Laser marking device for generating glass layer on wafer

Abstract

The invention discloses a technical field of wafer processing, specifically a laser marking device for generating a glass layer on a wafer, comprising a support seat and a base, the support seat being installed on the side of the base, a conveyor belt being rotatably installed on the base, a fixing plate being fixedly connected to the upper end of the side of the support seat, a laser marking assembly being fixedly installed on one end of the fixing plate away from the support seat, a lifting groove being opened on the side of the support seat, an electric telescopic rod being fixedly installed on the upper end of the support seat, the lower end of the electric telescopic rod extending downward into the lifting groove and being fixedly connected to the lifting slide plate, the beneficial effect of the invention is that when loading materials, it is only necessary to first place the wafer body in the wafer placement groove at the upper end of the wafer placement seat, and then place the wafer placement seat on the conveyor belt, so that the docking block at the upper end of the conveyor belt is plugged into the docking groove at the lower end of the wafer placement seat, and the wafer placement seat and the wafer body are transported to the bottom of the laser marking assembly through the conveyor belt.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to a laser marking device for generating a glass layer on a wafer. Background Art

[0002] The chip is one of the most important raw materials of LED, the light-emitting component of LED, and the core part of LED. The quality of the chip will directly determine the performance of LED. In the process of chip processing, it is necessary to generate a protective layer such as a glass layer on the chip to protect the chip to a certain extent. In the process of chip processing, it is necessary to perform laser marking on the chip. The existing laser marking device has certain defects in the process of operation:

[0003] 1. Most of the existing laser marking devices are manually loaded and unloaded, which is a cumbersome process. When loading, the worker's hand will reach under the laser head. If the laser marking device is accidentally started, it will cause injuries to the worker, which poses certain safety hazards. And each time, the previous wafer needs to be processed, the wafer needs to be unloaded, and then the new wafer to be processed needs to be loaded before the next wafer can be marked, which greatly reduces the processing efficiency.

[0004] 2. The existing laser marking device does not have a positioning mechanism. During the laser marking process, it cannot ensure that the wafer can be accurately and flatly placed on the laser marking table. Once the wafer is offset or tilted, it will affect the laser marking effect on the wafer, and then cause defects or damage to the wafer. Severe cases may directly cause the wafer to be scrapped, which is not conducive to actual processing. Summary of the invention

[0005] The object of the present invention is to provide a laser marking device for generating a glass layer on a wafer, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a laser marking device for generating a glass layer from a chip, comprising a support seat and a base, the support seat is installed on the side of the base, a conveyor belt is rotatably installed on the base, a fixing plate is fixedly connected to the upper end of the side of the support seat, a laser marking assembly is fixedly installed on the end of the fixing plate away from the support seat, a lifting groove is provided on the side of the support seat, an electric telescopic rod is fixedly installed on the upper end of the support seat, the lower end of the electric telescopic rod extends downward into the lifting groove and is fixedly connected to the lifting slide plate, an extrusion plate is fixedly connected to the side of the lifting slide plate, a guide light rod is symmetrically fixedly connected to the side of the support seat, a groove is provided on the upper end of the base, a protective box is fixedly installed in the groove, the protective box is distributed transversely on the inner side of the conveyor belt, and the side of the protective box away from the support seat is open, a plurality of wafer placing mechanisms are equidistantly arranged on the upper end of the conveyor belt, a wafer body is placed on the upper end of the wafer placing mechanism, and a positioning and calibration mechanism for fixing the wafer placing mechanism is installed on the upper end of the protective box.

[0007] Preferably, the lifting slide plate and the extrusion plate are both slidably connected to the lifting groove up and down, the lower end of the extrusion plate is arranged in a slope, and the cross section of the lifting groove is convex.

[0008] Preferably, the wafer placement mechanism includes a wafer placement seat arranged at the upper end of the conveyor belt, and L-shaped positioning blocks symmetrically fixedly connected to the left and right sides of the wafer placement seat, and a wafer placement groove is opened at the upper end of the wafer placement seat, and the wafer body is placed in the wafer placement groove.

