A semiconductor wafer single-chip cleaning robot taking automatic loosening mechanism

Abstract

The present invention discloses an automatic loosening mechanism for taking semiconductor wafer single-chip cleaning by a robot, and relates to the technical field of automatic loosening mechanism for taking semiconductor wafer single-chip cleaning. The present invention comprises a casing, a semi-arc box is fixed on the left side of the top surface of the casing, a hydraulic pump is fixedly installed on the bottom end of the interior of the casing, a hydraulic rod 1 is passed through the top end of the interior of the casing and is fixedly installed, the hydraulic rod 1 is located on the right side of the hydraulic pump, a hose of the hydraulic rod 1 is fixedly connected to the bottom right side of the hydraulic pump, a rotating module is fixed on the top surface of the telescopic end of the hydraulic rod 1, and a horizontal plate is fixed on the top surface of the rotating module. The present invention can telescope and clamp the semiconductor wafer single-chip for cleaning through the foam block, so that the equipment can continuously and automatically telescope and clamp the semiconductor wafer single-chip for cleaning, thereby avoiding the problem that the automatic loosening mechanism cannot continuously and automatically telescope and clamp the semiconductor wafer single-chip for cleaning, causing difficulty in cleaning the semiconductor wafer single-chip.

Description

Technical Field

[0001] The invention relates to the technical field of automatic loosening mechanisms for taking, and in particular to an automatic loosening mechanism for taking by a robot for cleaning a single semiconductor wafer. Background Art

[0002] Semiconductor wafer cleaning is a key step in manufacturing semiconductor wafers, which is directly related to the cleanliness and quality of the wafer, and thus affects the performance and reliability of the chip. In this process, the automatic loosening mechanism of the robot arm plays an important role. The automatic loosening mechanism of the robot arm can accurately grasp and place the wafer, greatly improving the efficiency of semiconductor wafer production. Through precise handling and placement, human errors are avoided and the risk of wafer damage is reduced.

[0003] The patent number CN221747189U discloses a photovoltaic chip rapid transplanter, which belongs to the field of photovoltaic chip processing technology. The photovoltaic chip rapid transplanter includes a first cover plate, a drive motor, the drive motor is fixedly connected to one side end of the first cover plate, and a transplanting assembly. The transplanting assembly includes a second cover plate, a third cover plate, a rotating rod, a movable slide, a movable rod, a rotating sleeve, a fixed plate, a limiting slide and a rotating groove. The second cover plate is fixedly connected to one side end of the first cover plate, and the third cover plate is fixedly connected to one side end of the second cover plate. Using a drive motor can realize X-axis and Z-axis synchronous rapid transplantation, which saves a motor and can complete the rapid transplantation of photovoltaic chips.

[0004] However, a photovoltaic chip rapid transplanting machine currently has the following problems: when the photovoltaic chip rapid transplanting machine is in use, since the equipment needs to continuously and uninterruptedly clean multiple semiconductor wafers in the process of picking up semiconductor wafers for cleaning, the multiple semiconductor wafers are located in different positions, which results in the automatic loosening mechanism being unable to continuously and automatically retract and clamp the semiconductor wafers for cleaning, causing difficulty in cleaning the semiconductor wafers. Therefore, we propose an automatic loosening mechanism for semiconductor wafer cleaning using a robot. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides an automatic loosening mechanism for taking a semiconductor wafer by a robot for cleaning a single wafer, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor wafer single-chip cleaning robot taking automatic loosening mechanism, including a casing, a semi-arc box is fixed on the left side of the top surface of the casing, a hydraulic pump is fixedly installed at the bottom end of the casing, a hydraulic rod 1 is passed through the top of the casing and fixedly installed, the hydraulic rod 1 is located on the right side of the hydraulic pump, the hose of the hydraulic rod 1 is fixedly connected to the bottom of the right side of the hydraulic pump, a rotating module is fixed on the top surface of the telescopic end of the hydraulic rod 1, and the rotating module includes a round shell, a servo motor 1 and a round cover, the round shell is fixed on the top surface of the hydraulic rod 1, the servo motor 1 is fixedly installed at the bottom end of the round shell, the round cover is fixed on the top surface of the rotating shaft of the servo motor 1, a horizontal plate is fixed on the top surface of the circular cover of the rotating module, and a telescopic component is arranged on the left side of the top surface of the horizontal plate;

