A fully automatic impurity removal tool and impurity removal process for small-size crushed silicon materials

Abstract

The present invention belongs to the technical field of photovoltaics, and is particularly a fully automatic impurity removal tool and impurity removal process for small-size broken silicon materials, including a cleaning pool and a filtering pool, wherein the cleaning pool is arranged on one side of the filtering pool, and the same triangular baffle is fixedly installed between the cleaning pool and the filtering pool, and a water filter plate is detachably installed in the filtering pool, and an impurity removal mechanism is installed in the triangular baffle, and the impurity removal mechanism is used to collect heavy impurities, and a water spraying mechanism and a dispersion mechanism are installed on the top of the cleaning pool, and the dispersion mechanism includes a cylinder fixedly installed inside the cleaning pool. The present invention can improve work efficiency, achieve better cleaning effects, and reduce manual labor intensity. Through the cooperation of multiple rotating fan plates in the dispersion mechanism and the filter part, the separation of broken silicon materials and heavy impurities can be achieved, ensuring that after the broken silicon materials pass through the filter part, the heavy impurities in the broken silicon materials can be fully separated, and ensuring that the broken silicon materials that finally float to the triangular baffle do not contain heavy impurities.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaics, and in particular to a fully automatic impurity removal tool and impurity removal process for small-size crushed silicon materials. Background Art

[0002] Silicon materials with a particle size of 1-5mm generated during the grading or turnover process of silicon single crystals / polycrystalline need to be decontaminated in order to reduce silicon costs and further achieve the purpose of pulling single crystals. For 1-5mm single / polycrystalline fragments, there is a lack of decontamination equipment, the effect is not nearly consistent, or it cannot completely remove impurities, especially heavy impurities, or it is difficult to form crystals after 100% re-investment. The proportion of heavy impurities in the fragments is larger than that of the fragments, and it is not easy to remove them by water washing. At present, the main way to remove heavy impurities in the fragments is manual selection, but the decontamination effect of manual selection is not ideal, and manual selection takes longer time and is more expensive. Therefore, a fully automatic decontamination tool and decontamination process for small-particle silicon fragments are proposed. Summary of the invention

[0003] In order to solve the shortcomings of the prior art, the present invention proposes a fully automatic impurity removal tool and impurity removal process for small-size crushed silicon materials.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a fully automatic impurity removal tool for small-size broken silicon materials, including a cleaning tank and a filtering tank, the cleaning tank is arranged on one side of the filtering tank, the same triangular baffle is fixedly installed between the cleaning tank and the filtering tank, a water filter plate is detachably installed in the filtering tank, a de-impurity mechanism is installed in the triangular baffle, the de-impurity mechanism is used to collect heavy impurities, a water spraying mechanism and a dispersion mechanism are installed on the top of the cleaning tank, the dispersion mechanism includes a cylinder fixedly installed inside the cleaning tank, a filtering part and a through port are opened on the cylinder, a circular box two is rotatably installed in the cylinder, a plurality of fan plates distributed in a circular array are slidably installed in the circular box two, and the ends of the plurality of fan plates away from each other are all slidably connected to the inner wall of the cylinder.

[0005] Preferably, a cleaning box is provided on the side of the cleaning tank away from the filtering tank, a pickling box is provided between the cleaning tank and the cleaning box, a robotic arm is provided between the cleaning tank and the pickling box, a conveyor belt is provided between the cleaning tank and the pickling box, a drain rack is provided in the cleaning box, a pickling tank and acid storage tooling are provided in the pickling box, a drying box is provided on the side of the filtering tank away from the cleaning tank, a rinsing box is provided between the filtering tank and the drying box, two robotic arms are provided between the filtering tank and the rinsing box, two conveyor belts are provided between the rinsing box and the drying box, and two drain racks are provided in the rinsing box.