[0009] Preferably, the lower end of the wafer placement seat is symmetrically provided with docking grooves, and the outer side surface of the conveyor belt is equidistantly and fixedly connected with a plurality of groups of docking blocks, each group of docking blocks has two blocks, and the docking blocks are plugged into the docking grooves.

[0010] Preferably, the positioning and calibration mechanism includes two L-shaped positioning clamping plates symmetrically distributed on the left and right sides of the chip placement mechanism, an adjustment mechanism installed in the protective box, and a transmission mechanism for driving the adjustment mechanism. A positioning groove is formed through the side of the L-shaped positioning clamping plate, and the lower end of the L-shaped positioning clamping plate is in sliding contact with the upper end of the protective box.

[0011] Preferably, the L-shaped positioning clamping plate is clamped on one side of the wafer placement seat, and one end of the L-shaped positioning block is plugged into the positioning groove.

[0012] Preferably, the adjustment mechanism includes a two-way transmission screw rotatably connected to the inner cavity of the protection box, an external gear ring fixedly sleeved on the two-way transmission screw, two adjustment blocks symmetrically and movably sleeved on the two-way transmission screw, two convex sliding blocks symmetrically installed on the upper end of the inner cavity of the protection box, and a movable rod symmetrically and rotatably connected to the two sides of the convex sliding blocks through a pin shaft, the end of the movable rod away from the convex sliding block is hinged to the adjustment block by a hinge, the two-way transmission screw is threadedly connected to the adjustment block, and the upper end of the adjustment block is in sliding contact with the upper end of the inner cavity of the protection box.

[0013] Preferably, a sliding groove is symmetrically opened on the upper end of the protective box, the convex sliding block is in sliding contact with the upper end of the protective box, the upward protrusion of the convex sliding block is slidably connected to the sliding groove, and the upward protrusion of the convex sliding block passes through the sliding groove and is fixedly connected to the lower end of the L-shaped positioning clamping plate.

[0014] Preferably, the transmission mechanism includes a rack plate meshed with the lower end of the outer gear ring, a strip plate fixedly connected to one end of the rack plate, a dovetail plate fixedly connected to the lower end of the rack plate, a transmission plate arranged at the end of the strip plate away from the rack plate, and two return springs symmetrically inserted into the side of the transmission plate, the lower end of the strip plate is in sliding contact with the bottom of the inner cavity of the protection box, the dovetail plate is slidably connected to the dovetail groove left and right, and one end of the strip plate extends through the side wall of the protection box to the outside and is fixedly connected to the transmission plate.

[0015] Preferably, the transmission plate is sleeved on two guide light rods, and the transmission plate is slidably connected to the guide light rods left and right, the return spring is sleeved on one end of the guide light rod, and the two ends of the return spring are respectively abutted against the outer side surface of the protective box and the transmission plate, and the side surface of the transmission plate is abutted against the extrusion plate.

[0016] Compared with the prior art, the invention has the following advantages:

[0017] 1. When loading, just place the wafer body in the wafer placement groove at the upper end of the wafer placement seat, and then place the wafer placement seat on the conveyor belt, so that the docking block at the upper end of the conveyor belt is plugged into the docking groove at the lower end of the wafer placement seat. The wafer placement seat and the wafer body are transported to the bottom of the laser marking component through the conveyor belt. After the processing of the wafer body is completed, the processed wafer body is directly transported away through the conveyor belt, so that the next wafer body can continue to be processed, which greatly improves the processing efficiency.

[0018] 2. When the wafer body needs to be processed, the inner rod of the electric telescopic rod is extended downward to drive the lifting slide plate to slide downward along the lifting slot, and the extrusion plate slides downward along the transmission plate. At the same time, the extrusion plate pushes the transmission plate to approach the protective box, so that the transmission mechanism drives the adjustment mechanism to operate, and the two convex sliders drive the two L-shaped positioning clamping plates to approach each other through the adjustment mechanism, so that the L-shaped positioning block is plugged into the positioning groove on the side of the L-shaped positioning clamping plate, so that the two L-shaped positioning clamping plates cooperate with each other to clamp and position the wafer placement mechanism; thereby, the wafer placement mechanism can be accurately and flatly placed under the laser marking component, and then the wafer body can be accurately and flatly placed under the laser marking component, so that the laser marking component can accurately mark the wafer body to ensure the processing accuracy.

