Multilayer circuit board automatic pressing equipment and multilayer circuit board production process

Abstract

The present invention relates to the technical field of circuit board production equipment, and in particular to an automatic lamination equipment for multi-layer circuit boards and a multi-layer board production process, wherein the automatic lamination equipment for multi-layer circuit boards includes a pre-processing machine, a laminating machine and a transfer device, the pre-processing machine is provided with a mesh conveyor belt, a film coating mechanism, an adsorption mechanism and a film tearing mechanism, the laminating machine includes a machine table and a laminating mechanism, the two sides of the machine table are respectively provided with a substrate feeding mechanism and a soft board feeding mechanism, the transfer device includes a lifting component and a bracket, and the bracket is connected with a plurality of vacuum suction cups to suck up the substrate. In the processing machine, the adhesive film on the bottom film is attached to the substrate, and the adhesive film is taken away by a film tearing roller, and the adhesive film takes away the dirt on the substrate; the mesh conveyor belt transfers the substrate to the substrate feeding mechanism of the laminating machine, and the transfer device of the laminating machine transfers the substrate and the soft board to the buffer base in turn, and the substrate and the soft board are pressed together by the cooperation of the pressing block and the buffer base, and the loading is automatic, and the production efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production equipment, and in particular to a multi-layer circuit board automatic pressing device and a multi-layer board production process. Background Art

[0002] In the related technology, with the rapid development of the printed circuit board (PCB) manufacturing industry, printed circuit boards have developed from single-layer to double-sided boards and composite multilayer boards (MLB), and the corresponding manufacturing level has been continuously developing towards high precision, high density and high reliability. In the preparation process of multilayer boards, the substrate is pressed with the flexible circuit board (Polyethyleneterephthalate, PET for short). Since the substrate is stored and transported after prefabrication, it is easy to be contaminated with dirt, which affects the subsequent pressing process and produces problems such as bumps and concave spots. In addition, the existing pressing equipment requires workers to manually load, stack and unload materials, which is inefficient and has product consistency deviations. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a multi-layer circuit board automatic pressing device, which has the function of cleaning the substrate and realizes automatic loading at the same time, and has high production efficiency.

[0004] The present invention also proposes a multi-layer circuit board production process using the multi-layer circuit board automatic pressing device.

[0005] According to the first aspect of the present invention, the automatic lamination equipment for multilayer circuit boards includes a pre-processing machine, a laminating machine and a transfer device. The pre-processing machine is provided with a mesh conveyor belt, a laminating mechanism, an adsorption mechanism and a film tearing mechanism. The laminating mechanism includes two guide rollers and a lifting frame. The two guide rollers are distributed on both sides of the lifting frame. Two pressing rollers are provided at the lower end of the lifting frame. The distance between the two pressing rollers is adapted to the width of the substrate. A bottom film is wound around the guide roller and the pressing roller. An adhesive film is adhered to the side of the bottom film away from the pressing roller. The adsorption mechanism The invention comprises a support plate, which is located below the mesh conveyor belt and can rise to contact the mesh conveyor belt. The support plate is provided with an exhaust hole and is connected to a vacuum pump or a strong exhaust fan. The film tearing mechanism is arranged downstream of the film laminating mechanism. The film tearing mechanism is provided with a film tearing roller, and the surface of the film tearing roller is provided with an adhesive layer. The laminating machine comprises a machine platform and a laminating mechanism. A substrate feeding mechanism and a soft plate feeding mechanism are respectively provided on both sides of the machine platform. The substrate feeding mechanism comprises a conveying component and a stacking component. The conveying component comprises A base plate, a driving component and two conveyor belts, two ends of the conveyor belts are connected with a driving pulley and a driven pulley, two groups of slide rails are arranged on the base plate, the driving pulley and the driven pulley are respectively connected to one group of the slide rails and move synchronously, the driving component comprises a first motor and a screw, the output shafts at both ends of the first motor are connected with the screw, the driven pulley is provided with a nut matching the screw, the driven pulley is adjacent to the output end of the mesh conveyor belt, the stacking assembly is arranged below the conveying assembly, the stacking assembly can receive the substrate and output the substrate to the conveying assembly, the pressing mechanism comprises a buffer base and a pressure block, the pressure block is located above the buffer base and is connected with a hydraulic cylinder; a transfer device comprises a lifting component and a bracket, the lifting component is slidably connected to the pressing machine, the lifting component is connected with a driving mechanism to move between the substrate feeding mechanism and the soft plate feeding mechanism, the bracket is connected to the lower end of the lifting component, and the bracket is connected with a plurality of vacuum suction cups to suck up the substrate.

