Copper sheet bonding equipment for punching and feeding semiconductor devices and assembly method thereof

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and in particular to a copper sheet bonding device for punching and feeding semiconductor devices and an assembly method thereof. The tray feeding and gluing device of the mounting equipment provides a copper frame with a first chip and a second chip mounted thereon, and glue is applied to the two pins of the copper frame, the source of the first chip and the second chip, and glue is applied to the gate of the first chip; the jumper punching and feeding device, the jumper mounting device, the image detection mechanism and the unloading mechanism of the mounting equipment respectively complete the punching of the flat strip to form two independent jumpers, and unload the materials after the jumper mounting device completes the mounting. The advantage of the present invention is that two independent jumpers are punched out by the punching and feeding device, and the copper frame is used as a substrate, and two jumper clips are used to interconnect the power semiconductor chip electrodes with the lead-out pins of the copper frame, and the copper sheet bonding reduces chip damage and increases the chip carrying power.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a copper sheet bonding device for punching and feeding semiconductor devices and an assembly method thereof. Background Art

[0002] Power semiconductor devices are core components of modern power transformation devices. At present, the voltage and current levels and reliability of domestic power semiconductor devices are relatively low. High-end industries such as rail transit and new energy vehicles require ultra-high voltage, high current, and high reliability high-power semiconductor devices, which are completely monopolized by foreign products, posing a huge hidden danger to the safety of industrial development.

[0003] Mastering advanced design technology, process technology and equipment is the key for foreign semiconductor companies to stay ahead. Advanced copper sheet bonding method is the core technology for high-power semiconductor device packaging. Due to restrictions on this technology and equipment by foreign manufacturers, domestic power semiconductor devices still generally use wire bonding, which limits the improvement of device carrying power and reliability.

[0004] Researching and developing high-precision copper sheet bonding equipment for power semiconductor devices, breaking through key technologies and forming product applications will help master advanced packaging and testing technologies for power semiconductor devices, improve the performance of domestic power semiconductor devices, and have great market application potential and social benefits. Summary of the invention

[0005] In view of this, the present invention aims to provide a copper sheet bonding device for punching and loading semiconductor devices and an assembly method thereof, which completes the assembly of flip chips through a tray loading and gluing device, a jumper mounting and unloading device, and a second frame mounting device.

[0006] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0007] A copper sheet bonding device for punching and loading semiconductor devices, comprising: a mounting platform; a tray loading and gluing device, which is arranged on the mounting platform; the tray loading and gluing device is configured to provide a copper frame with a first chip and a second chip mounted thereon, and to apply glue to two pins of the copper frame, a source of the first chip and a preset position of the second chip, as well as to apply glue to the gate of the first chip, and to transport the processed first chip, the second chip and the copper frame to the next process; a second conveying device, the second conveying device comprising a second linear motor and a second tray, the second tray being used to carry a frame tray, the frame tray being equipped with a copper frame, a first chip and a second chip; the second linear motor drives the second tray and then drives the frame tray to reciprocate between a jumper mounting position and a unloading position; a jumper punching and loading device, the jumper punching and loading device comprising a base plate, a flat belt guide mechanism arranged on the base plate, a jumper punching mechanism and a return pipe, the flat belt guide mechanism being configured to convey The flat strip is moved to the punching position; the jumper punching mechanism is configured to punch two different preset positions on the flat strip in sequence, thereby forming two independent first jumpers and second jumpers respectively; the return pipe is used to receive the remaining material of the flat strip after punching; the jumper mounting device, the jumper mounting device includes a chip recognition camera and a jumper mounting assembly; the chip recognition camera is used to identify and locate the position of the gate located on the second conveying device; the jumper mounting assembly is configured to pick up the first jumper or the second jumper, and mount the first jumper with the gate and the pin of the corresponding gate, and mount the second jumper with the second chip, the source and the pin of the corresponding second chip; the image detection mechanism, the image detection mechanism is located between the jumper punching and feeding device and the second conveying device; the image detection is used to identify the position of the contact point of the first jumper picked up by the jumper mounting assembly and the gate; the unloading mechanism; the unloading mechanism unloads the mounted copper frame, the first chip, the second chip, the first jumper and the second jumper.

[0008] Furthermore, the tray loading and gluing device includes: a first conveying mechanism, including a first linear motor and a first tray, the first tray being used to carry a frame tray, on which a copper frame is placed; the first linear motor drives the first tray and then drives the frame tray to reciprocate between a frame loading position, a glue brushing position, a glue dispensing position and a transfer position; a frame loading mechanism, being configured to place a frame tray equipped with a copper frame, a first chip and a second chip on the first tray; a glue brushing mechanism, being arranged at the glue brushing position, being configured to apply glue to two pins of the copper frame, a source of the first chip and a preset position of the second chip; a glue dispensing mechanism, being arranged on the glue brushing mechanism and away from the frame loading mechanism, the glue dispensing mechanism being configured to perform glue dispensing on a gate of the first chip; a material moving mechanism, being arranged at the transfer position, being configured to move the frame tray equipped with the first chip, the second chip and the copper frame that have been glued and dispensed from the transfer position to the second conveying device.

[0009] Furthermore, the frame feeding mechanism includes: a support frame; a mounting seat, which is arranged on the support frame; a motor, a movable plate fixed to the mounting seat through a motor mounting plate, and connected to the mounting seat through four first pillars; a lead screw, one end of which is fixed to the movable plate, and the other end passes through the mounting seat and is connected to the output shaft of the motor through a synchronous pulley assembly, for transmitting power to achieve lifting movement; a lifting plate, the lifting plate is located between the movable plate and the mounting seat, is connected to the four first pillars through a first lubricated bearing, and is connected to the nut of the lead screw, and moves up and down on the four first pillars as the lead screw rotates; two fixed plates are connected to the lifting plate through four second pillars, and the movable plate is connected to the four second pillars through a second lubricated bearing; four silos, arranged vertically in pairs on the fixed plate The inner side of the frame tray is constructed into a rectangular shape for placing the frame tray; the two discharge components each include a cylinder, a push plate, two linear guides and two discharge plates, the cylinder is arranged on the fixed plate, the push plate is connected to the output end of the cylinder, the two linear guides are arranged on the fixed plate and are located on both sides of the cylinder, the two discharge plates are arranged at both ends of the push plate and are connected to the sliders of the two linear guides for realizing the storage and discharge of the frame tray; the motor drives the lead screw to rotate, and drives the moving plate to move up and down through the lifting plate, and then drives the fixed plate to move up and down, so that when the lifting plate is in the rising position, the cylinder extends to make the frame tray on the discharge plate, and when the lifting plate is in the descending position, the cylinder drives the discharge plate to retract so that the frame tray is located on the first tray.

[0010] Furthermore, the glue brushing mechanism includes: a mounting frame, a glue brushing lifting assembly, a glue brushing translation assembly, a scraper assembly and a glue brushing plate; the mounting frame is fixed on the mounting platform, the glue brushing lifting assembly is arranged on the mounting frame, the glue brushing translation assembly and the glue brushing plate are connected to the glue brushing lifting assembly through the glue brushing mounting plate to realize vertical movement; the scraper assembly is connected to the glue brushing translation assembly, and the scraper of the scraper assembly is located in the glue groove of the glue brushing plate; at the bottom of the glue groove, a glue brushing hole is provided at a preset position, and the scraper assembly brushes the glue onto the two pins of the copper frame, the source of the first chip and the preset position of the second chip through the glue brushing hole.

