Protective coating and preparation method thereof, optical module assembly

Abstract

The present invention relates to the technical field of optical module component protection, and discloses a protective coating and a preparation method thereof, and an optical module component. The protective coating has a three-dimensional network structure, and the composition of the protective coating includes metal nitride and epoxy resin, wherein the metal nitride includes at least one of aluminum oxynitride and zinc oxynitride. The prepared protective coating has high compactness, good thermal conductivity and high corrosion resistance.

Description

Technical Field

[0001] The present invention relates to the technical field of optical module component protection, and in particular to a protective coating and a preparation method thereof, and an optical module component. Background Art

[0002] As a key component of the data center, optical module components include photoelectric conversion elements and circuits. In order to ensure the stable operation of optical module components, higher and higher requirements are placed on the packaging and protection performance of optical module components.

[0003] The density, thermal conductivity and corrosion resistance of the film layer in the existing protective coating are difficult to be improved at the same time, which limits the protective effect of the protective coating and makes the optical module components susceptible to corrosion and short circuit risks, thus affecting their performance and service life. Summary of the invention

[0004] The embodiment of the invention discloses a protective coating, which has high density, good thermal conductivity and high corrosion resistance.

[0005] In a first aspect, an embodiment of the present application discloses a protective coating for an optical module assembly, wherein the protective coating has a three-dimensional network structure and is composed of metal oxynitride and epoxy resin, wherein the metal oxynitride includes at least one of aluminum oxynitride and zinc oxynitride.

[0006] Furthermore, the three-dimensional network structure is formed by cross-linking part or all of the metal nitride and the epoxy resin.

[0007] Furthermore, part of the metal nitride and part of the epoxy resin are cross-linked to form the three-dimensional network structure.

[0008] The metal oxynitride has pores, and another portion of the epoxy resin fills the pores of the metal oxynitride.

[0009] Furthermore, in terms of mass fractions, the protective coating comprises a metal oxynitride composition and the epoxy resin, the metal oxynitride composition comprises the metal nitride oxide, and the protective coating comprises 70% to 95% of the metal oxynitride composition and 5% to 30% of the epoxy resin.

[0010] Furthermore, the elements in the metal oxynitride composition further include: at least one of B, Ti, Zr, and Si; and / or,

[0011] The metal oxynitride composition also includes at least one of aluminum nitride, zinc nitride and boron nitride.

[0012] Furthermore, the structural formula of the metal nitride oxide is MNHxOy, wherein 0<x≤0.5, 1.5≤y≤2.0, and M is a metal element.

[0013] Further, the thickness of the protective coating is 0.1 μm to 50 μm; and / or,

[0014] The thermal conductivity of the protective coating is 6 W / mK~9 W / mK.

[0015] In a second aspect, an embodiment of the present application discloses a method for preparing the protective coating according to the first aspect, the preparation method comprising the following steps:

[0016] The protective coating is prepared on the outer surface of the optical module component by using a chemical vapor deposition method.

[0017] Furthermore, the protective coating comprises a metal oxynitride composition and the epoxy resin, the metal oxynitride composition comprises the metal oxynitride, and the chemical vapor deposition method comprises the following steps:

[0018] Passing gas;

[0019] A precursor of the metal oxynitride composition and a precursor of the epoxy resin are introduced to deposit the protective coating on the optical module component.

[0020] Furthermore, the gas includes at least one of hydrogen, ethane, ethylene oxide, trimethylene oxide, and helium.

[0021] Furthermore, the gas is trimethylolpropane.

[0022] Further, the precursor of the metal nitride oxide composition includes a material source and a gas source, the material source includes at least one of methyl zinc, ethyl zinc, ethyl aluminum, zinc ethoxide, tetraethyl zirconate, aluminum isopropoxide, tetraethyl titanate, butyl boron, zirconium ethoxide, tantalum ethoxide, and triethoxyphosphorus; the gas source includes at least one of nitrogen and ammonia; and / or,

[0023] The precursor of the epoxy resin includes at least one of hexafluoropropylene oxide dimer, hexafluoropropylene oxide, ethylene oxide, propylene oxide, UVR6100, UVR6128, TCM101, TCM102, TCM104, TCM201, TCM203, and TCM207.

[0024] Furthermore, the chemical vapor deposition is plasma enhanced chemical vapor deposition, the deposition temperature is 10° C. to 80° C., and the deposition pressure is 0.001 atm to 1 atm.