[0006] The multi-layer circuit board automatic pressing device according to the first embodiment of the present invention has at least the following beneficial effects:

[0007] The substrate is first transported to the film laminating position by the mesh conveyor belt of the pre-processing machine, and the lifting frame of the laminating mechanism descends, and the adhesive film on the base film is adhered to the substrate by two pressure rollers. At the same time, the support plate rises and contacts the mesh conveyor belt, and the suction force of the vacuum equipment or the strong exhaust fan helps to adsorb the adhesive film, so that the adhesive film is separated from the base film; then the substrate is transported to the film tearing position by the mesh conveyor belt, and the film tearing mechanism moves down, so that the film tearing roller contacts the adhesive film and presses the substrate, and the film tearing roller takes away the adhesive film, and the adhesive film takes away the dirt on the substrate; the mesh conveyor belt transfers the substrate to the substrate loading mechanism of the laminating machine, and the transfer device of the laminating machine transfers the substrate to the buffer base, and then the soft board on the soft board loading mechanism is transferred to the buffer base by the transfer device, and the substrate and the soft board are pressed together by the cooperation of the pressing block and the buffer base. The automatic loading has high production efficiency and is conducive to improving product consistency.

[0008] According to some embodiments of the first aspect of the present invention, the laminating mechanism is further provided with a film pressing plate, the film pressing plate is connected to a film pressing cylinder, the film pressing cylinder is fixed to the lifting frame, the film pressing plate is distributed between the two pressing rollers and is located above the base film.

[0009] According to some embodiments of the first aspect of the present invention, the film tearing mechanism includes a slide, the slide is connected to a first cylinder, the first cylinder is fixed to the outer wall of the film coating mechanism, the film tearing roller is rotatably connected to the slide, and is connected to a driving motor.

[0010] According to some embodiments of the first aspect of the present invention, the stacking assembly includes a vertically arranged electric push rod, and a tray is provided at the upper end of the electric push rod to receive the substrate.

[0011] According to some embodiments of the first aspect of the present invention, the buffer base includes a base plate and an upper support plate, the upper end of the base plate is provided with a horizontal slide groove, two inclined sliding blocks are arranged in the slide groove, the opposite surfaces of the two inclined sliding blocks are set as inclined surfaces and form a V-shaped opening, the upper end surface of the upper support plate is a plane, and the lower end of the upper support plate is provided with a guide inclined block, the guide inclined block abuts against the inclined surfaces of the two inclined sliding blocks, and an elastic member is provided between the inclined sliding block and the base plate.

[0012] According to some embodiments of the first aspect of the present invention, a top plate is provided at the upper end of the laminating machine, and the top plate is provided with a first guide rail, the first guide rail extends from the substrate loading mechanism to the soft plate loading mechanism, the lifting component is connected to the first guide rail, the lifting component is a second cylinder, a buffer mechanism is provided at the upper end of the bracket to connect the second cylinder, the bracket is provided with a plurality of straight grooves, the plurality of straight grooves are evenly distributed circumferentially, and the upper end of the vacuum suction cup can move and lock in the straight groove.

[0013] According to some embodiments of the first aspect of the present invention, a top plate is provided at the upper end of the laminating machine, the top plate is provided with a first guide rail, the first guide rail is connected to a first slider, the first slider is provided with a second guide rail, the lifting component is connected to the second guide rail, the lifting component is a second cylinder, a buffer mechanism is provided at the upper end of the bracket to connect the second cylinder, the bracket is provided with a plurality of straight grooves, the plurality of straight grooves are evenly distributed circumferentially, and the upper end of the vacuum suction cup can move and lock in the straight groove.

[0014] According to some embodiments of the first aspect of the present invention, a top plate is provided at the upper end of the pressing machine, the top plate is provided with a first guide rail, the first guide rail is connected to a first slider, the first slider is connected to a rotating cylinder, the rotating cylinder is provided with a swing arm, the lifting component is connected to the end of the swing arm, the lifting component is a second cylinder, a buffer mechanism is provided at the upper end of the bracket to connect the second cylinder, the bracket is provided with a plurality of straight grooves, the plurality of straight grooves are evenly distributed circumferentially, and the upper end of the vacuum suction cup can move and lock in the straight groove.

[0015] The multilayer board production process according to the second embodiment of the present invention is applied to the multilayer circuit board automatic pressing device described in the first embodiment, and includes the following steps:

[0016] S100, placing the substrate on the mesh conveyor belt of the pre-processing machine, the mesh conveyor belt conveys the substrate to the film laminating position, the lifting frame descends, and the adhesive film on the base film is laminated to the substrate by the two pressing rollers, and at the same time, the support plate rises to contact the mesh conveyor belt, and the vacuum equipment or the suction force of the strong exhaust fan is used to help adsorb the adhesive film;

[0017] S200, conveying the substrate to a film-tearing position by the mesh conveyor belt, the film-tearing mechanism moves downward, so that the film-tearing roller contacts the adhesive film and presses the substrate, and the adhesive film is taken away by the film-tearing roller;

[0018] S300, transferring the substrate to the substrate loading mechanism of the laminating machine via the mesh conveyor belt, transferring the substrate to the buffer base of the laminating mechanism via the transfer device, and then transferring the soft board on the soft board loading mechanism to the buffer base via the transfer device, and laminating the substrate and the soft board by utilizing the cooperation of the pressing block and the buffer base.

