Wafer table structure automatic external inspection machine

Abstract

The present invention discloses an automatic external inspection machine of a wafer table structure, which relates to the field of wafer detection technology, including a detection table, a three-axis slide table is installed on the top of the detection table, a detection probe is installed on the three-axis slide table, the top of the detection table is slidably connected to two detection seats, a connecting seat is fixedly connected between the two detection seats, a wafer is fixed on the detection seat by a fixing mechanism, and the detection seat is moved by a switching mechanism. The present invention sets a fixing mechanism and a switching mechanism, when a wafer is located on the detection seat for detection, the next wafer can be fixed on another detection seat, after the wafer detection is completed, the detection seat and the connecting seat are pushed to move, the wafer on the other detection seat is detected, and the fixation of the detected wafer is automatically released at the same time, which is convenient for replacing the wafer, facilitating the detection of the wafer, and improving the detection efficiency of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of wafer detection, in particular to a wafer table structure automatic external inspection machine. Background Art

[0002] Transient voltage suppressor diode, referred to as TVS diode, is a high-efficiency protection device in the form of a diode. At present, the production of TVS wafers usually uses silicon nitride to replace lead-containing glass, thereby making lead-free and environmentally friendly TVS wafers. When producing lead-free and environmentally friendly TVS wafers, it is necessary to detect the appearance indicators such as the table depth of the wafer. This process requires the wafer to be fixed on the test table and the detection operation to be performed through the detection probe; however, when testing the next wafer, it is necessary to cancel the fixation of the previous wafer, remove it and place a new wafer, and then fix the newly placed wafer. This method reduces the efficiency of wafer detection. In order to achieve the purpose of improving the efficiency of wafer detection, an automatic external inspection machine for the table structure of the wafer is provided. Summary of the invention

[0003] The purpose of the present invention is to provide a wafer table-structured automatic external inspection machine in order to achieve the purpose of improving wafer inspection efficiency.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer table structure automatic external inspection machine, comprising a detection table, a three-axis slide table is installed on the top of the detection table, a detection probe is installed on the three-axis slide table, two detection seats are slidably connected to the top of the detection table, a connecting seat is fixedly connected between the two detection seats, a wafer is fixed on the detection seat by a fixing mechanism, and the detection seat is moved by a switching mechanism;

[0005] The fixing mechanism includes a placement slot, which is opened at the top of the detection seat, and the inner wall of the placement slot is provided with a guide slot, the inner wall of the guide slot is slidably connected with a clamping rod, the bottom end of the clamping rod is rotatably connected with a connecting rod, one end of the connecting rod is rotatably connected with a rotating disk, and the bottom end of the rotating disk is rotatably connected with a ratchet, the interior of the detection seat is provided with a rotating slot for the ratchet to rotate, the bottom end of the ratchet is fixedly connected with a supporting shaft, the support shaft is rotatably connected to the detection seat, the outer wall of the support shaft between the ratchet and the rotating slot is connected with a torsion spring, the interior of the detection seat is slidably connected with a clamping block on one side of the ratchet, the clamping block is connected with a first spring between the detection seat, the outer wall of the detection seat is rotatably connected with a rotating column, one end of the rotating column is fixedly connected with a bevel gear, and the bevel gear contacts the rotating disk.

[0006] As a further solution of the present invention: the switching mechanism includes a movable groove, the movable groove is opened at the top of the detection platform, the bottom of the movable groove is provided with a displacement groove, the detection seat and the connecting seat are located in the movable groove, and fixed grooves are symmetrically opened on both sides of the movable groove, the top of the connecting seat is fixedly connected to a fixed seat, the interior of the fixed seat is slidably connected to a lower pressure block extending to the top of the fixed seat, the bottom end of the lower pressure block is fixedly connected to a second spring, the interior of the fixed seat is located on both sides of the lower pressure block and is rotatably connected to a first spur gear, and the outer wall of the first spur gear is fixedly connected to a fixing rod extending from the fixed seat.

[0007] As a further solution of the present invention: the switching mechanism also includes a mounting seat, the mounting seat is fixedly connected to the bottom end of the displacement slot, the mounting seat is internally slidably connected with a slide plate extending to the top of the mounting seat, the slide plate is extended out of the mounting seat on one side and is provided with an inclined surface, a third spring is connected between the slide plate and the mounting seat, a groove is provided at the bottom end of the detection seat, a rotating rod is rotatably connected to one end of the inner wall of the groove, a second spur gear is fixedly connected to the top of the rotating rod, and a push frame is slidably connected to the top of the second spur gear inside the detection seat.