[0007] The telescopic assembly includes a three-ring frame, the three-ring frame is fixed on the left side of the top surface of the horizontal plate, a screw is rotatably installed on the inner wall of the three-ring frame, a servo motor 2 is fixedly installed on the right side of the top surface of the horizontal plate, the left side of the rotating shaft of the servo motor 2 is fixedly connected to the right side of the screw, a transverse ring is rotatably installed on the outer wall of the screw, two guide rods are fixed on the left side of the transverse ring, the outer walls of the two guide rods are slidably connected with the inner wall of the three-ring frame, a long plate 1 is fixed on the left side of the two guide rods, two micro hydraulic rods 2 are penetrated and fixed on the left side of the long plate 1, the hoses at the right ends of the two micro hydraulic rods 2 are fixedly connected to the top of the right side of the hydraulic pump, the hoses of the two micro hydraulic rods 2 are penetrated and slidably installed on the top surface of the casing, and a long plate 2 is fixed on the left side of the telescopic end of the two micro hydraulic rods 2, two foam blocks can be telescopically clamped to hold a semiconductor wafer single chip for cleaning, so that the equipment can continuously and automatically telescopically clamp a semiconductor wafer single chip for cleaning, and an oil supply assembly is provided on the top surface of the transverse ring;

[0008] The oil supply assembly includes two vertical columns, the two vertical columns are fixed on the top surface of the horizontal ring, the top surfaces of the two vertical columns are fixed with square plates, the bottom surface of the square plate is fixed with two springs, the bottom surfaces of the two springs are fixed with sponge blocks, and when the sponge blocks move to the left, the sponge blocks evenly spread the lubricating oil in the spiral groove of the screw, so that the equipment moves to the left more smoothly;

[0009] A positioning device is arranged on the top surface of the square plate, and a scraper device is arranged on the top surface of the positioning device.

[0010] According to the above technical solution, a foam block is fixed in the middle of the side where the second long board and the first long board are close to each other. The foam block is located on the left side of the two vertical columns, and the screw is on the movement trajectory of the sponge block.

[0011] According to the above technical scheme, the positioning device includes two U-shaped frames, a laser sensor, a number of reflective blocks and two U-shaped sliders, the two U-shaped frames are fixed on the top surface of the square plate, the two U-shaped frames are respectively located on the front and back of the square plate, and the bottom surfaces of the two U-shaped frames are provided with slide grooves, the laser sensor is fixed at the bottom opposite the two U-shaped frames, a laser shooter is provided in the middle of the top surface of the laser sensor, a number of reflective blocks are fixed on the bottom surface of the cross plate, the two U-shaped sliders are fixed in the middle opposite the two U-shaped frames, the inner walls of the two U-shaped sliders are slidably connected with the front and back surfaces of the cross plate, the laser emitted by the laser sensor is reflected by the reflective block, and the laser sensor controls the servo motor 2 to stop rotating, so that the long plate 2 stops precisely above the semiconductor wafer single chip, and the long plate 2 drives the foam block to precisely clamp the semiconductor wafer single chip.

[0012] According to the above technical solution, the positioning device also includes two sliding rods, two springs and abutment plates. The two sliding rods are respectively slidably installed on the inner walls of the slide grooves of the two U-shaped frames, the two springs are fixed on the bottom surfaces of the two U-shaped frames, the two springs are sleeved on the outer walls of the two sliding rods, the abutment plates are fixed on the bottom surfaces of the two sliding rods, and the top surface of the abutment plates is fixedly connected to one end of the two springs away from the two U-shaped frames. Under the elastic force of the springs, the long plate one slowly moves downward, and the long plate one drives the foam block to slowly clamp the semiconductor wafer single chip downward.

[0013] According to the above technical solution, the bottom surfaces of the plurality of reflective blocks are all located on the movement trajectory of the laser head of the laser sensor, and the top surface of the housing is located on the movement trajectory of the abutment plate.

[0014] According to the above technical solution, the scraper device includes two short columns, two L-shaped blocks, arc-shaped elastic strips and chamfered rods. The two short columns are respectively fixed in the middle of the top surfaces of the two U-shaped sliders, the two L-shaped blocks are respectively fixed on the top surfaces of the two short columns, the arc-shaped elastic strip is embedded in the bottom surfaces of the two L-shaped blocks, and the chamfered rod is fixed on the side of the arc-shaped elastic strip away from the two L-shaped blocks. When the chamfered rod moves to the left, the chamfer of the chamfered rod scrapes away foreign matter on the horizontal plate, so that there will be no foreign matter blocking the horizontal plate.

[0015] According to the above technical solution, the scraper device also includes two inclined blocks, two arc plates and two concave spring plates. The two inclined blocks are respectively fixed on the top surfaces of the two L-shaped blocks, and the two inclined blocks are respectively located on the side where the two short columns are close to each other. The two arc plates are respectively fixed on the top surfaces of the two inclined blocks, and the two concave spring plates are respectively fixed on the inner bottom ends of the two arc plates. Under the action of the elastic force of the concave spring plates, the jitter of the guide rod when it moves to the left is reduced, so that the semiconductor wafer single chip clamped by the long plate one and the long plate two can reduce the jitter.

