A crystal bonding and eutectic integrated machine

Abstract

The present invention discloses a crystal solidification and eutectic integrated machine, comprising a first wafer stage and a second wafer stage, the first wafer stage and the second wafer stage are connected by a eutectic heating stage, a first X-axis adjustment mechanism and a second Y-axis adjustment mechanism are arranged on the first wafer stage, a retractable first ejector pin is arranged below the first wafer stage, a first Z-axis adjustment mechanism is fixedly connected to the first wafer stage, an output end of the first Z-axis adjustment mechanism is fixedly connected to the first ejector pin, a first welding head is connected to one side of the first wafer stage, a first swing arm is fixedly connected to the output end of the first welding head, a first calibration mechanism is arranged on the first wafer stage, a first recognition camera is arranged above the first calibration mechanism, and a first linear welding head is installed on one side of the first calibration mechanism through a first cam mechanism. The present invention enables the device to have the function of eutectic and crystal solidification through the arrangement of the eutectic mechanism and the crystal solidification mechanism, and can quickly perform eutectic and crystal solidification processing on the chip, thereby effectively improving the production efficiency of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a chip solidification and eutectic integrated machine. Background Art

[0002] Eutectic refers to the phenomenon that eutectic solder fuses at a relatively low temperature. The eutectic alloy changes directly from solid to liquid without going through the plastic stage. It is a balanced reaction in which a liquid generates two solids at the same time. Its melting temperature is called the eutectic temperature. Eutectic welding technology is widely used in the electronic packaging industry, such as bonding chips to substrates, bonding substrates to tube shells, tube shell capping, etc.

[0003] Compared with traditional epoxy conductive adhesive bonding, eutectic welding has the advantages of high thermal conductivity, low resistance, fast heat transfer, strong reliability, and large shear force after bonding. It is suitable for the interconnection between chips and substrates, and substrates and shells in high-frequency and high-power devices.

[0004] The current automatic eutectic machine generally transfers the bracket to the eutectic heating table, sets a heating block on the eutectic heating table to process the bracket to the eutectic temperature, blows nitrogen onto the eutectic heating table at the same time, and then moves the chip to the crystal fixing position of the bracket on the eutectic heating table to make the chip eutectically welded on the bracket, and uses nitrogen to protect it to prevent oxidation during eutectic, and then moves the bracket out after eutectic to collect the materials.

[0005] However, the existing eutectic machine has a relatively simple structure, and generally has only a single eutectic function, and cannot achieve synchronous die bonding, thus affecting the production efficiency of the chip. Summary of the invention

[0006] The purpose of the present invention is to solve the problem in the prior art that the eutectic machine cannot synchronously and quickly move and transport the chip and the substrate, and to propose a solid crystal eutectic integrated machine.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] A crystal solidification eutectic integrated machine comprises a first wafer stage and a second wafer stage, wherein the first wafer stage and the second wafer stage are connected via a eutectic heating stage, a first X-axis adjustment mechanism and a first Y-axis adjustment mechanism are arranged on the first wafer stage, a retractable first ejector pin is arranged below the first wafer stage, a first Z-axis adjustment mechanism is fixedly connected to the first wafer stage, an output end of the first Z-axis adjustment mechanism is fixedly connected to the first ejector pin, a first welding head is connected to one side of the first wafer stage, a first swing arm is fixedly connected to the output end of the first welding head, a first calibration mechanism is arranged on the first wafer stage, a first recognition camera is arranged above the first calibration mechanism, and a first linear welding head is installed on one side of the first calibration mechanism via a first cam mechanism;

[0009] A second X-axis adjustment mechanism and a second Y-axis adjustment mechanism are provided on the second wafer stage, a retractable second ejector pin is provided below the second wafer stage, a second Z-axis adjustment mechanism is fixedly connected to the second wafer stage, an output end of the second Z-axis adjustment mechanism is fixedly connected to the second ejector pin, a second welding head is connected to one side of the second wafer stage, a second swing arm is fixedly connected to the output end of the second welding head, a second calibration mechanism is provided on the second wafer stage, a second recognition camera is installed above the second calibration mechanism, and a second linear welding head is installed on one side of the second calibration mechanism through a second cam mechanism;