[0008] As a further solution of the present invention: four guide grooves are provided and are equidistantly distributed on the inner wall of the placement groove, and the inner wall of the guide groove fits with the outer wall of the clamping rod.

[0009] As a further solution of the present invention: the outer wall of the rotating disk is provided with gear teeth, and the gear teeth are meshed with the bevel gear.

[0010] As a further solution of the present invention: the inner wall of the movable groove is in contact with the outer walls of the detection seat and the connecting seat, and the inner wall of the fixed groove is in contact with the outer wall of the fixing rod.

[0011] As a further solution of the present invention: first tooth grooves are formed on both sides of the lower pressing block, and the first tooth grooves are meshed with the first spur gears.

[0012] As a further solution of the present invention: the rotating rod is connected to the groove via a rotating shaft, and the second spur gear and the rotating shaft are at the same axial position.

[0013] As a further solution of the present invention: a second tooth groove is provided at the bottom end of the pushing frame, and the second tooth groove is meshed with the second spur gear.

[0014] As a further solution of the present invention: the outer walls of the pushing frame and the clamping block are both L-shaped, and the bottom of the clamping block is in contact with the top of the pushing frame.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] By setting up a fixing mechanism and a switching mechanism, when a wafer is located on the detection seat for detection, the next wafer can be fixed on another detection seat. After the wafer detection is completed, the detection seat and the connecting seat are pushed to move to detect the wafer on the other detection seat. At the same time, the fixation of the wafer after detection is automatically released, which is convenient for wafer replacement and wafer detection, thereby improving the detection efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the present invention;

[0018] Figure 2 It is a structural schematic diagram of the detection seat and the connection seat of the present invention;

[0019] Figure 3 It is a schematic diagram of the internal structure of the detection seat of the present invention;

[0020] Figure 4 It is a schematic diagram of the installation structure of the rotating disk of the present invention;

[0021] Figure 5 It is a schematic diagram of the internal structure of the detection seat of the present invention;

[0022] Figure 6 It is a schematic diagram of the internal structure of the fixing base of the present invention;

[0023] Figure 7 It is a schematic diagram of the internal structure of the mounting base of the present invention;

[0024] Figure 8 It is a schematic diagram of the installation structure of the rotating rod of the present invention.

[0025] In the figure: 1. detection table; 2. three-axis slide; 3. detection probe; 4. detection seat; 5. connecting seat; 6. fixing mechanism; 601. placement slot; 602. guide slot; 603. clamping rod; 604. connecting rod; 605. rotating disk; 606. ratchet; 607. rotating slot; 608. supporting shaft; 609. torsion spring; 610. clamping block; 611. first spring; 612. bevel gear; 613. rotating column; 7. switching mechanism; 701. movable slot; 702. displacement slot; 703. fixing slot; 704. fixing seat; 705. pressing block; 706. second spring; 707. first spur gear; 708. fixing rod; 709. mounting seat; 710. slide plate; 711. third spring; 712. groove; 713. rotating rod; 714. second spur gear; 715. pushing frame. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of its embodiments based on the overall structure of the present invention.

[0028] See also Figures 1 to 8In an embodiment of the present invention, a wafer table structure automatic external inspection machine includes a detection table 1, a three-axis slide table 2 is installed on the top of the detection table 1, a detection probe 3 is installed on the three-axis slide table 2, the top of the detection table 1 is slidably connected to two detection seats 4, a connecting seat 5 is fixedly connected between the two detection seats 4, the wafer is fixed on the detection seat 4 by a fixing mechanism 6, the detection seat 4 is moved by a switching mechanism 7, the fixing mechanism 6 includes a placement groove 601, the placement groove 601 is opened at the top of the detection seat 4, the inner wall of the placement groove 601 is opened with a guide groove 602, the inner wall of the guide groove 602 is slidably connected with a clamping rod 603, the bottom end of the clamping rod 603 is rotatably connected with a connecting rod 604, and one end of the connecting rod 604 is rotatably connected There is a rotating disk 605, the bottom end of which is rotatably connected to a ratchet 606, a rotating groove 607 for the ratchet 606 to rotate is provided inside the detection seat 4, the bottom end of the ratchet 606 is fixedly connected to a support shaft 608, the support shaft 608 is rotatably connected to the detection seat 4, a torsion spring 609 is connected to the outer wall of the support shaft 608 between the ratchet 606 and the rotating groove 607, a clamping block 610 is slidably connected to one side of the ratchet 606 inside the detection seat 4, a first spring 611 is connected between the clamping block 610 and the detection seat 4, the outer wall of the detection seat 4 is rotatably connected to a rotating column 613, one end of the rotating column 613 is fixedly connected to a bevel gear 612, and the bevel gear 612 is in contact with the rotating disk 605.

