A polymer composite material surface grinding device and method

Abstract

The invention discloses a surface grinding device and method for polymer composite materials, and relates to the technical field of grinding devices. During surface grinding, friction generates a large amount of heat, which may cause local melting of the ground debris. This melting phenomenon may cause the grinding surface to be uneven, or even burn, deform or damage. The invention removes the debris generated during the grinding process through a chip removal component to avoid interference with subsequent grinding, thereby ensuring the consistency and high quality of the grinding effect. The temperature of the grinding film is controlled through a cooling component to avoid local melting of the material caused by the heat generated by friction. The circulation of liquid inside the liquid bin realizes the control and stabilization of the temperature of the grinding column, thereby ensuring that overheating does not occur during the grinding process and ensuring the smoothness and consistency of the grinding surface.

Description

Technical Field

[0001] The invention relates to the technical field of grinding devices, in particular to a polymer composite material surface grinding device and method. Background Art

[0002] Polymer composites are a new type of material composed of two or more materials. This material usually combines the advantages of different materials and has excellent properties, such as high strength, light weight, corrosion resistance, etc. Polymer composites are usually composed of polymer matrix and reinforcing materials, and are prepared by composite processing technology.

[0003] In this regard, the patent document with publication number CN106826434A discloses a columnar material surface grinding system, including a grinding part and a rotating part, the rotating part is used to clamp and position the ceramic roller and drive it to rotate around the axis, and the grinding part is used to grind the surface of the ceramic roller as a whole while the ceramic roller rotates. This invention has the advantages of uniform integrated grinding and high grinding efficiency.

[0004] In this regard, the patent document with publication number CN108857627A discloses a device for cutting into and grinding the outer ring of a bearing to eliminate an ellipse. The device for cutting into and grinding the outer ring of a bearing to eliminate an ellipse has a structure comprising a first motor, a first motor transmission box, a connecting bracket, a bottom support plate, a chip guide support plate, a grinding roller, and a grinding cooling box. The first motor is nested and connected to the upper end surface of the first motor transmission box, the first motor transmission box is arranged at one end of the grinding cooling box and is nested and connected to one end of the grinding roller, the grinding roller is movably connected to the inner surface of the upper end of the grinding cooling box, the front end surface of the grinding cooling box is welded with a chip guide support plate, the lower end surface of the grinding cooling box is welded to the connecting bracket, and the four corners of the lower end surface of the connecting bracket are welded with the bottom support plate. The invention realizes that the equipment can help the grinding roller to quickly dissipate heat through the dual heat dissipation methods of air cooling and water cooling when in use, effectively improving the service life and processing accuracy of the grinding roller of the equipment, and has strong practicality.

[0005] Nowadays, in the processing of polymer materials, their surfaces are ground to meet the standards for subsequent use. When grinding the surface, friction will generate a lot of heat, which may cause partial melting of the ground debris. This melting phenomenon may cause the grinding surface to be uneven, or even burn, deform or damage.

[0006] In view of the above problems, a polymer composite surface grinding device and method are proposed. Summary of the invention

[0007] The purpose of the present invention is to provide a polymer composite surface grinding device and method, which solves the problem of local melting of grinding debris in the background technology.

[0008] To achieve the above object, the present invention provides the following technical solution: a polymer composite surface grinding device, comprising an operating table, a blower is installed on the operating table through a bracket, a driving motor is also connected to the operating table, a mounting seat is connected to the output end of the driving motor, and a grinding motor is connected to the bottom end of the mounting seat;

[0009] The output end of the grinding motor is connected with a chip removal assembly, and the chip removal assembly includes a motor spindle, the bottom end of the motor spindle is connected with a connection sleeve, the bottom end of the connection sleeve is connected with an upper plate, the edge of the upper plate is provided with a wrapping ring around it, the upper surface of the upper plate is connected with a guide plate, and the upper plate is provided with a chip outlet, and the chip outlet is provided on the inner side of the guide plate;