[0016] According to the above technical solution, the chamfered rod is located on the left side of the two U-shaped sliders, the chamfered rod is arranged on the top surface of the cross plate, and the two concave spring plates are located below the two guide rods.

[0017] The present invention provides a semiconductor wafer single-chip cleaning robot taking automatic loosening mechanism. It has the following beneficial effects:

[0018] (1) The present invention uses a horizontal plate, a three-ring frame, a screw, a second servo motor, a horizontal ring, a guide rod, a first long plate, a second micro hydraulic rod, a second long plate, a foam block, a vertical column and a square plate in combination with a spring sheet and a sponge block. The two foam blocks can be retracted to clamp a semiconductor wafer for cleaning, so that the device can continuously and automatically retract to clamp a semiconductor wafer for cleaning, thereby preventing the automatic loosening mechanism from being unable to continuously and automatically retract to clamp a semiconductor wafer for cleaning, thereby causing difficulty in cleaning the semiconductor wafer. In addition, during the process of the sponge block moving to the left, the sponge block evenly applies lubricating oil to the spiral groove of the screw, thereby allowing the device to move to the left more smoothly, thereby preventing the screw of the automatic loosening mechanism from rusting and causing the device to run unsmoothly. (2) The present invention arranges a positioning device so that the U-shaped frame, the laser sensor, the reflective block, the U-shaped slider, the slide bar and the spring cooperate with the abutment plate. The laser emitted by the laser sensor is reflected by the reflective block. The laser sensor controls the servo motor 2 to stop rotating, so that the long plate 2 stops precisely above the semiconductor wafer single chip, and the long plate 2 drives the foam block to precisely clamp the semiconductor wafer single chip, thereby preventing the automatic loosening mechanism from clamping the semiconductor wafer single chip of the semi-arc box inaccurately, resulting in a poor clamping effect. Moreover, under the elastic force of the spring, the long plate 1 moves downward slowly, and the long plate 1 drives the foam block to slowly clamp the semiconductor wafer single chip downward, thereby preventing the automatic loosening mechanism from clamping downward too quickly, thereby causing damage to the surface of the semiconductor wafer single chip. (3) The present invention arranges a scraper device so that the short column, L-shaped block, arc spring bar, chamfered rod, inclined block and arc plate cooperate with the concave spring plate. When the chamfered rod moves to the left, the chamfer of the chamfered rod scrapes away foreign matter on the horizontal plate, so that there will be no foreign matter blocking the horizontal plate, preventing the automatic loosening mechanism from being blocked by foreign matter on the horizontal plate and causing the equipment to be stuck. In addition, under the action of the elastic force of the concave spring plate, the shaking of the guide rod when it moves to the left is reduced, so that the semiconductor wafer single chip clamped by the long plates one and two can be reduced. This prevents the automatic loosening mechanism from generating severe shaking when clamping the semiconductor wafer single chip, causing poor clamping effect of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the present invention as a whole;

[0020] Figure 2 It is a cross-sectional schematic diagram of the present invention as a whole;

[0021] Figure 3 It is a cross-sectional schematic diagram of the horizontal plate of the present invention;

[0022] Figure 4 For the present invention Figure 3 A local enlarged schematic diagram of the middle A;

[0023] Figure 5 is a schematic diagram of a positioning device of the present invention;

[0024] Figure 6 For the present invention Figure 5 A partial enlarged schematic diagram of point B in the middle;

[0025] Figure 7 is a schematic diagram of a scraper device of the present invention;

[0026] Figure 8 For the present invention Figure 7 A partial enlarged schematic diagram of point C in the middle.