[0010] A heating device and a crystal bonding table are provided on the top of the eutectic heating table, a PCB working box is provided above the crystal bonding table, a belt and a third ejector are provided in the PCB working box, a glue dispensing welding head and a glue tray are provided above the PCB working box, and a loading and unloading mechanism connected to the PCB working box is fixedly connected to the top of the crystal bonding table; the loading and unloading mechanism comprises a swing arm welding head and a glue dispensing arm welding head, both of which are arranged above the eutectic heating table, and the output end of the glue dispensing arm welding head is arranged corresponding to the swing arm welding head; a vertical camera is provided on the PCB working box, and a PCB board conveyor belt is provided on one side of the PCB working box.

[0011] Preferably, a first adjustment knob corresponding to the first X-axis adjustment mechanism and the first Y-axis adjustment mechanism is provided under the first ejector pin, and a second adjustment knob corresponding to the second X-axis adjustment mechanism and the second Y-axis adjustment mechanism is provided under the second ejector pin.

[0012] Preferably, the first welding head is provided with a third Z-axis adjustment mechanism, to which the first φ-axis adjustment mechanism is fixedly connected; the second welding head is provided with a fourth Z-axis adjustment mechanism, to which the second φ-axis adjustment mechanism is fixedly connected.

[0013] Preferably, the first calibration mechanism is provided with a third Y-axis adjustment mechanism, the third Y-axis adjustment mechanism is fixedly connected to a third φ-axis adjustment mechanism, and the third φ-axis adjustment mechanism is fixedly connected to a first motor; the second calibration mechanism is provided with a fourth Y-axis adjustment mechanism, the output end of the fourth Y-axis adjustment mechanism is fixedly connected to a fourth φ-axis adjustment mechanism, and the fourth φ-axis adjustment mechanism is installed with a second motor.

[0014] Preferably, the first cam mechanism is provided with a fifth Z-axis adjustment mechanism, and the first suction nozzle is fixedly connected to the fifth Z-axis adjustment mechanism; the second cam mechanism is provided with a sixth Z-axis adjustment mechanism, and the second suction nozzle is fixedly connected to the sixth Z-axis adjustment mechanism.

[0015] Preferably, the first suction nozzle and the second suction nozzle are both connected with a buffer mechanism, and an electromagnet is installed on the buffer mechanism.

[0016] Preferably, the heating device is provided with a thermostat and a temperature sensor, the output end of the temperature sensor is connected to the input end of the thermostat, and the output end of the thermostat is connected to the input end of the heating device.

[0017] Preferably, the eutectic heating stage is provided with a third X-axis adjustment mechanism and a fifth Y-axis adjustment mechanism, and the crystal bonding stage is provided with a fourth X-axis adjustment mechanism and a sixth Y-axis adjustment mechanism.

[0018] Preferably, the glue dispensing welding head is provided with a seventh Z-axis adjustment mechanism, and the output end of the seventh Z-axis adjustment mechanism is fixedly connected to the fifth φ-axis adjustment mechanism. The glue dispensing welding head supports up and down movement of the Z-axis and horizontal swing of 13° and is fixed back and forth between points A and B, wherein point A is a glue tray, and there is a stirring device in the glue tray, and point B is the hole position of the PCB board working box, and the PCB working box supports up and down movement of the Z-axis.

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] In the present invention, by setting up the eutectic mechanism and the crystal bonding mechanism, the equipment has the functions of eutectic and crystal bonding in one, and can quickly perform eutectic and crystal bonding processes on the chip, thereby effectively improving the production efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a front view structural schematic diagram of a crystal bonding eutectic integrated machine proposed by the present invention;

[0022] Figure 2 It is a left-side structural schematic diagram of a crystal bonding eutectic integrated machine proposed by the present invention;

[0023] Figure 3 It is a right view structural schematic diagram of a crystal bonding eutectic integrated machine proposed by the present invention;

[0024] Figure 4 The figure is a schematic diagram of the top view of the structure of a crystal-bonding and eutectic integrated machine proposed by the present invention.