[0025] In a third aspect, an embodiment of the present application discloses an optical module assembly, on which a protective coating as described in any one of the first aspects is provided.

[0026] Further, the optical module assembly includes at least one of a jumper, a chip, a PCBA, a silicon lens, a PEI lens, a glass lens, an optical glass, alumina, an aluminum nitride ceramic, a copper-tungsten alloy or an aluminum part; and / or,

[0027] The optical module assembly is configured to be immersed in a cooling liquid, and the cooling liquid includes a fluorinated liquid, an organic silicon liquid or a hydrocarbon oil.

[0028] Compared with the prior art, the beneficial effects of this application are:

[0029] The embodiment of the present application provides a protective coating, which includes: metal oxynitride and epoxy resin. Since the metal oxynitride includes at least one of aluminum oxynitride and zinc oxynitride, the presence of this component can improve the thermal conductivity of the material to a high degree, so that the prepared protective coating has good thermal conductivity. Among them, the epoxy resin has a good chemical resistance effect, and the metal oxynitride can interact with the epoxy resin, thereby further enhancing the chemical resistance and adhesion performance of the protective coating.

[0030] Specifically, since the protective coating has a three-dimensional network structure, the three-dimensional network structure forms a continuous heat conduction path in the protective coating, providing multiple heat transfer paths, which is helpful for heat transfer, and since the protective coating contains metal nitride, it helps to improve the thermal conductivity of the protective coating, so that heat has a higher conduction efficiency in the three-dimensional network structure, further improving the heat dissipation effect of the protective coating. In addition, the molecular cross-linking degree in the three-dimensional network structure is high and the connection stability is good, so it helps to reduce the pores and channels of the protective coating, improve the density and stability of the protective coating, and further inhibit the erosion of chemicals.

[0031] In addition, since epoxy resin has good mechanical effects, when it is used as a component of the protective coating, it can effectively increase the mechanical effects of the protective coating, so that the protective coating can better disperse and withstand stress when subjected to external forces, thereby improving its mechanical strength, helping to extend the service life of the protective coating and enabling it to effectively play a protective role.

[0032] In summary, the protective coating provided in the present application includes a mixture formed by metal nitride and epoxy resin, and because the protective coating has a three-dimensional network structure, the thermal conductivity, mechanical properties, and chemical protection properties of the protective coating enable it to effectively protect the optical module components. DETAILED DESCRIPTION

[0033] The following will be combined with the specific implementation methods in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships described in the embodiments. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0035] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0036] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0037] The technical solution provided by the present invention will be further described below in conjunction with embodiments.

[0038] As the frequency of use of optical module components increases, the packaging and protection performance of optical module components are also increasingly required. Among them, polymer coatings are often used for material surface protection due to their economic, easy coating, high light transmittance, simple production process, and wide range of applications. They can give materials good physical and chemical durability. Therefore, when polymer coatings are applied to optical module components, they can effectively protect the optical module components and prevent the erosion of chemicals on the optical module components.

[0039] However, although the polymer coating can effectively improve the anti-corrosion performance of the optical module, the thermal conductivity of the coating is low, which hinders the heat transfer of the optical module assembly, the working stability of the optical module assembly is poor, and some components will be damaged due to excessive heat, affecting the service life of the optical module assembly.

[0040] Based on the above problems, an embodiment of the present application provides a protective coating, which has high anti-corrosion effect, good density, and high thermal conductivity, thereby being able to more effectively protect the optical module assembly.

[0041] In a first aspect, an embodiment of the present application discloses a protective coating having a three-dimensional network structure. The protective coating is composed of metal nitride and epoxy resin, wherein the metal nitride includes at least one of aluminum oxynitride and zinc oxynitride.

[0042] In a first optional embodiment, the metal element includes zinc, so the metal nitride includes zinc oxynitride; in a second optional embodiment, the metal element includes aluminum, so the metal nitride includes aluminum oxynitride; in a third optional embodiment, the metal element includes zinc and aluminum, so the metal nitride includes zinc oxynitride and aluminum oxynitride. In this case, the three-dimensional network structure is formed by cross-linking these two substances, and because aluminum is trivalent and zinc is divalent, there are more transmission paths and directions, which is more helpful to improve the heat dissipation effect, and the two nitrides have different thermal conductivity coefficients. Through the synergistic effect of the two, it is more helpful to improve the thermal conductivity of the protective coating.