[0006] Preferably, a rectangular frame is fixedly installed in the filter tank, and the bottom of the water filter plate is abutted against the rectangular frame. The impurity removal mechanism includes a V-shaped filter plate fixedly installed in the cleaning tank, and the bottom of the V-shaped filter plate is arranged in an arc shape. An auger is rotatably installed in the V-shaped filter plate, and both ends of the auger pass through the cleaning tank and are rotatably connected to the cleaning tank. A motor 1 is fixedly installed on the side of the cleaning tank away from the filter tank, and the output shaft of the motor 1 is fixedly connected to the end of the auger. A slag discharge pipe is fixedly installed on the V-shaped filter plate, and the slag discharge pipe passes through the bottom of the cleaning tank and is fixedly connected to the cleaning tank. An upper hopper is fixedly installed on the top of the cleaning tank.

[0007] Preferably, the water spraying mechanism includes two seats one fixedly mounted on the top of the cleaning pool, the same round box one is fixedly mounted through the two seats one, a plurality of linearly distributed nozzles are fixedly mounted through the round box one, an annular box is fixedly sleeved on the round box one, a hose is fixedly mounted through the round box one, the hose and the round box one are connected through the annular box, a motor two is fixedly mounted on the seat one away from the annular box, and the output shaft of the motor two is fixedly connected to the end of the round box one.

[0008] Preferably, the dispersion mechanism includes two seats 2 fixedly mounted on the top of the cleaning tank, and a rotating shaft is rotatably mounted on both seats 2, and a motor 3 is fixedly mounted on one of the seats 2, and the output shaft of the motor 3 is fixedly connected to the end of the adjacent rotating shaft, and the ends of the two rotating shafts close to each other are fixedly connected to the circular box 2, and two annular baffles are rotatably sleeved on the circular box 2, and the outer sides of the annular baffles are fixedly connected to the inner wall of the cylinder, and the two annular baffles are respectively fixedly connected to the two sides of the cleaning tank.

[0009] Preferably, a plurality of fan plates are fixedly installed with an arc plate at one end close to each other, a same prism is fixedly installed between the inner walls on both sides of the circular box two, a plurality of linearly distributed springs are fixedly installed on the side of the arc plate away from the fan plate, and the ends of the plurality of springs away from the arc plate are fixedly connected to the prism, annular grooves are provided on the two annular baffles at one side close to each other, a V-shaped groove is provided on the annular groove, a circular shaft is rotatably installed through the fan plate, and both ends of the circular shaft extend into the corresponding annular grooves respectively.

[0010] Preferably, a plurality of air inlet holes distributed linearly are provided on the inner wall of the cylinder, a rectangular box is fixedly installed on the outer side of the cylinder, an air inlet pipe is fixedly installed through the rectangular box, and the air inlet pipe is connected with the plurality of air inlet holes through the rectangular box.

[0011] A fully automatic impurity removal process for small-size silicon scraps, applicable to the above-mentioned fully automatic impurity removal tool for small-size silicon scraps, comprises the following steps:

[0012] S1, pure water cleaning to remove light materials: firstly, clean through a special cleaning box to remove light materials in the small-sized silicon crushed materials. After removing the light materials, the small-sized silicon crushed materials will enter the next process after controlling the water for a certain period of time (because the light materials are lighter than the small-sized silicon crushed materials, the small-sized silicon crushed materials float on the water to achieve light separation);

[0013] S2, acid solution preparation: calculate the ratio of pure water to hydrofluoric acid according to the hydrofluoric acid concentration set in the process, set the ratio of pure water to hydrofluoric acid in the pickling box, and directly configure the working concentration of hydrofluoric acid in the acid solution storage tooling according to the ratio;

[0014] S3, acid soaking: Place the small-sized silicon chips in the pickling tank, and cover the small-sized silicon chips with acid by 20-50mm. After soaking for several hours, pump the acid in the pickling tank to the acid storage tooling;