[0011] Furthermore, the glue dispensing mechanism is arranged on the mounting frame away from the glue brushing mechanism; the glue dispensing mechanism is configured to identify and locate the gate of the first chip, measure the vertical distance between the glue dispensing mechanism and the gate, and dispense glue to the gate.

[0012] Furthermore, the material moving mechanism includes a translation component, a lifting component and a grabbing component; the grabbing component is arranged on the lifting component, the translation component drives the lifting component to translate and then drives the grabbing component to move; the grabbing component includes an H-shaped plate and a pneumatic suction cup group arranged on the H-shaped plate, and the pneumatic suction cup group is arranged on the two vertical sides of the H-shaped plate.

[0013] Furthermore, the flat belt guide mechanism includes: a transmission motor, a fixed seat, a connecting shaft, a positioning ratchet, a flat belt guide, a sensor and a guide cover; the fixed seat is arranged on the bottom plate, the fixed end of the transmission motor is connected to the fixed seat, the output shaft of the transmission motor is connected to the connecting shaft through a coupling, the connecting shaft is connected to the fixed seat through two support plates, the positioning ratchet is sleeved on the connecting shaft and is located between the two support plates; a positioning pin is provided on the outer circumference of the positioning ratchet for cooperating with the positioning hole on the flat belt; the flat belt guide is arranged on the upper surfaces of the two support plates, the guide cover covers the upper surface of the flat belt guide, and together with the flat belt guide constitutes a conveying channel for the flat belt; the sensor is arranged on the flat belt guide for detecting the presence or absence of the flat belt and confirming the position of the flat belt; the flat belt is located in the conveying channel, and as the connecting shaft rotates, the positioning ratchet cooperates with the positioning hole on the flat belt , to achieve stable transportation of the flat belt; the jumper stamping mechanism includes: a stamping base, a stamping motor, an eccentric assembly, a lower plate, a middle plate, an upper plate, a punch seat, a punch, a die, a strip clamping plate, a first spring and a second spring; the stamping base is arranged on the bottom plate, the fixed end of the stamping motor is connected to the stamping base through the motor connecting plate, the output shaft of the stamping motor is connected to the eccentric assembly, the eccentric assembly is connected to the lower plate, the punch seat is arranged on the lower plate and passes through the middle plate; the punch is arranged on the punch seat; the strip clamping plate is arranged on the middle plate, the die is arranged on the upper plate, and a flat belt conveying channel is formed between the die and the upper plate; a first spring is arranged between the lower plate and the middle plate, a second spring is arranged between the middle plate and the lower plate, the lower plate, the middle plate and the upper plate are connected by four guide columns, and a supporting vertical plate is also arranged between the lower plate and.

[0014] Furthermore, the jumper wire mounting assembly includes a transverse movement mechanism and a picking mechanism arranged on the transverse movement mechanism, the transverse movement mechanism includes a transverse movement fixing frame and a transverse movement linear motor, the transverse movement fixing frame spans the second conveying device and the jumper wire punching and feeding device and is fixed to the mounting platform; the picking mechanism includes a mounting base plate and a suction assembly, the mounting base plate is arranged on the transverse movement linear motor, the suction assembly is arranged on the mounting base plate, the number of suction heads in the suction assembly is multiple, and the suction head is constructed to rotate 360 ​​degrees around its own axis and move up and down along the axis to achieve the positioning of the contacts of the first jumper wire 84.

[0015] Furthermore, the unloading mechanism has the same structure as the frame loading mechanism and is used to unload the mounted copper frame, the first chip, the second chip, the first jumper wire and the second jumper wire.

[0016] A method for assembling copper sheet bonding of a semiconductor device is implemented by using the copper sheet bonding equipment for punching and feeding the semiconductor device, wherein the semiconductor device comprises a copper frame, a first chip, a second chip, a first jumper wire and a second jumper wire; the method is characterized in that the specific steps are as follows:

[0017] S1. Place the copper frame with the first chip and the second chip mounted on the frame tray, and place the frame tray with the copper frame on the tray loading and gluing device frame loading mechanism;

[0018] S2. The frame feeding mechanism places the frame tray on the first tray of the first conveying mechanism of the tray feeding and gluing device, and the first conveying mechanism conveys the frame tray to the glue brushing position, and the glue brushing mechanism of the tray feeding and gluing device applies glue to the two pins of the copper frame, the source and gate of the first chip, and the preset position of the second chip;

[0019] S3. The first conveying mechanism conveys the copper frame, the first chip and the second chip after the glue is applied to the position of the glue dispensing mechanism of the material tray loading and glue coating device; the glue dispensing component of the glue dispensing mechanism fills the copper frame, the source and gate of the first chip and the unapplied or unqualified positions of the second chip with glue according to the unqualified positions detected by the detection camera of the glue dispensing mechanism and the measured distance of the distance measuring sensor of the glue dispensing mechanism, and the first conveying mechanism conveys the copper frame, the first chip and the second chip after the glue is applied to the transfer position;

[0020] S4. The material transfer mechanism of the tray loading and glue coating device moves the first chip, the second chip and the copper frame that have been glued from the transfer position to the second conveyor;

[0021] S5. The flat belt guide mechanism conveys the flat belt to the punching position; then, the jumper punching mechanism punches two different preset positions on the flat belt in sequence, punching each position only once, and punching twice in total, thereby forming independent first jumpers and second jumpers respectively;

[0022] S6. The jumper mounting device picks up the first jumper and moves it to the image detection mechanism, the image detection mechanism identifies the contact point of the first jumper and the gate mounting, and mounts the first jumper to the gate of the first chip and the pin of the copper frame corresponding to the gate of the first chip;

[0023] S7. The jumper mounting device picks up the second jumper and mounts the second jumper to the second chip, the source and gate of the first chip, and the pins of the copper frame corresponding to the second chip;

[0024] S8. The second conveying device transfers the mounted semiconductor device to the unloading mechanism;

[0025] S9. The unloading mechanism unloads the material.

