Epitaxial wafer stripping device and stripping method

Abstract

The present invention discloses an epitaxial wafer stripping device and a stripping method, belonging to the technical field of epitaxial wafer processing, comprising an upper adsorption part, a lower adsorption part and a clamp; the upper adsorption part is located above the clamp and is used to adsorb and strip the upper layer of the epitaxial wafer; the lower adsorption part is located below the clamp, and when the upper adsorption part adsorbs and strips, the lower adsorption part provides reverse suction at a corresponding position to adsorb the bottom layer of the epitaxial wafer and maintain the reverse suction; the clamp is used to clamp and fix the epitaxial wafer; it also includes an exhaust component and a connecting component; the exhaust component provides suction for the upper adsorption part and the lower adsorption part; the present invention, by providing an upper adsorption part and a lower adsorption part, the two are combined for stripping, and the upper and lower forces can be balanced, so that other parts will not be caused to undergo large deformation during stripping, and the effect of stable stripping can be achieved, thereby solving the problem that the epitaxial wafer may be deformed as a whole when it is automatically stripped in the prior art.

Description

Technical Field

[0001] The invention relates to the technical field of epitaxial wafer processing, and in particular to an epitaxial wafer stripping device and a stripping method. Background Art

[0002] Epitaxy is a type of semiconductor process. In the production process, the bottom layer of the silicon wafer is P-type substrate silicon (sometimes with a buried layer), and then a layer of single crystal silicon is grown on the substrate, which is called the epitaxial layer; later, the base region, emitter region, etc. are injected into the epitaxial layer. After a series of processing on the epitaxial layer, it meets the standard for manufacturing devices, and then a series of processes are performed on the epitaxial layer using technologies such as photolithography or dry etching to manufacture devices, and then they are cut into pieces of devices, and then the devices are peeled off from the substrate;

[0003] In the prior art, the wafers need to be removed one by one manually after cutting, so its efficiency is not high. In the Chinese invention patent with application number 202211457889.7, a wafer peeling device is disclosed. In this patent, an automated machine is used to replace manual wafer peeling. Specifically, a suction nozzle is used to achieve the effect of automatic peeling. However, when the suction nozzle is directly used for suction and peeling, if the connection of a small piece is relatively strong, it may cause the entire piece to produce a certain deformation during suction, and then other small pieces may be affected, causing performance impact, so it needs to be improved. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that the epitaxial wafer may be deformed when it is automatically peeled off, and to propose an epitaxial wafer peeling device and a peeling method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] An epitaxial wafer stripping device comprises an upper adsorption part, a lower adsorption part and a clamp;

[0007] An upper adsorption part, which is located above the fixture and is used to adsorb and peel off the upper layer of the epitaxial wafer;

[0008] The lower adsorption part is located below the fixture. When the upper adsorption part is adsorbing and peeling, the lower adsorption part provides reverse suction at the corresponding position to adsorb and hold the bottom layer of the epitaxial wafer;

[0009] A fixture, which is used to clamp and fix the epitaxial wafer;

[0010] Also included are an air extraction assembly and a connection assembly;

[0011] A suction assembly, which provides suction for the upper adsorption part and the lower adsorption part;

[0012] A connecting component is used to connect the air extraction component with the corresponding lower adsorption part.

[0013] Preferably, a plurality of the lower adsorption parts are provided, and the upper adsorption part is located on the same axis as the corresponding lower adsorption part during adsorption.

[0014] Preferably, the middle and bottom of the lower adsorption portion are both provided with a one-way valve;

[0015] The one-way valve comprises a valve post, a first air hole and an elastic leather cover;

[0016] A valve column, the interior of which is communicated with the internal passage of the lower adsorption portion;

[0017] A first air hole is provided in the middle of the valve stem;

[0018] The elastic leather cover is arranged on the valve post.

[0019] Preferably, the connecting assembly comprises a sleeve, a piston head and a reset member;

[0020] A sleeve, a second air hole is opened on its annular surface; the top end of the sleeve is plugged into the bottom of the lower adsorption part, and the valve post located at the bottom of the lower adsorption part can resist the piston head;

[0021] The piston head is slidably arranged inside the sleeve and can close the second air hole under the action of the reset member.

[0022] Preferably, the air extraction assembly comprises an air extraction pump, a first air pipe and a second air pipe;

[0023] A second air pipe, one end of which is connected to the air suction port of the air suction pump, and the other end of which is connected to the air suction port of the upper adsorption part;

[0024] One end of the first air pipe is communicated with the air suction port of the air suction pump, and the other end is communicated with the sleeve.