[0019] 3. After the marking process of the wafer body is completed, the extrusion plate is separated from the transmission plate, and the transmission plate is pushed away from the protective box under the action of the return spring elastic force, so that the transmission mechanism drives the adjustment mechanism to operate, and the two convex sliders drive the two L-shaped positioning clamping plates to move away from each other through the adjustment mechanism, so that the L-shaped positioning clamping plates release the clamping positioning of the wafer placement mechanism. At this time, the wafer placement seat with the processed wafer body is transported away by the conveyor belt, and the wafer placement seat with the wafer body to be processed is transported between the two L-shaped positioning clamping plates to wait for processing, and this reciprocating process can continuously mark the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A three-dimensional diagram of the structure of a laser marking device for generating a glass layer for a wafer of the present invention;

[0021] Figure 2 A cross-sectional view of the structure of a laser marking device for generating a glass layer on a wafer of the present invention;

[0022] Figure 3 for Figure 2 A schematic diagram of the structure enlargement in the middle;

[0023] Figure 4 This is an exploded view of the support seat, lifting slide plate and extrusion plate structure of the present invention;

[0024] Figure 5 It is a cross-sectional view of the structure of the wafer placement mechanism of the present invention;

[0025] Figure 6 It is a cross-sectional view of the protective box structure of the present invention;

[0026] Figure 7 It is an exploded view of the protective box and positioning calibration mechanism structure of the present invention.

[0027] In the figure: 1. Support seat; 11. Fixed plate; 12. Laser marking component; 13. Lifting slot; 14. Electric telescopic rod; 15. Lifting slide plate; 16. Extrusion plate; 17. Guide light rod; 2. Base; 21. Conveyor belt; 22. Docking block; 23. Groove; 3. Protective box; 31. Slide; 32. Dovetail groove; 4. Wafer placement seat; 41. Wafer placement slot; 42. Docking slot; 43. L-shaped positioning block; 44. Wafer body; 5. Bidirectional transmission screw; 51. External gear ring; 52. Adjustment block; 53. Convex slider; 54. Movable rod; 55. L-shaped positioning clamping plate; 56. Positioning slot; 6. Strip plate; 61. Rack plate; 62. Dovetail plate; 7. Transmission plate; 71. Reset spring. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figures 1 to 7 The present invention provides a technical solution: a laser marking device for generating a glass layer on a wafer, comprising a support seat 1 and a base 2, wherein the support seat 1 is mounted on the side of the base 2, a conveyor belt 21 is rotatably mounted on the base 2, a fixing plate 11 is fixedly connected to the upper end of the side of the support seat 1, a laser marking component 12 is fixedly mounted on the end of the fixing plate 11 away from the support seat 1, and the laser marking component 12 is arranged above the conveyor belt 21, a lifting groove 13 is opened on the side of the support seat 1, an electric telescopic rod 14 is fixedly mounted on the upper end of the support seat 1, and the lower end of the electric telescopic rod 14 extends downward to the lifting groove 13. The lowering groove 13 is fixedly connected to the lifting slide 15, the side of the lifting slide 15 is fixedly connected with an extrusion plate 16, the side of the support seat 1 is symmetrically fixedly connected with a guide light rod 17, the upper end of the base 2 is provided with a groove 23, and the groove 23 is fixedly installed with a protection box 3, the protection box 3 is distributed horizontally on the inner side of the conveyor belt 21, and the side of the protection box 3 away from the support seat 1 is open, and a plurality of wafer placing mechanisms are equidistantly arranged at the upper end of the conveyor belt 21, and a wafer body 44 is placed at the upper end of the wafer placing mechanism, and a positioning and calibration mechanism for fixing the wafer placing mechanism is installed at the upper end of the protection box 3.

[0030] See also Figure 1 , Figure 2 and Figure 4The lifting slide 15 and the extrusion plate 16 are connected to the lifting groove 13 in an up-and-down sliding manner. The lower end of the extrusion plate 16 is arranged on a slope. The cross section of the lifting groove 13 is convex. The lifting slide 15 is driven to slide up and down along the lifting groove 13 by the inner rod of the electric telescopic rod 14 extending and retracting up and down, and the lifting slide 15 drives the extrusion plate 16 to move up and down.

