A method and apparatus for rolling a precision semiconductor mask material

Abstract

This invention discloses a method and apparatus for rolling precision semiconductor mask materials, relating to the field of semiconductor mask material rolling technology. It is used to roll precision strips made from semiconductor mask materials, and includes the following steps: 1. Developing a rolling process; 2. Configuring the roll diameter; 3. Configuring the roll profile; 4. Presetting the rolling position; 5. Setting the rolling thickness, tension, and rolling oil cooling amount; 6. Completing the rolling according to the parameters set in the first five steps to obtain the finished product. The rolling apparatus uses a precision 20-roll mill. This invention achieves the rolling of semiconductor mask materials with a raw material width of 625mm, and has the effects of stable rolling process, good strip shape, and stable product production.

Description

Technical Field

[0001] This invention relates to the field of semiconductor mask material rolling technology, and in particular to a method and apparatus for rolling precision semiconductor mask materials. Background Technology

[0002] Currently, etching-based precision metal masks are the most widely used method. Etching-based precision masks are made from smelted metal sheets, which undergo multiple stages of traditional hot rolling, heat treatment, cold rolling to the desired thickness, and heat treatment to create ultra-thin metal sheets, typically made of iron-nickel alloy, with a thickness between 20 and 40 μm. Iron-nickel alloys possess excellent heat resistance, corrosion resistance, and mechanical properties. These metal sheets are then subjected to photolithography and wet etching, forming numerous micro-hole patterns on the ultra-thin metal sheet, corresponding to the areas designed on the driver backplane for the OLED light-emitting devices (OLEDs) in AMOLED displays.

[0003] As pixel resolution increases, the required mask becomes thinner. The thinner the mask, the weaker its strength, and the higher the requirements for the properties of the raw materials. However, due to the high difficulty of semiconductor mask material processes, equipment, and rolling, existing conventional cold rolling mills cannot guarantee its quality and precision, and cannot achieve stable production. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art by proposing a method and apparatus for rolling precision semiconductor mask materials, thereby achieving stable rolling of semiconductor mask materials with a raw material width of 625mm.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A rolling apparatus for precision semiconductor mask material is used to roll precision strips made from semiconductor mask material. The rolling apparatus employs a precision 20-roll mill, which includes a first intermediate roll, a second intermediate roll, a radial adjustment mechanism, and an oil spraying mechanism.

[0007] The diameter configuration range of the relevant roll system corresponding to the precision 20-roll mill is as follows: work roll: 41.23mm~76.05mm; first intermediate roll: 68.10mm~82.06mm; drive roll: 120.50mm~134.50mm; back support bearing: 225mm.

[0008] The first intermediate roller has a conical shape, and the second intermediate roller has a flat shape.

[0009] The effective flatness of the first intermediate roller is 85% of the material width;

[0010] The convexity value of the radial adjustment mechanism increases as the width of the precision strip decreases;

[0011] The reduction distribution during rolling on the precision 20-roll mill is as follows: the reduction for the first pass is 15.6%–17%, and the reduction for each subsequent pass is 10%–13.2%, decreasing with each subsequent pass; the unit tension for each pass is 12.55–25.38 kg / mm. 2 And the amount of pressure gradually increases.

[0012] Furthermore, when the width of the raw material is 625mm, the cone length of the first intermediate roller is 85mm and the taper of the first intermediate roller is 0.15%.

[0013] Furthermore, when the width of the raw material is 625mm, the calculation is based on the material width with an effective flatness of 85%, wherein the effective flatness on the first intermediate roller is 531mm, and the front and rear cone depths of the first intermediate roller are 46.8mm.

[0014] Furthermore, the convexity values ​​of the radial adjustment mechanism are CR1=15, CR2=25, CR3=35, CR4=45, CR5=35, CR6=25, and CR7=15.

