However, the semiconductor body 10 cannot be directly in a horizontal state after being placed in, and the center of the semiconductor body 10 is in a deviated state. The two groups of electric telescopic rods 57 are started, and the semiconductor body 10 is synchronously moved upward through the output shaft of the electric telescopic rod 57. After the semiconductor body 10 is ensured to be parallel, it is retracted and reset to make the semiconductor body 10 horizontal. When the first slide bar 45 slides downward, it touches the trapezoidal placement groove 54 and the inclined fixing plate 55, so that the trapezoidal placement groove 54 and the inclined fixing plate 55 slide in the middle of the first slide bar 56 and the first slide bar 52 respectively, so that the center of the semiconductor body 10 is parallel to the first pressure rod 42, and the trapezoidal placement groove 54, the inclined fixing plate 55, the second slide bar 56, the electric telescopic rod 57, and the first slide bar 52 form a triangular bracket state, making the structure more stable.
[0039] In this embodiment, the heating mechanism 6 includes an activated carbon adsorption box 61 fixedly connected to the operating box 1, and the upper end of the activated carbon adsorption box 61 is fixedly connected to an exhaust pipe 62, one end of the exhaust pipe 62 is fixedly connected to an exhaust fan 63, and the other end of the exhaust fan 63 is fixedly connected to an L-shaped input pipe 64.
[0040] Specifically, the exhaust fan 63 is started to absorb the moisture inside the operation box 1 and recover it to the activated carbon adsorption box 61 through the L-shaped input pipe 64 and the exhaust pipe 62 to ensure the dryness of the operation box 1.
[0041] In this embodiment, the rear end of the activated carbon adsorption box 61 is fixedly connected to an exhaust fan 65, the output port of the exhaust fan 65 is fixedly connected to an exhaust hose 66, the other end of the exhaust hose 66 is fixedly connected to a heater 67, the other end of the heater 67 is fixedly connected to a curved nozzle 68, and the curved nozzle 68 is parallel to the semiconductor body 10.
[0042] Specifically, the exhaust fan 65 is started, and the purified airflow is output through the exhaust hose 66. After being heated by the heater 67, it is output to the surface of the semiconductor body 10 by the arc nozzle 68, and the chain 75 is used to fully join the semiconductor body 10 for detection in a high temperature environment.
[0043] In this embodiment, the humidifying mechanism 7 includes a water tank 71 fixedly connected to the operating box 1, an electromagnetic water pump 72 is fixedly connected to the outer side of the water tank 71, and a water supply hose 73 is fixedly connected to the output port of the electromagnetic water pump 72, and an atomizing spray head 74 is fixedly connected to the lower end of the water supply hose 73. The atomizing spray head 74 is parallel to the semiconductor body 10, and the atomizing spray head 74 is fixedly connected to a chain 75 through a bracket. The inner side of the chain 75 is rotatably connected to two groups of symmetrical second rotating shafts 76, and the front and rear ends of the two groups of second rotating shafts 76 are rotatably connected to C-shaped fixed clamps 77. The ends of the two groups of C-shaped fixed clamps 77 that are away from each other are fixedly connected to the operating box 1, and a second motor 78 is installed at the rear end of one of the two groups of C-shaped fixed clamps 77, and the output shaft of the second motor 78 is fixedly connected to the second rotating shaft 76 at the front end.
[0044] Specifically, the electromagnetic water pump 72 is started to output the water in the water tank 71 through the water hose 73, and the second motor 78 is started to rotate the second rotating shaft 76 installed on the inner side of the C-shaped fixed clamp 77, thereby driving the chain 75 to operate. The second motor 78 can be set to rotate forward and reverse, so that the atomizing spray head 74 repeatedly sprays water mist on the semiconductor body 10 to simulate a humidity environment.
[0045] In this embodiment, a T-shaped push rod 79 is fixedly connected to the lower end of the chain 75 , and the lower end of the T-shaped push rod 79 is in contact with the baffle 8 .
[0046] Specifically, the T-shaped push rod 79 moves together with the chain 75 , so that the inner side of the operation box 1 is cleaned by the T-shaped push rod 79 and collected in the collection box 3 through the collection groove 9 .
[0047] Working principle: when in use, open the observation window 2, pull the two groups of support rods 53 apart and adjust the distance through the second slide bar 51, place the semiconductor body 10 between the two groups of trapezoidal placement grooves 54, the trapezoidal design of the trapezoidal placement grooves 54 is to adapt to semiconductor bodies 10 of different widths, but the semiconductor body 10 cannot be directly in a horizontal state after being placed in, and the center of the semiconductor body 10 is in a deviated state, start the two groups of electric telescopic rods 57, and move the semiconductor body 10 upward synchronously through the output shaft of the electric telescopic rod 57, so that the semiconductor body 10 is ensured to be parallel, and then it will be retracted and reset to make the semiconductor body 10 horizontal.