[0010] The bottom end of the upper plate is connected to a cooling assembly, the cooling assembly includes a grinding film, the upper surface of the grinding film is connected to a mounting assembly, the mounting assembly includes a limit bar, the upper surface of the grinding film is connected to the limit bar, a limit groove is provided on the upper plate, the limit bar is embedded in the limit groove, the upper surface of the grinding film is also connected to a bolt, the bolt passes through the interior of the upper plate and extends therefrom, a fixing nut is sleeved on the portion of the bolt extending from the interior of the upper plate, the grinding film is provided with a chip groove, and the chip groove corresponds to the chip outlet;

[0011] The upper surface of the polishing film is also connected to a cooling chamber, the top of which is embedded in the through groove, one side of the cooling chamber is connected to a guide port, the other side of the cooling chamber is connected to an inlet, the guide port is embedded with a guide pipe, the inlet is embedded with an inlet pipe, and the inlet and the guide pipe are respectively connected to a group of conveying pipes;

[0012] A heat transfer component is embedded in the bottom end of the cooling bin, and the heat transfer component includes a polishing column, the polishing column and the cooling bin are movably connected, the top of the polishing column is connected to a heat-conducting column, a liquid bin is provided inside the cooling bin, the heat-conducting column is embedded in the liquid bin, and one-way valves are installed inside the outlet and the inlet.

[0013] Preferably, the chip groove is connected to the chip outlet, and the chip groove is obliquely opened inside the grinding film. When the grinding film rotates, the ground chips are transported to the inside of the chip outlet through the chip groove until they are discharged.

[0014] Preferably, an opening is provided at the junction of the guide plate and the wrapping ring, and the inner width of the guide plate is larger near the opening of the wrapping ring and smaller away from the opening.

[0015] Preferably, the upper plate and the polishing film are connected by bolts and fixing nuts, and three groups of limit bars are arranged on the polishing film, and the three groups of limit bars are respectively embedded in the interior of the limit grooves.

[0016] Preferably, there are three groups of cooling bins in total, and each group of cooling bins is provided with an outlet and an inlet on the left and right sides, the outlet pipe connects the three groups of outlets, and the inlet pipe connects the three groups of inlet.

[0017] Preferably, two delivery pipes are provided, one of which is connected to the outlet pipe, and the other is connected to the inlet pipe. The top of the delivery pipe is movably connected to a water tank, and the liquid circulates in the water tank, the delivery pipe, the outlet pipe, the cooling tank and the inlet pipe.

[0018] Preferably, the polishing column is embedded in the polishing film, and a spring sheet is provided at the connection between the polishing column and the cooling chamber, and the spring sheet applies a downward force to the polishing column.

[0019] Preferably, the heat-conducting column is a column structure made of copper, the upper half of the heat-conducting column is located inside the liquid bin, and the lower half of the heat-conducting column is embedded inside the polishing column.

[0020] Preferably, the liquid tank stores cooling liquid inside, the heat-conducting column is immersed in the cooling liquid, and the cooling liquid is introduced from the inside of the inlet and discharged from the inside of the outlet.

[0021] An application method of a polymer composite surface grinding device:

[0022] Grinding: Grinding is completed by the rotation of the grinding film and the contact of the polymer composite material, wherein the grinding film is used to grind the surface of the material, and the grinding column is also used to grind the surface of the material. The debris produced by grinding is transported to the inside of the chip outlet through the chip outlet groove. With the rotation of the grinding film and the upper plate, the centripetal force will sweep out the debris introduced into the guide plate;

[0023] Cooling. The temperature of the grinding film rises during grinding. In order to suppress the temperature rise of the grinding film, the grinding column can transfer the temperature of the material surface and the grinding film. The heat is transferred to the grinding column, and then transported to the heat-conducting column along with the grinding column. Finally, the cooling liquid inside the liquid tank takes away the heat from the heat-conducting column.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] The present invention provides a polymer composite surface grinding device and method, which removes debris generated during the grinding process through a chip removal component to prevent it from interfering with subsequent grinding, thereby ensuring the consistency and high quality of the grinding effect. The temperature of the grinding film is controlled by a cooling component to prevent the heat generated by friction from causing local melting of the material. The circulation of liquid inside the liquid bin realizes the control and stabilization of the temperature of the grinding column, ensuring that overheating does not occur during the grinding process and ensuring the smoothness and consistency of the polished surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention;