[0019] According to some embodiments of the second aspect of the present invention, in the step S200, the pressure applied by the film-tearing roller to the substrate includes an increasing interval, a decreasing interval and an interval for maintaining a stable pressure.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0022] Figure 1 It is a schematic structural diagram of a multi-layer circuit board automatic pressing device according to an embodiment of the first aspect of the present invention;

[0023] Figure 2 is a schematic structural diagram of a pressing machine in an embodiment of the first aspect of the present invention;

[0024] Figure 3 It is a schematic diagram of the partial structure of the feeding device in the embodiment of the first aspect of the present invention;

[0025] Figure 4 It is an exploded schematic diagram of a buffer base in an embodiment of the first aspect of the present invention;

[0026] Figure 5 A diagram showing the use status of the transfer device in other embodiments of the first aspect of the present invention;

[0027] Figure 6 This is a usage status diagram of the transfer device in some embodiments of the first aspect of the present invention.

[0028] The figures are as follows:

[0029] Pre-processing machine 100, frame 110, stand 111, mesh conveyor belt 120, laminating mechanism 130, guide roller 131, lifting frame 132, pressing roller 133, bottom film 134, laminating plate 135, laminating cylinder 136, adsorption mechanism 140, support plate 141, film tearing mechanism 150, film tearing roller 151, slide 152, first cylinder 153;

[0030] Laminating machine 200, top plate 201, first guide rail 202, first slider 203, second guide rail 204, rotary cylinder 205, swing arm 206, machine table 210, laminating mechanism 220, buffer base 221, base plate 2211, upper support plate 2212, slide 2213, inclined slider 2214, guide inclined block 2215, pressing block 222, hydraulic cylinder 223, substrate loading mechanism 230, conveying assembly 231, bottom plate 2311, driving component 2312, first motor 23121, screw rod 23122, conveying belt 2313, driving pulley 2314, driven pulley 2315, slide rail 2316, stacking assembly 232, soft plate loading mechanism 240;

[0031] The transfer device 300 , the lifting component 310 , the bracket 320 , the buffer mechanism 321 , the slot 322 , and the vacuum suction cup 330 . DETAILED DESCRIPTION

[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] Reference Figures 1 to 6 The first embodiment of the present invention provides a multi-layer circuit board automatic pressing device, comprising:

[0037] Pre-processing machine 100, the pre-processing machine 100 is provided with a frame 110, a mesh conveyor belt 120, a coating mechanism 130, an adsorption mechanism 140 and a film tearing mechanism 150, the mesh conveyor belt 120, the coating mechanism 130, the adsorption mechanism 140 and the film tearing mechanism 150 are all arranged on the frame 110, the frame 110 is provided with a stand 111, a conveying guide rail is arranged in front of the stand 111 to feed the substrate into the mesh conveyor belt 120, the coating mechanism 130 includes two guide rollers 131 and a lifting frame 132, the two guide rollers 131 are distributed on both sides of the lifting frame 132, and are rotatably connected to the upper end of the stand 111, the lifting frame 132 is slidably connected to the stand 111, and is connected with a power part, which can be an electric push rod, a cylinder, etc., to push the lifting frame 132 to rise or fall, and the lower end of the lifting frame 132 is provided with There are two pressure rollers 133, and the distance between the two pressure rollers 133 is adapted to the width of the substrate. The bottom film 134 is passed around the two guide rollers 131 and the two pressure rollers 133. The bottom film 134 is automatically unwound and reeled by the unwinding device and the rewinding device. The side of the bottom film 134 away from the pressure roller 133 is adhered with an adhesive film. The adsorption mechanism 140 includes a support plate 141, and the support plate 141 is located below the mesh conveyor belt 120 and can rise to contact the mesh conveyor belt 120. The support plate 141 can be driven by power parts such as cylinders and electric push rods. The support plate 141 is provided with an exhaust hole and is connected to a vacuum pump or a strong exhaust fan to generate negative pressure suction at the exhaust hole. The film tearing mechanism 150 is arranged downstream of the laminating mechanism 130. The film tearing mechanism 150 is provided with a film tearing roller 151, and the surface of the film tearing roller 151 is provided with an adhesive layer.

