A soldering device for producing electronic components

Abstract

The present invention relates to the technical field of electronic component production, and specifically to a soldering device for electronic component production, comprising a frame, a soldering mechanism installed on the frame and a solder head located at the soldering mechanism, and also comprising: a supporting mold, wherein the supporting mold is installed on the frame and provided with a limiting groove for limiting a headphone circuit board; a wire arrangement mechanism, wherein the wire arrangement mechanism is installed on the frame and used to store multiple connecting wires on the headphone circuit board; an auxiliary solder feeding mechanism; the soldering device for electronic component production can sequentially stabilize the soldering between multiple connecting wires and the circuit board through the auxiliary solder feeding mechanism and the wire arrangement mechanism, which not only ensures the stability and accuracy of the soldering between the connecting wires and the circuit board, but also eliminates the need for manual hand-holding of the connecting wires, thereby ensuring the safety of the soldering between the connecting wires of the headphone and the circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component production, in particular to a soldering device for electronic component production. Background Art

[0002] Electronic components are the general term for electronic components and electronic devices, which play a specific functional role in electronic systems or equipment. Electronic components usually refer to finished products whose molecular composition is not changed during factory production and processing, such as resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices (diodes, triodes, thyristors), electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystals, quartz, ceramic magnetic materials, substrates for printed circuits, special materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and parts, etc.

[0003] The circuit board of the headset integrates multiple electronic components (such as microprocessors, Bluetooth chips, audio decoding chips, battery management chips, etc.) to realize a complex system of wireless audio transmission and control. These electronic components work together through the layout and connection of the circuit board to realize the various functions of the headset;

[0004] When soldering multiple connecting wires of existing headphones to their circuit boards, since the headphone circuit board itself is small, and the connecting wires are small and light in weight, when soldering, the staff fixes the tiny circuit board with one hand, and pinches the small connecting wires with the index finger and thumb of the other hand, and presses down with the soldering head to achieve the effect of soldering between the connecting wires of the headphone and the circuit board;

[0005] However, during the soldering process, on the one hand, manually holding the connecting wire and the circuit board may easily lead to inaccurate soldering position between the connecting wire and the circuit board, which may easily cause one end of the connecting wire to separate from the circuit board. On the other hand, due to the high temperature of the soldering head, there are certain safety hazards when the worker's thumb and index finger are close to the soldering head during the soldering process. Summary of the invention

[0006] The object of the present invention is to provide a soldering device for producing electronic components to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: A soldering device for producing electronic components, comprising a frame, a soldering mechanism installed on the frame and a soldering head located at the soldering mechanism, and also comprising:

[0008] A supporting mold, wherein the supporting mold is mounted on the frame and is provided with a limiting groove for limiting the position of the earphone circuit board;

[0009] A cable arrangement mechanism, which is installed on the frame and is used to store multiple connecting cables on the headset circuit board;

[0010] An auxiliary solder feeding mechanism is installed on the frame, and the auxiliary solder feeding mechanism is located between the supporting mold and the wiring mechanism, and is used for auxiliary soldering between the connecting wire and the earphone circuit board.

[0011] The cable arrangement mechanism comprises a fixing frame mounted on the frame, and a cable arrangement shell is fixedly mounted on the fixing frame. The cable arrangement shell is provided with a plurality of cable arrangement grooves, and a through hole is provided at the bottom of the cable arrangement shell, and the connecting wire is drawn out from the cable arrangement groove through the through hole.

[0012] Wherein, the auxiliary solder feeding mechanism comprises a connecting piece detachably mounted on the frame, the connecting piece is connected to a supporting block, and the bottom of the supporting block is fixedly connected to a top plate;

[0013] A first electric push rod is installed at the bottom of the top plate, and a push plate is fixedly connected to the output end of the first electric push rod;

[0014] Two driving shafts are fixedly connected to both ends of the driving plate, and the driving shafts are rotatably connected to side plates;

[0015] Support members are provided on both sides of the top plate at positions corresponding to the two side plates;

[0016] A semicircular block is fixedly connected between the two side plates on one side of the push plate, and a sealing member is provided between the two semicircular blocks;