[0043] The protective coating disclosed in the embodiment of the present application includes metal nitride and epoxy resin, wherein the metal nitride includes at least one of zinc oxynitride and aluminum oxynitride, and the metal nitride can effectively improve the thermal conductivity of the protective coating. In addition, the metal nitride and epoxy resin can cooperate with each other to further improve the compactness and corrosion resistance of the protective coating.

[0044] Specifically, the three-dimensional network structure in the protective coating can provide multiple heat transfer paths, and the continuity of the transfer paths is high, which can effectively improve the heat transfer efficiency. In addition, since the protective coating contains metal nitride, it helps to improve the thermal conductivity of the protective coating, thereby further increasing the heat transfer efficiency and helping to improve the heat dissipation effect of the optical module assembly. In addition, the molecules in the three-dimensional network structure have a high degree of cross-linking, higher density and good connection stability, which can effectively reduce defects such as pores and cracks in the protective coating, increase the density and structural stability of the protective coating, so that it can effectively avoid chemical erosion and improve its protection effect.

[0045] In addition, since epoxy resin has good mechanical effects, it can effectively improve the mechanical effects of the protective coating as a component of the protective coating. Therefore, the stress of the protective coating is evenly dispersed when subjected to external force, which helps to extend the service life of the protective coating and enable it to effectively play a protective role.

[0046] It can be understood that the three-dimensional network structure in the protective coating includes at least one of a three-dimensional network structure formed by the metal oxynitride itself, a three-dimensional network structure formed by the epoxy resin itself, and a three-dimensional network structure formed by a mixture of the metal oxynitride and the epoxy resin.

[0047] The three-dimensional network structure is formed by partially or completely cross-linking the metal nitride and the epoxy resin.

[0048] Specifically, the epoxy groups of the epoxy resin and the metal elements and other groups in the metal nitride are connected together through chemical bonds such as coordination bonds, thereby forming a three-dimensional network structure. The method of combining them together with chemical bonds makes the three-dimensional network structure more cross-linked, so the three-dimensional network structure has a higher density and good connection stability, which can effectively reduce defects such as pores and cracks in the protective coating, increase the density and structural stability of the protective coating, so that it can effectively avoid erosion by chemicals and improve its protective effect.

[0049] In addition, since metal nitride is a component of the three-dimensional network structure, it can effectively improve the thermal conductivity of the three-dimensional network structure and effectively increase the heat dissipation rate of the three-dimensional network structure, thereby improving the thermal conductivity of the protective coating to a high degree.

[0050] It can be understood that the three-dimensional structure in the protective coating of the present application is formed by metal nitride and epoxy resin. Compared with an independent layer structure, the connection between the metal nitride and epoxy resin of the present application is more stable, and the degree of mutual influence is higher, which is more conducive to forming a highly stable, dense, and thermally conductive protective coating, thereby further improving the service life and stability of the optical module assembly.

[0051] Furthermore, the three-dimensional network structure can be formed by cross-linking a portion of the metal oxynitride and the epoxy resin, and another portion of the epoxy resin and the metal oxynitride are combined in other forms. For example, since the metal oxynitride has a porous structure, another portion of the epoxy resin is filled in the pores of the metal oxynitride.

[0052] Therefore, when part of the metal nitride is bonded to the epoxy resin through chemical bonds, due to the saturation of the chemical bonds, part of the epoxy resin exists in a free state, and since the metal nitride contains pores, the epoxy resin in a free state will be filled in the pores of the metal nitride through van der Waals forces, electrostatic adsorption, physical adsorption, etc., thereby further increasing the density of the film layer of the protective coating, and further helping to improve the corrosion resistance and density of the protective coating.

[0053] It can be understood that the pores of metal nitride include two parts. The first part refers to when part of the metal nitride exists in a three-dimensional network structure, which refers to the pores in the three-dimensional network structure. The second part refers to when part of the metal nitride exists in a free state, which refers to the pores in the free state.

[0054] In an optional embodiment, the protective coating includes metal nitride and epoxy resin. In this case, the protective coating includes 70% to 95% of the metal nitride and 5% to 30% of the epoxy resin by weight. When the content of the metal nitride and the epoxy resin is within the above range, the synergistic effect between the metal nitride and the epoxy resin is good, the stability of the formed three-dimensional structure is good, and the protective coating has high thermal conductivity and high chemical resistance.