[0038] The laminating machine 200 includes a machine table 210 and a laminating mechanism 220. A substrate loading mechanism 230 and a soft board loading mechanism 240 are respectively arranged on both sides of the machine table 210. The substrate loading mechanism 230 includes a conveying component 231 and a stacking component 232. The conveying component 231 includes a base plate 2311, a driving component 2312 and two conveying belts 2313. Both ends of the conveying belt 2313 are connected with a driving pulley 2314 and a driven pulley 2315. Two groups of slide rails 2316 are arranged on the base plate 2311. Each group of slide rails 2316 is connected with two driving pulleys 2314 or two driven pulleys 2315, and the driving pulley 2314 and the driven pulley 2315 connected to the same conveying belt 2313 move synchronously. A connecting rod can be arranged to make the driving pulley 2314 and the driven pulley 2315 move synchronously. The driving component 2312 includes a first motor 23121 and a screw 23122. The output shafts at both ends of the first motor 23121 are connected to the screw 23122. The driven pulley 2315 is provided with a nut that matches the screw 23122. The nut can be an independent component or integrated into the slide seat of the driving pulley 2314 or the driven pulley 2315. The slide seat is slidably connected to the slide rail 2316. The driven pulley 2315 is adjacent to the output end of the mesh conveyor belt 120 to receive the substrate. The stacking assembly 232 is arranged below the conveying assembly 231. The stacking assembly 232 can receive the substrate and output the substrate to the conveying assembly 231. The pressing mechanism 220 includes a buffer base 221 and a pressing block 222. The pressing block 222 is located above the buffer base 221 and is connected to a hydraulic cylinder 223. The hydraulic cylinder 223 drives the pressing block 222 to rise and fall and provides a large pressing force.

[0039] Among them, the structure of the soft board loading mechanism 240 is consistent with that of the substrate loading mechanism 230, and the function is similar, so it will not be described in detail.

[0040] The transfer device 300 includes a lifting component 310 and a bracket 320. The lifting component 310 is slidably connected to the laminating machine 200. The lifting component 310 is connected to a driving mechanism to move between a substrate loading mechanism 230 and a soft board loading mechanism 240. The bracket 320 is connected to the lower end of the lifting component 310. The bracket 320 is connected to a plurality of vacuum suction cups 330 to suck up the substrate.

[0041] The operation process of the multi-layer circuit board automatic pressing equipment is as follows: the substrate is conveyed by the mesh conveyor belt 120 of the pre-processing machine 100 to the film sticking position, the mesh conveyor belt 120 stops, and the lifting frame 132 of the laminating mechanism 130 descends, and the adhesive film on the bottom film 134 is stuck to the substrate by using two pressing rollers 133, and at the same time the support plate 141 rises to contact the mesh conveyor belt 120, and the suction force of the vacuum equipment or the strong exhaust fan is used to help fix the substrate and absorb the adhesive film, and the grid of the mesh conveyor belt 120 does not affect the suction force, and then the lifting frame 132 rises to separate the adhesive film from the bottom film 134; the substrate is conveyed to the film tearing position by the mesh conveyor belt 120, the mesh conveyor belt 120 stops, and the film tearing mechanism 150 moves down, so that the film tearing roller 151 contacts the adhesive film and presses the substrate, and because the film tearing roller 151 The surface of the substrate is provided with an adhesive layer, and the adhesive film is taken away by the film-tearing roller 151, and the adhesive film takes away the dirt on the substrate, so as to prevent the dirt from affecting the subsequent lamination steps, improve the quality after lamination, and eliminate defective products; then the mesh conveyor belt 120 transfers the substrate to the substrate feeding mechanism 230 of the laminating machine 200, and the transfer device 300 of the laminating machine 200 transfers the substrate to the buffer base 221, and then the soft board on the soft board feeding mechanism 240 is transferred to the buffer base 221 by the transfer device 300, and the hydraulic cylinder 223 drives the pressing block 222 to descend, and the substrate and the soft board are pressed together by the cooperation of the pressing block 222 and the buffer base 221, and the automatic loading has high production efficiency and is conducive to improving product consistency, and then the hydraulic cylinder 223 drives the pressing block 222 to rise, and the pressed composite board can be automatically taken away by the manipulator.

[0042] It is understandable that the purpose of setting the stacking assembly 232 is to store the substrates when the substrates are stacked. For example, when the pressing mechanism 220 stops, the pre-processing machine 100 can continue to operate, and the substrates are temporarily stacked and stored in the stacking assembly 232. The stacking assembly 232 can use an electric push rod and a tray. The electric push rod drives the tray to rise to a position flush with the conveying belt 2313 of the substrate feeding mechanism 230. The tray contacts the substrate, and then the first motor 23121 of the driving component 2312 drives the two screw rods 23122 to rotate, thereby driving the two driven pulleys 2315 away from each other, so that the two conveying belts 2313 are separated, and the substrate falls on the tray. Then the electric push rod drives the tray to descend step by step to receive multiple substrates. When outputting the substrate, the driving component 2312 drives the two conveying belts 2313 to separate first, and the electric push rod drives the tray to rise step by step, and the transfer device 300 takes away the substrates one by one. The stacking assembly 232 may also adopt a structure in which a rack and pinion drives the tray to rise and fall, or a servo motor drives a linear motion module, both of which can meet the requirements of receiving the substrate.