[0017] A moving groove is provided inside the semicircular block, and a moving hole is provided between the semicircular block and a side plate on one side thereof, the moving hole is connected to the moving groove, and a guide mechanism for guiding the forming of the connecting line is connected between the moving grooves at the two semicircular blocks;

[0018] The top of the guide mechanism extends to the push plate, and a moving mechanism for driving the guide mechanism is provided on the push plate;

[0019] The semicircular block is provided with an adsorption hole on one side close to the supporting mold, and a negative pressure adsorption mechanism is installed on the outer side of the semicircular block for making the movable groove inside the semicircular block in a negative pressure state. Through the auxiliary solder feeding mechanism, the connecting wire can be connected to the circuit board when soldering the earphone circuit board and the connecting wire thereon.

[0020] Among them, the connecting member includes a fixing plate detachably mounted on the frame by bolts, a second electric push rod is fixedly mounted on one side of the fixing plate, an output end of the second electric push rod is fixedly connected to a moving seat, a third electric push rod is fixedly mounted on the top of the moving seat, and an output end of the third electric push rod is fixedly connected to a support block, and the connection between the support block and the frame is realized by means of the connecting member.

[0021] Wherein, the support member comprises two support shafts fixedly mounted on one side of the top plate;

[0022] The support shaft is rotatably connected with a connecting rod, the bottom of the connecting rod is rotatably connected with a synchronous shaft, and the synchronous shaft is fixedly installed on the side plate, and the top plate and the two side plates outside the top plate are connected by the supporting member.

[0023] Wherein, the seal includes two sealing strips installed on one side of one of the semicircular blocks, and two grooves for accommodating the sealing strips are provided on one side of the other semicircular block. Through the provided seal, the two semicircular blocks can achieve a sealed fit when they are close to each other.

[0024] Wherein, the guide mechanism comprises two forming plates respectively located at two moving grooves, and an arc groove is provided on one side of the forming plate close to the center of the semicircular block, and the bent connecting line is assisted in forming through the arc groove;

[0025] An extension plate is fixedly connected between the two forming plates, and guide grooves are provided at positions of the two semicircular blocks corresponding to the extension plates, and the extension plates slide through the guide grooves;

[0026] The push plate is provided with a moving opening, and the extension plate slides through the moving opening;

[0027] The top of the push plate is slidably connected to a moving frame, and the moving mechanism is connected to the moving frame;

[0028] A lifting member is installed on the top of the moving frame to enable the extension plate to move up and down along the moving opening, and the guiding mechanism is provided to achieve the function of guiding the connection line to form a shape.

[0029] Wherein, the moving mechanism comprises a pushing cylinder installed on one side of the pushing plate, and the output end of the pushing cylinder is fixedly connected to the moving frame, and the moving frame is connected and pushed by the moving mechanism.

[0030] Among them, the negative pressure adsorption mechanism includes a connecting tube connected to the adsorption hole, and the other end of the connecting tube is connected to a micro negative pressure vacuum pump, and the micro negative pressure vacuum pump is installed on the outside of the semicircular block. Through the negative pressure adsorption mechanism, a negative pressure state is formed inside the movable groove.

[0031] A micro motor is installed at one end of the moving groove, a moving screw is fixedly connected to the output end of the micro motor, a moving block is threadedly connected to the outer side of the moving screw, and the moving block is slidably connected to the moving groove;

[0032] A micro push rod is installed on the moving block, and a limit opening is provided on the forming plate at a position corresponding to the output end of the micro push rod, and a clamping plate is provided at the limit opening. The clamping plate is fixedly installed at the output end of the micro push rod, and an infrared sensor is installed at one of the clamping plates. Through the provided clamping plate, the connecting line can be stably moved when entering the moving groove.