[0026] Compared with the prior art, the invention can achieve the following beneficial effects: the invention uses the copper frame as a substrate through a tray loading and gluing device and a jumper mounting and unloading device, and uses copper sheet bonding to interconnect the power semiconductor chip electrodes with the copper frame lead pins. Compared with the traditional wire bonding process, copper sheet bonding can significantly reduce chip damage and increase the chip carrying power. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0028] Figure 1 is a schematic structural diagram of a semiconductor device provided according to an embodiment of the present invention;

[0029] Figure 2 2 is a schematic structural diagram of a copper sheet bonding device for punching and loading semiconductor devices according to an embodiment of the present invention;

[0030] Figure 3 is a structural schematic diagram of a frame feeding mechanism provided according to an embodiment of the present invention;

[0031] Figure 4 is a structural schematic diagram of a first transmission mechanism provided according to an embodiment of the present invention;

[0032] Figure 5 is a schematic structural diagram of a first tray provided according to an embodiment of the present invention;

[0033] Figure 6 is a structural schematic diagram of a glue applying mechanism provided according to an embodiment of the present invention;

[0034] Figure 7 is a structural schematic diagram of a material transfer mechanism provided according to an embodiment of the present invention;

[0035] Figure 8 is a structural schematic diagram of a dispensing mechanism provided according to an embodiment of the present invention;

[0036] Fig. 9 It is a structural schematic diagram of a jumper wire punching and feeding device provided according to an embodiment of the present invention;

[0037] Fig.10 is a top view of a jumper wire blanking and feeding device provided according to an embodiment of the present invention;

[0038] Fig.11 is a structural schematic diagram of a flat belt guide rail mechanism provided according to an embodiment of the present invention;

[0039] Fig.12is a schematic structural diagram of a flat belt guide rail provided according to an embodiment of the present invention;

[0040] Fig.13 is a structural schematic diagram of a jumper punching mechanism provided according to an embodiment of the present invention;

[0041] Fig.14 yes Fig.10 A cross-sectional view of the jumper punching mechanism along the AA direction;

[0042] Fig.15 is a structural schematic diagram of a jumper mounting device provided according to an embodiment of the present invention;

[0043] Fig.16 It is a structural schematic diagram of an image detection mechanism provided according to an embodiment of the present invention.

[0044] The reference numerals include: 1, mounting platform; 2, tray loading and gluing device; 21, frame loading mechanism; 211, support frame; 212, mounting seat; 213, motor; 214, moving plate; 215, first pillar; 216, lead screw; 217, lifting plate; 218, fixed plate; 219, second pillar; 2110, silo; 2111, discharge assembly; 2112, cylinder; 2113, push plate; 2114, linear guide; 2115, discharge plate; 22, first conveying mechanism; 221, first linear motor; 222, first tray; 2221, platform seat; 2222, tray; 2223, tray clamp; 2224 , clamping plate cylinder; 23, glue brushing mechanism; 231, mounting frame; 232, glue brushing lifting assembly; 233, glue brushing translation assembly; 234, scraper assembly; 235, glue brushing plate; 24, material moving mechanism; 241, translation assembly; 2411, translation bracket; 2412, translation bottom plate; 2413, translation motor; 2414, translation pulley assembly; 2415, translation guide rail; 242, lifting assembly; 2421, lifting motor; 2422, lifting fixed plate; 2423, lifting screw assembly; 2424, fixing block; 2425, lifting guide rail; 243, grabbing assembly; 2431, connecting beam; 2432, H-type plate; 2433 , pneumatic suction cup assembly; 25, dispensing mechanism; 251, detection camera; 252, dispensing assembly; 253, distance sensor; 254, camera lifting assembly; 255, dispensing linear motor; 256, dispensing mounting seat;

[0045] 3. A second conveying device;

[0046] 4. Jumper punching and feeding device; 41. Bottom plate; 42. Flat belt guide mechanism; 421. Transmission motor; 422. Fixed seat; 423. Connecting shaft; 424. Positioning ratchet; 425. Flat belt guide; 4251. Ratchet hole; 4252. Detection hole; 4253. Step groove; 426. Sensor; 427. Guide cover; 428. Support plate; 43. Jumper punching mechanism; 4301. Punching base ; 4302, stamping motor; 4303, eccentric assembly; 4304, lower plate; 4305, middle plate; 4306, upper plate; 4307, punch seat; 4308, punch; 4309, die; 4310, material belt clamping plate; 4311, first spring; 4312, second spring; 4313, motor connecting plate; 4314, guide column; 4315, support vertical plate; 44, return pipe;

[0047] 5. Jumper mounting device; 51. Transverse movement mechanism; 511. Transverse movement fixing frame; 512. Transverse movement linear motor; 52. Pick-up mechanism; 521. Mounting base plate; 522. Suction assembly; 53. Chip recognition camera;

[0048] 6. Image detection mechanism; 61. Light source assembly; 62. Camera; 63. Reflector assembly; 64. Camera bracket;

[0049] 7. Unloading mechanism;

[0050] 8. semiconductor device; 81. copper frame; 82. first chip; 83. second chip; 84. first jumper wire; 85. second jumper wire. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the invention more clear, the invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the invention and do not constitute a limitation of the invention.

[0052] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0053] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0054] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0055] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0056] like Figure 1 , Figure 2 As shown, an embodiment of the present invention provides a copper sheet bonding device for punching and loading semiconductor devices, wherein the semiconductor device 8 includes a copper frame 81, a first chip 82, a second chip 83, a first jumper 84, and a second jumper 85; the copper sheet bonding device for punching and loading semiconductor devices is used to complete bonding of the copper frame 81, the first chip 82, the second chip 83, the first jumper 84, and the second jumper 85. The copper sheet bonding device for punching and loading semiconductor devices includes: a mounting platform 1, a tray loading and gluing device 2, a second conveying device 3, a jumper punching and loading device 4, a jumper mounting device 5, an image detection mechanism 6, and a material unloading mechanism 7.

[0057] The tray feeding and gluing device 2 comprises a frame feeding mechanism 21 , a first conveying mechanism 22 , a glue brushing mechanism 23 , a glue dispensing mechanism 25 and a material moving mechanism 24 .

[0058] like Figure 3As shown, the frame loading mechanism 21 includes: a support frame 211, a mounting seat 212, a motor 213, a movable plate 214, four first pillars 215, a screw 216, a lifting plate 217, two fixed plates 218, four second pillars 219, four silos 2110, and a discharge assembly 2111.

[0059] The mounting seat 212 includes two L-shaped plates and a mounting plate. The horizontal plates of the two L-shaped plates are connected to the top of the support frame 211, the top surfaces of the vertical plates of the two L-shaped plates are connected to the bottom surface of the mounting plate, and the two L-shaped plates are arranged on both sides of the mounting plate back to back.

[0060] The motor 213 is fixed on the mounting plate of the mounting seat 212 via a motor mounting plate.

[0061] The lifting plate 217 is located between the movable plate 214 and the mounting seat 212. One end of the four first pillars 215 is fixed on the mounting plate of the mounting seat 212, and close to the four corners of the mounting plate. The other ends of the four first pillars 215 pass through the lifting plate 217 and are fixed to the movable plate 214. First self-lubricating bearings are respectively provided between the four first pillars 215 and the lifting plate 217.

[0062] One end of the lead screw 216 is connected to the output shaft of the motor 213 through a synchronous pulley assembly, and the other end is connected to the moving plate 214. The lifting plate 217 is connected to the nut of the lead screw 216. The motor 213 drives the lead screw 216 to rotate through the synchronous pulley assembly, thereby realizing the lifting movement of the lifting plate 217.

[0063] One end of the four second pillars 219 is fixed to the lifting plate 217 and is close to the four corners of the lifting plate 217. The other ends of the four second pillars 219 pass through the second self-lubricating bearing in the moving plate 214 and are connected to the two fixed plates 218. During assembly, the four second pillars 219 pass through the mounting platform 1, so that the four bins 2110 and the discharge assembly 2111 are located above the mounting platform 1, and one end of the first linear motor 221 is located between the four second pillars 219, ensuring that the frame tray is placed on the first tray 222.