[0043] Moreover, the driving component 2312 can drive the two conveying belts 2313 to separate or approach each other, and adjust the distance between the two conveying belts 2313 to adapt to substrates of various specifications, thereby improving versatility.

[0044] It is understandable that the side of the bottom film 134 is a smooth surface, and the adhesion between the adhesive film and the bottom film 134 is smaller than the adhesion between the adhesive film and the substrate. An adhesive layer is provided on the surface of the film-tearing roller 151, and the adhesive layer is used to stick the adhesive film. The adhesion between the adhesive film and the adhesive layer is greater than the adhesion between the adhesive film and the substrate, so that the film-tearing roller 151 can tear off the adhesive film, and the adhesive film helps to remove dirt on the surface of the substrate. After the adhesive film covers the film-tearing roller 151, the adhesive film on the film-tearing roller 151 can also serve as an adhesive layer to help remove the adhesive film.

[0045] In addition, the support plate 141 of the adsorption mechanism 140 extends to the bottom of the film peeling roller 151. During the adhesive peeling operation, the support plate 141 helps to fix the substrate through the suction force of a vacuum device or a strong exhaust fan. The position of the suction hole can be adjusted so that the suction force only acts on the substrate, which helps to separate the adhesive film and the substrate.

[0046] Reference Figure 1 In some embodiments of the first aspect of the present invention, the laminating mechanism 130 is further provided with a film pressing plate 135, and the film pressing plate 135 is connected to a film pressing cylinder 136, and the film pressing cylinder 136 is fixed to the lifting frame 132. The film pressing plate 135 is distributed between the two pressing rollers 133 and is located above the bottom film 134. The film pressing plate 135 is driven down by the film pressing cylinder 136 to push the bottom film 134 downward, fully and evenly covering the substrate, helping the adhesive film to fully cover the substrate, and helping to stick away the dirt on the substrate.

[0047] Reference Figure 1 In some embodiments of the first aspect of the present invention, the film tearing mechanism 150 includes a slide 152, the slide 152 is connected to a first cylinder 153, the first cylinder 153 is fixed to the outer wall of the stand 111, the slide 152 can move up and down along the outer surface of the stand 111, the film tearing roller 151 is rotatably connected to the slide 152, and is connected to a driving motor. In the film tearing step, the first cylinder 153 drives the slide 152 to descend, so that the film tearing roller 151 contacts the adhesive film on the substrate, and then the mesh conveyor belt 120 is started to drive the substrate to move, and the film tearing roller 151 rotates and tears off the adhesive film.

[0048] Reference Figure 4In some embodiments of the first aspect of the present invention, the buffer base 221 includes a base plate 2211 and an upper support plate 2212, a horizontal slide groove 2213 is provided at the upper end of the base plate 2211, two inclined sliding blocks 2214 are arranged in the slide groove 2213, the opposite surfaces of the two inclined sliding blocks 2214 are set as inclined surfaces and form a V-shaped opening, the upper end surface of the upper support plate 2212 is a plane, and a guide inclined block 2215 is provided at the lower end of the upper support plate 2212, the guide inclined block 2215 is abutted against the inclined surfaces of the two inclined sliding blocks 2214, an elastic member is provided between the inclined sliding block 2214 and the base plate 2311, the elastic member can be a spring, a pillar is provided on the side of the inclined sliding block 2214, and the spring is sleeved on the pillar for positioning. During the pressing process, the substrate and the soft board are placed on the upper end surface of the upper support plate 2212, and the pressing block 222 descends, pushing the upper support plate 2212 down. Through the cooperation of the guiding inclined block 2215 and the two inclined sliding blocks 2214, the two inclined sliding blocks 2214 are pushed to separate, and at the same time, the spring is compressed to slow down the descending speed of the upper support plate 2212 and provide buffering, which is conducive to the smooth pressing process and improves product quality.

[0049] In addition, the buffer base 221 can also use rubber springs, composite springs, etc. as buffer structures, which can meet the use requirements.