[0048] Start the hydraulic cylinder 41, so that the first pressure rod 42 is output downward, and the two groups of first slide bars 45 are moved downward through the sleeve 44. At this time, the spring 43 is pulled open, and the first slide bar 45 will touch the trapezoidal placement groove 54 and the inclined fixing plate 55 when sliding downward, so that the trapezoidal placement groove 54 and the inclined fixing plate 55 respectively slide in the middle of the first slider 52 through the second slider 56, so that the center of the semiconductor body 10 is parallel to the first pressure rod 42, the trapezoidal placement groove 54, the inclined fixing plate 55, the second slider 56, the electric telescopic rod 57, and the first slider 52 form a triangular bracket state, making the structure more stable, the first pressure rod 42 moves the pressure plate 413 downward through the second pressure rod 46 and the first rotating shaft 49, and makes the L-shaped pressure block 412 fit with the semiconductor body 10, so that the two groups of L-shaped pressure blocks 412 perform four-point bending detection on the semiconductor body 10 under the output of the hydraulic cylinder 41.
[0049] Start the first motor 48 installed at the rear end of the L-shaped mounting plate 47 to rotate the two groups of pressure plates 413, and limit the maximum rotation angle to forty-five degrees through the first semicircular block 411, so that a group of L-shaped pressure blocks 412 are rotated forty-five degrees and aligned with the semiconductor body 10, and then a three-point bending test is performed. After completion, the first motor 48 can be started again to reverse, so that the two groups of pressure plates 413 are reset, and the reset position is ensured by the second semicircular block 414. The three groups of connecting rods 410 ensure the connection and stability between the two groups of pressure plates 413.
[0050] Start the electromagnetic water pump 72 to output the water in the water tank 71 through the water supply hose 73, start the second motor 78 to rotate the second shaft 76 installed on the inner side of the C-shaped fixed clamp 77, and drive the chain 75 to operate together. The second motor 78 can be set to rotate forward and reverse, so that the atomizing spray head 74 repeatedly sprays water mist on the semiconductor body 10 to simulate the humidity environment and realize the humidity detection of the semiconductor body 10. As the partially broken defective semiconductor body 10 and the falling water fall on the surface of the baffle 8, the T-shaped push rod 79 moves with the chain 75, so that the T-shaped push rod 79 is used to clean the inside of the operating box 1 and collect it in the collection box 3 through the collection groove 9.
[0051] Start the exhaust fan 63 to absorb the moisture inside the operation box 1, and recover it to the activated carbon adsorption box 61 through the L-shaped input pipe 64 and the exhaust pipe 62 to ensure the dryness of the operation box 1. Then start the exhaust fan 65, and the purified air flow is output through the exhaust hose 66. After being heated by the heater 67, it is output to the surface of the semiconductor body 10 by the arc nozzle 68, and the semiconductor body 10 is fully joined by the chain 75 to perform detection under a high temperature environment. The fragments generated by the broken semiconductor body 10 are blocked by the observation window 2 to avoid splashing of some fragments when the semiconductor material suddenly breaks, causing damage to personnel or equipment.
[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor material bending test device, comprising an operating box (1), Features: The front end of the operation box (1) is rotatably connected to an observation window (2); the upper end of the operation box (1) is equipped with a calibration mechanism (4); a humidifying mechanism (7) is installed on one side of the calibration mechanism (4) at the upper end of the operation box (1); a placement mechanism (5) is installed below the calibration mechanism (4) on the inner side of the operation box (1); a baffle (8) is fixedly connected below the placement mechanism (5) on the inner side of the operation box (1); two groups of symmetrical collecting grooves (9) are provided on the inner side of the baffle (8); a collecting box (3) is slidably connected below the inner baffle (8) of the operation box (1); a heating mechanism (6) is installed on one side of the operation box (1); the calibration mechanism (4) comprises a hydraulic cylinder (1) fixedly connected to the operation box (1); 41), the output shaft of the hydraulic cylinder (41) is fixedly connected to a first pressure rod (42), a spring (43) is arranged on the outside of the first pressure rod (42), a sleeve (44) is slidably connected to the outside of the first pressure rod (42) near the lower end, the upper end of the spring (43) is fixedly connected to the first pressure rod (42), the lower end of the spring (43) is fixedly connected to the sleeve (44), the outside of the sleeve (44) is fixedly connected to two groups of symmetrical first sliding rods (45), the lower end of the first pressure rod (42) is fixedly connected to a second pressure rod (46), the outside of the second pressure rod (46) is fixedly connected to an L-shaped mounting plate (47), the rear end of the L-shaped mounting plate (47) is mounted with a first motor (48), The lower end of the second pressure rod (46) is rotatably connected to the first rotating shaft (49) through a retaining ring, the rear end of the first rotating shaft (49) is fixedly connected to the output shaft