[0015] S4, suspending and removing heavy impurities: the crushed materials soaked in acid are manually shoveled into the cleaning pool, and the crushed materials are broken up and fully suspended by the dispersion mechanism. After the crushed materials flow to the triangular baffle, they are filtered through the water filter plate and enter the next process (because the crushed materials are hydrophobic after being soaked in acid, they will float directly on the surface of pure water, while heavy impurities are not hydrophobic and sink directly to the bottom of the water, realizing the separation of heavy impurities);

[0016] S5, rinsing: small-size crushed silicon materials are placed in a rinsing box for pure water rinsing, and a single vibration polishing lasts for 5 minutes. After each polishing, the water is changed for the next polishing until the water conductivity is less than 2μs / cm. At this time, the heavy impurities in the silicon materials are effectively separated from the crushed materials;

[0017] S6, drying: drying in a drying oven for 15 hours;

[0018] S7, inspection and packaging: After the silicon chips are dried and cooled for 2 hours, they are inspected for impurities before packaging.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention can improve work efficiency, achieve better cleaning effect, and reduce labor intensity. The plurality of rotating fan plates in the dispersion mechanism cooperate with the filter part to separate the broken silicon material from heavy impurities, ensuring that the heavy impurities in the broken silicon material can be fully separated after the broken silicon material passes through the filter part, and ensuring that the broken silicon material that finally floats to the triangular baffle does not contain heavy impurities;

[0021] 2. The pure water in the cleaning pool can be stirred by rotating multiple fan plates. By forming waves in the pure water, it can not only impact the filter part and accelerate the speed of the broken silicon material passing through the filter part, but also drive the pure water floating on the surface to pass over the triangular baffle and fall onto the water filter plate for filtration. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a fully automatic impurity removal tool for small-size silicon chips proposed by the present invention;

[0023] Figure 2 This is a partial overall structural schematic diagram of a fully automatic impurity removal tool for small-size silicon crushed materials proposed by the present invention;

[0024] Figure 3 It is a partial side cross-sectional structural schematic diagram of a fully automatic impurity removal tool for small-size silicon crushed materials proposed by the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of a water spray mechanism in a fully automatic impurity removal tool for small-size silicon crushed materials proposed by the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of a dispersing mechanism in a fully automatic impurity removal tool for small-size silicon crushed materials proposed by the present invention;

[0027] Figure 6 A side cross-sectional view of a dispersing mechanism in a fully automatic impurity removal tool for small-size silicon crushed materials proposed by the present invention;

[0028] Figure 7 A side cross-sectional view of a dispersing mechanism in a fully automatic impurity removal tool for small-size silicon chips proposed by the present invention;

[0029] Figure 8 The present invention provides a flow chart of a fully automatic impurity removal process for small-size crushed silicon materials.

[0030] In the figure: 1, cleaning tank; 101, upper hopper; 2, filter tank; 21, rectangular frame; 22, water filter plate; 3, triangular baffle; 4, impurity removal mechanism; 41, V-shaped filter plate; 42, auger; 43, motor 1; 44, slag discharge pipe; 5, water spray mechanism; 51, stand 1; 52, round box 1; 53, nozzle; 54, ring box; 55, hose; 56, motor 2; 6, dispersion mechanism; 61, stand 2; 62, rotating shaft; 63, round box 2; 64, motor 3; 65, ring baffle; 66, cylinder; 6 61. Filter unit; 662. Through port; 67. Fan plate; 68. Arc plate; 69. Prism; 610. Spring; 611. Round shaft; 612. Annular groove; 613. V-shaped groove; 614. Air inlet hole; 615. Rectangular box; 616. Air inlet pipe; 7. Cleaning box; 71. Drain rack one; 8. Pickling box; 81. Pickling tank; 82. Acid storage tooling; 9. Rinse box; 91. Drain rack two; 10. Drying box; 11. Conveyor belt one; 12. Conveyor belt two; 13. Robot arm one; 14. Robot arm two. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Please refer to Figure 1-Figure 8 The present invention provides a technical solution: a fully automatic impurity removal tool for small-size broken silicon materials, comprising a cleaning pool 1 and a filtering pool 2, wherein the cleaning pool 1 is arranged at one side of the filtering pool 2, a same triangular baffle 3 is fixedly installed between the cleaning pool 1 and the filtering pool 2, a water filter plate 22 is detachably installed in the filtering pool 2, a de-impurity mechanism 4 is installed in the triangular baffle 3, and the de-impurity mechanism 4 is used to collect heavy impurities, a water spraying mechanism 5 and a dispersing mechanism 6 are installed on the top of the cleaning pool 1, and the dispersing mechanism 6 comprises a cylinder 66 fixedly installed inside the cleaning pool 1, a filtering portion 661 and a through port 662 are provided on the cylinder 66, a circular box 63 is rotatably installed inside the cylinder 66, and a plurality of fan plates 67 distributed in a circular array are slidably installed in the circular box 63, and the ends of the plurality of fan plates 67 away from each other are all slidably connected to the inner wall of the cylinder 66.