[0050] Reference Figure 1 and Figure 2 In some embodiments of the first aspect of the present invention, a top plate 201 is provided at the upper end of the laminating machine 200, and a first guide rail 202 is provided on the top plate 201. The first guide rail 202 extends from the substrate feeding mechanism 230 to the soft plate feeding mechanism 240. The lifting component 310 is connected to the first guide rail 202. The lifting component 310 is a second cylinder. A driving member is provided on the top plate 201 to drive the second cylinder to move along the first guide rail 202. The driving member can be a linear motion module such as a motor and a screw nut pair, or a structure such as a motor-driven synchronous belt. In addition, a buffer mechanism 321 is provided at the upper end of the bracket 320 to connect the second cylinder. The buffer mechanism 321 can be a plurality of circumferentially uniformly distributed springs connected to a plate, and the plate is fixed to the end of the piston rod of the second cylinder. When the transfer device 300 is running, the bracket 320 is lowered to contact the substrate. The buffer mechanism 321 can reduce the impact force, and the vacuum suction cup 330 slowly contacts the substrate. The buffer mechanism 321 can also be other structural forms such as elastic rubber and composite springs. A plurality of straight grooves 322 are provided on the bracket 320, and the plurality of straight grooves 322 are evenly distributed circumferentially. The upper end of the vacuum suction cup 330 can move and be locked in the straight grooves 322. For example, the upper end of the vacuum suction cup 330 is locked with a nut. The vacuum suction cup 330 can be moved by loosening the nut, and the vacuum suction cup 330 can be fixed by tightening the nut.

[0051] Reference Figure 5In other embodiments of the first aspect of the present invention, a top plate 201 is provided at the upper end of the laminating machine 200, and the top plate 201 is provided with a first guide rail 202, the first guide rail 202 is connected to a first slider 203, the first slider 203 is provided with a second guide rail 204, a lifting component 310 is connected to the second guide rail 204, the lifting component 310 is a second cylinder, the first slider 203 is also provided with a driving member to drive the second cylinder to move along the second guide rail 204, the driving member can be a motor and a screw nut pair, or a motor-driven synchronous belt and other structures, a driving member is provided on the top plate 201 to drive the first slider 203 to move along the first guide rail 202, the driving member can be a motor and a screw nut pair, or a motor-driven synchronous belt and other structures, the lifting component 310 is moved over a large range through two sliding mechanisms, and can be moved to above the substrate loading mechanism 230 and the soft board loading mechanism 240. The upper end of the bracket 320 is provided with a buffer mechanism to connect to the second cylinder. The buffer mechanism 321 can be a plurality of circumferentially evenly distributed springs connected to a plate, and the plate is fixed to the end of the piston rod of the second cylinder. When the transfer device 300 is running, the bracket 320 drops to contact the substrate. The buffer mechanism 321 can reduce the impact force, and the vacuum suction cup 330 slowly contacts the substrate. The buffer mechanism 321 can also be other structural forms such as elastic rubber and composite springs. A plurality of straight grooves 322 are provided on the bracket 320, and the plurality of straight grooves 322 are evenly distributed circumferentially. The upper end of the vacuum suction cup 330 can move and lock in the straight groove 322. For example, the upper end of the vacuum suction cup 330 is locked with a nut. The vacuum suction cup 330 can be moved by loosening the nut, and the vacuum suction cup 330 can be fixed by tightening the nut.

[0052] Reference Figure 6In some further embodiments of the first aspect of the present invention, a top plate 201 is provided at the upper end of the laminating machine 200, the top plate 201 is provided with a first guide rail 202, the first guide rail 202 is connected to a first slider 203, the first slider 203 is connected to a rotary cylinder 205, the rotary cylinder 205 is provided with a swing arm 206, the lifting component 310 is connected to the end of the swing arm 206, and a driving member is provided on the top plate 201 to drive the first slider 203 to move along the first guide rail 202. The driving member can be selected from a motor and The screw-nut pair can also be a structure such as a motor-driven synchronous belt. The lifting component 310 can be moved to the top of the substrate loading mechanism 230 through the movement of the first slider 203 and the swing arm 206. Then the first slider 203 moves to the middle of the first guide rail 202. The rotary cylinder 205 drives the swing arm 206 and the lifting component 310 to rotate 180 degrees. The first slider 203 moves to the other end of the first guide rail 202, and the lifting component 310 moves to the top of the soft board loading mechanism 240. The lifting component 310 is a second cylinder. The upper end of the bracket 320 is provided with a buffer mechanism to connect the second cylinder. The buffer mechanism 321 can be a plurality of circumferentially uniformly distributed springs connected to a plate, and the plate is fixed to the end of the piston rod of the second cylinder. When the transfer device 300 is running, the bracket 320 is lowered to contact the substrate. The buffer mechanism 321 can reduce the impact force, and the vacuum suction cup 330 slowly contacts the substrate. The buffer mechanism 321 can also be other structural forms such as elastic rubber and composite springs. A plurality of straight grooves 322 are provided on the bracket 320, and the plurality of straight grooves 322 are evenly distributed circumferentially. The upper end of the vacuum suction cup 330 can move and be locked in the straight grooves 322. For example, the upper end of the vacuum suction cup 330 is locked with a nut. The vacuum suction cup 330 can be moved by loosening the nut, and the vacuum suction cup 330 can be fixed by tightening the nut.