[0031] See also Figure 1 , Figure 5 and Figure 7 The wafer placement mechanism includes a wafer placement seat 4 arranged at the upper end of the conveyor belt 21, and L-shaped positioning blocks 43 symmetrically fixedly connected to the left and right sides of the wafer placement seat 4. A wafer placement groove 41 is opened at the upper end of the wafer placement seat 4, and a wafer body 44 is placed in the wafer placement groove 41. The wafer body 44 is held by the wafer placement seat 4, so as to achieve preliminary positioning of the wafer body 44.

[0032] The lower end of the wafer placement seat 4 is symmetrically provided with docking grooves 42, and the outer side surface of the conveyor belt 21 is equidistantly fixedly connected with a plurality of docking blocks 22, each group of docking blocks 22 has two, and the docking blocks 22 are plugged into the docking grooves 42;

[0033] The wafer body 44 is placed in the wafer placement groove 41 at the upper end of the wafer placement seat 4, and then the wafer placement seat 4 is placed on the conveyor belt 21, so that the docking block 22 at the upper end of the conveyor belt 21 is plugged into the docking groove 42 at the lower end of the wafer placement seat 4.

[0034] When the conveyor belt 21 is in operation, the wafer placement seat 4 is driven to move through the docking block 22 , and the wafer placement seat 4 drives the wafer body 44 to move, thereby conveying the wafer body 44 .

[0035] See also Figure 2 , Figure 3 , Figure 5 , Figure 6 and Figure 7 The positioning and calibration mechanism includes two L-shaped positioning clamping plates 55 symmetrically distributed on the left and right sides of the chip placement mechanism, an adjustment mechanism installed in the protective box 3, and a transmission mechanism for driving the adjustment mechanism. A positioning groove 56 is opened through the side of the L-shaped positioning clamping plate 55, and the lower end of the L-shaped positioning clamping plate 55 is in sliding contact with the upper end of the protective box 3.

[0036] The L-shaped positioning clamping plate 55 is clamped on one side of the chip placement seat 4, and one end of the L-shaped positioning block 43 is plugged into the positioning groove 56; the chip placement seat 4 is clamped and fixed by the two L-shaped positioning clamping plates 55, the inner side wall of the L-shaped positioning clamping plate 55 abuts against the side surface of the chip placement seat 4, and the bottom of the L-shaped positioning clamping plate 55 contacts the lower end of the chip placement seat 4.

[0037] By plugging the L-shaped positioning block 43 into the positioning groove 56 on the side of the L-shaped positioning clamping plate 55, the chip placement seat 4 can be accurately located below the laser marking component 12. Since the chip body 44 is placed on the chip placement seat 4, the chip body 44 can be accurately located below the laser marking component 12, thereby ensuring the accuracy of subsequent marking operations.

[0038] The adjusting mechanism includes a two-way transmission screw 5 rotatably connected to the inner cavity of the protection box 3, an external gear ring 51 fixedly sleeved on the two-way transmission screw 5, two adjusting blocks 52 symmetrically and movably sleeved on the two-way transmission screw 5, two convex sliding blocks 53 symmetrically installed on the upper end of the inner cavity of the protection box 3, and a movable rod 54 symmetrically and rotatably connected to the two sides of the convex sliding blocks 53 through a pin shaft, the end of the movable rod 54 away from the convex sliding blocks 53 is hinged to the adjusting block 52 through a hinge, the two-way transmission screw 5 is threadedly connected to the adjusting block 52, and the upper end of the adjusting block 52 is in sliding contact with the upper end of the inner cavity of the protection box 3.

[0039] A slide groove 31 is symmetrically provided at the upper end of the protective box 3, and the convex slider 53 is in sliding contact with the upper end of the protective box 3. The upward protrusion of the convex slider 53 is slidably connected to the slide groove 31, and the upward protrusion of the convex slider 53 passes through the slide groove 31 and is fixedly connected to the lower end of the L-shaped positioning clamping plate 55.