[0028] Figure 3 It is a structural schematic diagram of the mounting base and the grinding motor of the present invention;

[0029] Figure 4 It is a schematic diagram of the structure of the outlet tube and the inlet tube of the present invention;

[0030] Figure 5 It is a structural schematic diagram of the motor main shaft and the connecting sleeve of the present invention;

[0031] Figure 6 It is a schematic diagram of the structure of the upper plate and the polishing film of the present invention;

[0032] Figure 7 It is a schematic diagram of the structure of the polishing film and the polishing column of the present invention;

[0033] Figure 8 It is a schematic diagram of the explosion structure of the cooling bin of the present invention.

[0034] In the figure: 11. operating table; 12. blower; 13. drive motor; 14. mounting seat; 15. grinding motor; 2. chip removal assembly; 21. motor spindle; 22. connecting sleeve; 23. upper plate; 24. wrapping ring; 25. guide plate; 26. chip outlet; 27. chip outlet groove; 3. mounting assembly; 31. limit strip; 32. fixing nut; 33. limit groove; 34. through groove; 35. bolt; 4. cooling assembly; 41. outlet pipe; 42. inlet pipe; 43. conveying pipe; 44. cooling bin; 45. grinding film; 46. outlet; 47. inlet; 48. one-way valve; 5. heat transfer assembly; 51. grinding column; 52. heat transfer column; 53. liquid bin. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings.

[0037] Combination Figure 1-Figure 8 A polymer composite surface grinding device of the present invention includes an operating table 11, on which a blower 12 is installed through a bracket, and a driving motor 13 is also connected to the operating table 11, and a mounting seat 14 is connected to the output end of the driving motor 13, and a grinding motor 15 is connected to the bottom end of the mounting seat 14. In the processing of the polymer composite surface, the blower 12 can blow away the exported debris to ensure the cleanliness of the material surface. In addition, in order to be suitable for different working environments, the mounting seat 14 is deflected by the rotation of the driving motor 13. When the mounting seat 14 is deflected, the grinding motor 15 is driven to tilt, thereby processing materials with different degrees of inclination, thereby expanding the scope of application.

[0038] In the polishing of polymer composite materials, if the debris generated by the polishing is always present on the polishing film 45 and the material surface, the polishing effect will be affected by the debris. In order to avoid this problem, the debris generated by the polishing is processed to avoid interference with subsequent polishing. The specific operation is as follows:

[0039] The output end of the grinding motor 15 is connected to a chip removal assembly 2, which includes a motor spindle 21. The bottom end of the motor spindle 21 is connected to a connecting sleeve 22. The bottom end of the connecting sleeve 22 is connected to an upper plate 23. The edge of the upper plate 23 is provided with a wrapping ring 24 around it. The upper surface of the upper plate 23 is connected to a guide plate 25. An opening is provided at the connection between the guide plate 25 and the wrapping ring 24. The inner width of the guide plate 25 is larger near the opening of the wrapping ring 24 and smaller away from the opening. A chip discharge port 26 is provided on the upper plate 23. The chip discharge port 26 is provided on the inner side of the guide plate 25. When the grinding motor 15 starts working, the motor spindle 21 is driven When the motor spindle 21 rotates, the connecting sleeve 22 is driven to rotate. When the connecting sleeve 22 rotates, the upper plate 23 is driven to rotate. The grinding film 45 also moves with it. The debris produced by grinding is introduced into the inside of the chip groove 27 with the rotation. Since the chip groove 27 is tilted inside the grinding film 45, the debris is transferred to the inside of the chip outlet 26 under the push of the force. When the upper plate 23 rotates at a high speed, the debris between the guide plate 25 and the chip outlet 26 is splashed outward by the centripetal force, and the debris is discharged from the opening of the wrapping ring 24, thereby avoiding the interference of the debris on the grinding.