[0053] The second embodiment of the present invention provides a multilayer board production process, which is applied to the multilayer circuit board automatic pressing device of the first embodiment, and includes the following steps:

[0054] S100, placing the substrate on the mesh conveyor belt 120 of the pre-processing machine, the mesh conveyor belt 120 conveys the substrate to the film laminating position, the lifting frame 132 descends, and the adhesive film on the bottom film 134 is laminated to the substrate by two pressing rollers 133, and at the same time, the support plate 141 rises to contact the mesh conveyor belt 120, and the suction force of the vacuum equipment or the strong exhaust fan helps to absorb the adhesive film;

[0055] S200, conveying the substrate to the film-tearing position by the mesh conveyor belt 120, and moving the film-tearing mechanism 150 downward so that the film-tearing roller 151 contacts the adhesive film and presses the substrate, and the adhesive film is taken away by the film-tearing roller 151;

[0056] S300, transfer the substrate to the substrate loading mechanism 230 of the laminating machine 200 through the mesh conveyor belt 120, transfer the substrate to the buffer base 221 of the laminating mechanism 220 through the transfer device 300, and then transfer the soft board on the soft board loading mechanism 240 to the buffer base 221 through the transfer device 300, and press the substrate and the soft board by using the cooperation of the pressing block 222 and the buffer base 221.

[0057] During the lamination process of the multilayer board production process, an additional step of film sticking and film tearing is added to use the adhesive film to remove dirt on the surface of the substrate to prevent it from affecting the subsequent lamination and improve product quality.

[0058] The multilayer board production process also includes that in step S200, the pressure applied by the film-tearing roller 151 to the substrate is variable, including an increasing interval, a decreasing interval and a stable pressure maintaining interval, and the pressure change curve in the increasing interval is a formula: , where X is the time axis and Y is the pressure axis; the pressure change curve in the decreasing section is as follows: , where X is the time axis and Y is the pressure axis. In the stable pressure range, the pressure error is maintained within plus or minus 0.01 KPa. Initially, the pressure is designed to be gradually increased to facilitate close contact and adhesion between the film-tearing roller 151 and the adhesive film, prevent gaps, and avoid separation of the film-tearing roller 151 from the adhesive film. Then, the pressure is gradually reduced to a certain value and maintained stable. Stable pressure is applied to maintain pressure, which helps to stably tear off the adhesive film.

[0059] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Automatic lamination equipment for multi-layer circuit boards, characterized in that: include: A pre-processing machine, wherein the pre-processing machine is provided with a mesh conveyor belt, a film coating mechanism, an adsorption mechanism and a film tearing mechanism, the film coating mechanism includes two guide rollers and a lifting frame, the two guide rollers are distributed on both sides of the lifting frame, two pressure rollers are provided at the lower end of the lifting frame, the distance between the two pressure rollers is adapted to the width of the substrate, a base film is wound around the guide roller and the pressure roller, and an adhesive film is attached to the side of the base film away from the pressure roller, the adsorption mechanism includes a support plate, the support plate is located below the mesh conveyor belt and can rise to contact the mesh conveyor belt, the support plate is provided with an exhaust hole and is connected to a vacuum device or a strong exhaust fan, the film tearing mechanism is arranged downstream of the film coating mechanism, the film tearing mechanism is provided with a film tearing roller, and the surface of the film tearing roller is provided with an adhesive layer; The pressing machine comprises a machine platform and a pressing mechanism, a substrate feeding mechanism and a soft plate feeding mechanism are respectively arranged on both sides of the machine platform, the substrate feeding mechanism comprises a conveying assembly and a stacking assembly, the conveying assembly comprises a bottom plate, a driving component and two conveying belts, two ends of the conveying belt are connected with a driving pulley and a driven pulley, two sets of slide rails are arranged on the bottom plate, the driving pulley and the driven pulley are respectively connected to one set of the slide rails and move synchronously, the driving component comprises a first motor and a screw rod, the output shafts at both ends of the first motor are connected with the screw rod, the driven pulley is provided with a nut matching the screw rod, the driven pulley is adjacent to the output end of the mesh conveyor belt, the stacking assembly is arranged below the conveying assembly, the stacking assembly can receive the substrate and output the substrate to the conveying assembly, the pressing mechanism comprises a buffer base and a pressing block, the pressing block is located above the buffer base and is connected with a hydraulic cylinder; The transfer device includes a lifting component and a bracket. The lifting component is slidably connected to the laminating machine. The lifting component is connected to a driving mechanism to move between the substrate loading mechanism and the soft board loading mechanism. The bracket is connected to the lower end of the lifting component. The bracket is connected to a plurality of vacuum suction cups to suck up the substrate.