[0033] The present invention has at least the following beneficial effects:

[0034] When the present invention is in use, the supporting mold installed on the frame can support and limit the circuit board of the earphone, and the staff does not need to manually fix the circuit board. The auxiliary solder feeding mechanism and the wire arrangement mechanism are provided, so that the soldering can be stabilized in sequence between multiple connecting wires and the circuit board, which not only ensures the stability and accuracy of the soldering between the connecting wires and the circuit board, but also eliminates the need for manual holding of the connecting wires, thereby ensuring the safety of the soldering between the connecting wires of the earphone and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0036] Figure 2 It is a front view of the overall structure of the present invention;

[0037] Figure 3 This is a schematic diagram of the supporting mold structure of the present invention;

[0038] Figure 4 It is a schematic diagram of the structure of the cable arrangement mechanism of the present invention;

[0039] Figure 5 This is a schematic diagram of the structure of the solder feeding mechanism of the present invention;

[0040] Figure 6 It is a schematic diagram of the structure of the negative pressure adsorption mechanism of the present invention;

[0041] Figure 7 It is a schematic diagram of the side structure of the side panel of the present invention;

[0042] Figure 8 This is a schematic diagram of the structure of the side panel of the present invention in an expanded state;

[0043] Fig. 9 This is a schematic diagram of the structure of the molded plate of the present invention;

[0044] Fig.10 This is a schematic diagram of the semicircular block structure of the present invention;

[0045] Fig.11 This is a schematic diagram of the internal structure of the semicircular block of the present invention;

[0046] Fig.12 For the present invention Fig.11 A schematic diagram of the enlarged structure of the middle A area;

[0047] Fig.13 It is a schematic diagram of the lifting member structure of the present invention.

[0048] In the figure: 1-frame; 2-soldering mechanism; 3-soldering head; 4-supporting mold; 41-limiting groove; 5-wire arrangement mechanism; 51-fixed frame; 52-wire arrangement shell; 521-wire arrangement groove; 522-through hole; 6-auxiliary solder feeding mechanism; 61-connecting piece; 611-fixed plate; 612-moving seat; 62-support block; 63-top plate; 64-first electric push rod; 65-pushing plate; 651-pushing shaft; 652-moving port; 66-side plate; 67-supporting piece; 671-supporting shaft; 672-connecting support rod; 673-synchronizing shaft; 68-semicircular block; 681-moving groove; 6811-micro motor; 6812-moving screw rod; 6813-moving block; 681 4-micro push rod; 6815-clamping plate; 6816-infrared sensor; 682-moving hole; 683-adsorption hole; 684-guide groove; 69-moving mechanism; 691-pushing cylinder; 7-seal; 71-sealing strip; 8-guide mechanism; 81-forming plate; 811-arc groove; 812-limiting mouth; 82-extension plate; 83-moving frame; 84-lifting member; 841-driving motor; 842-bidirectional threaded screw; 843-positioning block; 844-first positioning support rod; 845-second positioning support rod; 846-support seat; 9-negative pressure adsorption mechanism; 91-connecting pipe; 92-micro negative pressure vacuum pump; 10-second electric push rod; 11-third electric push rod. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] Example 1: Please refer to Figure 1-Figure 12A soldering device for producing electronic components, comprising a frame 1, a soldering mechanism 2 mounted on the frame 1 and a soldering head 3 located at the soldering mechanism 2, wherein the soldering mechanism 2 is an existing mechanism, and the soldering head 3 and the tin bar can be used to solder the circuit board to the circuit board, and also includes:

[0051] The supporting mold 4 is mounted on the frame 1, and is provided with a limiting groove 41 for limiting the position of the earphone circuit board. The supporting mold 4 is detachably mounted on the frame 1, so that when soldering earphone circuit boards and connecting wires of different sizes, different molds can be replaced accordingly, thereby achieving the function of limiting the position of the earphone circuit board. At the same time, in this embodiment, the supporting mold 4 is also provided with a card slot, so as to facilitate the placement of the connecting wire;

[0052] A cable arrangement mechanism 5, which is installed on the frame 1 and is used to store multiple connecting wires on the headset circuit board;

[0053] The cable arrangement mechanism 5 includes a fixing frame 51 installed on the frame 1, and a cable arrangement housing 52 is fixedly installed on the fixing frame 51. The cable arrangement housing 52 is provided with a plurality of cable arrangement grooves 521. The bottom of the cable arrangement housing 52 is provided with a through hole 522, and the connecting wire is drawn out from the cable arrangement groove 521 through the through hole 522.