[0029] In this embodiment: when fixing the wafer, the wafer is placed in the inner cavity of the placement groove 601, and then the rotating column 613 is rotated. The rotation of the rotating column 613 drives the bevel gear 612 to rotate, and the rotation of the bevel gear 612 drives the rotating disk 605 to rotate. The rotating disk 605 rotates and drives the clamping rod 603 to move through the connecting rod 604. The clamping rod 603 slides in the guide groove 602, and the clamping rod 603 clamps and fixes the wafer. At the same time, the rotating disk 605 rotates to drive the ratchet 606 to rotate, causing the torsion spring 609 to twist. The clamping block 610 is engaged with the ratchet 606 under the elastic force of the first spring 611, thereby fixing the rotating disk 605 to prevent the wafer from loosening.

[0030] Please refer to Figures 5 to 8The switching mechanism 7 includes a movable groove 701, which is arranged at the top of the detection platform 1, and a displacement groove 702 is arranged at the bottom of the movable groove 701. The detection seat 4 and the connecting seat 5 are located in the movable groove 701. Fixed grooves 703 are symmetrically arranged on both sides of the movable groove 701. The top of the connecting seat 5 is fixedly connected to a fixed seat 704. The interior of the fixed seat 704 is slidably connected to a lower pressing block 705 extending above the fixed seat 704. The bottom end of the lower pressing block 705 is fixedly connected to a second spring 706. The interior of the fixed seat 704 is located on both sides of the lower pressing block 705 and is rotatably connected to a first straight gear 707. The outer wall of the first straight gear 707 is fixedly connected to a fixed spring extending out of the fixed seat. The switching mechanism 7 also includes a mounting seat 709, which is fixedly connected to the bottom end of the displacement slot 702. The mounting seat 709 is internally slidably connected with a slide plate 710 extending to the top of the mounting seat 709. A slope is provided on one side of the slide plate 710 extending out of the mounting seat 709. A third spring 711 is connected between the slide plate 710 and the mounting seat 709. A groove 712 is provided at the bottom end of the detection seat 4. A rotating rod 713 is rotatably connected to one end of the inner wall of the groove 712. A second spur gear 714 is fixedly connected to the top of the rotating rod 713. A push frame 715 is slidably connected to the top of the second spur gear 714 inside the detection seat 4.

[0031] In this embodiment: when it is necessary to move the detection seat 4 and the connecting seat 5, the lower pressing block 705 is pushed to be displaced, causing the second spring 706 to be squeezed. The displacement of the lower pressing block 705 drives the first spur gear 707 to rotate, and the rotation of the first spur gear 707 drives the fixing rod 708 to rotate. The fixing rod 708 rotates out of the fixing groove 703, canceling the fixation of the connecting seat 5. At this time, the detection seat 4 and the connecting seat 5 can be pushed to slide in the displacement groove 702. After the movement is completed, the lower pressing block 705 is released, and the lower pressing block 705 is reset by the elastic force of the second spring 706, thereby driving the fixing rod 708 to rotate into the fixing groove 703, thereby fixing the positions of the detection seat 4 and the connecting seat 5.