[0040] In order to increase the applicability, the upper plate 23 and the grinding film 45 can be disassembled. The upper plate 23 and the grinding film 45 are connected by a fixing nut 32. After the limiting strip 31 at the top of the grinding film 45 is inserted into the inside of the through groove 34, the fixing nut 32 is again sleeved on the bolt 35, thereby limiting the relative position between the upper plate 23 and the grinding film 45, and the installation is completed;

[0041] The bottom end of the upper plate 23 is connected to a cooling assembly 4, which includes a grinding film 45, a chip groove 27 and a chip outlet 26 are connected, and the chip groove 27 is obliquely opened inside the grinding film 45. The grinding film 45 rotates to transport the ground chips to the inside of the chip outlet 26 through the chip groove 27 until they are discharged. The upper surface of the grinding film 45 is connected to a mounting assembly 3, and the mounting assembly 3 includes a limit bar 31. The upper surface of the grinding film 45 is connected to the limit bar 31. The upper plate 23 and the grinding film 45 are connected by bolts 35 and a fixing The upper plate 23 is provided with a limit groove 33, and the limit groove 33 is provided on the upper plate 23. The limit groove 33 is embedded in the limit groove 33. The upper surface of the polishing film 45 is also connected with a bolt 35, and the bolt 35 extends from the upper plate 23. The portion of the bolt 35 extending from the upper plate 23 is sleeved with a fixing nut 32. The polishing film 45 is provided with a chip groove 27, and the chip groove 27 corresponds to the chip outlet 26.

[0042] During the grinding of polymer composite materials, friction will cause the temperature of the grinding film 45 to rise continuously. In order to avoid the large amount of heat generated by friction during the grinding process, which may cause the ground debris to partially melt, the grinding film 45 is cooled to suppress its temperature, thereby improving the smoothness of the grinding surface. The specific operation is as follows:

[0043] A cooling bin 44 is also connected to the upper surface of the grinding film 45. The top of the cooling bin 44 is embedded in the through groove 34. A guide port 46 is connected to one side of the cooling bin 44. An inlet port 47 is connected to the other side of the cooling bin 44. A guide pipe 41 is embedded in the guide port 46. A total of three groups of cooling bins 44 are provided. Guide ports 46 and inlet ports 47 are provided on the left and right sides of each group of cooling bins 44. The guide pipe 41 connects the three groups of guide ports 46. The inlet pipe 42 connects the three groups of inlet ports 47. An inlet pipe 42 is embedded in the inlet port 47. A group of delivery pipes 43 are respectively connected to the inlet pipe 42 and the guide pipe 41. Two delivery pipes 43 are provided, one of which is connected to the guide pipe 41, and the other is connected to the inlet pipe 42. The top of the delivery pipe 43 is movably connected to a water tank, and liquid circulates in the water tank, the delivery pipe 43, the guide pipe 41, the cooling bin 44 and the inlet pipe 42 A heat transfer component 5 is embedded in the bottom end of the cooling bin 44. The heat transfer component 5 includes a polishing column 51, which is embedded in the polishing film 45. A spring is provided at the connection between the polishing column 51 and the cooling bin 44. The spring applies a downward force to the polishing column 51. The polishing column 51 and the cooling bin 44 are movably connected. A heat-conducting column 52 is connected to the top of the polishing column 51. The heat-conducting column 52 is a column structure made of copper. The upper half of the heat-conducting column 52 is located in the liquid bin 53. The lower half of the heat-conducting column 52 is embedded in the polishing column 51. A liquid bin 53 is provided in the cooling bin 44. The heat-conducting column 52 is embedded in the liquid bin 53. A one-way valve 48 is installed in both the outlet 46 and the inlet 47. Liquid for cooling is stored in the liquid bin 53. The heat-conducting column 52 is immersed in the cooling liquid. The cooling liquid is introduced from the inlet 47 and discharged from the outlet 46.