[0040] The two-way transmission screw 5 rotates forward or reversely, and the two-way transmission screw 5 drives the two adjustment blocks 52 to move closer to or farther from each other. The adjustment block 52 drives the convex slider 53 to move along the upper end of the protection box 3 through the movable rod 54. At the same time, the convex part of the upper end of the convex slider 53 slides left and right along the slide groove 31, so that the convex slider 53 can move left and right stably.

[0041] When the two adjusting blocks 52 move toward each other, the adjusting blocks 52 push the movable rod 54 to move, and the movable rod 54 pushes the convex slider 53 to slide along the upper end of the protection box 3, so that the two convex sliders 53 move away from each other, and the two convex sliders 53 drive the two L-shaped positioning clamping plates 55 to move away from each other, so that the L-shaped positioning clamping plates 55 release the clamping positioning of the wafer placement mechanism;

[0042] When the two adjustment blocks 52 move away from each other, the adjustment blocks 52 pull the movable rod 54 to move, and the movable rod 54 pulls the convex slider 53 to slide along the upper end of the protective box 3, so that the two convex sliders 53 are close to each other, and the two convex sliders 53 drive the two L-shaped positioning clamping plates 55 to approach each other, so that the two L-shaped positioning clamping plates 55 cooperate with each other to clamp and position the chip placement mechanism.

[0043] The transmission mechanism includes a rack plate 61 meshed with the lower end of the outer gear ring 51, a strip plate 6 fixedly connected to one end of the rack plate 61, a dovetail plate 62 fixedly connected to the lower end of the rack plate 61, a transmission plate 7 arranged at one end of the strip plate 6 away from the rack plate 61, and two return springs 71 symmetrically plugged into the side of the transmission plate 7, the lower end of the strip plate 6 is in sliding contact with the bottom of the inner cavity of the protection box 3, the dovetail plate 62 is slidably connected to the dovetail groove 32, and one end of the strip plate 6 extends through the side wall of the protection box 3 to the outside and is fixedly connected to the transmission plate 7;

[0044] The strip plate 6 is slidably connected to the side wall of the protection box 3 , and the transmission plate 7 and the return spring 71 are both arranged on the outside of the protection box 3 .

[0045] The transmission plate 7 is sleeved on two guide light rods 17, and the transmission plate 7 is slidably connected to the guide light rods 17 left and right. The return spring 71 is sleeved on one end of the guide light rod 17. The two ends of the return spring 71 are respectively abutted against the outer side surface of the protection box 3 and the transmission plate 7, and the side of the transmission plate 7 is abutted against the squeezing plate 16. When the squeezing plate 16 moves up and down, it abuts against the side of the transmission plate 7.

[0046] The return spring 71 applies elastic force to the transmission plate 7, which drives the strip plate 6 and the rack plate 61 to move left and right through the transmission plate 7. When the rack plate 61 moves, it drives the outer gear ring 51 to rotate, and the outer gear ring 51 drives the bidirectional transmission screw 5 to rotate. When the rack plate 61 moves, it drives the dovetail plate 62 to slide left and right along the dovetail groove 32, so that the rack plate 61 can move left and right stably.

[0047] Working principle: The wafer placement seat 4 with the wafer body 44 is first installed on the upper end of the conveyor belt 21, and the wafer placement seat 4 and the wafer body 44 are conveyed to the bottom of the laser marking assembly 12 by the conveyor belt 21. After the marking process of the wafer body 44 is completed, the processed wafer body 44 is directly transported away by the conveyor belt 21, so that the marking process of the next wafer body 44 can continue, which greatly improves the efficiency of the laser marking process;

[0048] When loading, it is only necessary to first place the wafer body 44 in the wafer placement groove 41 at the upper end of the wafer placement seat 4, and then place the wafer placement seat 4 on the conveyor belt 21, so that the docking block 22 at the upper end of the conveyor belt 21 is plugged into the docking groove 42 at the lower end of the wafer placement seat 4; when unloading, it is only necessary to remove the wafer placement seat 4 from the conveyor belt 21, which is simple and convenient for loading and unloading.