[0015] Furthermore, the oil spraying mechanism is used to spray the precision strip during the rolling process;

[0016] When setting the initial rolling for each pass, the oil flow rate of the oil injection mechanism is 60% to 85% of the maximum flow rate; and when setting the stable rolling for each pass, the oil flow rate of the oil injection mechanism is 90% to 95% of the maximum flow rate.

[0017] Furthermore, the device also includes:

[0018] The transmission control system is used to provide power for rolling;

[0019] Thickness gauge system, used for measuring rolling thickness;

[0020] The AGC system is used for rolling thickness control.

[0021] PLC systems are used for logic control;

[0022] A computer system for storing and loading pass schedules, and for recording and tracking rolling thickness.

[0023] Furthermore, a method for rolling a precision semiconductor mask material, wherein the rolling device described above is used for rolling, and the method is as follows:

[0024] Step 1) Develop the rolling process;

[0025] Step 2) Configure the relevant roller diameters for different machine models.

[0026] Step 3) Configure the rolling rolls;

[0027] Step 4) Set the preset rolling position, including the effective flatness and crown adjustment position of the first intermediate roll;

[0028] Step 5) Set the rolling thickness, tension, and rolling oil cooling amount;

[0029] Step 6) Complete the rolling process according to the parameters set in Steps 1)-5), and spray the pre-set rolling oil flow rate during the rolling process to obtain the finished product.

[0030] Furthermore, in step 1), the width of the rolled raw material is 625 mm;

[0031] In step 3), the first intermediate roller has a conical shape, and the second intermediate roller has a flat shape.

[0032] In step 4), the effective flatness of the first intermediate roller is 85% of the material width;

[0033] The convexity values ​​of the radial adjustment mechanism of the Senkimir precision 20-roll mill are determined as follows: CR1=15, CR2=25, CR3=35, CR4=45, CR5=35, CR6=25, CR7=15.

[0034] Furthermore, the flatness is calculated as follows: F = (W - 2D).

[0035] Where F: flatness; W: raw material width; D: cone depth;

[0036] Flatness is determined based on the width of the raw material and the depth of the cone.

[0037] The relationship between the raw material width, cone depth, and cone length is as follows;

[0038] T: Cone length

[0039] When the width of the raw material is 550mm≤W≤650mm, T=85mm and D=41mm~49mm are determined.

[0040] When the width of the raw material is 480mm≤W≤620mm, T=120mm and D=36mm~46.5mm are determined.

[0041] When the width of the raw material is 350mm≤W≤490mm, T=180mm and D=26mm~37mm are determined.

[0042] Furthermore, the method also includes adjusting the position of the first intermediate roll according to the rolling edge condition, including:

[0043] The appearance of edge waves reduces flatness;

[0044] Tight edges increase flatness;

[0045] The convexity value is reduced in the middle wave.

[0046] Edge wavy areas, increase convexity value;

[0047] The rolling process is repeated to achieve the desired target thickness.

[0048] Compared with the prior art, the beneficial effects of the present invention are: the present invention provides a rolling process suitable for a precision twenty-roll mill with a raw material width of 625mm;

[0049] The rolling process provided by this invention is based on the thickness and width specifications of the raw semiconductor mask. The rolling process is designed according to the relevant roll diameter configuration for the corresponding rolling mill model. The roll type of the first and second intermediate rolls and the crown value of the radial adjustment mechanism are determined. The effective flatness of the first intermediate roll and the reduction and tension distribution during rolling are set. Pre-rolling oil flow is used during rolling to control the amount of pull-out of the first intermediate roll, thereby effectively reducing the tensile stress at the material edges to prevent strip breakage. Simultaneously, excessive edge waviness is prevented, leading to overpressure and avoiding breakage of the semiconductor mask material. This improves the stability of cold rolling of the semiconductor mask material and ensures its quality. The rolling method provided by this invention results in a stable rolling process, excellent thickness tolerance, good plate shape, and no defects on the upper and lower surfaces of the material, meeting the requirements for stable product production. Attached Figure Description

[0050] Figure 1 This is a schematic diagram of the structure of the device of the present invention.