[0033] A cleaning box 7 is provided on the side of the cleaning pool 1 away from the filtering pool 2, a pickling box 8 is provided between the cleaning pool 1 and the cleaning box 7, a robotic arm 13 is provided between the cleaning pool 1 and the pickling box 8, a conveyor belt 11 is provided between the cleaning box 7 and the pickling box 8, a drain rack 71 is provided in the cleaning box 7, a pickling tank 81 and an acid storage tooling 82 are provided in the pickling box 8, a drying box 10 is provided on the side of the filtering pool 2 away from the cleaning pool 1, a rinsing box 9 is provided between the filtering pool 2 and the drying box 10, a robotic arm 14 is provided between the filtering pool 2 and the rinsing box 9, a conveyor belt 12 is provided between the rinsing box 9 and the drying box 10, and a drain rack 91 is provided in the rinsing box 9.

[0034] A rectangular frame 21 is fixedly installed in the filter tank 2, and the bottom of the water filter plate 22 is abutted against the rectangular frame 21. The impurity removal mechanism 4 includes a V-shaped filter plate 41 fixedly installed in the cleaning tank 1. The bottom of the V-shaped filter plate 41 is arranged in an arc shape. An auger 42 is rotatably installed in the V-shaped filter plate 41. Both ends of the auger 42 penetrate the cleaning tank 1 and are rotatably connected to the cleaning tank 1. A motor 43 is fixedly installed on the side of the cleaning tank 1 away from the filter tank 2. The output shaft of the motor 43 is fixedly connected to the end of the auger 42. A slag discharge pipe 44 is fixedly installed on the V-shaped filter plate 41. The slag discharge pipe 44 penetrates the bottom of the cleaning tank 1 and is fixedly connected to the cleaning tank 1. An upper hopper 101 is fixedly installed on the top of the cleaning tank 1.

[0035] Furthermore, the heavy impurities that fall on the V-shaped filter plate 41 will fall to the bottom arc of the V-shaped filter plate 41 under the action of gravity, and the auger 42 can be driven to rotate by starting the motor 43. The rotating auger 42 can transport the heavy impurities that fall to the bottom arc of the V-shaped filter plate 41 to the slag discharge pipe 44. By providing a valve at the bottom end of the slag discharge pipe 44 and opening the valve periodically, the heavy impurities accumulated in the slag discharge pipe 44 can be discharged.

[0036] The water spraying mechanism 5 includes two stands 51 fixedly installed on the top of the cleaning pool 1, the same round box 52 is fixedly installed through the two stands 51, a plurality of linearly distributed nozzles 53 are fixedly installed through the round box 52, an annular box 54 is fixedly sleeved on the round box 52, a hose 55 is fixedly installed through the annular box 54, the hose 55 and the round box 52 are connected through the annular box 54, a motor 56 is fixedly installed on the stand 51 away from the annular box 54, and the output shaft of the motor 56 is fixedly connected to the end of the round box 52.