[0054] In this embodiment, four cable slots 521 are provided, and a plurality of connecting wires are stacked and arranged in sequence from bottom to top inside the cable slots 521;

[0055] An auxiliary solder feeding mechanism 6, which is installed on the frame 1 and is located between the supporting mold 4 and the wiring mechanism 5, and is used for auxiliary soldering between the connecting wire and the earphone circuit board;

[0056] The auxiliary solder feeding mechanism 6 includes a connecting piece 61 detachably mounted on the frame 1, a supporting block 62 is connected to the connecting piece 61, a top plate 63 is fixedly connected to the bottom of the supporting block 62, the connecting piece 61 includes a fixing plate 611 detachably mounted on the frame 1 by bolts, a second electric push rod 10 is fixedly mounted on one side of the fixing plate 611, a moving seat 612 is fixedly connected to the output end of the second electric push rod 10, a third electric push rod 11 is fixedly mounted on the top of the moving seat 612, the output end of the third electric push rod 11 is fixedly connected to the supporting block 62, and the fixing plate 611 is L-shaped. When the auxiliary solder feeding mechanism 6 needs to be disassembled as needed, the fixing plate 611 can be disassembled to further realize the disassembly of the auxiliary solder feeding mechanism 6 as a whole;

[0057] A first electric push rod 64 is installed at the bottom of the top plate 63, and a push plate 65 is fixedly connected to the output end of the first electric push rod 64;

[0058] Two driving shafts 651 are fixedly connected to both ends of the driving plate 65, and the driving shafts 651 are rotatably connected to the side plates 66;

[0059] Support members 67 are provided on both sides of the top plate 63 at positions corresponding to the two side plates 66;

[0060] The support member 67 includes two support shafts 671 fixedly mounted on one side of the top plate 63;

[0061] The support shaft 671 is rotatably connected to a connecting rod 672, and the bottom of the connecting rod 672 is rotatably connected to a synchronous shaft 673, and the synchronous shaft 673 is fixedly installed on the side plate 66;

[0062] A semicircular block 68 is fixedly connected between the two side plates 66 on one side of the push plate 65, and a sealing member 7 is provided between the two semicircular blocks 68;

[0063] The sealing member 7 includes two sealing strips 71 installed on one side of one of the semicircular blocks 68, and one side of the other semicircular block 68 is provided with two grooves for accommodating the sealing strips 71;

[0064] A moving groove 681 is provided inside the semicircular block 68, and a moving hole 682 is provided between the semicircular block 68 and the side plate 66 on one side thereof, the moving hole 682 is communicated with the moving groove 681, and the moving grooves 681 at the two semicircular blocks 68 are connected to each other with a guide mechanism 8 for guiding the connection line to be formed, and at the same time, an introduction cover is provided on the side plate 66 on the semicircular block 68 and close to the side of the cable housing 52, and the introduction cover is used to assist the connection line to be introduced into the moving hole 682;

[0065] The top of the guide mechanism 8 extends to the push plate 65, and a moving mechanism 69 for driving the guide mechanism 8 is provided on the push plate 65;

[0066] A suction hole 683 is provided on one side of the semicircular block 68 close to the supporting mold 4, and a negative pressure suction mechanism 9 for making the moving groove 681 inside the semicircular block 68 in a negative pressure state is installed on the outer side of the semicircular block 68. The negative pressure suction mechanism 9 includes a connecting pipe 91 connected to the suction hole 683, and the other end of the connecting pipe 91 is connected to a micro negative pressure vacuum pump 92, and the micro negative pressure vacuum pump 92 is installed on the outer side of the semicircular block 68;

[0067] A micro motor 6811 is installed at one end of the moving groove 681, and a moving screw 6812 is fixedly connected to the output end of the micro motor 6811. A moving block 6813 is threadedly connected to the outer side of the moving screw 6812, and the moving block 6813 is slidably connected to the moving groove 681. The micro motor 6811 is operated to make the moving screw 6812 rotate inside the moving groove 681. When the moving screw 6812 rotates, a driving force is provided to the moving block 6813. Since the moving block 6813 is limited inside the moving groove 681, the moving block 6813 further moves horizontally along the inside of the moving groove 681.

[0068] A micro push rod 6814 is installed on the moving block 6813, and a limiting opening 812 is provided at the position of the molding plate 81 corresponding to the output end of the micro push rod 6814, and a clamping plate 6815 is provided at the limiting opening 812. The clamping plate 6815 is fixedly installed at the output end of the micro push rod 6814, and an infrared sensor 6816 is installed at one of the clamping plates 6815.