of the first motor (48), and the outer side of the first rotating shaft (49) is fixedly connected to two groups of symmetrical pressure plates (413), both groups of pressure plates (413) are rectangles with the same four sides, and the opposite ends of the two groups of pressure plates (413) are commonly fixedly connected to three groups of connecting rods (410), the opposite ends of the two groups of pressure plates (413) are commonly fixedly connected to the position near the upper end with a second semicircular clamping block (414), the opposite ends of the two groups of pressure plates (413) are commonly fixedly connected to the position near the side with a first semicircular clamping block (411), and the lower ends of the two groups of pressure plates (413) are fixedly connected to the first rotating shaft (48), and the lower ends of the two groups of pressure plates (413) are fixedly connected to the first rotating shaft (48), and the lower ends of the two groups of pressure plates (413) are fixedly connected to the first rotating shaft (48), and the lower ends of the two groups of pressure plates (413) are fixedly connected to the first rotating shaft (48), and the lower ends of the two groups of pressure plates (413) are fixedly connected to the first rotating shaft (48). Two groups of symmetrical L-shaped pressure blocks (412) are fixedly connected together, the second semicircular clamping block (414) is fixed at a vertical angle of 90 degrees, and the first semicircular clamping block (411) is fixed at an inclined surface of 45 degrees. The placement mechanism (5) includes two groups of second sliding rods (51) fixedly connected to the operation box (1), and the outer sides of the two groups of second sliding rods (51) are slidably connected together with two groups of symmetrical first sliding blocks (52). The upper ends of the first sliding blocks (52) are fixedly connected with support rods (53), and the outer sides of the support rods (53) are fixedly connected with trapezoidal placement grooves (54) near the upper ends. The two groups of trapezoidal placement grooves (54) are symmetrically designed with bevel edges, and the inner sides of the support rods (53) are equipped with electric telescopic rods (57).A semiconductor body (10) is installed between the two groups of trapezoidal placement grooves (54), and the ends of the two groups of trapezoidal placement grooves (54) that are far away are fixedly connected to an inclined fixing plate (55), and the lower ends of the two groups of inclined fixing plates (55) are fixedly connected to a second slider (56), and the inner sides of the two groups of the second sliders (56) are slidably connected to the second slide bars (51), and the ends of the two groups of inclined fixing plates (55) that are close to each other are fixedly connected to the two groups of first sliders (52), respectively, and the semiconductor body (10) is synchronously moved upward by the output shaft of the electric telescopic rod (57), and after the semiconductor body (10) is ensured to be parallel, it is retracted and reset to make the semiconductor body (10) horizontal.
2. A semiconductor material bending test device according to claim 1, Features: The heating mechanism (6) comprises an activated carbon adsorption box (61) fixedly connected to the operation box (1); an upper end of the activated carbon adsorption box (61) is fixedly connected to an exhaust pipe (62); one end of the exhaust pipe (62) is fixedly connected to an exhaust fan (63); and the other end of the exhaust fan (63) is fixedly connected to an L-shaped input pipe (64).
3. A semiconductor material bending test device according to claim 2, Features: The rear end of the activated carbon adsorption box (61) is fixedly connected to an exhaust fan (65), the output port of the exhaust fan (65) is fixedly connected to an exhaust hose (66), the other end of the exhaust hose (66) is fixedly connected to a heater (67), the other end of the heater (67) is fixedly connected to a curved surface nozzle (68), and the curved surface nozzle (68) is parallel to the semiconductor body (10).
4. A semiconductor material bending test device according to claim 1, Features: The humidifying mechanism (7) comprises a water tank (71) fixedly connected to the operating box (1); an electromagnetic water pump (72) is fixedly connected to the outside of the water tank (71); a water delivery hose (73) is fixedly connected to the output port of the electromagnetic water pump (72); an atomizing spray head (74) is fixedly connected to the lower end of the water delivery hose (73); the atomizing spray head (74) is parallel to the semiconductor body (10); the atomizing spray head (74) is fixedly connected to a chain (75) via a bracket; the chain ( Two sets of symmetrical second rotating shafts (76) are rotatably connected to the inner side of the two sets of second rotating shafts (75), and the front and rear ends of the two sets of second rotating shafts (76) are rotatably connected to C-shaped fixed clamps (77), and the ends of the two sets of C-shaped fixed clamps (77) that are away from each other are fixedly connected to the operation box (1), and a second motor (78) is installed at the rear end of one of the two sets of C-shaped fixed clamps (77), and the output shaft of the second motor (78) is fixedly connected to the front end of the second rotating shaft (76).
5. A semiconductor material bending test device according to claim 4, Features: The lower end of the chain (75) is fixedly connected to a T-shaped push rod (79), and the lower end of the T-shaped push rod (79) is in contact with the baffle (8).