[0025] In the figure: 1 first wafer stage, 2 second wafer stage, 3 eutectic heating stage, 4 first X-axis adjustment mechanism, 5 first Y-axis adjustment mechanism, 6 first ejector, 7 first Z-axis adjustment mechanism, 8 first welding head, 9 first swing arm, 10 first calibration mechanism, 11 first recognition camera, 12 first cam mechanism, 13 first linear welding head, 14 second X-axis adjustment mechanism, 15 second Y-axis adjustment mechanism, 16 second ejector, 17 second Z-axis adjustment mechanism, 18 second welding head, 19 second swing arm, 20 second calibration mechanism, 21 second recognition camera, 22 second cam mechanism, 23 second linear welding head, 24 heating device, 25 solid crystal stage, 26 working box, 27 belt, 28 third ejector, 29 dispensing welding head, 30 glue tray, 31 loading and unloading mechanism , 32 first adjustment knob, 33 second adjustment knob, 34 third Z-axis adjustment mechanism, 35 first φ-axis adjustment mechanism, 36 fourth Z-axis adjustment mechanism, 37 second φ-axis adjustment mechanism, 38 third Y-axis adjustment mechanism, 39 third φ-axis adjustment mechanism, 40 first motor, 41 fourth Y-axis adjustment mechanism, 42 fourth φ-axis adjustment mechanism, 43 second motor, 44 fifth Z-axis adjustment mechanism, 45 first suction nozzle, 46 sixth Z-axis adjustment mechanism, 47 second suction nozzle, 48 buffer mechanism, 49 electromagnet, 50 temperature controller, 51 temperature sensor, 52 third X-axis adjustment mechanism, 53 fifth Y-axis adjustment mechanism, 54 fourth X-axis adjustment mechanism, 55 sixth Y-axis adjustment mechanism, 56 seventh Z-axis adjustment mechanism, 57 fifth φ-axis adjustment mechanism. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] Reference Figure 1-4 A crystal solidification eutectic integrated machine comprises a first wafer stage 1 and a second wafer stage 2, the first wafer stage 1 and the second wafer stage 2 are connected via a eutectic heating stage 3, a first X-axis adjustment mechanism 4 and a first Y-axis joint mechanism 5 are provided on the first wafer stage 1, a retractable first ejector pin 6 is provided below the first wafer stage 1, and a first Z-axis adjustment mechanism 7 is fixedly connected to the first wafer stage 1;

[0028] In the present invention, the output end of the first Z-axis adjustment mechanism 7 is fixedly connected to the first ejector pin 6, a first welding head 8 is connected to one side of the first wafer stage 1, and a first swing arm 9 is fixedly connected to the output end of the first welding head 8. A first calibration mechanism 10 is provided on the first wafer stage 1, a first recognition camera 11 is provided above the first calibration mechanism 10, and a first linear welding head 13 is installed on one side of the first calibration mechanism 10 through a first cam mechanism 12;

[0029] In the present invention, a second X-axis adjustment mechanism 14 and a second Y-axis adjustment mechanism 15 are provided on the second wafer stage 2, a retractable second ejector pin 16 is provided below the second wafer stage 2, a second Z-axis adjustment mechanism 17 is fixedly connected to the second wafer stage 2, an output end of the second Z-axis adjustment mechanism 17 is fixedly connected to the second ejector pin 16, a first adjustment knob 32 corresponding to the first X-axis adjustment mechanism 4 and the first Y-axis adjustment mechanism 5 is provided below the first ejector pin 6, and a second adjustment knob 33 corresponding to the second X-axis adjustment mechanism 14 and the second Y-axis adjustment mechanism 15 is provided below the second ejector pin 16;

