A combined triode and assembly method

Abstract

A combined triode and an assembly method, belonging to the technical field of triode heat dissipation structure, the combined triode comprises: a packaging structure and a heat sink; the packaging structure comprises a substrate, the front end of the substrate has a rectangular groove in the middle, three pins are arranged above the front end of the substrate, a chip is arranged on the top surface of the middle of the substrate, a plastic sealing body is arranged in the middle section of the substrate, and the part of the substrate protruding from the rear end of the plastic sealing body is an elastic part; a positioning pin is arranged at the front end of the front of the heat plate, and a pressing plate is arranged on the top; the front end of the rear end of the heat sink is an arc surface, and a slot is arranged at the rear end of the heat sink corresponding to the arc surface; when combined, the rectangular groove is clamped on the outside of the positioning pin, the pressing plate is pressed tightly on the top surface of the front end of the substrate, the rear end of the elastic part is clamped in the slot, and the bottom surface of the substrate is fitted with the top surface of the heat sink. The combined structure of this scheme is simpler and easier to disassemble and assemble, and the substrate and the heat sink have a better fit, which can effectively improve the heat dissipation effect.

Description

Technical Field

[0001] The invention belongs to the technical field of triode heat dissipation structures, and in particular relates to a combined triode and an assembling method. Background Art

[0002] A transistor is a semiconductor device that controls current. Its function is to amplify weak signals into electrical signals with larger amplitudes. When working, a transistor generates a lot of heat. To prevent the transistor from being damaged, a heat sink is usually required to be provided on the transistor to accelerate the heat dissipation of the transistor. For example, an invention patent with application number CN201120359548.7 discloses a heat dissipating transistor. A heat sink is provided on one side of the transistor, and a copper plate is provided between the transistor and the heat sink. The transistor is fixedly connected to the copper plate, and the heat sink is connected to the copper plate by screws. When manufacturing the heat dissipation transistor of this structure, not only does it need to set up a process of connecting the copper plate and the transistor, which increases the number of processes; it also needs to use screws to connect the copper plate and the heat sink, and the assembly process is relatively cumbersome. Although there are automatic equipment that can complete the assembly of the transistor, the heat sink and the screws, such equipment is usually expensive and only suitable for large-scale production investment. It is not suitable for transistors with a small quantity and a large number of models and specifications; on the other hand, the current method of fixing the copper plate with screws can only set the screw at the end opposite to the transistor pin. Due to the elastic deformation of the copper plate, one end of the transistor pin is easy to lift up after the screw is tightened, resulting in partial separation of the copper plate from the heat sink, thereby reducing the heat dissipation effect. Summary of the invention

[0003] In order to solve the deficiencies of the prior art, the present invention provides a combined triode and an assembly method, the combined structure is simpler, easier to assemble and disassemble, and the substrate and the heat sink have a better fit, which can effectively improve the heat dissipation effect.

[0004] In order to achieve the purpose of the present invention, the following scheme is proposed:

[0005] A combined triode, comprising: a packaging structure and a heat sink;

[0006] The packaging structure includes a substrate, a rectangular groove is provided in the middle of the front end of the substrate, three pins are provided above the front end of the substrate, a chip is provided on the top surface of the middle part of the substrate, a plastic package is provided in the middle section of the substrate, the rear ends of the pins and the chip are wrapped inside the plastic package, the rectangular groove protrudes from the front end of the plastic package, the bottom surface of the substrate is exposed outside the bottom of the plastic package, and the rear end of the substrate protrudes from the rear end surface of the plastic package to form an elastic part;

[0007] A plurality of heat sinks are arranged at intervals on the back of the heat sink, a positioning pin is arranged at the front end of the front of the heat sink, and a pressure plate is arranged on the top; the front of the rear end of the heat sink is an arc-shaped surface, the arc-shaped surface is tangent to the top surface of the front end of the heat sink, and the rear end of the arc-shaped surface extends to the back of the rear end of the heat sink, and a slot is arranged at the rear end edge of the heat sink corresponding to the arc-shaped surface, and the opening faces the front end of the heat sink, and the height of the slot is greater than the thickness of the substrate;

[0008] When assembled, the rectangular groove is clamped on the outside of the positioning pin, the pressing plate is pressed tightly on the top surface of the front end of the base plate, the rear end of the elastic part is clamped in the clamping groove, and the bottom surface of the base plate is fitted with the top surface of the heat sink.

[0009] The beneficial effects of the present invention are as follows: the present invention utilizes the rectangular groove and the positioning pin as well as the substrate and the card slot to connect the packaging structure, and the packaging structure and the heat sink can be connected without the need for screw locking, making assembly and disassembly more convenient; and while utilizing the substrate to achieve connection with the heat sink, the arc surface structure of the heat sink is also utilized to guide the substrate to produce elastic deformation, so that the substrate and the heat sink fit more closely, thereby improving the heat dissipation effect of the transistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0011] Figure 1 A schematic diagram of the internal structure of the packaging structure of the present application is shown.