[0051] Figure label:

[0052] First intermediate roller-1; work roller-2; semiconductor mask strip-3. Detailed Implementation

[0053] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Example 1

[0054] A method for rolling a precision semiconductor mask material, wherein the rolling method is used to control a Sendkimir precision 20-roll mill to roll a raw semiconductor mask to obtain a semiconductor mask material strip.

[0055] This embodiment 1 provides a rolling method for producing a semiconductor mask strip 3 with a raw material width of 625mm using a precision 20-roll mill. The rolling method is as follows:

[0056] Step 1) Develop the rolling process; The rolling process is to roll the raw material with a thickness of 0.045mm in three passes to obtain a strip with an output thickness of 0.030mm, thus completing the rolling process.

[0057] Specifically, the rolling process pass schedule is as follows:

[0058] The units for incoming material thickness are mm, outgoing material thickness is mm, rolling speed is m / min, inlet tension is KN, outlet tension is KN, and width is mm.

[0059] Step 2) Configure the relevant roller diameters for different machine models: Determine the working roller 2: 41.23mm~76.05mm; first intermediate roller: 68.10mm~82.06mm; drive roller: 120.50mm~134.50mm; back support bearing: 225mm.

[0060] Step 3) Configure the rolling roll type: Determine the roll type of the first intermediate roll as a conical roll and the roll type of the second intermediate roll as a flat roll.

[0061] Step 4) Set the preset position for rolling, including the effective flatness and crown adjustment position of the first intermediate roll.

[0062] Determining the effective flatness of the first intermediate roller includes:

[0063] The cone length T of the first intermediate roller: based on the raw material width of 625 mm, the cone length is 85 mm;

[0064] The taper of the first intermediate roller is 0.15%, based on the characteristics of the semiconductor mask material.

[0065] The flatness is calculated as follows: F = (W - 2D).

[0066] Where F: flatness; W: raw material width; D: cone depth;

[0067] Flatness is determined based on the width of the raw material and the depth of the cone.

[0068] The relationship between the raw material width, cone depth, and cone length is as follows;

[0069] T: Cone length

[0070] When the width of the raw material is 550mm≤W≤650mm, T=85mm and D=41mm~49mm are determined.

[0071] When the width of the raw material is 480mm≤W≤620mm, T=120mm and D=36mm~46.5mm are determined.

[0072] When the width of the raw material is 350mm≤W≤490mm, T=180mm and D=26mm~37mm are determined.

[0073] In this embodiment, the width of the raw material is 625mm, and the cone length T = 85mm and the cone depth D = 41-49mm are preset.

[0074] Based on the specifications of the raw material semiconductor mask, the effective flatness of the first intermediate roller is determined as 85% of the material width. The width is 625mm, the effective flatness is 531mm, and the cone depth of the front and rear first intermediate rollers is 46.8mm.

[0075] Based on the specified parameters, the convexity values ​​of the radial adjustment mechanism of the Senkimir precision 20-roll mill are determined as follows: CR1=15, CR2=25, CR3=35, CR4=45, CR5=35, CR6=25, CR7=15.

[0076] Step 5) Set the rolling thickness, reduction distribution, tension distribution, and rolling oil cooling amount.

[0077] The rolling thickness, tension, and rolling oil cooling amount are determined according to the process outlined in step 1), namely:

[0078] First pass: A 0.045mm thick substrate is rough-rolled through the inlet of a precision 20-roll mill, yielding a 0.038mm thick coil at the mill exit. During this rolling process, the inlet tension of the roughing mill is 12.55 kg / mm. 2 The outlet tension is 16.11 kg / mm. 2 The rolling speed is 400 m / min, and the single-pass reduction is 15.60%.