[0030] In the present invention, a second welding head 18 is connected to one side of the second wafer stage 2, a third Z-axis adjustment mechanism 34 is provided on the first welding head 8, and a first φ-axis adjustment mechanism 35 is fixedly connected to the third Z-axis adjustment mechanism 34; a fourth Z-axis adjustment mechanism 36 is provided on the second welding head 18, and a second φ-axis adjustment mechanism 37 is fixedly connected to the fourth Z-axis adjustment mechanism 36, and a second swing arm 19 is fixedly connected to the output end of the second welding head 18; a second calibration mechanism 20 is provided on the second wafer stage 2, a third Y-axis adjustment mechanism 38 is provided on the first calibration mechanism 10, and a third φ-axis adjustment mechanism 39 is fixedly connected to the third Y-axis adjustment mechanism 38, and a first motor 40 is fixedly connected to the third φ-axis adjustment mechanism 39; a fourth Y-axis adjustment mechanism 41 is provided on the second calibration mechanism 20, and a fourth φ-axis adjustment mechanism 42 is fixedly connected to the output end of the fourth Y-axis adjustment mechanism 41;

[0031] In the present invention, a second motor 43 is installed on the fourth φ-axis adjustment mechanism 42, a second recognition camera 21 is installed above the second calibration mechanism 20, a second linear welding head 23 is installed on one side of the second calibration mechanism 20 through a second cam mechanism 22, a fifth Z-axis adjustment mechanism 44 is provided on the first cam mechanism 12, and a first suction nozzle 45 is fixedly connected to the fifth Z-axis adjustment mechanism 44; a sixth Z-axis adjustment mechanism 46 is provided on the second cam mechanism 22, and a second suction nozzle 47 is fixedly connected to the sixth Z-axis adjustment mechanism 46, and a buffer mechanism 48 is connected to both the first suction nozzle 45 and the second suction nozzle 47, and an electromagnet 49 is installed on the buffer mechanism 48;

[0032] In the present invention, a heating device 24 and a crystal bonding platform 25 are provided on the top of the eutectic heating platform 3, a PCB working box 26 is provided above the crystal bonding platform 25, a belt 27 and a third ejector pin 28 are provided in the PCB working box 26, a glue dispensing welding head 29 and a glue tray 30 are provided above the PCB working box 26, and a loading and unloading mechanism 31 connected to the PCB working box 26 is fixedly connected to the top of the crystal bonding platform 25; the loading and unloading mechanism 31 includes a swing arm welding head and a glue dispensing arm welding head, both of which are arranged above the eutectic heating platform 3, and the output end of the glue dispensing arm welding head is arranged corresponding to the swing arm welding head; a vertical camera is provided on the PCB working box 26, and a PCB board conveyor belt is provided on one side of the PCB working box 26.

[0033] In the present invention, a belt 27 and a third ejector pin 28 are provided in the working box 26, a glue dispensing welding head 29 and a glue tray 30 are provided above the working box 26, a loading and unloading mechanism 31 connected to the working box 26 is fixedly connected to the top of the crystal bonding table 25, a seventh Z-axis adjustment mechanism 56 is provided on the glue dispensing welding head 29, and a fifth φ-axis adjustment mechanism 57 is fixedly connected to the output end of the seventh Z-axis adjustment mechanism 56.

[0034] In the present invention, after loading, PCB boards will be ejected one by one. After a PCB board completes the crystal bonding, it will return to the unloading area, and then the next PCB board to be processed will be ejected. After the PCB board is ejected, it is sent to the specified position via the conveyor belt and blocked by the limit block. Then the PCB board is lifted up by the top plate to fit the cover plate. The cover plate corresponds to the hole position of the PCB board, and the working box 26 is formed. After the working box 26 of the PCB board is ready, the glue dispensing arm is first used for glue dispensing. The glue dispensing arm supports the Z-axis to move up and down and swing 13° horizontally, and is fixed back and forth at points A and B. One point is the glue tray, and there is a stirring device in the glue tray to prevent solidification. The other point is the hole position of the PCB board working box 26.