[0049] When the wafer body 44 needs to be processed, the inner rod of the electric telescopic rod 14 extends downward to drive the lifting slide 15 to slide downward along the lifting slot 13, and the lifting slide 15 drives the extrusion plate 16 to move downward, and the extrusion plate 16 slides downward along the transmission plate 7. At the same time, the extrusion plate 16 pushes the transmission plate 7 to approach the protection box 3, and the transmission plate 7 squeezes the reset spring 71. The transmission plate 7 pushes the rack plate 61 to slide along the bottom of the protection box 3 through the strip plate 6, and the rack plate 61 drives the outer gear ring 51 to rotate, and the outer gear ring 51 drives the bidirectional transmission screw 5 to rotate;

[0050] The two adjusting blocks 52 are driven away from each other by the bidirectional transmission screw 5, and the adjusting block 52 pulls the movable rod 54 to move, and the movable rod 54 pulls the convex slider 53 to slide along the upper end of the protective box 3, so that the two convex sliders 53 are close to each other, and the two convex sliders 53 drive the two L-shaped positioning clamping plates 55 to approach each other, so that the L-shaped positioning block 43 is plugged into the positioning groove 56 on the side of the L-shaped positioning clamping plate 55, so that the two L-shaped positioning clamping plates 55 cooperate with each other to clamp and position the chip placement mechanism.

[0051] Thereby, the chip placement mechanism can be accurately and flatly positioned under the laser marking component 12, and the chip body 44 can be accurately and flatly positioned under the laser marking component 12, so that the laser marking component 12 can accurately mark the chip body 44, thereby ensuring the accuracy of the laser marking operation.

[0052] When the processing of the wafer body 44 is completed, the inner rod of the electric telescopic rod 14 is retracted to drive the lifting slide 15 to slide upward along the lifting slot 13, and the lifting slide 15 drives the extrusion plate 16 to move upward, so that the extrusion plate 16 is separated from the transmission plate 7, and the transmission plate 7 is pushed away from the protection box 3 under the action of the elastic force of the return spring 71, and the transmission plate 7 drives the rack plate 61 to move back through the strip plate 6, and the rack plate 61 drives the outer gear ring 51 to rotate in the opposite direction, and the outer gear ring 51 drives the bidirectional transmission screw 5 to rotate in the opposite direction;