[0027] In the figure: 1, housing; 2, half arc box; 3, hydraulic pump; 4, hydraulic rod 1; 5, rotating module; 6, horizontal plate; 61, telescopic component; 611, three-ring frame; 612, screw; 613, servo motor 2; 614, horizontal ring; 615, guide rod; 616, long board 1; 617, micro hydraulic rod 2; 618, long board 2; 619, foam block; 62, oil supply component; 621, vertical Column; 622, square plate; 623, spring piece; 624, sponge block; 7, positioning device; 71, U-shaped frame; 72, laser sensor; 73, reflective block; 74, U-shaped slider; 75, slide bar; 76, spring; 77, abutment plate; 8, scraper device; 81, short column; 82, L-shaped block; 83, arc spring strip; 84, chamfered rod; 85, oblique block; 86, arc plate; 87, concave spring plate. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] See also Figure 1-Figure 8 , one embodiment of the present invention is: a semiconductor wafer single-wafer cleaning robot taking automatic loosening mechanism, including a housing 1, a semi-arc box 2 is fixed on the left side of the top surface of the housing 1, a hydraulic pump 3 is fixedly installed at the bottom end of the housing 1, a hydraulic rod 1 4 is passed through and fixedly installed at the top end of the housing 1, the hydraulic rod 1 4 is located on the right side of the hydraulic pump 3, the hose of the hydraulic rod 1 4 is fixedly connected to the bottom of the right side of the hydraulic pump 3, a rotating module 5 is fixed on the top surface of the telescopic end of the hydraulic rod 1 4, and the rotating module 5 includes a round shell, a servo motor 1 and a round cover, the round shell is fixed on the top surface of the hydraulic rod 1 4, the servo motor 1 is fixedly installed at the bottom end of the round shell, the round cover is fixed on the top surface of the rotating shaft of the servo motor 1, and a horizontal plate 6 is fixed on the top surface of the round cover of the rotating module 5;

[0030] A telescopic assembly 61 is arranged on the left side of the top surface of the horizontal plate 6. The telescopic assembly 61 includes a three-ring frame 611, which is fixed on the left side of the top surface of the horizontal plate 6. A screw 612 is rotatably installed on the inner wall of the three-ring frame 611. A servo motor 613 is fixedly installed on the right side of the top surface of the horizontal plate 6. The left side of the rotating shaft of the servo motor 613 is fixedly connected to the right side of the screw 612. A transverse ring 614 is rotatably installed on the outer wall of the screw 612. The inner wall of the transverse ring 614 and the spiral groove of the screw 612 are meshed with each other. Two guide rods 615 are fixed on the left side of the transverse ring 614. The outer walls of the two guide rods 615 are slidably connected with the inner wall of the three-ring frame 611. A long plate 616 is fixed on the left side of the two guide rods 615. Two micro hydraulic rods 617 are penetrated and fixed on the left side of the long plate 616. The hoses at the right ends of the two micro hydraulic rods 617 are fixedly connected to the top of the right side of the hydraulic pump 3. The hoses of the two micro hydraulic rods 617 are penetrated and slidably installed on the top surface of the casing 1. A long plate 2 618 is fixed to the left side of the telescopic end of the two micro hydraulic rods 2 617, and a foam block 619 is fixed in the middle of the side where the long plate 2 618 and the long plate 1 616 are close to each other. The sponge block 624 is located on the left side of the two vertical columns 621, and the transverse ring 614 moves to the left in the spiral groove of the screw 612, and the transverse ring 614 drives the guide rod 615 to move to the left, and the guide rod 615 drives the long plate 1 616 to move to the left, and the long plate 1 616 drives the micro hydraulic rod 2 617 to move to the left, and the telescopic end of the micro hydraulic rod 2 617 drives the long plate 2 618 to move to the left, and the long plate 2 618 drives the foam block 619 to move to the right, so that the two foam blocks 619 can telescope to clamp the semiconductor wafer single chip for cleaning, so that the equipment can continuously and automatically telescope to clamp the semiconductor wafer single chip for cleaning, and avoid the automatic loosening mechanism cannot continuously and automatically telescope to clamp the semiconductor wafer single chip for cleaning, which causes the difficulty of cleaning the semiconductor wafer single chip;

[0031] An oil supply assembly 62 is provided on the top surface of the transverse ring 614, and the oil supply assembly 62 includes two vertical columns 621, and the two vertical columns 621 are fixed on the top surface of the transverse ring 614. A square plate 622 is fixed on the top surface of the two vertical columns 621, and two spring plates 623 are fixed on the bottom surface of the square plate 622, and a sponge block 624 is fixed on the bottom surface of the two spring plates 623. The screw 612 is on the movement trajectory of the sponge block 624. When the sponge block 624 moves to the left, the sponge block 624 evenly spreads the lubricating oil in the spiral groove of the screw 612, so that the equipment can move to the left more smoothly, and avoid the rust of the screw 612 of the automatic loosening mechanism causing the equipment to run unsmoothly.