[0035] In the present invention, the dispensing arm does not have a vacuum suction nozzle, but its dispensing needle has a function similar to a spring knife. When dispensing glue, the dispensing needle will retract if the force is slightly greater, and the PCB board will not be damaged. The swing arm welding head picks up the chip from the eutectic heating table 3. The swing arm welding head has a vacuum suction nozzle and supports up and down movement in the Z-axis direction and horizontal 90° φ-axis swing. Before the above-mentioned swing arm welding head places the chip on the PCB board working box 26, it must first use the dispensing arm welding head to dip glue into the specified position of the PCB board, and then the swing arm welding head places the chip on the dipped glue, and the PCB board and the chip are adhered by dispensing glue.

[0036] In the present invention, the work box 26 supports X-axis and Y-axis movement, and the vertical camera above the work box 26 performs XY positioning. There is a vertical camera at the top of the PCB board work box 26, and the camera position is fixed and cannot be moved. The position of the PCB board work box 26 to be glued is first moved to just below the camera, and then glue is first dispensed, and then the chip is picked up from the eutectic heating table 3 and glued, and then the work box 26 moves to the next position. The PCB boards on the work box 26 will complete the embedding of the chips one by one and row by row. After the work box 26 completes the solid crystal of the PCB board, the top plate of the work box 26 drops, and the PCB board is sent to the unloading area by the conveyor belt.

[0037] In the present invention, by setting up the eutectic mechanism and the crystal bonding mechanism, the equipment has the function of eutecticization and crystal bonding in one, and can quickly perform eutecticization and crystal bonding on the chip, thereby effectively improving the production efficiency of the chip.

[0038] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A crystal bonding and eutectic integrated machine, comprising a first wafer stage (1) and a second wafer stage (2), characterized in that: The first wafer stage (1) and the second wafer stage (2) are connected via a eutectic heating stage (3); a first X-axis adjustment mechanism (4) and a first Y-axis adjustment mechanism (5) are provided on the first wafer stage (1); a retractable first ejector pin (6) is provided below the first wafer stage (1); a first Z-axis adjustment mechanism (7) is fixedly connected to the first wafer stage (1); an output end of the first Z-axis adjustment mechanism (7) is fixedly connected to the first ejector pin (6); a first welding head (8) is connected to one side of the first wafer stage (1); an output end of the first welding head (8) is fixedly connected to a first swing arm (9); a first calibration mechanism (10) is provided on the first wafer stage (1); a first recognition camera (11) is provided above the first calibration mechanism (10); and a first linear welding head (13) is installed on one side of the first calibration mechanism (10) via a first cam mechanism (12); The second wafer stage (2) is provided with a second X-axis adjustment mechanism (14) and a second Y-axis adjustment mechanism (15); a retractable second ejector pin (16) is provided below the second wafer stage (2); a second Z-axis adjustment mechanism (17) is fixedly connected to the second wafer stage (2); an output end of the second Z-axis adjustment mechanism (17) is fixedly connected to the second ejector pin (16); a second welding head (18) is connected to one side of the second wafer stage (2); an output end of the second welding head (18) is fixedly connected to a second swing arm (19); a second calibration mechanism (20) is provided on the second wafer stage (2); a second recognition camera (21) is installed above the second calibration mechanism (20); and a second linear welding head (23) is installed on one side of the second calibration mechanism (20) via a second cam mechanism (22); A heating device (24) and a crystal fixing table (25) are provided on the top of the eutectic heating table (3); a PCB working box (26) is provided above the crystal fixing table (25); a belt (27) and a third ejector pin (28) are provided inside the PCB working box (26); a dispensing welding head (29) and a glue tray (30) are provided above the PCB working box (26); a loading and unloading mechanism (31) connected to the PCB working box (26) is fixedly connected to the top of the crystal fixing table (25); the loading and unloading mechanism (31) comprises a swing arm welding head and a dispensing arm welding head; the swing arm welding head and the dispensing arm welding head are both arranged above the eutectic heating table (3); a vacuum nozzle is provided on the swing arm welding head; the output end of the dispensing arm welding head corresponds to the swing arm welding head. The PCB working box (26) is provided with a vertical camera, one side of the PCB working box (26) is provided with a PCB board conveyor belt, the first calibration mechanism (10) is provided with a third X-axis adjustment mechanism and a third Y-axis adjustment mechanism (38), the third Y-axis adjustment mechanism (38) is fixedly connected to a third φ-axis adjustment mechanism (39), and the third φ-axis adjustment mechanism (39) is fixedly connected to a first motor (40); the second calibration mechanism (20) is provided with a fourth X-axis adjustment mechanism and a fourth Y-axis adjustment mechanism (41), the output end of the fourth Y-axis adjustment mechanism (41) is fixedly connected to a fourth φ-axis adjustment mechanism (42), and the fourth φ-axis adjustment mechanism (42) is installed with a second motor (43).