[0055] In another optional embodiment, the protective coating includes a metal oxynitride composition and an epoxy resin, the metal oxynitride composition includes a metal nitride oxide, and the protective coating includes 70% to 95% of the metal oxynitride composition and 5% to 30% of the epoxy resin by weight. When the content of the metal oxynitride composition and the epoxy resin is within the above range, the synergy between the metal oxynitride composition and the epoxy resin is good, the stability of the formed three-dimensional structure is good, and the protective coating has high thermal conductivity and high chemical resistance.

[0056] In addition, the metal oxynitride composition also includes at least one element of B, Ti, Zr, and Si, so that the metal oxynitride composition also includes aluminum oxide, zinc oxide, boron nitride, zirconium oxide, titanium oxide and other substances. Among them, when the metal oxynitride composition includes at least one of aluminum oxide, zinc oxide and boron nitride, the thermal conductivity of the protective coating can be further improved, so that it has a higher thermal conductivity; when the metal oxynitride composition includes zirconium oxide, the wear resistance of the protective coating can be further optimized and its service life can be increased; when the metal oxynitride composition includes titanium oxide, it helps to improve the flexibility and adhesion of the protective coating, so that the protective coating has a high degree of contact with the optical module component, and can play a high degree of sealing and protection effect.

[0057] Furthermore, the structural formula of the metal nitride is MNHxOy, wherein 0<x≤0.5, 1.5≤y≤2.0, and M is a metal element. When x and y satisfy the above relationship, the compactness of the formed protective coating is better, which is more conducive to improving the thermal conductivity of the protective coating. Since the metal nitride also contains hydrogen, the chemical bonds in the metal nitride will include amino groups and hydroxyl groups. The above groups can react with epoxy groups to form covalent bonds, thereby generating a higher chemical bonding force and further improving the stability of the three-dimensional network skeleton.

[0058] Furthermore, the thickness of the protective coating is 0.1μm~50μm. When the thickness of the protective coating is within the above range, it can effectively seal and protect, effectively block the corrosion of chemical reagents, and help transfer the heat in the optical module assembly to the external environment, thereby helping to further improve the service life and stability of the optical module assembly.

[0059] Furthermore, the thermal conductivity of the protective coating is 6 W / mK~9 W / mK. When the thermal conductivity of the protective coating is within the above range, it means that it has high thermal conductivity, which helps to improve the heat dissipation performance of the optical module assembly.

[0060] In a second aspect, the present application discloses a method for preparing the protective coating of the first aspect, the method comprising the following steps:

[0061] A protective coating is prepared on the outer surface of the optical module component by using a chemical vapor deposition method.

[0062] When the chemical vapor deposition process is used to prepare the protective coating, the process conditions are controllable, the prepared film layer has high density and good uniformity, which can effectively improve the protective performance of the protective coating and make the coating and the optical module component more tightly bonded, thereby helping to improve the service life and stability of the optical module component.

[0063] Furthermore, the protective coating includes a metal oxynitride composition and an epoxy resin, the metal oxynitride composition includes a metal oxynitride, and the chemical vapor deposition method includes the following steps:

[0064] Passing gas;

[0065] A precursor of a metal nitride oxide composition and a precursor of an epoxy resin are introduced to deposit a protective coating on the optical module component.

[0066] Specifically, the optical module assembly is placed in a vapor deposition furnace and the chamber is closed; gas is introduced, and then a precursor of a metal nitride oxide composition and a precursor of an epoxy resin are introduced. Under the action of the vapor deposition furnace, the two are polymerized in the form of gas at the interface of the optical module assembly, thereby forming the protective coating on the optical module assembly; the reaction is stopped, the equipment is closed, and the sample is removed.

[0067] Since the two substances are mixed in the form of gas, the two substances are evenly distributed in the prepared protective coating, which is more helpful to improve the sufficiency of the reaction and the protective performance of the protective coating.

[0068] Furthermore, in the step of introducing gas, the introduced gas includes at least one of hydrogen, ethane, ethylene oxide, trimethylene oxide, and helium. The use of the above gases can avoid side reactions during the reaction, thereby affecting the quality of the protective coating. Preferably, when the gas is trimethylene oxide, since the properties of trimethylene oxide and epoxy resin are similar, it can react with the metal nitride oxide composition, thereby further improving the chemical resistance, bonding performance, density, etc. of the protective coating.