[0025] Preferably, the clamp is composed of a first fixed plate, a second fixed plate and a plurality of groups of clamp block assemblies;

[0026] The bottom of the lower adsorption portion is fixedly connected to the first fixed plate, and the lower portion of the lower adsorption portion is fixedly connected to the second fixed plate;

[0027] A plurality of groups of the clamping block assemblies are evenly arranged on the edge of the first fixed plate in a circumferential manner.

[0028] Preferably, the clamping block assembly comprises a bracket, a slide plate and a third telescopic rod;

[0029] A bracket, the bottom end of which is fixedly arranged on the edge of the first fixed plate, and the upper part of which is provided with a cylinder assembly;

[0030] The slide plate is slidably arranged on the top surface of the bracket, the third telescopic rod is fixedly arranged on the slide plate, and a clamping block is fixedly arranged on the telescopic end of the third telescopic rod.

[0031] Preferably, the cylinder assembly is used to perform batch air extraction on the lower adsorption part and to change the position of the slide plate;

[0032] The cylinder assembly comprises a cylinder, which is fixedly arranged in the middle of the bracket and has a one-way air extraction assembly arranged inside;

[0033] The lower adsorption part is communicated with the cylinder through the third air pipe.

[0034] Preferably, the one-way air extraction component is moved to extract air via a fourth telescopic rod;

[0035] The fourth telescopic rod is fixedly arranged on the upper part of the bracket, and the fourth telescopic rod can synchronously drive the slide plate to move.

[0036] The epitaxial wafer stripping method comprises the following steps:

[0037] Step 1: placing the cut epitaxial wafer on the lower adsorption part, and clamping and fixing the epitaxial wafer with a clamp;

[0038] Step 2: After the epitaxial wafer is fixed, the upper adsorption part is used to adsorb and peel off the cut epitaxial wafers one by one in a certain order;

[0039] Step 3: When the upper adsorption part adsorbs the upper layer of a cut epitaxial wafer, the lower adsorption part at the corresponding position of the upper adsorption part also starts to adsorb, forming a suction force that opposes the upper adsorption part, so as to avoid the problem that the epitaxial wafer at this position is only subjected to the upward force, resulting in the deformation of the epitaxial wafer as a whole;

[0040] Step 4: After one row or one column of the cut epitaxial wafers is peeled off, start the cylinder assembly to open the clamping block assembly near the location, and evacuate all the lower adsorption parts at the location, so that the epitaxial wafer area after peeling is subjected to downward force, causing it to deform slightly and then be clamped again by the clamping block assembly, so that separation can be generated between the upper and lower layers of the peeled area and the unpeeled area, and then the upper adsorption part is used for adsorption and peeling, and this cycle is repeated until the peeling operation is completed.

[0041] Compared with the prior art, the present invention provides an epitaxial wafer stripping device and a stripping method, which have the following beneficial effects.

[0042] 1. The present invention provides an upper adsorption part and a lower adsorption part, and the two are combined for peeling, so that the upper and lower forces can be balanced, and other parts will not be caused to undergo significant deformation during peeling, and the effect of stable peeling can be achieved, thereby solving the problem in the prior art that the epitaxial wafer may be deformed as a whole when it is automatically peeled.

[0043] 2. The cylinder assembly provided in the present invention can be used to evacuate all the lower suction nozzles at a row or column of cut epitaxial wafers after they are peeled off, so that the peeled epitaxial wafer area has a slight downward force, which can produce a slight separation between the upper and lower layers of the peeled area and the unpeeled area, making subsequent peeling easier.

[0044] 3. The present invention can drive the slide to move by setting a cylinder assembly, and can control the movement of the slide while batch vacuuming, and then control the clamp to open, without affecting the slight deformation of the epitaxial wafer. Then, when the cylinder assembly is reset, it also drives the slide to reset, and then controls the clamp to clamp the epitaxial wafer again.

[0045] Other advantages, objectives and features of the present invention will be described in part in the following description; and in part, will be apparent to those skilled in the art based on an examination of the following; or, may be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a schematic diagram of the overall use structure of the present invention.

[0047] Figure 2 It is a schematic diagram of the overall use structure of the present invention.

[0048] Figure 3 It is a schematic diagram of the overall structure of the present invention.

[0049] Figure 4 It is a schematic diagram of the overall cross-sectional structure of the present invention.

[0050] Figure 5 For the present invention Figure 4 Enlarged structural diagram at A in the middle.

[0051] Figure 6 It is a schematic structural diagram of the lower adsorption part in the present invention.

[0052] Figure 7 It is a schematic diagram of the cross-sectional structure of the lower adsorption part in the present invention.

[0053] Figure 8 It is a schematic diagram of the split structure of the lower adsorption part in the present invention.

[0054] Fig. 9It is a partial structural schematic diagram of the present invention.