[0053] The two adjusting blocks 52 are driven to move toward each other through the bidirectional transmission screw 5, and the adjusting block 52 pushes the movable rod 54 to move, and the movable rod 54 pushes the convex sliding block 53 to slide along the upper end of the protective box 3, so that the two convex sliding blocks 53 are moved away from each other, and the two convex sliding blocks 53 drive the two L-shaped positioning clamping plates 55 to move away from each other, so that the L-shaped positioning clamping plates 55 release the clamping positioning of the chip placement mechanism, and at this time, the chip placement seat 4 with the processed chip body 44 is transported away by the conveyor belt 21, and at the same time, the chip placement seat 4 with the chip body 44 to be processed is transported to between the two L-shaped positioning clamping plates 55 to wait for processing, and this reciprocating process can continuously perform laser marking processing on the chip body 44.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser marking device for generating a glass layer on a wafer, comprising a support seat (1) and a base (2), wherein the support seat (1) is mounted on the side of the base (2), and a conveyor belt (21) is rotatably mounted on the base (2), characterized in that: The upper end of the side surface of the support seat (1) is fixedly connected to a fixing plate (11), and a laser marking assembly (12) is fixedly installed on one end of the fixing plate (11) away from the support seat (1). A lifting groove (13) is provided on the side surface of the support seat (1). An electric telescopic rod (14) is fixedly installed on the upper end of the support seat (1). The lower end of the electric telescopic rod (14) extends downward into the lifting groove (13) and is fixedly connected to a lifting slide plate (15). The side surface of the lifting slide plate (15) is fixedly connected to an extrusion plate (16). A guide light rod (17) is symmetrically fixedly connected, a groove (23) is provided at the upper end of the base (2), a protection box (3) is fixedly installed in the groove (23), the protection box (3) is distributed transversely on the inner side of the conveyor belt (21), and the side of the protection box (3) away from the support seat (1) is open, a plurality of wafer placement mechanisms are equidistantly arranged at the upper end of the conveyor belt (21), a wafer body (44) is placed at the upper end of the wafer placement mechanism, and a positioning and calibration mechanism for fixing the wafer placement mechanism is installed at the upper end of the protection box (3); The wafer placement mechanism comprises a wafer placement seat (4) arranged at the upper end of the conveyor belt (21), and L-shaped positioning blocks (43) symmetrically fixedly connected to the left and right sides of the wafer placement seat (4); a wafer placement groove (41) is formed at the upper end of the wafer placement seat (4), and the wafer body (44) is placed in the wafer placement groove (41); The positioning and calibration mechanism comprises two L-shaped positioning clamping plates (55) symmetrically distributed on the left and right sides of the wafer placement mechanism, an adjustment mechanism installed in the protection box (3), and a transmission mechanism for driving the adjustment mechanism, a positioning groove (56) is formed through the side of the L-shaped positioning clamping plate (55), the lower end of the L-shaped positioning clamping plate (55) is in sliding contact with the upper end of the protection box (3), the L-shaped positioning clamping plate (55) is clamped on one side of the wafer placement seat (4), and one end of the L-shaped positioning block (43) is plugged into the positioning groove (56); The adjustment mechanism comprises a bidirectional transmission screw (5) rotatably connected to the inner cavity of the protection box (3), an external gear ring (51) fixedly sleeved on the bidirectional transmission screw (5), two adjustment blocks (52) symmetrically sleeved on the bidirectional transmission screw (5), two convex sliders (53) symmetrically installed at the upper end of the inner cavity of the protection box (3), and a movable rod (54) symmetrically rotatably connected to both sides of the convex slider (53) through a pin shaft, and the end of the movable rod (54) away from the convex slider (53) is connected to the adjustment block (52) through The hinge is hinged, the bidirectional transmission screw (5) is threadedly connected to the adjustment block (52), the upper end of the adjustment block (52) is in sliding contact with the upper end of the inner cavity of the protection box (3), the upper end of the protection box (3) is symmetrically provided with a slide groove (31), the convex slider (53) is in sliding contact with the upper end of the protection box (3), the upward protrusion of the convex slider (53) is slidably connected to the slide groove (31), and the upward protrusion of the convex slider (53) passes through the slide groove (31) and is fixedly connected to the lower end of the L-shaped positioning clamping plate (55); The transmission mechanism comprises a rack plate (61) meshed with the lower end of the outer gear ring (51), a strip plate (6) fixedly connected to one end of the rack plate (61), a dovetail plate (62) fixedly connected to the lower end of the rack plate (61), a transmission plate (7) arranged at the end of the strip plate (6) away from the rack plate (61), and two return springs (71) symmetrically plugged into the side of the transmission plate (7), the lower end of the strip plate (6) is in sliding contact with the bottom of the inner cavity of the protection box (3), and the dovetail plate (62) is in contact with the dovetail groove (3). 2) a left-right sliding connection, one end of the strip plate (6) passes through the side wall of the protection box (3) and extends to the outside and is fixedly connected to the transmission plate (7), the transmission plate (7) is sleeved on two guide light rods (17), and the transmission plate (7) and the guide light rod (17) are slidably connected to the left-right, the return spring (71) is sleeved on one end of the guide light rod (17), and the two ends of the return spring (71) are respectively in contact with the outer side surface of the protection box (3) and the transmission plate (7), and the side surface of the transmission plate (7) is in contact with the extrusion plate (16).

2. A laser marking device for generating a glass layer on a wafer according to claim 1, characterized in that: The lifting slide plate (15) and the extrusion plate (16) are both slidably connected to the lifting groove (13) in an up-and-down manner; the lower end of the extrusion plate (16) is arranged in a sloped surface; and the cross section of the lifting groove (13) is convex.

3. A laser marking device for generating a glass layer on a wafer according to claim 1, characterized in that: The lower end of the wafer placement seat (4) is symmetrically provided with docking grooves (42), and the outer side surface of the conveyor belt (21) is equidistantly fixedly connected with a plurality of groups of docking blocks (22), each group of docking blocks (22) having two blocks, and the docking blocks (22) are plugged into the docking grooves (42).

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