[0037] Furthermore, by starting the motor 2 56 to drive the round box 1 52 to rotate, the spray angles of the water flows sprayed from the multiple nozzles 53 can be adjusted, which can not only disperse the broken silicon materials falling from the upper hopper 101, but also push the broken silicon materials to move toward the dispersion mechanism 6.

[0038] The dispersion mechanism 6 includes two seats 61 fixedly installed on the top of the cleaning tank 1, and a rotating shaft 62 is rotatably installed on the two seats 61. A motor 3 64 is fixedly installed on one of the seats 61, and the output shaft of the motor 3 64 is fixedly connected to the end of the adjacent rotating shaft 62. The ends of the two rotating shafts 62 close to each other are fixedly connected to the circular box 63. Two annular baffles 65 are rotatably sleeved on the circular box 63. The outer side of the annular baffle 65 is fixedly connected to the inner wall of the cylinder 66, and the two annular baffles 65 are respectively fixedly connected to the two sides of the cleaning tank 1.

[0039] An arc plate 68 is fixedly installed on one end of the multiple fan plates 67 that are close to each other, a same prism 69 is fixedly installed between the inner walls of the two sides of the circular box 63, a plurality of linearly distributed springs 610 are fixedly installed on the side of the arc plate 68 away from the fan plate 67, and one end of the multiple springs 610 away from the arc plate 68 is fixedly connected to the prism 69, an annular groove 612 is provided on the side of the two annular baffles 65 that are close to each other, a V-shaped groove 613 is provided on the annular groove 612, a circular shaft 611 is rotatably installed through the fan plate 67, and both ends of the circular shaft 611 extend into the corresponding annular groove 612 respectively.

[0040] A plurality of air inlet holes 614 distributed linearly are provided on the inner wall of the cylinder 66 , a rectangular box 615 is fixedly installed on the outer side of the cylinder 66 , an air inlet pipe 616 is fixedly installed through the rectangular box 615 , and the air inlet pipe 616 is connected to the plurality of air inlet holes 614 through the rectangular box 615 .

[0041] A fully automatic impurity removal process for small-size silicon scraps, applicable to the above-mentioned fully automatic impurity removal tool for small-size silicon scraps, comprises the following steps:

[0042] S1, pure water washing to remove light materials: firstly, washing is performed through a special washing box 7 to remove light materials in the small-sized silicon crushed materials. After the light materials are removed, the small-sized silicon crushed materials are controlled for a certain period of time before entering the next process (since the light materials are lighter than the small-sized silicon crushed materials, the small-sized silicon crushed materials float on the water to achieve light material separation);

[0043] S2, acid solution preparation: calculate the ratio of pure water to hydrofluoric acid according to the hydrofluoric acid concentration set in the process, set the ratio of pure water to hydrofluoric acid in the pickling box 8, and directly configure the working concentration of hydrofluoric acid in the acid solution storage fixture 82 according to the ratio;

[0044] S3, acid soaking: small-sized silicon chips are placed in the pickling tank 81, and the acid solution covers the small-sized silicon chips by 20-50 mm. After soaking for several hours, the acid solution in the pickling tank 81 is pumped into the acid solution storage tooling 82;

[0045] S4, suspending and removing heavy impurities: the crushed materials soaked in acid are manually shoveled into the cleaning tank 1, and the crushed materials are dispersed and fully suspended by the dispersion mechanism 6. After the crushed materials flow to the triangular baffle 3, they are filtered through the water filter plate 22 and enter the next process (because the crushed materials are hydrophobic after being soaked in acid, they will float directly on the surface of pure water, while heavy impurities are not hydrophobic and sink directly to the bottom of the water, thus achieving separation of heavy impurities);

[0046] S5, rinsing: placing the small-size crushed silicon material in a rinsing box 9 for pure water rinsing, vibrating and polishing for 5 minutes each time, changing the water after each polishing, until the water conductivity is less than 2μs / cm, at which time the heavy impurities in the silicon material are effectively separated from the crushed material;

[0047] S6, drying: drying in a drying oven 10 for 15 hours;

[0048] S7, inspection and packaging: After the silicon chips are dried and cooled for 2 hours, they are inspected for impurities before packaging.