[0055] Fig.10 It is a partial structural schematic diagram of the present invention.

[0056] Fig.11 It is a partial cross-sectional structural schematic diagram of the present invention.

[0057] Fig.12 For the present invention Fig.11 Enlarged structural diagram at B in the middle.

[0058] Fig.13 It is a schematic diagram of the structure of the one-way air extraction component in the present invention.

[0059] In the figure: 1, guide rail; 2, first fixed plate; 3, first telescopic rod; 4, first slider; 5, first air pipe; 6, second telescopic rod; 7, second slider; 8, motor; 9, second support rod; 10, second air pipe; 11, upper adsorption part; 12, epitaxial wafer; 13, clamping block; 14, third telescopic rod; 15, slide plate; 16, synchronous rod; 17, fourth telescopic rod; 18, cylinder; 19, bracket; 20, third air pipe; 21. First fixed plate; 22. Lower adsorption part; 23. Second fixed plate; 24. Second fixed plate; 25. Valve column; 26. Sleeve; 27. First support rod; 28. Fixed air pipe; 29. ​​Piston head; 30. First elastic member; 31. Elastic leather cover; 32. Movable rod; 33. Sliding cylinder; 34. Fixed cylinder; 35. Piston plate; 36. Second elastic member; 37. Through hole; 38. First air hole; 39. Second air hole. DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0061] Reference Figure 1-13 The epitaxial wafer stripping device includes an upper adsorption part 11, a lower adsorption part 22 and a clamp.

[0062] The upper adsorption part 11 is located above the fixture and is used to adsorb and peel off the upper layer of the epitaxial wafer 12.

[0063] The lower adsorption part 22 is located below the fixture. When the upper adsorption part 11 is adsorbed and peeled, the lower adsorption part 22 provides reverse suction at the corresponding position to adsorb and hold the bottom layer of the epitaxial wafer 12.

[0064] The fixture is used to clamp and fix the epitaxial wafer 12 .

[0065] It also includes an exhaust component and a connecting component.

[0066] The suction component provides suction force for the upper adsorption part 11 and the lower adsorption part 22 .

[0067] The connecting component is used to connect the air extraction component with the corresponding lower adsorption part 22.

[0068] In a specific embodiment of the present invention, the upper adsorption portion 11 mainly functions to adsorb and peel off the upper layer of the epitaxial wafer 12 after cutting, so that the upper and lower layers of the epitaxial wafer 12 are separated.

[0069] The lower adsorption part 22 is located below the epitaxial wafer 12 at the corresponding position when the upper adsorption part 11 is performing adsorption and peeling, and adsorbs the lower layer of the epitaxial wafer 12 at that position, and the suction force is opposite to the suction direction of the upper adsorption part 11. This design can ensure that when the upper adsorption part 11 is performing adsorption and peeling at a certain position, it will not cause the shape changes of other positions of the entire epitaxial wafer 12, thereby avoiding the upper layer of the epitaxial wafer 12 at other positions being damaged due to shape changes. Therefore, this setting can make the peeling more stable.

[0070] When the clamp is clamping and limiting the epitaxial wafer 12, it clamps the outer annular surface of the epitaxial wafer 12 so that the position of the epitaxial wafer 12 is fixed and limited, so that the epitaxial wafer 12 can remain motionless during the adsorption and stripping process.

[0071] In this solution, when the epitaxial wafer 12 is placed on the lower adsorption portion 22, it can be placed manually or by a robot arm.

[0072] In this solution, the movement of the upper adsorption part 11 and the connecting component is driven by the moving component.

[0073] The moving assembly includes a guide rail 1 , a second fixing plate 24 , a second telescopic rod 6 , a second sliding block 7 , a motor 8 and a second supporting rod 9 .

[0074] The second fixed plate 24 is fixedly set at the outer middle position of the guide rail 1, the second slider 7 is slidably set in the guide rail 1, the bottom end of the second telescopic rod 6 is fixedly set on the top surface of the second fixed plate 24, and the telescopic end of the second telescopic rod 6 is fixedly connected to the bottom surface of the second slider 7.

[0075] The motor 8 is fixedly arranged on the top surface of the second sliding block 7 , one end of the second supporting rod 9 is fixedly connected to the output shaft of the motor 8 , and the upper adsorption portion 11 is fixedly arranged on the other end of the second supporting rod 9 .

[0076] When in use, the extension and retraction of the second telescopic rod 6 can drive the second slider 7 to move up and down in the guide rail 1, and then drive the motor 8 and the second support rod 9 to move up and down, thereby driving the upper adsorption part 11 to achieve the effect of moving up and down, so that the upper adsorption part 11 can move down to contact the upper layer of the epitaxial wafer 12, and then adsorb and move up again to achieve the peeling effect; after peeling, the motor 8 can be used to drive the second support rod 9 to swing, move the upper adsorption part 11 to other positions, and then unload.