2. The crystal bonding and eutectic integrated machine according to claim 1, characterized in that: A first adjustment knob (32) corresponding to the first X-axis adjustment mechanism (4) and the first Y-axis adjustment mechanism (5) is provided below the first ejector pin (6), and a second adjustment knob (33) corresponding to the second X-axis adjustment mechanism (14) and the second Y-axis adjustment mechanism (15) is provided below the second ejector pin (16).

3. The crystal bonding and eutectic integrated machine according to claim 1, characterized in that: The first welding head (8) is provided with a third Z-axis adjustment mechanism (34), and the third Z-axis adjustment mechanism (34) is fixedly connected to a first φ-axis adjustment mechanism (35); the second welding head (18) is provided with a fourth Z-axis adjustment mechanism (36), and the fourth Z-axis adjustment mechanism (36) is fixedly connected to a second φ-axis adjustment mechanism (37).

4. The crystal bonding and eutectic integrated machine according to claim 1, characterized in that: The first cam mechanism (12) is provided with a fifth Z-axis adjustment mechanism (44), and the fifth Z-axis adjustment mechanism (44) is fixedly connected to a first suction nozzle (45); the second cam mechanism (22) is provided with a sixth Z-axis adjustment mechanism (46), and the sixth Z-axis adjustment mechanism (46) is fixedly connected to a second suction nozzle (47).

5. The crystal bonding and eutectic integrated machine according to claim 4, characterized in that: The first suction nozzle (45) and the second suction nozzle (47) are both connected to a buffer mechanism (48), and an electromagnet (49) is installed on the buffer mechanism (48).

6. The crystal bonding and eutectic integrated machine according to claim 1, characterized in that: The heating device (24) is provided with a temperature controller (50) and a temperature sensor (51), the output end of the temperature sensor (51) is connected to the input end of the temperature controller (50), and the output end of the temperature controller (50) is connected to the input end of the heating device (24).

7. The crystal bonding and eutectic integrated machine according to claim 1, characterized in that: The eutectic heating platform (3) is provided with a third X-axis adjustment mechanism (52) and a fifth Y-axis adjustment mechanism (53), and the crystal bonding platform (25) is provided with a fourth X-axis adjustment mechanism (54) and a sixth Y-axis adjustment mechanism (55).

8. The crystal bonding and eutectic integrated machine according to claim 1, characterized in that: The dispensing welding head (29) is provided with a seventh Z-axis adjustment mechanism (56), and the output end of the seventh Z-axis adjustment mechanism (56) is fixedly connected to a fifth φ-axis adjustment mechanism (57). The dispensing welding head (29) supports Z-axis up and down movement and horizontal 13° swing and is fixed back and forth between point A and point B, wherein point A is a glue disk, and a stirring device is provided in the glue disk, and point B is a hole position of a PCB board working box (26), and the PCB working box (26) supports Z-axis up and down movement.

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