[0069] Among them, the precursor of the metal nitride oxide composition includes a material source and a gas source. The material source includes at least one of methyl zinc, ethyl zinc, ethyl aluminum, ethoxide zinc, tetraethyl zirconate, isopropoxide aluminum, tetraethyl titanate, butyl boron, ethoxide zirconium, ethoxide tantalum, and triethoxyphosphorus; the gas source includes at least one of nitrogen and ammonia.

[0070] It is understandable that the gas source can also be introduced at the same time as the material source; the gas source can be introduced during the step of introducing the gas, so as to ensure that when the material source is introduced subsequently, it can directly react with the material source; the present application does not limit the order of introduction of the gas source and the material source, as long as it can ensure that the gas source and the material source can fully react.

[0071] In addition, the precursor of the epoxy resin includes at least one of hexafluoropropylene oxide dimer, hexafluoropropylene oxide, ethylene oxide, propylene oxide, 1,2-epoxy-4-vinylcyclohexane (UVR6100), Bis((3,4-epoxycyclohexyl)methyl)adipate (UVR6128), TCM101, TCM102, TCM104, TCM201, TCM203, and TCM207. Among them, TCM101, TCM102, TCM104, TCM201, TCM203, and TCM207 are TCM series products manufactured by Changzhou Qiangli Electronic New Materials Co., Ltd. (Tronly).

[0072] When the precursor of the epoxy resin includes at least one of UVR6128, UVR6100, and at least one of TCM104, TCM204, TCM203, and TCM207, it helps to increase the coating speed and make the reaction between the epoxy resin and the metal nitride oxide composition more sufficient, and the quality of the protective coating obtained by coating is better.

[0073] Furthermore, the chemical vapor deposition is plasma enhanced chemical vapor deposition, the deposition temperature is 10°C~80°C, and the deposition pressure is 0.001 atm~1 atm. When the above deposition conditions are adopted, it is ensured that the film layer of the deposited protective coating has good uniformity so that it can fully cover the optical module component to achieve a protective effect.

[0074] In a third aspect, an embodiment of the present application discloses an optical module assembly, on which a protective coating as in the first aspect is provided.

[0075] Furthermore, the optical module assembly includes at least one of a jumper, a chip, a printed circuit board assembly (PCBA), a silicon lens (silicon Lens), a polyetherimide lens (Polyetherimide Lens, PEI Lens), a glass lens (glass Lens), optical glass, alumina, aluminum nitride ceramics, copper tungsten alloy or aluminum parts.

[0076] At this time, providing a protective coating on the above structure can provide a better sealing and protective effect on the structure, prevent it from being corroded by chemicals, and allow the heat of the above structure to be conducted out through the protective coating, thereby improving the heat dissipation effect.

[0077] Furthermore, in order to achieve a better scattering effect of the optical module assembly, the optical module assembly is configured to be immersed in a coolant, thereby utilizing the cooling effect of the coolant to further help improve the heat dissipation efficiency of the optical module assembly, and when the protective coating of the present application is used, the protective coating is highly compatible with the coolant, so that the coolant can better act on the heat transmitted through the protective coating. Among them, the coolant includes a fluorinated liquid, a silicone liquid or a hydrocarbon oil; the fluorinated liquid includes at least one of FC-40 and hexafluoropropylene trimer (Noah3000), the silicone liquid includes ICL-1000, and the hydrocarbon oil includes at least one of polyalphaolefin (PAO4), S3X, and DC15.

[0078] The technical solution of the present application will be further explained below in conjunction with more specific embodiments and experimental test results.

[0079] Embodiment 1:

[0080] The present application provides a method for preparing a protective coating:

[0081] Place the optical module assembly into a vapor deposition furnace, set the chamber temperature at 25°C, and close the vapor deposition furnace door;

[0082] A mixed gas of nitrogen and helium is introduced, wherein the mass ratio of nitrogen to helium is 1:1;

[0083] A precursor of a metal nitride oxide composition and a precursor of an epoxy resin are introduced, and a 20 μm thick protective coating is deposited on the optical module component by a plasma enhanced chemical vapor deposition process, wherein the material source of the metal nitride oxide composition includes ethyl aluminum and ethyl zinc, the gas source is nitrogen, and the precursor of the epoxy resin includes UVR6110; the flow rate ratio of ethyl aluminum, ethyl zinc and UVR6110 is set to 3:2:1 respectively, the coating pressure is 0.01 atm, and the process time is 12 hours, wherein the mass content of the metal nitride oxide composition is 85%, and the mass content of the epoxy resin is 15%;

[0084] After the pressure reducing pump is turned off and the pressure in the chamber is restored to normal pressure, the chamber is opened and the optical module assembly is taken out, and the coating process is completed.