[0077] The moving assembly further includes a first fixing plate 2 , a first telescopic rod 3 , a first sliding block 4 and a first supporting rod 27 .

[0078] The first fixed plate 2 is fixedly arranged at the outer lower position of the guide rail 1, the first slider 4 is slidably arranged in the guide rail 1, the bottom end of the first telescopic rod 3 is fixedly arranged on the top surface of the first fixed plate 2, the telescopic end of the first telescopic rod 3 is fixedly connected to the bottom surface of the first slider 4, one end of the first support rod 27 is fixedly connected to the first slider 4, and the connecting component is arranged at the other end of the first support rod 27.

[0079] The moving component also includes a horizontal moving component (not shown in the drawings), which is mainly used to drive the guide rail 1 to move horizontally, that is, the guide rail 1 can move forward, backward, left and right under the drive of the horizontal moving component, so that the upper adsorption part 11 can be moved to a certain position on the epitaxial wafer 12 for peeling, and the connecting component can be moved to the corresponding lower adsorption part 22 to connect the vacuum component and the lower adsorption part 22.

[0080] A plurality of lower adsorption parts 22 are provided, and the upper adsorption part 11 is located on the same axis as the corresponding lower adsorption part 22 during adsorption.

[0081] In this solution, the number of the lower adsorption parts 22 is the same as the number of complete small pieces formed after the epitaxial wafer 12 is cut, and they correspond one to one, that is, there is a lower adsorption part 22 under each small piece.

[0082] That is, during use, when the upper adsorption part 11 moves to a small piece on the epitaxial wafer 12 for adsorption and peeling, the connecting component will move to the bottom of the lower adsorption part 22 corresponding to the small piece, and connect the vacuum component with the lower adsorption part 22. In this way, when the upper adsorption part 11 adsorbs the small piece, the corresponding lower adsorption part 22 can adsorb the lower layer of the epitaxial wafer 12 at that location, forming a suction force opposite to the upper adsorption part 11, so that the epitaxial wafer 12 as a whole is not easily deformed during adsorption and peeling.

[0083] One-way valves are provided at the middle and bottom of the lower adsorption portion 22 .

[0084] The one-way valve comprises a valve post 25 , a first air hole 38 and an elastic leather cover 31 .

[0085] The interior of the valve stem 25 is communicated with the internal passage of the lower adsorption portion 22 .

[0086] The first air hole 38 is opened in the middle of the valve stem 25 .

[0087] The elastic leather cover 31 is disposed on the valve post 25 for covering.

[0088] Through this arrangement, after the bottom of the lower adsorption part 22 is connected to the exhaust component through the connecting component, only the effect of suction generated by exhaust can be achieved. With this arrangement, after the connecting component disconnects the lower adsorption part 22 from the exhaust component, it can still maintain a certain suction and adsorb on the lower layer of the epitaxial wafer 12, so as to achieve a more stable effect when the upper adsorption part 11 subsequently adsorbs and peels off the adjacent small pieces. At this time, a slight downward force is applied to the position, so it will not cause a large deformation to the epitaxial wafer 12 as a whole. Therefore, a certain separation can be produced between the small pieces adjacent to the lower layer and the upper layer at this point, so that the upper adsorption part 11 can be easier to adsorb and peel off the adjacent small pieces.

[0089] The connecting assembly includes a sleeve 26, a piston head 29 and a reset member.

[0090] The sleeve 26 has a second air hole 39 on its annular surface; the top end of the sleeve 26 is plugged into the bottom of the lower adsorption portion 22 , and the valve column 25 located at the bottom of the lower adsorption portion 22 can resist the piston head 29 .

[0091] The piston head 29 is slidably disposed inside the sleeve 26 and can close the second air hole 39 under the action of the reset member.

[0092] The reset member may be a first elastic member 30, which is disposed inside the sleeve 26 and below the piston head 29, and the piston head 29 is lifted up by the elastic force of the first elastic member 30. The first elastic member 30 may be a spring.

[0093] At the same time, in order to limit the position of the piston head 29, a sliding rod can be fixedly set on the bottom surface of the piston head 29, and a circular plate with a hole in the center can be fixedly set on the inner lower part of the sleeve 26. The bottom of the sliding rod passes through the hole, and a round table is fixedly set at the bottom end of the sliding rod. In this way, under normal conditions, the piston head 29 will move upward under the elastic force of the first elastic member 30, and the round table will be blocked by the circular plate. At this time, the piston head 29 is exactly located at the position of the second air hole 39, thereby achieving the effect of closing the second air hole 39.