[0064] Four silos 2110 are vertically arranged in pairs on the inner side of each fixed plate 218 to form a rectangular shape for placing frame trays.

[0065] The two material discharging components 2111 each include a cylinder 2112, a push plate 2113, two linear guide rails 2114, and two material discharging plates 2115. The cylinder 2112 is arranged on a fixed plate 218, the push plate 2113 is connected to the output end of the cylinder 2112, the two linear guide rails 2114 are arranged on the fixed plate 218 and are located on both sides of the cylinder 2112, and the two material discharging plates 2115 are arranged at both ends of the push plate 2113 and are connected to the slider of the linear guide rail 2114. , used to realize the storage and discharge of the frame material tray; the motor 213 drives the screw 216 to rotate, and drives the four second pillars 219 to move up and down through the lifting plate 217, and then drives the two fixed plates 218 to move up and down. When the lifting plate 217 is at the highest point, the cylinder 2112 extends to make the frame material tray located on the discharge plate 2115. When the lifting plate 217 is at the lowest point, the cylinder 2112 drives the discharge plate 2115 to retract so that the frame material tray is located on the first tray 222.

[0066] In the present invention, the position where the frame loading mechanism 21 places the copper frame 81 on the first tray 222 is defined as the first frame loading position, the position where the first glue brushing mechanism 23 brushes glue on the copper frame 81 is defined as the glue brushing position, the position where the moving mechanism 24 absorbs the frame material tray containing the copper frame 81 that has been glued is defined as the transfer position, and the position where the jumper punching and loading device 4 punches the flat strip is defined as the stamping position.

[0067] The first conveying mechanism 22 includes a first linear motor 221 and a first tray 222. The first linear motor 221 is arranged on the mounting platform 1, and the first tray 222 is arranged on the first linear motor 221. The first tray 222 is used to place the frame tray, and is driven by the first linear motor 221 to reciprocate between the copper frame loading position, the first glue brushing position, and the transfer position. The first tray 222 includes a platform seat 2221, a tray 2222, two tray clamps 2223, and two clamp cylinders 2224. The platform seat 2221 is arranged on the first linear motor 221, and the tray 2222 is arranged on the platform seat 2221. The upper surface of the tray 2222 is provided with a positioning hole that cooperates with the structure on the frame tray to position the frame tray. The adjacent two sides of the tray 2222 are provided with guarding edges, and the clamping cylinder 2224 is installed on the lower surface of the two sides of the tray 2222 without guarding edges. The output end of the clamping cylinder 2224 is connected to the tray clamping plate 2223, and the frame tray is clamped or released by the extension and retraction of the clamping cylinder 2224.

[0068] The glue brushing mechanism 23 is used to brush glue on the copper frame 81 located at the glue brushing position, and includes: a mounting frame 231, a glue brushing lifting assembly 232, a glue brushing translation assembly 233, a scraper assembly 234 and a glue brushing plate 235. The mounting frame 231 is fixed on the mounting platform 1, the glue brushing lifting assembly 232 is arranged on the mounting frame 231, and the glue brushing translation assembly 233 and the glue brushing plate 235 are both connected to the glue brushing lifting assembly 232 to achieve vertical movement. The scraper assembly 234 is connected to the glue brushing translation assembly 233, and the scraper of the scraper assembly 234 is located in the glue groove of the glue brushing plate 235. The glue brushing lifting assembly 232 drives the glue brushing translation assembly 233, the glue brushing plate 235 and the scraper assembly 234 to lift and lower together. The glue brushing translation assembly 233 drives the scraper assembly 234 to move back and forth in the glue groove to complete the glue brushing. At the bottom of the glue tank, glue brushing holes are provided at preset positions, and the scraper assembly 234 brushes the glue onto the two pins of the copper frame 81, the source and gate of the first chip 82, and the preset positions of the second chip 83 through the glue brushing holes. In this embodiment, the scraper is a metal scraper made of stainless steel, with a flat blade shape and a sharp scraper edge, and the scraper and the glue brushing plate 235 are arranged at 45° or 135°.

[0069] The glue dispensing mechanism 25 is arranged on the side of the mounting frame 231 away from the glue brushing mechanism 23, and the glue dispensing mechanism includes a detection camera 251, a glue dispensing assembly 252, a distance sensor 253, a camera lifting assembly 254 and a glue dispensing linear motor 255. The glue dispensing linear motor 255 is arranged on the mounting frame 231, and the camera lifting assembly 254 is arranged on the glue dispensing linear motor 255. The detection camera 251, the glue dispensing assembly 252 and the distance sensor 253 are connected to the camera lifting assembly 254 through the glue dispensing mounting seat 256. The glue dispensing assembly 252 is arranged between the detection camera 251 and the distance sensor 253. The detection camera 251 is used to detect whether the glue brushing of the copper frame 81 is qualified, or whether there is a position where the glue is not brushed. The distance sensor 253 measures the distance between the position of the copper frame 81 where glue dispensing is required and the glue dispensing assembly 252. The glue dispensing assembly 252 fills the position of the copper frame 81 that is not brushed with glue or unqualified according to the position detected by the detection camera 251 and the measured distance of the distance sensor 253.

[0070] The material moving mechanism 24 is configured to move the copper frame 81 after the glue coating is completed from the transfer position to the second conveying device 3. The material moving mechanism 24 includes a translation component 241, a lifting component 242 and a grabbing component 243; the lifting component 242 is arranged on the translation component 241, and the grabbing component 243 is arranged on the lifting component 242. The translation component 241 drives the lifting component 242 to translate and then drives the grabbing component 243 to translate.

[0071] The translation assembly 241 includes a translation bracket 2411, a translation base plate 2412, a translation motor 2413, a translation pulley assembly 2414 and two translation guide rails 2415. The translation bracket 2411 is arranged on the mounting platform 1, the translation base plate 2412 is arranged on the translation bracket 2411, and the two translation guide rails 2415 are arranged on the translation base plate 2412 to provide guidance for translation movement. The translation pulley assembly 2414 is located between the two translation guide rails 2415, and includes two pulleys and a synchronous belt connected to the two pulleys. The translation motor 2413 is arranged at one end of the translation base plate 2412 close to the dispensing mechanism 25, the output end of the translation motor 2413 is connected to one of the pulleys in the translation pulley assembly 2414, and the other pulley is arranged at one end of the translation base plate 2412 away from the translation motor 2413. The translation motor 2413 drives the translation pulley assembly 2414 and then drives the lifting assembly 242 to move along the two translation guide rails 2415 .