[0085] Embodiment 2:

[0086] The difference between this embodiment and embodiment 1 is that the process time is 1 hour, and the thickness of the prepared protective coating is 1 μm.

[0087] Embodiment 3:

[0088] The difference between this embodiment and embodiment 1 is that the thickness of the prepared protective coating is 30 μm, the material source of the metal nitride oxide composition includes ethyl aluminum and zinc ethoxide, the precursor of the epoxy resin includes UVR6110 and TCM207, and the flow rate ratio of ethyl aluminum, zinc ethoxide, UVR6110 and TCM207 is set to 5:2:2:1 respectively.

[0089] Embodiment 4:

[0090] The difference between this embodiment and embodiment 1 is that the process time is 24 h, the thickness of the prepared protective coating is 50 μm, the material source of the metal nitride oxide composition includes ethyl aluminum and zinc ethoxide, the precursor of the epoxy resin includes UVR6110 and TCM104, and the flow rate ratios of ethyl aluminum, zinc ethoxide, UVR6110 and TCM207 are set to 5:8:1:1 respectively.

[0091] Embodiment 5:

[0092] The difference between this embodiment and embodiment 1 is that the thickness of the prepared protective coating is 50 μm, and the material source of the metal nitride oxide composition includes ethyl aluminum and zinc ethoxide, the precursor of the epoxy resin includes UVR6110 and TCM207, and the flow rate ratio of ethyl aluminum, zinc ethoxide, UVR6110 and TCM207 is set to 5:3:1:1 respectively.

[0093] Embodiment 6:

[0094] The difference between this embodiment and embodiment 1 is that the thickness of the prepared protective coating is 10 μm, and the material source of the metal nitride oxide composition includes aluminum isopropoxide and ethyl zinc.

[0095] Embodiment 7:

[0096] The difference between this embodiment and embodiment 1 is that the thickness of the prepared protective coating is 0.5 μm, and the material source of the metal nitride oxide composition includes ethyl aluminum and zinc ethoxide, the precursor of the epoxy resin includes TCM207 and UVR6110, and the flow rate ratio of ethyl aluminum, zinc ethoxide, UVR6110 and TCM207 is set to 3:6:1:1 respectively.

[0097] Embodiment 8:

[0098] The difference between this embodiment and embodiment 1 is that the process time is 18 h, the thickness of the prepared protective coating is 50 μm, the material sources of the metal nitride oxide composition include ethyl aluminum, zinc ethoxide, and n-butyl titanate, the precursors of the epoxy resin include UVR6110 and TCM207, and the flow rate ratios of ethyl aluminum, zinc ethoxide, n-butyl titanate, UVR6110 and TCM207 are set to 5:3:1:1:1, respectively.

[0099] Embodiment 9:

[0100] The difference between this embodiment and embodiment 1 is that in the step of introducing gas, the introduced gas includes nitrogen, helium, and ethane, and the flow rate ratio of nitrogen, helium, and ethane is 1:1:1;

[0101] In the step of introducing the metal nitride oxide composition precursor and the epoxy resin precursor, the process time is 6 h, and the material sources of the metal nitride oxide composition include tetraethyl orthosilicate and aluminum isopropoxide, and the precursors of the epoxy resin include UVR6110 and TCM207, and the flow rate ratios of tetraethyl orthosilicate, aluminum isopropoxide, UVR6110 and TCM207 are set to 5:20:2:3 respectively.

[0102] Comparative Example 1:

[0103] The only difference between this comparative example and Example 1 is that the prepared protective coating contains only epoxy resin, the process time is 6 hours, the precursors of the epoxy resin include TCM203 and UVR6110, and the flow rate ratio of TCM203 and UVR6110 is 1:1.

[0104] Comparative Example 2:

[0105] The only difference between this comparative example and Example 1 is that the prepared protective coating contains only a metal nitride oxide composition, and the material source of the metal nitride oxide composition includes tetraethyl orthosilicate and aluminum isopropoxide, and the flow rate ratio of tetraethyl orthosilicate to aluminum isopropoxide is 5:1.