[0094] The air extraction component comprises an air extraction pump, a first air pipe 5 and a second air pipe 10 .

[0095] One end of the second air pipe 10 is connected to the air suction port of the air suction pump, and the other end is connected to the air suction port of the upper adsorption part 11.

[0096] One end of the first air pipe 5 is connected to the air suction port of the air suction pump, and the other end is connected to the sleeve 26.

[0097] When in use, the upper adsorption part 11 is moved to the top of the small piece to be peeled off under the drive of the horizontal moving component. At the same time, the connecting component is also moved to the bottom of the corresponding lower adsorption part 22 under the drive of the horizontal moving component. Then, the upper adsorption part 11 is moved downward under the drive of the second telescopic rod 6, so that the suction nozzle of the upper adsorption part 11 contacts the corresponding divided small piece. At the same time, the first telescopic rod 3 drives the first slider 4 to move upward, and then drives the sleeve 26 to move upward through the first support rod 27, so that the sleeve 26 is inserted into the bottom of the lower adsorption part 22; during the insertion process, the piston head 29 will be supported by the valve column 25 located at the bottom of the lower adsorption part 22, and then the first elastic member 30 is compressed, and a relative displacement occurs between the piston head 29 and the sleeve 26, leaking out the second air hole 39.

[0098] Then start the vacuum pump to evacuate the air. The gas in the upper adsorption part 11 is sucked away by the vacuum pump through the second air pipe 10, thereby adsorbing the upper small piece of the epitaxial wafer 12. The gas in the lower adsorption part 22 passes through the lower valve column 25, and then passes through the first air hole 38, causing the elastic leather cover 31 to deform, and enters the sleeve 26 from between the elastic leather cover 31 and the valve column 25, and then enters the first air pipe 5 from the second air hole 39 and is sucked away, so that the lower adsorption part 22 adsorbs the lower layer of the epitaxial wafer 12.

[0099] After both the upper adsorption part 11 and the lower adsorption part 22 are adsorbed, the upper adsorption part 11 moves upward to peel off the small piece. After peeling off, the connecting component moves downward, that is, the sleeve 26 moves downward. During the downward movement, the piston head 29 will slowly reset under the action of the first elastic member 30 until the piston head 29 blocks the second air hole 39 again, and then the sleeve 26 is completely separated from the lower adsorption part 22. Since the upper adsorption part 11 and the lower adsorption part 22 use the same vacuum pump to provide suction, when the connecting component is separated from the lower adsorption part 22, it is equivalent to the vacuum pump now only providing suction for the upper adsorption part 11. Therefore, the suction provided at this time is stronger, so that the upper adsorption part 11 drives the adsorbed small piece to be transferred to the transfer table or sent to the partition box. The small piece is not easy to fall off the upper adsorption part 11, thereby achieving the effect of stable transportation.

[0100] The clamp is composed of a first fixing plate 21, a second fixing plate 23 and a plurality of clamp block assemblies.

[0101] The bottom of the lower adsorption portion 22 is fixedly connected to the first fixed plate 21 , and the lower portion of the lower adsorption portion 22 is fixedly connected to the second fixed plate 23 .

[0102] A plurality of groups of clamp block assemblies are evenly arranged in a circumference at the edge of the first fixing plate 21 . In the present embodiment, a total of six clamp block assemblies are provided.

[0103] The clamping block assembly includes a bracket 19 , a slide plate 15 and a third telescopic rod 14 .

[0104] The bottom end of the bracket 19 is fixedly arranged on the edge of the first fixed plate 21, and the upper part thereof is provided with a cylinder assembly.

[0105] The slide plate 15 is slidably disposed on the top surface of the bracket 19 , the third telescopic rod 14 is fixedly disposed on the slide plate 15 , and a clamping block 13 is fixedly disposed on the telescopic end of the third telescopic rod 14 .

[0106] The cylinder assembly is used to perform batch air extraction on the lower adsorption portion 22 and to change the position of the slide plate 15 .

[0107] When clamping, first use the cylinder assembly to adjust the slide plate 15 to a certain position and keep it stationary, then place the epitaxial wafer 12 on the lower adsorption portion 22 and between the six clamping block assemblies, and then the third telescopic rods 14 on the six clamping block assemblies simultaneously drive their respective corresponding clamping blocks 13 to clamp and limit the epitaxial wafer 12.

[0108] The cylinder assembly comprises a cylinder 18, which is fixedly arranged in the middle of a bracket 19 and has a one-way air extraction assembly arranged inside.