[0072] The lifting assembly 242 includes a lifting motor 2421, a lifting fixed plate 2422, a lifting screw assembly 2423, a fixing block 2424, and two lifting guide rails 2425. The back of the lifting fixed plate 2422 is connected to the slider of the translation guide rail 2415, and is connected to the synchronous belt through the synchronous belt clamp plate to ensure synchronous movement with the translation assembly 241. The synchronous belt clamp plate includes an upper clamp plate and a lower clamp plate, one end of the upper clamp plate and the lower clamp plate is connected to the lifting fixed plate 2422, and the synchronous belt is fixed between the lifting fixed plates 2422. The lifting motor 2421 is arranged on the upper part of the lifting fixed plate 2422, and the output shaft of the lifting motor 2421 is connected to one end of the lifting screw assembly 2423 through a coupling, and the lifting screw assembly 2423 is fixed to the lifting fixed plate 2422 through a bearing and a bearing seat. The two lifting rails 2425 are respectively arranged on both sides of the lifting screw assembly 2423, the fixing block 2424 is connected to the nut of the lifting screw assembly 2423, and the two ends of the fixing block 2424 are connected to the sliders of the lifting rails 2425. The lifting motor 2421 drives the lifting screw assembly 2423 and then drives the fixing block 2424 to move up and down on the two lifting rails 2425.

[0073] The grabbing assembly 243 includes a connecting beam 2431, an H-shaped plate 2432, and a pneumatic suction cup group 2433 arranged on the H-shaped plate 2432. The connecting beam 2431 is connected to the fixing block 2424, the H-shaped plate 2432 is arranged on the lower surface of the connecting beam 2431, and the pneumatic suction cup group 2433 is arranged on the two vertical sides at both ends of the H-shaped plate 2432.

[0074] The second conveying device 3 has the same structure as the first conveying mechanism 22 and is located on the same straight line as the first conveying mechanism 22. It includes a second linear motor and a second tray. The second tray is used to place the frame tray. The second linear motor drives the second tray and then drives the frame tray to move back and forth between the jumper mounting position and the unloading position. The structure of the second tray is the same as that of the first tray 222 and will not be described in detail here.

[0075] like Figure 9-13 As shown, the jumper wire blanking and feeding device 4 includes a bottom plate 41, a flat belt guide rail mechanism 42 arranged on the bottom plate 41, a jumper wire punching mechanism 43 and a return pipe 44. The flat belt guide rail mechanism 42 is configured to convey the flat belt to the punching position; the jumper wire punching mechanism 43 is configured to punch two different preset positions on the flat belt in sequence, punching each position only once, punching twice in total, thereby forming an independent first jumper wire 84 and a second jumper wire 85 respectively; the return pipe 44 is used to receive the remaining material of the flat belt after punching.

[0076] The flat belt guide mechanism 42 includes: a transmission motor 421, a fixed seat 422, a connecting shaft 423, a positioning ratchet 424, a flat belt guide 425, a sensor 426 and a guide cover 427. The fixed seat 422 is arranged on the bottom plate 41, the fixed end of the transmission motor 421 is connected to the fixed seat 422, the output shaft of the transmission motor 421 is connected to the connecting shaft 423 through a coupling, the connecting shaft 423 is connected to the fixed seat 422 through two supporting plates 428, and the positioning ratchet 424 is sleeved on the connecting shaft 423 and located between the two supporting plates 428. The outer circumference of the positioning ratchet 424 is provided with a positioning pin for matching with the positioning hole on the flat belt. The flat belt guide rail 425 is arranged on the upper surface of the two support plates 428, and the guide rail cover plate 427 covers the upper surface of the flat belt guide rail 425. The guide rail cover plate 427 and the flat belt guide rail 425 together constitute a conveying channel for the flat belt; the sensor 426 is arranged on the flat belt guide rail 425, and is used to detect whether the flat belt exists and confirm the position of the flat belt. The flat belt is located between the flat belt guide rail 425 and the guide rail cover plate 427. With the rotation of the connecting shaft 423, the positioning ratchet 424 cooperates with the positioning hole on the flat belt to achieve stable conveying of the flat belt.

[0077] The flat belt guide rail 425 is provided with a through ratchet hole 4251 and a detection hole 4252 corresponding to the position of the positioning ratchet 424 and the sensor 426. The ratchet hole 4251 is used to ensure that the positioning ratchet 424 is in precise contact with the flat belt, while the detection hole 4252 facilitates the sensor 426 to detect the state of the flat belt. A stepped groove 4253 is also provided on the upper surface of the flat belt guide rail 425 along the moving direction of the flat belt. The guide rail cover 427 covers the upper surface of the flat belt guide rail 425, and a conveying channel is formed between the lower surface of the guide rail cover 427 and the stepped groove 4253. The guide rail cover 427 is provided with an upwardly inclined inclined portion on one side of the flat belt entrance to facilitate the insertion of the flat belt.

[0078] The jumper punching mechanism 43 includes: a punching base 4301, a punching motor 4302, an eccentric assembly 4303, a lower plate 4304, a middle plate 4305, an upper plate 4306, a punch seat 4307, a punch 4308, a die 4309, a material strip clamping plate 4310, a first spring 4311, and a second spring 4312. The punching base 4301 is arranged on the bottom plate 41, the fixed end of the punching motor 4302 is connected to the punching base 4301 through the motor connecting plate 4313, the output shaft of the punching motor 4302 is connected to the eccentric assembly 4303, the eccentric assembly 4303 is connected to the lower plate 4304, and the punch seat 4307 is arranged on the lower plate 4304 and passes through the middle plate 4305. The punch 4308 is arranged on the punch seat 4307; the material strip pressing plate 4310 is arranged on the middle plate 4305, the die 4309 is arranged on the upper plate 4306, and a conveying channel for the flat strip is formed between the die 4309 and the upper plate 4306; a first spring 4311 is arranged between the upper plate 4306 and the middle plate 4305, a second spring 4312 is arranged between the middle plate 4305 and the lower plate 4304, and the lower plate 4304, the middle plate 4305 and the upper plate 4306 are connected near the four corners by four guide columns 4314, and a supporting vertical plate 4315 is also arranged between the stamping base 4301 and the upper plate 4306. The stiffness of the first spring 4311 is less than that of the second spring 4312. Four positioning pins are arranged on the material strip pressing plate 4310 for positioning with the positioning holes of the flat strip.

[0079] The outer contours of the lower plate 4304 and the middle plate 4305 are I-shaped, and the supporting vertical plate 4315 is located at the groove of the I-shaped. A positioning groove is provided on the upper surface of the lower plate 4304 for positioning the punch seat 4307. A limiting groove is provided on the lower surface of the middle plate 4305 for limiting the maximum stroke of the punch seat 4307. A through rectangular hole is also provided on the top surface of the limiting groove, and the punch seat 4307 and the punch 4308 can move up and down in the rectangular hole. A flat belt groove is provided on the upper surface of the upper plate 4306, and a flat belt channel is formed between the die 4309 and the flat belt groove. A through punch hole is also provided at the position corresponding to the flat belt channel on the upper plate 4306, and the punch 4308 moves in the punch hole.

[0080] The eccentric assembly 4303 includes an eccentric wheel, a cam follower and a follower seat. The eccentric wheel is connected to the output shaft of the stamping motor 4302, the eccentric wheel abuts against the cam follower, the cam follower is arranged on the follower seat, and the follower seat is connected to the lower surface of the lower plate 4304.