[0012] Figure 2 A schematic diagram of the bottom structure of the packaging structure of the present application is shown.

[0013] Figure 3 A schematic diagram of the structure of the packaging structure and the heat sink is shown.

[0014] Figure 4 The figure shows the state diagram of the combined triode during assembly.

[0015] Figure 5 The schematic diagram of the structure of the combined triode when standing upright is shown.

[0016] Figure 6 The schematic diagram of the structure of the combined triode when lying flat is shown.

[0017] Markings in the figure: packaging structure-1, substrate-11, rectangular groove-111, elastic part-112, residual material part-113, strip groove-114, wing plate-115, pin-12, chip-13, plastic package body-14, heat sink-2, heat sink-21, positioning pin-22, pressure plate-221, arc surface-23, card slot-24, strip hole-241. DETAILED DESCRIPTION

[0018] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] Embodiment 1, a combined triode, includes: a packaging structure 1 and a heat sink 2.

[0020] Specifically, Figure 1 , Figure 2 As shown, the package structure 1 includes a substrate 11, a rectangular groove 111 is provided in the middle of the front end of the substrate 11, and three pins 12 are provided above the front end of the substrate 11. More specifically, the three pins 12 are arranged along the width direction of the substrate 11, and the length direction of the pins 12 is consistent with the front and rear end connection direction of the substrate 11. As a conventional material selection, the substrate 11 and the pins 12 can be made of copper-based alloy or aluminum-based alloy. A chip 13 is provided on the top surface of the middle part of the substrate 11, and a plastic package 14 is provided in the middle section of the substrate 11. The pins 1 2 and the chip 13 are wrapped in the plastic package 14, the rectangular groove 111 protrudes from the front end of the plastic package 14, the bottom surface of the substrate 11 is exposed outside the bottom of the plastic package 14, and the rear end of the substrate 11 protrudes from the rear end surface of the plastic package 14 to form an elastic portion 112; this packaging structure 1 is not only that the substrate 11 covers the entire bottom surface of the plastic package 14, but also has an extension portion toward the front and rear ends of the plastic package 14, which greatly increases the contact area between the substrate 11 and the heat sink 2, thereby accelerating heat dissipation.

[0021] Specifically, Figures 3 to 6 As shown, a plurality of heat sinks 21 are provided at intervals on the back side of the heat sink 2 to increase the heat dissipation area, thereby improving the heat dissipation efficiency. A positioning pin 22 is provided at the front end of the front side of the heat sink 2, and a pressing plate 221 is provided on the top thereof. The front side of the rear end of the heat sink 2 is an arc-shaped surface 23, the front end of the arc-shaped surface 23 is tangent to the top surface of the front end of the heat sink 2, and the rear end of the arc-shaped surface 23 extends to the back side of the rear end of the heat sink 2. A card slot 24 is provided at the rear end edge of the heat sink 2 corresponding to the arc-shaped surface 23, and its opening faces the front end of the heat sink 2. The height of the card slot 24 is greater than the thickness of the substrate 11.

[0022] Specifically, Figure 5 , Figure 6As shown, when assembled, the rectangular groove 111 is stuck on the outside of the positioning pin 22, the pressure plate 221 is pressed against the top surface of the front end of the substrate 11, and the rear end of the elastic part 112 is stuck in the slot 24. The bottom surface of the substrate 11 fits with the top surface of the heat sink 2. This structure relies on the elasticity of the substrate 11 itself. When its rear end is connected to the slot 24, the substrate 11 will elastically deform along the trajectory of the arc surface 23, so that the rear end of the substrate 11 bends downward, thereby tightening the substrate 11 on the front side of the heat sink 2 to ensure that the substrate 11 fits with the front side of the heat sink 2 at all locations, thereby ensuring that the thermal conductive structure between the substrate 11 and the heat sink 2 is connected. When the rear end of the substrate 11 is bent and deformed downward, its own elastic force is upward, so that the top surface of the rear end of the substrate 11 can be pressed against the top surface of the slot 24 by its own elastic force, so that the substrate 11 is stably stuck in the slot 24, and the substrate 11 generates pressure toward the front of the heat sink 2, so that the substrate 11 is more closely attached to the front of the heat sink 2. In this way, not only the substrate 11 and the heat sink 2 are more closely attached, but also there is no need to set screws to connect the substrate 11 and the heat sink 2, the assembly structure and assembly method are simpler, the investment in assembly equipment can be reduced, and the production cost can be reduced. In addition, this combined structure is convenient for disassembly and assembly, making the later maintenance and replacement of the transistor more convenient. Compared with the method of directly attaching a copper plate to the outside of the transistor, the heat transfer path of this scheme is shorter, and the heat of the chip 13 can be quickly transferred to the heat sink 2 through the substrate 11, and then quickly dissipated through the heat sink 2, which has a higher heat dissipation efficiency.