[0109] The one-way air extraction assembly includes a movable rod 32, a piston plate 35, a fixed cylinder 34, a sliding cylinder 33 and a second elastic member 36; one end of the movable rod 32 is fixedly connected to the center of the piston plate 35, and the piston plate 35 is slidably set inside the cylinder 18. The other end of the movable rod 32 passes through one end surface of the cylinder 18 and extends to the outside of the cylinder 18.

[0110] The fixed cylinder 34 is fixedly arranged on the piston plate 35, and the fixed cylinder 34 and the movable rod 32 are located on the same surface of the piston plate 35, the sliding cylinder 33 is slidably arranged outside the fixed cylinder 34, and the second elastic member 36 is arranged inside the fixed cylinder 34, one end of the second elastic member 36 is fixedly connected to the piston plate 35, and the other end is fixedly connected to the sliding cylinder 33, and a groove is provided on the annular surface of the sliding cylinder 33 for ventilation. The second elastic member 36 can be a tension spring.

[0111] The piston plate 35 defines a through hole 37 , and the through hole 37 is coaxial with the corresponding fixing cylinder 34 .

[0112] The lower adsorption part 22 is connected to the cylinder 18 through the third air pipe 20 ; a fixed air pipe 28 is fixedly arranged in the middle of the lower adsorption part 22 , and the fixed air pipe 28 covers the one-way valve located in the middle of the lower adsorption part 22 ; the fixed air pipe 28 is connected to the third air pipe 20 .

[0113] like Fig.10 As shown, in this embodiment, the lower adsorption portion 22 is provided with six rows, the two left rows correspond to the two cylinder assemblies on the left, the two middle rows correspond to the two middle cylinder assemblies, and the two right rows correspond to the two cylinder assemblies on the right, and are connected to the corresponding cylinder assemblies through different third air pipes 20 respectively.

[0114] When connected, both ends of the third air pipe 20 are connected to the cylinders 18 of the corresponding two cylinder assemblies respectively, and the corresponding lower adsorption part 22 is connected to the middle section of the third air pipe 20 through the fixed air pipe 28.

[0115] The end of the third air pipe 20 is connected to the end of the cylinder 18 away from the movable rod 32 .

[0116] The one-way air extraction component moves and extracts air via the fourth telescopic rod 17 .

[0117] The fourth telescopic rod 17 is fixedly disposed on the upper portion of the bracket 19 , and the fourth telescopic rod 17 can synchronously drive the slide plate 15 to move.

[0118] The outer end of the movable rod 32 is connected to the slide plate 15 via a synchronization rod 16, and the telescopic end of the fourth telescopic rod 17 is fixedly connected to the synchronization rod 16, and the telescopic end of the fourth telescopic rod 17 drives the synchronization rod 16 to move, so that the synchronization rod 16 can drive the slide plate 15 and the movable rod 32 to move at the same time.

[0119] The overall workflow is as follows: the fourth telescopic rod 17 drives the synchronous rod 16 to move toward the cylinder 18, so that the movable rod 32 is retracted into the cylinder 18, and the slide plate 15 is away from the fourth telescopic rod 17, and then maintains this state, and the third telescopic rod 14 is in a retracted state.

[0120] The cut epitaxial wafer 12 is placed on the lower adsorption part 22 , and after the cut small pieces correspond to the lower adsorption part 22 one by one, the six third telescopic rods 14 drive their respective clamping blocks 13 to approach the epitaxial wafer 12 to clamp and fix the epitaxial wafer 12 .

[0121] After fixing, the motor 8 drives the second support rod 9 to rotate, so that the upper adsorption part 11 is coaxial with the sleeve 26 of the connecting component, and then the horizontal moving component drives the upper adsorption part 11 to move to the position above the divided small pieces.

[0122] In the present scheme, the stripping sequence is to strip one row at a time. For the convenience of description, the rightmost row is designated as the first row, that is, the upper adsorption part 11 is first moved to the top of a small piece in the first row. At this time, the connecting component is located below the corresponding lower adsorption part 22, and then the upper adsorption part 11 is moved downward by the second telescopic rod 6 and contacts the small piece, and the connecting component is moved upward by the first telescopic rod 3 and inserted into the corresponding lower adsorption part 22 for connection, and then the vacuum pump is used to pump air so that both the upper adsorption part 11 and the lower adsorption part 22 generate suction, and then the upper adsorption part 11 is moved upward to strip off the small piece, and then the connecting component is moved downward to disconnect the vacuum component from the lower adsorption part 22, and the lower adsorption part 22 connected to the connecting component still provides a certain suction to the lower layer of the epitaxial wafer 12.

[0123] Then the motor 8 drives the upper adsorption part 11 to rotate, and cooperates with the horizontal moving component to send the peeled small pieces to the transfer table or the carrying box to complete the peeling of the small pieces. In this way, the small pieces in the first row and the second row are peeled off in this cycle. When the last small piece in the second row is peeled off and sent to the transfer table or the carrying box, the two cylinder components corresponding to the lower adsorption parts 22 of the first row and the second row start to work.