[0044] When the grinding film 45 rotates, grinding is performed through the friction of the grinding film 45, and grinding can also be performed through the grinding column 51. The heat generated by grinding is transferred to the grinding column 51 through heat conduction. Since the grinding column 51 is affected by the spring sheet and exerts a downward force, the grinding column 51 is in better contact with the material surface during grinding, so that the friction force is greater, and the grinding effect brought by the greater friction force is better. In order to suppress the temperature of the grinding column 51, the heat is transferred through the heat-conducting column 52 inside the grinding column 51. The heat moves up to the heat-conducting column 52, and the heat on the heat-conducting column 52 is transferred to the liquid inside the liquid bin 53. During the grinding operation, as the grinding column 51 rises and falls, the grinding column 51 is driven to move in the cooling bin 4 4 moves up and down inside. When the polishing column 51 rises, the internal space of the liquid bin 53 is reduced. At this time, the internal liquid will be introduced from the outlet 46 into the inside of the outlet pipe 41, and then transported to the inside of the delivery pipe 43 through the outlet pipe 41. On the contrary, when the polishing column 51 descends, the internal space of the liquid bin 53 becomes larger. During the enlargement process, the liquid in the water bin is sucked into the inside of the introduction pipe 42 through the delivery pipe 43 until it is transported to the inside of the liquid bin 53. With the movement of the polishing column 51, the liquid inside the liquid bin 53 can be converted to realize the circulation of the liquid, which can also avoid overheating of the heat-conducting column 52. This can also ensure that the temperature of the polishing column 51 is limited to prevent melting during polishing, so that the polished surface is smoother.

[0045] An application method of a polymer composite surface grinding device:

[0046] Grinding: Grinding is accomplished by the rotation of the grinding film 45 and the contact between the polymer composite material, wherein the grinding film 45 is used to grind the surface of the material, and the grinding column 51 is also used to grind the surface of the material. The debris produced by grinding is transported to the inside of the chip outlet 26 through the chip outlet groove 27. As the grinding film 45 and the upper plate 23 rotate, the centripetal force acts to clean out the debris introduced into the guide plate 25;

[0047] Cooling. During grinding, the temperature of the grinding film 45 rises. In order to suppress the temperature rise of the grinding film 45, the grinding column 51 can transfer the temperature of the material surface and the grinding film 45. The heat is transferred to the grinding column 51, and then transported to the heat-conducting column 52 along with the grinding column 51. Finally, the cooling liquid inside the liquid tank 53 takes away the heat on the heat-conducting column 52.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A polymer composite surface grinding device, comprising an operating table (11), characterized in that: A blower (12) is mounted on the operating table (11) via a bracket, and a drive motor (13) is also connected to the operating table (11). The output end of the drive motor (13) is connected to a mounting seat (14), and the bottom end of the mounting seat (14) is connected to a grinding motor (15); The output end of the grinding motor (15) is connected to a chip removal assembly (2), the chip removal assembly (2) comprises a motor main shaft (21), the bottom end of the motor main shaft (21) is connected to a connection sleeve (22), the bottom end of the connection sleeve (22) is connected to an upper plate (23), a wrapping ring (24) is arranged around the edge of the upper plate (23), a guide plate (25) is connected to the upper surface of the upper plate (23), a chip discharge opening (26) is opened on the upper plate (23), and the chip discharge opening (26) is arranged on the inner side of the guide plate (25); The bottom end of the upper plate (23) is connected to a cooling assembly (4), the cooling assembly (4) comprises a grinding film (45), the upper surface of the grinding film (45) is connected to a mounting assembly (3), the mounting assembly (3) comprises a limit bar (31), the upper surface of the grinding film (45) is connected to the limit bar (31), a limit groove (33) is provided on the upper plate (23), the limit bar (31) is embedded in the limit groove (33), the upper surface of the grinding film (45) is also connected to a bolt (35), the bolt (35) passes through the interior of the upper plate (23) and extends therefrom, a fixing nut (32) is sleeved on the portion of the bolt (35) extending from the interior of the upper plate (23), and the grinding film (45) is provided with a chip groove (27), the chip groove (27) corresponds to the chip outlet (26); The upper surface of the polishing film (45) is also connected to a cooling chamber (44), the top end of the cooling chamber (44) is embedded in the interior of the through groove (34), one side surface of the cooling chamber (44) is connected to an outlet (46), the other side surface of the cooling chamber (44) is connected to an inlet (47), an outlet pipe (41) is embedded in the outlet (46), an inlet pipe (42) is embedded in the inlet (47), and a group of conveying pipes (43) are respectively connected to the inlet pipe (42) and the outlet pipe (41); A heat transfer component (5) is embedded in the bottom end of the cooling bin (44), and the heat transfer component (5) includes a polishing column (51). The polishing column (51) and the cooling bin (44) are movably connected, and the top end of the polishing column (51) is connected to a heat conducting column (52). A liquid bin (53) is provided inside the cooling bin (44), and the heat conducting column (52) is embedded in the liquid bin (53). Both the outlet (46) and the inlet (47) are provided with a one-way valve (48).