[0049] Furthermore, the drain rack 1 71 can reciprocate up and down in the cleaning box 7, so the broken silicon materials placed in the drain rack 1 71 can be washed away by the pure water in the cleaning box 7 to remove the light impurities therein. The drain rack 1 71 descends to make the broken materials all immersed in the water, and is repeatedly stirred for several times. The broken silicon materials sink to the bottom of the water, and the light materials float on the water surface. The light materials are discharged with the water. The drain rack 1 71 moves upward and stops at the top of the cleaning box 7. After controlling the water for a certain period of time, the drain rack 2 91 moves downward to the bottom of the rinsing box 9, and is rinsed with pure water. The single vibration polishing lasts for several minutes, and the water is discharged. This is repeated several times, and the broken silicon materials placed in the drain rack 2 91 can be washed away by the pure water in the cleaning box 7 to remove the acid liquid therein;

[0050] By setting up a conveyor belt 11, it is convenient to transport the crushed silicon material in the drain rack 71 to the pickling tank 81, and by using a conveyor belt 12, it is convenient to transport the crushed silicon material in the drain rack 91 to the drying box 10. By using a robot arm 13, it is convenient to grab the crushed silicon material in the pickling tank 81 into the upper hopper 101, and by using a robot arm 2 14, it is convenient to grab the crushed silicon material on the water filter plate 22 into the drain rack 91.

[0051] In this embodiment: the robot arm 13 grabs the broken silicon material into the upper hopper 101, and under the action of gravity, the broken silicon material directly falls into the pure water in the cleaning tank 1. During this process, some heavy impurities in the broken silicon material will directly sink and fall on the V-shaped filter plate 41, while the broken silicon material is hydrophobic and floats on the water surface. The pure water sprayed from the multiple nozzles 53 can push the broken silicon material floating on the water surface to the dispersion mechanism 6;

[0052] As mentioned above, the starting motor 3 64 drives the round box 2 63 to rotate through one of the rotating shafts 62, as shown in FIG. Figure 3 , Figure 6-7 As shown, the multiple fan plates 67 rotating clockwise can grab the floating silicon crushed materials and enter the cylinder 66. At this time, the fan plates 67 can press the silicon crushed materials downward and submerge them into the pure water. At this time, some of the remaining heavy impurities in the silicon crushed materials sink to the filter part 661 and pass through the holes on the filter part 661 and fall on the V-shaped filter plate 41, while the silicon crushed materials quickly float on the water surface due to their hydrophobicity.

[0053] As mentioned above, after the fan plate 67 rotates to the lowest point, the clockwise fan plate 67 moves upward to scoop up the broken silicon floating on the water surface. When the circular shaft 611 on the fan plate 67 passes through the V-shaped groove 613, the fan plate 67 moves toward the prism 69. At this time, the end of the fan plate 67 away from the prism 69 is above the water surface and there is a moving gap between the filter part 661. At this time, the air ejected from the multiple air inlet holes 614 can blow the broken silicon on the fan plate 67 down. The fallen broken silicon floats down evenly through the gap between the fan plate 67 and the filter part 661. The remaining heavy impurities all sink and pass through the holes on the filter part 661 and fall on the V-shaped filter plate 41, while the broken silicon materials float on the water surface and follow the fluctuation of the water surface through the holes on the filter part 661 and float toward the triangular baffle 3. The rotating multiple fan plates 67 can form waves on the water surface in the filter pool 2. The thrust generated by the pure water sprayed by the multiple nozzles 53 can accelerate the speed of the broken silicon materials falling from the gap between the fan plates 67 and the filter part 661 to pass through the holes on the filter part 661, and the impact of the water surface waves on the filter part 661 can prevent the filter part 661 from being blocked.