[0079] The second pass: A 0.038mm thick substrate is rough-rolled through the inlet of a precision 20-roll mill, yielding a 0.33mm thick coil at the mill exit. During this rolling process, the inlet tension of the roughing mill is 21.68 kg / mm. 2 The outlet tension is 24.98 kg / mm. 2 The rolling speed is 400 m / min, and the single-pass reduction is 13.20%.

[0080] The third pass: A 0.33mm thick substrate is rough-rolled through the inlet of a precision 20-roll mill, yielding a 0.30mm thick coil at the mill exit. During this rolling process, the inlet tension of the roughing mill is 22.84 kg / mm². 2The outlet tension is 25.38 kg / mm. 2 The rolling speed is 400 m / min, and the single-pass reduction is 10.00%.

[0081] When starting rolling for each pass, the rolling oil flow rate is set to 60% to 85% of the maximum flow rate; and when stabilizing rolling for each pass, the maximum rolling oil flow rate is set to 90% to 95% of the maximum flow rate.

[0082] Before starting the train in the first round, the above preset values ​​should be confirmed in the round number setting interface.

[0083] Based on the process pass, thickness setting, and tension setting, adjust the flow rate of rolling oil and load it one pass at a time.

[0084] Step 6) Complete the rolling process according to the parameters set in Steps 1)-5), that is, roll the raw strip steel according to the set reduction and tension distribution, and spray the pre-set rolling oil flow rate during the rolling process to obtain the finished product.

[0085] Furthermore, during the rolling process, the method also includes adjusting the position of the first intermediate roll according to the condition of the rolled edge, including:

[0086] The appearance of edge waves reduces flatness;

[0087] Tight edges increase flatness;

[0088] The convexity value is reduced in the middle wave.

[0089] Edge wavy areas, increase convexity value;

[0090] The rolling process is repeated to achieve the desired target thickness.

[0091] In this Example 1, the thickness of the finished product is 0.030 mm.

[0092] The semiconductor mask material rolling method given in this embodiment can achieve the goal of stable production of semiconductor mask materials with a raw material width of 625mm, and the rolling process is stable with good plate shape and no obvious defects. Example 2

[0093] A rolling apparatus for precision semiconductor mask material, employing a rolling method for precision semiconductor mask material, rolls a precision strip with a raw material of semiconductor mask material and a width of 425mm.

[0094] The rolling mill employs a precision 20-roll mill, preferably a CRM650-23 model. The precision 20-roll mill includes work rolls 2, drive rolls and idler rolls, back support bearings, first intermediate rolls, second intermediate rolls, a radial adjustment mechanism, and an oil spraying mechanism. The two work rolls 2 are arranged vertically, and the strip or sheet material passes between them and is rolled. The two first intermediate rolls are located on the upper and lower sides of the two work rolls, respectively. Figure 1 (The flat roll diagram is not shown). The first intermediate roll is located at the center of the rolls of the Senkimir Precision 20-roll mill. During rolling, the semiconductor mask steel strip is located between the work rolls 2 and is symmetrical about the center position.

[0095] In this model, the relevant roller system diameter configuration is as follows: work roller: 76mm; first intermediate roller 1: 70mm; drive roller: 121mm; back support bearing: 225mm.

[0096] The first intermediate roller has a conical shape, and the second intermediate roller has a flat shape; the cone length of the first intermediate roller is 185mm, and the taper of the first intermediate roller is 0.15%.

[0097] The effective flatness of the first intermediate roller is 85% of the material width; that is, when the width of the raw material is 425mm, it is calculated according to the material width with an effective flatness of 85%, wherein the effective flatness on the first intermediate roller is 361mm, and the front and rear cone depth of the first intermediate roller is 32mm.

[0098] The convexity value of the radial adjustment mechanism increases as the width of the precision strip decreases; in this embodiment 2, the convexity values ​​of the radial adjustment mechanism are CR1=15, CR2=25, CR3=35, CR4=45, CR5=35, CR6=25, and CR7=15.