[0124] When the cylinder assembly is working, the fourth telescopic rod 17 contracts first, driving the synchronous rod 16 to approach the fourth telescopic rod 17. At this time, the corresponding slide 15 will move accordingly, so that the third telescopic rod 14 on the slide 15 moves, and then the corresponding clamp 13 is separated from the epitaxial wafer 12. At the same time, the movable rod 32 will also be pulled outward, and then the piston plate 35 moves in the cylinder 18 to achieve the effect of pumping air, so that the corresponding lower adsorption parts 22 of the first and second rows are pumped at the same time to achieve a stronger suction force, so that the area of ​​the epitaxial wafer 12 from which the upper small piece has been peeled off is slightly deformed downward, so that the boundary between the unpeeled area and the peeled area will be slightly separated, that is, at the third row position, so that it is easier to peel off the third row.

[0125] After the batch of gas is pumped out, the fourth telescopic rod 17 drives the synchronous rod 16 to reset, so that the corresponding clamping block 13 re-clamps the annular surface of the epitaxial wafer 12. At the same time, the movable rod 32 is also retracted into the cylinder 18, driving the piston plate 35 to reset. During the resetting process, the piston plate 35 will send gas into the third air pipe 20, but due to the existence of the one-way valve on the lower adsorption part 22, the gas will be compressed, and then the gas will enter the fixed cylinder 34 from the through hole 37 and then push open the sliding cylinder 33, and then flow out from the gap between the sliding cylinder 33 and the fixed cylinder 34, so that the piston plate 35 can be normally reset; after the resetting is completed, the upper adsorption part 11 starts the peeling of the third and fourth rows, and the cycle is repeated until all are peeled off.

[0126] After all the stripping is completed, the clamp is opened, the lower adsorption part 22 is deflated, and the lower layer of the epitaxial wafer 12 (equivalent to the substrate or base) is removed; in order to facilitate the deflation of the lower adsorption part 22, an additional pipeline can be set in the middle of the lower adsorption part 22, and the pipeline is connected to the internal channel of the lower adsorption part 22, and a valve is set on the pipeline. During the stripping operation, the valve is always in a closed state to prevent the lower adsorption part 22 from leaking. When the stripping is completed, the valve is opened to allow the lower adsorption part 22 to leak, so as to facilitate the removal of the lower layer of the epitaxial wafer 12.

[0127] This embodiment is mainly suitable for making chips on the epitaxial wafer 12, and the chips need to be peeled off from the base or substrate of the epitaxial wafer 12, that is, after the epitaxial wafer 12 is processed and cut into individual chips or other devices through a series of processes, the chips or devices are peeled off from the substrate or substrate.

[0128] The epitaxial wafer stripping method comprises the following steps:

[0129] Step 1: placing the cut epitaxial wafer 12 on the lower adsorption portion 22, and clamping and fixing the epitaxial wafer 12 with a clamp;

[0130] Step 2: After the epitaxial wafer 12 is fixed, the upper adsorption part 11 is used to adsorb and peel off the cut epitaxial wafers 12 one by one in a certain order;

[0131] Step 3: When the upper adsorption part 11 adsorbs the upper layer of a cut epitaxial wafer 12, the lower adsorption part 22 at the corresponding position of the upper adsorption part 11 also starts to adsorb, forming a suction force that opposes the upper adsorption part 11, so as to avoid the problem that the epitaxial wafer 12 at this position is only subjected to the upward force, resulting in the overall deformation of the epitaxial wafer 12;

[0132] Step 4: After one row or one column of the cut epitaxial wafers 12 is peeled off, start the cylinder assembly to open the clamping block assembly near the location, and evacuate all the lower adsorption parts 22 at the location, so that the peeled epitaxial wafer 12 area is subjected to a downward force, causing it to be slightly deformed and then re-clamped by the clamping block assembly, so that a slight separation can be generated between the upper and lower layers of the peeled area and the unpeeled area, and then the upper adsorption part 11 is used for adsorption and peeling, and this cycle is repeated until the peeling operation is completed.