[0054] The intermittently fluctuating water surface will cause part of the pure water to flow over the triangular baffle 3 into the filter pool 2. At this time, the broken silicon materials floating toward the triangular baffle 3 will flow into the filter pool 2 over the triangular baffle 3 along with the intermittently fluctuating water surface. After being filtered by the filter plate 22, the broken silicon materials accumulate on the filter plate 22, while the pure water falls into the filter pool 2. If the pure water in the filter pool 2 is pumped into the cleaning pool 1 through a pumping device, the pure water can be recycled.

[0055] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A fully automatic impurity removal tool for small-size silicon scraps, comprising a cleaning tank (1) and a filtering tank (2), wherein the cleaning tank (1) is arranged on one side of the filtering tank (2), and is characterized in that: A triangular baffle (3) is fixedly installed between the cleaning pool (1) and the filtering pool (2); a water filter plate (22) is detachably installed in the filtering pool (2); a de-impurity mechanism (4) is installed in the triangular baffle (3); the de-impurity mechanism (4) is used to collect heavy impurities; a water spray mechanism (5) and a dispersion mechanism (6) are installed on the top of the cleaning pool (1); the dispersion mechanism (6) comprises a cylinder (66) fixedly installed inside the cleaning pool (1); a filtering portion (661) and a through opening (662) are provided on the cylinder (66); a second circular box (63) is rotatably installed in the cylinder (66); a plurality of fan plates (67) distributed in a circumferential array are slidably installed in the second circular box (63); the ends of the plurality of fan plates (67) that are away from each other are all slidably connected to the inner wall of the cylinder (66); A cleaning box (7) is provided on the side of the cleaning tank (1) away from the filtering tank (2), a pickling box (8) is provided between the cleaning tank (1) and the cleaning box (7), a mechanical arm (13) is provided between the cleaning tank (1) and the pickling box (8), a conveyor belt (11) is provided between the cleaning tank (7) and the pickling box (8), a drain rack (71) is provided in the cleaning tank (7), a pickling tank (81) and an acid storage tool (82) are provided in the pickling box (8), a drying box (10) is provided on the side of the filtering tank (2) away from the cleaning tank (1), a rinsing box (9) is provided between the filtering tank (2) and the drying box (10), a mechanical arm (2) is provided between the filtering tank (2) and the rinsing box (9), a conveyor belt (12) is provided between the rinsing box (9) and the drying box (10), and a drain rack (91) is provided in the rinsing box (9).

2. The fully automatic impurity removal tool for small-size silicon chips according to claim 1, characterized in that: A rectangular frame (21) is fixedly installed in the filter tank (2), and the bottom of the water filter plate (22) is in contact with the rectangular frame (21). The impurity removal mechanism (4) comprises a V-shaped filter plate (41) fixedly installed in the cleaning tank (1), and the bottom of the V-shaped filter plate (41) is arranged in an arc shape. An auger (42) is rotatably installed in the V-shaped filter plate (41), and both ends of the auger (42) penetrate the cleaning tank (1) and are rotatably connected to the cleaning tank (1). A motor 1 (43) is fixedly installed on a side of the cleaning tank (1) away from the filter tank (2), and the output shaft of the motor 1 (43) is fixedly connected to the end of the auger (42). A slag discharge pipe (44) is fixedly installed on the V-shaped filter plate (41), and the slag discharge pipe (44) penetrates the bottom of the cleaning tank (1) and is fixedly connected to the cleaning tank (1). An upper hopper (101) is fixedly installed on the top of the cleaning tank (1).

3. The fully automatic impurity removal tool for small-size silicon chips according to claim 1 is characterized by: The water spray mechanism (5) comprises two stand seats (51) fixedly mounted on the top of the cleaning pool (1); the same round box (52) is fixedly mounted through the two stand seats (51); a plurality of linearly distributed spray heads (53) are fixedly mounted through the round box (52); an annular box (54) is fixedly sleeved on the round box (52); a hose (55) is fixedly mounted through the annular box (54); the hose (55) and the round box (52) are connected via the annular box (54); a motor (56) is fixedly mounted on the stand seat (51) away from the annular box (54); an output shaft of the motor (56) is fixedly connected to an end of the round box (52).