[0069] Specific implementation process: when soldering is performed between the connecting wire and the circuit board, first, the two semicircular blocks 68 are sealed by the sealing strip 71, so that the two semicircular blocks 68 form a relatively sealed state, that is, the moving hole 682 between the two semicircular blocks 68 remains connected to the outside, and then, the two semicircular blocks 68 in the closed state are driven by the second electric push rod 10 and the third electric push rod 11, so that the two side plates 66 on one side of the two semicircular blocks 68 are moved to the outside of the cable housing 52, and the two side plates 66 are aligned with a through hole 522 at the cable housing 52, and then, the micro negative pressure vacuum pump 92 at the two semicircular blocks 68 is operated, so that the moving hole 682 between the two semicircular blocks 68 forms a negative pressure state, so that one end of the micro connecting wire near the through hole 522 enters the moving hole 682 from the through hole 522;

[0070] At this time, the two clamping plates 6815 are close to the opening of the moving hole 682. When one end of the connecting line enters the moving hole 682 and the infrared sensor 6816 at one of the clamping plates 6815 detects the connecting line, the micro push rods 6814 at the two clamping plates 6815 are operated, so that the two clamping plates 6815 can clamp and fix one end of the connecting line, and the micro motor 6811 is operated, so that the moving block 6813 moves relative to the inside of the moving slot 681. The two moving blocks 681 While moving synchronously, the connecting wire is pulled into the moving hole 682, and the connecting wire is assisted to be formed again under the limiting effect of the extension plate 82 outside the two clamping plates 6815 to prevent the connecting wire from bending, so as to facilitate the connection between the connecting wire and the circuit board, until the connecting wire is pulled by the two clamping plates 6815 and one end thereof moves to a position close to the other side plate 66. At this time, the micro negative pressure vacuum pump 92 stops running, and the two clamping plates 6815 are separated from the molding plate 81.

[0071] The guide mechanism 8 includes two forming plates 81 respectively located at the two moving grooves 681. An arc groove 811 is provided on one side of the forming plate 81 close to the center of the semicircular block 68, and the curved connecting line is assisted in forming through the arc groove 811.

[0072] An extension plate 82 is fixedly connected between the two forming plates 81, and guide grooves 684 are provided at positions of the two semicircular blocks 68 corresponding to the extension plates 82, and the extension plates 82 slide through the guide grooves 684;

[0073] The push plate 65 is provided with a moving opening 652, and the extension plate 82 slides through the moving opening 652;

[0074] The top of the push plate 65 is slidably connected to a moving frame 83, and the moving mechanism 69 is connected to the moving frame 83;

[0075] A lifting member 84 is installed on the top of the moving frame 83 to enable the extension plate 82 to move up and down along the moving opening 652 .

[0076] The moving mechanism 69 includes a pushing cylinder 691 installed on one side of the pushing plate 65, and the output end of the pushing cylinder 691 is fixedly connected to the moving frame 83;

[0077] Specific implementation process: when the connecting line moves between the two forming plates 81, the forming plates 81 synchronously realize the function of clamping and fixing the connecting line, and then, the first electric push rod 64 is operated to make the push plate 65 move vertically downward relative to the top plate 63, and while the push plate 65 moves vertically downward, due to the action of the side plates 66 and the connecting support rod 672, the two side plates 66 on both sides of the semicircular block 68 rotate synchronously, that is, the two semicircular blocks 68 are opened and operated in opposite directions, and the rotation angle is based on the push shaft 651 connected between the side plates 66 and the push plate 65, that is, the side plate 66 rotates relative to the push plate 65 with the push shaft 651 as the center, thereby realizing the function of opening the two semicircular blocks 68, and then the two The semicircular blocks 68 open to each other, and the two forming plates 81 are exposed. Subsequently, the lifting member 84 and the pushing cylinder 691 are operated to make the extension plate 82 drive the connecting wire at the forming plate 81 to move along the card slot for accommodating the connecting wire at the supporting mold 4, and until one end of the connecting wire is located directly above the soldering place of the circuit board, the extension plate 82 drives the forming plate 81 to move downward, and the two forming plates 81 move to the card slot. At this time, the soldering head 3 realizes soldering between one end of the connecting wire and the circuit board. Subsequently, by pushing the cylinder 691, the two forming plates 81 are separated from the soldered connecting wire and then restored to their original positions. Subsequently, the two semicircular blocks 68 are restored to their original positions, thereby realizing soldering between the next connecting wire and the circuit board.