[0032] When in use, the staff places the semiconductor wafer single chip into the semi-arc box 2, puts the cleaning device on the right side of the casing 1, starts the hydraulic pump 3 in the casing 1, and the hydraulic pump 3 uses a hose to extract the hydraulic oil in the hydraulic rod 1 4. The telescopic end of the hydraulic rod 1 4 starts to move downward, and the telescopic end of the hydraulic rod 1 4 drives the rotating module 5 to move downward. Since the equipment needs to continuously and uninterruptedly clean multiple semiconductor wafer single chips during the process of taking out the semiconductor wafer single chip for cleaning, the positions of the multiple semiconductor wafer single chips are different, and the servo motor 2 613 on the horizontal plate 6 is started, and the shaft of the servo motor 2 613 starts to rotate forward, and the shaft of the servo motor 2 613 drives the screw 612 to rotate forward, and the screw 612 rotates forward in the three-ring frame 611, and the screw 612 drives the horizontal ring 61 4 rotates forward, the transverse ring 614 drives the guide rod 615 to rotate forward, and the guide rod 615 is restricted by the three-ring frame 611, so that the transverse ring 614 moves leftward in the spiral groove of the screw rod 612, and the transverse ring 614 drives the guide rod 615 to move leftward, and the guide rod 615 drives the long plate 1 616 to move leftward, and the long plate 1 616 drives the micro hydraulic rod 2 617 to move leftward, and the telescopic end of the micro hydraulic rod 2 617 drives the long plate 2 618 to move leftward. At the same time, the round shell of the rotating module 5 drives the transverse plate 6 to move downward, and the transverse plate 6 drives the three-ring frame 611 to move downward, and the three-ring frame 611 drives the screw rod 612 to move downward, and the screw rod 612 drives the transverse ring 614 to move downward, and the transverse ring 614 drives the long plate 1 616 to move downward, and the long plate 1 616 drives the foam block 619 to move downward. The long plate 1 616 drives the micro hydraulic rod 2 617 to move downward, the telescopic end of the micro hydraulic rod 2 617 drives the long plate 2 618 to move downward, the long plate 2 618 drives the foam block 619 to move downward, the hydraulic pump 3 in the housing 1 is started, the hydraulic pump 3 uses a hose to extract the hydraulic oil in the micro hydraulic rod 2 617, the telescopic end of the micro hydraulic rod 2 617 drives the long plate 2 618 to move to the right, the long plate 2 618 drives the foam block 619 to move right, the two foam blocks 619 clamp the semiconductor wafer single chip, the telescopic end of the hydraulic rod 1 4 begins to reset, the two foam blocks 619 clamp the semiconductor wafer single chip and move upward, the servo motor 1 of the rotating module 5 is started, the shaft of the servo motor 1 begins to reverse half a circle, and the shaft of the servo motor 1 drives the circular The cover is reversed, and the round cover drives the horizontal plate 6 to reverse. The two foam blocks 619 holding the semiconductor wafer are reversed half a circle, and the semiconductor wafer is moved to the right side of the casing 1. The telescopic end of the hydraulic rod 4 begins to move downward, and the two foam blocks 619 hold the semiconductor wafer and move it to the cleaning device for cleaning. When the cleaning is completed, the telescopic end of the hydraulic rod 4 is reset again, and the staff takes out the semiconductor wafer from the foam block 619, and the servo motor of the rotating module 5 is reset to the next clamping, so that the two foam blocks 619 can be retracted to clamp the semiconductor wafer for cleaning, so that the equipment can automatically and continuously retract to clamp the semiconductor wafer for cleaning, to prevent the equipment from being unable to automatically and continuously clamp the semiconductor wafer for cleaning when it is in use.This avoids the problem that the automatic loosening mechanism cannot continuously and automatically extend and retract to clamp the semiconductor wafer single piece for cleaning, which makes it difficult to clean the semiconductor wafer single piece.

[0033] When the horizontal ring 614 moves to the left in the spiral groove of the screw 612, the horizontal ring 614 drives the vertical column 621 to move to the left, the vertical column 621 drives the square plate 622 to move to the left, the square plate 622 drives the spring piece 623 to move to the left, and the spring piece 623 drives the sponge block 624 to move to the left, so that in the process of the sponge block 624 moving to the left, the sponge block 624 evenly spreads the lubricating oil in the spiral groove of the screw 612, so that the equipment moves to the left more smoothly and prevents the spiral groove of the screw 612 from rusting when the equipment is in use, thereby avoiding the problem of the equipment running smoothly due to the rusting of the screw 612 of the automatic loosening mechanism.