[0023] Preferably, Figure 5 , Figure 6 As shown, when assembled, the plastic sealing body 14 and the arc surface 23 are arranged at intervals along the line direction of the front and rear ends of the heat sink 2, so that the bonding surface of the substrate 11 and the heat sink 2 can be divided into two parts, the elastic part 112 is the arc surface bonding part, and the remaining part of the substrate 11 and the heat sink 2 is the plane bonding part. The plane bonding part includes the front end of the substrate 11 and the part located below the plastic sealing body 14 that is bonded to the heat sink 2, the arc surface bonding part and the part where the elastic part 112 and the arc surface 23 are bonded. By limiting the position of the arc surface 23, only the elastic part 112 is bent and deformed during assembly, preventing the substrate 11 at the bottom of the plastic sealing body 14 from being greatly deformed. In this way, not only the bonding effect between the substrate 11 and the heat sink 2 can be ensured, but also cracks or separation can be prevented from occurring at the part where the substrate 11 and the plastic sealing body 14 are connected.

[0024] Preferably, Figure 1As shown, one of the pins 12 is formed by using the portion removed when the rectangular groove 111 is formed on the substrate 11, and the pin 12 is the middle one of the three pins 12. Specifically, it can also be understood that the middle one of the three pins 12 is formed integrally with the substrate 11, and the connection between the root of the pin 12 and the substrate 11 is located at the bottom of the rectangular groove 111. This structure uses the excess material 113 that originally needs to be removed when forming the pin 12 to form the front end of the substrate 11, and the excess material 113 is attached to the heat sink 2 to increase the heat dissipation area and improve the heat dissipation effect. At the same time, the interval between the excess material 113 on both sides is used to form the rectangular groove 111, providing a connection structure for the front end of the substrate 11.

[0025] Preferably, a strip groove 114 is provided at the intersection of the top surface of the elastic portion 112 and the rear end surface of the plastic sealing body 14, and the strip groove 114 extends in the width direction of the substrate 11. This can prevent the substrate 11 at the bottom of the plastic sealing body 14 from deforming downward after assembly, and prevent the substrate 11 from separating from the plastic sealing body 14 or cracking. The depth of the strip groove 114 is less than one-quarter of the thickness of the substrate 11 to avoid the formation of obvious creases at the strip groove 114 during assembly, which will reduce the elastic force of the substrate 11 and further affect the pressure of the substrate 11 on the heat sink 2.

[0026] Preferably, Figure 1 As shown, both sides of the middle section of the substrate 11 are inclined upward to form an integral structure of wing panels 115, the wing panels 115 are wrapped in the plastic packaging body 14, and the wing panels 115 are formed by stamping. Specifically, the wing panels 115 can be formed together when the substrate 11 is stamped. By wrapping the wing panels 115 in the plastic packaging body 14, the connection stability between the plastic packaging body 14 and the substrate 11 can be improved, and the upwardly protruding wing panels 115 formed on both sides of the substrate 11 can increase the bending strength of the substrate 11, so as to prevent the substrate 11 at the bottom of the plastic packaging body 14 from bending and deforming after assembly.

[0027] Preferably, the length of the elastic portion 112 is greater than half of the length of the plastic package body 14 to ensure that the elastic portion 112 has sufficient deformation length so that the elastic portion 112 can achieve elastic deformation.

[0028] Embodiment 2, a method for assembling a combined triode, is used to assemble the combined triode recorded in Embodiment 1. On the basis of Embodiment 1, Figures 1 to 3 and Figure 5As shown, a strip hole 241 is provided on the bottom surface of the card slot 24 along the arc track direction of the arc surface 23, and the rear end of the elastic portion 112 is an arc plate structure. When assembled, the middle portion of the arc plate is passed through the strip hole 241. This structure allows the substrate 11 and the heat sink 2 to have space for relative movement along the length direction of the rectangular groove 111, so as to adapt to the length of the substrate 11, while ensuring the fitting state between the substrate 11 and the heat sink 2, and preventing the substrate 11 from partially arching upwards due to the excessive length of the substrate 11, thereby causing the arched portion to be separated from the front of the heat sink 2.

[0029] The assembly method comprises the following steps:

[0030] First, if Figure 3 , Figure 4 As shown, the rectangular groove 111 is clamped on the outer side of the positioning pin 22, and the rear end of the base plate 11 is swung to one side of the heat dissipation plate 2;

[0031] Then, the rear end of the substrate 11 is pressed downward, and the side of the substrate 11 facing the heat sink 2 is inserted into one end of the slot 24;

[0032] Finally, the base plate 11 is rotated toward the middle of the heat sink 2 around the positioning pins 22. Figure 5 As shown, the middle portion of the arc-shaped plate until the rear end of the elastic portion 112 is inserted into the strip-shaped hole 241 .