[0078] Example 2: Please refer to Fig.13 , Embodiment 2 is a further supplementary description of the lifting member 84 in Embodiment 1, specifically: the lifting member 84 includes a driving motor 841 installed on the top of the moving frame 83, the output end of the driving motor 841 is fixedly connected with a bidirectional threaded screw 842, the bidirectional threaded screw 842 is rotatably connected to the moving frame 83, the outer side of the bidirectional threaded screw 842 is threadedly connected to two positioning blocks 843, the two positioning blocks 843 are slidably connected to the bottom end of the top of the moving frame 83, the two positioning blocks 843 are respectively rotatably connected with first positioning rods 844, the two first positioning rods 844 are cross-distributed, and the two first positioning rods 844 are rotatably connected through a pin shaft;

[0079] The bottom of the first positioning support rod 844 is rotatably connected to the second positioning support rod 845, and the two second positioning support rods 845 are cross-distributed, the two second positioning support rods 845 are hinged to each other through a pin shaft, the second positioning support rod 845 is hinged to a support seat 846 through a pin shaft, and the two support seats 846 are slidably connected to the top of the extension plate 82;

[0080] Therefore, when it is necessary to adjust the position of the extension plate 82 and the two forming plates 81 at the bottom thereof relative to the pushing plate 65, the driving motor 841 is operated to cause the bidirectional threaded screw 842 to rotate. When the bidirectional threaded screw 842 rotates, it provides driving forces in opposite directions to the two positioning blocks 843 on its outer side. Since the positioning blocks 843 are limited by the movable frame 83, the two positioning blocks 843 move toward each other. When the positioning blocks 843 move toward each other, they synchronously drive the two first positioning support rods 844 and the two second positioning support rods 845 to move and rotate, thereby realizing the effect of moving the positions of the two forming plates 81 and the extension plate 82 downward relative to the top of the supporting mold 4, and by driving the motor 841 in the reverse direction, the extension plate 82 is moved upward along the supporting mold 4.

[0081] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0082] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A soldering device for producing electronic components, comprising a frame (1), a soldering mechanism (2) mounted on the frame (1), and a soldering head (3) located at the soldering mechanism (2), It is characterized in that Also included are: A supporting mold (4), the supporting mold (4) being mounted on the frame (1), and the supporting mold (4) being provided with a limiting groove (41) for limiting the position of the earphone circuit board; A wire arrangement mechanism (5), the wire arrangement mechanism (5) being mounted on the frame (1), and being used to store a plurality of connecting wires on the headphone circuit board; An auxiliary solder feeding mechanism (6), the auxiliary solder feeding mechanism (6) being mounted on the frame (1), and the auxiliary solder feeding mechanism (6) being located between the supporting mold (4) and the wiring arrangement mechanism (5), and being used for auxiliary soldering between the connecting wire and the headphone circuit board; The auxiliary solder feeding mechanism (6) comprises a connecting piece (61) detachably mounted on the frame (1), the connecting piece (61) being connected to a supporting block (62), and the bottom of the supporting block (62) being fixedly connected to a top plate (63); A first electric push rod (64) is installed at the bottom of the top plate (63), and a push plate (65) is fixedly connected to the output end of the first electric push rod (64); Two driving shafts (651) are fixedly connected to both ends of the driving plate (65), and the driving shafts (651) are rotatably connected to side plates (66); Support members (67) are provided on both sides of the top plate (63) at positions corresponding to the two side plates (66); A semicircular block (68) is fixedly connected between the two side plates (66) on one side of the push plate (65), and a sealing member (7) is provided between the two semicircular blocks (68); A moving groove (681) is provided inside the semicircular block (68), and a moving hole (682) is provided between the semicircular block (68) and a side plate (66) on one side thereof, the moving hole (682) is communicated with the moving groove (681), and a guide mechanism (8) for guiding the forming of the connecting line is connected between the moving grooves (681) at the two semicircular blocks (68); The top of the guide mechanism (8) extends to the push plate (65), and a moving mechanism (69) for driving the guide mechanism (8) is provided on the push plate (65); A suction hole (683) is provided on one side of the semicircular block (68) close to the supporting mold (4), and a negative pressure suction mechanism (9) is installed on the outer side of the semicircular block (68) for making the movable groove (681) inside the semicircular block (68) present a negative pressure state; The guide mechanism (8) comprises two forming plates (81) respectively located at the two moving grooves (681); an arc-shaped groove (811) is provided on one side of the forming plate (81) close to the center of the semicircular block (68); and the bent connecting line is assisted in forming through the arc-shaped groove (811); An extension plate (82) is fixedly connected between the two forming plates (81), guide grooves (684) are provided at positions of the two semicircular blocks (68) corresponding to the extension plates (82), and the extension plates (82) slide through the guide grooves (684); The push plate (65) is provided with a moving opening (652), and the extension plate (82) slides through the moving opening (652); The top of the push plate (65) is slidably connected to a moving frame (83), and the moving mechanism (69) is connected to the moving frame (83); A lifting member (84) is installed on the top of the movable frame (83) to enable the extension plate (82) to move up and down along the movable opening (652).