4. The fully automatic impurity removal tool for small-size silicon chips according to claim 1, characterized in that: The dispersion mechanism (6) comprises two second stands (61) fixedly mounted on the top of the cleaning tank (1), and a rotating shaft (62) is rotatably mounted on each of the two second stands (61), and a motor (64) is fixedly mounted on one of the second stands (61), and an output shaft of the motor (64) is fixedly connected to an end of an adjacent rotating shaft (62), and ends of the two rotating shafts (62) close to each other are fixedly connected to a second round box (63), and two annular baffles (65) are rotatably sleeved on the second round box (63), and the outer sides of the annular baffles (65) are fixedly connected to the inner wall of a cylinder (66), and the two annular baffles (65) are respectively fixedly connected to two sides of the cleaning tank (1).

5. The fully automatic impurity removal tool for small-size silicon chips according to claim 1, characterized in that: An arc plate (68) is fixedly mounted on one end of the plurality of fan plates (67) close to each other; a prism (69) is fixedly mounted between the inner walls on both sides of the second circular box (63); a plurality of springs (610) distributed linearly are fixedly mounted on one side of the arc plate (68) away from the fan plate (67); one end of the plurality of springs (610) away from the arc plate (68) is fixedly connected to the prism (69); an annular groove (612) is formed on one side of the two annular baffles (65) close to each other; a V-shaped groove (613) is formed on the annular groove (612); a circular shaft (611) is rotatably mounted through the fan plate (67); and both ends of the circular shaft (611) extend into corresponding annular grooves (612).

6. The fully automatic impurity removal tool for small-size silicon scrap according to claim 1, characterized in that: A plurality of air inlet holes (614) distributed linearly are provided on the inner wall of the cylinder (66); a rectangular box (615) is fixedly installed on the outer side of the cylinder (66); an air inlet pipe (616) is fixedly installed through the rectangular box (615); and the air inlet pipe (616) is connected to the plurality of air inlet holes (614) through the rectangular box (615).

7. A fully automatic impurity removal process for small-size silicon scraps, applicable to a fully automatic impurity removal tool for small-size silicon scraps in claim 1, characterized in that: The following steps are involved: S1, pure water cleaning to remove light matter: first, the small-size crushed silicon material is cleaned by a special cleaning box (7) to remove light matter. After the light matter is removed, the small-size crushed silicon material is controlled for a certain period of time and then enters the next process; S2, acid solution preparation: calculate the ratio of pure water to hydrofluoric acid according to the hydrofluoric acid concentration set in the process, set the ratio of pure water to hydrofluoric acid in the pickling box (8), and directly prepare the working concentration of hydrofluoric acid in the acid solution storage tooling (82) according to the ratio; S3, acid soaking: placing the small-sized silicon crushed materials in an acid pickling tank (81), and covering the small-sized silicon crushed materials with acid by 20-50 mm. After soaking for several hours, the acid in the acid pickling tank (81) is pumped into an acid storage tool (82); S4, suspending and removing heavy impurities: the crushed materials soaked in acid are manually shoveled into the cleaning tank (1), and the crushed materials are dispersed and fully suspended by the dispersion mechanism (6). The crushed materials flow to the triangular baffle (3) and are filtered through the water filter plate (22) to enter the next process; S5, rinsing: placing the small-size crushed silicon material in a rinsing box (9) for pure water rinsing, vibrating and polishing for 5 minutes each time, changing the water after each polishing, until the water conductivity is less than 2 μs / cm, at which point the heavy impurities in the silicon material are effectively separated from the crushed material; S6, drying: drying in a drying oven (10) for 15 hours; S7, inspection and packaging: After the silicon chips are dried and cooled for 2 hours, they are inspected for impurities before packaging.

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