[0099] The reduction distribution during rolling on a precision 20-roll mill is as follows: 15.6%–17% reduction for the first pass, and 10%–13.2% reduction for all other passes, decreasing with each subsequent pass; the unit tension for each pass is 12.55–25.38 kg / mm. 2 And the amount of pressure gradually increases.

[0100] The specific rolling industry is as follows:

[0101] The oil spraying mechanism is used to spray the precision strip during the rolling process; when setting the starting rolling of each pass, the oil flow rate of the oil spraying mechanism is 60% to 85% of the maximum flow rate; and when setting the stable rolling of each pass, the oil flow rate of the oil spraying mechanism is 90% to 95% of the maximum flow rate.

[0102] In addition, the device also includes:

[0103] The transmission control system is used to provide power for rolling;

[0104] Thickness gauge system, used for measuring rolling thickness;

[0105] The AGC system is used for rolling thickness control.

[0106] PLC systems are used for logic control;

[0107] The computer system is used for storing and loading the pass schedule and for recording and tracking the rolling thickness. The pass schedule for the rolling process is directly written and stored on the computer, and then loaded into the drive control system one by one according to the pass order to realize the rolling process.

[0108] It should be noted that the transmission control system, thickness gauge system, AGC system, PLC system, and computer system are all existing technologies. This application does not involve any improvement to the above systems themselves, as their working principles will not be described in detail here.

[0109] The rolling method of Example 1 was used to roll semiconductor mask material with a raw material width of 625 mm, and the rolling method of Example 2 was used to roll semiconductor mask material with a raw material width of 425 mm in a rolling device. After multiple actual production tests, stable production of the product can be achieved, and the obtained strip has high quality, no surface defects, and high yield.

[0110] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A rolling apparatus for precision semiconductor mask materials, characterized in that, This equipment is used for rolling precision strips made from semiconductor mask material. The rolling device is a precision 20-roll mill, which includes a first intermediate roll (1), a second intermediate roll, a radial adjustment mechanism, and an oil spraying mechanism, wherein: The diameter configuration range of the relevant roll system corresponding to the precision 20-roll mill is as follows: work roll (2): 41.23mm~76.05mm; first intermediate roll (1): 68.10mm~82.06mm; drive roll: 120.50mm~134.50mm; back support bearing: 225mm; The first intermediate roller (1) is conical, and the second intermediate roller is flat; the convexity value of the radial adjustment mechanism increases as the width of the precision strip decreases; The reduction distribution during rolling on the precision 20-roll mill is as follows: the reduction for the first pass is 15.6%–17%, and the reduction for each subsequent pass is 10%–13.2%, decreasing with each subsequent pass; the unit tension for each pass is 12.55–25.38 kg / mm. 2 And the amount of pressure gradually increases; The effective flatness of the first intermediate roller is calculated as follows: F = (W - 2D). Where F: effective flatness; W: raw material width; D: cone depth; The effective flatness of the first intermediate roller (1) is preset to 85% of the material width; The raw material width is 625mm, the cone length of the first intermediate roll (1) is 85mm, and the taper of the first intermediate roll (1) is 0.15%. Calculated based on the material width with an effective flatness of 85%, the effective flatness on the first intermediate roll (1) is 531mm, and the front and rear cone depths of the first intermediate roll (1) are 46.8mm. The oil spraying mechanism is used to spray the precision strip during the rolling process. When setting the starting rolling for each pass, the oil flow rate of the oil spraying mechanism is 60% to 85% of the maximum flow rate. And when setting the stable rolling for each pass, the oil flow rate of the oil spraying mechanism is 90% to 95% of the maximum flow rate.

2. The rolling apparatus for precision semiconductor mask material according to claim 1, characterized in that, The device further includes: The transmission control system is used to provide power for rolling; Thickness gauge system, used for measuring rolling thickness; The AGC system is used for rolling thickness control. PLC systems are used for logic control; A computer system for storing and loading pass schedules, and for recording and tracking rolling thickness.

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