[0033] This assembly method allows one side of the rear end of the substrate 11 to be connected to the slot 24 first, and in the process of rotating the substrate 11, the elastic portion 112 is gradually bent and deformed by the guidance of the arc surface 23 and the restriction of the slot 24, rather than using external force to directly bend the elastic portion 112 and then insert it into the slot 24. Therefore, on the basis of setting the rear end of the elastic portion 112 as an arc plate, with the help of this assembly method, it is possible to effectively avoid excessive deformation of the substrate 11 during the assembly process, which may cause the substrate 11 to be partially unable to fit with the heat sink 2.

[0034] The above description is only a preferred embodiment of the present invention, and is not intended to be the only one or to limit the present invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.

Claims

1. A combined triode, comprising: The packaging structure (1) and the heat dissipation plate (2) are characterized by: The packaging structure (1) comprises a substrate (11), wherein a rectangular groove (111) is provided in the middle of the front end of the substrate (11), three pins (12) are provided above the front end of the substrate (11), a chip (13) is provided on the top surface of the middle part of the substrate (11), a plastic package (14) is provided in the middle section of the substrate (11), the rear ends of the pins (12) and the chip (13) are both wrapped inside the plastic package (14), the rectangular groove (111) protrudes from the front end of the plastic package (14), the bottom surface of the substrate (11) is exposed outside the bottom of the plastic package (14), and the portion of the substrate (11) protruding from the rear end of the plastic package (14) is an elastic portion (112); A plurality of heat sinks (21) are arranged at intervals on the back of the heat sink (2); a positioning pin (22) is arranged at the front end of the front of the heat sink (2); a pressing plate (221) is arranged on the top of the front of the heat sink (2); the front of the rear end of the heat sink (2) is an arc-shaped surface (23); the arc-shaped surface (23) is tangent to the top surface of the front end of the heat sink (2); the rear end of the arc-shaped surface (23) extends toward the back of the rear end of the heat sink (2); a slot (24) is arranged at the rear end edge of the heat sink (2) corresponding to the arc-shaped surface (23); the opening of the slot (24) faces the front end of the heat sink (2); and the height of the slot (24) is greater than the thickness of the substrate (11); When assembled, the rectangular groove (111) is clamped on the outside of the positioning pin (22), the pressing plate (221) is pressed against the top surface of the front end of the base plate (11), the rear end of the elastic portion (112) is clamped in the clamping groove (24), and the bottom surface of the base plate (11) is in contact with the top surface of the heat sink (2).

2. A combined triode according to claim 1, characterized in that: When assembled, the plastic sealing body (14) and the arc-shaped surface (23) are arranged at intervals along the direction of the line connecting the front and rear ends of the heat sink (2).

3. A combined triode according to claim 1, characterized in that: One of the pins (12) is formed by utilizing a portion removed when the substrate (11) forms the rectangular groove (111).

4. A combined triode according to claim 1, characterized in that: A strip groove (114) is provided at a position where the top surface of the elastic part (112) and the rear end surface of the plastic package body (14) meet. The strip groove (114) extends in the width direction of the substrate (11). The depth of the strip groove (114) is less than one quarter of the thickness of the substrate (11).

5. A combined triode according to claim 1, characterized in that: Both sides of the middle section of the base plate (11) are inclined upwards to form wing plates (115) of an integral structure, and the wing plates (115) are wrapped in the plastic packaging body (14).

6. A combined triode according to claim 1, characterized in that: The length of the elastic portion (112) is greater than half the length of the plastic package body (14).

7. The combined triode according to claim 1, characterized in that: The bottom surface of the slot (24) is provided with a strip hole (241) along the arc track direction of the arc surface (23); the rear end of the elastic part (112) is an arc plate structure; when assembled, the middle part of the arc plate is inserted into the strip hole (241).

8. A method for assembling a combined triode, characterized in that: The method for assembling the combined triode according to claim 7 comprises the following steps: First, the rectangular groove (111) is clamped on the outer side of the positioning pin (22), and the rear end of the base plate (11) is swung to one side of the heat dissipation plate (2); Then, the rear end of the base plate (11) is pressed downward, and the side of the base plate (11) facing the heat sink (2) is inserted into one end of the slot (24); Finally, the base plate (11) is rotated toward the middle of the heat dissipation plate (2) around the positioning pin (22) until the middle of the arc-shaped plate at the rear end of the elastic portion (112) is inserted into the strip-shaped hole (241).

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