[0081] The punching motor 4302 drives the eccentric assembly 4303 to rotate, driving the lower plate 4304 to move, and the lower plate 4304 drives the second spring 4312 to move, and then drives the middle plate 4305 to move, so as to achieve the positioning and compression of the flat belt. The punch 4308 moves with the lower plate all the time.

[0082] When the eccentric position of the eccentric wheel of the eccentric assembly 4303 is at the high point, it is the initial position, and the distances between the lower plate 4304, the middle plate 4305, and the upper plate 4306 are the largest. When the stamping motor 4302 drives the eccentric wheel of the eccentric assembly 4303 to rotate 67° from the initial position, the eccentric assembly 4303 drives the lower plate 4304 and the punch 4308 to move up 0.5mm, and the lower plate 4304 drives the second spring 4312 to move and then drives the middle plate 4305 to move up 2mm. At this time, the four positioning pins on the material strip clamping plate 4310 begin to enter the positioning holes of the flat strip, and the positioning of the material strip begins. The stamping motor 4302 continues to drive the eccentric wheel of the eccentric assembly 4303 to rotate 26°, that is, when it rotates 93° from the initial position, the eccentric assembly 4303 drives the lower plate 4304 and the punch 4308 to move up 1mm, and the lower plate 4304 drives the second spring 4312 to move and then drives the middle plate 4305 to move up 4mm. At this time, the four positioning pins on the material belt clamping plate 4310 complete the positioning of the flat belt, and the material belt clamping plate 4310 clamps the flat belt. The stamping motor 4302 continues to drive the eccentric wheel of the eccentric assembly 4303 to rotate 87°, that is, when it rotates 180° from the initial position, the lower plate 4304 and the punch 4308 continue to move upward to perform the punching action of the jumper, and the upward displacement of the punch 4308 reaches the maximum value. In this embodiment, the punching gap is selected to be 0.03mm.

[0083] like Fig.14 As shown, the jumper mounting device 5 includes a chip recognition camera 53 and a jumper mounting assembly. The chip recognition camera 53 is used to identify and locate the position of the gate of the first chip 82 on the second conveyor. The jumper mounting assembly is configured to pick up the first jumper 84 or the second jumper 85, and mount the first jumper 84 with the gate of the first chip 82 and the pin of the copper frame corresponding to the gate, and mount the second jumper 85 with the second chip 83, the source of the first chip 82 and the pin corresponding to the second chip 83. The jumper mounting assembly includes a transverse movement mechanism 51 and a picking mechanism 52 arranged on the transverse movement mechanism 51. The transverse movement mechanism 51 includes a transverse movement fixing frame 511 and a transverse movement linear motor 512. The transverse movement fixing frame 511 is fixed to the mounting platform 1 across the second conveyor 3 and the jumper blanking and feeding device 4. The picking mechanism 52 includes a mounting base plate 521 and a suction assembly 522. The mounting base plate 521 is arranged on the transverse linear motor 512. The suction assembly 522 is arranged on the mounting base plate 521. There are multiple suction heads in the suction assembly 522. The suction heads are configured to rotate 360 ​​degrees around their own axes and move up and down along the axes to realize the positioning of the contacts of the first jumper wire 84 in contact with the gate of the first chip 82.

[0084] When the suction component 522 picks up the first jumper 84, the first jumper 84 is moved to directly above the first chip 82 through the transverse movement mechanism 51, and the chip recognition camera 53 detects the gate position of the first chip 82. The suction head in the suction component 522 rotates to correspond to the gate of the first chip 82 according to the gate position of the first chip 82 detected by the chip recognition camera 53 and the contact position of the first jumper 84 and the gate mounting detected by the image detection mechanism 6, and mounts the first jumper 84 with the gate of the first chip 82 and the pins of the copper frame 81.

[0085] like Figure 2 , Fig.15 As shown, the image detection mechanism 6 is located between the jumper blanking and feeding device 4 and the second conveying device 3. The image detection mechanism 6 is used to identify the contact point where the first jumper 84 contacts the gate of the first chip 82, and includes a light source assembly 61, a camera 62, a reflector assembly 63 and a camera bracket 64. The camera 62 is arranged on the camera bracket 64, and the reflector assembly 63 is arranged opposite to the camera 62. The reflector assembly 63 includes a reflector frame and a reflector, and the reflector is arranged at 45 degrees to the camera 62. A light-transmitting hole is provided on the reflector frame, the light source assembly 61 is connected to the camera bracket 64, and the light source of the light source assembly 61 is illuminated on the reflector of the reflector assembly 63, and the imaging of the camera 62 is realized through the reflector.

[0086] The unloading mechanism 7 unloads the processed semiconductor device 8. The unloading mechanism 7 has the same structure as the frame loading mechanism 21, and will not be described in detail here.

[0087] A method for copper sheet bonding and assembly of a conductor device is implemented by using the copper sheet bonding device for punching and feeding the semiconductor device. The semiconductor device includes a copper frame 81, a first chip 82, a second chip 83, a first jumper 84 and a second jumper 85. The specific steps are as follows:

[0088] S1. Place the copper frame 81 mounted with the first chip 82 and the second chip 83 on the frame tray, and place the frame tray with the copper frame 81 on the frame loading mechanism 21 of the tray loading and gluing device 2.

[0089] S2. The frame loading mechanism 21 places the frame tray on the first tray 222 of the first conveying mechanism 22 of the tray loading and gluing device 2, and the first conveying mechanism 22 conveys the frame tray to the glue brushing position, and the glue brushing mechanism 23 of the tray loading and gluing device 2 brushes glue on the two pins of the copper frame 81, the source and gate of the first chip 82, and the preset position of the second chip 83.

[0090] S3. The first conveying mechanism 22 transports the copper frame 81, the first chip 82 and the second chip 83 that have been brushed with glue to the position of the glue dispensing mechanism 25 of the material tray loading and glue coating device 2; the glue dispensing component 252 of the glue dispensing mechanism 25 fills the two pins of the copper frame 81, the source and gate of the first chip 82 and the unbrushed or unqualified positions of the second chip 83 with glue according to the unqualified positions detected by the detection camera 251 of the glue dispensing mechanism 25 and the measured distance of the distance measuring sensor 253 of the glue dispensing mechanism 25, and the first conveying mechanism 22 transports the copper frame 81, the first chip 82 and the second chip 83 that have been filled with glue to the transfer position.

[0091] S4. The material transfer mechanism 24 of the tray loading and gluing device 2 moves the frame tray containing the glue-filled first chip 82, the second chip 83 and the copper frame 81 from the transfer position to the second conveying device 3.

[0092] S5. The flat belt guide mechanism 42 conveys the flat belt to the punching position; then, the jumper punching mechanism 43 punches two different preset positions on the flat belt in sequence, punching each position only once, and punching twice in total, thereby forming independent first jumper wires 84 and second jumper wires 85, respectively.

[0093] S6. The jumper mounting device 5 picks up the first jumper 84 and moves it to the image detection mechanism 6. The image detection mechanism 6 identifies the contact points of the first jumper 84 and the gate of the first chip 82, and mounts the first jumper 84 to the gate of the first chip 82 and the pins of the copper frame 81 corresponding to the gate of the first chip 82.