[0106] Comparative Example 3:

[0107] The only difference between this comparative example and Example 1 is that the epoxy resin and the metal nitride oxide composition in the prepared protective coating are separate coatings.

[0108] Place the optical module assembly including PCBA, PEI Lens, jumper and other structures into a vapor deposition furnace, the chamber temperature is 25°C, and the vapor deposition furnace door is closed;

[0109] A mixed gas of nitrogen and helium is introduced, wherein the mass ratio of nitrogen to helium is 1:1;

[0110] A precursor of a metal oxynitride composition is introduced, and a 10 μm thick metal oxynitride composition layer is prepared by a plasma enhanced chemical vapor deposition process, wherein the material source of the metal oxynitride composition includes tetraethyl orthosilicate and aluminum isopropoxide, and the flow rate ratio of tetraethyl orthosilicate to aluminum isopropoxide is 1:5, the process time is 5 hours, and the coating pressure is 0.01 atm;

[0111] The epoxy resin precursor was introduced to prepare a 10 μm thick epoxy resin layer by plasma enhanced chemical vapor deposition process. The epoxy resin precursors included TCM203 and UVR6110. The flow rate ratio of TCM203 and UVR6110 was set to 1:1, the process time was 1 hour, and the coating pressure was 0.01 atm.

[0112] After the pressure reducing pump is turned off and the pressure in the chamber is restored to normal pressure, the chamber is opened and the optical module assembly is taken out, and the coating process is completed.

[0113] Test Results

[0114] In order to further verify the protective coating effects of the embodiments and comparative examples of the present application, the present application tests the performance of the protective coating.

[0115] Thermal conductivity: The thermal conductivity of the samples of the embodiment and the comparative example was tested using a thermal conductivity meter of model 2500S produced by Hot Disk Company.

[0116] High and low temperature cycle performance: In an environment of -40℃~85℃, the samples of the embodiments and comparative examples were cycled 1000 times to test the stability of their performance, wherein the temperature change rate was ≥10℃ / min (temperature switching time 12.5mins), the high and low temperature holding time was greater than 10 min, and each cycle time was more than 45 min.

[0117] High temperature and high humidity performance: The samples of the embodiment and the comparative example were stored in an environment with a temperature of 85° C. and a humidity of 85% RH for 168 h, 500 h, and 1000 h, respectively.

[0118] Chemical resistance: Place the test sample in chemicals, heat the chemicals to 85°C, and soak for 2000 hours.

[0119] Boiling experiment: The samples of the embodiment and comparative example were boiled in boiling water at 100°C for 6h, 12h and 24h respectively.

[0120] Table 1 Performance of protective coatings in examples and comparative examples

[0121]

[0122] Analysis of the data of Examples 1 to 9 and Comparative Example 1 shows that the performance of the examples is better than that of Comparative Example 1. This is because the protective coating of the examples includes a metal nitride oxide composition and an epoxy resin, while Comparative Example 1 only contains an epoxy resin. Therefore, the metal nitride oxide composition in the examples can effectively improve the thermal conductivity of the protective coating, and the three-dimensional network structure in the mixture can conduct heat well, thereby facilitating the heat dissipation of the protective coating. The three-dimensional network structure makes the protective coating highly dense, which is more helpful in avoiding corrosion by chemicals.

[0123] Analysis of the data of Examples 1 to 9 and Comparative Example 2 shows that the performance of the examples is better than that of Comparative Example 2. This is because the protective coating of the examples includes a metal oxynitride composition and an epoxy resin, while Comparative Example 2 only contains a metal oxynitride composition. Therefore, the three-dimensional network structure in the mixture of the examples, and the basic network skeleton of the three-dimensional network structure is metal oxynitride, so it provides more heat conduction paths and improves the efficiency of heat conduction, thereby effectively increasing the thermal conductivity of the protective coating of the examples. In addition, the three-dimensional structure of the examples is composed of a metal oxynitride composition and an epoxy resin, so through cross-linking between chemical bonds, the prepared film layer has good density, which is more conducive to improving chemical resistance.

[0124] Analysis of the data of Examples 1 to 9 and Comparative Example 3 shows that the thermal conductivity and chemical resistance of the examples are better than those of Comparative Example 3. This is because the metal nitride oxide composition and the epoxy resin of the examples are in the same layer structure, while the metal nitride oxide composition layer and the epoxy resin layer in Comparative Example 3 belong to separate layer structures. Therefore, the three-dimensional network structure composed of the metal nitride oxide composition and the epoxy resin has a high degree of cross-linking between molecules and a higher structural density. Moreover, the basic network skeleton of the three-dimensional network structure is metal nitride oxide, so the heat dissipation rate is faster, which is more conducive to improving the thermal conductivity and chemical resistance of the protective coating.