[0032] When the detection seat 4 moves from one end of the movable groove 701 toward the position of the detection probe 3, the rotating rod 713 is located at one end of the groove 712 and can only rotate in one direction. The rotating rod 713 contacts the inclined surface of the slide plate 710, pushing the slide plate 710 to move into the mounting seat 709; when the detection seat 4 moves from the middle position of the movable groove 701 to one end, the rotating rod 713 contacts the slide plate 710, and the rotating rod 713 is forced to rotate. The rotation of the rotating rod 713 drives the second spur gear 714 to rotate, and the rotation of the second spur gear 714 drives the pushing frame 715 to move. The displacement of the pushing frame 715 drives the card block 610 to move, thereby releasing the fixation of the ratchet 606. The ratchet 606 rotates and resets under the torsion of the torsion spring 609. The rotation of the ratchet 606 drives the rotating disk 605 to rotate. The rotation of the rotating disk 605 drives the clamping rod 603 to move and reset, automatically releasing the fixation of the wafer.

[0033] When a wafer is placed on the detection seat 4 for detection, the next wafer can be fixed on another detection seat 4. After the wafer detection is completed, the detection seat 4 and the connecting seat 5 are pushed to move, and the wafer on the other detection seat 4 is detected, and the fixation of the wafer after the detection is automatically released. The present invention can conveniently clamp and fix the wafer and replace it, and improves the detection efficiency when the wafer is detected.

[0034] Please refer to Figures 1 to 4 Four guide grooves 602 are provided and are equidistantly distributed on the inner wall of the placement groove 601 . The inner wall of the guide groove 602 fits with the outer wall of the clamping rod 603 . The outer wall of the rotating disk 605 is provided with gear teeth, which mesh with the bevel gear 612 .

[0035] In this embodiment: the rotating column 613 is rotated, the rotating column 613 rotates to drive the bevel gear 612 to rotate, the bevel gear 612 rotates to drive the rotating disk 605 to rotate, the rotating disk 605 rotates to drive the clamping rod 603 to move through the connecting rod 604, the clamping rod 603 slides in the guide groove 602, and the clamping rod 603 clamps and fixes the wafer.

[0036] Please refer to Figures 5 to 8 The inner wall of the movable groove 701 is in contact with the outer walls of the detection seat 4 and the connecting seat 5, the inner wall of the fixed groove 703 is in contact with the outer wall of the fixed rod 708, and the first tooth grooves are provided on both sides of the lower pressing block 705, and the first tooth grooves are meshed with the first spur gear 707.

[0037] In this embodiment: the lower pressing block 705 is pushed to move, causing the second spring 706 to be squeezed. The displacement of the lower pressing block 705 drives the first spur gear 707 to rotate. The rotation of the first spur gear 707 drives the fixing rod 708 to rotate. The fixing rod 708 rotates out of the fixing groove 703, canceling the fixation of the connecting seat 5.

[0038] Please refer to Figures 5 to 8 The rotating rod 713 is connected to the groove 712 through the rotating shaft, the second spur gear 714 and the rotating shaft are at the same axial position, the bottom end of the pushing frame 715 is provided with a second tooth groove, the second tooth groove is meshed with the second spur gear 714, the outer wall shape of the pushing frame 715 and the block 610 are both L-shaped, and the bottom of the block 610 is in contact with the top of the pushing frame 715.

[0039] In this embodiment: when the detection seat 4 moves from one end of the movable groove 701 toward the position of the detection probe 3, the rotating rod 713 is located at one end of the groove 712 and can only rotate in one direction. The rotating rod 713 contacts the inclined surface of the slide plate 710, pushing the slide plate 710 to move into the mounting seat 709; when the detection seat 4 moves from the middle position of the movable groove 701 to one end, the rotating rod 713 contacts the slide plate 710, and the rotating rod 713 is forced to rotate. The rotation of the rotating rod 713 drives the second spur gear 714 to rotate, and the rotation of the second spur gear 714 drives the pushing frame 715 to move. The displacement of the pushing frame 715 drives the block 610 to move, thereby releasing the fixation of the ratchet 606.