[0094] S7 . The jumper mounting device 5 picks up the second jumper 85 , and mounts the second jumper 85 to the second chip 83 , the source of the first chip 82 , and the pins of the copper frame 81 corresponding to the second chip 83 .

[0095] S8. The second conveying device 3 conveys the mounted semiconductor device 8 to the unloading mechanism 7.

[0096] S9. The unloading mechanism 7 performs unloading.

[0097] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A copper sheet bonding device for punching and feeding semiconductor devices, characterized in that: include: Installation platform (1); A material tray loading and glue coating device (2) is arranged on the mounting platform (1); the material tray loading and glue coating device (2) is configured to provide a copper frame (81) on which a first chip (82) and a second chip (83) are mounted, and to apply glue to two pins of the copper frame (81), a source electrode of the first chip (82) and a preset position of the second chip (83), and to dispense glue to a gate electrode of the first chip (82), and to transport the processed first chip (82), the second chip (83) and the copper frame (81) to the next process; A second conveying device (3), the second conveying device (3) comprising a second linear motor and a second tray, the second tray being used to carry a frame tray, the frame tray being provided with the copper frame (81), the first chip (82) and the second chip (83); the second linear motor drives the second tray and thereby drives the frame tray to reciprocate between a jumper mounting position and a material unloading position; A jumper wire punching and feeding device (4), the jumper wire punching and feeding device (4) comprising a base plate (41), a flat strip guide rail mechanism (42) arranged on the base plate (41), a jumper wire punching mechanism (43) and a return pipe (44), the flat strip guide rail mechanism (42) being configured to convey the flat strip to a punching position; the jumper wire punching mechanism (43) being configured to punch two different preset positions on the flat strip in sequence, thereby respectively forming an independent first jumper wire (84) and a second jumper wire (85); the return pipe (44) being used to receive the remaining material of the flat strip after punching; A jumper wire mounting device (5), the jumper wire mounting device (5) comprising a chip recognition camera (53) and a jumper wire mounting component; the chip recognition camera (53) is used to identify and locate the position of the gate on the second conveying device (3); the jumper wire mounting component is configured to pick up the first jumper wire (84) or the second jumper wire (85), and mount the first jumper wire (84) to the gate and the pin corresponding to the gate, and to mount the second jumper wire (85) to the second chip (83), the source and the pin corresponding to the second chip (83); An image detection mechanism (6), the image detection mechanism (6) being located between the jumper wire blanking and feeding device (4) and the second conveying device (3); the image detection mechanism (6) being used to identify the position of the contact point where the first jumper wire (84) picked up by the jumper wire mounting component contacts the gate; A material unloading mechanism (7); the material unloading mechanism (7) unloads the mounted copper frame (81), the first chip (82), the second chip (83), the first jumper wire (84) and the second jumper wire (85).

2. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 1, characterized in that: The tray feeding and gluing device (2) comprises: A first conveying mechanism (22) comprises a first linear motor (221) and a first tray (222), wherein the first tray (222) is used to carry the frame material tray, and the copper frame (81) is placed on the frame material tray; the first linear motor (221) drives the first tray (222) and thereby drives the frame material tray to reciprocate between a frame loading position, a glue brushing position, a glue dispensing position and a transfer position; A frame loading mechanism (21) configured to place the frame tray containing the copper frame (81), the first chip (82) and the second chip (83) onto the first tray (222); A glue brushing mechanism (23) is arranged at the glue brushing position and is configured to brush glue on two pins of the copper frame (81), the source electrode of the first chip (82) and a preset position of the second chip (83); a glue dispensing mechanism (25), arranged on the glue brushing mechanism (23) and away from the frame feeding mechanism (21), the glue dispensing mechanism (25) being configured to dispense glue on the gate of the first chip (82); The material transfer mechanism (24) is arranged at the transfer position and is configured to move the frame material tray containing the first chip (82) and the second chip (83) that have been glued and dispensed, and the copper frame (81) from the transfer position to the second conveying device (3).

3. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 2, characterized in that: The frame feeding mechanism (21) comprises: Support frame (211); A mounting seat (212) is arranged on the supporting frame (211); The motor (213) is fixed on the mounting seat (212) via a motor mounting plate A movable plate (214) connected to the mounting seat (212) via four first pillars (215); A lead screw (216), one end of which is connected to the movable plate (214), and the other end of which passes through the mounting seat (212) and is connected to the output shaft of the motor (213) via a synchronous pulley assembly, for transmitting power to achieve lifting motion; A lifting plate (217), the lifting plate (217) being located between the moving plate (214) and the mounting seat (212), being connected to the four first pillars (215) via a first self-lubricating bearing, and being connected to the nut of the lead screw (216), and being moved up and down on the four first pillars (215) as the lead screw (216) rotates; Two fixed plates (218) are connected to the lifting plate (217) via four second pillars (219); the movable plate (214) is connected to the four second pillars (219) via a second self-lubricating bearing; Four material bins (2110), arranged vertically in pairs on the inner side of each of the fixing plates (218) to form a rectangular shape, for accommodating the frame material trays; Two material discharge assemblies (2111), each comprising a cylinder (2112), a push plate (2113), two linear guide rails (2114) and two material discharge plates (2115); the cylinder (2112) is arranged on the fixed plate (218); the push plate (2113) is connected to the output end of the cylinder (2112); the two linear guide rails (2114) are arranged on the fixed plate (218) and are located on both sides of the cylinder (2112); the two material discharge plates (2115) are arranged at both ends of the push plate (2113) and are connected to the sliders of the two linear guide rails (2114) to realize the storage and discharge of the frame material tray; The motor (213) drives the lead screw (216) to rotate, and drives the four second pillars (219) to move up and down through the lifting plate (217), thereby driving the fixed plate (218) to move up and down, so that when the lifting plate (217) is at the highest point, the cylinder (2112) extends to make the frame material tray located on the discharge plate (2115); and when the lifting plate (217) is at the lowest point, the cylinder (2112) drives the discharge plate (2115) to retract to make the frame material tray located on the first tray (222).

4. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 2, characterized in that: The glue brushing mechanism (23) comprises: a mounting frame (231), a glue brushing lifting assembly (232), a glue brushing translation assembly (233), a scraper assembly (234) and a glue brushing plate (235); the mounting frame (231) is fixed on the mounting platform (1); the glue brushing lifting assembly (232) is arranged on the mounting frame (231); the glue brushing translation assembly (233) and the glue brushing plate (235) are both connected to the glue brushing lifting assembly (232) via the glue brushing mounting plate. The scraper assembly (234) is connected to the glue brushing translation assembly (233), and the scraper of the scraper assembly (234) is located in the glue groove of the glue brushing plate (235); glue brushing holes are provided at preset positions at the bottom of the glue groove, and the scraper assembly (234) brushes glue onto the two pins of the copper frame (81), the source and gate of the first chip (82), and the preset positions of the second chip (83) through the glue brushing holes.

5. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 4, characterized in that: The glue dispensing mechanism (25) is arranged on the mounting frame (231) away from the glue brushing mechanism (23); the glue dispensing mechanism (25) is configured to identify and locate the gate of the first chip (82), measure the vertical distance between the glue dispensing mechanism (25) and the gate, and dispense glue to the gate.

6. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 2, characterized in that: The material transfer mechanism (24) comprises a translation component (241), a lifting component (242) and a gripping component (243); the gripping component (243) is arranged on the lifting component (242); the translation component (241) drives the lifting component (242) to translate and thereby drives the gripping component (243) to move; the gripping component (243) comprises an H-shaped plate (2432) and a pneumatic suction cup group (2433) arranged on the H-shaped plate (2432); the pneumatic suction cup group (2433) is arranged on two vertical sides of the H-shaped plate (2432).

7. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 1, characterized in that: The flat belt guide rail mechanism (42) comprises: a transmission motor (421), a fixing seat (422), a connecting shaft (423), a positioning ratchet (424), a flat belt guide rail (425), a sensor (426) and a guide rail cover plate (427); the fixing seat (422) is arranged on the bottom plate (41); the fixed end of the transmission motor (421) is connected to the fixing seat (422); the output shaft of the transmission motor (421) is connected to the connecting shaft (423) via a coupling; the connecting shaft (423) is connected to the fixing seat (422) via two supporting plates (428); the positioning ratchet (424) is sleeved on the connecting shaft (423) and is located between the two supporting plates (428); 8); the outer circumference of the positioning ratchet (424) is provided with a positioning pin for cooperating with the positioning hole on the flat belt; the flat belt guide rail (425) is arranged on the upper surface of the two support plates (428); the guide rail cover plate (427) covers the upper surface of the flat belt guide rail (425), and together with the flat belt guide rail (425) constitutes a conveying channel for the flat belt; the sensor (426) is arranged on the flat belt guide rail (425) for detecting the presence of the flat belt and confirming the position of the flat belt; the flat belt is located in the conveying channel, and as the connecting shaft (423) rotates, the positioning ratchet (424) cooperates with the positioning hole on the flat belt to achieve stable conveying of the flat belt; The jumper punching mechanism (43) comprises: a punching base (4301), a punching motor (4302), an eccentric assembly (4303), a lower plate (4304), a middle plate (4305), an upper plate (4306), a punch seat (4307), a punch (4308), a die (4309), a material strip clamping plate (4310), a first spring (4311) and a second spring (4312); the punching base (4301) 301) is arranged on the bottom plate (41), the fixed end of the stamping motor (4302) is connected to the stamping base (4301) through a motor connecting plate (4313), the output shaft of the stamping motor (4302) is connected to the eccentric component (4303), the eccentric component (4303) is connected to the lower plate (4304), the punch seat (4307) is arranged on the lower plate (4304), and The flat belt is passed through the middle plate (4305); the punch (4308) is arranged on the punch seat (4307); the material belt pressing plate (4310) is arranged on the middle plate (4305), the die (4309) is arranged on the upper plate (4306), and a conveying channel for the flat belt is formed between the die (4309) and the upper plate (4306); the upper plate (4306) and the middle plate A first spring (4311) is provided between the plates (4305), a second spring (4312) is provided between the middle plate (4305) and the lower plate (4304), the lower plate (4304), the middle plate (4305) and the upper plate (4306) are connected via four guide columns (4314), and a supporting vertical plate (4315) is further provided between the stamping base (4301) and the upper plate (4306).

8. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 7, characterized in that: The jumper wire mounting assembly comprises a transverse movement mechanism (51) and a picking mechanism (52) arranged on the transverse movement mechanism (51), the transverse movement mechanism (51) comprises a transverse movement fixing frame (511) and a transverse movement linear motor (512), the transverse movement fixing frame (511) straddles the second conveying device (3) and the jumper wire punching and feeding device (4) and is fixed to the mounting platform (1); the picking mechanism (52) comprises a mounting base plate (521) and a suction assembly (522), the mounting base plate (521) is arranged on the transverse movement linear motor (512), the suction assembly (522) is arranged on the mounting base plate (521), the suction assembly (522) has a plurality of suction heads, and the suction heads are configured to be rotatable 360 ​​degrees around their own axes and to be movable up and down along the axes, so as to realize the positioning of the contacts of the first jumper wire (84).

9. The copper sheet bonding equipment for punching and feeding semiconductor devices according to claim 8, characterized in that: The unloading mechanism (7) has the same structure as the frame loading mechanism (21) and is used to unload mounted semiconductor devices (8).

10. A method for assembling copper sheet bonding of a semiconductor device, implemented by using the copper sheet bonding equipment for punching and loading semiconductor devices according to any one of claims 1 to 9, wherein the semiconductor device (8) comprises a copper frame (81), a first chip (82), a second chip (83), a first jumper (84) and a second jumper (85); characterized in that: The specific steps are as follows: S1. placing the copper frame (81) mounted with the first chip (82) and the second chip (83) on a frame tray, and placing the frame tray with the copper frame (81) on the frame loading mechanism (21) of the tray loading and gluing device (2); S2. The frame feeding mechanism (21) places the frame material tray on the first tray of the first conveying mechanism (22) of the material tray feeding and gluing device (2), and the first conveying mechanism (22) conveys the frame material tray to the glue brushing position, and the glue brushing mechanism (23) of the material tray feeding and gluing device (2) brushes glue on the two pins of the copper frame (81), the source and gate of the first chip (82), and the preset position of the second chip (83); S3. The first conveying mechanism (22) conveys the copper frame (81), the first chip (82) and the second chip (83) that have been brushed with glue to the position of the glue dispensing mechanism (25) of the material tray loading and glue coating device (2); the glue dispensing component (252) of the glue dispensing mechanism (25) performs glue repair on the copper frame (81), the source and gate of the first chip (82) and the unqualified positions of the second chip (83) according to the unqualified positions detected by the detection camera (251) of the glue dispensing mechanism (25) and the measured distance of the distance measuring sensor (253) of the glue dispensing mechanism (25), and the first conveying mechanism (22) conveys the copper frame (81), the first chip (82) and the second chip (83) that have been brushed with glue to the transfer position; S4. The material transfer mechanism (24) of the material tray loading and gluing device (2) moves the first chip (82), the second chip (83) and the copper frame (81) that have been glued from the transfer position to the second conveying device (3); S5. The flat belt guide mechanism (42) conveys the flat belt to the punching position; then, the jumper punching mechanism (43) punches two different preset positions on the flat belt in sequence, punching each position only once, and punching twice in total, thereby forming the first jumper (84) and the second jumper (85) independently; S6. The jumper mounting device (5) picks up the first jumper (84) and moves it to the image detection mechanism (6); the image detection mechanism (6) identifies the contact point between the first jumper (84) and the gate, and mounts the first jumper (84) to the gate of the first chip (82) and the pin of the copper frame (81) corresponding to the gate of the first chip (82); S7. The jumper mounting device (5) picks up the second jumper (85), and mounts the second jumper (85) to the second chip (83), the source and gate of the first chip (82), and the pins of the copper frame (81) corresponding to the second chip (83); S8. The second conveying device (3) conveys the mounted semiconductor device (8) to the unloading mechanism (7); S9. The material unloading mechanism (7) performs unloading.

Images