2. A soldering device for producing electronic components according to claim 1, Features: The cable arrangement mechanism (5) comprises a fixing frame (51) mounted on the frame (1), and a cable arrangement housing (52) is fixedly mounted on the fixing frame (51), a plurality of cable arrangement grooves (521) are provided on the cable arrangement housing (52), a through hole (522) is provided at the bottom of the cable arrangement housing (52), and the connection wires are drawn out from the cable arrangement grooves (521) through the through holes (522).

3. A soldering device for producing electronic components according to claim 1, Features: The connecting member (61) comprises a fixing plate (611) detachably mounted on the frame (1) by means of bolts, a second electric push rod (10) being fixedly mounted on one side of the fixing plate (611), an output end of the second electric push rod (10) being fixedly connected to a moving seat (612), a third electric push rod (11) being fixedly mounted on the top of the moving seat (612), and an output end of the third electric push rod (11) being fixedly connected to a support block (62).

4. A soldering device for producing electronic components according to claim 1, Features: The support member (67) comprises two support shafts (671) fixedly mounted on one side of the top plate (63); The support shaft (671) is rotatably connected to a connecting rod (672), the bottom of the connecting rod (672) is rotatably connected to a synchronizing shaft (673), and the synchronizing shaft (673) is fixedly mounted on the side plate (66).

5. A soldering device for producing electronic components according to claim 1, Features: The sealing member (7) comprises two sealing strips (71) installed on one side of one of the semicircular blocks (68), and two grooves for accommodating the sealing strips (71) are provided on one side of the other semicircular block (68).

6. A soldering device for producing electronic components according to claim 1, Features: The moving mechanism (69) comprises a pushing cylinder (691) installed on one side of the pushing plate (65), and an output end of the pushing cylinder (691) is fixedly connected to the moving frame (83).

7. A soldering device for producing electronic components according to claim 1, Features: The negative pressure adsorption mechanism (9) comprises a connecting tube (91) connected to the adsorption hole (683), and the other end of the connecting tube (91) is connected to a micro negative pressure vacuum pump (92), and the micro negative pressure vacuum pump (92) is installed outside the semicircular block (68).

8. A soldering device for producing electronic components according to claim 1, Features: A micro motor (6811) is installed at one end inside the movable groove (681), a movable lead screw (6812) is fixedly connected to the output end of the micro motor (6811), a movable block (6813) is threadedly connected to the outer side of the movable lead screw (6812), and the movable block (6813) is slidably connected to the movable groove (681); A micro push rod (6814) is installed on the moving block (6813), a limit opening (812) is provided on the forming plate (81) at a position corresponding to the output end of the micro push rod (6814), and a clamping plate (6815) is provided at the limit opening (812), and the clamping plate (6815) is fixedly installed at the output end of the micro push rod (6814), and an infrared sensor (6816) is installed at one of the clamping plates (6815).

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