[0125] The protective coating and its preparation method, and the optical module component disclosed in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the protective coating and its preparation method, and the optical module component: At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A protective coating for an optical module assembly, characterized in that: The protective coating has a three-dimensional network structure, and the composition of the protective coating includes metal nitride and epoxy resin, wherein the metal nitride includes at least one of aluminum oxynitride and zinc oxynitride, and the three-dimensional network structure is formed by cross-linking part or all of the metal nitride and the epoxy resin.

2. The protective coating according to claim 1, characterized in that A part of the metal nitride and a part of the epoxy resin are cross-linked to form the three-dimensional network structure. The metal oxynitride has pores, and another portion of the epoxy resin fills the pores of the metal oxynitride.

3. The protective coating according to claim 1, characterized in that In terms of mass fractions, the protective coating comprises a metal oxynitride composition and the epoxy resin, the metal oxynitride composition comprises the metal nitride oxide, and the protective coating comprises 70% to 95% of the metal oxynitride composition and 5% to 30% of the epoxy resin.

4. The protective coating according to claim 3, characterized in that The elements in the metal oxynitride composition further include: at least one of B, Ti, Zr, and Si; and / or, The metal oxynitride composition also includes at least one of aluminum nitride, zinc nitride and boron nitride.

5. The protective coating according to claim 1, characterized in that The structural formula of the metal nitride oxide is MNHxOy, wherein 0<x≤0.5, 1.5≤y≤2.0, and M is a metal element.

6. The protective coating according to claim 1, characterized in that The thickness of the protective coating is 0.1 μm to 50 μm; and / or, The thermal conductivity of the protective coating is 6 W / mK~9 W / mK.

7. A method for preparing a protective coating according to any one of claims 1 to 6, characterized in that: The preparation method comprises the following steps: The protective coating is prepared on the outer surface of the optical module component by using a chemical vapor deposition method.

8. The preparation method according to claim 7, characterized in that: The protective coating comprises a metal oxynitride composition and the epoxy resin, the metal oxynitride composition comprises the metal oxynitride, and the chemical vapor deposition method comprises the following steps: Passing gas; A precursor of the metal oxynitride composition and a precursor of the epoxy resin are introduced to deposit the protective coating on the optical module component.

9. The preparation method according to claim 8, characterized in that: The gas includes at least one of hydrogen, ethane, ethylene oxide, trimethylene oxide, and helium.

10. The preparation method according to claim 9, characterized in that: The gas is trimethylolpropane oxide.

11. The preparation method according to claim 8, characterized in that: The precursor of the metal nitride oxide composition comprises a material source and a gas source, wherein the material source comprises at least one of methyl zinc, ethyl zinc, ethyl aluminum, zinc ethoxide, tetraethyl zirconate, aluminum isopropoxide, tetraethyl titanate, butyl boron, zirconium ethoxide, tantalum ethoxide, and triethoxyphosphorus; the gas source comprises at least one of nitrogen and ammonia; and / or, The precursor of the epoxy resin includes at least one of hexafluoropropylene oxide dimer, hexafluoropropylene oxide, ethylene oxide, propylene oxide, UVR6100, UVR6128, TCM101, TCM102, TCM104, TCM201, TCM203, and TCM207.

12. The preparation method according to claim 7, characterized in that: The chemical vapor deposition is plasma enhanced chemical vapor deposition, the deposition temperature is 10° C. to 80° C., and the deposition pressure is 0.001 atm to 1 atm.

13. An optical module assembly, characterized in that: The optical module assembly is provided with the protective coating as claimed in any one of claims 1 to 6.

14. The optical module assembly according to claim 13, characterized in that: The optical module assembly includes at least one of a jumper, a chip, a PCBA, a silicon lens, a PEI lens, a glass lens, an optical glass, alumina, an aluminum nitride ceramic, a copper-tungsten alloy or an aluminum part; and / or, The optical module assembly is configured to be immersed in a cooling liquid, and the cooling liquid includes a fluorinated liquid, an organic silicon liquid or a hydrocarbon oil.

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