[0034] See also Figure 1-Figure 8 On the basis of the above embodiment, in another embodiment of the present invention, a positioning device 7 is provided on the top surface of the square plate 622, and the positioning device 7 includes two U-shaped frames 71, a laser sensor 72, a plurality of reflective blocks 73 and two U-shaped sliders 74. The two U-shaped frames 71 are fixed on the top surface of the square plate 622, and the two U-shaped frames 71 are respectively located on the front and back of the square plate 622. The bottom surfaces of the two U-shaped frames 71 are provided with sliding grooves, the laser sensor 72 is fixed to the bottom opposite to the two U-shaped frames 71, and a laser head is provided in the middle of the top surface of the laser sensor 72. The plurality of reflective blocks 73 are fixed on the bottom surface of the horizontal plate 6, and the two U-shaped sliders 74 are fixed in the middle opposite to the two U-shaped frames 71. The inner walls of the two U-shaped sliders 74 are slidably connected to the front and back surfaces of the horizontal plate 6, and the bottom surfaces of the reflective blocks 73 are all on the movement trajectory of the laser head of the laser sensor 72. When the laser sensor 72 moves to the left, the laser sensor 72 moves below the reflective block 73. The laser emitted by the laser sensor 72 is reflected by the reflective block 73. The laser sensor 72 controls the servo motor 2 613 to stop rotating, so that the long plate 2 618 stops accurately above the semiconductor wafer single chip, and the long plate 2 618 drives the foam block 619 to accurately clamp the semiconductor wafer single chip, so as to avoid the automatic loosening mechanism clamping the semiconductor wafer single chip of the semi-arc box 2 inaccurately, resulting in poor clamping effect.

[0035] The positioning device 7 also includes two slide bars 75, two springs 76 and abutment plates 77. The two slide bars 75 are respectively slidably mounted on the inner walls of the slide grooves of the two U-shaped frames 71. The two springs 76 are fixed to the bottom surfaces of the two U-shaped frames 71. The two springs 76 are sleeved on the outer walls of the two slide bars 75. The abutment plates 77 are fixed to the bottom surfaces of the two slide bars 75. The top surface of the abutment plates 77 is fixedly connected to one end of the two springs 76 away from the two U-shaped frames 71. The top surface of the casing 1 is on the movement trajectory of the abutment plates 77. Under the elastic force of the springs 76, the long plate 616 slowly moves downward, allowing the long plate 616 to drive the foam block 619 to slowly clamp the semiconductor wafer single chip downward, so as to avoid the automatic loosening mechanism from clamping downward too quickly to cause damage to the surface of the semiconductor wafer single chip.

[0036] A scraper device 8 is provided on the top surface of the positioning device 7, and the scraper device 8 includes two short columns 81, two L-shaped blocks 82, an arc-shaped elastic strip 83 and a chamfered rod 84. The two short columns 81 are respectively fixed in the middle of the top surfaces of the two U-shaped sliders 74, and the two L-shaped blocks 82 are respectively fixed on the top surfaces of the two short columns 81. The arc-shaped elastic strip 83 is embedded in the bottom surfaces of the two L-shaped blocks 82. The chamfered rod 84 is fixed on the side of the arc-shaped elastic strip 83 away from the two L-shaped blocks 82. The chamfered rod 84 is located on the left side of the two U-shaped sliders 74. The chamfered rod 84 is set on the top surface of the cross plate 6. When the chamfered rod 84 moves to the left, the chamfer of the chamfered rod 84 scrapes away foreign matter on the cross plate 6, so that there will be no foreign matter blocking the cross plate 6, thereby avoiding foreign matter blocking the cross plate 6 of the automatic loosening mechanism and causing the equipment to be stuck.

[0037] The scraper device 8 also includes two inclined blocks 85, two arc plates 86 and two concave spring plates 87. The two inclined blocks 85 are respectively fixed on the top surfaces of the two L-shaped blocks 82, and the two inclined blocks 85 are respectively located on the side where the two short columns 81 are close to each other. The two arc plates 86 are respectively fixed on the top surfaces of the two inclined blocks 85, and the two concave spring plates 87 are respectively fixed on the inner bottom ends of the two arc plates 86. The two concave spring plates 87 are located below the two guide rods 615. The concave spring plates 87 are pressed against the bottom of the guide rods 615 to move to the left. Under the elastic force of the concave spring plates 87, the jitter of the guide rods 615 when moving to the left is reduced, so that the semiconductor wafer single chip clamped by the long plate 1 616 and the long plate 2 618 can reduce the jitter, and avoid the automatic loosening mechanism from generating violent jitter when clamping the semiconductor wafer single chip, resulting in poor clamping effect of the equipment.

[0038] While the vertical column 621 drives the square plate 622 to move to the left, the square plate 622 drives the U-shaped frame 71 to move to the left, and the U-shaped frame 71 drives the laser sensor 72 to move to the left. At the same time, the U-shaped frame 71 drives the U-shaped slider 74 to move to the left, and the U-shaped slider 74 slides to the left on the horizontal plate 6. In the process of the laser sensor 72 moving to the left, the laser sensor 72 moves below the reflective block 73, and the laser emitted by the laser sensor 72 is reflected by the reflective block 73. The laser sensor 72 controls the servo motor 2 613 to stop rotating, so that the long plate 2 618 stops accurately above the semiconductor wafer single chip, and the long plate 2 618 drives the foam block 619 to accurately clamp the semiconductor wafer single chip, thereby preventing the equipment from clamping the semiconductor wafer single chip inaccurately, thereby avoiding the problem of poor clamping effect caused by the automatic loosening mechanism clamping the semiconductor wafer single chip of the semi-arc box 2 inaccurately.