[0133] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0134] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0135] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An epitaxial wafer stripping device, characterized in that: It comprises an upper adsorption part (11), a lower adsorption part (22) and a clamp; An upper adsorption portion (11), which is located above the fixture and is used to adsorb and peel off the upper layer of the epitaxial wafer (12); A lower adsorption portion (22) is located below the clamp, and when the upper adsorption portion (11) is adsorbed and peeled, the lower adsorption portion (22) provides a reverse suction force at a corresponding position to adsorb the bottom layer of the epitaxial wafer (12) and maintain the reverse suction force; A clamp, used for clamping and fixing the epitaxial wafer (12); Also included are an exhaust assembly and a connection assembly; An air suction component, which provides suction force for the upper adsorption part (11) and the lower adsorption part (22); A connecting assembly, used to connect the air extraction assembly to the corresponding lower adsorption portion (22); The middle and bottom of the lower adsorption portion (22) are both provided with one-way valves; The one-way valve comprises a valve post (25), a first air hole (38) and an elastic leather cover (31); A valve column (25), the interior of which is in communication with the internal passage of the lower adsorption portion (22); A first air hole (38) is provided in the middle of the valve column (25); An elastic leather cover (31) is disposed on the valve post (25); The connecting assembly comprises a sleeve (26), a piston head (29) and a reset member; A sleeve (26) having a second air hole (39) formed on its annular surface; the top end of the sleeve (26) is plugged into the bottom of the lower adsorption portion (22), and the valve column (25) located at the bottom of the lower adsorption portion (22) is capable of resisting the piston head (29); A piston head (29) is slidably disposed inside the sleeve (26) and is capable of closing the second air hole (39) under the action of a reset member; The air extraction component comprises an air extraction pump, a first air pipe (5) and a second air pipe (10); A second air pipe (10), one end of which is connected to the air suction port of the air suction pump, and the other end of which is connected to the air suction port of the upper adsorption part (11); A first air pipe (5), one end of which is connected to the air suction port of the air suction pump, and the other end of which is connected to the sleeve (26); The clamp is composed of a first fixed plate (21), a second fixed plate (23) and a plurality of clamp block assemblies; The bottom of the lower adsorption portion (22) is fixedly connected to the first fixed plate (21), and the lower portion of the lower adsorption portion (22) is fixedly connected to the second fixed plate (23); A plurality of groups of the clamp block assemblies are evenly arranged in a circumferential manner at the edge of the first fixed plate (21); the clamp block assemblies include a bracket (19), a slide plate (15) and a third telescopic rod (14); A bracket (19), the bottom end of which is fixedly arranged on the edge of the first fixed plate (21), and the upper part of which is provided with a cylinder assembly; A slide plate (15) is slidably disposed on the top surface of the bracket (19); the third telescopic rod (14) is fixedly disposed on the slide plate (15); and a clamping block (13) is fixedly disposed on the telescopic end of the third telescopic rod (14); The cylinder assembly is used to perform batch air extraction on the lower adsorption portion (22) and is also used to change the position of the slide plate (15); The cylinder assembly comprises a cylinder (18), wherein the cylinder (18) is fixedly arranged in the middle of a bracket (19), and a one-way air extraction assembly is arranged inside the cylinder (18); The lower adsorption portion (22) is connected to the cylinder (18) via a third air pipe (20); The one-way air extraction component is moved to extract air via a fourth telescopic rod (17); The fourth telescopic rod (17) is fixedly arranged on the upper part of the bracket (19), and the fourth telescopic rod (17) can synchronously drive the slide plate (15) to move.

2. The epitaxial wafer stripping device according to claim 1, characterized in that: A plurality of lower adsorption parts (22) are provided, and the upper adsorption part (11) is located on the same axis as the corresponding lower adsorption part (22) during adsorption.

3. A method for stripping an epitaxial wafer, comprising: using the epitaxial wafer stripping device according to claim 2, characterized in that: The steps include: Step 1: placing the cut epitaxial wafer (12) on the lower adsorption portion (22), and clamping and fixing the epitaxial wafer (12) using a clamp; Step 2: After the epitaxial wafer (12) is fixed, the upper adsorption portion (11) is used to adsorb and peel off the cut epitaxial wafers (12) one by one in a certain order; Step 3: When the upper adsorption part (11) adsorbs the upper layer of a cut epitaxial wafer (12), the lower adsorption part (22) at a position corresponding to the upper adsorption part (11) also starts adsorption, thereby forming a suction force that opposes the upper adsorption part (11), thereby avoiding the problem that the epitaxial wafer (12) at that position is only subjected to an upward force, thereby causing the epitaxial wafer (12) to be deformed as a whole; Step 4: After one row or one column of the cut epitaxial wafers (12) is peeled off, the cylinder assembly is started to open the clamping block assembly near the location, and all the lower adsorption parts (22) at the location are evacuated, so that the peeled epitaxial wafer (12) area is subjected to a downward force, causing it to deform slightly and then be clamped again by the clamping block assembly, so that the upper and lower layers of the peeled area and the unpeeled area are separated, and then the upper adsorption part (11) is used for adsorption and peeling, and the cycle is repeated until the peeling operation is completed.

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