2. The multi-layer circuit board automatic pressing device according to claim 1 is characterized in that: The laminating mechanism is also provided with a film pressing plate, the film pressing plate is connected with a film pressing cylinder, the film pressing cylinder is fixed to the lifting frame, the film pressing plate is distributed between the two pressing rollers and is located above the bottom film.

3. The multi-layer circuit board automatic pressing device according to claim 2 is characterized in that: The film tearing mechanism comprises a slide, the slide is connected to a first cylinder, the first cylinder is fixed to the outer wall of the film laminating mechanism, the film tearing roller is rotatably connected to the slide, and is connected to a driving motor.

4. The multi-layer circuit board automatic pressing device according to claim 1, characterized in that: The stacking assembly comprises a vertically arranged electric push rod, and a tray is arranged at the upper end of the electric push rod to receive the substrate.

5. The multi-layer circuit board automatic pressing device according to claim 1 is characterized in that: The buffer base includes a base plate and an upper support plate, the upper end of the base plate is provided with a horizontal slide groove, two inclined sliding blocks are arranged in the slide groove, the opposite surfaces of the two inclined sliding blocks are set as inclined surfaces and form a V-shaped opening, the upper end surface of the upper support plate is a plane, and the lower end of the upper support plate is provided with a guide inclined block, the guide inclined block abuts against the inclined surfaces of the two inclined sliding blocks, and an elastic member is provided between the inclined sliding block and the base plate.

6. The multi-layer circuit board automatic pressing device according to claim 1, characterized in that: A top plate is provided at the upper end of the laminating machine, and a first guide rail is provided on the top plate. The first guide rail extends from the substrate feeding mechanism to the soft plate feeding mechanism. The lifting component is connected to the first guide rail. The lifting component is a second cylinder. A buffer mechanism is provided at the upper end of the bracket to connect the second cylinder. The bracket is provided with a plurality of straight grooves, and the plurality of straight grooves are evenly distributed circumferentially. The upper end of the vacuum suction cup can move and lock in the straight groove.

7. The multi-layer circuit board automatic pressing device according to claim 1, characterized in that: The upper end of the pressing machine is provided with a top plate, the top plate is provided with a first guide rail, the first guide rail is connected to a first slider, the first slider is provided with a second guide rail, the lifting component is connected to the second guide rail, the lifting component is a second cylinder, the upper end of the bracket is provided with a buffer mechanism to connect the second cylinder, the bracket is provided with a plurality of straight grooves, the plurality of straight grooves are uniformly distributed circumferentially, and the upper end of the vacuum suction cup can move and lock in the straight groove.

8. The multi-layer circuit board automatic pressing device according to claim 1, characterized in that: A top plate is provided at the upper end of the pressing machine, and a first guide rail is provided on the top plate. The first guide rail is connected to a first slider, and the first slider is connected to a rotating cylinder. The rotating cylinder is provided with a swing arm, and the lifting component is connected to the end of the swing arm. The lifting component is a second cylinder. A buffer mechanism is provided at the upper end of the bracket to connect the second cylinder. The bracket is provided with a plurality of straight grooves, and the plurality of straight grooves are uniformly distributed circumferentially. The upper end of the vacuum suction cup can move and lock in the straight groove.

9. A multilayer board production process, applied to a multilayer circuit board automatic pressing device as claimed in any one of claims 1 to 8, characterized in that: The steps include: S100, placing the substrate on the mesh conveyor belt of the pre-processing machine, the mesh conveyor belt conveys the substrate to the film laminating position, the lifting frame descends, and the adhesive film on the base film is laminated to the substrate by the two pressing rollers, and at the same time, the support plate rises to contact the mesh conveyor belt, and the vacuum equipment or the suction force of the strong exhaust fan is used to help adsorb the adhesive film; S200, conveying the substrate to a film-tearing position by the mesh conveyor belt, the film-tearing mechanism moves downward, so that the film-tearing roller contacts the adhesive film and presses the substrate, and the adhesive film is taken away by the film-tearing roller; S300, transferring the substrate to the substrate loading mechanism of the laminating machine via the mesh conveyor belt, transferring the substrate to the buffer base of the laminating mechanism via the transfer device, and then transferring the soft board on the soft board loading mechanism to the buffer base via the transfer device, and laminating the substrate and the soft board by utilizing the cooperation of the pressing block and the buffer base.

10. The multilayer board production process according to claim 9, characterized in that: In the step S200, the pressure applied by the film-tearing roller to the substrate includes an increasing interval, a decreasing interval and an interval for maintaining a stable pressure.

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