[0039] When the square plate 622 drives the U-shaped frame 71 to move to the left, the U-shaped frame 71 drives the sliding rod 75 to move downward, the sliding rod 75 drives the abutment plate 77 to move to the left, and the abutment plate 77 drives the spring 76 to move to the left. When the hydraulic rod 4 moves downward, the abutment plate 77 contacts the casing 1. Under the action of the extrusion force, the abutment plate 77 drives the sliding rod 75 to move upward. The sliding rod 75 moves upward in the slide groove of the U-shaped frame 71, and the spring 76 on the abutment plate 77 begins to shrink. Under the elastic force of the spring 76, the long plate 1 616 moves slowly downward, allowing the long plate 1 616 to drive the foam block 619 to slowly clamp the semiconductor wafer single chip downward, preventing the long plate 1 616 and the long plate 2 618 on the equipment from clamping downward too quickly, thereby avoiding the problem of the automatic loosening mechanism clamping downward too quickly and causing damage to the surface of the semiconductor wafer single chip.

[0040] When the U-shaped frame 71 drives the U-shaped slider 74 to move to the left, the U-shaped slider 74 drives the short column 81 to move to the left, the short column 81 drives the L-shaped block 82 to move to the left, the L-shaped block 82 drives the arc spring bar 83 to move to the left, and the arc spring bar 83 drives the chamfered rod 84 to move to the left, so that when the chamfered rod 84 moves to the left, the chamfer of the chamfered rod 84 scrapes off the foreign matter on the horizontal plate 6, so that there will be no foreign matter blocking the horizontal plate 6, preventing foreign matter from blocking the equipment, thereby avoiding the problem of foreign matter blocking the horizontal plate 6 of the automatic loosening mechanism and causing the equipment to get stuck.

[0041] While the short column 81 drives the L-shaped block 82 to move to the left, the L-shaped block 82 drives the inclined block 85 to move to the left, the inclined block 85 drives the arc plate 86 to move to the left, and the arc plate 86 drives the concave spring plate 87 to move to the left, so that the concave spring plate 87 is pressed against the bottom of the guide rod 615 and moves to the left. Under the elastic force of the concave spring plate 87, the shaking of the guide rod 615 when moving to the left is reduced, and the shaking of the semiconductor wafer single chip clamped by the long plate 1 616 and the long plate 2 618 is reduced, preventing the equipment from shaking violently when clamping the semiconductor wafer single chip, thereby avoiding the problem of poor clamping effect of the equipment caused by the violent shaking when the automatic loosening mechanism clamps the semiconductor wafer single chip.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A robotic arm automatic loosening mechanism for cleaning semiconductor wafers, comprising a housing (1), a semi-arc box (2) being fixed on the left side of the top surface of the housing (1), characterized in that: A hydraulic pump (3) is fixedly mounted at the bottom end of the casing (1), a hydraulic rod (4) is passed through and fixedly mounted at the top end of the casing (1), the hydraulic rod (4) is located on the right side of the hydraulic pump (3), a hose of the hydraulic rod (4) is fixedly connected to the bottom of the right side of the hydraulic pump (3), a rotating module (5) is fixed on the top surface of the telescopic end of the hydraulic rod (4), a horizontal plate (6) is fixed on the top surface of the rotating module (5), and a telescopic component (61) is arranged on the left side of the top surface of the horizontal plate (6); The telescopic assembly (61) comprises a three-ring frame (611), the three-ring frame (611) is fixed on the left side of the top surface of the horizontal plate (6), a screw rod (612) is rotatably mounted on the inner wall of the three-ring frame (611), a servo motor 2 (613) is fixedly mounted on the right side of the top surface of the horizontal plate (6), the left side of the rotating shaft of the servo motor 2 (613) is fixedly connected to the right side of the screw rod (612), a transverse ring (614) is rotatably mounted on the outer wall of the screw rod (612), the inner wall of the transverse ring (614) is meshed with the spiral groove of the screw rod (612), two guide rods (615) are fixedly mounted on the left side of the transverse ring (614), and the two guide rods (615) are fixedly mounted on the left side of the transverse ring (614). The outer wall of the guide rod (615) is slidably connected to the inner wall of the three-ring frame (611); a long plate 1 (616) is fixed on the left side of the two guide rods (615); two micro hydraulic rods 2 (617) are passed through and fixed on the left side of the long plate 1 (616); the hoses at the right ends of the two micro hydraulic rods 2 (617) are fixedly connected to the top of the right side of the hydraulic pump (3); the hoses of the two micro hydraulic rods 2 (617) pass through and are slidably installed on the top surface of the casing (1); a long plate 2 (618) is fixed on the left side of the telescopic end of the two micro hydraulic rods 2 (617); and an oil supply assembly (62) is arranged on the top surface of the transverse ring (614); The oil supply assembly (62) comprises two vertical columns (621), the two vertical columns (621) are fixed on the top surface of the transverse ring (614), a square plate (622) is fixed on the top surface of the two vertical columns (621), two spring plates (623) are fixed on the bottom surface of the square plate (622), and a sponge block (624) is fixed on the bottom surface of the two spring plates (623); A positioning device (7) is provided on the top surface of the square plate (622), and a scraper device (8) is provided on the top surface of the positioning device (7); The positioning device (7) comprises two U-shaped frames (71), a laser sensor (72), a plurality of reflective blocks (73) and two U-shaped sliders (74). The two U-shaped frames (71) are fixed on the top surface of the square plate (622). The two U-shaped frames (71) are respectively located on the front and back sides of the square plate (622). The bottom surfaces of the two U-shaped frames (71) are provided with a slide groove. The laser sensor (72) is fixed on the bottom of the opposite side of the two U-shaped frames (71). A laser head is provided in the middle of the top surface of the laser sensor (72). The plurality of reflective blocks (73) are fixed on the bottom surface of the horizontal plate (6). The two U-shaped sliders (74) are fixed in the middle of the opposite side of the two U-shaped frames (71). The inner walls of the two U-shaped sliders (74) are slidably connected to the front and back sides of the horizontal plate (6).