[0040] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer table structure automatic external inspection machine, comprising a detection table (1), a three-axis slide table (2) is installed on the top of the detection table (1), and a detection probe (3) is installed on the three-axis slide table (2), characterized in that: The top of the detection platform (1) is slidably connected to two detection seats (4), a connecting seat (5) is fixedly connected between the two detection seats (4), the wafer is fixed on the detection seat (4) by a fixing mechanism (6), and the detection seat (4) is moved by a switching mechanism (7); The fixing mechanism (6) comprises a placement groove (601), the placement groove (601) is arranged at the top end of the detection seat (4), the inner wall of the placement groove (601) is provided with a guide groove (602), the inner wall of the guide groove (602) is slidably connected with a clamping rod (603), the bottom end of the clamping rod (603) is rotatably connected with a connecting rod (604), one end of the connecting rod (604) is rotatably connected with a rotating disk (605), the bottom end of the rotating disk (605) is rotatably connected with a ratchet (606), the inside of the detection seat (4) is provided with a rotating groove (607) for the ratchet (606) to rotate, and the bottom end of the ratchet (606) is fixedly connected with A support shaft (608) is rotatably connected to the detection seat (4); a torsion spring (609) is connected to the outer wall of the support shaft (608) between the ratchet (606) and the rotating groove (607); a clamping block (610) is slidably connected to one side of the ratchet (606) inside the detection seat (4); a first spring (611) is connected between the clamping block (610) and the detection seat (4); a rotating column (613) is rotatably connected to the outer wall of the detection seat (4); one end of the rotating column (613) is fixedly connected to a bevel gear (612); and the bevel gear (612) is in contact with the rotating disk (605).

2. The wafer table structure automatic external inspection machine according to claim 1, characterized in that: The switching mechanism (7) comprises a movable groove (701), wherein the movable groove (701) is provided at the top of the detection platform (1), and a displacement groove (702) is provided at the bottom of the movable groove (701), wherein the detection seat (4) and the connecting seat (5) are located in the movable groove (701), and fixed grooves (703) are symmetrically provided on both sides of the movable groove (701), and a fixed seat (704) is fixedly connected to the top of the connecting seat (5), and a lower pressing block (705) extending to the top of the fixed seat (704) is slidably connected inside the fixed seat (704), and a second spring (706) is fixedly connected to the bottom of the lower pressing block (705), and a first spur gear (707) is rotatably connected inside the fixed seat (704) and located on both sides of the lower pressing block (705), and a fixing rod (708) extending from the fixed seat (704) is fixedly connected to the outer wall of the first spur gear (707).

3. The wafer table structure automatic external inspection machine according to claim 2, characterized in that: The switching mechanism (7) further comprises a mounting seat (709), wherein the mounting seat (709) is fixedly connected to the bottom end of the displacement groove (702), a slide plate (710) extending to the top of the mounting seat (709) is slidably connected inside the mounting seat (709), a side of the slide plate (710) extending out of the mounting seat (709) is provided with an inclined surface, a third spring (711) is connected between the slide plate (710) and the mounting seat (709), a groove (712) is provided at the bottom end of the detection seat (4), a rotating rod (713) is rotatably connected to one end of the inner wall of the groove (712), a second spur gear (714) is fixedly connected to the top end of the rotating rod (713), and a pushing frame (715) is slidably connected to the top end of the second spur gear (714) inside the detection seat (4).

4. The wafer table structure automatic external inspection machine according to claim 1, characterized in that: The guide grooves (602) are provided with four and are equidistantly distributed on the inner wall of the placement groove (601). The inner wall of the guide groove (602) fits the outer wall of the clamping rod (603).

5. The wafer table structure automatic external inspection machine according to claim 1, characterized in that: The outer wall of the rotating disk (605) is provided with gear teeth, and the gear teeth are meshed with the bevel gear (612).

6. The wafer table structure automatic external inspection machine according to claim 3, characterized in that: The inner wall of the movable groove (701) fits with the outer walls of the detection seat (4) and the connection seat (5), and the inner wall of the fixed groove (703) fits with the outer wall of the fixed rod (708).

7. The wafer table structure automatic external inspection machine according to claim 3, characterized in that: First tooth grooves are formed on both sides of the lower pressing block (705), and the first tooth grooves are meshed with the first spur gear (707).

8. The wafer table structure automatic external inspection machine according to claim 3, characterized in that: The rotating rod (713) is connected to the groove (712) via a rotating shaft, and the second spur gear (714) and the rotating shaft are located at the same axial position.

9. The wafer table structure automatic external inspection machine according to claim 3, characterized in that: A second tooth groove is provided at the bottom end of the pushing frame (715), and the second tooth groove is meshed with the second spur gear (714).

10. The wafer table structure automatic external inspection machine according to claim 3, characterized in that: The outer walls of the pushing frame (715) and the clamping block (610) are both L-shaped, and the bottom of the clamping block (610) is in contact with the top of the pushing frame (715).

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