2. A polymer composite surface grinding device according to claim 1, characterized in that: The chip discharge groove (27) is connected to the chip discharge opening (26); the chip discharge groove (27) is obliquely opened inside the grinding film (45); the grinding film (45) rotates to transport the ground chips through the chip discharge groove (27) to the inside of the chip discharge opening (26) until they are discharged.

3. The polymer composite surface grinding device according to claim 1, characterized in that: An opening is provided at the junction of the guide plate (25) and the wrapping ring (24); the inner width of the guide plate (25) is larger near the opening of the wrapping ring (24) and smaller away from the opening.

4. The polymer composite surface grinding device according to claim 1, characterized in that: The upper plate (23) and the grinding plate (45) are connected via bolts (35) and fixing nuts (32). The grinding plate (45) is provided with three groups of limit strips (31), and the three groups of limit strips (31) are respectively embedded in the inside of the limit grooves (33).

5. The polymer composite surface grinding device according to claim 1, characterized in that: The cooling bins (44) are provided in three groups in total. The left and right sides of each group of cooling bins (44) are provided with an outlet (46) and an inlet (47). The outlet pipe (41) connects the three groups of outlets (46), and the inlet pipe (42) connects the three groups of inlet (47).

6. A polymer composite surface grinding device according to claim 5, characterized in that: Two delivery pipes (43) are provided, one of which is connected to the outlet pipe (41) and the other is connected to the inlet pipe (42). The top end of the delivery pipe (43) is movably connected to a water tank, and liquid circulates in the water tank, the delivery pipe (43), the outlet pipe (41), the cooling tank (44) and the inlet pipe (42).

7. The polymer composite surface grinding device according to claim 1, characterized in that: The polishing column (51) is embedded in the polishing bottom film (45), and a spring sheet is provided at the connection between the polishing column (51) and the cooling chamber (44), and the spring sheet applies a downward force to the polishing column (51).

8. The polymer composite surface grinding device according to claim 1, characterized in that: The heat-conducting column (52) is a column structure made of copper; the upper half of the heat-conducting column (52) is located inside the liquid bin (53), and the lower half of the heat-conducting column (52) is embedded inside the polishing column (51).

9. A polymer composite surface grinding device according to claim 8, characterized in that: The liquid tank (53) stores liquid for cooling inside, the heat-conducting column (52) is immersed in the cooling liquid, and the cooling liquid is introduced from the inside of the inlet (47) and discharged from the inside of the outlet (46).

10. The application method of the polymer composite surface grinding device according to any one of claims 1 to 9, characterized in that: Grinding, the grinding is performed by rotating the grinding film (45) and contacting the polymer composite material, wherein the grinding film (45) is used to grind the surface of the material, and the grinding column (51) is also used to grind the surface of the material. The debris produced by grinding is transported to the inside of the chip outlet (26) through the chip outlet groove (27). As the grinding film (45) and the upper plate (23) rotate, the centripetal force acts to sweep out the debris introduced into the guide plate (25); During the grinding process, the temperature of the grinding film (45) rises. In order to suppress the temperature rise of the grinding film (45), the grinding column (51) can transfer the temperature of the material surface and the grinding film (45). The heat is transferred to the grinding column (51) and then transported to the heat-conducting column (52) along the grinding column (51). Finally, the cooling liquid inside the liquid tank (53) takes away the heat on the heat-conducting column (52).

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