2. The automatic loosening mechanism for taking out a semiconductor wafer by a robot for cleaning a single wafer according to claim 1, characterized in that: A foam block (619) is fixed in the middle of the side where the second long board (618) and the first long board (616) are close to each other. The sponge block (624) is located on the left side of the two vertical columns (621), and the screw rod (612) is on the movement track of the sponge block (624).

3. The automatic loosening mechanism for taking out a semiconductor wafer by a robot for cleaning a single wafer according to claim 2, characterized in that: The positioning device (7) further comprises two slide bars (75), two springs (76) and a stop plate (77), wherein the two slide bars (75) are respectively slidably mounted on the inner walls of the slide grooves of the two U-shaped frames (71), the two springs (76) are fixed on the bottom surfaces of the two U-shaped frames (71), the two springs (76) are sleeved on the outer walls of the two slide bars (75), the stop plate (77) is fixed on the bottom surfaces of the two slide bars (75), and the top surface of the stop plate (77) is fixedly connected to one end of the two springs (76) away from the two U-shaped frames (71).

4. The automatic loosening mechanism for taking out a semiconductor wafer by a robot for cleaning a single wafer according to claim 3, characterized in that: The bottom surfaces of the plurality of reflective blocks (73) are all located on the movement trajectory of the laser head of the laser sensor (72), and the top surface of the housing (1) is located on the movement trajectory of the abutment plate (77).

5. The automatic loosening mechanism for taking out a semiconductor wafer by a robot for cleaning a single wafer according to claim 4, characterized in that: The scraper device (8) comprises two short columns (81), two L-shaped blocks (82), an arc-shaped elastic strip (83) and a chamfered rod (84); the two short columns (81) are respectively fixed in the middle of the top surfaces of the two U-shaped sliders (74); the two L-shaped blocks (82) are respectively fixed on the top surfaces of the two short columns (81); the arc-shaped elastic strip (83) is embedded in the bottom surfaces of the two L-shaped blocks (82); and the chamfered rod (84) is fixed on a side of the arc-shaped elastic strip (83) away from the two L-shaped blocks (82).

6. The automatic loosening mechanism for taking out a semiconductor wafer by a robot for cleaning a single wafer according to claim 5, characterized in that: The scraper device (8) further comprises two inclined blocks (85), two arc plates (86) and two concave spring plates (87), the two inclined blocks (85) being respectively fixed on the top surfaces of the two L-shaped blocks (82), the two inclined blocks (85) being respectively located on the sides of the two short columns (81) close to each other, the two arc plates (86) being respectively fixed on the top surfaces of the two inclined blocks (85), and the two concave spring plates (87) being respectively fixed on the inner bottom ends of the two arc plates (86).

7. The automatic loosening mechanism for taking out a semiconductor wafer by a robot for cleaning a single wafer according to claim 6, characterized in that: The chamfered rod (84) is located on the left side of the two U-shaped slide blocks (74), the chamfered rod (84) is arranged on the top surface of the transverse plate (6), and the two concave spring plates (87) are located below the two guide rods (615).

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